CN114885567A - Container type computing device with liquid cooling system - Google Patents

Container type computing device with liquid cooling system Download PDF

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Publication number
CN114885567A
CN114885567A CN202210671283.7A CN202210671283A CN114885567A CN 114885567 A CN114885567 A CN 114885567A CN 202210671283 A CN202210671283 A CN 202210671283A CN 114885567 A CN114885567 A CN 114885567A
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CN
China
Prior art keywords
cooling
computing device
liquid
outlet
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202210671283.7A
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Chinese (zh)
Inventor
龙正祥
林明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Strait Deer Co ltd
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Xidong Technology Co ltd
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Publication date
Application filed by Xidong Technology Co ltd filed Critical Xidong Technology Co ltd
Priority to CN202210671283.7A priority Critical patent/CN114885567A/en
Publication of CN114885567A publication Critical patent/CN114885567A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763Liquid cooling without phase change
    • H05K7/20781Liquid cooling without phase change within cabinets for removing heat from server blades
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • H05K7/1485Servers; Data center rooms, e.g. 19-inch computer racks
    • H05K7/1488Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • H05K7/1485Servers; Data center rooms, e.g. 19-inch computer racks
    • H05K7/1488Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures
    • H05K7/1489Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures characterized by the mounting of blades therein, e.g. brackets, rails, trays
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • H05K7/1485Servers; Data center rooms, e.g. 19-inch computer racks
    • H05K7/1488Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures
    • H05K7/1492Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures having electrical distribution arrangements, e.g. power supply or data communications
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718Forced ventilation of a gaseous coolant
    • H05K7/20736Forced ventilation of a gaseous coolant within cabinets for removing heat from server blades
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20836Thermal management, e.g. server temperature control
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02DCLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00Energy efficient computing, e.g. low power processors, power management or thermal management

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention relates to a container type computing device with a liquid cooling system. A containerized computing device may include a box portion and an open space portion disposed on a support floor with a cooling tower disposed in the open space portion on the support floor, with: a support providing single or multiple layers of support sites; and the cooling grooves are arranged on the supporting positions of the bracket, each cooling groove contains cooling liquid and a plurality of computing devices immersed in the cooling liquid, the cooling liquid inlets of the cooling grooves are connected to the cooling liquid outlets of the cooling tower through liquid inlet pipes, and the cooling liquid outlets of the cooling grooves are connected to the cooling liquid inlets of the cooling tower through liquid outlet pipes.

Description

Container type computing device with liquid cooling system
Technical Field
The invention relates to a container type computing device with a liquid cooling system.
Background
With the development of computer networks and communication technologies, various applications have increased explosively, and thus the demand for computing power (abbreviated as "computing power") has also increased dramatically. A containerized computing center has been proposed in which multiple computing devices (i.e., "computers") are integrated into a container, thereby providing high density, powerful computing power. Containerized computing devices have the advantages of high integration, ease of flexible and rapid deployment, and the like, and are therefore popular with many users.
Since a large number of computing devices are located in the container compartment and may be over-utilized for increased computing power, heat dissipation from the computing devices is a technical problem to be solved. The general solution is to install a large fan or high performance heat sink, such as heat pipes or water cooled heat sinks, per computing device, but these solutions have their own drawbacks. For example, because the placement density of the computing devices is large, the air circulation is affected, and the specific heat of the air is small, the quantity of heat taken away is small, and therefore the heat dissipation effect of the fan is not significant. The heat pipe or water-cooled heat sink plate is costly, equipping each computing device with a heat pipe or water-cooled heat sink plate can greatly increase the cost of the whole container-type computing device, and when used in a relatively closed container cabin for a long time, the heat dissipation effect can be affected by the ambient temperature. One solution is to install an air conditioner for the container, and reduce the temperature in the container cabin through air conditioning refrigeration, but the compressor of the air conditioner will result in a larger power consumption, which is not favorable for the energy economy when in long-term use.
Disclosure of Invention
The present invention has been made in view of the above problems. The invention provides a container type computing device integrated with a liquid cooling system, which can be simply and conveniently and rapidly deployed, can provide excellent heat dissipation effect and has low cost and energy economy.
According to an exemplary embodiment, there is provided a containerized computing device including a box portion and an open space portion disposed on a support floor, a cooling tower disposed in the open space portion on the support floor, a cabinet disposed in the support floor surrounded by the box portion, a cabinet disposed in the cabinet, and a controller disposed in the cabinet, the controller comprising: a support providing single or multiple layers of support sites; and the cooling grooves are arranged on the supporting positions of the bracket, each cooling groove contains cooling liquid and a plurality of computing devices immersed in the cooling liquid, the cooling liquid inlets of the cooling grooves are connected to the cooling liquid outlets of the cooling tower through liquid inlet pipes, and the cooling liquid outlets of the cooling grooves are connected to the cooling liquid inlets of the cooling tower through liquid outlet pipes.
In some embodiments, the tank section comprises a first tank section and a second tank section, each surrounding a separate compartment, the open space section being located between the first tank section and the second tank section, the open space section having one or more cooling towers disposed therein to provide refrigeration to the first tank section and the second tank section.
In some embodiments, the cooling liquid inlet and the cooling liquid outlet of the cooling tank are provided at the same end or opposite ends of the cooling tank, and the cooling liquid outlet is provided at a higher position than the cooling liquid inlet. The cooling liquid inlet of the cooling tower is disposed at a higher position than the cooling liquid outlet.
In some embodiments, the liquid inlet pipe and the liquid outlet pipe extend into the cooling tank and extend along the length direction of the cooling tank, the portions of the liquid inlet pipe and the liquid outlet pipe extending into the cooling tank are provided with closed ports and are provided with a plurality of holes, and the holes on the liquid outlet pipe are formed in pipe wall portions in the range of 0-45 degrees and 135-360 degrees of the cross section of the liquid outlet pipe.
In some embodiments, the liquid inlet pipe and the liquid outlet pipe extend into the cooling tank and extend along the length direction of the cooling tank, the portions of the liquid inlet pipe and the liquid outlet pipe extending into the cooling tank are provided with closed ports and are provided with a plurality of holes, the holes on the liquid outlet pipe are long-strip-shaped holes which are formed in the lower pipe wall of the cross section of the liquid outlet pipe and are arranged downwards, and a flow guide plate which is parallel to the liquid outlet pipe is further arranged below the liquid outlet pipe.
In some embodiments, the racks are disposed on opposite sides of the cabin, one or more cooling slots are supported on each rack, and a service aisle is located between the racks on the opposite sides. The containerized computing device further comprising: a switch disposed in a support location of the rack for providing network connectivity for the computing device; a control cabinet disposed in the support location of the rack for controlling operation of the container-based computing device; a power distribution box disposed in a support location of the rack for supplying power to at least the computing device, the cooling tower, the control cabinet, and the switch; and a Power Distribution Unit (PDU) connected to the switchbox by a cable, including a plurality of power outlets to distribute power to devices powered by the switchbox.
In some embodiments, the liquid inlet pipe comprises a liquid inlet branch provided for each layer of cooling tank, each liquid inlet branch is connected to a plurality of cooling tanks in the same layer through a manifold, the liquid outlet pipe comprises a liquid outlet branch provided for each layer of cooling tank, at least one oil pump is connected to each liquid outlet branch, the oil pumps are provided with check valves connected in series, and each liquid outlet branch is connected to a plurality of cooling tanks in the same layer through a manifold.
In some embodiments, a main oil pump and a backup oil pump are connected in parallel to each liquid outlet branch, and each of the main oil pump and the backup oil pump has a check valve connected in series.
In some embodiments, the feed liquor pipe includes the solitary feed liquor branch road that sets up for every cooling bath, and every feed liquor branch road is connected between the coolant outlet of cooling tower and the coolant inlet of cooling bath, the drain pipe includes the solitary liquid branch road that sets up for every cooling bath, and every liquid branch road is connected between the coolant inlet of cooling tower and the coolant outlet of cooling bath, is connected with an oil pump on every liquid branch road at least, the oil pump has series connection's check valve.
In some embodiments, the oil pump is disposed in the open space portion.
In some embodiments, the cold tower comprises: a coolant loop comprising a finned tube portion and a coil portion connected in series, the finned tube portion being located above the coil portion; the spray pipe is positioned between the finned pipe part and the coil pipe part and is used for spraying cooling water to the coil pipe part; a water tank located below the coil part for accommodating cooling water; the water pump is used for pumping the cooling water in the water tank into the spraying pipe; and an exhaust fan located above the finned tube portion.
In some embodiments, the cooling tower further comprises a housing, and the lower portion of the housing is provided with an air inlet, so that the air extractor flows air through the cooling liquid loop from bottom to top.
In some embodiments, a cabin door is arranged at one end of each box body part opposite to the cooling tower, a ventilation window is arranged at the lower part of the cabin door, and an exhaust window and an exhaust fan are arranged above the box body side wall of the box body part adjacent to the cooling tower.
In some embodiments, the containerized computing device further comprises one or more of the following sensors: an in-tank air temperature sensor for monitoring an air temperature within the tank portion, an out-tank air temperature sensor for monitoring an ambient temperature outside the tank portion, a cooling tower inlet temperature sensor for monitoring a cooling liquid temperature at a cooling liquid inlet of the cooling tower, a cooling tower outlet temperature sensor for monitoring a cooling liquid temperature at a cooling liquid outlet of the cooling tower, a cooling tower sink temperature sensor for monitoring a cooling water temperature in a sink of the cooling tower, a cooling sink temperature sensor for monitoring a cooling liquid temperature in the cooling sink, a computer temperature sensor for monitoring a temperature of the computing device,
an in-tank humidity sensor for monitoring the humidity in the tank portion, an out-tank humidity sensor for monitoring the ambient humidity outside the tank portion, a coolant flow sensor for monitoring the coolant flow, a coolant flow sensor for monitoring the sprayed coolant flow, a coolant pressure sensor for monitoring the coolant pressure, a main oil pump rotational speed sensor for monitoring the rotational speed of the main oil pump, a backup oil pump rotational speed sensor for monitoring the rotational speed of the backup oil pump, a water pump rotational speed sensor for monitoring the rotational speed of the water pump, an exhaust fan rotational speed sensor for monitoring the rotational speed of the exhaust fan mounted on the tank portion, an exhaust fan rotational speed sensor for monitoring the rotational speed of the exhaust fan mounted on the cooling tower, a cooling tank liquid level sensor for monitoring the liquid level of the coolant in the cooling tank, and a sump level sensor for monitoring a level of cooling water in the sump.
In some embodiments, the containerized computing device further comprises a control device comprising: a setup module comprising one or more of the following setup units: a temperature setting unit for setting one or more of a temperature range of air inside the box portion, a temperature range of the cooling liquid at a cooling liquid inlet and outlet of the cooling tower, a temperature range of the cooling liquid at a cooling liquid outlet and outlet of the cooling tower, a temperature range of the cooling liquid in the cooling tank, a temperature range of the cooling water in the water tank, and a temperature range of the computing device; a humidity setting unit for setting a humidity range within the tank part; a flow rate setting unit for setting one or more of a flow rate range of the cooling liquid and a flow rate range of the cooling water; a pressure setting unit for setting one or more of a pressure range of the cooling liquid and a pressure range of the cooling water; the rotating speed setting unit is used for setting one or more of a rotating speed range of the main oil pump, a rotating speed range of the standby oil pump, a rotating speed range of the water pump, a rotating speed range of the exhaust fan and a rotating speed range of the exhaust fan; and a liquid level setting unit for setting one or more of a liquid level range of the cooling liquid in the cooling tank and a liquid level range of the cooling water in the water tank; a control module comprising one or more of the following controllers implemented as a manual controller or a programmable logic controller: a main oil pump rotation speed controller for adjusting a rotation speed of the main oil pump to control a circulation speed of the coolant; a backup oil pump rotational speed controller for adjusting a rotational speed of the backup oil pump to control a circulation speed of the coolant; the water pump rotating speed controller is used for adjusting the rotating speed of the water pump so as to control the circulating speed of the cooling water; the exhaust fan rotating speed controller is used for adjusting the rotating speed of an exhaust fan arranged on the box body part so as to control the air flowing speed in the box body part; the exhaust fan rotating speed controller is used for adjusting the rotating speed of an exhaust fan arranged on the cooling tower so as to control the air flowing speed in the cooling tower; and one or more alarm devices for sending out alarm signals when the detection values of the one or more sensors exceed the corresponding parameter ranges set by the setting module.
In some embodiments, the containerized computing device further comprises: a control panel mounted on the cabinet portion, the control panel comprising: the touch screen display panel is used for setting the operation parameters of the container type computing device and displaying the operation state of the container type computing device; a plurality of indicator lamps or buzzers serving as the alarm device; and a plurality of switching elements for controlling the power supply of the main oil pump, the backup oil pump, the water pump, the exhaust fan installed on the box body part and the exhaust fan of the cooling tower.
In some embodiments, the box section and the open space section on the support floor have an integral rectangular frame that determines the spatial dimensions of the containerized computing device, and the containerized computing device further includes a protective frame disposed about the cooling tower and connected to the rectangular frame.
In some embodiments, a predetermined number of computing devices are disposed in the plurality of cooling slots in each case portion such that the total power of the computing devices disposed in each case portion is in the range of 400 to 800 kW.
The above and other features and advantages of the present invention will become apparent from the following description of exemplary embodiments, which is to be read in connection with the accompanying drawings.
Drawings
Fig. 1 is an external view of a container-type computing device according to an embodiment of the invention.
FIG. 2A illustrates a schematic side cross-sectional view of a case portion of a containerized computing device in accordance with one embodiment of the present invention.
Fig. 2B illustrates a schematic top cross-sectional view of a case portion of a containerized computing device in accordance with an embodiment of the present invention.
Fig. 3A shows a schematic view of an inlet pipe portion and an outlet pipe portion extending into a cooling bath according to an embodiment of the invention.
Fig. 3B shows a schematic cross-sectional view of a liquid outlet pipe portion extending into a cooling bath according to another embodiment of the invention.
Fig. 4A illustrates a schematic diagram of liquid inlet and outlet pipes of a liquid cooling system of a container-based computing device, according to an embodiment of the invention.
Fig. 4B illustrates a schematic diagram of liquid inlet and outlet pipes of a liquid cooling system of a container-based computing device, according to another embodiment of the invention.
Fig. 4C illustrates a schematic diagram of liquid inlet and outlet pipes of a liquid cooling system of a container-based computing device, according to another embodiment of the invention.
FIG. 5 illustrates a schematic cross-sectional view of a cold tower of a container-based computing device, according to an embodiment of the present invention.
FIG. 6 illustrates a schematic block diagram of a control system for a containerized computing device in accordance with one embodiment of the present invention.
FIG. 7 illustrates a schematic view of a control panel of a containerized computing device in accordance with one embodiment of the present invention.
Fig. 8 illustrates an external view of a container-type computing device according to another embodiment of the invention.
Detailed Description
Exemplary embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood that the drawings are not necessarily drawn to scale.
Fig. 1 is an external view of a container-type computing device 100 according to an embodiment of the invention. As shown in FIG. 1, the containerized computing device 100 includes a case portion 110 and an open space portion 120 disposed on a support floor 101. The box portion 110 surrounds a container compartment in which the computing device may be disposed. The open space portion 120 is located at one end of the case portion 110, and the cooling tower 300 may be disposed in the open space portion 120.
The body portion 110 may comprise a conventional container body, such as an iron or steel body, which provides sufficient support to facilitate stacking and shipping of the containers. The box portion 110 may be rectangular in shape and the overall dimensions of the open space portion 120 may be conventional container dimensions, such as 20-foot standard or tall boxes, 40-foot standard or tall boxes, or any other dimensions that may be determined according to the actual needs.
An end of the box part 110 opposite to the open space part 120 may be provided with a hatch door 111. Although not shown, the lower portion of the hatch door 111 may be provided with a louver, such as a louver. Alternatively or additionally, ventilation windows may also be provided in other parts of the box portion 110, for example in the side walls near the hatch 111. On the side wall of the case opposite to the hatch 111, a ventilation window 112 may be provided. Although fig. 1 shows only one louver 112, louvers may be symmetrically provided on opposite sidewalls not shown. A discharge fan may be provided inside the discharge window 112. The ventilation windows and the exhaust windows are arranged at the two ends of the box body part 110 in the length direction, so that air can flow in the whole cabin conveniently; and discharge of the hot air to the outside of the container compartment is facilitated by providing the air discharge window 112 at the upper side of the container body.
The cooling tower 300 is disposed in the open space 120 outside the box portion 110, which will be described in detail below.
As shown in fig. 1, both the box portion 110 and the open space portion 120 are disposed on the support floor 101 of the container, and an integral rectangular frame 102 may be disposed about the perimeter of the box portion 110 and the open space portion 120, the rectangular frame 102 defining the shape outline (i.e., container shape) and dimensions (e.g., common container dimensions, as well as other dimensions) of the containerized computing device 100. By providing the integrated frame 102, the box portion 110 and the open space portion 120 form an integral structure, and also facilitate transportation of the entire structure. For example, the entire computing device 100 may be handled, stacked, and transported like a common shipping container. In order to protect the cooling tower 300 disposed in the open space portion 120 from accidental damage, a protection frame 121 may be further disposed around the cooling tower 300, and as shown in fig. 1, the protection frame 121 may be connected to the rectangular frame 102 of the container. It is understood that the protective frame 121 is not limited to the shape shown in fig. 1, but may have any other shape.
Fig. 2A shows a schematic side cross-sectional view of the case portion 110 of the containerized computing device 100, and fig. 2B shows a schematic top cross-sectional view of the case portion 110 of the containerized computing device 100. The structural arrangement of the inside of the case portion 110 will be described below with reference to fig. 2A and 2B.
Referring to fig. 2A and 2B, the box portion 110 surrounds an inner cabin space, and a bracket 201 may be provided in the container cabin. The stent 201 may be a single-layered or multi-layered stent providing single-layered or three-dimensional multi-layered support sites to fully utilize the three-dimensional cabin space. Fig. 2A shows a rack 201 having three layers of support sites, but the rack 201 may provide a greater or lesser number of layers of support sites depending on the size of the device supported thereon. The racks 201 may be disposed on opposite sides of the cabin, for example, fig. 2B shows racks 201a and 201B, and the space between them may be used as a service aisle 250 to facilitate equipment installation and maintenance by a user.
Each rack 201 may support a plurality of cooling channels 210, for example, cooling channels 210a and 210b may be supported on rack 201a, and cooling channels 210c and 210d may be supported on rack 201b, wherein cooling channels 210a and 210c are located on the same level of support, and cooling channels 210b and 210d are located on the same level of support. Although fig. 2A shows two layers of cooling channels, the rack 201 may be designed to support fewer layers, such as one or more layers, such as three or four layers of cooling channels. Each cooling channel 210 may be welded to the bracket 201 or may be detachably fixed to the bracket 201. The cooling slot 210 may have an elongated shape extending along the rack 201, have side walls and a bottom wall, and the upper surface may be open, or may include a lid structure that can be opened and closed to facilitate placement of the computing device 202 into the cooling slot 210. Each cooling tank 210 may house a plurality of computing devices 202 that are submerged in a cooling fluid 203, the cooling fluid 203 being an insulating, thermally conductive liquid, such as vegetable oil, mineral oil, organic liquid material, and the like, that preferably has a low viscosity, a low volatility, and a high specific heat capacity to facilitate the flow and removal of heat generated by the computing devices 202. The low volatility ensures that the loss of cooling fluid 203 is small, thereby eliminating the need to constantly replenish cooling fluid 203.
The cooling bath 210 may have an elongated shape, and the cooling fluid inlet and outlet may be provided at one end of the cooling bath 210 near the cooling tower 300, or in another embodiment, the cooling fluid inlet and outlet may be provided at opposite ends of the cooling bath 210, respectively, so as to promote the flow of the cooling fluid to remove heat, and prevent the cooling fluid from standing still or swirling in a local area. As shown in fig. 2A and 2B, the cooling liquid inlet of the cooling tank 210 is connected to the cooling liquid outlet of the cooling tower 300 through a liquid inlet pipe 230, and the cooling liquid outlet of the cooling tank 210 is connected to the cooling liquid inlet of the cooling tower 300 through a liquid outlet pipe 240 (alternatively referred to as a liquid return pipe). The structure of inlet pipe 230 and outlet pipe 240 will be described in further detail below.
The rack 201 may also be provided with a distribution box 220, a switch 222, a control cabinet 224 and other necessary equipment. The power box 220 may provide power to the computing device 202, the switch 222, the control cabinet 224, the cold tower 300, and other devices such as oil pumps, water pumps, control panels, and lighting described below. The switchbox 220 may include a plurality of switches, such as a main switch connected to an external power source and a plurality of branch switches (not shown) connected between the main switch and the computing devices 202, each of which may be connected via a cable to a power distribution unit (PDU, also referred to as a patch panel) having a plurality of voltage jacks thereon for supplying power to a plurality of computing devices 202 and other devices, such as cable plugs of powered devices that may be plugged into the jacks on the power distribution unit. Moreover, the power distribution unit generally has an elongated shape, and may extend in the direction of the cooling bath 210, thereby conveniently supplying power to the plurality of computing devices 202 disposed in the cooling bath 210. The power distribution box 220 may be disposed in a support location above the cooling trough 210 with one end of the cable connected to the power distribution unit and the other end hanging down into the cooling trough 210, connected to the computing equipment 202 in the cooling trough 210 to provide power. The switch 222 may be connected to a network port of the computing device 202 by twisted pair or optical fiber to provide a network connection for the computing device 202. Depending on the number of computing devices 202 and the number of network ports on each switch 222, the number of switches 222 required may be determined.
One or more Programmable Logic Controllers (PLCs) may be included in the control cabinet 224 and may be used to automatically implement various control functions, described in detail below, in accordance with a predetermined program to control the operation of the containerized computing device 100.
The switchgears 220, the switches 222 and the control cabinets 224 may be disposed in a support position of the racks 201a and 201b, for example, in a support position above the cooling bath 210. In one embodiment, the switchgears 220 may be disposed in the uppermost supporting position of the rack 201a, the control cabinets 224 may be disposed in the uppermost supporting position of the rack 201b, and the plurality of switches 222 may be disposed in the uppermost supporting position of either or both of the racks 201a and 201 b. Of course, in other embodiments, the power distribution box 220, the switch 222, and the control cabinet 224 may be disposed in the middle or lower support positions of the racks 201a and 201b, and the present invention is not limited in any way. To illustrate the lower cooling tank 210, the switchbox 220, switch 222, and control cabinet 224 are not shown in fig. 2B.
In order to achieve continuous and stable operation of the computing device 202, it is important to ensure reliable and effective heat dissipation capability, and therefore, to ensure that the cooling fluid 203 can continuously and sufficiently flow in the cooling tank 210. If the cooling fluid 203 is not flowing, the computing device 202 may malfunction due to overheating, and even cause irreparable hardware damage. To ensure that cooling fluid 203 is able to flow sufficiently in cooling bath 210, in one embodiment of the present invention, inlet pipe 230 and outlet pipe 240 may extend into cooling bath 210, as shown in FIG. 3A.
Fig. 3A shows a side view schematic of cooling bath 210. Referring to fig. 3A, the cooling bath 210 has an elongated shape, and the liquid inlet pipe 230 and the liquid outlet pipe 240 may extend into the cooling bath 210 and along the length of the cooling bath 210, with the liquid outlet pipe 240 being positioned above the liquid inlet pipe 230. In some embodiments, inlet tube 230 and outlet tube 240 may extend at least 60% or more, preferably 80% or more, of the length of cooling bath 210. The ends of inlet pipe 230 and outlet pipe 240 are closed and the portions of inlet pipe 230 and outlet pipe 240 that extend into cooling bath 210 have a plurality of small holes for the flow of cooling fluid 203. These apertures also act as a screen, for example, to prevent parts in cooling bath 210 from accidentally entering drain pipe 240.
As shown in fig. 3A, the liquid inlet of the cooling tank 210 is disposed below the liquid outlet, and the low-temperature cooling liquid from the cooling tower 300 can uniformly enter the cooling tank 210 along the porous pipe portion of the liquid inlet pipe 230 (or along the length direction of the cooling tank 210) by using the porous pipe design shown in fig. 3A. The low-temperature coolant absorbs heat from the computing equipment 202 and increases in temperature, thereby flowing upward in the cooling bath 210. The upper exit pipe 240 may draw the heat absorbed coolant to the coolant inlet of the cooling tower 300. Also, with the perforated tube design, the exit tubes 240 may draw the cooling fluid evenly along the length of the cooling slot 210, thereby achieving a sufficient flow of the cooling fluid 203 in the cooling slot 210.
It should be noted that, as shown in fig. 3A, the liquid inlet pipe 230 located below may be immersed in the cooling liquid, and thus holes may be formed on the entire pipe wall (within 360 degrees of the cross section of the pipe wall) of the liquid inlet pipe 230. The drain pipe 240 located above may be located near the liquid surface of the cooling liquid, and in order to prevent the intake of air or foreign substances or impurities floating on the liquid surface, holes may be formed in pipe wall portions in the range of 0 to 45 degrees and 135 to 360 degrees (which can be understood with reference to the pipe cross-sectional coordinate system described in the drawing) of the cross-section of the drain pipe 240, that is, no holes may be formed in the top pipe wall portion in the range of 45 to 135 degrees. Or more preferably, holes may be formed in the walls of the lower half (180 degrees to 360 degrees) of outlet 240 without forming holes in the walls of the upper half (0 degrees to 180 degrees).
Figure 3B shows a schematic cross-sectional view of an effluent pipe 240 according to another embodiment of the invention. Unlike the embodiment shown in fig. 3A, in the embodiment shown in fig. 3B, the effluent pipe 240 has a downwardly (e.g., directly below) disposed hole formed in the lower pipe wall of its cross-sectional shape, and the hole may be elongated, also referred to as a slit, extending along the length of the effluent pipe 240. A guide plate 249 may be further disposed below the outlet pipe 240, and the guide plate 249 may have a flat plate shape or a groove shape and be disposed parallel to the outlet pipe 240. The guide plate 249 can guide the cooling liquid near the liquid level to be sucked into the liquid outlet pipe 240, and prevent the liquid outlet pipe 240 from only sucking the cooling liquid right below the liquid outlet pipe so that the cooling liquid on two sides of the liquid outlet pipe does not sufficiently participate in circulation. In addition, the guide plate 249 can also prevent bubbles or vortexes from occurring when the liquid outlet pipe 240 sucks the cooling liquid, and damage to the oil pump is avoided.
It should be understood that in the structure shown in fig. 3A and 3B, in order that the cooling liquid may uniformly participate in circulation in the direction along the cooling bath 210, the holes formed on the liquid inlet pipe 230 and the liquid outlet pipe 240 may not be uniform. For example, the size of the holes may be smaller, the number may be smaller, and/or the spacing may be larger at the end closer to the inlet/outlet; at the end remote from the inlet/outlet, the holes may be larger in size, larger in number, and smaller in spacing. Also, the size, number and spacing of the holes may be varied uniformly along the length of the inlet and outlet pipes 230 and 240.
Fig. 4A shows a circuit design of inlet pipe 230 and outlet pipe 240, wherein two layers of cooling channels are illustrated, but it is understood that the circuit design can also be applied to cooling channels of fewer or more layers. Referring to fig. 4A, the liquid inlet pipe 230 is connected between the cooling liquid outlet of the cooling tower 300 and the liquid inlet of each cooling tank 210, and has a first branch 231 for the first layer of cooling tanks (210a and 210c) and a second branch 235 for the second layer of cooling tanks (210b and 210 d). The first branch 231 may be connected to the liquid inlets of the cooling tanks 210a and 210c through a manifold, and flow rate adjustment valves 232a and 232c may be installed at the liquid inlets of the cooling tanks 210a and 210c, respectively. The second branch 235 may be connected to the liquid inlets of the cooling tanks 210b and 210d through a manifold, and flow rate adjustment valves 232b and 232d may be installed at the liquid inlets of the cooling tanks 210b and 210d, respectively.
The exit pipes 240 are connected between the cooling fluid outlets of the respective cooling channels 210 and the cooling fluid inlets of the cooling tower 300, and have first branches 241 for the first tier of cooling channels (210a and 210c) and second branches 245 for the second tier of cooling channels (210b and 210 d). A first oil pump 242a and a second oil pump 242c may be connected in parallel to the first branch 241, and the first oil pump 242a and the second oil pump 242c may each have check valves 243a and 243c connected in series. The first branch 241 may be connected to the outlet ports of the cooling tanks 210a and 210c through a manifold. A third oil pump 242b and a fourth oil pump 242d may be connected in parallel on the second branch 245, and the third oil pump 242b and the fourth oil pump 242d may each have check valves 243b and 243d connected in series. The second branch 245 may be connected to the outlet ports of the cooling tanks 210b and 210d through a manifold.
As shown in fig. 4A, any one of the two oil pumps connected in parallel on each branch may be used as a main oil pump, and the other may be used as a backup oil pump. For example, the first and third oil pumps 242a and 242b may be used as main oil pumps, and the second and fourth oil pumps 242c and 242d may be used as backup oil pumps. When the main oil pump is out of order and needs to be repaired or replaced, the backup oil pump may be operated to maintain the circulation of the coolant 203 while the main oil pump may be repaired or replaced. In this way, normal heat dissipation and operation of the computing device 202 may not be interrupted, improving the continuity of computing services. Also, by controlling the respective flow rate adjustment valves 232 and adjusting the rotation speed of the oil pump 242, the flow rate of the coolant in the respective cooling tanks 210 can be controlled.
In some embodiments, since the flow rate can be controlled by controlling the rotation speed of the oil pump, the flow regulating valves 232a, 232b, 232c, and 232d may be omitted. Further, although not shown in the drawings, butterfly valves may be installed at various positions on the pipes to control the flow or shut-off of the coolant. For example, butterfly valves may be installed on the piping near the coolant inlet and outlet of each cooling bath 210, and butterfly valves may also be installed on the piping upstream and downstream of each oil pump to facilitate, for example, removal and replacement of the oil pump.
Figure 4B shows a circuit design of inlet pipe 230 and outlet pipe 240 according to another embodiment. In the embodiment shown in FIG. 4B, a backup oil pump is eliminated, and only one oil pump is provided for each level of effluent pipe 240, which reduces cost and saves valuable in-cabin space occupied by oil pumps and piping, facilitating the design of larger sized (e.g., longer) cooling slots 210 to accommodate more computing devices 202. Other aspects of the embodiment shown in fig. 4B are the same as those in fig. 4A, and a repetitive description thereof will be omitted here.
Figure 4C shows a circuit design of inlet pipe 230 and outlet pipe 240 according to another embodiment. In the embodiment shown in fig. 4C, a separate inlet branch and outlet branch are provided for each cooling tank 210. Specifically, as shown in fig. 4C, the liquid inlet pipe 230 includes separate liquid inlet branches 231a, 231b, 231C and 231d provided for the cooling tanks 210a, 210b, 210C and 210d, respectively, and each of the liquid inlet branches 231a, 231b, 231C and 231d is connected between the cooling liquid outlet of the cooling tower 300 and the cooling liquid inlet of the corresponding cooling tank 210a, 210b, 210C and 210 d. The outlet pipe 240 includes separate outlet branches 241a, 241b, 241c and 241d for the cooling channels 210a, 210b, 210c and 210d, respectively, and each outlet branch 241a, 241b, 241c and 241d is connected between the cooling liquid inlet of the cooling tower 300 and the cooling liquid outlet of the corresponding cooling channel 210a, 210b, 210c and 210 d. At least one oil pump 242a, 242b, 242c and 242d and a check valve 243a, 243b, 243c and 243d connected in series with the oil pump are connected to each of the liquid outlet branches 241a, 241b, 241c and 241 d. In this way, each cooling channel 210 may be conveniently controlled individually, for example by controlling its coolant flow rate. Other aspects of the embodiment shown in fig. 4C are the same as those of the embodiment shown in fig. 4A or 4B, and a repetitive description thereof will be omitted here. It should be understood that in the embodiment shown in fig. 4A, 4B and 4C, each oil pump may be disposed in the compartment surrounded by the box portion 110, or may be disposed outside the box portion 110, i.e., in the open space 120, which helps to save space in the compartment and also helps to dissipate heat of the oil pump, thereby preventing the oil pump from generating heat during operation and increasing the temperature in the compartment.
FIG. 5 shows a schematic cross-sectional view of a cooling tower 300 according to an embodiment. The cooling tower 300 may employ both air cooling and liquid cooling to cool the cooling liquid 203. As shown in fig. 5, the cooling tower 300 may include a coolant circuit 310 disposed within the shell 301, the coolant circuit 310 may include a finned tube portion 312 and a coil portion 314 positioned between an inlet 311 and an outlet 319, connected in series with each other and the coil portion 314 may be positioned below the finned tube portion 312 and the outlet 319 is positioned below the inlet 311. The coolant loop 310 may be made of a thermally conductive metal, such as copper, to facilitate heat exchange. Both the finned tube section 312 and the coil section 314 include metal tubing that meanders back and forth to increase the heat dissipation area, wherein the finned tube section 312 further includes a plurality of metal fins welded to the metal tubing to further increase the heat dissipation area.
The cold tower 300 also includes a shower tube 320, which may be disposed above the coil portion 314, such as between the coil portion 314 and the finned tube portion 312. The spray pipe 320 may have a plurality of small holes or may be provided with spray heads to spray cooling water to the coil portion 314 for heat dissipation. The sprayed cooling water flows through the coil part 314 and is collected by the water tank 304 below the coil part 314, and the water pump 322 can pump the cooling water in the water tank 304 into the spray pipe 320, so that the cooling water can be recycled.
The top of the cold tower 300 may be equipped with an exhaust blower 330, and one or more exhaust blowers 330 may be installed depending on the footprint of the cold tower 300. Although fig. 5 shows two suction fans 330, for example, one suction fan 330 or four suction fans 330 may be installed. The lower portion of the housing 301 may be provided with one or more ventilation windows, such as ventilation windows 302 and 303. When suction fan 330 is operated, air is drawn into the interior of the tower from louvers 302 and 303, flows from the bottom up to cool the components inside the tower, and is then discharged from the top of the tower into the external environment.
The cooling tower 300 adopts a combination of liquid cooling and air cooling, so that the cooling liquid 203 from the cooling tank 210 can be effectively cooled, and the cooling tower 300 avoids using a compressor, so that the power consumption is reduced, and the operation cost of the whole system is reduced.
FIG. 6 illustrates a schematic block diagram of a control system of the containerized computing device 100 according to one embodiment. As shown in fig. 6, the control system of the containerized computing device 100 may include a temperature sensing system 410, a humidity sensing system 420, a flow sensing system 430, a pressure sensing system 440, a rotational speed sensing system 450, a liquid level sensing system 460, and a control device 500.
The temperature sensing system 410 may include one or more temperature sensors, examples of which are described below that may be used with the container-type computing device 100, but it should be understood that the container-type computing device 100 need not be equipped with all of these temperature sensors, and that the container-type computing device 100 may also be equipped with other temperature sensors, alternatively or additionally.
Referring to FIG. 6, the temperature sensing system 410 may include an in-box air temperature sensor 411 and an out-box air temperature sensor 412 for monitoring the air temperature inside and outside the cabinet portion 110, respectively. If the temperature in the cabinet is too high, the rotation speed of the exhaust fan 112 can be increased to increase the air flow speed; otherwise, the rotational speed of the exhaust fan 112 may be reduced in pursuit of low energy consumption, reducing operating costs. If the outside temperature is higher than the inside temperature, the exhaust fan 112 may be turned off to stop the circulation of the inside and outside air.
The temperature sensing system 410 may include a plurality of coolant temperature sensors, such as a cooling tower inlet temperature sensor 413 disposed at a coolant inlet of the cooling tower 300 and a cooling tower outlet temperature sensor 414 disposed at a coolant outlet of the cooling tower 300 for monitoring coolant temperatures at the coolant inlet and outlet of the cooling tower 300, respectively. If the temperature of the cooling liquid at the outlet is too high, it indicates that the cooling tower 300 does not have a good cooling effect, and at this time, the cooling capacity of the cooling tower 300 can be increased by increasing the rotation speed of the exhaust fan 330 or the spraying flow rate of the cooling water (i.e., increasing the rotation speed of the water pump 322). If the temperature of the cooling fluid at the inlet is too high, indicating that the cooling fluid 203 in the cooling tank 210 is not cooling the computing equipment 202 sufficiently, the circulation rate of the cooling fluid 203 may be increased (i.e., the rotational speed of the oil pump 242 may be increased), and the cooling capacity of the cooling tower 300 may also be increased to lower the temperature of the cooling fluid 203 provided at the cooling fluid outlet of the cooling tower 300.
In some embodiments, a temperature sensor 416 may also be provided in the cooling tank 210 to monitor the temperature of the cooling liquid in the cooling tank 210, and the computing equipment 202 may include a temperature sensor 417 for monitoring the temperature of its chip, and the cooling status of the computing equipment 202 may be determined directly from the temperatures indicated by the temperature sensors 416 and 417, thereby adjusting the cooling capacity of the cooling tower 300 and the circulation rate of the cooling liquid 203.
In some embodiments, a temperature sensor 415 may also be provided in the water tank 304 of the cooling tower 300 to monitor the temperature of the cooling water in the water tank 304. For example, when the temperature of the cooling water is too high, the rotation speed of the suction fan 330 may be increased to accelerate the air flow, or an alarm signal may be issued to remind the user to change the cooling water or to lower the temperature of the cooling water by other means such as adding ice cubes.
The humidity sensing system 420 may include a humidity sensor 421 disposed within the cabinet portion 110 and a humidity sensor 422 disposed outside the cabinet portion 110 to monitor the humidity inside and outside the cabinet, respectively. If the humidity inside the cabinet is high and the humidity outside the cabinet is low, the rotation speed of the exhaust fan 112 can be increased to promote air circulation; if the humidity inside and outside the cabinet is high, a dehumidifying device (not shown) may be activated to reduce the humidity inside the cabinet or an alarm signal may be issued to alert a user.
The flow sensing system 430 may include a coolant flow sensor 431 for monitoring coolant flow and a coolant flow sensor 432 for monitoring coolant flow of the spray. In some embodiments, the cooling fluid flow sensor 431 may be disposed at the inlet and/or outlet of each cooling tank 210, alternatively or additionally at the inlet or outlet of the cooling tower 300, and the cooling water flow sensor 432 may be disposed at the inlet of the shower pipe 320. The flow sensors 431 and 432 may monitor the circulation state of the cooling liquid and the cooling water, and may give an alarm signal to alert a user when an abnormality occurs.
Pressure sensing system 440 may include a cooling water pressure sensor 441 for monitoring the cooling water pressure and a cooling water pressure sensor 442 for monitoring the cooling water pressure. In some embodiments, the cooling water pressure sensor 441 may be disposed on the main line of the inlet pipe 230 or the outlet pipe 240, and the cooling water pressure sensor 442 may be disposed on the shower pipe 320. The pressure sensors 441 and 442 may monitor the pressure levels of the coolant and the cooling water, and may give an alarm signal to alert a user when an abnormality occurs.
The rotational speed sensing system 450 may include an oil pump rotational speed sensor 451 for monitoring the rotational speed of each oil pump 242, a water pump rotational speed sensor 452 for monitoring the rotational speed of the water pump 322, a fan rotational speed sensor 453 for monitoring the rotational speed of the fan 112, and a fan rotational speed sensor 454 for monitoring the rotational speed of the fan 330. The rotating speed values sensed by the sensors reflect the running state of the cooling system, and when any one rotating speed value is abnormal, an alarm signal can be sent out to remind a user. For example, when it is monitored that the main oil pump is not operating and causes the coolant temperature to rise, the backup oil pump may be automatically activated and an alarm may be issued to alert the user.
The level sensing system 460 may include a cooling tank level sensor 461 disposed in the cooling tank 210 for monitoring the level of the cooling liquid 203 and a tank level sensor 462 disposed in the tank 304 for monitoring the level of the cooling water. When either level is too low or too high, an alarm signal may be sent to alert the user to check the cooling fluid or cooling water. For example, when the cooling liquid or cooling water is insufficient or the pipeline is blocked, the user needs to check in time to remove the fault and ensure the normal operation of the cooling system.
The control device 500 may include a setup module 510, a control module 520, and an alarm module 530. The setting module 510 can be used to set a reference range of the sensing value of the sensor, i.e., a normal operation range of the relevant parameter. For example, the setting module 510 may include a temperature setting unit 511, a humidity setting unit 512, a flow setting unit 513, a pressure setting unit 514, a rotation speed setting unit 515, and a liquid level setting unit 516.
The temperature setting unit 511 may be used to set a reference range of the temperature detected by the temperature sensor, such as one or more of an air temperature range inside and outside the box portion 110, a coolant temperature range at a coolant inlet and outlet of the cooling tower 300, a coolant temperature range at a coolant outlet and outlet of the cooling tower 300, a coolant temperature range in the cooling tank 210, a cooling water temperature range in the water tank 304, and a temperature range of the computing equipment 202.
The humidity setting unit 512 may be used to set a reference range of humidity detected by the humidity sensor, such as a humidity range inside and outside the cabinet portion 110.
The flow rate setting unit 513 may be configured to set a reference range of the flow rate detected by the flow rate sensor, for example, to set one or more of a flow rate range of the cooling liquid and a flow rate range of the cooling water.
The pressure setting unit 514 may be used to set a reference range of the pressure detected by the pressure sensor described above, for example, to set one or more of a pressure range of the cooling liquid and a pressure range of the cooling water.
The rotational speed setting unit 515 may be used to set a reference range of the rotational speed detected by the above-described rotational speed sensor, for example, one or more of a rotational speed range of the main oil pumps 242a, 242b, a rotational speed range of the backup oil pumps 242c, 242d, a rotational speed range of the water pump 322, a rotational speed range of the exhaust fan 112, and a rotational speed range of the suction fan 330.
The liquid level setting unit 516 may be used to set a reference range of the liquid level detected by the above-described liquid level sensor, for example, to set one or more of a liquid level range of the cooling liquid in the cooling tank 210 and a liquid level range of the cooling water in the water tank 304.
The control module 520 may control the operational status of one or more components of the containerized computing device 100 based on the sensed values of the sensing systems 410-460 described above or based on a comparison between the sensed values and the set reference parameter ranges. For example, the control module 520 may include an oil pump rotational speed controller 521 for adjusting the rotational speed of the oil pump 242 to control the cooling liquid circulation rate, a water pump rotational speed controller 522 for adjusting the rotational speed of the water pump 322 to control the cooling water circulation rate, a discharge fan rotational speed controller 523 for adjusting the rotational speed of the discharge fan 112 to control the air flow rate within the box portion 110, and a discharge fan rotational speed controller 524 for adjusting the rotational speed of the discharge fan 330 of the cooling tower 300 to control the air flow rate in the cooling tower 300. The control module 520 may control the cooling capacity of the containerized computing device 100 by adjusting the operating conditions of these components to achieve a balance between cooling capacity and economy. For example, when the coolant temperature is within the normal temperature range, the respective components may be controlled to operate at a low speed, thereby saving power consumption.
It will be appreciated that the setup module 510 and the control module 520 described above may be implemented as Programmable Logic Controllers (PLCs), or that some of the controllers in the control module 520 may also be implemented as manual controllers. The PLC controller may be installed in the above-described control cabinet 224, which may automatically perform adjustment and control of relevant parameters based on a plurality of sensed data according to a preset program, thereby enabling rapid response to various parameter changes to perform adjustment and control and saving human resources. The manual controller may be, for example, a knob or other device requiring manual operation to perform control, which may be provided on a control panel described below.
The alarm means 530 may comprise, for example, one or more indicator lights or buzzers or the like, which are capable of emitting an alarm signal in the form of sound or light. For example, the alarm device 530 may send an alarm signal to remind the user when the detection value of one or more sensors is beyond the set corresponding reference range.
FIG. 7 illustrates a schematic diagram of a control panel 600 of the containerized computing device 100 according to one embodiment. A plurality of display and control components may be integrated on the control panel 600 to facilitate centralized control and management of the various components within the containerized computing device 100. In one embodiment, the control panel 600 may include a touch screen display panel 610 capable of displaying the current operating status of various components of the container-based computing device 100, such as temperature, humidity, flow, rotational speed, pressure, and level information detected by various sensors. The touch screen display panel 610 may also be used to perform input functions, such as for setting the reference parameter ranges discussed above.
The control panel 600 may also include a plurality of indicator lights or buzzers 620, which may be used as the alarm devices 530 described above to perform an alarm function.
The control panel 600 may further include a plurality of switch elements 630, such as a push button switch 630a, a rotary switch 630b, or a toggle switch (not shown), etc., which may be used to control the on and off states of, for example, the oil pump 242, the water pump 322, the exhaust fan 112, and the exhaust fan 330, or to further adjust the rotational speed thereof (e.g., adjust the rotational speed using the rotary switch 630 b). Optionally, the switching element 630 may also be used to control the opening and closing of the valves 233, 235, 237 and 239. For example, the valves 233, 235, 237 and 239 may be solenoid valves that are controlled to open and close by controlling power supplied thereto.
The control panel 600 may be mounted on, for example, a cabinet side wall of the cabinet portion 110, and a protective cover may be provided for the control panel 600 to prevent it from being touched by mistake or damaged by accident. A display panel 610, an indicator light or buzzer 620, a switching element 630, etc. on the control panel 600 may be connected to a programmable logic controller in the control cabinet 224 to perform the operations described above.
The general structure of the containerized computing device 100 provided by the present invention is described above. The inventors have discovered in their research and optimization that based on the typical container size, the power and heat dissipation capabilities of the container-based computing device 100 can be optimized for optimal results, i.e., energy economy and high input (power consumption) to output (power) ratio. For example, if the total power of the computing device 202 is too large and the cooling tower size is small, the heat dissipation capacity is insufficient and peak computing power of the computing device 202 cannot be exploited; if the cooling tower size is increased to provide better cooling, space is again taken up by the computing equipment 202, resulting in a reduction in overall power (i.e., computing power). Thus, the inventors have discovered through experimentation and computer simulations that a balance between total power and cooling capacity is well achieved and contributes to long term stable operation of the container computing device 100 for typical container sizes, where the total power of the computing equipment 202 is in the range of 400 to 1000 kilowatts, and more preferably in the range of 400 to 800 kilowatts. Accordingly, the predetermined number of computing devices 202 housed in the cooling slot 210 may be determined based on the total power of the computing devices 202.
In the embodiment described above, the containerized computing device 100 has a case portion 110 surrounding a compartment in which the cooling bath 210 and the computing equipment 202, etc. are disposed, and the open space portion 120 and the cooling tower 300 are disposed at one end of the case portion 110 in the length direction. The inventors have discovered that as the length of the containerized computing device 100 increases, so does the length of the box portion 110 and the cooling slots 210 therein, and that non-uniform cooling along the length of the cooling slots 210 may be more likely to occur, although larger cooling towers 300 may be provided to provide sufficient cooling capacity. For example, the cooling liquid at the end of the cooling tank 210 close to the cooling tower 300 is easy to circulate and is cooled, while the cooling liquid at the end of the cooling tank 210 far from the cooling tower 300 is not easy to circulate and is not easy to cool. For example, the configuration shown in fig. 1 may be used for a 20 foot container size, but when the container size is increased to 40 feet, uneven cooling in the cooling tank 210 may occur.
To address this issue, fig. 8 shows a schematic structural diagram of a container-type computing device 100 according to another embodiment of the invention. As shown in fig. 8, a first case portion 110A and a second case portion 110B are provided on the supporting base 101, each case portion 110A and 110B surrounds a separate compartment, and an open space portion 120 is provided between the first case portion 110A and the second case portion 110B. Thus, the structure in each of the case portions 110A and 110B may be the same as that described above with reference to fig. 1 to 7, and will not be repeated here. One larger cooling tower 300 may be provided in the open space portion 120 to provide refrigeration to the first and second tank portions 110A and 110B, or two cooling towers 300A and 300B may be provided to provide refrigeration to the first and second tank portions 110A and 110B, respectively, or more cooling towers may be provided to provide refrigeration to each floor, column, or cooling bath 210, respectively. As previously mentioned, the configuration shown in FIG. 8 is particularly suited for a containerized computing device 100 having a longer container size that provides uniform cooling capacity along the length of each cooling slot 210.
The containerized computing device 100 of the present invention has a high level of integration and can be deployed very conveniently and quickly. For example, when the container-based computing device 100 is transported to a destination, cooling water and cooling fluid are added and connected to the power cable, and operation is immediately enabled. Moreover, the operation of each component can be conveniently controlled through the control panel 600, and the operation state of the whole system can be monitored. The containerized computing device 100 has an efficient, low-cost cooling system that enables rapid and efficient heat dissipation by completely immersing the computing equipment 202 in an insulating, thermally conductive coolant, since the specific heat of the coolant is much greater than air and the coolant is able to adequately contact the heat generating components of the computing equipment 202. Due to the increased heat dissipation efficiency, more cooling slots 210 may be provided in the limited space of the container and/or more computing devices 202 may be provided in each cooling slot 210. In some embodiments, the total power of the computing equipment 202 may range from 400 kilowatts to 1000 kilowatts, and more preferably from 400 kilowatts to 800 kilowatts, for a standard container size, and the heat dissipation system of the present invention may provide efficient heat dissipation, ensuring stable operation of the entire container computing device 100. In addition, the whole cooling system of the invention has low cost, and the energy consumption of the cooling system is also reduced by avoiding the use of a compressor, thereby realizing the economy in long-term use. Furthermore, the container-based computing device 100 is equipped with a main oil pump and a backup oil pump, so that when the main oil pump fails, the backup oil pump can be used to continue to maintain the operation of the cooling system without requiring a shutdown for maintenance, thereby improving the continuous service time of the container-based computing device 100.
While certain embodiments of the present invention have been described, these embodiments have been presented by way of example only, and are not intended to limit the scope of the application. Indeed, the novel methods and systems described herein may be embodied in a variety of other forms. In addition, various omissions, substitutions and changes in the form of the methods and systems described herein may be made without departing from the scope of the application.

Claims (18)

1. A containerized computing device comprising a box portion (110) and an open space portion (120) disposed on a support floor (101), a cooling tower (300) disposed in the open space portion on the support floor, a cabinet disposed in the support floor surrounded by the box portion, and:
a support (201) providing single or multiple layers of support sites;
a plurality of cooling channels (210) disposed on the support locations of the rack, each cooling channel containing a cooling fluid and a plurality of computing devices (202) submerged in the cooling fluid, a cooling fluid inlet of the cooling channel connected to a cooling fluid outlet of the cooling tower via a fluid inlet pipe (230), a cooling fluid outlet of the cooling channel connected to a cooling fluid inlet of the cooling tower via a fluid outlet pipe (240).
2. The containerized computing device of claim 1, wherein said cabinet portion (110) includes a first cabinet portion (110A) and a second cabinet portion (110B) each surrounding a separate compartment, said open space portion (120) being located between said first cabinet portion (110A) and said second cabinet portion (110B), said open space portion (120) having one or more cooling towers (300) disposed therein to provide cooling to said first cabinet portion (110A) and said second cabinet portion (110B).
3. The container-based computing device of claim 1 or 2, wherein the cooling-liquid inlet and the cooling-liquid outlet of the cooling tank are disposed at the same end or opposite ends of the cooling tank, and the cooling-liquid outlet is disposed at a higher position than the cooling-liquid inlet,
the cooling liquid inlet of the cooling tower is disposed at a higher position than the cooling liquid outlet.
4. The containerized computing device of claim 1 or 2, wherein the inlet and outlet pipes extend into and along a length of the cooling bath, portions of the inlet and outlet pipes extending into the cooling bath having closed ports and having a plurality of holes formed thereon, the holes on the outlet pipe being formed in pipe wall portions within a range of 0 to 45 degrees and 135 to 360 degrees of a cross-section of the outlet pipe.
5. The container-style computing device of claim 1 or 2, wherein the inlet and outlet pipes extend into and along a length of the cooling bath, portions of the inlet and outlet pipes extending into the cooling bath having closed ports and having a plurality of holes formed thereon, the holes on the outlet pipe being downwardly-disposed elongated holes formed in a lower side pipe wall of a cross-section of the outlet pipe, and a flow guide plate (249) parallel to the outlet pipe being further disposed below the outlet pipe.
6. The containerized computing device of claim 1 or 2, wherein the racks are disposed on opposite sides of the cabin, one or more cooling channels are supported on each rack, a service aisle (250) is located between the racks on the opposite sides, and
the containerized computing device further comprising:
a switch (222) disposed in a support location of the rack for providing network connectivity for the computing device;
a control cabinet (224) disposed in the support location of the rack for controlling operation of the containerized computing device;
a power distribution box (220) disposed in a support location of the rack for supplying power to at least the computing device, the cooling tower, the control cabinet, and the switch; and
a Power Distribution Unit (PDU) connected to the switchbox by a cable, including a plurality of power outlets to distribute power to devices powered by the switchbox.
7. The containerized computing device of claim 1 or 2, wherein the inlet pipe (230) includes an inlet branch (231,235) for each cooling bath, each inlet branch being connected to a plurality of cooling baths in the same layer by a manifold, the outlet pipe (240) includes an outlet branch (241,245) for each cooling bath, at least one oil pump (242a, 242b) is connected to each outlet branch, the oil pump having a series connection of check valves (243), and each outlet branch being connected to a plurality of cooling baths in the same layer by a manifold.
8. The containerized computing device of claim 7, wherein a main oil pump (242a, 242b) and a backup oil pump (242c, 242d) are connected in parallel to each outlet branch, each having a check valve (243) connected in series.
9. The container-based computing device of claim 1 or 2, wherein the inlet pipe (230) comprises a separate inlet branch (231a, 231b, 231c, 231d) for each cooling tank, each inlet branch being connected between the cooling liquid outlet of the cooling tower and the cooling liquid inlet of the cooling tank, the outlet pipe (240) comprises a separate outlet branch (241a, 241b, 241c, 241d) for each cooling tank, each outlet branch being connected between the cooling liquid inlet of the cooling tower and the cooling liquid outlet of the cooling tank, at least one oil pump (242a, 242b, 242c, 242d) being connected to each outlet branch, the oil pumps having check valves (243a, 243b, 243c, 243d) connected in series.
10. The containerized computing device of claim 9, wherein said oil pump is disposed in said open space portion.
11. The containerized computing device of claim 1 or 2, wherein the cold tower comprises:
a coolant circuit (310) comprising a finned tube portion (312) and a coil portion (314) connected in series, the finned tube portion being located above the coil portion;
a spray pipe (320) located between the finned tube portion and the coil portion for spraying cooling water to the coil portion;
a water tank (304) located below the coil section for containing cooling water;
a water pump (322) for pumping the cooling water in the water tank into the shower pipe; and
an exhaust fan (330) located above the finned tube portion.
12. The containerized computing device of claim 11, wherein the cooling tower further comprises a housing having an air intake disposed in a lower portion thereof such that the air extractor flows air from a bottom to a top through the coolant circuit.
13. The containerized computing device of claim 1 or 2, wherein each box section is provided with a hatch at an end opposite the cooling tower, a lower portion of the hatch is provided with a ventilation window, and a ventilation window and a ventilation fan are provided above a side wall of the box section adjacent the cooling tower.
14. The containerized computing device of claim 1 or 2, further comprising one or more of the following sensors:
an in-box air temperature sensor (411) for monitoring the temperature of air within the box portion,
an outside box air temperature sensor (412) for monitoring an ambient temperature outside the box portion,
a cold tower inlet temperature sensor (413) for monitoring a temperature of the cooling liquid at the cooling liquid inlet of the cold tower,
a cold tower outlet temperature sensor (414) for monitoring a temperature of the cooling liquid at the cooling liquid outlet of the cold tower,
a cold tower water tank temperature sensor (415) for monitoring a temperature of cooling water in a water tank of the cold tower,
a cooling bath temperature sensor (416) for monitoring a cooling liquid temperature in the cooling bath,
a computer temperature sensor (417) for monitoring a temperature of the computing device,
an in-tank humidity sensor (421) for monitoring humidity within the tank portion,
an outside box humidity sensor (422) for monitoring ambient humidity outside the box portion,
a coolant flow sensor (431) for monitoring the coolant flow,
a cooling water flow sensor (432) for monitoring cooling water flow of the spray,
a cooling liquid pressure sensor (441) for monitoring a cooling liquid pressure,
a cooling water pressure sensor (442) for monitoring a cooling water pressure,
a main oil pump rotational speed sensor (451) for monitoring the rotational speed of the main oil pump,
a backup oil pump rotational speed sensor (452) for monitoring a rotational speed of the backup oil pump,
a water pump rotational speed sensor (453) for monitoring a rotational speed of the water pump,
a fan rotation speed sensor (454) for monitoring the rotation speed of the fan mounted on the case portion,
a blower speed sensor (455) for monitoring the speed of a blower mounted on the cooling tower,
a cooling tank level sensor (461) for monitoring the level of cooling liquid in the cooling tank, and
a sump level sensor (462) for monitoring a level of cooling water in the sump.
15. The containerized computing device of claim 14, further comprising a control device (500), the control device comprising:
a setup module (510) comprising one or more of the following setup units:
a temperature setting unit (511) for setting one or more of a temperature range of air within the box portion, a temperature range of the cooling liquid at the cooling liquid outlet of the cooling tower, a temperature range of the cooling liquid in the cooling tank, a temperature range of the cooling water in the water tank, and a temperature range of the computing device;
a humidity setting unit (512) for setting a humidity range within the tank portion;
a flow rate setting unit (513) for setting one or more of a flow rate range of the cooling liquid and a flow rate range of the cooling water;
a pressure setting unit (514) for setting one or more of a pressure range of the cooling liquid and a pressure range of the cooling water;
a rotation speed setting unit (515) for setting one or more of a rotation speed range of the main oil pump, a rotation speed range of the backup oil pump, a rotation speed range of the water pump, a rotation speed range of the exhaust fan and a rotation speed range of the exhaust fan; and
a liquid level setting unit (516) for setting one or more of a liquid level range of the cooling liquid in the cooling tank and a liquid level range of the cooling water in the water tank;
a control module (520) comprising one or more of the following controllers implemented as a manual controller or a programmable logic controller:
a main oil pump rotational speed controller (521) for adjusting a rotational speed of the main oil pump to control a circulation speed of the coolant;
a backup oil pump rotational speed controller (522) for adjusting a rotational speed of the backup oil pump to control a circulation speed of the coolant;
a water pump rotational speed controller (523) for adjusting a rotational speed of the water pump to control a circulation speed of the cooling water;
a fan speed controller (524) for adjusting a speed of a fan mounted on the cabinet portion to control a flow rate of air in the cabinet portion;
an exhaust fan rotation speed controller (525) for adjusting the rotation speed of an exhaust fan mounted on the cooling tower to control the air flow speed in the cooling tower; and
and one or more alarm devices (530) for sending out alarm signals when the detection values of the one or more sensors exceed the corresponding parameter ranges set by the setting module.
16. The containerized computing device of claim 15, further comprising:
a control panel mounted on the cabinet portion, the control panel comprising:
a touch screen display panel (610) for setting operating parameters of the container-based computing device and displaying operating status of the container-based computing device;
a plurality of indicator lights or buzzers (620) serving as the alarm means; and
a plurality of switching elements (630) for controlling the supply of power to the main oil pump, the backup oil pump, the water pump, the exhaust fan mounted on the tank portion, and the exhaust fan of the cooling tower.
17. The containerized computing device of claim 1 or 2, wherein the box portion and open space portion of the support floor have an integral rectangular frame (102) that defines the spatial dimensions of the containerized computing device and a protective frame (121) attached to the rectangular frame is further disposed around the cooling tower.
18. The containerized computing arrangement of claim 1 or 2, wherein a predetermined number of computing devices (202) are disposed in the plurality of cooling slots (210) in each case portion such that a total power of the computing devices disposed in each case portion is in a range of 400 to 800 kW.
CN202210671283.7A 2022-06-14 2022-06-14 Container type computing device with liquid cooling system Pending CN114885567A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116981219A (en) * 2023-07-19 2023-10-31 上海柏晟能源科技有限公司 Integrated photovoltaic energy storage's immersion liquid cooling server circulation cooling system
CN116997140A (en) * 2023-07-19 2023-11-03 上海柏晟能源科技有限公司 Integrated modularized submerged liquid cooling server circulating heat dissipation system
EP4326021A1 (en) * 2022-08-18 2024-02-21 Straitdeer Pte. Ltd. Cooling tank for computing equipment, cooling device, and computing apparatus including the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4326021A1 (en) * 2022-08-18 2024-02-21 Straitdeer Pte. Ltd. Cooling tank for computing equipment, cooling device, and computing apparatus including the same
CN116981219A (en) * 2023-07-19 2023-10-31 上海柏晟能源科技有限公司 Integrated photovoltaic energy storage's immersion liquid cooling server circulation cooling system
CN116997140A (en) * 2023-07-19 2023-11-03 上海柏晟能源科技有限公司 Integrated modularized submerged liquid cooling server circulating heat dissipation system

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