CN114899599A

CN114899599A - Antenna assembly and electronic equipment

Info

Publication number: CN114899599A
Application number: CN202210388156.6A
Authority: CN
Inventors: 文思超
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2022-04-13
Filing date: 2022-04-13
Publication date: 2022-08-12

Abstract

The embodiment of the application discloses an antenna assembly and electronic equipment. The antenna assembly, comprising: the first antenna comprises a first radiator, a first matching module and a first feed module; the first radiator is provided with a first grounding end and a first radiation tail end; a first connecting point is arranged between the first feeding point and the first radiation tail end; the second antenna comprises a second radiator, a second matching module and a second feed module; the second radiator is provided with a second radiation tail end and a second grounding end; a radiator gap is formed between the second radiation tail end and the first radiation tail end; a second connection point is arranged between the second feeding point and the second radiation tail end; and one end of the band elimination filter circuit is connected with the first connecting point, and the other end of the band elimination filter circuit is connected with the second connecting point, and the band elimination filter circuit is used for reducing the coupling between the first radiator and the second radiator.

Description

Antenna assembly and electronic equipment

Technical Field

The present disclosure relates to electronic circuits, and more particularly, to an antenna assembly and an electronic device.

Background

The quantity of the antennas on the electronic equipment is large and the antennas are densely arranged, so that the coupling degree between the antennas is strong; a certain spatial distance between the antenna elements is usually required to ensure sufficient isolation. Because the above-mentioned method will increase the space occupied by the antenna and the decoupling effect needs to be further improved, how to decouple the antennas is a problem to be solved urgently.

Disclosure of Invention

In order to solve any one of the above technical problems, embodiments of the present application provide an antenna assembly and an electronic device.

To achieve the purpose of the embodiments of the present application, the embodiments of the present application provide an antenna assembly, including:

the first antenna comprises a first radiator, a first matching module and a first feed module; the first radiator is provided with a first grounding end, a first radiation tail end and a first feeding point positioned between the first grounding end and the first radiation tail end, the first matching module is electrically connected between the first feeding point and the first feeding module, and the first grounding end is electrically connected to a first reference ground; wherein a first connection point is arranged between the first feed point and the first radiation tail end;

the second antenna comprises a second radiator, a second matching module and a second feed module; the second radiator is provided with a second radiation tail end and a second grounding end, and a second feeding point is positioned between the second radiation tail end and the second grounding end, the second matching module is electrically connected between the second feeding point and the second feeding module, and the second grounding end is electrically connected to a second reference ground; wherein a radiator gap exists between the second radiation end and the first radiation end; wherein a second connection point is arranged between the second feeding point and the second radiating end;

and one end of the band elimination filter circuit is connected with the first connecting point, and the other end of the band elimination filter circuit is connected with the second connecting point, and is used for reducing the coupling between the first radiator and the second radiator.

An electronic device is provided with an antenna assembly as described above.

One of the above technical solutions has the following advantages or beneficial effects:

a band-impedance filter circuit is constructed at the position where the tail ends of the radiating bodies of the two antennas are close to each other, so that the coupling between the first radiating body and the second radiating body is reduced, the decoupling of the two antennas is realized, the isolation is improved, and the antenna efficiency is further improved.

Additional features and advantages of the embodiments of the application will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the embodiments of the application. The objectives and other advantages of the embodiments of the application may be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.

Drawings

The accompanying drawings are included to provide a further understanding of the embodiments of the present application and are incorporated in and constitute a part of this specification, illustrate embodiments of the present application and together with the examples of the embodiments of the present application do not constitute a limitation of the embodiments of the present application.

Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present disclosure;

fig. 2 is a schematic perspective view of the electronic device shown in fig. 1;

fig. 3 is a schematic structural diagram of the antenna assembly 100 provided herein;

fig. 4 is a schematic diagram of a band-stop filter circuit 30 provided in an embodiment of the present application;

fig. 5 is a schematic deployment diagram of an antenna assembly 100 according to an embodiment of the present application;

fig. 6 is a schematic diagram illustrating relative positions of a first radiator 11 and a second radiator 21 according to an embodiment of the present disclosure;

fig. 7 is a schematic diagram of a band-stop filter circuit 30 according to an embodiment of the present application;

FIG. 8 is a schematic diagram of the equivalent capacitor in the band-stop filter circuit 30 shown in FIG. 7;

FIG. 9 is a schematic view of a dielectric substrate according to an embodiment of the present application;

fig. 10 is another schematic diagram of the band-stop filter circuit 30 according to an embodiment of the present application;

fig. 11 is a schematic deployment diagram of the first inductor L1 shown in fig. 10;

fig. 12 is a schematic structural diagram of the first inductor L1 shown in fig. 10;

fig. 13 is a schematic deployment view of an antenna assembly 100 provided in embodiment two of the present application;

FIG. 14 is a schematic diagram of a band-stop filter circuit 30 according to a second embodiment of the present application;

FIG. 15 is another schematic diagram of the band-stop filter circuit 30 of FIG. 14;

fig. 16 is a graph comparing S-parameters after the first antenna 10 and the second antenna 20 are not decoupled and are decoupled;

fig. 17 is a graph comparing the efficiency of the first antenna 10 before and after decoupling.

Detailed Description

To make the objects, technical solutions and advantages of the embodiments of the present application more apparent, the embodiments of the present application will be described in detail below with reference to the accompanying drawings. It should be noted that, in the embodiments of the present application, features in the embodiments and the examples may be arbitrarily combined with each other without conflict.

Referring to fig. 1, fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present disclosure. The electronic device 1000 includes an antenna assembly 100. The antenna assembly 100 is used for transceiving electromagnetic wave signals to implement a communication function of the electronic device 1000. The location of the antenna assembly 100 within the electronic device 1000 is not specifically limited by the present application. The electronic device 1000 further includes a display 300 and a housing 200 that are coupled to each other.

The antenna assembly 100 may be disposed inside the housing 200 of the electronic device 1000, or partially integrated with the housing 200, or partially disposed outside the housing 200. The radiator of the antenna assembly 100 of fig. 1 is integrated with the housing 200. Of course, the antenna assembly 100 may also be disposed on a retractable component of the electronic device 1000, in other words, at least a portion of the antenna assembly 100 can also extend out of the electronic device 1000 along with the retractable component of the electronic device 1000 and retract into the electronic device 1000 along with the retractable component; alternatively, the overall length of the antenna assembly 100 is extended as the retractable components of the electronic device 1000 are extended.

The electronic device 1000 includes, but is not limited to, a telephone, a television, a tablet computer, a mobile phone, a camera, a personal computer, a notebook computer, an in-vehicle device, an earphone, a watch, a wearable device, a base station, an in-vehicle radar, a Customer Premise Equipment (CPE), and the like, which are capable of transceiving electromagnetic wave signals. In the present application, the electronic device 1000 is taken as a mobile phone as an example, and other devices may refer to the detailed description in the present application.

For convenience of description, referring to a view angle of the electronic apparatus 1000 in fig. 1, a width direction of the electronic apparatus 1000 is defined as an X-axis direction, a length direction of the electronic apparatus 1000 is defined as a Y-axis direction, and a thickness direction of the electronic apparatus 1000 is defined as a Z-axis direction. The X-axis direction, the Y-axis direction and the Z-axis direction are vertical to each other. Wherein the direction indicated by the arrow is the forward direction.

Referring to fig. 2, the housing 200 includes a frame 210 and a rear cover 220. The middle plate 410 is formed in the bezel 210 by injection molding, and a plurality of mounting grooves for mounting various electronic devices are formed on the middle plate 410. Middle plate 410 and bezel 210 together become a middle frame 420 of electronic device 1000. The display screen 300, the middle frame 420 and the rear cover 220 form a receiving space on both sides of the middle frame 420 after being covered. One side (e.g., the rear side) of the bezel 210 is attached around the periphery of the rear cover 220, and the other side (e.g., the front side) of the bezel 210 is attached around the periphery of the display screen 300.

The electronic device 1000 further includes a battery, a camera, a microphone, a receiver, a speaker, a face recognition module, a fingerprint recognition module, and other devices that are disposed in the accommodating space and can implement the basic functions of the mobile phone, which are not described in detail in this embodiment.

The antenna assembly 100 provided in the present application is specifically described below with reference to the drawings, and of course, the antenna assembly 100 provided in the present application includes, but is not limited to, the following embodiments.

Referring to fig. 3, the antenna assembly 100 at least includes a first radiator 11, a second radiator 21, a first matching module M1, a first feeding module 13, a second matching module M2, and a second feeding module 23. For the convenience of functionally dividing different parts of the antenna assembly 100 to facilitate the following description, the first radiator 11, the second radiator 21, the first matching module M1, and the first feeding module 13 are defined as the first antenna unit 10, and the first radiator 11, the second radiator 21, the second matching module M2, and the second feeding module 23 are defined as the second antenna unit 20.

Referring to fig. 3, the first radiator 11 has a first ground 111 and a first radiation end 112, and a first feeding point a located between the first ground 111 and the first radiation end 112. In this embodiment, the first ground end 111 and the first radiation end 112 are opposite ends of the first radiator 11 in a straight line shape. In other embodiments, the first radiator 11 is bent, the first ground 111 and the first radiation end 112 may not be opposite to each other along a straight line, but the first ground 111 and the first radiation end 112 are two ends of the first radiator 11.

Referring to fig. 3, the second radiator 21 has a second radiation end 211 and a second ground end 212, and a second feeding point B located between the second radiation end 211 and the second ground end 212. A radiator gap 140 exists between the second radiating end 211 and the first radiating end 112. In this embodiment, the second radiation end 211 and the second ground end 212 are two ends of the second radiator 21. Alternatively, the first radiator 11 and the second radiator 21 may be arranged in a straight line or substantially in a straight line (i.e., with a small tolerance in the design process).

Of course, in other embodiments, the first radiator 11 and the second radiator 21 may be arranged offset in the extending direction to form a relief space and the like.

Referring to fig. 3, the first radiating end 112 and the second radiating end 211 are disposed opposite to each other and spaced apart from each other. The radiator gap 140 is a gap between the first radiator 11 and the second radiator 21, for example, the width of the radiator gap 140 may be 0.5-2 mm, but is not limited thereto. The first radiator 11 and the second radiator 21 can be seen as two parts formed with the radiator slots 140 separating the radiators.

Preferably, the first radiator 11 and the second radiator 21 are capacitively coupled through the radiator slot 140. Here, the "capacitive coupling" means that an electric field is generated between the first radiator 11 and the second radiator 21, a signal of the first radiator 11 can be transmitted to the second radiator 21 through the electric field, and a signal of the second radiator 21 can be transmitted to the first radiator 11 through the electric field, so that the first radiator 11 and the second radiator 21 can achieve electrical conduction even in a state of not being in direct contact or not in direct contact.

It is understood that the shape and configuration of the first radiator 11 and the second radiator 21 are not limited in the present application, and the shapes of the first radiator 11 and the second radiator 21 include, but are not limited to, a strip, a sheet, a rod, a coating, a film, and the like. When the first radiator 11 and the second radiator 21 are in the shape of a strip, the extending tracks of the first radiator 11 and the second radiator 21 are not limited in this application, so that the first radiator 11 and the second radiator 21 can extend in a straight line, a curve, a multi-section bending track, and the like. The radiator can be a line with uniform width on the extending track, and can also be a strip with gradually changed width and different widths, such as a widened area.

Referring to fig. 3, the first matching module M1 is electrically connected between the first feeding point a and the first feeding module 13. The first feeding module 13 is a radio frequency transceiver chip for transmitting radio frequency signals or a feeding portion electrically connected to the radio frequency transceiver chip for transmitting radio frequency signals. The first matching module M1 may include at least one of a switching device, a capacitive device, an inductive device, a resistive device, and the like.

Referring to fig. 3, the first ground 111 is electrically connected to the first ground reference GND1, and the electrical connection method includes but is not limited to direct soldering, or indirect electrical connection through a coaxial line, a microstrip line, a conductive elastic piece, a conductive adhesive, and the like. The specific position of the first feeding point a on the first radiator 11 is not limited in the present application.

Referring to fig. 3, the second antenna unit 20 includes a first radiator 11, a second radiator 21, a second matching module M2, and a second feeding module 23.

Referring to fig. 3, the second matching module M2 is electrically connected between the second feeding point B and the second feeding module 23. The second feeding module 23 is a rf transceiver chip for transmitting rf signals or a feeding portion electrically connected to the rf transceiver chip for transmitting rf signals. The second matching module M2 includes at least one of a switching device, a capacitive device, an inductive device, a resistive device, and the like.

Referring to fig. 3, the second ground terminal 212 is electrically connected to the second ground reference GND2, and the electrical connection method includes, but is not limited to, direct soldering, or indirect electrical connection through a coaxial line, a microstrip line, a conductive elastic piece, a conductive adhesive, and the like. The specific position of the first feeding point a on the first radiator 11 is not limited in the present application.

The first ground reference GND1 and the second ground reference GND2 include, but are not limited to, the following embodiments. Optionally, the antenna assembly 100 itself has a reference ground. Specific forms of the reference ground include, but are not limited to, a metal conductive plate, a metal conductive layer formed inside a flexible circuit board, a hard circuit board, and the like. The first ground reference GND1 and the second ground reference GND2 may be one ground reference integrally formed in the antenna assembly 100, or may be two ground references independent from each other and connected to each other in the antenna assembly 100. When the antenna assembly 100 is disposed within the electronic device 1000, the reference ground of the antenna assembly 100 is connected to the reference ground of the electronic device 1000. Still alternatively, the antenna assembly 100 itself does not have a ground reference, and the first ground 111 and the second ground 212 of the antenna assembly 100 are electrically connected to a ground reference of the electronic device 1000 or a ground reference of an electronic device within the electronic device 1000 by direct electrical connection or indirectly through a conductive member. In the present application, the antenna assembly 100 is disposed in the electronic device 1000, and the metal alloy on the middle plate 410 is used as the ground GND. Namely, the first ground reference GND1 and the second ground reference GND2 are part of the middle plate 410 or are electrically connected to the middle plate 410.

Referring to fig. 3, a first connection point C is disposed between the first feeding point a and the first radiation end 112; a second connection point D is arranged between the second feeding point B and the second radiating end 212;

the antenna assembly 100 further includes:

a Band Stop Filter (BSF) 30 having one end connected to the first connection point C and the other end connected to the second connection point D, and configured to reduce coupling between the first radiator 11 and the second radiator 21.

As shown in fig. 3, the first Antenna 10 and the second Antenna 20 are two inverted-F antennas (IFA) antennas, and the distance between the radiators of the two antennas is small, so that the first Antenna 10 and the second Antenna 20 are strongly coupled with each other and have poor isolation.

As shown in fig. 3, a band-impedance filter circuit is constructed at a position where the ends of the radiators of the two antennas are close to each other, so that energy coupling from the radiator of one antenna to the radiator of the other antenna can be effectively reduced, coupling between the first radiator and the second radiator is reduced, decoupling of the two antennas is realized, isolation is improved, and antenna efficiency is further improved.

Here, the description will be given taking an antenna as an IFA as an example, and the present invention is also applicable to other types of antennas.

Referring to fig. 4, fig. 4 is a schematic diagram of a band-stop filter circuit 30 according to an embodiment of the present application. The band-stop filter circuit 30 comprises a first branch 30A and a second branch 30B which are connected in parallel; wherein the first branch is a capacitor; the second branch circuit is an inductor.

The first branch 30A and the second branch 30B form an equivalent resonant tank, wherein the first branch 30A is used for determining a resonant frequency of the band-stop filter circuit, and the inductance of the second branch 30B determines an operating frequency of the band-stop filter circuit.

By connecting the band-stop filter circuit 30 in series between the first antenna 10 and the second antenna 20, the isolation between the first antenna 10 and the second antenna 20 is improved.

Referring to fig. 5 and 6, fig. 5 is a schematic diagram illustrating a deployment of an antenna assembly 100 according to an embodiment of the present application. Fig. 6 is a schematic diagram illustrating relative positions of the first radiator 11 and the second radiator 21 according to a first embodiment of the present disclosure. In fig. 5, the first antenna 10 and the second antenna 20 are disposed on the same side of the electronic device 1000, wherein the first antenna is disposed on the first surface 61 of the dielectric substrate 600, and the second radiator 21 (not shown) is disposed on the second surface 62 of the dielectric substrate 600. The first ground terminal 112 and the second ground terminal 212 are not shown in fig. 6. The first radiator 11 and the second radiator 12 are parallel to each other, and a parallel projection of one radiation end of the first radiator 11 and the second radiator 12 is located on the other radiator of the first radiator 11 and the second radiator 12. In fig. 6, the parallel projection of the first radiation end 112 is adjacent to the second radiator 21 and adjacent to the second radiation end 212; the parallel projection of the second radiation end 212 is adjacent to the first radiator 11 and adjacent to the first radiation end 112. With the help of being parallel to each other between first irradiator and the second irradiator, realize that there is the irradiator gap between first radiation end 112 and the second radiation end 212, simultaneously, because first irradiator 11 with second irradiator 12 is parallel to each other, makes first irradiator 11 with second irradiator 12 is not on the coplanar to make first irradiator and second irradiator realize the part and overlap, thereby effectively reduce the shared space of first irradiator 11 and second irradiator 12, improved space utilization.

Compared with the prior art in which the first radiator 11 and the second radiator 21 are disposed on the same surface, the length of the required dielectric substrate can be effectively reduced, and the utilization rate of space is improved.

Referring to fig. 7, fig. 7 is a schematic diagram of a band-stop filter circuit 30 according to an embodiment of the present application. The band-stop filter circuit 30 includes:

a first connection region 31 on the first radiator, the first connection region 31 being disposed between the first connection point and the first radiation end;

a second connection region 32 on the second radiator, the second connection region 32 being arranged between the second connection point and the second radiation end;

and a conductive element 33 having one end connected to the first connection region 31 and the other end connected to the second connection region 32.

Referring to fig. 7, the first connection region 31 of the first radiator 11 is connected to the first radiator through a first connection point C, and the second connection region 32 of the second radiator 21 is connected to the second radiator 21 through a second connection point D. The conductive device 33 is connected to the first connection region 31 and the second connection region 32, so that the band-stop filter circuit is connected in series between the first radiator 11 and the second radiator 21.

Referring to fig. 8, fig. 8 is a schematic diagram of an equivalent capacitor in the band-stop filter circuit 30 shown in fig. 7. Referring to fig. 6, the projection of the first radiation end 112 on the second surface 62 is located in the corresponding region of the second radiator 21 on the second surface 62; the projection of the second radiation end 212 on the first surface 61 is located in a region of the first radiator 11 corresponding to the first surface 61, so that the first radiator 11 and the second radiator 12 are partially overlapped in space. Since the two parallel radiators can form a pair of parallel plate capacitors, specifically, the opposite regions of the first radiator 11 and the second radiator 21 form an equivalent capacitance, which forms a first branch 30A, and determines the resonant frequency of the band-stop filter circuit.

Further, the distributed parameter circuit model is equivalent to a pair of distributed parameter capacitors C1 and C2. The relative area of the region of the first radiator 11 adjacent to the first radiation end 112 determines the size of the distributed parameter capacitor C1, and the relative area of the region of the second radiator 21 adjacent to the first radiation end 212 determines the size of the distributed parameter capacitor C2. The capacitor comprises a distributed parameter capacitor C1 and a distributed parameter capacitor C2.

The conductive device 33 can be equivalent to an inductor, and therefore, the band-stop filter circuit with the above structure realizes a resonant circuit with parallel equivalent inductor and equivalent capacitor.

Preferably, the conductive device 33 is a metal body, and the metal body is connected to the first connection region and the second connection region by welding.

The connection mode is simple to realize and low in hardware cost.

In one embodiment of the present application, the dielectric substrate is provided with through holes corresponding to the first connection region and the second connection region;

the conductive device is connected to the first connection region and the second connection region through the through hole.

Referring to fig. 9, fig. 9 is a schematic view of a dielectric substrate according to an embodiment of the present application. Through the through hole 63 formed in the dielectric substrate 600, the conductive device 33 can pass through the through hole conveniently, so that the first radiator 11 and the second radiator 12 are connected, the hardware structure is more compact, and the space utilization rate is high.

In one embodiment of the present application, the band-stop filter circuit includes a first inductor L1 connected between the first connection region 31 and the first connection point C; and/or a second inductance L2 connected between said second connection region 32 and said second connection point D.

Referring to fig. 10, fig. 10 is another schematic diagram of the band-stop filter circuit 30 shown in fig. 4. Taking the band-elimination filter circuit 30 including the first inductor L1 and the second inductor L2 as an example, the first inductor L1, the second inductor L2 and the equivalent inductor of the conductive device are connected in series to form an equivalent inductor, which is used as the second branch 30B for determining the operating frequency of the band-elimination filter circuit.

In an embodiment of the present application, a first slot 311 surrounding the first connection region 31 is disposed on the first radiator 11, wherein the first inductor L1 is disposed in the first slot 311; and/or the presence of a gas in the gas,

a second slot 321 surrounding the second connection region 32 is disposed on the second radiator 21, wherein the second inductor L2 is disposed in the second slot 321.

Referring to fig. 11, fig. 11 is a schematic view illustrating a disposition of the first inductor L1 shown in fig. 10. The first inductor L1 disposed at the end of the first radiator 11 is taken as an example for illustration. The first slot 311 may be disposed around the first connection region 31, and the first inductor L1 may be disposed in the first slot 311, so as to achieve the purpose of disposing an inductor element in the band-stop filter circuit, and effectively utilize space.

Optionally, the band-stop filter circuit 30 further includes:

a first equivalent inductor formed by etching a coil on the first surface 61; and/or the presence of a gas in the gas,

and a second equivalent inductor formed by a coil etched on the second surface 62.

Referring to fig. 12, fig. 12 is a schematic structural diagram of the first inductor L1 shown in fig. 10. As shown in fig. 11, the coil is formed on the first surface 61 by etching in a ring-like manner, constituting a first equivalent inductance.

Further, at least one of a first inductor and a second inductor may be provided at the same time as at least one of the first equivalent inductor and the second equivalent inductor is provided, wherein the first inductor is connected between the first connection region and the first connection point; a second inductance is connected between the second connection region and the second connection point.

Referring to fig. 13, fig. 13 is a schematic deployment diagram of an antenna assembly 100 according to a second embodiment of the present application. The first radiator 11 and the second radiator 21 are both located on the same surface of the dielectric substrate 600, such as the first surface 61 or the second surface 62;

referring to fig. 14, fig. 14 is a schematic diagram of a band-stop filter circuit 30 according to a second embodiment of the present application. The band-stop filter circuit 30 comprises one or more first radiation extension units 34 connected with the first radiation end 112, one or more second radiation extension units 35 connected with the second radiation end 212, wherein the second radiation extension units 35 are arranged between at least two first radiation extension units 34; and/or at least two second radiation extension elements 35 are provided with said first radiation extension element 34.

Because the first radiator 11 and the second radiator 21 are located on the same layer of the dielectric substrate 600, the first radiation extension unit 33 and the second radiation extension unit 34 are arranged in a crossed manner, so that the relative areas of the first radiator 11 and the second radiator 21 can be formed, an equivalent capacitor is formed, and the first chinese branch 30A is constructed.

Referring to fig. 15, fig. 15 is another schematic diagram of the band-stop filter circuit 30 shown in fig. 14. The band-reject filter circuit 30 further comprises a third inductor L3 connected to the adjacent first and second

radiation extension elements

33, 34.

The second branch 30B of the band-stop filter circuit is constructed by disposing an inductance device with a gap between the adjacent first radiation extension unit 33 and the second radiation extension unit 34

Optionally, a third equivalent inductor formed by etching the coils on the first or second surfaces.

The structure of the third equivalent inductor can be seen in the structure shown in fig. 11.

In summary, the first antenna 10 and the second antenna 20 are decoupled by the band-stop filter circuit, so that the isolation and the antenna radiation efficiency are improved.

An embodiment of the application provides an electronic device 1000 provided with the antenna assembly 100 of any one of the above.

The first antenna 10 and the second antenna 20 are disposed on the same side of the electronic device 1000, wherein the first antenna 10 and the second antenna 20 are the same-frequency antennas.

According to the arrangement in the related art, the radiators are arranged approximately in mirror symmetry, and the radiators are parallel to each other and the ends of the radiating arms are closer, so that the coupling degree between the first antenna 10 and the second antenna 20 is higher, wherein the S-parameter curve of the first antenna 10 is not decoupled as shown in the curve S1,1 shown in fig. 16, and the S-parameter curve of the first antenna 20 is not decoupled as shown in the curve S2,1 shown in fig. 16.

After the band-stop filter circuit is arranged, the coupling degree between the first antenna 10 and the second antenna 20 is reduced, wherein after the S-parameter curve of the first antenna 10 is decoupled as shown in a curve S1 shown in fig. 15, 1, the S-parameter curve of the first antenna 20 is decoupled as shown in a curve S2 shown in fig. 16, 1.

Referring to fig. 16, fig. 16 is a graph comparing the S-parameters of the first antenna 10 and the second antenna 20 after being decoupled and not decoupled. Without the BSF decoupling structure, the coupling between the first antenna 10 and the second antenna 20 is very strong and the isolation is poor. After the decoupling structure is added, a notch appears at the original peak of the transmission coefficient, which is the resonance point of the band-stop filter.

Taking the working frequencies of the first antenna 10 and the second antenna 20 as an example, when the first antenna 10 is excited, the first antenna 10 and the second antenna 20 have close ends, the polarizations are parallel, and the working frequencies are the same, so that the coupling is very strong, and the current intensities on the two antennas are almost equivalent. The current coupled to the second antenna 20 is significantly reduced after the addition of the band-stop filter circuit.

Referring to fig. 17, fig. 17 is a graph comparing the radiation efficiency of the first antenna 10 after decoupling and decoupling. When the first antenna 10 is excited, since the power coupled to the second antenna 20 is reduced, energy is radiated to a free space, and the radiation efficiency is remarkably improved.

It will be understood by those of ordinary skill in the art that all or some of the steps of the methods, systems, functional modules/units in the devices disclosed above may be implemented as software, firmware, hardware, and suitable combinations thereof. In a hardware implementation, the division between functional modules/units mentioned in the above description does not necessarily correspond to the division of physical components; for example, one physical component may have multiple functions, or one function or step may be performed by several physical components in cooperation. Some or all of the components may be implemented as software executed by a processor, such as a digital signal processor or microprocessor, or as hardware, or as an integrated circuit, such as an application specific integrated circuit. Such software may be distributed on computer readable media, which may include computer storage media (or non-transitory media) and communication media (or transitory media). The term computer storage media includes volatile and nonvolatile, removable and non-removable media implemented in any method or technology for storage of information such as computer readable instructions, data structures, program modules or other data, as is well known to those of ordinary skill in the art. Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, Digital Versatile Disks (DVD) or other optical disk storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other medium which can be used to store the desired information and which can accessed by a computer. In addition, communication media typically embodies computer readable instructions, data structures, program modules or other data in a modulated data signal such as a carrier wave or other transport mechanism and includes any information delivery media as known to those skilled in the art.

Claims

1. An antenna assembly, comprising:

the second antenna comprises a second radiator, a second matching module and a second feed module; the second radiator is provided with a second radiation tail end and a second grounding end, and a second feeding point is positioned between the second radiation tail end and the second grounding end, the second matching module is electrically connected between the second feeding point and the second feeding module, and the second grounding end is electrically connected to a second reference ground; a radiator gap is formed between the second radiation end and the first radiation end; wherein a second connection point is arranged between the second feeding point and the second radiating end;

2. The antenna assembly of claim 1, wherein the band-reject filter circuit comprises a first branch and a second branch connected in parallel; wherein the first branch comprises a capacitive device and the second branch comprises an inductance.

3. The antenna assembly of claim 2, wherein:

the first radiator and the second radiator are isolated by a dielectric substrate, wherein the dielectric substrate is provided with a first surface and a second surface which are mutually deviated, the first radiator is arranged on the first surface, the second radiator is arranged on the second surface, and the parallel projection of one radiation tail end of the first radiator and the second radiator is positioned on the other radiator of the first radiator and the second radiator;

the band-stop filter circuit includes:

a first connection region on the first radiator, the first connection region disposed between the first connection point and the first radiating end;

a second connection region on the second radiator, the second connection region disposed between the second connection point and the second radiation end;

and one end of the conductive device is connected with the first connecting area, and the other end of the conductive device is connected with the second connecting area.

4. The antenna assembly of claim 3, wherein:

the medium substrate is provided with through holes corresponding to the first connection area and the second connection area;

5. The antenna assembly of claim 3, wherein the band-reject filter circuit further comprises:

a first inductor connected between the first connection region and the first connection point; and/or the presence of a gas in the atmosphere,

a second inductor connected between the second connection region and the second connection point.

6. The antenna assembly of claim 5, wherein:

a first slot surrounding the first connection region is arranged on the first radiator, wherein the first inductor is arranged in the first slot; and/or the presence of a gas in the gas,

a second slot surrounding the second connection area is arranged on the second radiator, wherein the second inductor is arranged in the second slot.

7. The antenna assembly of claim 3, wherein the inductive device comprises:

a first equivalent inductor formed by etching a first coil on the first surface; and/or the presence of a gas in the gas,

and a second equivalent inductor formed by etching the second coil on the second surface.

8. The antenna assembly according to claim 3, characterized in that the projection of the first radiating end on the second surface is located in a region of the second radiator corresponding to the second surface; the projection of the second radiation tail end on the first surface is positioned in a region of the first radiator corresponding to the first surface;

the opposite regions of the first radiator and the second radiator form equivalent capacitance.

9. The antenna assembly of claim 2, wherein:

the first radiator and the second radiator are both positioned on the first surface or the second surface of the dielectric substrate;

the band-stop filter circuit comprises one or more first radiation extension units connected with the first radiation tail end and one or more second radiation extension units connected with the second radiation tail end, wherein a second radiation extension unit is arranged between at least two first radiation extension units, and/or at least two second radiation extension units are provided with the first radiation extension units.

10. The antenna assembly of claim 9, wherein:

the band-stop filter circuit also comprises a third inductor connected with the adjacent first radiation extension unit and the second radiation extension unit; or a third equivalent inductor formed by etching a coil on the first or second surface.

11. An electronic device, characterized in that an antenna assembly according to any of claims 1 to 10 is provided.