CN114899599A - Antenna assembly and electronic equipment - Google Patents
Antenna assembly and electronic equipment Download PDFInfo
- Publication number
- CN114899599A CN114899599A CN202210388156.6A CN202210388156A CN114899599A CN 114899599 A CN114899599 A CN 114899599A CN 202210388156 A CN202210388156 A CN 202210388156A CN 114899599 A CN114899599 A CN 114899599A
- Authority
- CN
- China
- Prior art keywords
- radiator
- radiation
- antenna assembly
- antenna
- filter circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000005855 radiation Effects 0.000 claims abstract description 74
- 230000008878 coupling Effects 0.000 claims abstract description 13
- 238000010168 coupling process Methods 0.000 claims abstract description 13
- 238000005859 coupling reaction Methods 0.000 claims abstract description 13
- 239000000758 substrate Substances 0.000 claims description 13
- 238000005530 etching Methods 0.000 claims description 4
- 230000001939 inductive effect Effects 0.000 claims description 3
- 230000008030 elimination Effects 0.000 claims 2
- 238000003379 elimination reaction Methods 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 32
- 238000002955 isolation Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 239000003990 capacitor Substances 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 101100489713 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) GND1 gene Proteins 0.000 description 4
- 101100489717 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) GND2 gene Proteins 0.000 description 4
- 230000006870 function Effects 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000012938 design process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
- H01Q1/521—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure reducing the coupling between adjacent antennas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
Landscapes
- Support Of Aerials (AREA)
Abstract
本申请实施例公开了一种天线组件和电子设备。所述天线组件,包括:第一天线,包括第一辐射体、第一匹配模块和第一馈电模块;其中第一辐射体具有第一接地端和第一辐射末端;其中,第一馈电点和第一辐射末端之间设置有第一连接点;第二天线,包括第二辐射体、第二匹配模块和第二馈电模块;其中,第二辐射体具有第二辐射末端和第二接地端;其中,第二辐射末端与第一辐射末端之间存在辐射体缝隙;其中,第二馈电点和第二辐射末端之间设置有第二连接点;带阻滤波电路,一端连接与第一连接点,另一端连接与第二连接点,用于降低第一辐射体和第二辐射体之间的耦合。
Embodiments of the present application disclose an antenna assembly and an electronic device. The antenna assembly includes: a first antenna, including a first radiator, a first matching module and a first feed module; wherein the first radiator has a first ground terminal and a first radiation end; wherein the first feed A first connection point is set between the point and the first radiating end; the second antenna includes a second radiator, a second matching module and a second feeding module; wherein the second radiator has a second radiating end and a second a grounding end; wherein, there is a radiator gap between the second radiation end and the first radiation end; wherein a second connection point is set between the second feeding point and the second radiation end; a band-stop filter circuit, one end is connected to the The first connection point is connected to the second connection point at the other end for reducing the coupling between the first radiator and the second radiator.
Description
技术领域technical field
本申请实施例涉及电子电路领域,尤指一种天线组件和电子设备。The embodiments of the present application relate to the field of electronic circuits, and in particular, to an antenna assembly and an electronic device.
背景技术Background technique
电子设备上天线数量多且排列密集,造成天线之间耦合度强;为了保证得到足够的隔离度通常需要天线单元之间留有一定的空间距离。由于上述方式会增加天线占用的空间,且去耦效果需进一步提升,因此如何对天线之间去耦是亟待解决问题。The number of antennas on electronic equipment is large and the arrangement is dense, resulting in strong coupling between antennas; in order to ensure sufficient isolation, it is usually necessary to leave a certain spatial distance between antenna units. Since the above method will increase the space occupied by the antenna, and the decoupling effect needs to be further improved, how to decouple the antennas is an urgent problem to be solved.
发明内容SUMMARY OF THE INVENTION
为了解决上述任一技术问题,本申请实施例提供了一种天线组件和电子设备。In order to solve any of the above technical problems, embodiments of the present application provide an antenna assembly and an electronic device.
为了达到本申请实施例目的,本申请实施例提供了一种天线组件,包括:In order to achieve the purpose of the embodiments of the present application, the embodiments of the present application provide an antenna assembly, including:
第一天线,包括第一辐射体、第一匹配模块和第一馈电模块;其中所述第一辐射体具有第一接地端和第一辐射末端,以及位于所述第一接地端和所述第一辐射末端之间的第一馈电点,所述第一匹配模块电连接于所述第一馈电点与所述第一馈电模块之间,所述第一接地端电连接至第一参考地;其中,所述第一馈电点和所述第一辐射末端之间设置有第一连接点;The first antenna includes a first radiator, a first matching module and a first feeding module; wherein the first radiator has a first ground end and a first radiation end, and is located at the first ground end and the first radiator The first feeding point between the first radiation ends, the first matching module is electrically connected between the first feeding point and the first feeding module, and the first ground terminal is electrically connected to the first feeding point. a reference ground; wherein, a first connection point is provided between the first feeding point and the first radiating end;
第二天线,包括第二辐射体、第二匹配模块和第二馈电模块;其中,所述第二辐射体具有第二辐射末端和第二接地端,以及位于所述第二辐射末端和所述第二接地端之间的第二馈电点,所述第二匹配模块电连接至所述第二馈电点与所述第二馈电模块之间,所述第二接地端电连接至第二参考地;其中,所述第二辐射末端与所述第一辐射末端之间存在辐射体缝隙;其中,所述第二馈电点和所述第二辐射末端之间设置有第二连接点;The second antenna includes a second radiator, a second matching module and a second feeding module; wherein the second radiator has a second radiation end and a second ground end, and is located at the second radiation end and all a second feeding point between the second ground terminals, the second matching module is electrically connected between the second feeding point and the second feeding module, and the second ground terminal is electrically connected to a second reference ground; wherein a radiator gap exists between the second radiation end and the first radiation end; wherein a second connection is provided between the second feed point and the second radiation end point;
带阻滤波电路,一端连接与所述第一连接点,另一端连接与所述第二连接点,用于降低所述第一辐射体和第二辐射体之间的耦合。A band-stop filter circuit, one end of which is connected to the first connection point and the other end of which is connected to the second connection point, is used to reduce the coupling between the first radiator and the second radiator.
一种电子设备,设置有上文所述的天线组件。An electronic device provided with the antenna assembly described above.
上述技术方案中的一个技术方案具有如下优点或有益效果:One of the technical solutions in the above-mentioned technical solutions has the following advantages or beneficial effects:
在两个天线的辐射体末端相互靠近的位置构造一个帯阻滤波电路,降低所述第一辐射体和第二辐射体之间的耦合,实现两支天线的解耦,提高隔离度,进而提升天线效率。A blocking filter circuit is constructed where the ends of the radiators of the two antennas are close to each other to reduce the coupling between the first radiator and the second radiator, realize the decoupling of the two antennas, improve the isolation, and further improve the Antenna efficiency.
本申请实施例的其它特征和优点将在随后的说明书中阐述,并且,部分地从说明书中变得显而易见,或者通过实施本申请实施例而了解。本申请实施例的目的和其他优点可通过在说明书、权利要求书以及附图中所特别指出的结构来实现和获得。Other features and advantages of the embodiments of the present application will be set forth in the description that follows, and in part will be apparent from the description, or learned by practice of the embodiments of the present application. The objectives and other advantages of the embodiments of the application may be realized and attained by the structure particularly pointed out in the description, claims and drawings.
附图说明Description of drawings
附图用来提供对本申请实施例技术方案的进一步理解,并且构成说明书的一部分,与本申请实施例的实施例一起用于解释本申请实施例的技术方案,并不构成对本申请实施例技术方案的限制。The accompanying drawings are used to provide a further understanding of the technical solutions of the embodiments of the present application, and constitute a part of the description. The accompanying drawings are used to explain the technical solutions of the embodiments of the present application together with the embodiments of the embodiments of the present application, and do not constitute the technical solutions of the embodiments of the present application. limits.
图1为本申请实施例提供的一种电子设备的结构示意图;FIG. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application;
图2为图1所示电子设备的立体结构示意图;Fig. 2 is a three-dimensional schematic diagram of the electronic device shown in Fig. 1;
图3为本申请提供的天线组件100的结构示意图;FIG. 3 is a schematic structural diagram of the
图4为本申请实施例提供的带阻滤波电路30的示意图;FIG. 4 is a schematic diagram of a band-
图5为本申请实施例一提供的天线组件100的部署示意图;FIG. 5 is a schematic diagram of the deployment of the
图6为本申请实施例一提供的第一辐射体11和第二辐射体21的相对位置的示意图;6 is a schematic diagram of the relative positions of the
图7为本申请实施例一提供的带阻滤波电路30的示意图;FIG. 7 is a schematic diagram of a band-
图8为图7所示带阻滤波电路30中等效电容的示意图;FIG. 8 is a schematic diagram of an equivalent capacitance in the band-
图9为本申请实施例一提供的介质基板的示意图;FIG. 9 is a schematic diagram of a dielectric substrate provided in Embodiment 1 of the present application;
图10为本申请实施例一提供的带阻滤波电路30的另一示意图;FIG. 10 is another schematic diagram of the band-
图11为图10所示第一电感L1的部署示意图;FIG. 11 is a schematic diagram of the deployment of the first inductor L1 shown in FIG. 10;
图12为图10所示第一电感L1的结构示意图;FIG. 12 is a schematic structural diagram of the first inductor L1 shown in FIG. 10;
图13为本申请实施例二提供的天线组件100的部署示意图;FIG. 13 is a schematic diagram of the deployment of the
图14为本申请实施例二中带阻滤波电路30的示意图;FIG. 14 is a schematic diagram of the band-
图15为图14所示带阻滤波电路30的另一示意图;FIG. 15 is another schematic diagram of the band-
图16为第一天线10和第二天线20未解耦与解耦之后的S参数对比图;16 is a comparison diagram of the S-parameters of the
图17为第一天线10解耦前和解耦后的效率的对比图。FIG. 17 is a comparison diagram of the efficiency of the
具体实施方式Detailed ways
为使本申请实施例的目的、技术方案和优点更加清楚明白,下文中将结合附图对本申请实施例的实施例进行详细说明。需要说明的是,在不冲突的情况下,本申请实施例中的实施例及实施例中的特征可以相互任意组合。In order to make the objectives, technical solutions and advantages of the embodiments of the present application more clearly understood, the embodiments of the embodiments of the present application will be described in detail below with reference to the accompanying drawings. It should be noted that the embodiments in the embodiments of the present application and the features in the embodiments may be arbitrarily combined with each other unless there is a conflict.
请参照图1,图1为本申请实施例提供的一种电子设备的结构示意图。电子设备1000包括天线组件100。天线组件100用于收发电磁波信号,以实现电子设备1000的通信功能。本申请对于天线组件100在电子设备1000内的位置不做具体的限定。电子设备1000还包括相互盖合连接的显示屏300及壳体200。Please refer to FIG. 1 , which is a schematic structural diagram of an electronic device according to an embodiment of the present application.
天线组件100可设于电子设备1000的壳体200内部、或部分与壳体200集成为一体、或部分设于壳体200外。图1中天线组件100的辐射体与壳体200集成为一体。当然,天线组件100还可以设于电子设备1000的可伸缩组件上,换言之,天线组件100的至少部分还能够随着电子设备1000的可伸缩组件伸出电子设备1000之外,及随着可伸缩组件缩回至电子设备1000内;或者,天线组件100的整体长度随着电子设备1000的可伸缩组件的伸长而伸长。The
电子设备1000包括不限于为电话、电视、平板电脑、手机、照相机、个人计算机、笔记本电脑、车载设备、耳机、手表、可穿戴设备、基站、车载雷达、客户前置设备(CustomerPremise Equipment,CPE)等能够收发电磁波信号的设备。本申请中以电子设备1000为手机为例,其他的设备可参考本申请中的具体描述。
为了便于描述,以电子设备1000处于图1中的视角为参照,电子设备1000的宽度方向定义为X轴方向,电子设备1000的长度方向定义为Y轴方向,电子设备1000的厚度方向定义为Z轴方向。X轴方向、Y轴方向及Z轴方向两两垂直。其中,箭头所指示的方向为正向。For ease of description, with reference to the viewing angle of the
请参阅图2,壳体200包括边框210及后盖220。边框210内通过注塑形成中板410,中板410上形成多个用于安装各种电子器件的安装槽。中板410与边框210一起成为电子设备1000的中框420。显示屏300、中框420及后盖220盖合后在中框420的两侧皆形成收容空间。边框210的一侧(例如后侧)围接于后盖220的周沿,边框210的另一侧(例如前侧)围接于显示屏300的周沿。Please refer to FIG. 2 , the
电子设备1000还包括设于收容空间内的电池、摄像头、麦克风、受话器、扬声器、人脸识别模组、指纹识别模组等等能够实现手机的基本功能的器件,在本实施例中不再赘述。The
以下结合附图对于本申请提供的天线组件100进行具体的说明,当然,本申请提供的天线组件100包括但不限于以下的实施方式。The
请参阅图3,天线组件100至少包括第一辐射体11、第二辐射体21、第一匹配模块M1、第一馈电模块13、第二匹配模块M2及第二馈电模块23。其中,为了便于从功能上划分天线组件100的不同部分以便于后续的描述,定义第一辐射体11、第二辐射体21、第一匹配模块M1、第一馈电模块13为第一天线单元10,定义第一辐射体11、第二辐射体21、第二匹配模块M2及第二馈电模块23为第二天线单元20。Referring to FIG. 3 , the
请参阅图3,第一辐射体11具有第一接地端111和第一辐射末端112,以及位于第一接地端111和第一辐射末端112之间的第一馈电点A。本实施例中,第一接地端111与第一辐射末端112为呈直线条形的第一辐射体11的相对两端。在其他实施方式中,第一辐射体11呈弯折状,第一接地端111和第一辐射末端112可不沿直线方向相对,但第一接地端111和第一辐射末端112为第一辐射体11的两个末端。Referring to FIG. 3 , the
请参阅图3,第二辐射体21具有第二辐射末端211和第二接地端212,以及位于第二辐射末端211和第二接地端212之间的第二馈电点B。第二辐射末端211与第一辐射末端112之间存在辐射体缝隙140。本实施例中,第二辐射末端211及第二接地端212为第二辐射体21的两个末端。可选的,第一辐射体11与第二辐射体21可沿直线排列或大致沿直线排列(即在设计过程中具有较小的公差)。Referring to FIG. 3 , the second radiator 21 has a
当然,在其他实施方式中,第一辐射体11与第二辐射体21还可在延伸方向上错开设置,以形成避让空间等。Of course, in other embodiments, the
请参阅图3,第一辐射末端112与第二辐射末端211相对且间隔设置。辐射体缝隙140为第一辐射体11与第二辐射体21之间的断缝,例如,辐射体缝隙140的宽度可以为0.5~2mm,但不限于此尺寸。第一辐射体11和第二辐射体21可看作为辐射体被辐射体缝隙140隔断而形成的两个部分。Referring to FIG. 3 , the
优选的,第一辐射体11与第二辐射体21通过辐射体缝隙140进行容性耦合。其中,“容性耦合”是指,第一辐射体11与第二辐射体21之间产生电场,第一辐射体11的信号能够通过电场传递至第二辐射体21,第二辐射体21的信号能够通过电场传递至第一辐射体11,以使第一辐射体11与第二辐射体21即使在不直接接触或不直接连接的状态下也能够实现电信号导通。Preferably, the
可以理解的,本申请对于第一辐射体11、第二辐射体21的形状、构造不做具体的限定,第一辐射体11、第二辐射体21的形状皆包括但不限于条状、片状、杆状、涂层、薄膜等。当第一辐射体11、第二辐射体21呈条状时,本申请对于第一辐射体11、第二辐射体21的延伸轨迹不做限定,故第一辐射体11、第二辐射体21皆可呈直线、曲线、多段弯折等轨迹延伸。上述的辐射体在延伸轨迹上可为宽度均匀的线条,也可以为宽度渐变、设有加宽区域等宽度不等的条形。It can be understood that the shape and structure of the
请参阅图3,第一匹配模块M1电连接于第一馈电点A与第一馈电模块13之间。第一馈电模块13为用于发送射频信号的射频收发芯片或电连接用于发送射频信号的射频收发芯片的馈电部。第一匹配模块M1可包含开关器件、电容器件、电感器件、电阻器件等中的至少一者。Please refer to FIG. 3 , the first matching module M1 is electrically connected between the first feeding point A and the
请参阅图3,第一接地端111电连接至第一参考地GND1,其电连接方式包括但不限于直接焊接、或通过同轴线、微带线、导电弹片、导电胶等方式间接电连接。本申请对于第一馈电点A在第一辐射体11上的具体位置不做限定。Please refer to FIG. 3 , the
请参阅图3,第二天线单元20包括第一辐射体11、第二辐射体21、第二匹配模块M2及第二馈电模块23。Referring to FIG. 3 , the
请参阅图3,第二匹配模块M2电连接于第二馈电点B与第二馈电模块23之间。第二馈电模块23为用于发送射频信号的射频收发芯片或电连接用于发送射频信号的射频收发芯片的馈电部。第二匹配模块M2包含开关器件、电容器件、电感器件、电阻器件等中的至少一者。Please refer to FIG. 3 , the second matching module M2 is electrically connected between the second feeding point B and the
请参阅图3,第二接地端212电连接至第二参考地GND2,其电连接方式包括但不限于直接焊接、或通过同轴线、微带线、导电弹片、导电胶等方式间接电连接。本申请对于第一馈电点A在第一辐射体11上的具体位置不做限定。Please refer to FIG. 3 , the
第一参考地GND1和第二参考地GND2包括但不限于以下几种实施方式。可选的,天线组件100自身具有参考地。该参考地的具体形式包括但不限于金属导电板件、成型于柔性电路板内部、硬质电路板中的金属导电层等。其中,第一参考地GND1和第二参考地GND2可为天线组件100中的一体成型的一个参考地,也可以为天线组件100中的两个相互独立但相互连接的参考地。当天线组件100设于电子设备1000内时,天线组件100的参考地电连接至电子设备1000的参考地。再可选的,天线组件100本身不具有参考地,天线组件100的第一接地端111和第二接地端212通过直接电连接或通过导电件间接电连接至电子设备1000的参考地或电子设备1000内的电子器件的参考地。本申请中,天线组件100设于电子设备1000,以中板410上的金属合金作为参考地GND。即第一参考地GND1和第二参考地GND2为中板410的一部分或电连接至中板410。The first reference ground GND1 and the second reference ground GND2 include but are not limited to the following embodiments. Optionally, the
请参阅图3,所述第一馈电点A所述第一辐射末端112之间设置有第一连接点C;所述第二馈电点B和所述第二辐射末端212之间设置有第二连接点D;Referring to FIG. 3 , a first connection point C is arranged between the first feeding point A and the
所述天线组件100还包括:The
带阻滤波电路(Band Stop Filter,BSF)30,一端连接与所述第一连接点C,另一端连接与所述第二连接点D,用于降低所述第一辐射体11和第二辐射体21之间的耦合。A band stop filter circuit (Band Stop Filter, BSF) 30, one end is connected to the first connection point C, and the other end is connected to the second connection point D, for reducing the
如图3所示,第一天线10和第二天线20是两个口对口的IFA(Inversed-F Antenna,倒F天线)天线,两支天线的辐射体的距离很小,因此,第一天线10和第二天线20会产生强烈的互耦,隔离度差。As shown in FIG. 3 , the
如图3所示,在两个天线的辐射体末端相互靠近的位置构造一个帯阻滤波电路,可以有效减少从一支天线的辐射体耦合到另外一支天线的辐射体的能量,降低所述第一辐射体和第二辐射体之间的耦合,实现两支天线的解耦,提高隔离度,进而提升天线效率。As shown in Figure 3, constructing a blocking filter circuit in a position where the ends of the radiators of the two antennas are close to each other can effectively reduce the energy coupled from the radiator of one antenna to the radiator of the other antenna, and reduce the The coupling between the first radiator and the second radiator realizes the decoupling of the two antennas, improves the isolation, and further improves the efficiency of the antenna.
需要说明的是,此处以天线为IFA为例进行说明,对于其他形式的天线也同样适用。It should be noted that the description is given by taking the antenna as an IFA as an example, and the same applies to other types of antennas.
请参阅图4,图4为本申请实施例提供的带阻滤波电路30的示意图。所述带阻滤波电路30包括并联的第一支路30A和第二支路30B;其中所述第一支路为电容;所述第二支路为电感。Please refer to FIG. 4 , which is a schematic diagram of a band-
第一支路30A和第二支路30B构成等效的谐振回路,其中,第一支路30A用于决定带阻滤波电路的谐振频率的大小,第二支路30B的电感的大小决定了带阻滤波电路的工作频率。The
通过将带阻滤波电路30串接在第一天线10和第二天线20之间,提高第一天线10和第二天线20的隔离度。By connecting the band-
请参阅图5和图6,图5为本申请实施例一提供的天线组件100的部署示意图。图6为本申请实施例一提供的第一辐射体11和第二辐射体21的相对位置的示意图。在图5中,第一天线10和第二天线20均部署在电子设备1000的同一侧边,其中第一天线部署在介质基板600的第一表面61,第二辐射体21(图中未示出)部署在介质基板600的第二表面62。在图6中未示出第一接地端112和第二接地端212。所述第一辐射体11和所述第二辐射体12相互平行,且所述第一辐射体11和第二辐射体12中一个辐射末端的平行投影位于所述第一辐射体11和第二辐射体12中另一个辐射体上。在图6中,第一辐射末端112的平行投影邻近第二辐射体21上,且邻近第二辐射末端212;第二辐射末端212的平行投影邻近第一辐射体11上,且邻近第一辐射末端112。借助第一辐射体和第二辐射体之间相互平行,实现第一辐射末端112和第二辐射末端212之间存在辐射体缝隙,同时,由于所述第一辐射体11和所述第二辐射体12相互平行,使得所述第一辐射体11和所述第二辐射体12不处于同一平面上,从而使得第一辐射体和第二辐射体实现部分重叠,从而有效减少第一辐射体11和第二辐射体12所占用的空间,提高了空间利用率。Please refer to FIG. 5 and FIG. 6 . FIG. 5 is a schematic diagram of the deployment of the
与相关技术中将第一辐射体11和第二辐射体21部署在同一表面上相比,可以有效减少所需介质基板的长度,提高空间的利用率。Compared with the related art in which the
请参阅图7,图7为本申请实施例一提供的带阻滤波电路30的示意图。所述带阻滤波电路30包括:Please refer to FIG. 7 , which is a schematic diagram of the band-
位于所述第一辐射体上的第一连接区31,所述第一连接区31设置在所述第一连接点和所述第一辐射末端之间;a
位于所述第二辐射体上的第二连接区32,所述第二连接区32设置在所述第二连接点和所述第二辐射末端之间;a
导电器件33,一端连接所述第一连接区31,另一端连接第二连接区32。One end of the
请参阅图7,第一辐射体11上的第一连接区31通过第一连接点C与第一辐射体相连,第二辐射体21上的第二连接区32通过第二连接点D与第二辐射体21相连。导电器件33通过与第一连接区31和第二连接区32相连,实现带阻滤波电路串接在第一辐射体11和第二辐射体21之间的目的。Referring to FIG. 7 , the
请参阅图8,图8为图7所示带阻滤波电路30中等效电容的示意图。请一并参阅图6,所述第一辐射末端112在第二表面62的投影位于所述第二辐射体21在第二表面62对应的区域中;所述第二辐射末端212在第一表面61的投影位于所述第一辐射体11在第一表面61对应的区域中,使得所述第一辐射体11和所述第二辐射体12在空间上实现部分重叠。由于两个平行的辐射体可构成一对平行平板电容器,具体的,第一辐射体11和第二辐射体21的正对区域构成等效电容,构成了第一支路30A,确定了带阻滤波电路的谐振频率大小。Please refer to FIG. 8 , which is a schematic diagram of an equivalent capacitor in the band-
进一步的,根据分布参数电路模型等效为一对分布参数电容C1和分布参数电容C2。其中,第一辐射体11邻近第一辐射末端112一侧区域的相对面积决定了分布参数电容C1的大小,第二辐射体21邻近第一辐射末端212一侧的区域的相对面积决定了分布参数电容C2的大小。其中,分布参数电容C1和分布参数电容C2。Further, according to the distributed parameter circuit model, it is equivalent to a pair of distributed parameter capacitors C1 and distributed parameter capacitors C2. Wherein, the relative area of the area of the
该导电器件33可以等效为电感,因此,上述结构的带阻滤波电路实现了等效电感与等效电容并行的谐振电路。The
优选的,所述导电器件33为金属体,所述金属体采用焊接方式连接在所述第一连接区和所述第二连接区。Preferably, the
上述连接方式实现简单,且硬件成本低。The above connection method is simple to implement and has low hardware cost.
在本申请一个实施例中,所述介质基板设置有与所述第一连接区和所述第二连接区对应的通孔;In an embodiment of the present application, the dielectric substrate is provided with through holes corresponding to the first connection area and the second connection area;
所述导电器件穿过所述通孔与所述第一连接区和所述第二连接区相连。The conductive device is connected to the first connection area and the second connection area through the through hole.
请参阅图9,图9为本申请实施例一提供的介质基板的示意图。通过在介质基板600上设置通孔63,可以方便导电器件33通过,从而将第一辐射体11和第二辐射体12相连,硬件结构更加紧凑,且空间利用率高。Please refer to FIG. 9 , which is a schematic diagram of a dielectric substrate provided in Embodiment 1 of the present application. By arranging the through
在本申请中的一个实施例中,所述带阻滤波电路包括连接与所述第一连接区31和所述第一连接点C之间的第一电感L1;和/或,连接与所述第二连接区32和所述第二连接点D之间的第二电感L2。In an embodiment of the present application, the band-stop filter circuit includes a first inductance L1 connected between the
请参阅图10,图10为图4所示带阻滤波电路30的另一示意图。以所述带阻滤波电路30包括第一电感L1和第二电感L2为例进行说明,第一电感L1和第二电感L2以及导电器件的等效电感三者串联,构成等效电感,作为第二支路30B,用于确定带阻滤波电路的工作频率。Please refer to FIG. 10 , which is another schematic diagram of the band-
在本申请的一个实施例中,所述第一辐射体11上设置有环绕所述第一连接区31的第一缝隙311,其中所述第一电感L1设置在所述第一缝隙311中;和/或,In an embodiment of the present application, the
所述第二辐射体21上设置有环绕所述第二连接区32的第二缝隙321,其中所述第二电感L2设置在所述第二缝隙321中。The second radiator 21 is provided with a second slot 321 surrounding the
请参阅图11,图11为图10所示第一电感L1的部署示意图。以在第一辐射体11末端部署的第一电感L1为例进行说明。该第一缝隙311可以环绕所述第一连接区31设置,第一电感L1可以设置在该第一缝隙311中,达到在带阻滤波电路中设置电感元件的目的,且能有效利用空间。Please refer to FIG. 11 , which is a schematic diagram of the deployment of the first inductor L1 shown in FIG. 10 . Take the first inductor L1 deployed at the end of the
可选的,所述带阻滤波电路30还包括:Optionally, the band-
蚀刻在所述第一表面61的线圈构成的第一等效电感;和/或,the first equivalent inductance formed by the coil etched on the
蚀刻在所述第二表面62的线圈构成的第二等效电感。The second equivalent inductance formed by the coil etched on the
请参阅图12,图12为图10所示第一电感L1的结构示意图。如图11所示,以环形方式蚀刻在第一表面61上形成线圈,构成第一等效电感。Please refer to FIG. 12 , which is a schematic structural diagram of the first inductor L1 shown in FIG. 10 . As shown in FIG. 11 , a coil is formed by etching on the
进一步的,在设置第一等效电感和第二等效电感中至少一个的同时,还可以设置第一电感和第二电感中的至少一个,其中,该第一电感连接于所述第一连接区和所述第一连接点之间;第二电感连接于所述第二连接区和所述第二连接点之间。Further, when at least one of the first equivalent inductance and the second equivalent inductance is set, at least one of the first inductance and the second inductance can also be set, wherein the first inductance is connected to the first connection between the second connection area and the first connection point; the second inductor is connected between the second connection area and the second connection point.
请参阅图13,图13为本申请实施例二提供的天线组件100的部署示意图。所述第一辐射体11和所述第二辐射体21均位于介质基板600的同一表面,如第一表面61或第二表面62;Please refer to FIG. 13 . FIG. 13 is a schematic diagram of the deployment of the
请参阅图14,图14为本申请实施例二中带阻滤波电路30的示意图。所述带阻滤波电路30包括与所述第一辐射末端112相连的一个或多个第一辐射延长单元34、与所述第二辐射末端212相连的一个或多个第二辐射延长单元35,其中至少两个第一辐射延长单元34之间设置有第二辐射延长单元35;和/或,至少两个第二辐射延长单元35设置有所述第一辐射延长单元34。Please refer to FIG. 14 . FIG. 14 is a schematic diagram of the band-
由于第一辐射体11和所述第二辐射体21位于介质基板600的同一层,利用第一辐射延长单元33以及第二辐射延长单元34交叉设置,可以构成第一辐射体11和第二辐射体21的相对面积,从而形成等效电容,实现第一汉支路30A的构建。Since the
请参阅图15,图15为图14所示带阻滤波电路30的另一示意图。所述带阻滤波电路30还包括与相邻的第一辐射延长单元33和第二辐射延长单元34相连的第三电感L3。Please refer to FIG. 15 , which is another schematic diagram of the band-
利用相邻的第一辐射延长单元33和第二辐射延长单元34之间的缝隙来设置电感器件,从而完成带阻滤波电路中第二支路30B的构建The gap between the adjacent first
可选的,蚀刻在第一或等二表面的线圈构成的第三等效电感。Optionally, a third equivalent inductance formed by a coil etched on the first or second surface.
第三等效电感的结构可以参见图11所示的结构。The structure of the third equivalent inductor can refer to the structure shown in FIG. 11 .
综上所述,通过设置带阻滤波电路,实现第一天线10和第二天线20解耦,提高隔离度和天线辐射效率。To sum up, by setting the band-stop filter circuit, the decoupling of the
本申请实施例提供一种电子设备1000,设置有上文任一的天线组件100。The embodiment of the present application provides an
以电子设备1000同一侧边设置有第一天线10和第二天线20为例进行说明,其中第一天线10和第二天线20为同频天线。For illustration, the
按照相关技术中进行设置,二者近似镜像对称排布,辐射体互相平行,且辐射臂末端距离较近,使得第一天线10和第二天线20之间耦合度较高,其中第一天线10的S参数曲线参见图16所示的曲线S1,1未解耦,第一天线20的S参数曲线参见图16所示的曲线S2,1未解耦。According to the arrangement in the related art, the two are arranged approximately in mirror symmetry, the radiators are parallel to each other, and the distance between the ends of the radiating arms is relatively close, so that the coupling degree between the
在设置带阻滤波电路后,使得第一天线10和第二天线20之间耦合度降低,其中第一天线10的S参数曲线参见图15所示的曲线S1,1解耦后,第一天线20的S参数曲线参见图16所示的曲线S2,1解耦后。After the band-stop filter circuit is set, the coupling degree between the
请参阅图16,图16为第一天线10和第二天线20未解耦与解耦之后的S参数对比图。未加BSF解耦结构之前,第一天线10和第二天线20之间的耦合非常强,隔离度很差。增加了解耦结构之后,在传输系数原本的峰值处出现一个凹陷,这是带阻滤波器的谐振点所在。Please refer to FIG. 16 , FIG. 16 is a comparison diagram of the S-parameters of the
以第一天线10和第二天线20工作频率相同为例,在激励第一天线10时,由于第一天线10和第二天线20的末端十分接近,极化平行,且工作频率相同,因此耦合非常强,两支天线上电流强度几乎相当。在增设带阻滤波电路后,耦合到第二天线20上的电流明显减弱。Taking the same working frequency of the
请参阅图17,图17为第一天线10未解耦和解耦后的辐射效率的对比图。在激励第一天线10时,由于耦合到第二天线20的功率减小,因此能量得以辐射到自由空间,辐射效率显著提升。Please refer to FIG. 17 . FIG. 17 is a comparison diagram of the radiation efficiency of the
本领域普通技术人员可以理解,上文中所公开方法中的全部或某些步骤、系统、装置中的功能模块/单元可以被实施为软件、固件、硬件及其适当的组合。在硬件实施方式中,在以上描述中提及的功能模块/单元之间的划分不一定对应于物理组件的划分;例如,一个物理组件可以具有多个功能,或者一个功能或步骤可以由若干物理组件合作执行。某些组件或所有组件可以被实施为由处理器,如数字信号处理器或微处理器执行的软件,或者被实施为硬件,或者被实施为集成电路,如专用集成电路。这样的软件可以分布在计算机可读介质上,计算机可读介质可以包括计算机存储介质(或非暂时性介质)和通信介质(或暂时性介质)。如本领域普通技术人员公知的,术语计算机存储介质包括在用于存储信息(诸如计算机可读指令、数据结构、程序模块或其他数据)的任何方法或技术中实施的易失性和非易失性、可移除和不可移除介质。计算机存储介质包括但不限于RAM、ROM、EEPROM、闪存或其他存储器技术、CD-ROM、数字多功能盘(DVD)或其他光盘存储、磁盒、磁带、磁盘存储或其他磁存储装置、或者可以用于存储期望的信息并且可以被计算机访问的任何其他的介质。此外,本领域普通技术人员公知的是,通信介质通常包含计算机可读指令、数据结构、程序模块或者诸如载波或其他传输机制之类的调制数据信号中的其他数据,并且可包括任何信息递送介质。Those of ordinary skill in the art can understand that all or some of the steps in the methods disclosed above, functional modules/units in the systems, and devices can be implemented as software, firmware, hardware, and appropriate combinations thereof. In a hardware implementation, the division between functional modules/units mentioned in the above description does not necessarily correspond to the division of physical components; for example, one physical component may have multiple functions, or one function or step may be composed of several physical components Components execute cooperatively. Some or all of the components may be implemented as software executed by a processor, such as a digital signal processor or microprocessor, or as hardware, or as an integrated circuit, such as an application specific integrated circuit. Such software may be distributed on computer-readable media, which may include computer storage media (or non-transitory media) and communication media (or transitory media). As known to those of ordinary skill in the art, the term computer storage media includes both volatile and nonvolatile implemented in any method or technology for storage of information, such as computer readable instructions, data structures, program modules or other data flexible, removable and non-removable media. Computer storage media include, but are not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, digital versatile disk (DVD) or other optical disk storage, magnetic cartridges, magnetic tape, magnetic disk storage or other magnetic storage devices, or may Any other medium used to store desired information and which can be accessed by a computer. In addition, communication media typically embodies computer readable instructions, data structures, program modules, or other data in a modulated data signal such as a carrier wave or other transport mechanism, and can include any information delivery media, as is well known to those of ordinary skill in the art .
Claims (11)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210388156.6A CN114899599B (en) | 2022-04-13 | 2022-04-13 | Antenna assembly and electronic device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210388156.6A CN114899599B (en) | 2022-04-13 | 2022-04-13 | Antenna assembly and electronic device |
Publications (2)
Publication Number | Publication Date |
---|---|
CN114899599A true CN114899599A (en) | 2022-08-12 |
CN114899599B CN114899599B (en) | 2024-11-22 |
Family
ID=82716718
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202210388156.6A Active CN114899599B (en) | 2022-04-13 | 2022-04-13 | Antenna assembly and electronic device |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN114899599B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117996449A (en) * | 2024-02-22 | 2024-05-07 | 无锡创宇物联技术有限公司 | Tunable antenna system applicable to multiple frequency bands and corresponding electronic equipment |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2819242A1 (en) * | 2013-06-28 | 2014-12-31 | BlackBerry Limited | Antenna with a combined bandpass/bandstop filter network |
US20150002347A1 (en) * | 2013-06-28 | 2015-01-01 | Research In Motion Limited | Antenna with a combined bandpass/bandstop filter network |
CN104425891A (en) * | 2013-09-05 | 2015-03-18 | 广达电脑股份有限公司 | Antenna module |
CN111276806A (en) * | 2020-02-14 | 2020-06-12 | 维沃移动通信有限公司 | Antenna and electronic equipment |
CN113644436A (en) * | 2021-08-18 | 2021-11-12 | 维沃移动通信有限公司 | Antenna system and electronic equipment |
CN113764885A (en) * | 2020-06-05 | 2021-12-07 | 华为技术有限公司 | Electronic equipment |
-
2022
- 2022-04-13 CN CN202210388156.6A patent/CN114899599B/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2819242A1 (en) * | 2013-06-28 | 2014-12-31 | BlackBerry Limited | Antenna with a combined bandpass/bandstop filter network |
US20150002347A1 (en) * | 2013-06-28 | 2015-01-01 | Research In Motion Limited | Antenna with a combined bandpass/bandstop filter network |
CN104425891A (en) * | 2013-09-05 | 2015-03-18 | 广达电脑股份有限公司 | Antenna module |
CN111276806A (en) * | 2020-02-14 | 2020-06-12 | 维沃移动通信有限公司 | Antenna and electronic equipment |
WO2021160066A1 (en) * | 2020-02-14 | 2021-08-19 | 维沃移动通信有限公司 | Antenna and electronic device |
CN113764885A (en) * | 2020-06-05 | 2021-12-07 | 华为技术有限公司 | Electronic equipment |
CN113644436A (en) * | 2021-08-18 | 2021-11-12 | 维沃移动通信有限公司 | Antenna system and electronic equipment |
Non-Patent Citations (1)
Title |
---|
CHENG-DAI XUE 等: ""MIMO Antenna Using Hybrid Electric and Magnetic Coupling for Isolation Enhancement"", 《MIMOANTENNA USING HYBRID ELECTRIC AND MAGNETIC COUPLING FOR ISOLATION ENHANCEMENT》, vol. 65, no. 10, 10 August 2017 (2017-08-10) * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117996449A (en) * | 2024-02-22 | 2024-05-07 | 无锡创宇物联技术有限公司 | Tunable antenna system applicable to multiple frequency bands and corresponding electronic equipment |
Also Published As
Publication number | Publication date |
---|---|
CN114899599B (en) | 2024-11-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2022206237A1 (en) | Antenna assembly and electronic device | |
TWI425713B (en) | Three-band antenna device with resonance generation | |
KR102455333B1 (en) | Antenna systems and terminal equipment | |
US9502776B2 (en) | Antenna surrounded by metal housing | |
KR100980774B1 (en) | Internal mimo antenna having isolation aid | |
US10008765B2 (en) | Antenna structure and wireless communication device using same | |
CN105141717A (en) | Mobile terminal device | |
CN113437520B (en) | Antenna device and electronic apparatus | |
CN101764282B (en) | Electromagnetic radiation device and manufacturing method thereof | |
WO2023160131A1 (en) | Antenna assembly and electronic device | |
CN214378835U (en) | Antenna module and mobile terminal | |
WO2023273604A1 (en) | Antenna module and electronic device | |
CN108879112B (en) | Antenna array and terminal | |
WO2023124646A1 (en) | Antenna assembly and electronic device | |
CN112821050B (en) | Antenna assembly and electronic equipment | |
WO2020134328A1 (en) | Antenna module and mobile terminal | |
US10707571B2 (en) | Antenna device for mobile terminal and mobile terminal | |
CN114899599A (en) | Antenna assembly and electronic equipment | |
US20230387594A1 (en) | Antenna assembly and electronic device | |
US20240014556A1 (en) | Antenna assembly and electronic device | |
CN102157794A (en) | Three-frequency-band antenna generated by resonance | |
CN111403901A (en) | Antenna modules and electronic equipment | |
WO2024139486A1 (en) | Antenna assembly and electronic device | |
WO2022068373A1 (en) | Antenna assembly and electronic device | |
CN118156771A (en) | Antenna assembly and electronic equipment |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |