CN114883805A - Miniaturized antenna unit with front-to-back ratio suppression and array thereof - Google Patents
Miniaturized antenna unit with front-to-back ratio suppression and array thereof Download PDFInfo
- Publication number
- CN114883805A CN114883805A CN202210801512.2A CN202210801512A CN114883805A CN 114883805 A CN114883805 A CN 114883805A CN 202210801512 A CN202210801512 A CN 202210801512A CN 114883805 A CN114883805 A CN 114883805A
- Authority
- CN
- China
- Prior art keywords
- metal
- antenna
- short
- coupling
- radiation patch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
- H01Q9/0414—Substantially flat resonant element parallel to ground plane, e.g. patch antenna in a stacked or folded configuration
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/48—Earthing means; Earth screens; Counterpoises
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
- H01Q21/061—Two dimensional planar arrays
- H01Q21/065—Patch antenna array
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
- H01Q9/0421—Substantially flat resonant element parallel to ground plane, e.g. patch antenna with a shorting wall or a shorting pin at one end of the element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
- H01Q9/045—Substantially flat resonant element parallel to ground plane, e.g. patch antenna with particular feeding means
Landscapes
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Waveguide Aerials (AREA)
Abstract
The invention discloses a miniaturized antenna unit with front-to-back ratio suppression and an array thereof, wherein the antenna unit comprises: a first metal layer, a second metal layer and a third metal layer which are arranged from top to bottom at intervals in sequence; the first metal layer comprises a radiation patch and a microstrip feed line, and a short circuit metal wall is formed at the edge of the top of the radiation patch; the second metal layer comprises a first coupling metal sheet and a second coupling metal sheet, the first coupling metal sheet and the second coupling metal sheet are arranged at the open end of the radiation patch, and parts of the first coupling metal sheet and the second coupling metal sheet extend into the position right below the radiation patch; the third metal layer is a metal floor, a short-circuit metal wall, a microstrip feed line, a first coupling metal sheet and a second coupling metal sheetThe two coupling metal sheets are respectively connected with the metal floor, and the radiation patch works in TM 01 The mode, resonates at a quarter wavelength dimension of the center frequency. The antenna has high front-to-back ratio and is more beneficial to realizing the miniaturization design of the antenna.
Description
Technical Field
The invention relates to the technical field of microwave communication, in particular to a miniaturized antenna unit with front-to-back ratio suppression and an array thereof.
Background
With the advent of the 5G era, MIMO (multiple input multiple output) technology and millimeter wave technology, the internal space of consumer products is becoming more and more popular, and the conventional half-wave resonant patch antenna is difficult to meet the size requirement, so that the planar inverted F antenna with small area, low profile, simple structure and easy processing is often used as a classical choice for solving the problems of such products.
In recent years, a great number of researchers at home and abroad make a great deal of intensive research on planar inverted-F antennas. Some documents indicate that, based on the conventional antenna structure, the antenna can resonate under a quarter-wavelength size through short-circuit wall loading, and therefore, the aperture of the antenna can be reduced by one time, but on one hand, the width of the structure is wide, and the overall structure cannot meet increasingly strict size restrictions of terminal equipment, and on the other hand, the structure feeding mode is coaxial feeding, and the feeding structure and the radiation patch are not in the same layer plane, and are not suitable for a multilayer substrate in actual industrial processing.
In order to further reduce the size of the planar inverted F antenna, various miniaturization techniques have been developed. The first is the application of high dielectric constant materials. The planar inverted F antenna is one of planar antennas, and its operating wavelength is inversely proportional to the dielectric constant. For example, there is a document indicating that by using a high dielectric constant low temperature co-fired ceramic (dielectric constant 100) as a substrate, the antenna area can be reduced to 20% of that when using a conventional material as a substrate. However, the solution of the high dielectric constant medium is not perfect, it excites strong surface waves to increase the antenna loss and reduce the antenna bandwidth, and the material cost is too high to be applied in practical industrial production. Another common miniaturization concept is meander technology, for example, some documents provide a design that a bent structure is added at the tail of a planar inverted-F antenna, and a current path is divided by narrow slots arranged in a staggered manner so as to flow along the slot edges, thereby achieving the effects of increasing the length of the current path, further increasing the equivalent electrical size of the antenna, and reducing the resonant frequency. The antenna can operate at one-eighth wavelength dimensions with this design. However, the meander technology disturbs the normal surface current distribution of the antenna, which makes the antenna more complex and difficult to predict, and has the problem of uncontrollable directional pattern. And finally, a loading technology is adopted, and the size of the planar inverted-F antenna can be obviously reduced by loading an inductive element at the short-circuit end of the planar inverted-F antenna or loading a capacitive element at the open-circuit end of the planar inverted-F antenna. These inductive and capacitive elements can be lumped elements or distributed elements, which are distinguished by their high accuracy but introduce additional losses, and by their low losses but relatively complex tuning of the element dimensions. In addition, the miniaturized microstrip antenna based on the loading technology faces the problem of difficult impedance matching. The method for solving the impedance matching problem mainly comprises two modes of capacitive coupling feed and short-circuit pin loading. Some documents adopt capacitive coupling feed to improve the working bandwidth of the patch while ensuring impedance matching, but in order to ensure the coupling strength, a surface coupling mode is often adopted, and a coupling capacitor plate needing feed is positioned right below the radiation patch, so that a feed structure and the radiation patch are inevitably positioned on different planes, and the processing difficulty is increased, so that the patch is not suitable for practical application. The principle of the short-circuit nail loading is to use the short-circuit nail to introduce a current zero to disturb the current distribution on the surface of the patch so as to adjust the impedance matching, but the literature also indicates that the short-circuit nail loading in the radiation patch can increase the resonant frequency, which is not beneficial to realizing miniaturization.
Finally, the planar inverted-F antenna which is sought to be miniaturized is loaded on the basis of a single short-circuit pin, the electrical size of the planar inverted-F antenna is proportional to the sum of the length and the width of the plane of the antenna, so that the front-to-back ratio of the planar inverted-F antenna is not ideal, in the application of the sensor, the antenna and other devices can be interfered with each other due to the poor front-to-back ratio, and the detection accuracy is reduced. In view of the above, there is a need to provide further improvement on the structure of the present planar inverted F antenna.
Disclosure of Invention
To solve at least one of the above problems, it is a primary object of the present invention to provide a miniaturized antenna unit and an array thereof with front-to-back ratio suppression.
In order to achieve the purpose, the invention adopts a technical scheme that: provided is a miniaturized antenna unit with front-to-back ratio suppression, comprising: a first metal layer, a second metal layer and a third metal layer which are arranged from top to bottom at intervals in sequence;
the first metal layer comprises a radiation patch and a microstrip feed line connected with the radiation patch, and a short-circuit metal wall used for constructing a voltage zero point is formed at the edge of the top of the radiation patch;
the second metal layer comprises a first coupling metal sheet and a second coupling metal sheet, the first coupling metal sheet and the second coupling metal sheet are arranged at the open end of the radiation patch, and parts of the first coupling metal sheet and the second coupling metal sheet extend into the position right below the radiation patch;
the third metal layer is a metal floor, the short circuit metal wall, the microstrip feed line, the first coupling metal sheet and the second coupling metal sheet are respectively connected with the metal floor, and the radiation patch works in TM 01 The mode, resonates at a quarter wavelength dimension of the center frequency.
The radiation patch is characterized by further comprising a plurality of first short circuit metal columns, one ends of the first short circuit metal columns penetrate through the radiation patch and are close to the edge of the radiation patch to form the short circuit metal wall, and the other ends of the first short circuit metal columns are connected with the metal floor respectively.
The microstrip grounding structure further comprises a second short-circuit metal column, wherein one end of the second short-circuit metal column is connected with the microstrip feed line, and the other end of the second short-circuit metal column is connected with the metal floor.
The metal floor board comprises a first coupling metal sheet and a second coupling metal sheet, and is characterized by further comprising two third short-circuit metal columns, wherein one ends of the two third short-circuit metal columns are respectively connected with the first coupling metal sheet and the second coupling metal sheet, and the other ends of the two third short-circuit metal columns are connected with the metal floor board.
The metal-clad laminate further comprises a first dielectric substrate and a second dielectric substrate, wherein the first dielectric substrate is located between the first metal layer and the second metal layer, the second dielectric substrate is located between the second metal layer and the third metal layer, and the first short-circuit metal column, the second short-circuit metal column and the third short-circuit metal column penetrate through the first dielectric substrate and the second dielectric substrate.
Wherein, a plurality of the first short circuit metal posts are distributed along the X-axis direction of the radiation patch at equal intervals.
The radiation patch is provided with a first cutting angle at the overlapping position of the first coupling metal sheet, the radiation patch is provided with a second cutting angle at the overlapping position of the second coupling metal sheet, and the first cutting angle is symmetrical to the second cutting angle.
One end of the microstrip feeder line is connected with the middle point position of the radiation patch along the X-axis direction, and the other end of the microstrip feeder line is externally connected with a power supply for excitation.
In order to achieve the purpose, the invention adopts another technical scheme that: the antenna receiving unit is in mirror symmetry with the antenna transmitting unit, the antenna receiving unit is connected with the radio frequency chip through a radio frequency chip receiving end bonding pad, the antenna transmitting unit is connected with the radio frequency chip through a radio frequency chip transmitting end bonding pad, and the antenna receiving unit and the antenna transmitting unit are both the miniaturized antenna unit with the front-to-back ratio suppression.
And a plurality of short-circuit metal columns are arranged around the edge of the upper-layer metal floor close to the dielectric substrate.
The technical scheme of the invention adopts that the edge of the top of the radiation patch is provided with the short circuit metal wall, and the edge of the short circuit metal wall loaded on the top of the radiation patch does not radiate signals, so that the short circuit metal wall can be arranged close to the edge of the metal floor, the space utilization rate of the radiation patch can be improved, and the radiation patch has higher front-to-back ratio; meanwhile, the first coupling metal sheet and the second coupling metal sheet are respectively introduced under two corners of the bottom of the open end of the radiation patch, so that larger capacitive components can be introduced in a smaller area, the resonant frequency of the antenna unit can be reduced, the performance of the antenna unit is improved, and the miniaturization design of the antenna unit is realized.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a top view of an antenna unit according to an embodiment of the present invention;
fig. 2 is a side view of an antenna unit according to an embodiment of the present invention;
fig. 3 is a front view of an antenna unit according to an embodiment of the present invention;
fig. 4 is a current diagram of the surface of a radiating patch in a PIFA antenna array in the related art;
fig. 5 is a current diagram of the surface of a radiating patch in an antenna unit according to an embodiment of the present invention;
fig. 6 is a front view of the overall structure of an antenna array according to an embodiment of the present invention;
fig. 7 is a graph of reflection coefficients for two excitation ports of the antenna array of the present invention;
fig. 8 is a graph of the isolation of two excitation ports of the antenna array of the present invention;
fig. 9 is a normalized radiation pattern of the transmitting and receiving antennas in the antenna array of the present invention;
fig. 10 is a graph comparing the normalized radiation directions of the antenna array of the present invention and the PIFA antenna of the related art.
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the description of the invention relating to "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying any relative importance or implicit indication of the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
In contrast to the problem that the front-back ratio of a miniaturized planar inverted-F antenna in the related art is poor, which affects the performance of the antenna, the present embodiment provides a miniaturized antenna unit with front-back ratio suppression, which aims to improve the front-back ratio of the antenna unit and meet the requirement of miniaturized design. The detailed structure of the miniaturized antenna unit with front-to-back ratio suppression refers to the following embodiments.
Referring to fig. 1 to 3, fig. 1 is a top view of an antenna unit according to an embodiment of the present invention; fig. 2 is a side view of an antenna unit according to an embodiment of the present invention; fig. 3 is a front view of an antenna unit according to an embodiment of the present invention. In an embodiment of the present invention, the miniaturized antenna unit with front-to-back ratio suppression includes: a first metal layer, a second metal layer and a third metal layer which are arranged from top to bottom at intervals in sequence; the first metal layer comprises a radiation patch 1 and a microstrip feed line connected with the radiation patch 1, and the edge of the top of the radiation patch 1 is provided with a short-circuit metal wall for constructing an equivalent electric wall; the second metal layer comprises a first coupling metal sheet 2 and a second coupling metal sheet 7, the second metal layerA coupling metal sheet 2 and a second coupling metal sheet 7 are disposed at the open end of the radiation patch 1, and a part of the first coupling metal sheet 2 and a part of the second coupling metal sheet 7 both extend into the right lower part of the radiation patch 1; the third metal layer is a metal floor 10, and the short-circuit metal wall, the microstrip feed line 4, the first coupling metal sheet 2 and the second coupling metal sheet 7 are respectively connected with the metal floor 10. The central working frequency wavelength of the radiation patch 1 is lambda and works in TM 01 Mode, resonating at 1/4 λ size. The length of the radiation patch 1 in the y direction is 0.10 lambda-0.11 lambda, and the width in the x direction is 0.084 lambda-0.091 lambda. The length of the coupling metal sheet 2 and the second coupling metal sheet 7 is 0.049 lambda-0.050 lambda, the width of the coupling metal sheet is 0.010 lambda-0.011 lambda, and the length of the part extending into the radiation patch 1 is 0.028 lambda-0.029 lambda.
In this embodiment, set up the short circuit metal wall through the top edge of radiation paster 1, can increase radiation paster 1's space utilization, can solve the poor problem of the front and back comparison of plane inverted-F antenna, but the cost of above-mentioned structure is that antenna resonant frequency will rise, for this reason, this scheme is further at radiation paster 1's open end, first coupling sheetmetal 2 and second coupling sheetmetal 7 are added respectively under radiation paster 1's the bottom both corners, first coupling sheetmetal 2 and second coupling sheetmetal 7 all part stretch into radiation paster 1 and form equivalent capacitance with radiation paster 1, so, can introduce bigger capacitive component under the area of littleer, can reduce antenna element's resonant frequency, and then improve antenna element's performance.
In a specific embodiment, the antenna further comprises a plurality of first short-circuit metal columns (11, 12,13,14,15, 16), one end of each of the plurality of first short-circuit metal columns (11, 12,13,14,15, 16) penetrates through the radiation patch 1 and is close to the edge of the radiation patch 1 to form the short-circuit metal wall, and the other end of each of the plurality of first short-circuit metal columns (11, 12,13,14,15, 16) is connected to the metal floor 10. The plurality of first short metal posts (11, 12,13,14,15, 16) are arranged in a line shape, and the plurality of first short metal posts (11, 12,13,14,15, 16) have the same pitch with the edge of the radiation patch 1. The number of the first short-circuit metal columns (11, 12,13,14,15, 16) is specifically 6, the specific number of the first short-circuit metal columns (11, 12,13,14,15, 16) can be set according to actual requirements, and only a plurality of first short-circuit metals are required to be combined to equivalently form a short-circuit metal wall. Similarly, the principle of using a complete short-circuit metal wall instead of a short-circuit metal column is not different from the method. Specifically, a plurality of the first short metal posts (11, 12,13,14,15, 16) are equidistantly distributed along the X-axis direction of the radiation patch 1.
In a specific embodiment, the microstrip patch antenna further comprises a second short-circuit metal pillar 5, one end of the second short-circuit metal pillar 5 is connected with the microstrip feed line 4, and the other end of the second short-circuit metal pillar is connected with the metal floor 10. According to the scheme, the second short circuit metal column 5 is loaded on the microstrip feed line 4, so that impedance matching can be realized, the impedance matching problem after capacitive components are introduced can be avoided, and the use of coaxial feed can be avoided, so that the low profile of the overall design is ensured. The position of the second short circuit metal column 5 changes along with the change of the microstrip feed line length and the position of the excitation source, and the specific position is determined by depending on the impedance matching effect.
In a specific embodiment, the metal floor further includes three short-circuit metal posts (3,6), the number of the three short-circuit metal posts (3,6) is two, one end of each of the two third short-circuit metal posts (3,6) is connected to the first coupling metal sheet 2 and the second coupling metal sheet 7, and the other end is connected to the metal floor 10. The third short-circuit metal is intended to enable the first and second coupling metal pieces 2, 7 to be connected to the metal floor 10, respectively. In order to control the processing cost in the actual processing, the third short circuit metal posts (3,6) at the positions of the first coupling metal sheet 2 and the second coupling metal sheet 7 are designed into through holes penetrating through the whole structure, and the tail ends of the first coupling metal sheet 2 and the second coupling metal sheet 7 are stretched by a length to extend out of the position under the radiation patch 1, so that the completeness of the radiation patch 1 is not influenced by the through holes.
In addition, in practical applications, the first to third short-circuit metal posts (3,6) are all metal vias.
Specifically, the metal capacitor further comprises a first dielectric substrate 8 and a second dielectric substrate 9, wherein the first dielectric substrate 8 is located between the first metal layer and the second metal layer, the second dielectric substrate 9 is located between the second metal layer and the third metal layer, and the first short-circuit metal column (11, 12,13,14,15, 16), the second short-circuit metal column 5 and the third short-circuit metal column (3,6) all penetrate through the first dielectric substrate 8 and the second dielectric substrate 9. The first dielectric substrate 8 and the second dielectric substrate 9 are used to separate the first metal layer, the second metal layer and the third metal layer. The specific material of the first dielectric substrate 8 and the second dielectric substrate 9 can be selected according to practical requirements, and is not limited herein.
Specifically, a first chamfer angle is arranged at the overlapping position of the radiation patch 1 and the first coupling metal sheet 2, a second chamfer angle is arranged at the overlapping position of the radiation patch 1 and the second coupling metal sheet 7, and the first chamfer angle and the second chamfer angle are symmetrical. In order to improve the tolerance of the overall design to the error in actual processing, the overlapping part of the radiation patch 1 and the coupling metal sheet is subjected to corner cutting treatment, so that the radiation patch 1 is prevented from being influenced during drilling.
One end of the microstrip feed line 4 is connected with the middle point position of the radiation patch 1 along the X-axis direction, and the other end is externally connected with a power supply for excitation.
Referring to fig. 4 and 5, fig. 4 is a current diagram of a radiating patch surface of a PIFA antenna in the related art; fig. 5 is a surface current diagram of a radiating patch in an antenna unit according to an embodiment of the present invention. For miniaturization and cost considerations, the planar inverted-F antenna common in terminal design is loaded with a short-circuited metal post only at one corner of the patch, which represents a current distribution as shown in fig. 4. As can be seen from fig. 4, the surface current distribution is substantially diagonal, so that the resonant frequency thereof is related to the sum of the length and width of the radiating patch. The advantage of this is that the aperture area of the radiation patch is fully utilized, and the miniaturization degree of the radiation patch is high. But at the same time, the disadvantage is that because four sides of the radiation patch all participate in radiation, a larger square floor is needed to ensure that the front-to-back ratio of the antenna radiation is maintained in a reasonable range. In practical applications, the metal floor is often not square, and the antenna is not necessarily placed at the center, but is often required to be tightly attached to the edge of the circuit board, and usually, only enough distance between three edges of the metal floor and the edge of the floor can be ensured. If a planar inverted-F antenna loaded by a single short-circuit pin is still applied in this case, the radiation front-to-back ratio is deteriorated, and interference is inevitably introduced. In order to overcome the defects of a common planar inverted-F antenna in terminal design in practical application, the invention sets a short-circuit metal wall at the top of a radiation patch according to the principle, and specifically comprises the following steps: a more complete electrical wall is simulated by punching a row of first short-circuited metal studs (11, 12,13,14,15, 16) in the X-axis direction near the edge of the metal floor. This has the advantage that the edge of the radiating patch carrying the ideal electrical wall does not itself radiate a signal and can be placed close to the edge of the metal floor, solving the front-to-back ratio problem of the planar inverted-F antenna, with a current profile as shown in fig. 5.
Referring to fig. 6, fig. 6 is a front view of an overall structure of an antenna array according to an embodiment of the present invention. In the embodiment of the present invention, the antenna array includes an upper metal floor 100, a dielectric substrate 200, an antenna receiving unit 31, an antenna transmitting unit 32, and a radio frequency chip holder 35 for mounting a radio frequency chip, which are disposed on the dielectric substrate 200, where the antenna receiving unit 31 and the antenna transmitting unit 32 are mirror-symmetric, the antenna receiving unit 31 is connected to the radio frequency chip through a radio frequency chip receiving end pad 33, the antenna transmitting unit 32 is connected to the radio frequency chip through a radio frequency chip transmitting end pad 34, and both the antenna receiving unit 31 and the antenna transmitting unit 32 are the above-mentioned miniaturized antenna unit with front-to-back ratio suppression. For a specific structure of the miniaturized antenna unit with front-to-back ratio suppression, please refer to the above-mentioned embodiments, and further description thereof is omitted. Since the antenna array of the present embodiment employs the above-described miniaturized antenna unit with front-to-back ratio suppression, all the advantages and effects of the miniaturized antenna unit with front-to-back ratio suppression are achieved.
Specifically, the antenna receiving unit 31 and the antenna transmitting unit 32 are mirror-symmetric with respect to the dielectric substrate 200. The rf chip receiving terminal pad 33 and the rf chip transmitting terminal pad 34 may be symmetrically arranged or asymmetrically arranged, and the specific arrangement may be made according to actual requirements. When the rf chip receiving terminal pad 33 and the rf chip transmitting terminal pad 34 are symmetrically disposed, the patterns of the antenna receiving unit 31 and the antenna transmitting unit 32 have good consistency. When the rf chip receiving terminal pad 33 and the rf chip transmitting terminal pad 34 are asymmetrically arranged (at this time, the lengths of the microstrip feed lines 4 of the two are different), compared with the design of simply connecting the radiating patch and the pad through a turn, the antenna transmitting unit 32 is moved up on the feed line in the x-axis direction and a turn is added, so as to maintain the design of being on the same horizontal line with the microstrip feed line 4 of the antenna receiving unit 31, and thus, the symmetry of the transmitting and receiving direction patterns can be improved. Meanwhile, because the lengths of the microstrip feed lines 4 on the two sides are different, compared with the antenna receiving unit 31, the short-circuit metal column of the antenna transmitting unit 32 needs to move a distance to the positive direction of the x axis, so that the matching of the antenna transmitting unit 32 can be ensured.
Further, a plurality of short circuit metal posts 101 are arranged around the edge of the upper metal floor 100 close to the dielectric substrate 200. The plurality of short-circuit metal posts 101 are uniformly and alternately distributed, and play a role in isolating high-frequency signals.
Referring to fig. 7 and 8, fig. 7 is a reflection coefficient curve of two excitation ports of the antenna array of the present invention; fig. 8 is a graph of the isolation between two excitation ports of the antenna array of the present invention. As can be seen from the curves S11 and S22 in fig. 7, the operating frequencies of the two radiating patches substantially coincide, and the center operating frequency is 10.52 GHz. As can be seen from the S12 curve in FIG. 8, the isolation between the transmitting antenna and the receiving antenna reaches-27.8 dB, and the isolation is better.
Referring to fig. 9 and 10, fig. 9 is a normalized radiation pattern of the transmitting antenna and the receiving antenna in the antenna array of the present invention; fig. 10 is a graph comparing the normalized radiation directions of the antenna array of the present invention and the PIFA antenna of the related art. Fig. 9 shows the normalized radiation pattern of the transmitting antenna and the receiving antenna in the present scheme when Phi = 90 deg, and it can be seen from fig. 9 that the coverage areas of the transmitting antenna and the receiving antenna are in a symmetrical relationship, and the combination of the two can ensure the signal coverage of plus and minus 50 deg in front of the antenna, and the pattern is uniform and regular, which is beneficial to setting the trigger threshold in applications such as sensors, and the coverage area can be flexibly adjusted according to requirements in practical applications. Fig. 10 shows a directional diagram comparison of the antenna of the present design with a conventional planar inverted F antenna (PIFA antenna) loaded with a single short-circuit pin when Phi = 0 deg, and as can be seen from fig. 10, the forward normalized gain of the present scheme is 0 dB, the backward normalized gain is-6 dB, and the front-to-back ratio is 6 dB, compared with the planar inverted F antenna loaded with a single short-circuit pin, the front-to-back ratio is greatly improved, which is increased by 4.02 dB, and the interference caused by backward components is effectively reduced.
In summary, the miniaturized antenna with front-to-back ratio suppression proposed in this patent is applied to a miniaturized high-front-to-back ratio antenna of a sensor, has advantages of small size and high front-to-back ratio, and is applicable to various practical products. For example, it can be applied to various smart home product sensors as a radiation antenna. Due to its advantage of small size, the overall size of the sensor can be significantly reduced. Meanwhile, due to the characteristic of front-to-back ratio suppression, the sensor can be placed close to the edge of the sensor circuit board, and the interaction with other elements behind the sensor is not needed to be worried about, so that a false alarm is caused, and the design difficulty of the whole sensor is reduced.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents made by the contents of the specification and drawings or directly/indirectly applied to other related technical fields within the spirit of the present invention are included in the scope of the present invention.
Claims (10)
1. A miniaturized antenna unit with front-to-back ratio suppression, comprising: a first metal layer, a second metal layer and a third metal layer which are arranged from top to bottom at intervals in sequence;
the first metal layer comprises a radiation patch and a microstrip feed line connected with the radiation patch, and the edge of the top of the radiation patch is provided with a short-circuit metal wall for constructing an equivalent electric wall;
the second metal layer comprises a first coupling metal sheet and a second coupling metal sheet, the first coupling metal sheet and the second coupling metal sheet are arranged at the open end of the radiation patch, and parts of the first coupling metal sheet and the second coupling metal sheet extend into the position right below the radiation patch;
the third metal layer is a metal floor, the short circuit metal wall, the microstrip feed line, the first coupling metal sheet and the second coupling metal sheet are respectively connected with the metal floor, and the radiation patch works in TM 01 The mode, resonates at a quarter wavelength dimension of the center frequency.
2. The miniaturized antenna unit with front-to-back ratio suppression of claim 1, further comprising a plurality of first short-circuit metal posts, wherein one end of each of the plurality of first short-circuit metal posts penetrates through the radiation patch and is close to the edge of the radiation patch to form the short-circuit metal wall, and the other end of each of the plurality of first short-circuit metal posts is connected to the metal floor.
3. A miniaturized antenna unit with front-to-back ratio suppression as claimed in claim 2, further comprising a second short-circuited metal stub having one end connected to said microstrip feed line and the other end connected to said metal ground.
4. A miniaturized antenna unit having front-to-back ratio suppression as claimed in claim 3, further comprising three short-circuited metal posts, two of said third short-circuited metal posts being connected at one end to said first and second coupling metal pieces, respectively, and at the other end to said metal ground plate.
5. The miniaturized antenna unit with front-to-back ratio suppression of claim 4, further comprising a first dielectric substrate and a second dielectric substrate, wherein the first dielectric substrate is located between the first metal layer and the second metal layer, the second dielectric substrate is located between the second metal layer and the third metal layer, and the first short-circuit metal stud, the second short-circuit metal stud and the third short-circuit metal stud all penetrate through the first dielectric substrate and the second dielectric substrate.
6. A miniaturized antenna unit with front-to-back ratio suppression as claimed in any one of the claims 2 to 5, characterized in that a plurality of said first short-circuited metal studs are equally distributed in the X-axis direction of said radiating patch.
7. The miniaturized antenna unit with front-to-back ratio suppression of claim 6, wherein a position where the radiation patch overlaps the first coupling metal piece is provided with a first chamfer, a position where the radiation patch overlaps the second coupling metal piece is provided with a second chamfer, and the first chamfer is symmetrical to the second chamfer.
8. The miniaturized antenna unit with front-to-back ratio suppression of claim 6, wherein one end of said microstrip feed line is connected to a midpoint position of said radiating patch in the X-axis direction, and the other end is externally connected to a power supply for excitation.
9. An antenna array is characterized by comprising an upper metal floor, a dielectric substrate, an antenna receiving unit, an antenna transmitting unit and a radio frequency chip holder, wherein the antenna receiving unit, the antenna transmitting unit and the radio frequency chip holder are arranged on the dielectric substrate, the antenna receiving unit and the antenna transmitting unit are in mirror symmetry, the antenna receiving unit is connected with a radio frequency chip through a radio frequency chip receiving end bonding pad, the antenna transmitting unit is connected with the radio frequency chip through a radio frequency chip transmitting end bonding pad, and the antenna receiving unit and the antenna transmitting unit are the miniaturized antenna unit with front-to-back ratio suppression function in any one of claims 1 to 8.
10. An antenna array according to claim 9 wherein the upper metal floor is surrounded by a plurality of shorting metal posts near the edge of the dielectric substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210801512.2A CN114883805B (en) | 2022-07-08 | 2022-07-08 | Miniaturized antenna unit with front-to-back ratio suppression and array thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210801512.2A CN114883805B (en) | 2022-07-08 | 2022-07-08 | Miniaturized antenna unit with front-to-back ratio suppression and array thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114883805A true CN114883805A (en) | 2022-08-09 |
| CN114883805B CN114883805B (en) | 2022-09-30 |
Family
ID=82683659
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210801512.2A Active CN114883805B (en) | 2022-07-08 | 2022-07-08 | Miniaturized antenna unit with front-to-back ratio suppression and array thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114883805B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060145927A1 (en) * | 2004-12-08 | 2006-07-06 | Won-Kyu Choi | PIFA and RFID tag using the same |
| CN201072805Y (en) * | 2007-03-13 | 2008-06-11 | 中兴通讯股份有限公司 | Double-frequency broadband printing antenna |
| WO2018119944A1 (en) * | 2016-12-29 | 2018-07-05 | 深圳天珑无线科技有限公司 | Multi-input multi-output antenna system and mobile terminal |
| CN109742524A (en) * | 2018-12-28 | 2019-05-10 | 中山大学 | A kind of directed microstrip antenna |
| CN113131195A (en) * | 2019-12-31 | 2021-07-16 | 华为技术有限公司 | Antenna and communication equipment |
| CN113193371A (en) * | 2021-04-30 | 2021-07-30 | 西安电子科技大学 | Miniaturized high-isolation circularly polarized diversity antenna based on dual-mode resonance |
| TW202131551A (en) * | 2020-02-12 | 2021-08-16 | 和碩聯合科技股份有限公司 | Antenna structure |
-
2022
- 2022-07-08 CN CN202210801512.2A patent/CN114883805B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060145927A1 (en) * | 2004-12-08 | 2006-07-06 | Won-Kyu Choi | PIFA and RFID tag using the same |
| CN201072805Y (en) * | 2007-03-13 | 2008-06-11 | 中兴通讯股份有限公司 | Double-frequency broadband printing antenna |
| WO2018119944A1 (en) * | 2016-12-29 | 2018-07-05 | 深圳天珑无线科技有限公司 | Multi-input multi-output antenna system and mobile terminal |
| CN109742524A (en) * | 2018-12-28 | 2019-05-10 | 中山大学 | A kind of directed microstrip antenna |
| CN113131195A (en) * | 2019-12-31 | 2021-07-16 | 华为技术有限公司 | Antenna and communication equipment |
| TW202131551A (en) * | 2020-02-12 | 2021-08-16 | 和碩聯合科技股份有限公司 | Antenna structure |
| CN113193371A (en) * | 2021-04-30 | 2021-07-30 | 西安电子科技大学 | Miniaturized high-isolation circularly polarized diversity antenna based on dual-mode resonance |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114883805B (en) | 2022-09-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4443802A (en) | Stripline fed hybrid slot antenna | |
| US6734828B2 (en) | Dual band planar high-frequency antenna | |
| US6492947B2 (en) | Stripline fed aperture coupled microstrip antenna | |
| US10312601B2 (en) | Combination antenna element and antenna array | |
| US3803623A (en) | Microstrip antenna | |
| US6369762B1 (en) | Flat antenna for circularly-polarized wave | |
| CN103972658B (en) | The double-circle polarization microstrip antenna of wideband wide scan | |
| US11276940B2 (en) | Waveguide slot array antenna | |
| KR102430247B1 (en) | Capacitive coupled comb-line microstrip array antenna | |
| JP4364439B2 (en) | antenna | |
| JP2002359515A (en) | M-shaped antenna apparatus | |
| US20230020807A1 (en) | Antenna, Antenna Module, And Wireless Network Device | |
| CN114824779B (en) | Single-layer low-profile broadband dual-polarized patch antenna | |
| CN114883805B (en) | Miniaturized antenna unit with front-to-back ratio suppression and array thereof | |
| US20220224017A1 (en) | Capacitive-coupled comb-line microstrip array antenna and method of manufacturing the same | |
| US11710904B2 (en) | Cavity backed antenna with in-cavity resonators | |
| CN109586014A (en) | A kind of monopole antenna that open rectangle is intracavitary | |
| KR100286005B1 (en) | Microstrip dipole antenna array | |
| US10826184B2 (en) | Unbalanced slot aperture (USA) radiator | |
| CN220797105U (en) | Antenna unit and communication equipment | |
| CN217468794U (en) | Antenna structure | |
| CN215896721U (en) | Electromagnetic dipole dielectric resonator antenna and communication equipment | |
| JPH05110334A (en) | Loop antenna for electromagnetic field coupling type circularly polarized wave | |
| WO2024061154A1 (en) | Antenna unit, antenna array, and communication device | |
| US20230420851A1 (en) | Antenna device and communication device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230323 Address after: 518000 Building A2, Building A1A2, China Merchants Guangming Science Park, Fenghuang Community Sightseeing Road, Fenghuang Street, Guangming District, Nanshan District, Shenzhen, Guangdong Province 315 Patentee after: Shenzhen Dianmu Technology Co.,Ltd. Address before: 518060 No. 3688 Nanhai Road, Shenzhen, Guangdong, Nanshan District Patentee before: SHENZHEN University |
|
| TR01 | Transfer of patent right |