CN114883049A - 3D prints high Nb field 3 Sn precursor wire manufacturing method - Google Patents
3D prints high Nb field 3 Sn precursor wire manufacturing method Download PDFInfo
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- CN114883049A CN114883049A CN202210564074.2A CN202210564074A CN114883049A CN 114883049 A CN114883049 A CN 114883049A CN 202210564074 A CN202210564074 A CN 202210564074A CN 114883049 A CN114883049 A CN 114883049A
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- oxygen
- free copper
- rod
- honeycomb structure
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- 239000002243 precursor Substances 0.000 title claims abstract description 21
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 53
- 239000010949 copper Substances 0.000 claims abstract description 50
- 239000002131 composite material Substances 0.000 claims abstract description 46
- 229910052802 copper Inorganic materials 0.000 claims abstract description 45
- 238000010146 3D printing Methods 0.000 claims abstract description 16
- 239000000463 material Substances 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 13
- 238000012545 processing Methods 0.000 claims abstract description 12
- 238000005553 drilling Methods 0.000 claims abstract description 10
- 239000010955 niobium Substances 0.000 claims description 44
- 238000010894 electron beam technology Methods 0.000 claims description 8
- 229910020012 Nb—Ti Inorganic materials 0.000 claims description 6
- 230000004888 barrier function Effects 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 5
- 238000001192 hot extrusion Methods 0.000 claims description 5
- 238000001513 hot isostatic pressing Methods 0.000 claims description 5
- 238000002844 melting Methods 0.000 claims description 5
- 230000008018 melting Effects 0.000 claims description 5
- 229910052758 niobium Inorganic materials 0.000 claims description 5
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims description 5
- 238000005096 rolling process Methods 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 5
- 238000003466 welding Methods 0.000 claims description 5
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- 238000000149 argon plasma sintering Methods 0.000 claims description 3
- 230000008021 deposition Effects 0.000 claims description 3
- 229910020888 Sn-Cu Inorganic materials 0.000 claims description 2
- 229910019204 Sn—Cu Inorganic materials 0.000 claims description 2
- 229910008839 Sn—Ti Inorganic materials 0.000 claims description 2
- 238000005481 NMR spectroscopy Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HFYPIIWISGZGRF-UHFFFAOYSA-N [Nb].[Sn].[Sn].[Sn] Chemical compound [Nb].[Sn].[Sn].[Sn] HFYPIIWISGZGRF-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000002887 superconductor Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B12/00—Superconductive or hyperconductive conductors, cables, or transmission lines
- H01B12/02—Superconductive or hyperconductive conductors, cables, or transmission lines characterised by their form
- H01B12/10—Multi-filaments embedded in normal conductors
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
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- Superconductors And Manufacturing Methods Therefor (AREA)
- Metal Extraction Processes (AREA)
Abstract
The invention belongs to the technical field of superconducting material processing, and particularly relates to 3D printing high-field Nb 3 The method for manufacturing the Sn precursor wire rod is characterized in that an oxygen-free copper ingot with a ring-shaped honeycomb structure through hole is prepared by using an oxygen-free copper material with the purity of more than 99.95 percent and combining a 3D printing process, the method avoids the problem that the porous copper ingot is easy to scrap when being prepared by drilling in the prior art, reduces the distance between Nb rods, improves the Nb proportion in a CuNb composite ingot, and finally obtains higher Nb 3 Volume fraction of Sn superconducting phase, thereby increasing Nb 3 Current carrying capability of the Sn superconducting wire.
Description
Technical Field
The invention belongs to the technical field of superconducting material processing, and particularly relates to 3D printing high-field Nb 3 A method for manufacturing a Sn precursor wire.
Background
Niobium tristin (Nb) 3 Sn) low-temperature superconductor is the most important material for the application of high-field superconducting magnets with the power of more than 10T at present, and has wide application in more fields such as high-energy particle accelerators, nuclear magnetic resonance spectrometers (NMR), magnetic confinement nuclear fusion (ITER) and the like. Influence of Nb 3 The main factors of the critical current density of the Sn superconducting wire are the superconducting phase content and the density of grain boundary pinning centers, and the aim of improving the Nb content 3 The current carrying capacity of Sn superconducting wire needs to be greatly increased to obtain high Nb content and high Sn content in the wire 3 Volume fraction of Sn superconducting phase.
In the prior art, the Nb is prepared by adopting an internal tin method 3 In the process of preparing the Sn superconducting wire, firstly, a round hole more than 160 holes needs to be drilled on an oxygen-free copper ingot to obtain a porous copper ingot, and then an Nb rod is inserted into the porous copper ingot to obtain a multi-core composite ingotThe drilling precision requirement is extremely high, even if drilling deviation of 1 hole causes the rejection of the whole billet, the porous copper ingot is expensive, and on the other hand, the thickness of the copper material between the hole sites of the copper ingot is controlled to be more than 5mm under the control of the drilling process, so that the Nb content in the wire is difficult to further increase to obtain higher Nb content 3 Volume fraction of Sn superconducting phase.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a 3D printing high-field Nb 3 A method for manufacturing a Sn precursor wire.
The invention relates to a 3D printing high-field Nb 3 The Sn precursor wire manufacturing method comprises the following steps:
step (1), drawing a three-dimensional model of a porous oxygen-free copper ingot by using 3D design software, wherein the three-dimensional model is cylindrical, the middle of the cylinder comprises a through hole of an annular honeycomb structure, the thickness of a ribbed plate of the honeycomb structure is 0.5-3mm, layering is performed in the vertical direction by using general slicing software according to the three-dimensional model, and profile information of each layer of section is extracted;
step (2), according to the section profile information extracted in the step (1), using an oxygen-free copper material with the purity of more than 99.95 percent to print oxygen-free copper ingots with honeycomb structures layer by layer in a vacuum environment through a 3D printing process;
step (3), inserting niobium rods matched with the aperture size of the honeycomb structure into the holes of the honeycomb structure of the oxygen-free copper ingot one by one, adding copper covers at two ends, and sealing and welding by using a vacuum electron beam to obtain a CuNb composite ingot;
step (4), carrying out hot isostatic pressing and hot extrusion processing on the CuNb composite ingot prepared in the step (3) to obtain a CuNb composite rod;
step (5), cutting the CuNb composite rod prepared in the step (4) into a fixed length, then drilling a hole in the center of the CuNb composite rod, then inserting an Sn rod into the hole, and processing the CuNb composite rod into a hexagonal Cu-Nb-Sn composite subcomponent through drawing and rolling;
step (6), a plurality of Cu-Nb-Sn compound sub-components prepared in the step (5) and a plurality of hexagonal sub-componentsThe central Cu rods are arranged in the oxygen-free copper pipe containing the barrier layer according to the closest arrangement, and then the copper clad Cu-Nb-Sn composite body compounded again is drawn and rolled, so that the Nb of the final finished product is obtained 3 And a Sn precursor wire.
Further, in the step (2), the oxygen-free copper material can be oxygen-free copper powder or oxygen-free copper wire.
Further, in the step (2), the 3D printing process may be Direct Metal Laser Sintering (DMLS), Selective Laser Melting (SLM), Electron Beam Melting (EBM), Fused Deposition (FDM), or fuse fabrication (FFF).
Further, in the step (2), the holes in the honeycomb structure may be hexagonal or circular.
Further, the number of the through holes of the annular honeycomb structure is greater than or equal to 160.
Further, in step (3), Nb may be inserted into a portion of the through hole 47 Ti or Nb-Ti rods instead of Nb rods, said Nb 47 The Ti or Nb-Ti rods are uniformly distributed in the annular honeycomb structure.
Further, in the step (5), a Sn — Cu alloy rod or a Sn — Ti alloy rod may be used instead of the Sn rod.
Compared with the prior art, adopt the porous anaerobic copper ingot of mode preparation that 3D printed, on the one hand, avoided the condemned condition of billet because of drilling error leads to, the manufacturing approach that 3D printed simultaneously does not have the production of waste material, has saved the quantity of raw and other materials, on the other hand, utilize 3D printing technology preparation anaerobic copper ingot can reduce the copper material thickness between the hole site, through inserting more and thinner Nb stick of quantity, promote the Nb content in the wire rod in order to obtain higher Nb 3 Volume fraction of Sn superconducting phase, thereby increasing Nb 3 Current carrying capability of the Sn superconducting wire.
Drawings
FIG. 1 is a schematic structural view of an oxygen-free copper ingot with through holes of a ring honeycomb structure according to the present invention.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present invention, the following detailed description of the present invention is provided with reference to the accompanying drawings and examples.
Example 1
3D prints high Nb field 3 The Sn precursor wire manufacturing method specifically comprises the following steps:
step (1), drawing a three-dimensional model of a porous oxygen-free copper ingot by using 3D design software, wherein the three-dimensional model is cylindrical, the middle of the cylinder comprises an annular honeycomb-structured through hole, the thickness of a rib plate of the honeycomb structure is 0.5mm, layering is performed in the vertical direction by using general slicing software according to the three-dimensional model, and profile information of each layer of section is extracted;
step (2), according to the section profile information extracted in the step (1), oxygen-free copper ingots with honeycomb structures are printed layer by using oxygen-free copper powder with the purity of more than 99.95% in a vacuum environment through Direct Metal Laser Sintering (DMLS);
step (3), inserting niobium rods matched with the aperture size of the honeycomb structure into the holes of the honeycomb structure of the oxygen-free copper ingot one by one, adding copper covers at two ends, and sealing and welding by using a vacuum electron beam to obtain a CuNb composite ingot;
step (4), carrying out hot isostatic pressing and hot extrusion processing on the CuNb composite ingot prepared in the step (3) to obtain a CuNb composite rod;
step (5), cutting the CuNb composite rod prepared in the step (4) into a fixed length, then drilling a hole in the center of the CuNb composite rod, then inserting an Sn rod into the hole, and processing the CuNb composite rod into a hexagonal Cu-Nb-Sn composite subcomponent through drawing and rolling;
step (6), a plurality of Cu-Nb-Sn composite subcomponents prepared in the step (5) and a plurality of hexagonal central Cu rods are arranged in an oxygen-free copper pipe containing a barrier layer in a densely-arranged manner, and then the copper-clad Cu-Nb-Sn composite compounded again is drawn and rolled, so that the Nb of the final finished product is obtained 3 And a Sn precursor wire.
Example 2
3D prints high Nb field 3 The Sn precursor wire manufacturing method specifically comprises the following steps:
step (1), drawing a three-dimensional model of a porous oxygen-free copper ingot by using 3D design software, wherein the three-dimensional model is cylindrical, the middle of the cylinder comprises an annular honeycomb-structured through hole, the thickness of a rib plate of the honeycomb structure is 1.5mm, layering is performed in the vertical direction by using general slicing software according to the three-dimensional model, and profile information of each layer of section is extracted;
step (2), according to the section profile information extracted in the step (1), oxygen-free copper ingots with honeycomb structures are printed layer by using oxygen-free copper powder with the purity of more than 99.95% in a vacuum environment through Electron Beam Melting (EBM);
step (3), inserting niobium rods matched with the aperture size of the honeycomb structure into the holes of the honeycomb structure of the oxygen-free copper ingot one by one, adding copper covers at two ends, and sealing and welding by using a vacuum electron beam to obtain a CuNb composite ingot;
step (4), carrying out hot isostatic pressing and hot extrusion processing on the CuNb composite ingot prepared in the step (3) to obtain a CuNb composite rod;
step (5), cutting the CuNb composite rod prepared in the step (4) into a fixed length, then drilling a hole in the center of the CuNb composite rod, then inserting an Sn rod into the hole, and processing the CuNb composite rod into a hexagonal Cu-Nb-Sn composite subcomponent through drawing and rolling;
step (6), a plurality of Cu-Nb-Sn composite subcomponents prepared in the step (5) and a plurality of hexagonal central Cu rods are arranged in an oxygen-free copper pipe containing a barrier layer in a densely-arranged manner, and then the copper-clad Cu-Nb-Sn composite compounded again is drawn and rolled, so that the Nb of the final finished product is obtained 3 And a Sn precursor wire.
Example 3
3D prints high Nb field 3 The Sn precursor wire manufacturing method specifically comprises the following steps:
step (1), drawing a three-dimensional model of a porous oxygen-free copper ingot by using 3D design software, wherein the three-dimensional model is cylindrical as shown in figure 1, the middle of the cylinder comprises an annular honeycomb-structured through hole, the thickness of a rib plate of the honeycomb structure is 3mm, layering is performed in the vertical direction by using general slicing software according to the three-dimensional model, and profile information of each layer of section is extracted;
step (2), according to the section profile information extracted in the step (1), oxygen-free copper ingots with honeycomb structures are printed layer by using oxygen-free copper materials with the purity of more than 99.95% in a vacuum environment through Fused Deposition (FDM);
step (3), inserting niobium rods matched with the aperture size of the honeycomb structure into the holes of the honeycomb structure of the oxygen-free copper ingot one by one, adding copper covers at two ends, and sealing and welding by using a vacuum electron beam to obtain a CuNb composite ingot;
step (4), carrying out hot isostatic pressing and hot extrusion processing on the CuNb composite ingot prepared in the step (3) to obtain a CuNb composite rod;
step (5), cutting the CuNb composite rod prepared in the step (4) into a fixed length, then drilling a hole in the center of the CuNb composite rod, then inserting an Sn rod into the hole, and processing the CuNb composite rod into a hexagonal Cu-Nb-Sn composite subcomponent through drawing and rolling;
step (6), a plurality of Cu-Nb-Sn composite subcomponents prepared in the step (5) and a plurality of hexagonal central Cu rods are arranged in an oxygen-free copper pipe containing a barrier layer in a densely-arranged manner, and then the copper-clad Cu-Nb-Sn composite compounded again is drawn and rolled, so that the Nb of the final finished product is obtained 3 And a Sn precursor wire.
In the 3 embodiments, in the step (2), the oxygen-free copper material may be oxygen-free copper powder or oxygen-free copper wire. The holes in the honeycomb structure may be hexagonal or circular.
In the step (1), the number of the through holes of the annular honeycomb structure is greater than or equal to 160.
In the step (3), Nb may be inserted into a part of the through-holes 47 Ti or Nb-Ti rods instead of Nb rods, said Nb 47 The Ti or Nb-Ti rods are uniformly distributed in the annular honeycomb structure.
In the step (5), a Sn-Cu alloy rod or a Sn-Ti alloy rod may be used instead of the Sn rod.
In light of the foregoing description of the preferred embodiment of the present invention, many modifications and variations will be apparent to those skilled in the art without departing from the spirit and scope of the invention. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.
Claims (7)
1. 3D prints high Nb field 3 The method for manufacturing the Sn precursor wire is characterized by comprising the following steps of:
step (1), drawing a three-dimensional model of a porous oxygen-free copper ingot by using 3D design software, wherein the three-dimensional model is cylindrical, the middle of the cylinder comprises a through hole of an annular honeycomb structure, the thickness of a ribbed plate of the honeycomb structure is 0.5-3mm, layering is performed in the vertical direction by using general slicing software according to the three-dimensional model, and profile information of each layer of section is extracted;
step (2), according to the section profile information extracted in the step (1), using an oxygen-free copper material with the purity of more than 99.95 percent to print oxygen-free copper ingots with honeycomb structures layer by layer in a vacuum environment through a 3D printing process;
step (3), inserting niobium rods matched with the aperture size of the honeycomb structure into the holes of the honeycomb structure of the oxygen-free copper ingot one by one, adding copper covers at two ends, and sealing and welding by using a vacuum electron beam to obtain a CuNb composite ingot;
step (4), carrying out hot isostatic pressing and hot extrusion processing on the CuNb composite ingot prepared in the step (3) to obtain a CuNb composite rod;
step (5), cutting the CuNb composite rod prepared in the step (4) into a fixed length, then drilling a hole in the center of the CuNb composite rod, then inserting an Sn rod into the hole, and processing the CuNb composite rod into a hexagonal Cu-Nb-Sn composite subcomponent through drawing and rolling;
step (6), a plurality of Cu-Nb-Sn composite subcomponents prepared in the step (5) and a plurality of hexagonal central Cu rods are arranged in an oxygen-free copper pipe containing a barrier layer according to the densest arrangement, and then the copper-clad Cu-Nb-Sn composite compounded again is drawn and rolled, so that the final finished product is obtainedNb of product 3 And a Sn precursor wire.
2. 3D printing high field Nb according to claim 1 3 The manufacturing method of the Sn precursor wire is characterized in that in the step (2), the oxygen-free copper material is oxygen-free copper powder or an oxygen-free copper wire.
3. 3D printing high field Nb according to claim 1 3 The manufacturing method of the Sn precursor wire is characterized in that in the step (2), the 3D printing process is one of Direct Metal Laser Sintering (DMLS), Selective Laser Melting (SLM), Electron Beam Melting (EBM), Fused Deposition (FDM) and fuse manufacturing (FFF).
4. 3D printing high field Nb according to claim 1 3 The manufacturing method of the Sn precursor wire is characterized in that in the step (2), the holes in the honeycomb structure are hexagonal or circular.
5. 3D printing high field Nb according to claim 1 3 The manufacturing method of the Sn precursor wire is characterized in that the number of the through holes of the annular honeycomb structure is more than or equal to 160.
6. 3D printing high field Nb according to claim 1 3 The method for producing the Sn precursor wire rod is characterized in that in the step (3), Nb is inserted into part of the through hole 47 Ti or Nb-Ti rods instead of Nb rods, said Nb 47 The Ti or Nb-Ti rods are uniformly distributed in the annular honeycomb structure.
7. 3D printing high field Nb according to claim 1 3 The manufacturing method of the Sn precursor wire is characterized in that in the step (5), an Sn-Cu alloy rod or an Sn-Ti alloy rod is adopted to replace an Sn rod.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210564074.2A CN114883049B (en) | 2022-05-23 | 2022-05-23 | 3D prints high-field Nb3Sn precursor wire manufacturing method |
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| CN202210564074.2A CN114883049B (en) | 2022-05-23 | 2022-05-23 | 3D prints high-field Nb3Sn precursor wire manufacturing method |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1460848A (en) * | 1973-02-27 | 1977-01-06 | Mitsubishi Electric Corp | Process for making a niobium alloy superconductor composite wire |
| CA2976782A1 (en) * | 2017-08-16 | 2019-02-16 | Chao Xu | Metal 3d printing method and metallic 3d printing materials |
| CN110391048A (en) * | 2019-06-19 | 2019-10-29 | 西部超导材料科技股份有限公司 | A kind of Nb3The preparation method of Sn presoma wire rod |
| CN111036902A (en) * | 2019-12-13 | 2020-04-21 | 同济大学 | Porous forming method for selective laser additive manufacturing |
| JP2021063297A (en) * | 2020-12-17 | 2021-04-22 | エムティーエー カンパニー リミテッドＭＴＡ Ｃｏ．， ＬＴＤ． | Iron-copper alloy having high thermal conductivity and method for producing the same |
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- 2022-05-23 CN CN202210564074.2A patent/CN114883049B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1460848A (en) * | 1973-02-27 | 1977-01-06 | Mitsubishi Electric Corp | Process for making a niobium alloy superconductor composite wire |
| CA2976782A1 (en) * | 2017-08-16 | 2019-02-16 | Chao Xu | Metal 3d printing method and metallic 3d printing materials |
| CN110391048A (en) * | 2019-06-19 | 2019-10-29 | 西部超导材料科技股份有限公司 | A kind of Nb3The preparation method of Sn presoma wire rod |
| CN111036902A (en) * | 2019-12-13 | 2020-04-21 | 同济大学 | Porous forming method for selective laser additive manufacturing |
| JP2021063297A (en) * | 2020-12-17 | 2021-04-22 | エムティーエー カンパニー リミテッドＭＴＡ Ｃｏ．， ＬＴＤ． | Iron-copper alloy having high thermal conductivity and method for producing the same |
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