CN114878037A - Miniature strain gauge with overlapped patterns - Google Patents
Miniature strain gauge with overlapped patterns Download PDFInfo
- Publication number
- CN114878037A CN114878037A CN202210461579.6A CN202210461579A CN114878037A CN 114878037 A CN114878037 A CN 114878037A CN 202210461579 A CN202210461579 A CN 202210461579A CN 114878037 A CN114878037 A CN 114878037A
- Authority
- CN
- China
- Prior art keywords
- substrate
- sensitive grid
- strain gauge
- layer
- bonding pads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 49
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 5
- 238000005476 soldering Methods 0.000 abstract description 5
- 239000003292 glue Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 239000011888 foil Substances 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
- G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
- G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
- G01L1/2287—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges constructional details of the strain gauges
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Abstract
The invention discloses a micro strain gauge with overlapped patterns, which comprises a plurality of layers of substrates; sensitive grids are arranged on each layer of substrate, and included angles between each sensitive grid and the central line of the substrate are different; two bonding pads are arranged on each sensitive grid, the distance between the two bonding pads of each sensitive grid is equal, the positions of all the bonding pads are arranged on the surface of the substrate in a staggered mode, n bonding pads are arranged on different substrates in the area between the two bonding pads of each sensitive grid, and n is equal to the number of the sensitive grids minus one. Under the condition of reducing the size of the substrate, the space between the bonding pads is increased, and the phenomenon of soldering tin adhesion is avoided.
Description
Technical Field
The invention belongs to the field of foil type resistance strain gauges, and relates to a miniature overlapped pattern strain gauge.
Background
Foil type resistance strain gauges have been widely used in the fabrication of various high precision sensors and in stress and strain testing in various environments. With the explosion of consumer electronics products, the usage of circuit boards and integrated chips has increased dramatically. However, stress concentration or damage is very easily generated in the transportation and installation processes of the circuit board and the integrated chip, so that a strain gauge is needed to detect the stress condition of the circuit board or the chip to analyze the reliability of the circuit board, thereby optimizing the design, transportation and packaging modes of the circuit board and improving the reliability of the circuit board.
As consumer electronics are miniaturized, circuit boards or chips used therein are extremely small in size, and a multiaxial strain gauge with an extremely small size is required to test stress in a very small area or in multiple directions at a certain point on the circuit board. However, the existing strain gage with overlapping patterns can not meet the test requirements of chips and circuit boards with tiny sizes, mainly the pad space size of each strain gage is very small, soldering tin adhesion is easy to occur after lead welding, the problems of abnormal resistance and the like are caused, and a large-size substrate is required, the size is usually 2.5mm multiplied by 2.5mm or more, and the problem of soldering tin adhesion can be avoided.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a micro strain gage with overlapped patterns, which increases the distance between bonding pads and avoids the phenomenon of solder adhesion under the condition of reducing the size of a substrate.
In order to achieve the purpose, the invention adopts the following technical scheme to realize the purpose:
a micro overlay strain gauge comprises a multi-layer substrate;
sensitive grids are arranged on each layer of substrate, and included angles between the sensitive grids and the central line of the substrate are different; two bonding pads are arranged on each sensitive grid, the distance between the two bonding pads of each sensitive grid is equal, the positions of all the bonding pads are arranged on the surface of the substrate in a staggered mode, n bonding pads are arranged on different substrates in the area between the two bonding pads of each sensitive grid, and n is equal to the number of the sensitive grids minus one.
Preferably, the substrate is bonded with the sensitive grid on the next layer by using bonding glue.
Further, the adhesive is in the form of a semi-cured film.
Preferably, the size of each layer of substrate is the same.
Preferably, one lead is bonded to each pad.
Furthermore, the lead wire is a flat enameled wire, the thickness of the flat enameled wire is 0.06-0.08 mm, and the width of the flat enameled wire is 0.12-0.16 mm.
Preferably, each pad surface is provided with a copper plating layer.
Preferably, the pads on each sensitive grid are oriented uniformly.
Preferably, the surface dimensions of the strain gauge are 1.5mm by 1.5 mm.
Preferably, the substrate is three layers, and the distance between two pads of each sensitive grid is the sum of the width of two pads and the distance between three adjacent pads in the overlapping space.
Compared with the prior art, the invention has the following beneficial effects:
according to the invention, the distance between the two bonding pads of each sensitive grid is increased, the positions of all the bonding pads are staggered on the surface of the substrate, and the bonding pads of other sensitive grids can be arranged between the two bonding pads of the same sensitive grid on the spatial layer, so that the distance between the two bonding pads of the same sensitive grid is increased under the condition that the width of the whole bonding pad is not changed, the phenomenon of soldering tin adhesion is avoided, the size of the substrate is not limited by the distance between the bonding pads, and the surface size of the strain gauge can be reduced.
Furthermore, the substrate and the sensitive grid are bonded by semi-cured film-shaped bonding glue, so that the sensitive grid is not only viscous and does not flow, and no glue overflow is generated after pressurization. Excessive glue can pollute the bonding pad and influence the lead welding.
Furthermore, the size of each layer of substrate is the same, so that the applique of the whole strain gauge can be realized, the alignment is simple, the applique efficiency is high, and the modification size error is reduced.
Further, the flat enameled wire is welded on the bonding pad, so that the overall thickness of the strain gauge can be reduced.
Drawings
FIG. 1 is a front view of a three-layer structure and a lead pattern of a micro-strain gage according to the present invention;
FIG. 2 is a top view of a three-layer structure and lead pattern of the micro strain gage according to the present invention;
FIG. 3 is a schematic diagram of a first layer of a sensing gate structure according to the present invention;
FIG. 4 is a diagram of a second layer of the sensing grid structure of the present invention;
fig. 5 is a schematic diagram of a third layer of sensitive gate structure according to the present invention.
Wherein: 1-a substrate; 2-a sensitive grid; 3-adhesive glue; 4-a pad; 5-lead wire.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments; all other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the terms "front," "back," "left," "right," "upper" and "lower" used in the following description refer to directions in the drawings, and the terms "inner" and "outer" refer to directions toward and away from, respectively, the geometric center of a particular component.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
As shown in fig. 1, the strain gage for micro overlay flower according to the present invention includes a multi-layer substrate 1.
The size of each layer of substrate 1 is the same, each layer of substrate 1 is provided with a sensitive grid 2, and the included angle between each sensitive grid 2 and the central line of the substrate 1 is different; two bonding pads 4 are arranged on each sensitive grid 2, the distance between the two bonding pads 4 of each sensitive grid 2 is equal, the positions of all the bonding pads 4 are arranged on the surface of the substrate 1 in a staggered mode, n bonding pads 4 are arranged on different substrates 1 in the area between the two bonding pads 4 of each sensitive grid 2, and n is equal to the number of the sensitive grids 2 minus one.
And coating an adhesive 3 on the sensitive grid 2, laminating the sensitive grid and the substrate 1, performing thermocuring to form the substrate 1 of the single strain gauge, and welding a lead 5 on a strain gauge bonding pad 4 to form a single resistance strain gauge.
In the embodiment, a three-way overlapping flower is taken as an example, six pads 4 of the strain gauge and leads 5 are arranged and led out in the same direction, so that 6 pads 4 with equal width and equal spacing are arranged in the width direction of the strain gauge substrate 1, the width is 0.15mm, and the spacing is 0.08 mm; the two pads 4 of each layer of strain gauge are spaced apart by a distance of 2 pads 4 wide and 3 pads 4 spaced apart.
The first layer strain gauge comprises a substrate 1, a sensitive grid 2, a bonding pad 4 and a lead 5, wherein the bonding pads 4 connected with the strain gauge sensitive grid 2 are a bonding pad 4c and a bonding pad 4f respectively.
The substrate 1 of the first layer of strain gauges has dimensions of 1.5 x 1.5mm, the sensitive grid 2 has an orientation of-45 °, the pad 4c and pad 4f are spaced apart by 0.69mm, this dimension being the sum of the distance between the width of 2 pads 4 and the spacing of 3 pads 4.
The invention relates to a design method of a micro strain gage with overlapping patterns, wherein a second layer of strain gage comprises a substrate 1, a sensitive grid 2, a bonding pad 4 and a lead 5, wherein the bonding pads 4 connected with the sensitive grid 2 of the strain gage are a bonding pad 4a and a bonding pad 4d respectively.
The substrate 1 of the second layer strain gauge has dimensions of 1.5 x 1.5mm, the sensitive grid 2 has a direction of 45 °, the center-to-center spacing between the pads 4a and 4d is 0.69mm, and the dimensions are the sum of the distances between the width of 2 pads 4 and the spacing of 3 pads 4.
The invention relates to a design method of a micro overlay strain gauge, wherein the third layer strain gauge comprises a substrate 1, a sensitive grid 2, a bonding pad 4 and a lead 5, wherein the bonding pads 4 connected with the sensitive grid 2 of the strain gauge are a bonding pad 4b and a bonding pad 4e respectively.
The substrate 1 of the third layer strain gauge has dimensions of 1.5mm x 1.5mm, the sensitive grid 2 is oriented at 0 °, the center-to-center spacing between pad 4b and pad 4e is 0.69mm, and the dimensions are the sum of the distances between the width of 2 pads 4 and the spacing of 3 pads 4.
Each bonding pad 4 is welded with a lead 5, the lead 5 is a flat enameled wire, the thickness of the flat enameled wire is 0.06-0.08 mm, the width of the flat enameled wire is 0.12-0.16 mm, and the flat enameled wire can resist the ambient temperature of 150 ℃. The flat enameled wire is fixed with the strain gauge bonding pad 4 through a soldering tin point, and the welding reliability is good.
Each layer of the substrate 1 of the three-layer overlapping structure has the same size; six bonding pads 4 and leads 5 of the strain gauge are arranged and led out in the same direction, the widths of the bonding pads 4 are the same, and the distances between the adjacent bonding pads 4 are the same; the included angles of the three sensitive grids 2 are distributed at-45 degrees, 0 degree and 45 degrees, and the total thickness of the strain gauge is 0.3-0.5 mm.
The manufacturing method of the micro overlap strain gauge comprises the following steps:
the micro-pattern-overlapped strain gauge is composed of three layers of single strain gauges, and the structure of the strain gauge is as follows: coating a layer of adhesive 3 on the back surface of a substrate 1 of the second layer of strain gauge, forming a semi-cured film, then adhering the semi-cured film to the front surface of the third layer of strain gauge, and simultaneously overlapping and fixing the center of a sensitive grid 2 of the second layer of strain gauge with the center of a sensitive grid 2 of the third layer of strain gauge; secondly, coating a layer of adhesive 3 on the back surface of the substrate 1 of the first layer of strain gauge, forming a semi-cured film, then adhering the semi-cured film to the front surface of the second layer of strain gauge, and simultaneously overlapping and fixing the center of the sensitive grid 2 of the first layer of strain gauge with the center of the sensitive grid 2 of the second layer of strain gauge; the three layers of strain gauges are sequentially adhered according to the angle direction of the sensitive grid 2, namely, 45 degrees, 0 degrees and 45 degrees, and then are pressed and thermally cured to form an integral three-layer miniature overlapped strain gauge.
The upper layer and the lower layer of the three-layer strain gauge are bonded together through a thin layer of bonding glue 3 to form the three-layer overlapped strain gauge.
A semi-cured film-like adhesive 3 is used. Such as epoxy resins or modified phenolic resins. The manufacturing method comprises the steps of coating a layer of glue solution of the adhesive glue 3 on the back surface of the strain gauge substrate 1, and performing thermosetting at a certain temperature for a certain time to form a semi-solidified film with a certain adhesiveness.
The overlapping alignment process with equal size of each layer of substrate 1 and high alignment marking precision can accurately determine the central position of the sensitive grid 2, and the alignment is accurate and reliable.
The sensitive grid 2 is made of Itemn alloy, and the surface of the bonding pad 4 is plated with copper, so that the reliability of the lead 5 is improved.
In summary, the design and manufacturing method of a micro overlay flower strain gauge according to the present invention is inventive, and is not limited to the three-way overlay flower of example 1.5mm × 1.5mm, and can be expanded to overlay flower strain gauges with larger size or smaller size, and the included angle of the measuring grid is not limited to-45 °, 0 ° and 45 °, and can also be used for two-way overlay flowers of 0 °, 90 ° or 0 °, 45 °, and overlay flower strain gauges of various types such as 0 °, 60 °, 120 °.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
It is to be understood that the above description is intended to be illustrative, and not restrictive. Many embodiments and many applications other than the examples provided would be apparent to those of skill in the art upon reading the above description. The scope of the present teachings should, therefore, be determined not with reference to the above description, but should instead be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled. The disclosures of all articles and references, including patent applications and publications, are hereby incorporated by reference for all purposes. The omission in the foregoing claims of any aspect of subject matter that is disclosed herein is not intended to forego such subject matter, nor should the applicant consider that such subject matter is not considered part of the disclosed subject matter.
Claims (10)
1. A micro overlay strain gauge comprising a multi-layer substrate (1);
each layer of substrate (1) is provided with a sensitive grid (2), and the included angles between each sensitive grid (2) and the central line of the substrate (1) are different; two bonding pads (4) are arranged on each sensitive grid (2), the distance between the two bonding pads (4) of each sensitive grid (2) is equal, the bonding pads (4) are arranged on the surface of the substrate (1) in a staggered mode, n bonding pads (4) are arranged on different substrates (1) in the area between the two bonding pads (4) of each sensitive grid (2), and n is equal to the number of the sensitive grids (2) minus one.
2. The strain gage of claim 1, wherein the substrate (1) is bonded with the sensitive grid (2) of the next layer by using an adhesive (3).
3. The micro overlay strain gauge according to claim 2, wherein the adhesive (3) is in the form of a semi-cured film.
4. The micro overlay strain gauge according to claim 1, wherein the size of each layer of substrate (1) is the same.
5. The micro strain gage according to claim 1, characterized in that one lead (5) is soldered to each pad (4).
6. The micro strain gage according to claim 5, wherein the lead wire (5) is a flat enameled wire, and the thickness of the flat enameled wire is 0.06-0.08 mm, and the width of the flat enameled wire is 0.12-0.16 mm.
7. The micro pattern strain gage according to claim 1, wherein each pad (4) surface is provided with a copper plating layer.
8. The micro eclipse strain gauge of claim 1, wherein the pads (4) on each sensitive grid (2) are oriented in a uniform manner.
9. The micro pattern overlay strain gage of claim 1 wherein the surface dimension of the strain gage is 1.5mm x 1.5 mm.
10. The micro overlay strain gauge according to claim 1, wherein the substrate (1) is three-layered, and the two pads (4) of each sensitive grid (2) are spaced apart by the sum of the width of two pads (4) and the distance between the three adjacent pads (4) in the overlay space.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210461579.6A CN114878037A (en) | 2022-04-28 | 2022-04-28 | Miniature strain gauge with overlapped patterns |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210461579.6A CN114878037A (en) | 2022-04-28 | 2022-04-28 | Miniature strain gauge with overlapped patterns |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114878037A true CN114878037A (en) | 2022-08-09 |
Family
ID=82672224
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210461579.6A Pending CN114878037A (en) | 2022-04-28 | 2022-04-28 | Miniature strain gauge with overlapped patterns |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114878037A (en) |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0653643A (en) * | 1992-08-03 | 1994-02-25 | Seiko Epson Corp | Structure of printed solder resist |
| EP1335194A1 (en) * | 1998-07-28 | 2003-08-13 | Rosemount Aerospace Inc. | Flexible silicon strain gage |
| CN201583247U (en) * | 2010-01-06 | 2010-09-15 | 中航电测仪器股份有限公司 | Double-output strainometer |
| TW201325358A (en) * | 2011-12-12 | 2013-06-16 | Ud Electronic Corp | Circuit board soldering plate layout structure for soldering signal filter module |
| CN103728067A (en) * | 2014-01-23 | 2014-04-16 | 济南金钟电子衡器股份有限公司 | Resistance strain gauge for stress analysis |
| CN104602447A (en) * | 2015-01-21 | 2015-05-06 | 谌壮兵 | Welding wire structure of USB circuit board end |
| CN105241371A (en) * | 2015-10-28 | 2016-01-13 | 上海应用技术学院 | Resistance strain gauge |
| CN205209428U (en) * | 2015-12-23 | 2016-05-04 | 昆山雅图电子科技有限公司 | Resistance strain gauge |
| CN206818337U (en) * | 2017-04-12 | 2017-12-29 | 厦门市诺盛测控技术有限公司 | Miniature three axle is not superimposed strain gauge |
| CN209069201U (en) * | 2018-12-21 | 2019-07-05 | 广东微应变传感科技有限公司 | For simplifying the full-bridge foil resistance strain gauge of cantilever beam sensor |
| CN110459524A (en) * | 2019-08-12 | 2019-11-15 | 北京比特大陆科技有限公司 | Base plate for packaging, chip and packaging method |
| CN111623702A (en) * | 2020-04-29 | 2020-09-04 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Method for testing strain of welding spot of integrated circuit component |
-
2022
- 2022-04-28 CN CN202210461579.6A patent/CN114878037A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0653643A (en) * | 1992-08-03 | 1994-02-25 | Seiko Epson Corp | Structure of printed solder resist |
| EP1335194A1 (en) * | 1998-07-28 | 2003-08-13 | Rosemount Aerospace Inc. | Flexible silicon strain gage |
| CN201583247U (en) * | 2010-01-06 | 2010-09-15 | 中航电测仪器股份有限公司 | Double-output strainometer |
| TW201325358A (en) * | 2011-12-12 | 2013-06-16 | Ud Electronic Corp | Circuit board soldering plate layout structure for soldering signal filter module |
| CN103728067A (en) * | 2014-01-23 | 2014-04-16 | 济南金钟电子衡器股份有限公司 | Resistance strain gauge for stress analysis |
| CN104602447A (en) * | 2015-01-21 | 2015-05-06 | 谌壮兵 | Welding wire structure of USB circuit board end |
| CN105241371A (en) * | 2015-10-28 | 2016-01-13 | 上海应用技术学院 | Resistance strain gauge |
| CN205209428U (en) * | 2015-12-23 | 2016-05-04 | 昆山雅图电子科技有限公司 | Resistance strain gauge |
| CN206818337U (en) * | 2017-04-12 | 2017-12-29 | 厦门市诺盛测控技术有限公司 | Miniature three axle is not superimposed strain gauge |
| CN209069201U (en) * | 2018-12-21 | 2019-07-05 | 广东微应变传感科技有限公司 | For simplifying the full-bridge foil resistance strain gauge of cantilever beam sensor |
| CN110459524A (en) * | 2019-08-12 | 2019-11-15 | 北京比特大陆科技有限公司 | Base plate for packaging, chip and packaging method |
| CN111623702A (en) * | 2020-04-29 | 2020-09-04 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Method for testing strain of welding spot of integrated circuit component |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7414323B2 (en) | Tab tape and method of manufacturing the same | |
| JP3536728B2 (en) | Semiconductor device, tape carrier, manufacturing method thereof, circuit board, electronic device, and tape carrier manufacturing apparatus | |
| US7226821B2 (en) | Flip chip die assembly using thin flexible substrates | |
| WO2001026432A1 (en) | Wiring board, semiconductor device and method of producing, testing and packaging the same, and circuit board and electronic equipment | |
| JP2000031327A (en) | Semiconductor device and its manufacture | |
| CN105163484A (en) | Flexible circuit board with reinforced structure and processing process thereof | |
| US20240178006A1 (en) | Leadless semiconductor package with wettable flanks and method for manufacturing the same | |
| CN103579171B (en) | Semiconductor package part and manufacture method thereof | |
| US8198130B2 (en) | Chip module and method for producing a chip module having plains of extensions for chip and substrate | |
| CN110753447B (en) | Embedded circuit board and manufacturing method thereof | |
| CN114878037A (en) | Miniature strain gauge with overlapped patterns | |
| KR101897069B1 (en) | Manufacturing method of chip package member and manufacturing method of chip package | |
| Frisk et al. | Reliability of adhesive joined thinned chips on flexible substrates under humid conditions | |
| Lahokallio et al. | High temperature reliability of electrically conductive adhesive attached temperature sensors on flexible polyimide substrates | |
| US11533811B2 (en) | Electronic device | |
| KR100192871B1 (en) | Semiconductor device having a leadframe and metal substrate | |
| KR101751390B1 (en) | Flexible printed circuit boards and method for manufacturing the same | |
| US20140035132A1 (en) | Surface mount chip | |
| CN103715107A (en) | Method for manufacturing package stack structure | |
| US11309237B2 (en) | Semiconductor package with wettable slot structures | |
| Palm et al. | Comparison of different flex materials in high density flip chip on flex applications | |
| CN110010483B (en) | Radio frequency chip three-dimensional packaging process with electromagnetic shielding function | |
| JP2000340916A (en) | Printed wiring board | |
| JP5365204B2 (en) | Wiring board manufacturing method | |
| JP3751938B2 (en) | TAB tape carrier and method for manufacturing the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |