CN114843300A - Manufacturing method of display panel and splicing display device - Google Patents

Manufacturing method of display panel and splicing display device Download PDF

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Publication number
CN114843300A
CN114843300A CN202210412090.XA CN202210412090A CN114843300A CN 114843300 A CN114843300 A CN 114843300A CN 202210412090 A CN202210412090 A CN 202210412090A CN 114843300 A CN114843300 A CN 114843300A
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China
Prior art keywords
auxiliary substrate
back plate
display panel
layer
backplane
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Pending
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CN202210412090.XA
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Chinese (zh)
Inventor
王恺君
李林霜
苑春歌
陈黎暄
吴明洲
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Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Application filed by Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd filed Critical Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority to CN202210412090.XA priority Critical patent/CN114843300A/en
Publication of CN114843300A publication Critical patent/CN114843300A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/302—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements characterised by the form or geometrical disposition of the individual elements
    • G09F9/3026—Video wall, i.e. stackable semiconductor matrix display modules
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs

Abstract

The embodiment of the application discloses display panel's manufacturing method and tiled display device, through setting up first auxiliary substrate in the one side that deviates from the backplate of first encapsulated layer, set up second auxiliary substrate in the one side that deviates from first encapsulated layer of backplate, make first auxiliary substrate, second auxiliary substrate, enclose between backplate and the first encapsulated layer and close and form the recess, fill glue in the recess and can make level and second encapsulated layer of arbitrary thickness, thereby encapsulate the side of backplate, effectively improve display panel's reliability.

Description

Manufacturing method of display panel and splicing display device
Technical Field
The application relates to the field of display, in particular to a manufacturing method of a display panel and a splicing display device.
Background
Compared with the conventional Display technologies of Organic Light-Emitting Diode (OLED) and Liquid Crystal Display (LCD), the MiniLED or micro led Display technology has lower power consumption, faster response time, and higher image resolution and color gamut.
However, the size of the MiniLED or micro led display panel is limited, and the current large-sized MiniLED or micro led display device is mainly formed by splicing a plurality of display panels.
In the related art, after the display device is manufactured, the display device needs to be subjected to a RA Test (Reliability Test). In order to improve the reliability of the MiniLED or micro led display device, four side surfaces of a MiniLED or micro led display panel need to be packaged, and at present, the substrate side surfaces are mainly subjected to glue coating packaging by substrate inclination or glue coating head inclination side coating, and the main defects are as follows:
(1) if the viscosity of the glue is low, the glue is easy to overflow, the glue cannot reach a large glue thickness, the side surface packaging of the display panel is unqualified, and the RA test cannot be passed;
(2) the side glue coating type is in a semicircular arc shape, so that the glue thickness at the functional layer is lower than the highest glue thickness, and the abutted seam is larger than the glue thickness actually required.
Therefore, a technical solution capable of solving the above problems is needed.
Disclosure of Invention
The embodiment of the application provides a manufacturing method of a display panel and a splicing display device, and can solve the technical problems that the smoothness of side packaging glue of the display panel is poor and the glue thickness is difficult to reach.
The embodiment of the application provides a manufacturing method of a display panel, which comprises the following steps:
providing a back plate, wherein a light-emitting device is arranged on the surface of the back plate;
forming a first encapsulation layer on the back plate, the first encapsulation layer covering the light emitting device;
arranging a first auxiliary substrate on the first packaging layer, arranging a second auxiliary substrate on one side of the backboard, which is far away from the first packaging layer, wherein the first auxiliary substrate, the second auxiliary substrate, the backboard and the first packaging layer enclose to form a groove, and the groove is arranged on at least one side surface of the backboard;
and forming a second packaging layer in the groove.
Optionally, in some embodiments of the present application, in the step of disposing a first auxiliary substrate on a side of the first encapsulation layer facing away from the backplane, the first auxiliary substrate includes a first central portion and a first extending portion, the first central portion is disposed corresponding to the backplane, and the first extending portion is connected to at least one side of the first central portion;
in the step of arranging a second auxiliary substrate on one side of the back plate, which is far away from the first packaging layer, the second auxiliary substrate comprises a second central portion and a second extending portion, the second central portion is arranged corresponding to the back plate, the second extending portion is connected to at least one side of the second central portion, the first extending portion and the second extending portion are arranged oppositely, and the first extending portion, the second extending portion, the back plate and the first packaging layer are enclosed to form the groove.
Optionally, in some embodiments of the present application, in the step of providing a first auxiliary substrate on a side of the first encapsulation layer facing away from the backplane, the first extending portion is connected to a peripheral side of the first central portion;
in the step of arranging a second auxiliary substrate on the side of the back plate departing from the first packaging layer, the second extending portion is connected to the peripheral side of the second central portion, and the groove is arranged on the peripheral side of the back plate.
Optionally, in some embodiments of the present application, in the step of providing a back plate, the back plate is rectangular;
in the step of arranging a second auxiliary substrate on one side of the back plate, which is far away from the first packaging layer, the depth of the groove arranged corresponding to the long side of the back plate is 10-350 micrometers, and the depth of the groove arranged corresponding to the short side of the back plate is 10-500 micrometers.
Optionally, in some embodiments of the present application, in the step of disposing a second auxiliary substrate on a side of the backplane facing away from the first encapsulation layer, the second auxiliary substrate is fixed to the side of the backplane facing away from the first encapsulation layer by a temporary glue;
the manufacturing method of the display panel further comprises the following steps:
and stripping the second auxiliary substrate.
Optionally, in some embodiments of the present application, in the step of disposing a first auxiliary substrate on a side of the first encapsulation layer facing away from the backplane, the first auxiliary substrate is fixed to the side of the first encapsulation layer facing away from the backplane by a temporary glue;
in the step of arranging a second auxiliary substrate on the side of the backboard departing from the first packaging layer, the second auxiliary substrate is fixed on the side of the backboard departing from the first packaging layer through a temporary adhesive;
the manufacturing method of the display panel further comprises the following steps:
and stripping the first auxiliary substrate and the second auxiliary substrate.
Optionally, in some embodiments of the present application, after forming the first encapsulation layer on the backplane, the method further includes: and cutting the back plate to remove the process edge of the back plate.
The embodiment of this application still provides a tiled display device, including at least two display panel, at least two display panel splices together, display panel includes:
the surface of the back plate is provided with a light-emitting device;
the first packaging layer is arranged on the back plate and covers the light-emitting device; and
the second packaging layer is arranged on at least one side face of the back plate, and the surface and the side face of the second packaging layer are smooth;
and in two adjacent display panels, the side surfaces of the second packaging layers are abutted together.
Optionally, in some embodiments of the present application, the backplane is rectangular, a width of the second encapsulation layer disposed corresponding to a long side of the backplane is 10 to 350 micrometers, and a width of the second encapsulation layer disposed corresponding to a short side of the backplane is 10 to 500 micrometers.
Optionally, in some embodiments of the present application, the display panel further includes:
the first auxiliary substrate is arranged on one side of the first packaging layer, which is far away from the backboard;
in two adjacent display panels, the side surfaces of the first auxiliary substrates are abutted together.
The embodiment of the application adopts a manufacturing method of a display panel and a splicing display device, a first auxiliary substrate is arranged on one side of a first packaging layer, which is far away from a back plate, and a second auxiliary substrate is arranged on one side of the back plate, which is far away from the first packaging layer, so that the first auxiliary substrate, the second auxiliary substrate, the back plate and the first packaging layer are enclosed to form a groove, the groove is filled with glue to obtain a second packaging layer with smooth and any thickness, the side surface of the back plate is packaged, and the reliability of the display panel is effectively improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a display device according to a comparative example of the present application;
fig. 2 is a schematic flowchart of a method for manufacturing a display panel according to an embodiment of the present disclosure;
FIG. 3 is a schematic structural diagram of providing a backplane and forming a first encapsulation layer on the backplane according to an embodiment of the present disclosure;
fig. 4 is a schematic structural diagram illustrating a dicing process performed on a backplane and a first package layer and a bonding of a flip chip on the backplane according to an embodiment of the disclosure;
fig. 5 is a schematic structural diagram of a first auxiliary substrate and a second auxiliary substrate respectively disposed on two opposite sides of a backplane and a first encapsulation layer according to an embodiment of the present disclosure;
fig. 6 is a schematic structural diagram of forming a second encapsulation layer in a groove according to an embodiment of the present disclosure;
FIG. 7a is a schematic structural diagram of a second auxiliary substrate being peeled off according to an embodiment of the present disclosure;
fig. 7b is a schematic structural diagram of peeling the first auxiliary substrate and the second auxiliary substrate according to an embodiment of the present disclosure;
fig. 8a is a schematic structural diagram of a tiled display device according to an embodiment of the present application;
fig. 8b is a schematic structural diagram of a tiled display device provided in the embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application. Furthermore, it should be understood that the detailed description and specific examples, while indicating preferred embodiments of the present application, are given by way of illustration and explanation only, and are not intended to limit the present application. In this application, where the context requires otherwise, the words "upper" and "lower" used in relation to the device in use or operation will generally refer to the upper and lower extremities of the device, particularly as oriented in the drawing figures; while "inner" and "outer" are with respect to the outline of the device.
Referring to fig. 1, a display device according to a comparative example is formed by splicing at least two display panels 10, and side encapsulant 11 is disposed on four side surfaces of the display panels 10, specifically, the display panels 10 are tilted and then coated with adhesive, or a coating head is tilted and then coated with adhesive on the side surfaces of the display panels 10, so that the side encapsulant 11 is formed on the side surfaces of the display panels 10. However, in this gluing method, if the viscosity of the glue is low, the glue is easy to overflow, and the glue cannot reach a large glue thickness, so that the side surface of the display panel 10 is not packaged properly, and further the RA test cannot be passed; the side glue coating type is in a semicircular arc shape, so that the glue thickness at the functional layer is lower than the highest glue thickness, and the abutted seam is larger than the glue thickness actually required.
The embodiment of the application provides a manufacturing method of a display panel and a splicing display device. The following are detailed below. It should be noted that the following description of the embodiments is not intended to limit the preferred order of the embodiments.
Referring to fig. 2, an embodiment of the present application provides a method for manufacturing a display panel 100, including the following steps:
step B1, as shown in fig. 3, providing a back plate 110, wherein a light emitting device 114 is disposed on a surface of the back plate 110;
step B2, as shown in fig. 3 and 4, forming a first encapsulation layer 120 on the back sheet 110, the first encapsulation layer 120 covering the light emitting device 114;
step B3, as shown in fig. 5, a first auxiliary substrate 140 is disposed on a side of the first package layer 120 away from the backplane 110, a second auxiliary substrate 150 is disposed on a side of the backplane 110 away from the first package layer 120, the first auxiliary substrate 140, the second auxiliary substrate 150, the backplane 110 and the first package layer 120 enclose a groove 160, and the groove 160 is disposed on at least one side surface of the backplane 110;
step B4, as shown in fig. 6, forms a second encapsulation layer 170 within the recess 160.
According to the embodiment of the application, the first auxiliary substrate 140 is arranged on the side, deviating from the back plate 110, of the first packaging layer 120, the second auxiliary substrate 150 is arranged on the side, deviating from the first packaging layer 120, of the back plate 110, the groove 160 is formed by enclosing the first auxiliary substrate 140, the second auxiliary substrate 150, the back plate 110 and the first packaging layer 120, the second packaging layer 170 with flat and any thickness can be manufactured by filling glue in the groove 160, the side face of the back plate 110 is packaged, and the reliability of the display panel 100 is effectively improved.
Specifically, in the manufacturing method of the display panel 100 according to the embodiment of the present application, the step B1 specifically includes:
step B11, providing a substrate 111, wherein the material of the substrate 111 may be, but is not limited to, glass;
step B12, forming a driving circuit layer 112 and a binding portion 113 on the substrate 111, wherein the driving circuit layer 112 is electrically connected to the binding portion 113;
step B13, forming the light emitting device 114 on the driving circuit layer 112, and transferring the light emitting device 114 to the driving circuit layer 112 by a Surface Mount Technology (SMT) or a bulk transfer process. The Light Emitting device 114 may be a Light-Emitting Diode (LED), and specifically may be a Micro LED (Micro LED) or a Mini LED (Mini LED).
Specifically, in step B12, the binding portion 113 is disposed on one side of the substrate 111, so that when the manufactured display panel 100 is assembled, the side of the display panel 100 corresponding to the binding portion 113 is disposed outward, which is beneficial to reducing the seam.
Specifically, in step B12, the driving circuit layer 112 includes a thin film transistor, the thin film transistor includes a gate electrode, an active layer, a source electrode and a drain electrode, and the thin film transistor may have a top gate structure, wherein the active layer may be made of amorphous Silicon (a-Si), Indium Gallium Zinc Oxide (IGZO), Indium Gallium Tin Oxide (IGTO) or Low Temperature polysilicon (Low Temperature Poly-Silicon, p-Si). In this embodiment, the light transmittance of the back plate 110 can reach more than 80%.
Specifically, in the step B2, the first sealing layer 120 may be formed by a spraying process, a slit coating process, or the like, and the material of the first sealing layer 120 may be one or more selected from glue such as silicon gel, epoxy glue, or the like. With the above arrangement, the first encapsulation layer 120 having high light transmittance may be obtained, and the light transmittance of the first encapsulation layer 120 may be greater than or equal to 90%.
Specifically, in step B2, if the thickness of the first encapsulant layer 120 is too large, there is a large light loss; if the thickness of the first encapsulation layer 120 is too small, the encapsulation effect is reduced, and water vapor easily erodes the driving circuit layer 112 or the light emitting device 114. In order to avoid the above problem, the thickness of the first encapsulation layer 120 should be set to 1.2-2 times that of the light emitting device 114, so that the optical loss can be reduced, the encapsulation effect can be ensured, and the water vapor erosion can be effectively reduced.
Specifically, as shown in fig. 2 to 4, after the first encapsulation layer 120 is formed on the back plate 110, the step B2 further includes: the back plate 110 is cut to remove the process edge of the back plate 110, and during the cutting process, the back plate 110 and the first package layer 120 may be cut simultaneously, so that the side surface of the back plate 110 is flat, and the subsequent side surface packaging is facilitated. In this embodiment, the back plate 110 may be cut by, but not limited to, laser cutting.
Specifically, the width of the technical edge may be 5 mm to 20 mm, for example, the width of the technical edge may be 5 mm, 7 mm, 8 mm, 10 mm, 12 mm, 14 mm, 16 mm, 18 mm or 20 mm, and the width of the technical edge may be appropriately adjusted according to the selection of the actual situation and the specific requirement, and is not limited herein.
Specifically, in the process of cutting the back plate 110 in the step B2, the negative tolerance of the cutting accuracy of the long edge of the back plate 110 is 0 to 350 micrometers, and the cut and removed part is subsequently supplemented by the second packaging layer 170, so that the arrangement can ensure that the edge joint between the long edges of two adjacent back plates 110 is small during subsequent splicing.
Specifically, the negative tolerance of the cutting accuracy of the short edges of the corresponding back plate 110 is 0-500 micrometers, the cut and removed part is subsequently supplemented by the second packaging layer 170, and the arrangement can ensure that the abutted seam between the short edges of the two adjacent back plates 110 is small during subsequent splicing.
The negative tolerance for the cutting accuracy of the short side of the back plate 110 refers to a difference between the length of the long side of the back plate 110 obtained after cutting and the theoretical length of the long side of the back plate 110, and the negative tolerance for the cutting accuracy of the long side of the back plate 110 refers to a difference between the length of the short side of the back plate 110 obtained after cutting and the theoretical length of the short side of the back plate 110.
Specifically, as shown in fig. 2 to 4, after the back plate 110 is cut, step B2 further includes: the flip chip film 130 is bonded to the bonding portion 113. In this embodiment, the flip chip film 130 includes a chip 131, and the chip 131 is electrically connected to the driving circuit layer 112 through the bonding portion 113, so as to control the operation of the driving circuit layer 112.
Specifically, in step B1, the back plate 110 has a rectangular shape, and specifically, the substrate 111 has a rectangular shape. In the step B12, forming a trace on the substrate 111, and electrically connecting the bonding portion 113 with the driving circuit layer 112 through the trace. In step B2, after the back panel 110 is cut, the distance between the edge of the long side of the back panel 110 and the trace is greater than 100 micrometers, so that the trace can be prevented from being accidentally damaged during cutting. In this embodiment, the binding portions 113 are disposed corresponding to the short sides of the back plate 110.
Specifically, in step B3, the first auxiliary substrate 140 includes a first central portion 141 and a first extending portion 142, the first central portion 141 is disposed corresponding to the back plate 110, and the first extending portion 142 is connected to at least one side of the first central portion 141, that is, the first extending portion 142 does not overlap the back plate 110; the second auxiliary substrate 150 includes a second central portion 151 and a second extending portion 152, the second central portion 151 is disposed corresponding to the backplate 110, the second extending portion 152 is connected to at least one side of the second central portion 151, that is, the second extending portion 152 does not overlap with the backplate 110, the first extending portion 142 and the second extending portion 152 are disposed opposite to each other, and the first extending portion 142, the second extending portion 152, the backplate 110 and the first encapsulation layer 120 enclose to form a groove 160. In this embodiment, each of the first and second auxiliary substrates 140 and 150 may have a rectangular shape, and the length of the long side of each of the first and second auxiliary substrates 140 and 150 is greater than that of the long side of the backplate 110, and the length of the short side of each of the first and second auxiliary substrates 140 and 150 is greater than that of the short side of the backplate 110.
Specifically, in step B3, the first extending portion 142 is connected to the peripheral side of the first central portion 141; correspondingly, the second extending portion 152 is connected to the periphery of the second central portion 151, and the groove 160 is disposed on the periphery of the back plate 110, so that the second encapsulating layer 170 can be disposed around the back plate 110, thereby greatly improving the encapsulating effect and being beneficial to improving the reliability of the display panel 100.
Specifically, in step B3, the depth of the groove 160 corresponding to the long side of the back plate 110 is 10 to 350 microns, and the depth of the groove 160 corresponding to the short side of the back plate 110 is 10 to 500 microns. In this embodiment, one of the short sides of the back plate 110 is provided with a binding portion 113. Note that the depth of the groove 160 refers to the distance from the bottom surface of the groove 160 to the opening of the groove 160, i.e., the width of the second encapsulation layer 170 formed in step B4.
Specifically, in the embodiment of the present application, the depth of the groove 160 disposed corresponding to the long side of the backplate 110 may be 10 micrometers, 30 micrometers, 50 micrometers, 70 micrometers, 90 micrometers, 100 micrometers, 120 micrometers, 140 micrometers, 160 micrometers, 180 micrometers, 200 micrometers, 220 micrometers, 240 micrometers, 260 micrometers, 280 micrometers, 300 micrometers, 330 micrometers or 350 micrometers, the depth of the groove 160 disposed corresponding to the short side of the backplate 110 may be 20 micrometers, 40 micrometers, 60 micrometers, 80 micrometers, 100 micrometers, 120 micrometers, 140 micrometers, 160 micrometers, 180 micrometers, 200 micrometers, 220 micrometers, 240 micrometers, 260 micrometers, 280 micrometers, 300 micrometers, 330 micrometers, 350 micrometers, 400 micrometers, 450 micrometers or 500 micrometers, and the depth of the groove 160 disposed corresponding to the long side of the backplate 110 and the depth of the groove 160 disposed corresponding to the short side of the backplate 110 may be appropriately adjusted according to the selection of actual conditions and the specific requirements, and are not intended to be limited solely thereto.
Specifically, because backplate 110's minor face is equipped with binding portion 113, therefore, the width of the reservation of the minor face part of backplate 110 is great, in order to guarantee that two adjacent backplate 110's piece is less when follow-up concatenation, the negative tolerance scope of the cutting accuracy of the minor face that corresponds backplate 110 will be greater than the negative tolerance scope of the cutting accuracy of the long limit that corresponds backplate 110, because backplate 110's minor face contracts in more, the degree of depth that can make the recess 160 that corresponds the minor face setting is greater than the degree of depth that corresponds the recess 160 that the long limit set up, therefore, the width of the second packaging layer 170 of the minor face of backplate 110 will be greater than the width of the second packaging layer 170 on long limit, be favorable to preventing steam from getting into inside backplate 110 from backplate 110's minor face.
Specifically, in the embodiment of the present application, the material of the first auxiliary substrate 140 and the second auxiliary substrate 150 is glass, and of course, the material of the first auxiliary substrate 140 and the second auxiliary substrate 150 may also be a steel plate, a PET (polyethylene terephthalate) film material, or other substrates according to the selection of the actual situation and the specific requirement, which is not limited herein.
Specifically, in the step B4, glue may be filled into the groove 160 by filling, so that the glue is flush with the side surface of the first auxiliary substrate 140 (or the second auxiliary substrate 150), and then the glue is cured, so as to obtain the second encapsulation layer 170. In this embodiment, the glue may be filled into the groove 160 by spot coating, spray coating, or dip coating. When the glue is filled into the groove 160 by spot coating or spraying, the back plate 110 may be turned over by a five-axis machine, so that the back plate 110 is coated with the glue at 90 °.
Specifically, in the step B4, the glue may be selected from one or two of epoxy resin and acrylic resin, and the second encapsulating layer 170 has a low Water Vapor Transmission Rate (WVIR), and the Water Vapor Transmission Rate of the second encapsulating layer 170 is less than or equal to 10 -3 Grams per square meter per day. With the above arrangement, the side encapsulation effect of the display panel 100 can be greatly improved.
Specifically, in the step B3, the second auxiliary substrate 150 may be adhered to the side of the back plate 110 facing away from the first encapsulation layer 120 by the temporary glue. As shown in fig. 2, the method for manufacturing the display panel 100 further includes:
step B5, as shown in fig. 6 and 7a, peels off the second auxiliary substrate 150.
In the above step B5, as shown in fig. 7a, the second auxiliary substrate 150 is peeled off and the first auxiliary substrate 140 remains, and in this structure, as shown in fig. 8a, the first auxiliary substrate 140 may be butted to join the two display panels 100. In this embodiment, the first auxiliary substrate 140 and the first encapsulation layer 120 may be bonded by a fixing adhesive, the fixing adhesive may be OCA adhesive, and the temporary adhesive between the second auxiliary substrate 150 and the back plate 110 may be UV anti-adhesive or thermal adhesive. When it is necessary to peel off the second auxiliary substrate 150, the second auxiliary substrate 150 is peeled off by reducing the viscosity of the UV visbreaker by means of UV light irradiation or by reducing the viscosity of the thermal adhesive by means of temperature rise.
Specifically, in the step B3, the first auxiliary substrate 140 may be adhered to the side of the first encapsulation layer 120 away from the back plate 110 by the temporary glue, and the second auxiliary substrate 150 may be adhered to the side of the back plate 110 away from the first encapsulation layer 120 by the temporary glue. As shown in fig. 2, the method for manufacturing the display panel 100 further includes:
step B5, as shown in fig. 6 and 7B, peels the first auxiliary substrate 140 and the second auxiliary substrate 150.
As shown in fig. 7B, in the step B5, the first auxiliary substrate 140 and the second auxiliary substrate 150 are peeled off, and in this structure, as shown in fig. 8B, during the splicing, the second encapsulation layer 170 may be butted to realize the splicing of the two display panels 100. In this embodiment, the temporary adhesive between the first auxiliary substrate 140 and the first encapsulation layer 120 may be a UV anti-adhesive or a thermal adhesive, and when the first auxiliary substrate 140 needs to be peeled, the viscosity of the UV anti-adhesive is reduced by means of UV light irradiation, or the viscosity of the thermal adhesive is reduced by means of temperature rise, so as to peel the first auxiliary substrate 140; the temporary paste between the second auxiliary substrate 150 and the first encapsulation layer 120 may be UV-detackifying paste or heat-sensitive paste, which is irradiated by UV light to reduce the viscosity of the UV-detackifying paste, or heated to reduce the viscosity of the heat-sensitive paste, so as to peel off the second auxiliary substrate 150.
As shown in fig. 7a to 7b, an embodiment of the present application further provides a display panel 100 manufactured by the above method, where the display panel 100 includes a back plate 110, a first encapsulation layer 120, and a second encapsulation layer 170, a light emitting device 114 is disposed on a surface of the back plate 110, the first encapsulation layer 120 is disposed on the back plate 110, and the first encapsulation layer 120 covers the light emitting device 114; the second packaging layer 170 is disposed on at least one side of the backplate 110, and the surface and the side of the second packaging layer 170 are flat.
Specifically, the back plate 110 further includes a substrate 111, a driving circuit layer 112 and a binding portion 113, the substrate 111 may be made of, but not limited to, glass, the driving circuit layer 112 and the binding portion 113 are disposed on the substrate 111, the driving circuit layer 112 is electrically connected to the binding portion 113, and the light emitting device 114 is disposed on the driving circuit layer 112. In this embodiment, the Light Emitting device 114 may be a Light-Emitting Diode (LED), and specifically may be a Micro LED (Micro LED) or a Mini LED (Mini LED).
Specifically, binding portion 113 is located one side of substrate 111, so set up, when splicing display panel 100 who will make, can set up display panel 100 one side that corresponds to be equipped with binding portion 113 outwards, is favorable to reducing the piece.
Specifically, the driving circuit layer 112 includes a thin film transistor, which includes a gate electrode, an active layer, a source electrode and a drain electrode, and the thin film transistor may have a top gate structure, wherein the active layer may be made of amorphous Silicon (a-Si), Indium Gallium Zinc Oxide (IGZO), Indium Gallium Tin Oxide (IGTO), or Low Temperature polysilicon (Low Temperature polysilicon, p-Si). In this embodiment, the light transmittance of the back plate 110 can reach more than 80%.
Specifically, the material of the first encapsulation layer 120 may be one or more than two selected from glue such as silicone glue and epoxy glue. With the above arrangement, the first encapsulation layer 120 having high light transmittance may be obtained, and the light transmittance of the first encapsulation layer 120 may be greater than or equal to 95%.
Specifically, if the thickness of the first encapsulant layer 120 is too large, there will be a large loss of light; if the thickness of the first encapsulation layer 120 is too small, the encapsulation effect is reduced, and water vapor easily erodes the driving circuit layer 112 or the light emitting device 114. In order to avoid the above problem, the thickness of the first encapsulation layer 120 should be set to 1.2-2 times that of the light emitting device 114, so that the optical loss can be reduced, the encapsulation effect can be ensured, and the water vapor erosion can be effectively reduced.
Specifically, the display panel 100 further includes a chip on film 130, and the chip on film 130 is bonded to the bonding portion 113. In this embodiment, the flip chip film 130 includes a chip 131, and the chip 131 is electrically connected to the driving circuit layer 112 through the bonding portion 113, so as to control the operation of the driving circuit layer 112.
Specifically, the back plate 110 is rectangular, and specifically, the substrate 111 is rectangular. The back plate 110 further includes traces disposed on the substrate 111, and the bonding portions 113 are electrically connected to the driving circuit layer 112 through the traces. In this embodiment, the binding portions 113 are disposed corresponding to the short sides of the back plate 110.
Specifically, the second encapsulation layer 170 is disposed on the periphery of the back plate 110, so as to greatly improve the encapsulation effect and improve the reliability of the display panel 100.
Specifically, the width of the second encapsulation layer 170 corresponding to the long side of the backplane 110 is 10 to 350 micrometers, and the width of the second encapsulation layer 170 corresponding to the short side of the backplane 110 is 10 to 500 micrometers.
Specifically, one of the short sides of the back plate 110 is provided with the binding portion 113, and thus, the width of the second encapsulation layer 170 of the short side of the back plate 110 is greater than the width of the second encapsulation layer 170 of the long side.
Specifically, in the embodiment of the present invention, the width of the second encapsulation layer 170 disposed corresponding to the long side of the backplane 110 may be 10 micrometers, 30 micrometers, 50 micrometers, 70 micrometers, 90 micrometers, 100 micrometers, 120 micrometers, 140 micrometers, 160 micrometers, 180 micrometers, 200 micrometers, 220 micrometers, 240 micrometers, 260 micrometers, 280 micrometers, 300 micrometers, 330 micrometers or 350 micrometers, the width of the second encapsulation layer 170 disposed corresponding to the short side of the backplane 110 may be 20 micrometers, 40 micrometers, 60 micrometers, 80 micrometers, 100 micrometers, 120 micrometers, 140 micrometers, 160 micrometers, 180 micrometers, 200 micrometers, 220 micrometers, 240 micrometers, 260 micrometers, 280 micrometers, 300 micrometers, 330 micrometers, 350 micrometers, 400 micrometers, 450 micrometers or 500 micrometers, and the width of the second encapsulation layer 170 disposed corresponding to the long side of the backplane 110 and the width of the second encapsulation layer 170 disposed corresponding to the short side of the backplane 110 may be appropriately adjusted according to the selection of practical situation and the specific requirements, and are not intended to be limited solely thereto.
Specifically, the material of the second encapsulating layer 170 may be one or two selected from epoxy resin, acrylic resin, and the like, and the obtained second encapsulating layer 170 has a low Water Vapor Transmission rate (Water Vapor Transmission)Rate, WVIR), the second encapsulation layer 170 has a water vapor transmission Rate of 10 or less -3 Grams per square meter per day. With the above arrangement, the side encapsulation effect of the display panel 100 can be greatly improved.
As shown in fig. 7a, the display panel 100 further includes a first auxiliary substrate 140 disposed on a side of the first encapsulation layer 120 away from the backplane 110, and in this structure, as shown in fig. 8a, during the splicing process, the first auxiliary substrate 140 may be butted to realize the splicing of the two display panels 100. In this embodiment, the fixing paste between the first auxiliary substrate 140 and the back plate 110 may be OCA paste.
As shown in fig. 7b, the display panel 100 is not provided with the first auxiliary substrate 140 and the second auxiliary substrate 150, and in this structure, as shown in fig. 8b, during the splicing process, the second encapsulation layer 170 may be butted to realize the splicing process of the two display panels 100.
Referring to fig. 8a-8b, an embodiment of the present application further provides a tiled display device, which includes at least two display panels 100 as described above, and at least two display panels 100 are tiled together. Compared with the display device of the comparative embodiment, the side of the second packaging layer 170 of the display panel 100 is flat, so that the side of the second packaging layer 170 in two adjacent display panels 100 is tightly abutted together, and the two adjacent display panels 100 can be tightly abutted together, which is beneficial to reducing the abutted seam.
Specifically, the display panel 100 further includes a first auxiliary substrate 140 disposed on a side of the first encapsulation layer 120 away from the backplane 110, and in two adjacent display panels 100, side surfaces of the first auxiliary substrate 140 abut against each other. In this structure, as shown in fig. 8a, when the two display panels 100 are spliced, the first auxiliary substrate 140 may be butted. In this embodiment, the fixing glue between the first auxiliary substrate 140 and the back plate 110 may be OCA glue.
The above detailed description is made on the manufacturing method of the display panel and the tiled display device provided in the embodiment of the present application, and a specific example is applied in the detailed description to explain the principle and the implementation manner of the present application, and the description of the above embodiment is only used to help understanding the method and the core idea of the present application; meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims (10)

1. A method for manufacturing a display panel is characterized by comprising the following steps:
providing a back plate, wherein a light-emitting device is arranged on the surface of the back plate;
forming a first encapsulation layer on the back plate, the first encapsulation layer covering the light emitting device;
arranging a first auxiliary substrate on one side of the first packaging layer, which is far away from the backboard, arranging a second auxiliary substrate on one side of the backboard, which is far away from the first packaging layer, wherein the first auxiliary substrate, the second auxiliary substrate, the backboard and the first packaging layer are enclosed to form a groove, and the groove is arranged on at least one side surface of the backboard;
and forming a second packaging layer in the groove.
2. The method for manufacturing a display panel according to claim 1, wherein in the step of disposing a first auxiliary substrate on a side of the first encapsulation layer facing away from the backplane, the first auxiliary substrate includes a first central portion and a first extending portion, the first central portion is disposed corresponding to the backplane, and the first extending portion is connected to at least one side of the first central portion;
in the step of arranging a second auxiliary substrate on one side of the back plate, which is far away from the first packaging layer, the second auxiliary substrate comprises a second central portion and a second extending portion, the second central portion is arranged corresponding to the back plate, the second extending portion is connected to at least one side of the second central portion, the first extending portion and the second extending portion are arranged oppositely, and the first extending portion, the second extending portion, the back plate and the first packaging layer are enclosed to form the groove.
3. The method for manufacturing a display panel according to claim 2, wherein in the step of providing the first auxiliary substrate on a side of the first encapsulation layer facing away from the backplane, the first extension portion is connected to a peripheral side of the first center portion;
in the step of arranging a second auxiliary substrate on the side of the back plate departing from the first packaging layer, the second extending portion is connected to the peripheral side of the second central portion, and the groove is arranged on the peripheral side of the back plate.
4. The method for manufacturing a display panel according to claim 3, wherein in the step of providing a back plate, the back plate is rectangular;
in the step of arranging a second auxiliary substrate on one side of the back plate, which is far away from the first packaging layer, the depth of the groove arranged corresponding to the long side of the back plate is 10-350 micrometers, and the depth of the groove arranged corresponding to the short side of the back plate is 10-500 micrometers.
5. The method for manufacturing a display panel according to claim 1, wherein in the step of providing a second auxiliary substrate on a side of the backplane facing away from the first encapsulation layer, the second auxiliary substrate is fixed to the side of the backplane facing away from the first encapsulation layer by a temporary adhesive;
the manufacturing method of the display panel further comprises the following steps:
and stripping the second auxiliary substrate.
6. The method for manufacturing a display panel according to claim 1, wherein in the step of providing the first auxiliary substrate on the side of the first encapsulation layer facing away from the backplane, the first auxiliary substrate is fixed to the side of the first encapsulation layer facing away from the backplane by a temporary adhesive;
in the step of arranging a second auxiliary substrate on the side of the backboard departing from the first packaging layer, the second auxiliary substrate is fixed on the side of the backboard departing from the first packaging layer through a temporary adhesive;
the manufacturing method of the display panel further comprises the following steps:
and stripping the first auxiliary substrate and the second auxiliary substrate.
7. The method for manufacturing a display panel according to claim 1, further comprising, after forming the first encapsulation layer on the backplane: and cutting the back plate to remove the process edge of the back plate.
8. A tiled display arrangement comprising at least two display panels tiled together, the display panels comprising:
the surface of the back plate is provided with a light-emitting device;
the first packaging layer is arranged on the back plate and covers the light-emitting device; and
the second packaging layer is arranged on at least one side face of the back plate, and the surface and the side face of the second packaging layer are smooth;
and in two adjacent display panels, the side surfaces of the second packaging layers are abutted together.
9. The tiled display apparatus of claim 8, wherein the backplane is rectangular, and the width of the second encapsulant layer disposed corresponding to the long side of the backplane is 10-350 microns, and the width of the second encapsulant layer disposed corresponding to the short side of the backplane is 10-500 microns.
10. The tiled display arrangement of claim 8 wherein the display panel further comprises:
the first auxiliary substrate is arranged on one side of the first packaging layer, which is far away from the backboard;
in two adjacent display panels, the side surfaces of the first auxiliary substrates are abutted together.
CN202210412090.XA 2022-04-19 2022-04-19 Manufacturing method of display panel and splicing display device Pending CN114843300A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210412090.XA CN114843300A (en) 2022-04-19 2022-04-19 Manufacturing method of display panel and splicing display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210412090.XA CN114843300A (en) 2022-04-19 2022-04-19 Manufacturing method of display panel and splicing display device

Publications (1)

Publication Number Publication Date
CN114843300A true CN114843300A (en) 2022-08-02

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210412090.XA Pending CN114843300A (en) 2022-04-19 2022-04-19 Manufacturing method of display panel and splicing display device

Country Status (1)

Country Link
CN (1) CN114843300A (en)

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