CN114871583B - Multi-physical-field brittle material laser polishing method and brittle material polishing equipment - Google Patents
Multi-physical-field brittle material laser polishing method and brittle material polishing equipment Download PDFInfo
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- CN114871583B CN114871583B CN202210479989.3A CN202210479989A CN114871583B CN 114871583 B CN114871583 B CN 114871583B CN 202210479989 A CN202210479989 A CN 202210479989A CN 114871583 B CN114871583 B CN 114871583B
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- 239000000463 material Substances 0.000 title claims abstract description 106
- 238000005498 polishing Methods 0.000 title claims abstract description 80
- 238000000034 method Methods 0.000 title claims abstract description 31
- 238000010438 heat treatment Methods 0.000 claims abstract description 37
- 230000000694 effects Effects 0.000 claims abstract description 20
- 238000004090 dissolution Methods 0.000 claims abstract description 8
- 230000002035 prolonged effect Effects 0.000 claims abstract description 5
- 238000002844 melting Methods 0.000 claims description 10
- 230000008018 melting Effects 0.000 claims description 10
- 238000001816 cooling Methods 0.000 claims description 5
- 239000012768 molten material Substances 0.000 claims description 2
- 238000009499 grossing Methods 0.000 abstract description 7
- 239000007789 gas Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 230000004083 survival effect Effects 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004093 laser heating Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/3568—Modifying rugosity
- B23K26/3576—Diminishing rugosity, e.g. grinding; Polishing; Smoothing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/60—Preliminary treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
The invention discloses a laser polishing method and equipment for brittle materials with multiple physical fields, wherein the laser polishing method comprises the following steps: heating the brittle material; maintaining heating of the brittle material and laser polishing the brittle material; a molten pool formed by ultrasonic vibration laser polishing of the brittle material; applying an air flow with air pressure to the molten pool above the molten pool so as to ensure that the dissolution materials in the molten pool are uniformly distributed by tangential force; the heating high temperature, ultrasonic vibration and airflow of the brittle material laser polishing method jointly act on the molten pool, so that the molten state time of the molten pool is prolonged, the acting time of thermal capillary force and capillary force is sufficient, and the laser polishing surface is smooth and compact and has no cracks. The multi-physical-field laser polishing method for the brittle material improves the laser polishing smoothing effect, simultaneously makes the surface of the brittle material more compact, and reduces or eliminates the generation of cracks.
Description
Technical Field
The invention relates to the field of laser polishing of brittle materials, in particular to a laser polishing method and equipment for a brittle material with multiple physical fields.
Background
The laser polishing method has the advantages of high laser polishing speed, high polishing quality, low requirement on environment, good adaptability to a polished object, no pollution to the environment and wide application prospect. Common brittle materials are glass, diamond, ceramic, etc., which may be laser polished.
Along with the development of science and technology, brittle materials such as ceramic materials have wide development prospects in the fields of microelectronics, aerospace and the like, so that the demand for high-precision brittle materials is increased. The traditional brittle materials generally adopt mechanical grinding and polishing to improve the surface quality, and the defects of the traditional brittle materials are large noise and high cost during polishing, and the requirements of large-batch and high-quality ceramic surface supply cannot be met. The laser polishing of the brittle material can overcome the defects of the traditional polishing and greatly improve the working efficiency.
But the laser polishing speed is high, the survival time of a molten pool is short, the polishing smoothing effect is not obvious, and the problems of air holes, cracks and the like are easy to generate in the molten pool.
Disclosure of Invention
The invention aims to provide a laser polishing method and equipment for a brittle material with multiple physical fields, which have obvious polishing smooth effect and overcome the problems of easy generation of air holes, cracks and the like in a molten pool.
The invention discloses a laser polishing method for a brittle material with multiple physical fields, which comprises the following steps:
heating the brittle material;
maintaining heating of the brittle material and laser polishing the brittle material;
a molten pool formed by ultrasonic vibration laser polishing of the brittle material;
applying an air flow with air pressure to the molten pool above the molten pool so as to ensure that the dissolution materials in the molten pool are uniformly distributed by tangential force;
the heating high temperature, ultrasonic vibration and airflow of the brittle material laser polishing method jointly act on the molten pool, so that the molten state time of the molten pool is prolonged, the acting time of thermal capillary force and capillary force is sufficient, and the laser polishing surface is smooth and compact and has no cracks.
Optionally, the specific steps of the laser polishing method are as follows:
a gas flow with gas pressure is applied to the molten pool on one side above the molten pool so as to lead the dissolution materials in the molten pool to be uniformly distributed by tangential force.
Optionally, the specific steps of the laser polishing method are as follows:
the laser is leveled so that the laser light is perpendicularly irradiated on the surface of the brittle material.
Optionally, the heating temperature for heating the brittle material is 500-600 ℃, and the air pressure of the air flow is 20-30 MPa.
Optionally, the power of the laser is 150W, the duty cycle is 60% -100%, the frequency is 1kHz-3kHz, and the scanning speed is 400mm/s-600mm/s.
The invention also discloses a brittle material polishing device, which applies the brittle material laser polishing method, comprising a laser component, a processing table and a supporting frame; the laser component and the supporting frame are placed on the side edge of the processing table, a heating plate for placing the brittle material and heating the brittle material is arranged on the processing table, an air tap and an ultrasonic generator are arranged on the supporting frame, and the air tap and the ultrasonic generator extend into the upper part of the heating plate; the air tap is used for applying air flow with air pressure to the laser molten pool, and the ultrasonic generator is used for carrying out ultrasonic vibration on the molten pool.
Optionally, the processing table comprises a lifting adjusting assembly and a bearing assembly, and the heating plate is installed on the bearing assembly; the lifting adjusting assembly comprises a base, a first adjusting screw and two supporting pieces; the base is provided with a first sliding cavity, and the two supporting pieces are rotationally connected; one end of the supporting piece is rotatably connected to the base, and the other end of the supporting piece is movably connected to the bearing assembly; one end of the other supporting piece is movably connected in the first sliding cavity, and the other end of the other supporting piece is rotatably connected to the bearing component; the first adjusting screw is arranged on the bearing assembly and is in threaded connection with the supporting piece movably connected with the bearing assembly; and the first adjusting screw is adjusted and drives the bearing assembly to move, so that the two supporting pieces are driven to lift.
Optionally, the bearing assembly comprises a bottom plate, an X-axis adjusting plate and a second adjusting screw, and a second sliding cavity is arranged on the bottom plate; one end of one supporting piece is movably connected in the second sliding cavity, and one end of the other supporting piece is rotatably connected to the bottom plate; the first adjusting screw is arranged on the bottom plate, inserted into the second sliding cavity and in threaded connection with the support piece movably connected in the second sliding cavity;
the X-axis adjusting plate is slidably arranged on the bottom plate, and the second adjusting screw is arranged on the bottom plate and is in threaded connection with the X-axis adjusting plate; and rotating the X-axis adjusting plate, and moving the X-axis adjusting plate in the X-axis direction.
Optionally, the bearing assembly includes a Y-axis adjusting plate and a third adjusting screw; the Y-axis adjusting plate is slidably arranged on the X-axis adjusting plate, and the third adjusting screw is arranged on the X-axis adjusting plate and is in threaded connection with the Y-axis adjusting plate; and rotating the third adjusting screw, and moving the Y-axis adjusting plate in the Y-axis direction.
Optionally, the support frame includes a support base, a first mechanical arm, a second mechanical arm, and a third mechanical arm; the first mechanical arm is rotatably mounted on the supporting seat, the second mechanical arm is rotatably mounted on the first mechanical arm, and the third mechanical arm is rotatably mounted on the second mechanical arm; the ultrasonic generator is arranged on the end part of the second mechanical arm, and the air tap is arranged on the end part of the third mechanical arm.
The multi-physical-field laser polishing method for the brittle material prolongs the molten state time of a molten pool by heating the brittle material, carrying out ultrasonic vibration and carrying out air flow pressurizing blowing on the brittle material in a multi-physical-field auxiliary polishing mode, ensures that the thermal capillary force and the capillary force have sufficient action time, quickens the realization of the effect of 'melting peak filling valley', improves the laser polishing smoothing effect, simultaneously ensures that the surface of the brittle material is more compact, and reduces or eliminates the generation of cracks.
Drawings
The accompanying drawings, which are included to provide a further understanding of embodiments of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention. It is evident that the figures in the following description are only some embodiments of the invention, from which other figures can be obtained without inventive effort for a person skilled in the art. In the drawings:
FIG. 1 is a schematic view of a brittle material polishing apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic view of a processing station and a support frame according to an embodiment of the present invention;
FIG. 3 is another schematic view of a processing station and support frame according to an embodiment of the present invention;
FIG. 4 is a schematic view of a processing station according to an embodiment of the invention;
FIG. 5 is an exploded view of a processing station according to an embodiment of the present invention;
FIG. 6 is another exploded view of a processing station according to an embodiment of the present invention.
1, a laser component; 11. a laser; 12. vibrating mirror; 2. a processing table; 21. a heating plate; 22. a lifting adjusting component; 221. a base; 221a, a first sliding chamber; 222. a first adjusting screw; 223. a support; 223a, a connecting shaft; 223a1, a slider; 23. a carrier assembly; 231. a bottom plate; 231a, a second sliding chamber; 231b, mounting a shaft; 232. an X-axis adjusting plate; 233. a second adjusting screw; 234. a Y-axis adjusting plate; 235. a third adjusting screw; 3. a support frame; 31. a support base; 32. a first mechanical arm; 33. a second mechanical arm; 34. a third mechanical arm; 5. an air tap; 6. an ultrasonic generator; 7. an air floatation shockproof platform; 8. a water cooling machine; 9. brittle materials.
Detailed Description
It is to be understood that the terminology used herein, the specific structural and functional details disclosed are merely representative for the purpose of describing particular embodiments, but that the invention may be embodied in many alternate forms and should not be construed as limited to only the embodiments set forth herein.
The invention is described in detail below with reference to the attached drawings and alternative embodiments.
As an embodiment of the present invention, a laser polishing method for a multi-physical-field brittle material is disclosed, which is characterized by comprising the steps of:
s100: heating the brittle material;
s200: maintaining heating of the brittle material and laser polishing the brittle material;
s300: a molten pool formed by ultrasonic vibration laser polishing of the brittle material;
s400: applying an air flow with air pressure to the molten pool above the molten pool so as to ensure that the dissolution materials in the molten pool are uniformly distributed by tangential force;
the heating high temperature, ultrasonic vibration and airflow of the brittle material laser polishing method jointly act on the molten pool, so that the molten state time of the molten pool is prolonged, the acting time of thermal capillary force and capillary force is sufficient, and the laser polishing surface is smooth and compact and has no cracks.
The surface of the brittle material is scanned by a high-energy laser beam, the convex part of the surface of the brittle material is melted, and the smooth effect is achieved under the comprehensive actions of capillary force, thermal capillary force, gravity and the like, so that the laser polishing is realized. If the melted material has solidified and these forces have not equilibrated, an uneven surface is regenerated and the polishing effect is not achieved.
The traditional laser polishing has the problems of high speed and short survival time of a molten pool formed by laser heating, and the capillary force and the thermal capillary force act for a short time, so that the effect of 'melting peak and filling valley' is not realized, and the molten material of the molten pool is cooled and solidified, so that the laser polishing smoothing effect is not obvious. And pores and cracks are easy to generate in a molten pool, so that the surface of the polished brittle material is not dense enough and not smooth enough.
The multi-physical-field brittle material laser polishing method of the invention heats the brittle material in the steps of S100 and S200, so that the brittle material is in a higher temperature state in the laser polishing process, the melting material of the molten pool is cooled and solidified for a long time, the capillary force and the thermal capillary force have sufficient action time to realize the effect of 'melting peak and filling valley', and the smooth effect of laser polishing is ensured. In the step S300, the ultrasonic vibration laser polishes a molten pool formed by the brittle material, accelerates the flow of the molten pool, accelerates the realization of the effect of 'melting peak and filling valley', shortens the required time and improves the laser polishing smoothing effect. Simultaneously, cavitation can be generated by ultrasonic vibration, which is beneficial to removing air in a molten pool, and the surface is more compact after the molten pool is cooled, so that the generation of cracks is reduced or eliminated, and the surface quality is improved. In the step S300, air flow with air pressure is applied to the molten pool above the molten pool, so that the dissolution materials in the molten pool are subjected to tangential force, tangential redistribution of the molten pool is accelerated, the effect of 'melting peak filling valley' is accelerated, the required time is shortened, the molten pool distribution is more uniform, the surface roughness of brittle materials is reduced, and the smooth effect of laser polishing is ensured.
The multi-physical-field laser polishing method for the brittle material prolongs the molten state time of a molten pool by heating the brittle material, carrying out ultrasonic vibration and carrying out air flow pressurizing blowing on the brittle material in a multi-physical-field auxiliary polishing mode, ensures that the thermal capillary force and the capillary force have sufficient action time, quickens the realization of the effect of 'melting peak filling valley', improves the laser polishing smoothing effect, simultaneously ensures that the surface of the brittle material is more compact, and reduces or eliminates the generation of cracks. Brittle materials include, but are not limited to, glass, diamond, ceramic, and the like.
Optionally, the specific step S400 of the laser polishing method is as follows: a gas flow with gas pressure is applied to the molten pool on one side above the molten pool so as to lead the dissolution materials in the molten pool to be uniformly distributed by tangential force. In the scheme, air flow with air pressure is applied to the molten pool from one side above the molten pool, tangential force is easier to form, and the molten pool is rapidly and uniformly distributed.
Optionally, the specific step S400 of the laser polishing method is as follows: the laser 11 is leveled so that the laser light is perpendicularly irradiated on the surface of the brittle material.
Optionally, the heating temperature for heating the brittle material is 500-600 ℃, and the air pressure of the air flow is 20-30 MPa.
Optionally, the power of the laser is 150W, the duty cycle is 60% -100%, the frequency is 1kHz-3kHz, and the scanning speed is 400mm/s-600mm/s.
Specifically, the gas flow may be air or an inert gas such as nitrogen, argon, or the like. The brittle material 9 which is easy to oxidize during processing can be protected by inert gas, and air can be directly selected for the brittle material 9 which is difficult to oxidize.
Specifically, the surface of the brittle material is cleaned with alcohol before the brittle material is heated in S100.
The invention also discloses a brittle material 9 polishing device, which is applied to the brittle material laser polishing method, and as shown in figures 1 to 3, the brittle material polishing device comprises a laser component 1, a processing table 2 and a supporting frame 3; the laser assembly 1 and the support frame 3 are placed on the side edge of the processing table 2, a heating plate 21 for placing the brittle material 9 and heating the brittle material 9 is arranged on the processing table 2, an air tap 5 and an ultrasonic generator 6 are arranged on the support frame 3, and the air tap 5 and the ultrasonic generator 6 extend above the heating plate 21; the air tap 5 is used for applying air flow with air pressure to the laser molten pool, and the ultrasonic generator 6 is used for carrying out ultrasonic vibration on the molten pool.
According to the brittle material polishing equipment, the brittle material 9 to be polished is placed on the heating plate 21, the heating plate 21 heats the brittle material 9, the air tap 5 applies air flow with air pressure to the laser molten pool, the ultrasonic generator 6 carries out ultrasonic vibration on the molten pool, multi-physical-field auxiliary polishing is realized, the molten state time of the molten pool is prolonged, the thermal capillary force and the capillary force have sufficient action time, the effect of 'melting peak filling valley' is accelerated, the laser polishing smoothing effect is improved, the surface of the brittle material 9 is more compact, and the generation of cracks is reduced or eliminated.
Specifically, the laser assembly 1 comprises a laser 11 and a vibrating mirror 12, the brittle material polishing device further comprises an air floatation shockproof platform 7, and the laser 11 and the vibrating mirror 12 are mounted on the air floatation shockproof platform 7. The air floatation shockproof platform 7 can adjust the level of the table top, so that the problem that a laser beam cannot vertically irradiate a sample due to uneven ground is avoided. Meanwhile, the air floatation shockproof platform 7 can reduce external disturbance to the minimum, and high stability is provided for experiments.
Specifically, the brittle material polishing device further comprises a water cooling machine 8, wherein the water cooling machine 8 is respectively communicated with the laser 11 and the vibrating mirror 12, and is used for carrying out water cooling on the laser 11 and the vibrating mirror 12 to prevent the device from being damaged due to overhigh temperature.
Specifically, the laser 11 is CO 2 A pulse laser 11 with an average power of 150W CO 2 The pulse laser 116 has a duty cycle of 60% -100%, a frequency of 1kHz-3kHz, and a scanning speed of 400mm/s-600mm/s。
Specifically, after removing dirt on the surface of the brittle material 9, the sample holder is opened to fix the brittle material 9 on the processing table 2.
Alternatively, as shown in fig. 3 and 6, the processing table 2 includes a lift adjustment assembly 22 and a carrier assembly 23, and the heating plate 21 is mounted on the carrier assembly 23; the lifting adjusting assembly comprises a base 221, a first adjusting screw 222 and two supporting pieces 223; the base 221 is provided with a first sliding cavity 221a, and the two supporting pieces 223 are rotatably connected; one end of the supporting member 223 is rotatably connected to the base 221, and the other end is movably connected to the bearing assembly 23; one end of the other supporting member 223 is movably connected to the first sliding cavity 221a, and the other end is rotatably connected to the bearing assembly 23; the first adjusting screw 222 is installed on the bearing assembly 23 and is in threaded connection with the supporting piece 223 movably connected with the bearing assembly 23; the first adjusting screw 222 is adjusted, and the first adjusting screw 222 drives the bearing assembly 23 to move, so as to drive the two supporting pieces 223 to lift. In this embodiment, the height adjustment in the Z-axis direction can be achieved by the first adjusting screw 222.
Specifically, the connecting shaft 223a of the supporting member 223 penetrates into the first sliding cavity 221a to slide, the two supporting members 223 are rotatably connected, and the two supporting members 223 are respectively rotatably and movably connected with the base 221 and the bearing assembly 23, so that when the first adjusting screw 222 is screwed, the supporting member 223 can be lifted and lowered.
Optionally, the bearing assembly 23 includes a bottom plate 231, an X-axis adjusting plate 232, and a second adjusting screw 233, where the bottom plate 231 is provided with a second sliding cavity 231a; one end of the supporting member 223 is movably connected to the second sliding cavity 231a, and one end of the other supporting member 223 is rotatably connected to the bottom plate 231; the first adjusting screw 222 is mounted on the bottom plate 231 and inserted into the second sliding chamber 231a to be screw-coupled with the support 223 movably coupled in the second sliding chamber 231 a. The X-axis adjusting plate 232 is slidably mounted on the bottom plate 231, and the second adjusting screw 233 is mounted on the bottom plate 231 and is in threaded connection with the X-axis adjusting plate 232; the second adjusting screw 233 is rotated, and the X-axis adjusting plate 232 is moved in the X-axis direction. In this embodiment, the adjustment in the X-axis direction can be achieved by the second adjusting screw 233.
Specifically, the connection shaft 223a of the support member 223 is penetrated into the second sliding chamber 231a to slide, the connection shaft 223a is provided with a slider 223a1, and the second adjusting screw 233 is penetrated through the slider 223a1 and is screw-coupled with the slider 223a 1. The slider 223a1 can be slidably inserted into the slide groove in the second slide chamber 231a to achieve stable sliding.
Specifically, the base plate 231 is provided with a mounting shaft 231b, and the x-axis adjustment plate 232 is slidably mounted on the mounting shaft 231 b.
Optionally, the carrier assembly 23 includes a Y-axis adjustment plate 234 and a third adjustment screw 235; the Y-axis adjusting plate 234 is slidably mounted on the X-axis adjusting plate 232, and the third adjusting screw 235 is mounted on the X-axis adjusting plate 232 and is in threaded connection with the Y-axis adjusting plate 234; the third adjusting screw 235 is rotated, and the Y-axis adjusting plate 234 is moved in the Y-axis direction. In this embodiment, the adjustment in the Y-axis direction can be achieved by the second adjusting screw 233.
Specifically, the X-axis adjustment plate 232 is provided with a mounting shaft 231b, and the y-axis adjustment plate 234 is slidably mounted on the mounting shaft 231 b. The heating plate 21 is mounted on the Y-axis adjusting plate 234.
Through the cooperation of the first adjusting screw 222, the second adjusting screw 233, the third adjusting screw 235, the adjusting piece, the base 221, the X-axis adjusting plate 232, the bottom plate 231 and the Y-axis adjusting plate 234, the three-dimensional adjustment of the processing table 2 can be realized, and the three-dimensional adjustment device is simple and reliable in structure and flexible and convenient to adjust.
Optionally, the support frame 3 includes a support seat 31, a first mechanical arm 32, a second mechanical arm 33, and a third mechanical arm 34; the first mechanical arm 32 is rotatably mounted on the supporting seat 31, the second mechanical arm 33 is rotatably mounted on the first mechanical arm 32, and the third mechanical arm 34 is rotatably mounted on the second mechanical arm 33; the ultrasonic generator 6 is mounted on the end of the second mechanical arm 33, and the air tap 5 is mounted on the end of the third mechanical arm 34.
The installation angle of the ultrasonic generator 6 is adjusted, and the ultrasonic generator 6 forms an included angle of 35-45 degrees with the laser beam. The adoption of the non-contact ultrasonic setting can avoid laser defocusing caused by directly carrying out ultrasonic vibration on a sample, thereby greatly reducing the laser energy density and setting the ultrasonic frequency to be 25kHz-30kHz. The movement direction of the air nozzle 5 is consistent with the laser direction, so that the air nozzle 5 is positioned at a position 2mm above the light spot.
It should be noted that, the limitation of each step in the present solution is not to be considered as limiting the sequence of steps on the premise of not affecting the implementation of the specific solution, and the steps written in the previous step may be executed before, or executed after, or even executed simultaneously, so long as the implementation of the present solution is possible, all the steps should be considered as falling within the protection scope of the present invention.
The above description of the invention in connection with specific alternative embodiments is further detailed and it is not intended that the invention be limited to the specific embodiments disclosed. It will be apparent to those skilled in the art that several simple deductions or substitutions may be made without departing from the spirit of the invention, and these should be considered to be within the scope of the invention.
Claims (10)
1. A multi-physical-field brittle material laser polishing method is characterized by comprising the following steps:
heating the brittle material;
maintaining heating of the brittle material and laser polishing the brittle material; heating to increase the cooling and solidifying time of molten materials in the molten pool so that the capillary force and the hot capillary force of the molten pool have sufficient action time to realize the effect of 'melting peak and filling valley';
a molten pool formed by ultrasonic vibration laser polishing of the brittle material;
applying air flow with air pressure to the molten pool above the molten pool so as to ensure that the dissolution materials in the molten pool are uniformly distributed by tangential force and realize 'melting peak filling';
the heating high temperature, ultrasonic vibration and airflow of the brittle material laser polishing method jointly act on the molten pool, so that the molten state time of the molten pool is prolonged, the acting time of thermal capillary force and capillary force is sufficient, and the laser polishing surface is smooth and compact and has no cracks.
2. The method for laser polishing a brittle material according to claim 1, wherein the laser polishing method comprises the specific steps of:
a gas flow with gas pressure is applied to the molten pool on one side above the molten pool so as to lead the dissolution materials in the molten pool to be uniformly distributed by tangential force.
3. The method for laser polishing a brittle material according to claim 1, wherein the laser polishing method comprises the specific steps of:
the laser is leveled so that the laser light is perpendicularly irradiated on the surface of the brittle material.
4. The method of laser polishing a brittle material according to claim 1, wherein the heating temperature for heating the brittle material is 500 ℃ to 600 ℃, and the air pressure of the air flow is 20MPa to 30MPa.
5. The method of claim 1, wherein the laser has a power of 150W, a duty cycle of 60% -100%, a frequency of 1kHz-3kHz, and a scanning speed of 400mm/s-600mm/s.
6. A brittle material polishing apparatus applying the brittle material laser polishing method according to any one of claims 1 to 5, characterized by comprising a laser assembly, a processing table and a supporting frame; the laser component and the supporting frame are placed on the side edge of the processing table, a heating plate for placing the brittle material and heating the brittle material is arranged on the processing table, an air tap and an ultrasonic generator are mounted on the supporting frame, and the air tap and the ultrasonic generator extend above the heating plate; the air tap is used for applying air flow with air pressure to the laser molten pool, and the ultrasonic generator is used for carrying out ultrasonic vibration on the molten pool.
7. The brittle material polishing apparatus according to claim 6, wherein the processing table comprises a lifting adjustment assembly and a carrier assembly, the heating plate being mounted on the carrier assembly; the lifting adjusting assembly comprises a base, a first adjusting screw and two supporting pieces; the base is provided with a first sliding cavity, and the two supporting pieces are rotationally connected; one end of the supporting piece is rotatably connected to the base, and the other end of the supporting piece is movably connected to the bearing assembly; one end of the other supporting piece is movably connected in the first sliding cavity, and the other end of the other supporting piece is rotatably connected to the bearing component; the first adjusting screw is arranged on the bearing assembly and is in threaded connection with the supporting piece movably connected with the bearing assembly; and the first adjusting screw is adjusted and drives the bearing assembly to move, so that the two supporting pieces are driven to lift.
8. The brittle material polishing apparatus according to claim 7, wherein the carrier assembly comprises a base plate, an X-axis adjusting plate and a second adjusting screw, the base plate being provided with a second sliding chamber; one end of one supporting piece is movably connected in the second sliding cavity, and one end of the other supporting piece is rotatably connected to the bottom plate; the first adjusting screw is arranged on the bottom plate, inserted into the second sliding cavity and in threaded connection with the supporting piece movably connected in the second sliding cavity;
the X-axis adjusting plate is slidably arranged on the bottom plate, and the second adjusting screw is arranged on the bottom plate and is in threaded connection with the X-axis adjusting plate; and rotating the second adjusting screw, and moving the X-axis adjusting plate in the X-axis direction.
9. The brittle material polishing apparatus according to claim 8, wherein the carrier assembly comprises a Y-axis adjustment plate and a third adjustment screw; the Y-axis adjusting plate is slidably arranged on the X-axis adjusting plate, and the third adjusting screw is arranged on the X-axis adjusting plate and is in threaded connection with the Y-axis adjusting plate; and rotating the third adjusting screw, and moving the Y-axis adjusting plate in the Y-axis direction.
10. The brittle material polishing apparatus according to claim 6, wherein the support frame comprises a support base, a first mechanical arm, a second mechanical arm and a third mechanical arm; the first mechanical arm is rotatably mounted on the supporting seat, the second mechanical arm is rotatably mounted on the first mechanical arm, and the third mechanical arm is rotatably mounted on the second mechanical arm; the ultrasonic generator is arranged on the end part of the second mechanical arm, and the air tap is arranged on the end part of the third mechanical arm.
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Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2759310A1 (en) * | 1997-02-13 | 1998-08-14 | Essilor Int | Polishing glass component using laser beam with preheating of the component |
| CN102453906A (en) * | 2010-10-20 | 2012-05-16 | 中国科学院力学研究所 | Multifunctional gas protection atmosphere case for laser cladding formation |
| CN103114286A (en) * | 2013-02-27 | 2013-05-22 | 沈阳航空航天大学 | Method for repairing titanium alloy by ultrasound-assisted laser |
| CN107520538A (en) * | 2017-08-16 | 2017-12-29 | 江苏大学 | A kind of device and method of new pattern laser indirect stroke microsecond delay |
| CN109483046A (en) * | 2019-01-16 | 2019-03-19 | 长沙中拓创新科技有限公司 | A kind of ultra-hard abrasive material laser mill machine and its technique |
| CN110936019A (en) * | 2019-12-18 | 2020-03-31 | 李军兆 | Airflow-assisted laser wire-filling narrow-gap welding device and using method |
| CN111716005A (en) * | 2020-06-19 | 2020-09-29 | 西安交通大学 | Method for polishing ceramic matrix composite material by ultrasonic-assisted laser |
| CN113385820A (en) * | 2021-06-11 | 2021-09-14 | 绍兴文理学院 | Double-magnetic-field and ultrasonic-wave cooperative auxiliary laser deep melting welding device |
| CN113695993A (en) * | 2021-09-07 | 2021-11-26 | 长春工业大学 | Vibration-assisted laser magnetorheological composite polishing device |
| CN114178702A (en) * | 2021-11-30 | 2022-03-15 | 深圳信息职业技术学院 | Laser polishing device and polishing method |
-
2022
- 2022-05-05 CN CN202210479989.3A patent/CN114871583B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2759310A1 (en) * | 1997-02-13 | 1998-08-14 | Essilor Int | Polishing glass component using laser beam with preheating of the component |
| CN102453906A (en) * | 2010-10-20 | 2012-05-16 | 中国科学院力学研究所 | Multifunctional gas protection atmosphere case for laser cladding formation |
| CN103114286A (en) * | 2013-02-27 | 2013-05-22 | 沈阳航空航天大学 | Method for repairing titanium alloy by ultrasound-assisted laser |
| CN107520538A (en) * | 2017-08-16 | 2017-12-29 | 江苏大学 | A kind of device and method of new pattern laser indirect stroke microsecond delay |
| CN109483046A (en) * | 2019-01-16 | 2019-03-19 | 长沙中拓创新科技有限公司 | A kind of ultra-hard abrasive material laser mill machine and its technique |
| CN110936019A (en) * | 2019-12-18 | 2020-03-31 | 李军兆 | Airflow-assisted laser wire-filling narrow-gap welding device and using method |
| CN111716005A (en) * | 2020-06-19 | 2020-09-29 | 西安交通大学 | Method for polishing ceramic matrix composite material by ultrasonic-assisted laser |
| CN113385820A (en) * | 2021-06-11 | 2021-09-14 | 绍兴文理学院 | Double-magnetic-field and ultrasonic-wave cooperative auxiliary laser deep melting welding device |
| CN113695993A (en) * | 2021-09-07 | 2021-11-26 | 长春工业大学 | Vibration-assisted laser magnetorheological composite polishing device |
| CN114178702A (en) * | 2021-11-30 | 2022-03-15 | 深圳信息职业技术学院 | Laser polishing device and polishing method |
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