CN114828435A - PCB circuit board electroplating device - Google Patents
PCB circuit board electroplating device Download PDFInfo
- Publication number
- CN114828435A CN114828435A CN202210406876.0A CN202210406876A CN114828435A CN 114828435 A CN114828435 A CN 114828435A CN 202210406876 A CN202210406876 A CN 202210406876A CN 114828435 A CN114828435 A CN 114828435A
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- Prior art keywords
- moisture
- groove
- proof
- collecting
- pipe
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- 238000009713 electroplating Methods 0.000 title claims abstract description 27
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 72
- 230000007246 mechanism Effects 0.000 claims abstract description 25
- 239000006096 absorbing agent Substances 0.000 claims abstract description 22
- 238000003825 pressing Methods 0.000 claims abstract description 12
- 230000006978 adaptation Effects 0.000 claims description 8
- 239000003651 drinking water Substances 0.000 claims description 6
- 235000020188 drinking water Nutrition 0.000 claims description 6
- 239000012141 concentrate Substances 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 description 6
- 239000012535 impurity Substances 0.000 description 6
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 230000004888 barrier function Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 210000001503 joint Anatomy 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000000630 rising effect Effects 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 238000005086 pumping Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- -1 corrosion) Chemical class 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/187—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D29/00—Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups B01D24/00 - B01D27/00; Filtering elements therefor
- B01D29/01—Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups B01D24/00 - B01D27/00; Filtering elements therefor with flat filtering elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D29/00—Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups B01D24/00 - B01D27/00; Filtering elements therefor
- B01D29/62—Regenerating the filter material in the filter
- B01D29/64—Regenerating the filter material in the filter by scrapers, brushes, nozzles, or the like, acting on the cake side of the filtering element
- B01D29/6469—Regenerating the filter material in the filter by scrapers, brushes, nozzles, or the like, acting on the cake side of the filtering element scrapers
- B01D29/6484—Regenerating the filter material in the filter by scrapers, brushes, nozzles, or the like, acting on the cake side of the filtering element scrapers with a translatory movement with respect to the filtering element
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/26—Drying gases or vapours
- B01D53/261—Drying gases or vapours by adsorption
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/227—Drying of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
Abstract
The invention relates to the technical field of PCB circuit boards, and discloses PCB circuit board electroplating equipment which comprises a main body, wherein a moisture-proof mechanism is arranged outside the main body, a collecting mechanism is arranged outside the moisture-proof mechanism and comprises a moisture-proof groove, a rotating groove is formed in the top of the moisture-proof groove, a pressing block is arranged inside the rotating groove, a moisture-proof plate is arranged inside the moisture-proof groove, clamping grooves are formed in the bottoms of the left side and the right side of the moisture-proof plate, clamping blocks are arranged inside the clamping grooves, a handle is fixedly connected to the top of the moisture-proof plate, the collecting mechanism comprises collecting pipes, a plurality of collecting pipes are arranged outside the collecting pipes, moisture absorbers are arranged at the bottoms of the collecting pipes, water outlet pipes are fixedly communicated with the bottoms of the moisture absorbers, and collecting boxes are arranged at the bottoms of the water outlet pipes. This PCB circuit board electroplating device prevents through dampproofing mechanism that the moisture is too big to cause the damage to equipment, and the rethread is collected the mechanism and is collected vapor and convert it into the operation of available resource.
Description
Technical Field
The invention relates to the technical field of PCB circuit boards, in particular to electroplating equipment for a PCB circuit board.
Background
The PCB is also called a printed circuit board, and is also called a printed circuit board, which is an important electronic component, a support body of an electronic component, and a carrier for electrical interconnection of the electronic component. It is called a "printed" circuit board because it is made using electronic printing. The printed circuit board consists of an insulating bottom plate, a connecting lead and a welding disc for assembling and welding electronic elements, and has double functions of a conductive circuit and the insulating bottom plate. At present, printed circuit boards have been widely used in the production of electronic products, wherein there is a process of plating a thin layer of other metals or alloys on the surface of some metals by using the principle of electrolysis in the electroplating process, which is a process of attaching a metal film on the surface of a metal or other material product by using the action of electrolysis to prevent the oxidation of metals (such as corrosion), improve the wear resistance, conductivity, light reflection, corrosion resistance (such as copper sulfate, etc.), and enhance the appearance.
When the existing PCB circuit board electroplating equipment is used, hot water is arranged in a cleaning pool, water vapor rises, so that the moisture in the air is too heavy, the electroplating equipment can be affected with damp, and the electroplating equipment can damage circuits and parts in the electroplating equipment when being in a humid environment for a long time.
Disclosure of Invention
In order to achieve the purpose, the invention provides the following technical scheme: a PCB circuit board electroplating device comprises a main body, wherein a moisture-proof mechanism is arranged outside the main body, and a collecting mechanism is arranged outside the moisture-proof mechanism;
the damp-proof mechanism comprises a damp-proof groove, a rotating groove is formed in the top of the damp-proof groove, a pressing block is arranged in the rotating groove, a damp-proof plate is arranged in the damp-proof groove, clamping grooves are formed in the bottoms of the left side and the right side of the damp-proof plate, clamping blocks are arranged in the clamping grooves, and a handle is fixedly connected to the top of the damp-proof plate;
the collecting mechanism comprises a plurality of collecting pipes, a plurality of collecting pipes are arranged, a concentrating pipe is arranged outside the collecting pipes, a moisture absorber is arranged at the bottom of the concentrating pipe, a water outlet pipe is fixedly communicated with the bottom of the moisture absorber, and a collecting box is arranged at the bottom of the water outlet pipe;
in the above scheme, when the PCB is not cleaned, but the cleaning pool is still running, at the moment, a worker pulls the damp-proof plate from the damp-proof groove by driving the handle at the top of the damp-proof plate until the clamping block at the bottom of the damp-proof plate is pulled to the rotary groove, the spring bounces to enable the clamping block to enter the rotary groove, the damp-proof plate is fixed, the clamping block rotates in the rotary groove by pulling down the damp-proof plate, the damp-proof plate is closed towards the placing block, the handle enters the door handle groove, the damp-proof plate is closed with the main body to avoid water vapor from drifting, then the moisture absorber is started by an external power supply to drive the collecting pipes in the damp-proof plate to absorb the water vapor in the main body, then the collecting pipes are connected in butt joint by the concentration pipes, so that the concentration pipes can convey the water vapor collected by the collecting pipes into the moisture absorber, and then the water vapor is converted into water drops by the moisture absorber, and then discharge the drop of water through the outlet pipe and collect in collecting box, accomplish and prevent that the rising of vapor leads to the fact the air moisture aggravates and collect vapor and make its condensation become the operation that the drop of water can be recycled.
Preferably, dampproofing board thickness is less than dampproofing groove, one side height in dampproofing groove is less than the height of swivelling chute, two fixture block left side fixedly connected with stopper, stopper left side fixedly connected with spring, the spring left side and the inside left wall fixed connection of draw-in groove, the fixture block sets up to cylindrical, fixture block size and swivelling chute looks adaptation, the stopper is greater than the notch of draw-in groove.
In the above scheme, the thickness of dampproofing plate is less than dampproofing groove, and sets up dampproofing groove and be less than the swivelling chute for dampproofing plate has avoided being blocked by dampproofing groove both sides when rotatory, and convenient dampproofing plate is rotatory, limits the fixture block through the stopper, does not have the strong point when avoiding the fixture block to fix in the swivelling chute, makes the spring bending can not fix dampproofing plate, and the notch that rethread stopper is greater than the draw-in groove avoids the spring to pop out the draw-in groove, prevents that dampproofing plate from fixing unstably.
Preferably, the diameter of the pressing block is smaller than that of the clamping block, the pressing block penetrates through the main body and extends to the outside of the main body, two rotating grooves are formed in the rotating grooves, and the rotating grooves are symmetrically distributed through the middle shaft of the moisture-proof groove.
In the above scheme, when the size of the damp-proof plate is matched with the main body, the damp-proof plate and the main body can be closed, and the main body can be covered.
Preferably, the inside cavity state that sets up of dampproofing board, dampproofing board size and main part looks adaptation, dampproofing groove is located the inside of main part, the inside top fixedly connected with of main part places the piece, it has seted up the doorknob groove to place the piece top, it is unanimous with dampproofing groove to place the height of piece, it sets up to the U-shaped to place the piece.
Preferably, the bottom of the moisture-proof plate is provided with a water hole, the size of the water hole is matched with that of the collecting pipe, the concentrating pipe penetrates through the top of the moisture-proof plate and extends to the top of the moisture absorber, and the concentrating pipe is arranged as a hose.
Preferably, the collecting box is internally provided with a filter screen, the top of the filter screen is provided with a cleaning block, the front side of the cleaning block is fixedly connected with a telescopic rod, the front side of the telescopic rod is fixedly connected with a telescopic motor, the bottom of the telescopic motor is provided with a supporting seat, the back side of the supporting seat is fixedly connected with the front side of the collecting box, and the back side of the collecting box is provided with a discharge valve.
Preferably, the collecting box internally mounted has the suction pump, the suction pump top is provided with the drinking-water pipe, the drinking-water pipe runs through the collecting box and extends to the collecting box outside.
Preferably, the telescopic rod runs through the collecting box and extends to the front of the telescopic motor, and the filter screen is located above the water suction pump.
Compared with the prior art, the invention provides the electroplating equipment for the PCB, which has the following beneficial effects:
1. this equipment is electroplated to PCB circuit board, through being provided with dampproofing groove, devices such as dampproofing board and fixture block mutually support, the staff is through the handle that drives dampproofing roof portion, pull up dampproofing board from dampproofing inslot, until the fixture block with dampproofing roof portion is pulled to the rotary trough department, at this moment, the spring bounce makes the fixture block get into the rotary trough, fix dampproofing board, the rethread is pulled down dampproofing board and is made the fixture block at the rotary trough internal rotation, and then make dampproofing board toward placing a department closed, the handle gets into the door handle inslot, and then make dampproofing board and main part closed, steam has been avoided wafting, it can cause the damage to its inside circuit and spare part to be in the humid environment for a long time to have solved electroplating equipment mentioned among the above-mentioned background art.
2. This PCB circuit board electroplating device, through being provided with the collecting pipe, device such as centralized pipe and collecting box mutually support, specifically for start a plurality of collecting pipes that the desiccator drove in the dampproofing board through external power supply and absorb the inside vapor of main part, then a plurality of collecting pipes of pipe butt joint are concentrated to the rethread, make concentrated pipe can carry the desiccator with the vapor that the collecting pipe was collected in, and then convert vapor into the drop of water through the desiccator, and then collect in collecting box through the outlet pipe with the drop of water discharge again, reached and collected the effect that vapor made it become available resource.
3. This PCB circuit board electroplating device, through being provided with the filter screen, devices such as suction pump and drinking-water pipe mutually support, specifically for moisture absorber converts absorptive vapor into the drop of water and discharges to the collecting box after, filter to rivers through the filter screen this moment and make impurity stay on the filter screen, the rethread starts flexible motor and drives the telescopic link and promote the impurity clearance of clearance piece on to the filter screen, open the bleeder valve again and discharge impurity, and then through starting the suction pump extraction rivers again, carry rivers in the main part through the drinking-water pipe, reach the effect of cyclic utilization water resource.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic cross-sectional view of the present invention;
FIG. 3 is a schematic view of the moisture barrier groove of the present invention;
FIG. 4 is a schematic view of a damp-proof sheet structure according to the present invention;
FIG. 5 is a schematic cross-sectional view of the moisture barrier of the present invention;
FIG. 6 is a schematic view of a concentrator tube according to the present invention;
fig. 7 is a schematic structural view of a cross section of the collecting mechanism of the present invention.
Wherein: 1. a main body; 2. a moisture-proof mechanism; 3. a collection mechanism; 11. placing the blocks; 12. a door handle slot; 21. a moisture-proof groove; 22. a rotating tank; 23. a pressing block; 24. a moisture barrier; 25. a card slot; 26. a clamping block; 27. a handle; 31. a collection pipe; 32. a concentration pipe; 33. a moisture absorber; 34. a water outlet pipe; 35. a collection box; 201. a limiting block; 202. a spring; 301. a filter screen; 302. cleaning the block; 303. a telescopic rod; 304. a telescopic motor; 305. a supporting seat; 306. a discharge valve; 307. a water pump; 308. a water pumping pipe.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example one
Embodiment of PCB circuit board electroplating equipment
Referring to fig. 1-7, a PCB circuit board electroplating apparatus includes a main body 1, a moisture-proof mechanism 2 is disposed outside the main body 1, and a collecting mechanism 3 is disposed outside the moisture-proof mechanism 2;
the damp-proof mechanism 2 comprises a damp-proof groove 21, a rotating groove 22 is formed in the top of the damp-proof groove 21, a pressing block 23 is arranged inside the rotating groove 22, a damp-proof plate 24 is arranged inside the damp-proof groove 21, clamping grooves 25 are formed in the bottoms of the left side and the right side of the damp-proof plate 24, clamping blocks 26 are arranged inside the clamping grooves 25, and a handle 27 is fixedly connected to the top of the damp-proof plate 24;
the collecting mechanism 3 comprises a collecting pipe 31, the collecting pipe 31 is provided with a plurality of collecting pipes, a collecting pipe 32 is arranged outside the collecting pipes 31, a moisture absorber 33 is arranged at the bottom of the collecting pipe 32, a water outlet pipe 34 is fixedly communicated with the bottom of the moisture absorber 33, and a collecting box 35 is arranged at the bottom of the water outlet pipe 34.
Through above-mentioned technical scheme, do not rinse the PCB board, but rinse the pond still when the operation. At this time, the worker pulls up the moisture-proof plate 24 from the moisture-proof groove 21 by driving the handle 27 at the top of the moisture-proof plate 24 until the fixture block 26 at the bottom of the moisture-proof plate 24 is pulled to the rotating groove 22, at this time, the spring 202 bounces to make the fixture block 26 enter the rotating groove 22, the moisture-proof plate 24 is fixed, then the moisture-proof plate 24 is pulled down to make the fixture block 26 rotate in the rotating groove 22, further the moisture-proof plate 24 is closed towards the placing block 11, the handle 27 enters the door handle groove 12, further the moisture-proof plate 24 is closed with the main body 1, so as to avoid the water vapor from drifting, then the moisture absorber 33 is started by the external power supply to drive the collecting pipes 31 in the moisture-proof plate 24 to absorb the water vapor inside the main body 1, then the collecting pipes 32 are connected with the collecting pipes 31, so that the collecting pipes 32 can convey the water vapor collected by the collecting pipes 31 into the moisture absorber 33, further the water vapor is converted into water drops by the moisture absorber 33, and then the water drops are discharged into a collection box 35 through a water outlet pipe 34 to be collected, so that the operation of preventing the moisture of the air from being aggravated due to the rising of the water vapor and collecting the water vapor to be condensed into water drops for reuse is completed.
Example two
Embodiment of damp-proof plate of PCB (printed Circuit Board) electroplating equipment
Specifically, dampproofing board 24 thickness is less than dampproofing groove 21, and one side height of dampproofing groove 21 is less than the height of swivelling chute 22, two fixture block 26 left side fixedly connected with stoppers 201, stopper 201 left side fixedly connected with spring 202, the spring 202 left side and the inside left wall fixed connection of draw-in groove 25, fixture block 26 sets up to cylindrical, fixture block 26 size and swivelling chute 22 looks adaptation, stopper 201 is greater than the notch of draw-in groove 25.
Specifically, the diameter of the pressing block 23 is smaller than that of the clamping block 26, the pressing block 23 penetrates through the main body 1 and extends to the outside of the main body 1, two rotating grooves 22 are formed, and the rotating grooves 22 are symmetrically distributed through the center axis of the moisture-proof groove 21.
Specifically, dampproofing board 24 is inside to be set up to the hollow state, dampproofing board 24 size and 1 looks adaptation of main part, and dampproofing groove 21 is located the inside of main part 1, and the inside top fixedly connected with of main part 1 places piece 11, places piece 11 top and has seted up door knob groove 12, and the height of placing piece 11 is unanimous with dampproofing groove 21, places piece 11 and sets up to the U-shaped.
Through the technical scheme, the thickness of the moisture-proof plate 24 is smaller than the moisture-proof groove 21, the moisture-proof groove 21 is arranged to be lower than the rotary groove 22, the moisture-proof plate 24 is prevented from being clamped by two sides of the moisture-proof groove 21 when rotating, the moisture-proof plate 24 is convenient to rotate, the limiting block 201 limits the fixture block 26, the fixture block 26 is prevented from having no supporting point when being fixed in the rotary groove 22, the spring 202 is bent and cannot fix the moisture-proof plate 24, the limiting block 201 is larger than the notch of the clamping groove 25 to prevent the spring 202 from popping out of the clamping groove 25, the moisture-proof plate 24 is prevented from being unstably fixed, when the moisture-proof plate 24 needs to be put down, the pressing block 23 is pressed to extrude the fixture block 26 out of the rotary groove 22, the moisture-proof plate 24 is released from being fixed, the moisture-proof plate 24 can be withdrawn, when the moisture-proof plate 24 is closed with the main body 1, one side of the moisture-proof plate 24 is supported through the placing block 11, the placing block 11 is arranged to have the same height as the moisture-proof groove 21 and be arranged in a U shape, so that the moisture-proof plate 24 is in a horizontal state, and the closing and sealing effect is better.
EXAMPLE III
Embodiment of collecting mechanism of PCB (printed Circuit Board) electroplating equipment
Specifically, the water hole has been seted up to dampproofing board 24 bottom, and water hole size and collecting pipe 31 looks adaptation concentrate pipe 32 to run through dampproofing board 24 top and extend to desiccator 33 top, concentrate pipe 32 and set up to the hose.
Specifically, collecting box 35 internally mounted has filter screen 301, and filter screen 301 top is provided with clearance piece 302, the positive fixedly connected with telescopic link 303 of clearance piece 302, the flexible motor 304 of the positive fixedly connected with of telescopic link 303, supporting seat 305 is installed to flexible motor 304 bottom, the back of supporting seat 305 and the positive fixed connection of collecting box 35, the collecting box 35 back is provided with ejection of compact valve 306.
Specifically, a water suction pump 307 is installed inside the collection box 35, a water suction pipe 308 is arranged at the top of the water suction pump 307, and the water suction pipe 308 penetrates through the collection box 35 and extends to the outside of the collection box 35.
Specifically, the telescopic rod 303 penetrates through the collecting box 35 and extends to the front of the telescopic motor 304, and the filter screen 301 is located above the water pump 307.
By the technical proposal, the water holes are arranged, and the size of the water holes is matched with that of the collecting pipe 31, so that the water vapor can be collected by the collecting pipe 31, and then the water vapor is transmitted to a concentration pipe 32 through a collecting pipe 31, the concentration pipe 32 is arranged as a hose, so that the concentration pipe 32 can be stretched, so that the concentration pipe 32 can be conveniently connected to the moisture absorber 33, the moisture absorber 33 converts the water vapor into water drops, then the water flow is discharged into the collection box 35 through the water outlet pipe 34, the water flow is filtered through the filter screen 301 to enable impurities to be left on the filter screen 301, the telescopic motor 304 is started to drive the telescopic rod 303 to push the cleaning block 302 to clean the impurities on the filter screen 301, the discharge valve 306 is opened to discharge the impurities, then the water pump 307 is started to pump water flow, and the water flow is conveyed into the main body 1 through the water pumping pipe 308, so that the operation of saving water resources and reusing the water resources is achieved.
When the moisture-proof board is used, the handle 27 at the top of the moisture-proof board 24 is driven, the moisture-proof board 24 is pulled up from the moisture-proof groove 21 until the fixture block 26 at the bottom of the moisture-proof board 24 is pulled to the rotating groove 22, at this time, the spring 202 bounces to enable the fixture block 26 to enter the rotating groove 22, the moisture-proof board 24 is fixed, the moisture-proof board 24 is pulled down to enable the fixture block 26 to rotate in the rotating groove 22, the moisture-proof board 24 is further closed towards the placing block 11, the handle 27 enters the door handle groove 12, the moisture-proof board 24 is further closed with the main body 1, water vapor dispersion is avoided, the moisture absorber 33 is started through the external power supply to drive the collecting pipes 31 in the moisture-proof board 24 to absorb the water vapor in the main body 1, the concentrating pipe 32 is in butt joint with the collecting pipes 31, the concentrating pipe 32 can convey the water vapor collected by the collecting pipe 31 into the moisture absorber 33, and the water vapor is further converted into water drops through the moisture absorber 33, and then the water drops are discharged into a collection box 35 through a water outlet pipe 34 to be collected, so that the operation of preventing the moisture of the air from being aggravated due to the rising of the water vapor and collecting the water vapor to be condensed into water drops for reuse is completed.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. The utility model provides a PCB circuit board electroplating device, includes main part (1), its characterized in that: a moisture-proof mechanism (2) is arranged outside the main body (1), and a collecting mechanism (3) is arranged outside the moisture-proof mechanism (2);
the damp-proof mechanism (2) comprises a damp-proof groove (21), a rotating groove (22) is formed in the top of the damp-proof groove (21), a pressing block (23) is arranged in the rotating groove (22), a damp-proof plate (24) is arranged in the damp-proof groove (21), clamping grooves (25) are formed in the bottoms of the left side and the right side of the damp-proof plate (24), clamping blocks (26) are arranged in the clamping grooves (25), and a handle (27) is fixedly connected to the top of the damp-proof plate (24);
the collecting mechanism (3) comprises a collecting pipe (31), the collecting pipe (31) is provided with a plurality of collecting pipes, the collecting pipe (31) is externally provided with a centralized pipe (32), the bottom of the centralized pipe (32) is provided with a moisture absorber (33), the bottom of the moisture absorber (33) is fixedly communicated with a water outlet pipe (34), and the bottom of the water outlet pipe (34) is provided with a collecting box (35).
2. A PCB circuit board electroplating device according to claim 1, characterized in that: dampproofing board (24) thickness is less than dampproofing groove (21), one side height in dampproofing groove (21) is less than the height of swivelling chute (22), two fixture block (26) left side fixedly connected with stopper (201), stopper (201) left side fixedly connected with spring (202), spring (202) left side and the inside left wall fixed connection of draw-in groove (25), fixture block (26) set up to cylindrical, fixture block (26) size and swivelling chute (22) looks adaptation, stopper (201) are greater than the notch of draw-in groove (25).
3. A PCB circuit board electroplating device according to claim 2, characterized in that: the diameter of the pressing block (23) is smaller than that of the clamping block (26), the pressing block (23) penetrates through the main body (1) and extends to the outside of the main body (1), two rotating grooves (22) are formed, and the rotating grooves (22) are symmetrically distributed through the middle shaft of the moisture-proof groove (21).
4. A PCB circuit board electroplating device according to claim 1, characterized in that: the inside cavity state that sets up of dampproofing board (24), dampproofing board (24) size and main part (1) looks adaptation, dampproofing groove (21) are located the inside of main part (1), piece (11) are placed to the inside top fixedly connected with of main part (1), place piece (11) top and seted up door knob groove (12), the height of placing piece (11) is unanimous with dampproofing groove (21), it sets up to the U-shaped to place piece (11).
5. A PCB circuit board electroplating device according to claim 1, characterized in that: the water hole has been seted up to dampproofing board (24) bottom, water hole size and collecting pipe (31) looks adaptation, concentrate pipe (32) and run through dampproofing board (24) top and extend to desiccator (33) top, concentrate pipe (32) and set up to the hose.
6. A PCB circuit board electroplating device according to claim 1, characterized in that: the collecting box (35) internally mounted has filter screen (301), filter screen (301) top is provided with clearance piece (302), the positive fixedly connected with telescopic link (303) of clearance piece (302), the flexible motor (304) of the positive fixedly connected with of telescopic link (303), supporting seat (305) are installed to flexible motor (304) bottom, the back of supporting seat (305) and the positive fixed connection of collecting box (35), the collecting box (35) back is provided with ejection of compact valve (306).
7. A PCB circuit board electroplating device according to claim 1, characterized in that: collecting box (35) internally mounted has suction pump (307), suction pump (307) top is provided with drinking-water pipe (308), drinking-water pipe (308) run through collecting box (35) and extend to collecting box (35) outside.
8. A PCB circuit board electroplating device according to claim 6, characterized in that: the telescopic rod (303) penetrates through the collecting box (35) and extends to the front face of the telescopic motor (304), and the filter screen (301) is located above the water suction pump (307).
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CN202210406876.0A CN114828435A (en) | 2022-04-18 | 2022-04-18 | PCB circuit board electroplating device |
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CN202210406876.0A CN114828435A (en) | 2022-04-18 | 2022-04-18 | PCB circuit board electroplating device |
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CN202210406876.0A Pending CN114828435A (en) | 2022-04-18 | 2022-04-18 | PCB circuit board electroplating device |
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CN213936910U (en) * | 2020-12-02 | 2021-08-10 | 广州市穗铃电气设备有限公司 | Outdoor dampproofing block terminal |
CN215852574U (en) * | 2021-06-21 | 2022-02-18 | 安徽天翔电气设备有限公司 | Power electronic components dampproof device |
CN216121255U (en) * | 2021-09-03 | 2022-03-22 | 盐城凌光智能科技有限公司 | Dampproofing switch board |
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US20160131372A1 (en) * | 2014-11-12 | 2016-05-12 | Samsung Electronics Co., Ltd. | Appliance for dehumidification and multi-function appliance for dehumidificaton or humidification |
CN209897404U (en) * | 2018-10-30 | 2020-01-03 | 江西伟德智能电气有限公司 | Dampproofing regulator cubicle |
CN210041011U (en) * | 2019-07-24 | 2020-02-07 | 云南安能电气设备有限公司 | Low-voltage distribution cabinet with dampproofing function |
CN210517490U (en) * | 2019-09-23 | 2020-05-12 | 中建中新建设工程有限公司 | Vibration isolation and moisture prevention mounting device for building electrical equipment |
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CN216121255U (en) * | 2021-09-03 | 2022-03-22 | 盐城凌光智能科技有限公司 | Dampproofing switch board |
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