CN114841925A - Test equipment alignment calculation method, terminal and storage medium - Google Patents
Test equipment alignment calculation method, terminal and storage medium Download PDFInfo
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- CN114841925A CN114841925A CN202210379831.9A CN202210379831A CN114841925A CN 114841925 A CN114841925 A CN 114841925A CN 202210379831 A CN202210379831 A CN 202210379831A CN 114841925 A CN114841925 A CN 114841925A
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- G06T7/0004—Industrial image inspection
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Abstract
The application relates to a test equipment alignment calculation method, a terminal and a storage medium, wherein the method comprises the following steps: establishing a reference point, wherein the reference point is arranged between a first preset test fixture and a second preset test fixture, and first reference information of the reference point relative to the first test fixture is obtained; acquiring a mark point on a second test fixture, and acquiring first mark information of the mark point relative to a first test fixture; analyzing the first reference information and the first marking information to obtain alignment information; acquiring second marking information of the marking point relative to the second test fixture based on the alignment information; and carrying out alignment treatment on the second test fixture and the piece to be tested based on the second marking information. This application has the test fixture that makes calculation when counterpoint the test and the position of circuit board more accurate, effect of artificial compensation's when reducing the debugging possibility.
Description
Technical Field
The present disclosure relates to the field of alignment tools, and in particular, to a method, a terminal and a storage medium for calculating alignment of a test device.
Background
With the development of communication technology, electronic products are more and more widely applied to the lives of people. In order to prevent an electronic product with a faulty component from falling into a user's hand, the electronic product needs to be tested by using a fixture before being shipped from a factory.
At present, a flexible printed circuit board tester is often used for testing a circuit board of an electronic product, and during testing, a jig on the flexible printed circuit board tester is generally used for photographing a mark point on a testing jig by an alignment CCD camera to calculate the position of the testing jig; and then, the circuit board is used for photographing the mark points of the circuit board by using the alignment CCD camera to calculate the position of the circuit board, and then the deviation between the test fixture and the circuit board is calculated and adjusted according to the deviation.
For the related technologies, the inventor considers that the CCD camera aligned by the test fixture and the CCD camera aligned by the circuit board are different CCD cameras respectively, and the relative relationship between the two is unclear, so that the calculation is inaccurate, the final alignment is inaccurate, and the deviation needs to be manually compensated during each debugging, which is troublesome.
Disclosure of Invention
In order to enable the positions of the test fixture and the circuit board to be more accurate during alignment test and reduce the possibility of manual compensation during debugging, the application provides a test equipment alignment calculation method, a terminal and a storage medium.
In a first aspect, the present application provides a method for computing alignment of test equipment, which adopts the following technical scheme:
a test equipment alignment calculation method comprises the following steps:
acquiring a reference point, wherein the reference point is arranged between a first preset test fixture and a second preset test fixture, and acquiring first reference information of the reference point relative to the first test fixture;
acquiring a mark point on a second test fixture, and acquiring first mark information of the mark point relative to a first test fixture;
analyzing the first reference information and the first marking information to obtain alignment information;
acquiring second marking information of the marking point relative to the second test fixture based on the alignment information;
and carrying out alignment treatment on the second test fixture and the piece to be tested based on the second marking information.
By adopting the technical scheme, the reference point is established, and because the first test fixture and the second test fixture acquire the same reference point, the alignment information between the reference point and the mark point is measured through the first test fixture, and meanwhile, the position of the reference point relative to the second test fixture is determined, so that the position of the mark point relative to the second test fixture can be determined, then, the deviation information of the second test fixture is calculated, and the alignment processing is carried out on the second test fixture and the piece to be tested according to the deviation information. The second test fixture and the piece to be tested are placed in the same system through the first test fixture and the datum point, relative errors are reduced, the calculated position is more accurate when alignment test is carried out, and the possibility of manual compensation during debugging is reduced.
Optionally, the reference point is arranged on a reference rod, the reference rod is fixed on the equipment body, the piece to be tested and the reference point are arranged on the same plane, and the first test fixture and the second test fixture are respectively arranged on two sides of the piece to be tested.
Through adopting above-mentioned technical scheme, benchmark pole fixed connection is on the equipment body to keep the fixed of benchmark, the both sides of benchmark are arranged respectively in to first test fixture and second test fixture, and the position that first test fixture and second test fixture of being convenient for acquireed the benchmark.
Optionally, the obtaining first reference information of the reference point relative to the first test fixture includes the following steps:
acquiring a first photo comprising the reference point based on photographing equipment preset on a first test fixture;
establishing a first coordinate system matched with the first test fixture based on the first photo;
and acquiring first reference coordinates of the reference points in the first coordinate system, and taking the first reference coordinates as the first reference information.
By adopting the technical scheme, the first coordinate system of the first test fixture side is established so as to calculate the first reference coordinate of the reference point.
Optionally, the obtaining the mark point on the second test fixture and obtaining the first mark information of the mark point relative to the first test fixture includes the following steps:
selecting a mark point on the second test fixture;
acquiring a second picture comprising the mark point based on photographing equipment preset on the first test fixture;
and acquiring a first mark coordinate of the mark point in the first coordinate system based on the second picture, and taking the first mark coordinate as the first mark information.
By adopting the technical scheme, the first mark coordinate is obtained, the position relation of the mark point on the second test fixture relative to the reference point is conveniently calculated, and therefore the deviation of the second test fixture is conveniently calculated.
Optionally, the analyzing the first reference information and the first mark information to obtain alignment information includes the following steps:
acquiring the first reference coordinate and the first mark coordinate;
and calculating a relative coordinate difference value between the first reference coordinate and the first mark coordinate, and taking the relative coordinate difference value as alignment information.
By adopting the technical scheme, the alignment information is obtained, so that the position relation of the mark point relative to the second test fixture can be calculated according to the alignment information.
Optionally, the obtaining second marking information of the marking point relative to the second testing fixture based on the alignment information includes the following steps:
acquiring second reference information of the reference point relative to the second test fixture;
and acquiring second marking information of the marking point relative to the second test fixture based on the second reference information and the alignment information.
Optionally, the obtaining second reference information of the reference point relative to the second test fixture includes the following steps:
acquiring a third photo comprising the reference point based on photographing equipment preset on a second test fixture;
establishing a second coordinate system corresponding to the second test fixture based on the third picture;
and acquiring second reference coordinates of the reference points in the second coordinate system, and taking the second reference coordinates as second reference information.
By adopting the technical scheme, the second reference coordinate of the reference point relative to the second test fixture is obtained, so that the position coordinate of the mark point relative to the second test fixture is conveniently calculated according to the alignment information.
Optionally, the aligning the second test fixture and the to-be-tested device based on the second mark information includes the following steps:
acquiring deviation information of the second test fixture according to the second marking information;
acquiring the position information of the piece to be tested based on photographing equipment preset on a second test fixture;
and adjusting the piece to be tested based on the deviation information and the position information, and carrying out alignment treatment on the second test fixture and the piece to be tested.
By adopting the technical scheme, the deviation information and the position information of the piece to be detected are obtained, the position of the piece to be detected can be accurately adjusted according to the deviation information, and the possibility of manual compensation is reduced.
In a second aspect, the present application provides a terminal device, which adopts the following technical solution:
the terminal equipment comprises a memory, a processor and a computer program which is stored in the memory and can run on the processor, wherein the testing equipment alignment calculation method is adopted when the processor loads and executes the computer program.
By adopting the technical scheme, the test equipment alignment calculation method generates the computer program, and the computer program is stored in the memory to be loaded and executed by the processor, so that the terminal equipment is manufactured according to the memory and the processor, and the use is convenient.
In a third aspect, the present application provides a computer-readable storage medium, which adopts the following technical solutions:
a computer-readable storage medium, in which a computer program is stored, and when the computer program is loaded and executed by a processor, the method for calculating alignment of test equipment is adopted.
By adopting the technical scheme, the test equipment alignment calculation method generates the computer program and stores the computer program in the computer readable storage medium so as to be loaded and executed by the processor, and the computer program can be conveniently read and stored through the computer readable storage medium.
Drawings
Fig. 1 is a schematic view of the overall structure of a soft board testing machine in the embodiment of the present application.
Fig. 2 is a schematic left-view structural diagram of the soft board testing machine in the embodiment of the present application.
Fig. 3 is a schematic overall flow chart of a test equipment alignment calculation method according to an embodiment of the present application.
Fig. 4 is a schematic flowchart of steps S301 to S303 in a test equipment alignment calculation method according to an embodiment of the present application.
Fig. 5 is a schematic flowchart of steps S401 to S403 in a test equipment alignment calculation method according to an embodiment of the present application.
Fig. 6 is a schematic flowchart of steps S501 to S502 in a test equipment alignment calculation method according to an embodiment of the present application.
Fig. 7 is a schematic flowchart of steps S601 to S602 in a test equipment alignment calculation method according to an embodiment of the present application.
Fig. 8 is a schematic flowchart of steps S701 to S703 in a test equipment alignment calculation method according to an embodiment of the present application.
Fig. 9 is a schematic diagram of a second coordinate system in a test equipment alignment calculation method according to an embodiment of the present application.
Fig. 10 is a schematic flowchart of steps S801 to S803 in a test equipment alignment calculation method according to an embodiment of the present application.
Description of reference numerals:
1. a first test fixture; 11. a first CCD camera; 2. a second test fixture; 21. a second CCD camera; 3. a piece to be tested; 4. a reference bar.
Detailed Description
The present application is described in further detail below with reference to figures 1-10.
It should be noted that in this embodiment, the flexible board testing machine is used as the testing device to realize the testing alignment between the testing device and the device under test 3. For explaining the structure of the present application, please refer to fig. 1 and 2, two sets of test jigs are disposed on the flexible printed circuit board tester, and can respectively perform test alignment on the front and back surfaces of the to-be-tested object 3.
The first test fixture 1 is arranged below the soft board testing machine, the second test fixture 2 is arranged above the soft board testing machine, generally, when the flexible printed circuit board testing machine is used, a piece to be tested is arranged between the first test fixture 1 and the second test fixture 2, the first test fixture 1 carries out test processing on the reverse side of the piece to be tested, and the second test fixture 2 carries out test processing on the front side of the piece to be tested. The first test fixture 1 and the second test fixture 2 are provided with a photographing device, in this embodiment, a CCD camera is used as the photographing device (CCD is a charge coupled device (charge coupled device) for short, which can convert light into electric charge and store and transfer the electric charge, and can also take out the stored electric charge to change the voltage, so that the CCD camera is an ideal camera element, and the CCD camera formed by the CCD camera has the characteristics of small volume, light weight, no influence of magnetic field, and vibration and impact resistance). The first test fixture 1 is provided with a first CCD camera 11 in a matching way, the first CCD camera 11 can move along with the first test fixture 1, and the shooting direction of the first CCD camera 11 is from bottom to top; the second test fixture 2 is provided with a second CCD camera 21 in a matching manner, the second CCD camera 21 can move along with the second CCD camera 21, and the shooting direction of the second CCD camera 21 is from top to bottom.
The embodiment of the application discloses a test equipment alignment calculation method, and with reference to fig. 3, the method comprises the following steps:
s101, acquiring a reference point, wherein the reference point is arranged between a first preset test fixture and a second preset test fixture, and acquiring first reference information of the reference point relative to the first test fixture;
s102, acquiring a mark point on the second test fixture, and acquiring first mark information of the mark point relative to the first test fixture;
s103, analyzing the first reference information and the first mark information to obtain alignment information;
s104, acquiring second marking information of the marking point relative to a second test fixture based on the alignment information;
and S105, carrying out alignment treatment on the second test fixture and the piece to be tested based on the second marking information.
In step S101, a reference rod 4 is disposed on the soft board testing machine, one end of the reference rod 4 is fixedly connected to the soft board testing machine, when the soft board testing machine is horizontally disposed, the reference rod 4 is also horizontally disposed, the reference rod 4 and the piece to be tested are located on the same horizontal plane, one end of the reference rod 4 away from the soft board testing machine is set as a reference point, and when the testing operation is performed, the reference point and the piece to be tested are located on the same horizontal plane.
The method for acquiring the first reference information of the reference point relative to the second test fixture by using the first CCD camera specifically includes the following steps with reference to fig. 4:
s301, acquiring a first photo comprising a reference point based on photographing equipment preset on a first test fixture;
s302, establishing a first coordinate system matched with the first test fixture based on the first picture;
and S303, acquiring a first reference coordinate of the reference point in a first coordinate system, and taking the first reference coordinate as first reference information.
Specifically, a first CCD camera is used for photographing from bottom to top to obtain a first picture. And establishing a first coordinate system according to the first picture, wherein the mould connected with the reference rod is used as a lower mould X axis, the mould connected with the first test fixture is used as a lower mould Y axis, the first test fixture can move along the lower mould X axis and the lower mould Y axis so as to match with test requirements, and meanwhile, the first coordinate system is established by taking the lower X axis and the lower mould Y axis as reference axes.
Specifically, after the first coordinate system is constructed, a first coordinate system is calculatedAnd taking the first reference coordinate of the reference point in the picture in the first coordinate system as the first reference information. For example, the first reference coordinates of the reference point A in the first photograph are
In step S102, after the first reference information is acquired, first mark information of a mark point on the second test fixture is acquired, referring to fig. 5, the method specifically includes the following steps:
s401, selecting a mark point on a second test fixture;
s402, acquiring a second photo comprising the mark points;
and S403, acquiring mark coordinates of the mark points in the first coordinate system based on the second picture, and taking the mark coordinates as first mark information.
Specifically, two marking points are selected on the second test fixture, after the marking points are determined, the first CCD camera takes a picture of the second test fixture to obtain a second picture, calculates first marking coordinates of the two marking points in the first coordinate system, and takes the first marking coordinates as first marking information. For example, the first mark coordinates of the two mark points M1 and M2 on the second test fixture are respectively
，
。
In step S103, the first reference information and the first mark information are analyzed, and referring to fig. 6, the method specifically includes the following steps:
s501, acquiring a first reference coordinate and a first mark coordinate;
s502, calculating a relative coordinate difference value between the first reference coordinate and the first mark coordinate, and taking the relative coordinate difference value as alignment information.
Specifically, a first reference coordinate and a first mark coordinate are acquired, and a relative coordinate difference is calculated according to the first reference coordinate and the first mark coordinate. Example (b)For example, the difference between the first reference coordinate of the reference point A and the relative coordinate of the marker point M1 is calculated as
Calculating the difference value between the first reference coordinate of the reference point A and the relative coordinate of the marking point M2 as
The positional relationship between the marker point M1 and the marker point M2 with respect to the reference point is known.
In step S104, after the relative coordinate difference is obtained, second mark information of the mark point relative to the second test fixture is obtained according to the relative coordinate difference, referring to fig. 7, specifically referring to the following steps:
s601, acquiring second reference information of the reference point relative to a second test fixture;
and S602, acquiring second marking information of the marking point relative to the second test fixture based on the second reference information and the alignment information.
Specifically, after the relative coordinate difference is obtained, the second mark coordinate of the mark point relative to the second test fixture can be known only by acquiring the second reference coordinate of the reference point relative to the second test fixture, so that the deviation of the second test fixture can be known. Referring to fig. 8, the step of acquiring the second reference information specifically includes the following steps:
s701, acquiring a third photo comprising the reference point based on photographing equipment preset on a second test fixture;
s702, establishing a second coordinate system corresponding to the second test fixture based on the third picture;
and S703, acquiring a second reference coordinate of the reference point in a second coordinate system, and taking the second reference coordinate as second reference information.
Specifically, the reference point is photographed through a second CCD camera arranged on the second test fixture, and a second picture is obtained. Referring to fig. 9, a second coordinate system is established according to the second picture, wherein the mold connected to the reference rod is used as the upper mold X axis, the mold connected to the second test fixture is used as the upper mold Y axis, and the second test fixture can move along the upper mold X axis and the upper mold Y axis to match the test requirements, and meanwhile, the upper mold X axis and the upper mold Y axis are used as reference axes to establish the second coordinate system.
Specifically, second reference information of the reference point is acquired in the second coordinate system, for example, a first reference coordinate of the reference point in the second coordinate system is calculated as
And taking the second reference coordinate as second reference information.
In step S602, after the second reference information is acquired, since the relative position relationship between the reference point and the mark point is fixed, the second mark coordinates of the two mark points on the second test fixture on the second coordinate system can be calculated according to the relative coordinate information obtained by calculating the reference point coordinates and the mark point coordinates in the first coordinate system, and the second mark coordinates are used as the second mark information. As can be seen from the above, the second mark coordinates of the two mark points on the second coordinate system are respectively
。
In step S105, deviation information of the second test fixture is calculated according to the second mark coordinate, so as to perform alignment processing on the second test fixture and the to-be-tested object. Referring to fig. 10, step S105 includes the steps of:
s801, acquiring deviation information of the second test fixture according to the second marking information;
s802, acquiring position information of the piece to be tested based on photographing equipment preset on a second test fixture;
and S803, adjusting the piece to be tested based on the deviation information and the position information, and carrying out alignment treatment on the second test fixture and the piece to be tested.
In this embodiment, the deviation information includes a position deviation and an inclination angle, and the position deviation of the second test fixture relative to the second CCD camera can be calculated as
By passing
Can calculate the inclination angle of the second test fixture in the second coordinate system as
。
The to-be-tested piece is generally a circuit board, after the circuit board is installed, the circuit board is photographed through a second CCD camera, the position information of the circuit board is calculated in a second coordinate system, and the position information comprises the center coordinate of the center point of the circuit board
And the inclination angle of the circuit board
And after the position information is obtained through calculation, the position of the circuit board can be corrected and aligned according to the deviation information.
In particular, since the second coordinate system has already been determined, the position of the circuit board after mounting should also be determined. Two circuit board marking points are selected on the circuit board, theoretical coordinates of the two circuit board marking points are determined, and the theoretical coordinates of the two circuit board marking points are connected to obtain a theoretical straight line. Acquiring actual coordinates of the two circuit board mark points through the second CCD camera, connecting the actual coordinates of the two circuit board mark points to obtain an actual straight line, and calculating an angle between the theoretical straight line and the actual straight line as an inclination angle of the circuit board
。
The correction and alignment of the position of the circuit board according to the deviation information comprises the following specific steps of offsetting the central point of the circuit board
Aligning the second test fixture and the central position of the circuit board; meanwhile, according to the inclination angle of the circuit board
The inclination angle with the second test fixture
And comparing, calculating to obtain the angle deviation between the second test fixture and the circuit board, and driving a fine adjustment mechanism on the soft board testing machine to perform corresponding angle adjustment on the circuit board according to the angle deviation, so that the angle alignment of the second test fixture and the circuit board can be realized.
Similarly, the method of performing the alignment process on the reverse side of the circuit board is the same as the above method.
The implementation principle of the test equipment alignment calculation method in the embodiment of the application is as follows: and establishing a reference point, wherein the first test fixture and the second test fixture acquire the same reference point, so that the first test fixture is used for measuring the alignment information between the reference point and the mark point, the position of the reference point relative to the second test fixture is determined, the position of the mark point relative to the second test fixture can be determined, then the deviation information of the second test fixture is calculated, and the second test fixture and the piece to be tested are aligned according to the deviation information. The second test fixture and the piece to be tested are placed in the same system through the first test fixture and the datum point, relative errors are reduced, the calculated position is more accurate when alignment test is carried out, and the possibility of manual compensation during debugging is reduced.
The embodiment of the application further discloses a terminal device, which comprises a memory, a processor and a computer program which is stored in the memory and can run on the processor, wherein when the processor executes the computer program, the test device alignment calculation method in the embodiment is adopted.
The terminal device may adopt a computer device such as a desktop computer, a notebook computer, or a cloud server, and the terminal device includes but is not limited to a processor and a memory, for example, the terminal device may further include an input/output device, a network access device, a bus, and the like.
The processor may be a Central Processing Unit (CPU), and of course, according to an actual use situation, other general processors, Digital Signal Processors (DSPs), Application Specific Integrated Circuits (ASICs), Field Programmable Gate Arrays (FPGAs) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, and the like may also be used, and the general processor may be a microprocessor or any conventional processor, and the present application does not limit the present invention.
The memory may be an internal storage unit of the terminal device, for example, a hard disk or a memory of the terminal device, or an external storage device of the terminal device, for example, a plug-in hard disk, a smart card memory (SMC), a secure digital card (SD) or a flash memory card (FC) equipped on the terminal device, and the memory may also be a combination of the internal storage unit of the terminal device and the external storage device, and the memory is used for storing a computer program and other programs and data required by the terminal device, and the memory may also be used for temporarily storing data that has been output or will be output, which is not limited in this application.
The test equipment alignment calculation method in the embodiment is stored in a memory of the terminal equipment through the terminal equipment, and is loaded and executed on a processor of the terminal equipment, so that the terminal equipment is convenient to use.
The embodiment of the application further discloses a computer readable storage medium, and the computer readable storage medium stores a computer program, wherein when the computer program is executed by a processor, the alignment calculation method for the test equipment in the above embodiment is adopted.
The computer program may be stored in a computer readable medium, the computer program includes computer program code, the computer program code may be in a source code form, an object code form, an executable file or some intermediate form, and the like, the computer readable medium includes any entity or device capable of carrying the computer program code, a recording medium, a usb disk, a removable hard disk, a magnetic disk, an optical disk, a computer memory, a Read Only Memory (ROM), a Random Access Memory (RAM), an electrical carrier signal, a telecommunication signal, a software distribution medium, and the like, and the computer readable medium includes but is not limited to the above components.
The test equipment alignment calculation method in the above embodiment is stored in the computer-readable storage medium through the computer-readable storage medium, and is loaded and executed on the processor, so as to facilitate storage and application of the method.
The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.
Claims (10)
1. A test equipment alignment calculation method is characterized by comprising the following steps:
acquiring a reference point, wherein the reference point is arranged between a first preset test fixture and a second preset test fixture, and acquiring first reference information of the reference point relative to the first test fixture;
acquiring a mark point on a second test fixture, and acquiring first mark information of the mark point relative to a first test fixture;
analyzing the first reference information and the first marking information to obtain alignment information;
acquiring second marking information of the marking point relative to the second test fixture based on the alignment information;
and carrying out alignment treatment on the second test fixture and the piece to be tested based on the second marking information.
2. The alignment calculation method of testing equipment according to claim 1, wherein the reference point is disposed on a reference rod, the reference rod is fixed on the equipment body, the piece to be tested and the reference point are disposed on the same plane, and the first testing jig and the second testing jig are disposed on two sides of the piece to be tested respectively.
3. The method as claimed in claim 1, wherein the step of obtaining the first reference information of the reference point relative to the first test fixture comprises the steps of:
acquiring a first photo comprising the reference point based on photographing equipment preset on a first test fixture;
establishing a first coordinate system matched with the first test fixture based on the first picture;
and acquiring first reference coordinates of the reference points in the first coordinate system, and taking the first reference coordinates as the first reference information.
4. The alignment calculation method of claim 3, wherein the step of obtaining the mark point on the second test fixture and obtaining the first mark information of the mark point relative to the first test fixture comprises the steps of:
selecting a mark point on the second test fixture;
acquiring a second photo comprising the mark point based on photographing equipment preset on the first test fixture;
and acquiring a first mark coordinate of the mark point in the first coordinate system based on the second picture, and taking the first mark coordinate as the first mark information.
5. The alignment calculation method of claim 4, wherein the analyzing the first reference information and the first mark information to obtain the alignment information comprises:
acquiring the first reference coordinate and the first mark coordinate;
and calculating a relative coordinate difference value between the first reference coordinate and the first mark coordinate, and taking the relative coordinate difference value as alignment information.
6. The alignment calculation method of claim 1, wherein the obtaining second mark information of the mark point relative to the second test fixture based on the alignment information comprises:
acquiring second reference information of the reference point relative to the second test fixture;
and acquiring second marking information of the marking point relative to the second test fixture based on the second reference information and the alignment information.
7. The method as claimed in claim 6, wherein the step of obtaining second reference information of the reference point relative to the second test fixture comprises the steps of:
acquiring a third photo comprising the reference point based on photographing equipment preset on a second test fixture;
establishing a second coordinate system corresponding to the second test fixture based on the third picture;
and acquiring second reference coordinates of the reference points in the second coordinate system, and taking the second reference coordinates as second reference information.
8. The alignment calculation method of claim 7, wherein the aligning the second test fixture and the device under test based on the second mark information comprises the following steps:
acquiring deviation information of the second test fixture according to the second marking information;
acquiring the position information of the piece to be tested based on photographing equipment preset on a second test fixture;
and adjusting the piece to be tested based on the deviation information and the position information, and carrying out alignment treatment on the second test fixture and the piece to be tested.
9. A terminal device comprising a memory, a processor and a computer program stored in the memory and being executable on the processor, characterized in that the method of any of claims 1-8 is used when the computer program is loaded and executed by the processor.
10. A computer-readable storage medium, in which a computer program is stored, which, when loaded and executed by a processor, carries out the method of any one of claims 1 to 8.
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| CN115666125A (en) * | 2022-12-27 | 2023-01-31 | 合肥安迅精密技术有限公司 | Method for detecting and compensating positioning error of XY platform of chip mounter based on machine vision |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115666125A (en) * | 2022-12-27 | 2023-01-31 | 合肥安迅精密技术有限公司 | Method for detecting and compensating positioning error of XY platform of chip mounter based on machine vision |
| CN115666125B (en) * | 2022-12-27 | 2023-08-18 | 合肥安迅精密技术有限公司 | Machine vision-based method for detecting and compensating positioning error of XY platform of chip mounter |
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