CN114885507A - Disposable full continuous hole plugging device and method - Google Patents
Disposable full continuous hole plugging device and method Download PDFInfo
- Publication number
- CN114885507A CN114885507A CN202210788098.6A CN202210788098A CN114885507A CN 114885507 A CN114885507 A CN 114885507A CN 202210788098 A CN202210788098 A CN 202210788098A CN 114885507 A CN114885507 A CN 114885507A
- Authority
- CN
- China
- Prior art keywords
- lower roller
- powder
- hole
- plugging
- hole plugging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention relates to a one-time full continuous hole plugging device and a method, and relates to the technical field of circuit board hole plugging. The disposable full continuous hole plugging device comprises a conveyor belt, an upper roller, a lower roller, a hole plugging ink storage tank and a liquid circulating cooling device; the upper roller is positioned above the lower roller; the conveying belt is positioned between the upper roller and the lower roller and is provided with a die hole for accommodating the circuit board; the lower roller is transversely arranged above the plug hole ink storage groove, and the lower end of the lower roller body is positioned in the plug hole ink storage groove; a cavity is arranged in the lower roller and is connected with a liquid circulating cooling device; the outer side of the cylinder body is provided with a sticky layer. The device is matched with a one-time full continuous hole plugging method, so that the circuit board holes can be fully plugged at one time, continuous production can be realized, and hole plugging efficiency and excellent rate can be obviously improved.
Description
Technical Field
The invention relates to the technical field of circuit board hole plugging, in particular to a disposable full continuous hole plugging device and a method.
Background
In recent years, the high density interconnection Technology (HDI) design of printed circuit boards is becoming more common, so that the resin ink via holes are more and more widely applied in the PCB industry, and the advantages of the resin ink via holes in products with high layer number and thick boards are more obvious.
At present, there are two main processes for plugging holes used in printed circuit boards, i.e., screen printing and vacuum plugging. The general hole plugging process comprises the following steps: taking out the hole plugging ink, placing the hole plugging ink in a printing chamber in a constant temperature and humidity environment for standing for 4-6H, opening the tank after the hole plugging ink is consistent with the room temperature, and stirring for 15min in vacuum to uniformly mix the resin.
The vacuum hole plugging process does not need hole alignment, and the vacuum tube resin ink is directly used on a machine, but the vacuum hole plugging equipment is expensive and low in efficiency. After the circuit board is hung well, the vacuum plug hole is vacuumized and then printed, then the circuit board is deflated and taken down, and the board is replaced to continue vacuumization and printing, so that the efficiency is low and the large-scale production is not suitable.
Most use screen printing processes, which are somewhat complex but inexpensive. The screen printing process comprises the steps of selecting proper screen gauze or aluminum sheets, then carrying out plate alignment, adjusting a contact angle between air pressure and a scraper according to the process, pouring a proper amount of resin to start printing, filling the resin into holes under the action of the scraper and the air pressure, taking out the resin to check whether filling leakage exists or not, compensating, and carrying out curing baking after printing is finished. The screen printing needs to specially design the screen printing plates consistent with the holes of the circuit board, different circuit boards correspond to different screen printing plates, holes need to be aligned before plugging, and after plugging, the circuit boards need to be taken out to check whether the circuit boards are fully plugged and whether the circuit boards need to be plugged for the second time.
As can be seen from the above, neither process can meet the requirements of one-time full plugging and continuous large-scale production.
Therefore, it is urgently needed to research a hole plugging process or method, which can plug the circuit board to be plugged with holes at one time, can be continuously performed, and is suitable for large-scale production and application.
Disclosure of Invention
The invention provides a disposable full-plugging continuous hole plugging device and a method aiming at the problems that the conventional hole plugging process is difficult to perform full plugging at one time and continuous production is not available.
Meanwhile, the device and the method do not need a screen aluminum plate, do not need steps of vacuumizing, deflating and the like, and are suitable for large-scale production and application.
In order to achieve the aim, the invention provides a disposable full continuous hole plugging device and a method, and particularly comprises the following steps:
the disposable full continuous hole plugging device comprises a conveyor belt, an upper roller, a lower roller, a hole plugging ink storage tank and a liquid circulating cooling device; the upper roller is positioned above the lower roller; the conveying belt is positioned between the upper roller and the lower roller and is provided with a die hole for accommodating the circuit board; the lower roller is transversely arranged above the plug hole ink storage groove, and the lower end of the lower roller body is positioned in the plug hole ink storage groove; a cavity is arranged in the lower roller and is connected with a liquid circulating cooling device; the outer side of the cylinder body is provided with a sticky layer.
Preferably, the device also comprises an external power supply, and the external power supply is connected with the lower roller; the lower roller is provided with a first bearing at the center, and an external power supply drives the lower roller to operate through the first bearing.
Preferably, a cavity is arranged inside the upper roller and is connected with a liquid circulation cooling device.
Preferably, the device further comprises a pair of fixing frames which are fixedly connected with two ends of the plug hole ink storage tank.
Preferably, the fixing frame is vertically provided with a plurality of clamping grooves comprising a first clamping groove and a second clamping groove, and the lower roller is fixed on the fixing frame in an embedded manner through a first bearing and the first clamping groove; and a second bearing is arranged at the center of the upper roller, and the upper roller is fixed on the fixing frame in an embedded manner through the second bearing and the second clamping groove.
The invention provides a one-time full continuous hole plugging method, which applies the device and comprises the following steps:
(1) adding the hole plugging ink into a hole plugging ink storage tank;
(2) placing the circuit board to be plugged on the conveyer belt;
(3) the upper roller is contacted with the circuit board to be plugged, the lower roller rotates, and the stuck hole plugging ink is plugged into the circuit board to be plugged to complete hole plugging;
the viscosity of the hole plugging ink is 200-400dpa.s/25 ℃, and the thixotropy TI value is more than 4.5;
the conveying speed of the conveyor belt is 0.05-0.2 m/s;
the rotating speed of the lower roller is 5-20r/min, and the operating temperature is 20-40 ℃.
Preferably, the hole plugging ink comprises the following components in parts by weight: 20-30 parts of epoxy resin, 10-20 parts of glycidyl reactive diluent, 2-4 parts of latent curing agent, 0.01-0.3 part of defoaming agent and 50-60 parts of modified powder;
the epoxy resin is a mixture of at least two of bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin and polyfunctional epoxy resin;
the glycidyl reactive diluent is a mixture of at least two of n-butyl glycidyl ether, 5-ethylhexyl glycidyl ether, butanediol diglycidyl ether, phenyl glycidyl ether, diglycidyl ether and polyethanol diglycidyl ether;
the latent curing agent is at least one of o-methylphenyl biguanide, 2-methylimidazole and derivatives thereof, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole and 2-undecylimidazole;
the modified powder comprises modified micron-level powder and modified nano-level powder, and the mass ratio of the modified micron-level powder to the modified nano-level powder is (7-15): 1; the micron-sized powder is one or a mixture of two of siliceous micropowder, aluminum hydroxide powder, calcium carbonate powder, fly ash, glass fiber, carbon nano tube and kaolin, and the nanometer-sized powder is one or a mixture of two of siliceous micropowder, aluminum hydroxide powder, calcium carbonate powder, fly ash, glass fiber, carbon nano tube and kaolin.
Preferably, the epoxy resin is a mixture of bisphenol A epoxy resin and polyfunctional epoxy resin epoxidized m-xylylenediamine, and the mass ratio of the bisphenol A epoxy resin to the polyfunctional epoxy resin epoxidized m-xylylenediamine is 3-6: 1;
the glycidyl reactive diluent is a mixture of butanediol diglycidyl ether and phenyl glycidyl ether, and the mass ratio of the butanediol diglycidyl ether to the phenyl glycidyl ether is 2-3: 1.
Preferably, the particle size of the micron-sized powder is 1-20 μm; the modified micron-sized powder is modified by a coupling reaction between the micron-sized powder and a coupling agent by a self-drying method, wherein the coupling agent is selected from one or a mixture of two of a silane coupling agent and a titanate coupling agent, and the coupling agent accounts for 0.5-1.0% of the mass of the micron-sized powder.
Preferably, the particle size of the nano-scale powder is 1-100 nm; the modified nano-powder is modified by a coupling reaction between nano-powder and a coupling agent by a self-drying method, wherein the coupling agent is selected from one or a mixture of silane coupling agent and titanate coupling agent, and the coupling agent accounts for 1.0-1.5% of the mass of the nano-powder.
Preferably, the defoaming agent is at least one of an organic silicon defoaming agent, a polyether defoaming agent and polyether modified silicon.
Compared with the existing mainstream hole plugging device and method, the invention has the advantages that:
(1) according to the invention, by using the roller hole plugging process, compared with screen printing, a screen printing plate and an aluminum plate are not required, and the process is simple; compared with vacuum hole plugging, the continuous hole plugging production can be realized without vacuumizing or intermittent hole plugging operation.
(2) According to the invention, by matching the low-viscosity high-thixotropy hole plugging ink, the requirement of filling holes with different apertures and high AR at one time can be met by using the roller hole plugging process, continuous hole plugging operation can be realized, the hole plugging efficiency and the excellent rate can be obviously improved, and the good economic benefit is achieved. Meanwhile, the plug holes have high shaping performance and excellent physicochemical performance after curing.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Figure 1 is a front view of the disposable full continuous nozzle device of the present invention.
Figure 2 is a partial cross-sectional view of the disposable full continuous plugging device of the present invention.
Figure 3 is a top view of the disposable full continuous jack device of the present invention.
Fig. 4 is a partial cross-sectional view of the lower roller part of the disposable full continuous hole plugging device of the present invention.
Fig. 5 is a partial cross-sectional view of the upper roller portion of the disposable full continuous hole plugging device of the present invention.
Figure 6 is a side view of the disposable full continuous nozzle device of the present invention.
Fig. 7-8 are schematic diagrams illustrating the effect of the present invention after plugging the holes in embodiment 1.
The labels in the figures illustrate:
1-lower roller; 11-lower roller outer layer; 12-a first bearing; 2-a via ink storage tank; 3-a conveyor belt; 4-upper roller; 41-a second bearing; 5-a fixing frame; 51-a first card slot; 52-second card slot.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It will be understood that the terms "comprises" and/or "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is also to be understood that the terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in the specification of the present invention and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be further understood that the term "and/or" as used in this specification and the appended claims refers to any and all possible combinations of one or more of the associated listed items and includes such combinations.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings or orientations or positional relationships that the present product is conventionally placed in use, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
The terms "first," "second," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
The terms "horizontal", "vertical", "overhang" and the like do not imply that the components are required to be absolutely horizontal, vertical or overhang, but may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the present invention, it should also be noted that, unless otherwise explicitly stated or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Disposable full continuous hole plugging device
As shown in the figures 1-6, the disposable full continuous hole plugging device is mainly realized by a roller type hole plugging device and comprises a conveyor belt 3, a lower roller 1, a hole plugging ink storage tank 2, an upper roller 4, a fixing frame 5, an external power supply and a liquid circulating cooling device.
The fixing frames 5 are a pair and are arranged at two ends of the hole plugging ink storage tank 2, and a plurality of clamping grooves comprising a first clamping groove 51 and a second clamping groove 52 are vertically arranged on the fixing frames 5. The clamping grooves arranged on the fixing frames 5 at the two ends of the hole plugging ink storage tank 2 are a corresponding pair, and specifically, if the first clamping groove 51 is a pair, the clamping grooves are arranged on the fixing frames 5 at the two ends of the corresponding hole plugging ink storage tank 2. The arrangement of a plurality of clamping grooves can be used for adjusting the positions of the upper roller 4 and the lower roller 1.
The lower roller 1 is internally provided with a cavity which is connected with a liquid circulation cooling device and used for cooling the lower roller 1 which is heated after operation and adjusting the operation temperature of the lower roller. A first bearing 12 is arranged at the center of the lower roller 1, and the first bearing 12 is nested with the first clamping groove 51, so that the lower roller 1 is fixed on the fixed frame 5; meanwhile, the lower roller 1 is connected with an external power supply, and the external power supply drives the lower roller 1 to operate through the first bearing 12. The inside cavity that is of lower roller 1 is convenient for later clear up and overhaul lower roller 1.
The upper roller 4 is internally provided with a cavity which is connected with a liquid circulation cooling device and used for cooling the upper roller 4 heated after operation and adjusting the operation temperature of the upper roller. The center of the upper roller 4 is provided with a second bearing 41, and the second bearing 41 is nested with the second clamping groove 52, so that the upper roller 4 is fixed on the fixed frame 5. The upper roller 4 can be connected with an external power supply, the upper roller 4 is driven to run through the second bearing 41, the running direction is opposite to that of the lower roller 1, and the rotating speed is not higher than that of the lower roller 1. The upper roller 4 can also be disconnected from an external power supply. The design of the inner cavity of the upper roller 4 is convenient for cleaning and overhauling the upper roller 4.
The upper roller 4 is arranged above the lower roller 1, and the clamping grooves in the fixing frame 5 are vertically arranged, so that the upper roller 4 and the lower roller 1 are vertically arranged in parallel.
A gap is reserved between the upper roller 4 and the lower roller 1, and the gap is 1-2mm larger than the thickness of the circuit board; a conveyor belt 3 is arranged at the gap; i.e. the conveyor belt 3 is located between the upper roller 4 and the lower roller 1. The conveyer belt 3 is provided with a die hole for accommodating a circuit board, and the die hole penetrates through the conveyer belt 3, so that the circuit board accommodated by the die hole can be in contact with the upper roller 4 and the lower roller 1; meanwhile, the circuit board to be plugged can be fixed, and the circuit board to be plugged is prevented from shaking during conveying. The conveyor belt 3 may also be a double-roller structure commonly used in the actual production process, that is, a pair of rollers respectively fixes the left and right sides of the circuit board, so as to drive the circuit board to move.
The width of the conveyor belt 3 is h, so the width of the circuit board on the conveyor belt 3 is less than or equal to h. The conveyer belt 3 can convey the circuit boards to be plugged below the upper roller 4 and above the lower roller 1. When the upper roller 4 is contacted with the conveyor belt 3, if the circuit board to be plugged is conveyed to the position below the upper roller 4, the upper roller 4 is contacted with the circuit board to be plugged; the lower roller 1 cannot be in direct contact with the circuit board to be plugged due to the gap, but the plugging ink adhered to the lower roller 1 can be in contact with the circuit board to be plugged, so that the circuit board to be plugged is plugged.
The lower roller 1 is connected with an external power supply and can rotate actively, the rotating direction is consistent with the running direction of the conveyor belt 3, and meanwhile, the conveyor belt 3 is driven, so that the speed of the conveyor belt 3 is consistent with the rotating speed of the conveyor belt. The length H more than or equal to conveyer belt width H of roller 1 down, the circuit board width of treating the consent of length H more than or equal to of roller 1 down promptly can prevent to treat the circuit board of consent and rock to influence the consent effect.
A sticking layer is arranged on the outer side of the lower roller 1, namely the outer layer 11 of the lower roller is a sticking layer and used for sticking the hole plugging ink; the outer layer 11 of the lower roller can be made of nylon, silk cloth and other materials easy to adhere. The running temperature of the lower roller 1 is 20-40 ℃; the inner part of the cylinder body of the lower roller 1 is a cavity which is connected with a liquid circulation cooling device and is used for maintaining the running temperature of the lower roller 1 and preventing overhigh temperature so that the hole plugging ink adhered on the lower roller is solidified too fast to cause hole plugging failure; or the hole plugging ink is solidified when the hole plugging is not fully plugged, so that the hole plugging effect is poor. Lower roller 1 is located the horizontal setting in top of consent ink storage tank 2, and the lower extreme of 1 stack shell of lower roller is located consent ink storage tank 2, is convenient for lower roller skin 11 glues the consent ink in the consent ink storage tank 2 of gluing.
The hole-plugging ink storage tank 2 is used to store hole-plugging ink. The plug hole ink storage tank 2 can be of a lifting structure, so that plug hole ink is convenient to store and clean. The outer layer 11 of the lower roller is contacted with the hole plugging ink stored in the hole plugging ink storage tank 2, so that the hole plugging ink is stuck to the lower roller 1 and is pressed into a circuit board to be plugged, which is contacted with the lower roller 1, through rotation.
The upper roller 4 is positioned above the lower roller 1. The length of the upper roller 4 is the same as that of the lower roller, and is H, which is larger than or equal to the width H of the conveying belt, namely the length H of the upper roller 4 is larger than or equal to the width of the circuit board to be plugged. Meanwhile, the diameters of the upper roller 4 and the lower roller 1 are preferably 5-10 cm; the upper roller 4 and the lower roller 1 can be made of polytetrafluoroethylene, zirconia, stainless steel and the like.
When hole plugging is carried out, the upper roller 4 is in contact with the circuit board to be plugged on the conveyor belt 3 and is used for plugging holes in the circuit board to be plugged; meanwhile, the lower roller 1 presses the sticky hole plugging ink into the hole to be plugged above the circuit board, and the pressure of the hole plugging ink is increased due to the action of air pressure, so that the effect of one-time full plugging is realized.
Go up 4 stack shafts internal connection liquid circulation cooling device of roller for adjust the operating temperature of roller 4, prevent the high temperature, solidify when making the consent printing ink not full, lead to the consent effect not good.
Meanwhile, the outer layer of the upper roller 4 can be provided with a sticky layer which is the same as the outer layer 11 of the lower roller, or the sticky layer is not provided.
Disposable full continuous hole plugging method
The disposable full continuous hole plugging method comprises the following steps:
(1) adding the hole plugging ink into a hole plugging ink storage tank; the viscosity of the hole plugging ink is 200-400dpa.s/25 ℃, and the thixotropy TI value is more than 4.5.
The viscosity of the hole plugging ink is too low to be adhered to the lower roller and rotates together with the lower roller; the viscosity is too high, and the roller is difficult to continuously stick and takes the printing ink to make the consent defect and then be difficult to continuous production, and the printing ink is remained on roller down easily simultaneously for roller cleaning frequency increases down, increases the cost.
The thixotropy TI value is too low, and the plug holes are easy to overflow and connect with the sheets after being baked, so that the polishing cost is increased; the high thixotropy of low viscosity can guarantee that the efficiency of pluging has the high design purpose that can reach the board, prevents the overflow, easily polishes.
The hole plugging ink comprises the following components in parts by weight: 20-30 parts of epoxy resin, 10-20 parts of glycidyl reactive diluent, 2-4 parts of latent curing agent, 0.01-0.3 part of defoaming agent and 50-60 parts of modified powder.
The epoxy resin can be a mixture of two or more of bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin and polyfunctional epoxy resin according to the proportion, and the viscosity of the epoxy resin is 4-8 Pa.s/25 ℃. Specifically, a mixture of bisphenol a epoxy resin and polyfunctional epoxy resin epoxidized m-xylylenediamine is preferred, wherein the mass ratio of bisphenol a epoxy resin to polyfunctional epoxy resin epoxidized m-xylylenediamine is 3-6: 1.
The glycidyl reactive diluent is a mixture of at least two of n-butyl glycidyl ether, 5-ethylhexyl glycidyl ether, butanediol diglycidyl ether, phenyl glycidyl ether, diglycidyl ether and polyethanol diglycidyl ether. Specifically, a mixture of butanediol diglycidyl ether and phenyl glycidyl ether is preferred, wherein the mass ratio of the butanediol diglycidyl ether to the phenyl glycidyl ether is 2-3: 1.
the latent curing agent is at least one of dicyandiamide and derivatives thereof, imidazole and derivatives and salts thereof, aromatic diamine curing agent, organic acid anhydride curing agent, Lewis acid-amine complex curing agent and organic hydrazide curing agent. The latent curing agent is dicyandiamide derivatives matched with imidazole and derivatives thereof, preferably at least one of o-methylphenyl biguanide (c 1), 2-methylimidazole and derivatives thereof (c 2), 1-cyanoethyl-2-undecylimidazole (c 3), 1-cyanoethyl-2-ethyl-4-methylimidazole (c 4) and 2-undecylimidazole (c 5). In this test example, 2-methylimidazole and derivatives thereof are preferable.
The modified powder comprises modified micron-level powder and modified nano-level powder, and the mass ratio of the modified micron-level powder to the modified nano-level powder is (7-15): 1; the micron-sized powder is one or two mixtures selected from siliceous micro powder, aluminum hydroxide powder, calcium carbonate powder, fly ash, glass fiber, carbon nano tube and kaolin, and the nano-sized powder is one or two mixtures selected from siliceous micro powder, aluminum hydroxide powder, calcium carbonate powder, fly ash, glass fiber, carbon nano tube and kaolin.
Preferably, the micron-sized powder is aluminum hydroxide powder with the particle size of 1-20 mu m, and the nano-sized powder is aluminum hydroxide powder with the particle size of 1-100 nm.
The modified micron-sized powder is modified by carrying out coupling reaction on micron-sized powder with the particle size of 1-20 microns and a coupling agent by an air-drying method, wherein the coupling agent accounts for 0.5-1.0% of the mass of the micron-sized powder.
The particle size of the nano-grade powder is 1-100nm, the modified nano-grade powder is modified by a coupling reaction of the nano-grade powder with the particle size of 1-100nm and a coupling agent by an air-drying method, and the coupling agent accounts for 1.0-1.5% of the mass of the nano-grade powder.
The coupling agent is selected from one or a mixture of silane coupling agent or titanate coupling agent. The silane coupling agent is one or a mixture of aminosilane, epoxy silane, sulfenyl silane, vinyl silane, phenyl silane and alkyl silane; the titanate coupling agent is one or a mixture of isopropoxy tri (isostearoyl) titanate, mono-alkoxy titanium tricarboxylate, triethanolamine titanate, alcohol amine ethylene diethylene titanate and alcohol amine fatty acid titanate.
The defoaming agent is at least one of organic silicon defoaming agent (d 1), polyether defoaming agent (d 2) and polyether modified silicon (d 3).
The hole plugging ink is prepared by the following steps:
s1: epoxy resin, glycidyl reactive diluent, modified nano-scale aluminum hydroxide powder, a latent curing agent and a defoaming agent are placed in a reaction kettle with cooling water introduced, and stirred at a low speed for 30-60min to obtain a mixed material.
S2: adding the modified micron-sized aluminum hydroxide powder into the mixed material, introducing circulating cooling water of 20 ℃, controlling the temperature of the mixed material in the high-speed stirring process by the circulating cooling water, keeping the temperature of the mixed material below 30 ℃, and stirring at a high speed for 1-5 hours to obtain a mixture.
S3: and (4) grinding the mixture obtained in the step S2 by using a three-roll grinder, and introducing circulating cooling water at 15 ℃ into the three-roll grinder for more than three times to obtain a mixture with uniform particle size distribution.
S4: and transferring the mixed material prepared in the step S3 to a vacuum stirrer, introducing circulating cooling water at 25 ℃, vacuumizing and stirring for 2-6 hours to obtain the aluminum hydroxide type plugging ink at the temperature of 200-400dPa.s/25 ℃.
(2) Placing the circuit board to be plugged on the conveyer belt; the conveying speed of the conveyor belt is 0.05-0.2 m/s.
(3) The upper roller is contacted with the circuit board to be plugged, the lower roller rotates, and the stuck hole plugging ink is plugged into the circuit board to be plugged to complete hole plugging; the rotating speed of the lower roller is 5-20r/min, and the operating temperature is 20-40 ℃. The speed of the conveyor belt is kept consistent by the driving speed of the rollers.
The transmission speed of the conveyor belt is considered in combination with the rotating speed of the lower roller, if the transmission speed is too high, hole plugging ink plugged into the hole is not cured and is transmitted away, and the hole plugging ink falls off under the action of gravity, so that the hole plugging effect is poor; if the transfer rate is too slow, then inefficiency, the cost is too high, glues the glued consent printing ink too much on the circuit board simultaneously, needs the clearance, causes the manpower waste. The rotating speed of the lower roller is too high, so that the hole plugging ink is difficult to adhere to the lower roller and rotates along with the lower roller, even if the hole plugging ink can be adhered, the amount of the adhered hole plugging ink is insufficient, the requirement of full plugging at one time cannot be met, and meanwhile splashing can also occur; the rotating speed of the lower roller is too slow, so that the adhered hole plugging ink falls under the action of gravity, and the amount of the adhered hole plugging ink is also insufficient.
Meanwhile, the lower roller has too high temperature, so that the adhered hole plugging ink is quickly cured, waste is caused, and the cured hole plugging ink is difficult to plug holes, so that the hole plugging effect is poor; the temperature of the lower roller is too low, and the hole plugging ink plugged into the circuit board is conveyed away without being cured, so that the hole plugging effect is poor.
The method for filling the holes continuously by one-time filling is combined with a device and applied to the hole filling process, and specifically comprises the following steps:
firstly, adding the plugging ink with the viscosity of 200-400dpa.s/25 ℃ and the thixotropy TI value of more than 4.5 into the plugging ink storage tank 2; the circuit board to be plugged is then placed on the conveyor belt 3.
The lower roller 1 is fixed through nesting of a first clamping groove 51 on the fixing frame and a first bearing 12 in the lower roller 1; the upper roller 4 is fixed through the nesting arrangement of a second clamping groove 52 on the fixed frame and a second bearing 41 in the upper roller 4; adjusting the distance between the upper roller 4 and the lower roller 1 and the conveyor belt 3, wherein the distance is 1-2mm larger than the thickness of the circuit board to be plugged, and the conveyor belt 3 is in contact with the upper roller 4; the conveyer belt conveys the circuit board to be plugged between the lower roller 1 and the upper roller 4 at a conveying speed of 0.05-0.2 m/s; the lower roller 1 rotates at the rotation speed of 5-20r/min, the hole plugging ink on the hole plugging ink storage tank 2 is adhered to the outer layer 11 of the lower roller, and then the hole plugging ink is plugged into the hole of the circuit board to be plugged by rotating. At the moment, the upper roller 4 is in contact with the circuit board to be plugged on the conveyor belt 3 to plug the hole of the circuit board to be plugged, and the hole plugging ink fully plugs the hole of the circuit board to be plugged at one time under the action of air pressure; and the hole plugging ink fully plugging the holes of the circuit board is cured under the influence of the temperature of the upper roller 4 and the lower roller 1; and then conveyed away via the conveyor belt 3.
Then, the next circuit board to be plugged is continuously conveyed between the upper roller 4 and the lower roller 1 by the conveyor belt 3, and the lower roller 1 continuously plugs the sticky plugging resin into the hole of the next circuit board to be plugged by rotating to plug the hole of the next circuit board to be plugged; realizing continuous hole plugging.
In the process, the inner cavity of the lower roller 1 is connected with a liquid circulating cooling device, so that the running temperature of the lower roller 1 can be ensured to be 20-40 ℃; the cavity inside the upper roller 4 is connected with a liquid circulation cooling device, so that the temperature of the upper roller 4 is not higher than 40 ℃.
Test example 1
The hole plugging ink is prepared by the following steps:
s1: placing the epoxy resin, the glycidyl reactive diluent, the modified nano-scale aluminum hydroxide powder, the latent curing agent and the defoaming agent in a reaction kettle filled with cooling water, and stirring at a low speed for 30-60min to obtain a mixed material.
S2: adding the modified micron-sized aluminum hydroxide powder into the mixed material, introducing circulating cooling water of 20 ℃, controlling the temperature of the mixed material in the high-speed stirring process by the circulating cooling water, keeping the temperature of the mixed material below 30 ℃, and stirring at a high speed for 1-5 hours to obtain a mixture.
S3: and (3) grinding the mixture obtained in the step (2) by using a three-roll grinder, and introducing circulating cooling water with the temperature of 15 ℃ into the three-roll grinder to grind for more than three times to obtain the mixture with uniform particle size distribution.
S4: and (4) transferring the mixed material prepared in the step (3) into a vacuum stirrer, introducing circulating cooling water at the temperature of 25 ℃ into the vacuum stirrer, vacuumizing and stirring for 2-6 hours to obtain the plugging ink at the temperature of 200-400dPa.s/25 ℃.
The taphole ink test sample YM1-7 and the comparative sample DB 1-DB 8 were prepared according to the preparation procedures described above and the taphole ink composition Table in Table 1.
TABLE 1 composition Table of hole-plugging inks
The epoxy resin is preferably a mixture of bisphenol A epoxy resin and polyfunctional epoxy resin epoxidized m-xylylenediamine, wherein the bisphenol A epoxy resin is a1, and the polyfunctional epoxy resin epoxidized m-xylylenediamine is a 2; the diluent is preferably a mixture of butanediol diglycidyl ether and phenyl glycidyl ether, the butanediol diglycidyl ether is b1, and the phenyl glycidyl ether is b 2; the modified micron-sized powder is preferably modified micron-sized aluminum hydroxide powder (e 1), and the modified nano-sized powder is preferably modified nano-sized aluminum hydroxide powder (e 2).
It is known from DB2-3 in table 1 that when the mass ratio of the modified micron-sized powder to the modified nano-sized powder is not in accordance with the mass ratio limit in the present application, the viscosity or thixotropy of the ink is deteriorated, which results in that the requirement of the one-time full continuous hole plugging method cannot be satisfied.
DB4 has a viscosity below 200 due to an inappropriate ratio compared to YM 3; DB5-DB7 and YM4-YM6 are improper in proportion, so that DB5-DB7 is subjected to expansion cracking in an IR furnace after curing, and heat resistance is deteriorated; DB8 compared with YM7, it is known that no nanopowder, thixotropy is deteriorated, and the problem of overflow local cracking occurs.
Example 1
The disposable continuous hole plugging device and method includes the following steps:
(1) adding the hole plugging ink into a hole plugging ink storage tank; the viscosity of the hole plugging ink is 300dpa.s/25 ℃, and the thixotropy TI value is more than 4.5. Specifically, the via hole ink is YM 1.
(2) Placing the circuit board to be plugged on the conveyer belt; the conveying speed of the conveyor belt was 0.05 m/s.
(3) The upper roller is contacted with the circuit board to be plugged, the lower roller rotates, and the glued plugging ink is plugged into the circuit board to be plugged to complete plugging. The rotating speed of the lower roller is 5r/min, and the operating temperature is 20 ℃; the upper roller temperature was below 30 ℃.
Example 2
The disposable continuous hole plugging device and method includes the following steps:
(1) adding the hole plugging ink into a hole plugging ink storage tank; the viscosity of the hole plugging ink is 200dpa.s/25 ℃, and the thixotropy TI value is more than 4.5. Specifically, the via hole ink is YM 2.
(2) Placing the circuit board to be plugged on the conveyer belt; the conveying speed of the conveyor belt was 0.10 m/s.
(3) The upper roller is contacted with the circuit board to be plugged, the lower roller rotates, and the glued plugging ink is plugged into the circuit board to be plugged to complete plugging. The rotating speed of the lower roller is 10r/min, and the operating temperature is 25 ℃; the upper drum temperature was below 35 ℃.
Example 3
The disposable continuous hole plugging device and method includes the following steps:
(1) adding the hole plugging ink into the hole plugging ink storage tank; the viscosity of the plugging ink is 400dpa.s/25 ℃, and the thixotropy TI value is more than 4.5. Specifically, the via hole ink is YM 3.
(2) Placing the circuit board to be plugged on the conveyer belt; the conveying speed of the conveyor belt was 0.20 m/s.
(3) The upper roller is contacted with the circuit board to be plugged, the lower roller rotates, and the glued plugging ink is plugged into the circuit board to be plugged to complete plugging. The rotating speed of the lower roller is 20r/min, and the operating temperature is 30 ℃; the upper drum temperature was below 40 ℃.
Ink plugging was performed according to the apparatus and method of examples 1-3, and the plugging inks were all test sample YM 1.
Comparative example 1
The difference from example 1 is that the selected plug hole ink viscosity is 530dpa.s/25 ℃ and the thixotropic TI value is greater than 4.5. Specifically, the via ink is DB 1.
Comparative example 2
The difference from example 1 is that the selected plug hole ink viscosity is 120dpa.s/25 ℃ and the thixotropic TI value is greater than 4.5. Specifically, the via ink is DB 2.
Comparative example 3
The difference from example 1 is that the selected plug hole ink viscosity is 210dpa.s/25 ℃ and the thixotropic TI value is less than 4.5. Specifically, the via ink is DB 3.
Comparative example 4
The difference from example 1 is that the conveying speed of the conveyor belt is 0.25m/s and the rotating speed of the lower roller is 20 r/min.
Comparative example 5
The difference from example 1 is that the conveying speed of the belt was 0.05m/s and the rotating speed of the lower rollers was 35 r/min.
Comparative example 6
The difference from example 1 is that the temperature of the lower roll is 45 ℃.
Comparative example 7
The difference from example 1 is that the temperature of the lower roll is 15 ℃.
Comparative example 8
The difference from example 1 is that the temperature of the upper roller is higher than 40 ℃.
The plugging effect was tested by plugging operation according to examples 1 to 3 and comparative examples 1 to 8 on a plate having a plate thickness of 4.4mm and a height to thickness ratio (AR 11: 1) of 0.40mm in pore diameter.
The results of examples 1 to 3 are shown in Table 2 below. Fig. 7-8 are schematic views showing the effect of the embodiment 1 after plugging.
TABLE 2 jack plugging performance results table for examples 1-3
The results of comparative examples 1 to 8 are shown in Table 3 below.
TABLE 3 Table of jack plugging results for comparative examples 1-8
As can be seen from tables 2-3, the embodiment 1-3 of the present invention can achieve the effect of one-time full plugging and continuous plugging when plugging the circuit board; this effect was not achieved in any of comparative examples 1 to 8.
The above description is provided only for the purpose of illustration of the present invention, and is not intended to limit the scope of the present invention.
Claims (10)
1. The disposable full continuous hole plugging device is characterized by comprising a conveyor belt, an upper roller, a lower roller, a hole plugging ink storage tank and a liquid circulating cooling device; the upper roller is positioned above the lower roller; the conveying belt is positioned between the upper roller and the lower roller and is provided with a die hole for accommodating the circuit board; the lower roller is transversely arranged above the plug hole ink storage groove, and the lower end of the lower roller body is positioned in the plug hole ink storage groove; a cavity is arranged in the lower roller and is connected with a liquid circulating cooling device; the outer side of the cylinder body is provided with a sticky layer.
2. The device for filling continuous disposable plugs according to claim 1, further comprising an external power source connected to the lower roller; the lower roller is provided with a first bearing at the center, and an external power supply drives the lower roller to operate through the first bearing.
3. The device for filling continuous disposable plugs according to claim 2, wherein the upper roller is provided with a cavity inside, and the cavity is connected with a liquid circulation cooling device.
4. The device as claimed in claim 3, further comprising a pair of fixing frames fixedly connected to both ends of the receptacle ink storage tank.
5. The device for filling a continuous plug hole in a disposable manner according to claim 4, wherein a plurality of clamping grooves including a first clamping groove and a second clamping groove are vertically arranged on the fixing frame, and the lower roller is fixed on the fixing frame in a nesting manner through a first bearing and the first clamping groove; and a second bearing is arranged at the center of the upper roller, and the upper roller is fixed on the fixing frame in an embedded manner through the second bearing and the second clamping groove.
6. Method for the single full continuous plugging of a hole, using the device according to any one of claims 1 to 5, characterized in that it comprises the following steps:
adding the hole plugging ink into the hole plugging ink storage tank;
placing the circuit board to be plugged on the conveyer belt;
the upper roller is contacted with the circuit board to be plugged, the lower roller rotates, and the sticky plugging ink is plugged into the circuit board to be plugged to complete plugging;
the viscosity of the hole plugging ink is 200-400dpa.s/25 ℃, and the thixotropy TI value is more than 4.5;
the conveying speed of the conveyor belt is 0.05-0.2 m/s;
the rotating speed of the lower roller is 5-20r/min, and the operating temperature is 20-40 ℃.
7. The method for filling the holes continuously at one time according to claim 6, wherein the ink for filling the holes comprises the following components in parts by weight: 20-30 parts of epoxy resin, 10-20 parts of glycidyl reactive diluent, 2-4 parts of latent curing agent, 0.01-0.3 part of defoaming agent and 50-60 parts of modified powder;
the epoxy resin is a mixture of at least two of bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin and polyfunctional epoxy resin;
the glycidyl reactive diluent is a mixture of at least two of n-butyl glycidyl ether, 5-ethylhexyl glycidyl ether, butanediol diglycidyl ether, phenyl glycidyl ether, diglycidyl ether and polyethanol diglycidyl ether;
the latent curing agent is at least one of o-methylphenyl biguanide, 2-methylimidazole and derivatives thereof, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole and 2-undecylimidazole;
the modified powder comprises modified micron-level powder and modified nano-level powder, and the mass ratio of the modified micron-level powder to the modified nano-level powder is (7-15): 1; the micron-sized powder is one or a mixture of two of siliceous micropowder, aluminum hydroxide powder, calcium carbonate powder, fly ash, glass fiber, carbon nano tube and kaolin, and the nanometer-sized powder is one or a mixture of two of siliceous micropowder, aluminum hydroxide powder, calcium carbonate powder, fly ash, glass fiber, carbon nano tube and kaolin.
8. The method for plugging a continuous hole in a disposable manner according to claim 7, wherein the epoxy resin is a mixture of bisphenol A epoxy resin and polyfunctional epoxy resin epoxidized m-xylylenediamine, and the mass ratio of bisphenol A epoxy resin to polyfunctional epoxy resin epoxidized m-xylylenediamine is 3 to 6: 1;
the glycidyl reactive diluent is a mixture of butanediol diglycidyl ether and phenyl glycidyl ether, and the mass ratio of the butanediol diglycidyl ether to the phenyl glycidyl ether is 2-3: 1.
9. the method for filling a hole in a disposable full continuous manner as claimed in claim 7, wherein the micron-sized powder has a particle size of 1 to 20 μm; the modified micron-sized powder is modified by a coupling reaction between the micron-sized powder and a coupling agent by a self-drying method, wherein the coupling agent is selected from one or a mixture of two of a silane coupling agent and a titanate coupling agent, and the coupling agent accounts for 0.5-1.0% of the mass of the micron-sized powder;
the grain diameter of the nano-scale powder is 1-100 nm; the modified nano-powder is modified by a coupling reaction between the nano-powder and a coupling agent by a self-drying method, wherein the coupling agent is one or a mixture of two of a silane coupling agent and a titanate coupling agent, and the mass of the coupling agent is 1.0-1.5% of that of the nano-powder.
10. The method for plugging a hole in a continuous manner at one time according to claim 7, wherein the defoaming agent is at least one of a silicone type defoaming agent, a polyether type defoaming agent, and polyether modified silicon.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210788098.6A CN114885507B (en) | 2022-07-06 | 2022-07-06 | Disposable full continuous hole plugging device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210788098.6A CN114885507B (en) | 2022-07-06 | 2022-07-06 | Disposable full continuous hole plugging device and method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114885507A true CN114885507A (en) | 2022-08-09 |
| CN114885507B CN114885507B (en) | 2022-09-27 |
Family
ID=82683404
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210788098.6A Active CN114885507B (en) | 2022-07-06 | 2022-07-06 | Disposable full continuous hole plugging device and method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114885507B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115181450A (en) * | 2022-09-08 | 2022-10-14 | 深圳市板明科技股份有限公司 | Aluminum substrate hole plugging resin ink and ink hole plugging method |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08316642A (en) * | 1995-05-19 | 1996-11-29 | Toagosei Co Ltd | Multilayer printed wiring board with interstitial via hole |
| JPH09331135A (en) * | 1996-06-12 | 1997-12-22 | Wako Denshi Kk | Method and device for filling through-hole of printed board |
| EP1302247A1 (en) * | 2001-10-11 | 2003-04-16 | G.I.T. Co., Ltd. | Device for plugging holes in printed circuit boards |
| CN104371419A (en) * | 2014-11-20 | 2015-02-25 | 深圳市板明科技有限公司 | Nanometer calcium carbonate composite resin-based taphole printing ink and preparation method thereof |
| CN212499384U (en) * | 2020-05-29 | 2021-02-09 | 瓦房店大森纸业有限公司 | Detachable printing roller based on paper printing machine |
| CN114710886A (en) * | 2022-06-02 | 2022-07-05 | 深圳市板明科技股份有限公司 | Ink hole plugging method for high-heat-conductivity PCB |
-
2022
- 2022-07-06 CN CN202210788098.6A patent/CN114885507B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08316642A (en) * | 1995-05-19 | 1996-11-29 | Toagosei Co Ltd | Multilayer printed wiring board with interstitial via hole |
| JPH09331135A (en) * | 1996-06-12 | 1997-12-22 | Wako Denshi Kk | Method and device for filling through-hole of printed board |
| EP1302247A1 (en) * | 2001-10-11 | 2003-04-16 | G.I.T. Co., Ltd. | Device for plugging holes in printed circuit boards |
| CN104371419A (en) * | 2014-11-20 | 2015-02-25 | 深圳市板明科技有限公司 | Nanometer calcium carbonate composite resin-based taphole printing ink and preparation method thereof |
| CN212499384U (en) * | 2020-05-29 | 2021-02-09 | 瓦房店大森纸业有限公司 | Detachable printing roller based on paper printing machine |
| CN114710886A (en) * | 2022-06-02 | 2022-07-05 | 深圳市板明科技股份有限公司 | Ink hole plugging method for high-heat-conductivity PCB |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115181450A (en) * | 2022-09-08 | 2022-10-14 | 深圳市板明科技股份有限公司 | Aluminum substrate hole plugging resin ink and ink hole plugging method |
| CN115181450B (en) * | 2022-09-08 | 2022-11-25 | 深圳市板明科技股份有限公司 | Aluminum substrate hole plugging resin ink and ink hole plugging method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114885507B (en) | 2022-09-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN114885507B (en) | Disposable full continuous hole plugging device and method | |
| CN207973212U (en) | A kind of binary channels send trigger | |
| WO2020164595A1 (en) | Apparatus for filling wafer with glass powder | |
| CN106811173A (en) | Aluminum-based copper-clad plate silk-screen insulating cement and screen printing method | |
| CN114248535A (en) | Automatic silk screen printing coating film former | |
| CN213824504U (en) | High-speed high frequency PCB copper-clad plate preparation is with mixing mucilage binding and is put | |
| CN204414765U (en) | A kind of silicon chip silk-screen printing device | |
| CN211808477U (en) | Color printing equipment capable of improving ink jet uniformity | |
| CN212147982U (en) | High-efficient paper products printing drying device | |
| CN209999894U (en) | multifunctional printing equipment for label production | |
| CN214881147U (en) | Cooling equipment of glass doubling equipment | |
| JP2022152090A (en) | Aqueous dispersion, method for producing aqueous dispersion, method for producing laminate, and method for producing impregnated woven fabric | |
| CN216001858U (en) | Green environmental protection printing ink cooling treatment device | |
| CN206089874U (en) | Electroplating device of firm centre gripping PCB board | |
| CN115739540B (en) | Resistor piece dip-coating equipment and insulation treatment method of resistor piece | |
| CN205323759U (en) | Fast speed control temperature filter equipment | |
| CN220811846U (en) | Complete development equipment for 3D resin artware | |
| CN114161820B (en) | Fine ceramic surface printing equipment | |
| CN216367696U (en) | Solid epoxy melting and mixing device | |
| CN218536050U (en) | Playing card printing glazing structure | |
| CN214111857U (en) | Hot-pressing cooling equipment for plate processing | |
| CN207756429U (en) | A kind of automatic dispensing machine and its conveying device | |
| CN106543958A (en) | Aluminum-based copper-clad plate insulating cement and rolling process | |
| CN213825569U (en) | Printing ink spraying equipment for paperboard processing | |
| CN117377224B (en) | Manufacturing device of double-sided PCB circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |