CN114843053A - Current sensing resistor and manufacturing method thereof - Google Patents
Current sensing resistor and manufacturing method thereof Download PDFInfo
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- CN114843053A CN114843053A CN202210502059.5A CN202210502059A CN114843053A CN 114843053 A CN114843053 A CN 114843053A CN 202210502059 A CN202210502059 A CN 202210502059A CN 114843053 A CN114843053 A CN 114843053A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
- H01C1/028—Housing; Enclosing; Embedding; Filling the housing or enclosure the resistive element being embedded in insulation with outer enclosing sheath
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/02—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
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- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
The invention discloses a current sensing resistor and a manufacturing method thereof, comprising the following steps: the device comprises an insulating support plate, a protection unit, a current electrode, a voltage electrode and a resistance plate arranged on the surface of the insulating support plate; one end of the resistance plate facing the length direction of the insulating support plate is provided with a notch; the protection unit comprises a first solder mask layer and a second solder mask layer which are attached to the surface of the resistor plate, the first solder mask layer and the second solder mask layer are respectively arranged along the length direction parallel to the insulating carrier plate and the length direction vertical to the insulating carrier plate, one end of the first solder mask layer covers the top of the gap, and the first solder mask layer and the second solder mask layer form a cross shape to divide the resistor plate into different electrode accommodating areas; the current electrode is arranged in the electrode accommodating area at one end of the resistance plate; the voltage electrode is arranged in the electrode accommodating area at the other end of the resistance plate; the invention has simple manufacturing process, lower cost and better resistance precision.
Description
Technical Field
The present invention relates to the field of resistors, and more particularly, to a current sensing resistor and a method for manufacturing the same.
Background
The working principle of the current sensing resistor is that the resistor is connected in series in a load circuit, the voltage drop generated on the resistor is measured when power is supplied to the load, and the current intensity flowing through the circuit is calculated by ohm's law. The resistor is a heating element, and in order to reduce energy dissipation in the normal working process, the resistance value of the current sensing resistance device is designed to be smaller, about milliohm, so that the requirement on the resistance value precision is higher than that of a common resistor (within +/-1%).
At present, with the requirement on the current detection precision becoming higher and higher, the two-terminal current sensing resistor is switched to the four-terminal current sensing resistor, but with the development of product refinement, the manufacturing difficulty of the existing four-terminal current sensing resistor is high, the yield is low, and the manufacturing cost is high.
Disclosure of Invention
The main objective of the present invention is to provide a current sensing resistor and a method for manufacturing the same, which has a simple manufacturing process, a low cost, and a better resistance accuracy.
To achieve the above object, a first aspect of the present invention provides a current sensing resistor, including: the device comprises an insulating support plate, a protection unit, a current electrode, a voltage electrode and a resistance plate arranged on the surface of the insulating support plate;
a notch is formed in one end, facing the length direction of the insulating carrier plate, of the resistor plate;
the protection unit comprises a first solder mask layer and a second solder mask layer which are attached to the surface of the resistor plate, the first solder mask layer and the second solder mask layer are respectively arranged along the length direction parallel to the insulating carrier plate and the length direction vertical to the insulating carrier plate, one end of the first solder mask layer covers the top of the notch, and the first solder mask layer and the second solder mask layer form a cross shape to divide the resistor plate into different electrode accommodating areas;
the current electrode is arranged in the electrode accommodating area at one end of the resistance plate; the voltage electrode is arranged in the electrode accommodating area at the other end of the resistance plate;
when the resistance temperature coefficient of the resistance plate is equal to 0, the sum of the width of the voltage electrode and the width of the second solder mask layer is equal to the depth of the notch.
Preferably, when the temperature coefficient of resistance of the resistance plate is less than 0, the sum of the width of the voltage electrode and the width of the second solder mask layer is less than the depth of the notch.
Preferably, when the temperature coefficient of resistance of the resistance plate is greater than 0, the sum of the width of the voltage electrode and the width of the second solder mask layer is greater than the depth of the notch.
Preferably, the current electrode and the voltage electrode are both provided with a copper layer hung on the surface of the resistor plate and a nickel-tin layer barrel-plated on the surface of the copper layer.
Preferably, the current sensing resistor further comprises a bonding layer, the bonding layer is located between the resistor plate and the insulating carrier plate and is used for bonding the resistor plate on the insulating carrier plate.
Preferably, the length of the voltage electrode is less than the length of the current electrode.
Preferably, the insulating carrier plate comprises one of an alumina ceramic plate, an aluminum nitride ceramic plate or an FR-4 epoxy resin plate.
In a second aspect of the present invention, a method for manufacturing a current sensing resistor is further provided, including the following steps:
providing an insulating carrier plate and a resistor plate, and attaching the resistor plate on the insulating carrier plate;
etching the resistor plate to form a notch at one end of the resistor plate facing the length direction of the insulating carrier plate;
attaching a first solder mask layer and a second solder mask layer on the surface of the resistance plate, wherein the first solder mask layer and the second solder mask layer form a cross shape to divide the resistance plate into different electrode accommodating areas; wherein one end of the first solder mask layer covers the top of the notch;
electroplating the electrode accommodating areas on the same side to respectively form a current electrode and a voltage electrode;
and plating nickel-tin layers on the surfaces of the current electrode and the voltage electrode.
Preferably, after the step of electroplating the electrode receiving areas on the same side to form the current electrode and the voltage electrode respectively, the method further includes:
pasting a third solder mask layer on the surface of the first solder mask layer; the width of the third solder mask layer is larger than that of the first solder mask layer;
electroplating the surfaces of the current electrode and the voltage electrode to enable the surfaces of the current electrode and the voltage electrode to be flush with the surface of the third solder mask layer;
and plating nickel-tin layers on the surfaces of the electroplated current electrode and the electroplated voltage electrode.
Preferably, the thickness of the resistor plate is smaller than that of the insulating carrier plate.
According to the technical scheme, the resistance plate is attached to the insulating support plate, then a notch is formed in one end, facing the length direction of the insulating support plate, of the resistance plate through etching equipment, then the first welding-proof layer is attached to the surface of the resistance plate, one end of the first welding-proof layer covers the top of the notch, the second welding-proof layer is attached to the surface, perpendicular to the length direction of the insulating support plate, of the resistance plate, the second welding-proof layer and the first welding-proof layer form a cross shape to divide the resistance plate into different electrode containing areas, and finally the current electrode and the voltage electrode are placed in the different electrode containing areas respectively.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic diagram of an embodiment of a current sense resistor according to the present invention;
FIG. 2 is a schematic diagram of another embodiment of a current sense resistor according to the present invention;
FIG. 3 is a schematic diagram of a current sense resistor according to another embodiment of the present invention;
FIG. 4 is a flow chart of a method of manufacturing a current sense resistor according to an embodiment of the present invention;
the reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 1 | |
5 | |
| 2 | |
6 | |
| 3 | First solder mask layer | 7 | |
| 4 | Second solder mask | 8 | Gap |
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture, and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, if the meaning of "and/or" and/or "appears throughout, the meaning includes three parallel schemes, for example," A and/or B "includes scheme A, or scheme B, or a scheme satisfying both schemes A and B. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
With the development of product refinement, the manufacturing difficulty of the existing four-terminal current sensing resistor is high, the yield is low, and the manufacturing cost is high.
Referring to fig. 1 and 2, in an embodiment of the present invention, the current sensing resistor includes an insulating carrier plate 1, a protection unit, a current electrode 5, a voltage electrode 6, and a resistor plate 2 disposed on a surface of the insulating carrier plate 2;
a gap 8 is formed at one end of the resistance plate 2 facing the length direction of the insulating carrier plate 1; the protection unit comprises a first welding-proof layer 3 and a second welding-proof layer 4 which are attached to the surface of the resistor plate 1, the first welding-proof layer 3 and the second welding-proof layer 4 are respectively arranged along the length direction parallel to the insulating carrier plate 1 and the length direction vertical to the insulating carrier plate 1, one end of the first welding-proof layer 3 covers the top of the notch 8, and the first welding-proof layer 3 and the second welding-proof layer 4 form a cross shape to divide the resistor plate into different electrode containing areas; the current electrode 5 is arranged in an electrode accommodating area at one end of the resistance plate 2; the voltage electrode 6 is arranged in the electrode accommodating area at the other end of the resistance plate 2, and the length of the voltage electrode 6 is smaller than that of the current electrode 5.
According to the technical scheme, the resistance plate 2 is attached to the insulating carrier plate 1, then the notch 8 is formed in one end, facing the length direction of the insulating carrier plate 1, of the resistance plate 2 through etching equipment, then the first solder mask layer 3 is attached to the surface of the resistance plate 2, one end of the first solder mask layer 3 covers the top of the notch 8, the second solder mask layer 4 is attached to the surface, perpendicular to the length direction of the insulating carrier plate 1, of the resistance plate 2, the second solder mask layer 4 and the first solder mask layer 3 form a cross shape to divide the resistance plate 2 into different electrode containing areas, and finally the current electrode 5 and the voltage electrode 6 are respectively placed in the different electrode containing areas.
In addition, the notch 8 is only formed at one end of the resistive plate 2 along the length direction of the insulating carrier plate 1, that is, the notch 8 is only formed singly, and compared with the conventional current sensing resistor in which the notches 8 are formed at both ends of the resistive plate 2, the current density can be reduced in the working process to improve the accuracy of the resistance value.
It should be noted that, because the commonly used resistive materials in the market at present contain many components of MnCu or NiCu, and the resistance temperature coefficients of each material are different, some materials have resistance temperature coefficients greater than 0, some materials have resistance temperature coefficients less than 0, and some materials have resistance temperature coefficients equal to 0, in order to meet the requirements of different adaptive materials, the resistance Temperature Coefficient (TCR) can be adjusted by changing the depth of the notch, and the depth of the notch is specifically adjusted as follows:
when the temperature coefficient of resistance of the resistance plate 2 is greater than 0, the sum of the width of the voltage electrode 6 and the width of the second solder mask layer 4 is greater than the depth of the notch 8, that is: h is more than A + B, H is the depth of the notch 8, A is the width of the voltage electrode 6, and B is the width of the second solder mask layer 4. The depth H of the notch 8 is set to be larger than the sum of the width A of the voltage electrode 6 and the width B of the second solder mask layer 4, so that the resistance coefficient of the resistance plate is adjusted to be larger than 0;
when the temperature coefficient of resistance of the resistance plate 2 is less than 0, the sum of the width of the voltage electrode 6 and the width of the second solder mask layer 4 is less than the depth of the notch 8, that is: h < A + B, H is the depth of the notch 8, A is the width of the voltage electrode 6, and B is the width of the second solder mask layer 4. The depth H of the notch 8 is set to be smaller than the sum of the width A of the voltage electrode 6 and the width B of the second solder mask layer 4, so that the resistance coefficient of the resistance plate 2 is adjusted to be smaller than 0;
when the temperature coefficient of resistance of the resistive plate 2 is equal to 0, the sum of the width of the voltage electrode 6 and the width of the second solder mask layer 4 is equal to the depth of the notch 8, i.e.: h is a depth of the notch 8, a is a width of the voltage electrode 6, and B is a width of the second solder mask layer 4. The resistivity of the resistive plate 2 is adjusted to 0 by setting the depth H of the notch 8 to be equal to the sum of the width a of the voltage electrode 6 and the width B of the second solder resist layer 4.
In one embodiment, the current electrode 5 and the voltage electrode 6 are both provided with a copper layer hung on the surface of the resistance plate 2 and a nickel-tin layer barrel-plated on the surface of the copper layer. It should be noted that the thickness range value of the copper layer hung on the surface of the resistance plate 2 is 90-120 μm, the conductivity is better in the range, the influence of the electrode value on the measurement result can be minimized, and the nickel-tin layer is welded on the surface of the copper layer in a barrel plating manner, so that the operation is more convenient.
In one embodiment, the current sensing resistor further comprises an adhesive layer 7, the adhesive layer 7 is located between the resistive plate 2 and the insulating carrier plate 1, and is used for adhering the resistive plate 2 to the insulating carrier plate 1.
In one embodiment, the insulating carrier plate 1 comprises one of an alumina ceramic plate, an aluminum nitride ceramic plate or an FR-4 epoxy resin plate.
It should be noted that a large amount of heat is generated in the process of operating the current sensing resistor, and since the alumina ceramic plate, the aluminum nitride ceramic plate or the FR4 epoxy resin plate can bear the temperature within 200 ℃ without deformation and has the property of acid and alkali resistance, the insulating carrier plate 1 adopts one of the alumina ceramic plate, the aluminum nitride ceramic plate or the FR4 epoxy resin plate, which can effectively prevent the current sensing resistor from being deformed due to temperature expansion and contraction; among them, the FR4 epoxy board is a code of a flame-retardant material grade, which means a material specification that the resin material must be self-extinguished after burning, and it is not a material name but a material grade, so FR-4 grade materials used for general insulating carrier boards are very various, but most are composite materials made of so-called tetra-functional (terra-Function) epoxy resin plus Filler (Filler) and glass fiber.
In a second aspect of the present invention, a method for manufacturing a current sensing resistor is further provided, which includes the following steps:
s100, providing an insulating carrier plate and a resistor plate, and attaching the resistor plate on the insulating carrier plate.
And pasting the resistance plate on the insulating carrier plate so that the resistance plate covers the insulating carrier plate, thereby facilitating the subsequent etching of the resistance plate. The resistor plate can be connected to the surface of the insulating carrier plate through an adhesive layer, and can also be fixed in other manners. In addition, the insulating carrier plate comprises one of an alumina ceramic plate, an aluminum nitride ceramic plate or an FR-4 epoxy resin plate, so that a large amount of heat can be generated in the working process of the current sensing resistor, the insulating carrier plate can bear the temperature within 200 ℃ without deformation, and the insulating carrier plate has acid and alkali resistance.
And S200, etching the resistor plate to form a notch at one end of the resistor plate facing to the length direction of the insulating carrier plate.
Compared with the traditional current sensing resistor with the notches arranged at the two ends of the resistance plate, the current density can be reduced in the working process so as to improve the precision of the resistance value; and the Temperature Coefficient of Resistance (TCR) can be adjusted by changing the depth of the notch so as to meet the requirements of different adaptive materials.
S300, attaching a first welding-proof layer and a second welding-proof layer on the surface of the resistance plate, wherein the first welding-proof layer and the second welding-proof layer form a cross shape to divide the resistance plate into different electrode accommodating areas; wherein, one end of the first solder mask layer covers the top of the gap.
The first welding-proof layer is arranged along the length direction parallel to the insulating support plate, the second welding-proof layer is arranged along the length direction perpendicular to the insulating support plate, the first welding-proof layer and the second welding-proof layer form a cross shape to separate the resistor plate into different electrode accommodating areas, and the second welding-proof layer is connected to the upper portion of the first welding-proof layer, so that the areas of the electrode accommodating areas are different, wherein the current electrode is arranged in the electrode accommodating area with the larger area, and the voltage electrode is arranged in the electrode accommodating area with the smaller area.
And S400, electroplating the electrode accommodating areas on the same side to respectively form a current electrode and a voltage electrode.
And S500, plating nickel-tin layers on the surfaces of the current electrode and the voltage electrode.
The resistance plate is attached to the insulating support plate, then a notch is formed in one end, facing the length direction of the insulating support plate, of the resistance plate through etching equipment, then a first welding-proof layer is attached to the surface of the resistance plate, the top of the notch is covered by one end of the first welding-proof layer, a second welding-proof layer is attached to the surface, perpendicular to the length direction of the insulating support plate, of the resistance plate, the second welding-proof layer and the first welding-proof layer form a cross shape to divide the resistance plate into electrode containing areas with different areas, then the current electrode and the voltage electrode are respectively placed in the different electrode containing areas, finally, a nickel-tin coating is rolled on the current electrode and the voltage electrode, and the manufacturing of the current sensing resistor is completed.
In one embodiment, after the step of electroplating the electrode receiving areas on the same side to form the current electrode and the voltage electrode respectively, the method further includes:
pasting a third solder mask layer on the surface of the first solder mask layer; the width of the third solder mask layer is larger than that of the first solder mask layer;
electroplating the surfaces of the current electrode and the voltage electrode to enable the surfaces of the current electrode and the voltage electrode to be flush with the surface of the third welding prevention layer;
and (4) plating nickel-tin layers on the surfaces of the current electrode and the voltage electrode after electroplating.
After electroplating and forming current electrode and voltage motor in the electrode holding district, paste on the surface of first anti-welding layer and cover the third anti-welding layer, then continue to electroplate current electrode and voltage motor's surface again for the thickness increase of current electrode and voltage electrode, and reach the surface parallel and level with the third anti-welding layer, again at last to the surface roll nickel tin plating layer of the current electrode after the electroplating and voltage electrode, its manufacturing process is simple, the cost is lower, and have better resistance precision.
In addition, the thickness of the resistor plate in the above embodiment is smaller than that of the insulating carrier plate.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A current sense resistor, comprising: the protection device comprises an insulating support plate, a protection unit, a current electrode, a voltage electrode and a resistance plate arranged on the surface of the insulating support plate;
a notch is formed in one end, facing the length direction of the insulating carrier plate, of the resistor plate;
the protection unit comprises a first solder mask layer and a second solder mask layer which are attached to the surface of the resistor plate, the first solder mask layer and the second solder mask layer are respectively arranged along the length direction parallel to the insulating carrier plate and the length direction vertical to the insulating carrier plate, one end of the first solder mask layer covers the top of the notch, and the first solder mask layer and the second solder mask layer form a cross shape to divide the resistor plate into different electrode accommodating areas;
the current electrode is arranged in the electrode accommodating area at one end of the resistance plate; the voltage electrode is arranged in the electrode accommodating area at the other end of the resistance plate;
when the resistance temperature coefficient of the resistance plate is equal to 0, the sum of the width of the voltage electrode and the width of the second solder mask layer is equal to the depth of the notch.
2. The current sensing resistor of claim 1, wherein a sum of the width of the voltage electrode and the width of the second solder mask layer is less than a depth of the gap when a temperature coefficient of resistance of the resistive plate is less than 0.
3. The current sense resistor of claim 2 wherein a sum of the width of the voltage electrode and the width of the second solder mask layer is greater than a depth of the gap when the temperature coefficient of resistance of the resistive plate is greater than 0.
4. The current sensing resistor of claim 1, wherein the current electrode and the voltage electrode each have a copper layer hung on the surface of the resistor plate and a nickel-tin layer barrel-plated on the surface of the copper layer.
5. The current sense resistor of claim 4 further comprising an adhesive layer between the resistive plate and the insulating carrier plate for adhering the resistive plate to the insulating carrier plate.
6. The current sense resistor of claim 1 wherein the length of the voltage electrode is less than the length of the current electrode.
7. The current sense resistor of claim 1 wherein the insulating carrier plate comprises one of an alumina ceramic plate, an aluminum nitride ceramic plate, or an FR-4 epoxy plate.
8. A method of manufacturing a current sense resistor, comprising the steps of:
providing an insulating carrier plate and a resistor plate, and attaching the resistor plate on the insulating carrier plate;
etching the resistance plate to form a notch at one end of the resistance plate facing the length direction of the insulating carrier plate;
attaching a first solder mask layer and a second solder mask layer on the surface of the resistance plate, wherein the first solder mask layer and the second solder mask layer form a cross shape to divide the resistance plate into different electrode accommodating areas; wherein one end of the first solder mask layer covers the top of the notch;
electroplating the electrode accommodating areas on the same side to respectively form a current electrode and a voltage electrode;
and plating nickel-tin layers on the surfaces of the current electrode and the voltage electrode.
9. The method of manufacturing a current sensing resistor according to claim 8, wherein the step of electroplating the electrode receiving areas on the same side to form the current electrode and the voltage electrode respectively further comprises:
pasting a third solder mask layer on the surface of the first solder mask layer; the width of the third solder mask layer is larger than that of the first solder mask layer;
electroplating the surfaces of the current electrode and the voltage electrode to enable the surfaces of the current electrode and the voltage electrode to be flush with the surface of the third solder mask layer;
and plating nickel-tin layers on the surfaces of the electroplated current electrode and the electroplated voltage electrode.
10. The method of manufacturing a current sense resistor of claim 8, wherein the thickness of the resistor plate is less than the thickness of the insulating carrier plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210502059.5A CN114843053A (en) | 2022-05-10 | 2022-05-10 | Current sensing resistor and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210502059.5A CN114843053A (en) | 2022-05-10 | 2022-05-10 | Current sensing resistor and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114843053A true CN114843053A (en) | 2022-08-02 |
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ID=82570701
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210502059.5A Pending CN114843053A (en) | 2022-05-10 | 2022-05-10 | Current sensing resistor and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114843053A (en) |
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2022
- 2022-05-10 CN CN202210502059.5A patent/CN114843053A/en active Pending
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