CN114827413A - Camera module and electronic equipment - Google Patents
Camera module and electronic equipment Download PDFInfo
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- CN114827413A CN114827413A CN202210436631.2A CN202210436631A CN114827413A CN 114827413 A CN114827413 A CN 114827413A CN 202210436631 A CN202210436631 A CN 202210436631A CN 114827413 A CN114827413 A CN 114827413A
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
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Abstract
The invention discloses a camera module and electronic equipment, relating to the technical field of electronic equipment, wherein the camera module comprises: the lens barrel comprises a first lens barrel, a second lens barrel and a flexible circuit board; the second lens barrel is movably arranged on the inner side of the first lens barrel, a first gap is formed between the inner side wall of the first lens barrel and the outer side wall of the second lens barrel, and the first part of the flexible circuit board is located in the first gap.
Description
Technical Field
The invention belongs to the technical field of electronic equipment, and particularly relates to a camera module and electronic equipment.
Background
With the development of technology, the manufacturing technology of electronic devices has been rapidly improved. In order to further improve the shooting effect of the camera of the electronic equipment, the telescopic zoom camera comes along. The telescopic camera that zooms passes through the removal of camera lens, effectively extends high space, reduces the shared module space of making a video recording of camera lens, uses bigger light ring, bigger sensor in the module of realizing making a video recording, improves optical property to promote the effect of shooing.
In the existing telescopic zoom camera solution, a flexible circuit board is usually disposed in an inner cavity of the camera, and the flexible circuit board is electrically connected to a Voice Coil Motor (VCM) at a lens, so as to implement power supply and signal transmission.
When adopting current telescopic camera that zooms, because flexible circuit board can shelter from the lens section of thick bamboo in the camera is inside for image sensor's area receives the restriction, and flexible circuit board still can block the light entering sensor in the camera lens, influences the shooting quality.
Disclosure of Invention
The embodiment of the invention aims to provide a camera module and electronic equipment, which can solve the problem that in the prior art, a flexible circuit board can shield a lens barrel in a camera to influence the shooting quality.
In order to solve the technical problem, the invention is realized as follows:
in a first aspect, an embodiment of the present invention provides a camera module, including: the lens barrel comprises a first lens barrel, a second lens barrel and a flexible circuit board;
the second lens barrel is movably arranged on the inner side of the first lens barrel, a first gap is formed between the inner side wall of the first lens barrel and the outer side wall of the second lens barrel, and the first part of the flexible circuit board is located in the first gap.
In a second aspect, an embodiment of the present invention provides an electronic device, including the camera module described above.
In the embodiment of the invention, the camera module comprises a first lens barrel, a second lens barrel and a flexible circuit board; the second lens cone is movably arranged on the inner side of the first lens cone, a first gap is formed between the inner side wall of the first lens cone and the outer side wall of the second lens cone, and the first part of the flexible circuit board is located in the first gap. The first part of the flexible circuit board is contained in the first gap, so that the position of the flexible circuit board inside the lens barrel is relatively fixed, the bending deformation of the flexible circuit board is controllable, the shielding of the inner space of the lens barrel can be reduced, the light entering amount of the lens can be improved, the larger-size photosensitive chip can be arranged, and the shooting quality is improved.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
Fig. 1 is a schematic structural diagram of a camera module when a second lens barrel is located at a first position according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a camera module according to an embodiment of the present invention, where the second barrel is located at a second position;
fig. 3 is a schematic structural diagram of a camera module when the second lens barrel is located at the first position and the third lens barrel is located at the retracted position according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a camera module according to an embodiment of the present invention, where the second barrel is located at a second position and the third barrel is located at an extended position;
FIG. 5 is a schematic diagram of a flexible circuit board according to an embodiment of the present invention;
FIG. 6 is a second schematic diagram of a flexible circuit board according to an embodiment of the present invention;
FIG. 7 is an enlarged view taken at point I of FIG. 6 according to an embodiment of the present invention;
FIG. 8 is a third schematic diagram of a flexible circuit board according to an embodiment of the present invention;
FIG. 9 is a schematic view of the structure of the embodiment of the present invention along the direction a in FIG. 8;
fig. 10 is a schematic view of a hinge structure according to an embodiment of the present invention.
Description of the reference numerals:
10-a first barrel; 20-a second barrel; 30-a flexible circuit board; 40-a drive assembly; 50-a lens assembly; 60-a photosensitive chip; 70-a first guide; 80-a hinge; 90-a third barrel; 100-a second guide; 101-a first gap; 102-a second gap; 301-a first portion; 302-a second portion; 303-a linking moiety; 304-a pad; 801-connecting shaft; 802-a support plate; 3011-a first bend segment; 3021-second curved section.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments that can be derived by one of ordinary skill in the art from the embodiments given herein are intended to be within the scope of the present invention.
The terms first, second and the like in the description and in the claims of the present invention are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that embodiments of the invention may be practiced otherwise than as specifically illustrated and described herein. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.
In the description of the present invention, it is to be understood that the terms "length", "upper", "lower", "inner", "outer", etc., indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the present invention.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1 to 2, an embodiment of the present invention provides a camera module, including: a first barrel 10, a second barrel 20, and a flexible circuit board 30; the second barrel 20 is movably disposed inside the first barrel 10, a first gap 101 is formed between an inner sidewall of the first barrel 10 and an outer sidewall of the second barrel 20, and the first portion 301 of the flexible circuit board 30 is located in the first gap 101.
Specifically, as shown in fig. 1 to 2, the image capturing module includes a first barrel 10 and a second barrel 20, an inner diameter of the first barrel 10 is slightly larger than an outer diameter of the second barrel 20, the first barrel 10 is sleeved on the second barrel 20 to be mounted, an inner sidewall of the first barrel 10 is opposite to an outer sidewall of the second barrel 20, a first gap 101 is formed between the inner sidewall of the first barrel 10 and the outer sidewall of the second barrel 20, and the first gap 101 is about 0.5 mm.
The lens assembly 50 is mounted in the second barrel 20, and the flexible circuit board 30 is used for supplying power to the lens assembly 50. Along the optical axis direction of the camera module, the first barrel 10 and the second barrel 20 can move relatively, and specifically, a slide rail can be arranged on the inner side wall of the first barrel 10 or the outer side wall of the second barrel 20, so as to realize the relative movement of the first barrel 10 and the second barrel 20.
The lens assembly 50 can be driven to move by the relative movement of the first lens barrel 10 and the second lens barrel 20, so as to realize zooming. The relative movement between the first barrel 10 and the second barrel 20 can be controlled manually, for example, a user can rotate the first barrel 10 manually to drive the second barrel 20 to extend or retract relative to the first barrel 10. The first barrel 10 and the second barrel 20 may also be driven to move relatively by the cooperation of the stepping motor and the planetary gear, which is not limited in the embodiment of the present invention.
When the first barrel 10 and the second barrel 20 move relatively, the flexible circuit board 30 is driven to deform accordingly. The first portion 301 of the flexible circuit board 30 may be mounted in the first gap 101 for storage, wherein the first portion 301 is a portion of the flexible circuit board 30 close to the first barrel 10. When the first portion 301 of the flexible circuit board 30 is located in the first gap 101, the inner sidewall of the first barrel 10 and the outer sidewall of the second barrel 20 can limit the first portion 301, so as to prevent the flexible circuit board 30 from being deformed at will and even extending into the barrel to block light.
In the embodiment of the present invention, the first portion 301 of the flexible circuit board 30 is accommodated in the first gap 101, so that the position of the flexible circuit board 30 inside the lens barrel is relatively fixed, the bending deformation of the flexible circuit board 30 is controllable, and the shielding of the inner space of the lens barrel can be reduced, thereby facilitating the improvement of the light entering amount of the lens, the arrangement of the photosensitive chip 60 with a larger size, and the improvement of the shooting quality.
Optionally, referring to fig. 1 to 2, the camera module further includes a driving assembly 40 and a lens assembly 50, one end of the flexible circuit board 30 is electrically connected to the driving assembly 40, and the other end of the flexible circuit board 30 passes through the first gap 101 and is electrically connected to the lens assembly 50.
Specifically, as shown in fig. 1 to 2, the lens assembly 50 is disposed inside the second barrel 20. A Voice Coil Motor (VCM) is provided in the lens assembly 50, and the VCM can drive the lens to move, thereby implementing focusing and zooming functions. The side of the first barrel 10 away from the second barrel 20 is fixed to a driving assembly 40, and the driving assembly 40 is used for outputting an electrical signal to the lens assembly 50. One end of the flexible circuit board 30 is electrically connected to the driving assembly 40, and the other end of the flexible circuit board 30 passes through the first gap 101 to be electrically connected to the lens assembly 50, so as to transmit an electrical signal of the driving assembly 40 to the VCM, and control the focusing and zooming functions of the lens assembly 50. By using the VCM in cooperation with the first barrel 10 and the second barrel 20, a wider range of focal length adjustment can be achieved.
When the flexible circuit board 30 is arranged, the other end of the flexible circuit board 30 is electrically connected to the lens assembly 50 through the first gap 101, so that the first portion 301 of the flexible circuit board 30 is located in the first gap 101, and the flexible circuit board 30 is accommodated. Under the restriction of the inner sidewall of the first barrel 10 and the outer sidewall of the second barrel 20, the flexible circuit board 30 will not deform at will or even extend into the barrel to block light.
Optionally, referring to fig. 1 to 2, the image capturing module further includes a photosensitive chip 60, when the second barrel 20 is located at a first position close to the photosensitive chip 60, the second barrel 20 is located inside the first barrel 10, and the first portion 301 is located in the first gap 101; when the second barrel 20 is located at the second position far away from the photosensitive chip 60, one end of the second barrel 20 extends out of the first barrel 10, and the first portion 301 is located between the inner side wall of the first barrel 10 and the outer side wall of the second barrel 20.
Specifically, as shown in fig. 1 to fig. 2, a photosensitive chip 60 is disposed on a side of the first barrel 10 away from the second barrel 20, and the photosensitive chip 60 may be a CCD (Charge Coupled Device) or a CMOS (Complementary Metal-Oxide Semiconductor). The photosensitive chip 60 is disposed opposite to the lens assembly 50. The ambient light enters the first barrel 10 and the second barrel 20 through the lens assembly 50, and is finally transmitted to the photosensitive chip 60 to realize imaging.
Fig. 1 is a schematic structural diagram of a camera module when the second barrel 20 is located at the first position according to an embodiment of the present invention, the first barrel 10 and the second barrel 20 can move relatively, when the second barrel 20 moves to the first position close to the photo chip 60, the second barrel 20 retracts to the inside of the first barrel 10, and the retractable barrel formed by the first barrel 10 and the second barrel 20 is shortened as a whole. The inner side wall of the first barrel 10 is partially overlapped with the outer side wall of the second barrel 20 to form a first gap 101, and the first part 301 of the flexible circuit board 30 is accommodated in the first gap 101 under the driving of the first barrel 10 and the second barrel 20. Under the restriction of the inner sidewall of the first barrel 10 and the outer sidewall of the second barrel 20, the flexible circuit board 30 will not deform at will or even extend into the barrel to block light.
Fig. 2 is a schematic structural diagram of the image pickup module when the second barrel 20 is located at the second position according to the embodiment of the present invention, and when the second barrel 20 moves to the second position away from the photo-sensing chip 60, that is, the second barrel 20 extends from the first barrel 10, and the retractable barrel formed by the first barrel 10 and the second barrel 20 extends as a whole. At this time, the first portion 301 of the flexible circuit board 30 is between the inner sidewall of the first barrel 10 and the outer sidewall of the second barrel 20, supported by the first barrel 10 and the second barrel 20. It can be understood that, the inner sidewall of the first barrel 10 and the outer sidewall of the second barrel 20 project toward the photosensitive chip 60, and a region formed between the two projections is a region between the inner sidewall of the first barrel 10 and the outer sidewall of the second barrel 20, which is actually an extension of the first gap 101.
After the second barrel 20 is extended from the first barrel 10, the inner sidewall of the first barrel 10 and the outer sidewall of the second barrel 20 are not in an opposite state. However, since the retractable lens barrel formed by the first lens barrel 10 and the second lens barrel 20 is extended as a whole, the required length of the flexible circuit board 30 is increased, and the first portion 301 of the flexible circuit board 30 is still located between the inner side wall of the first lens barrel 10 and the outer side wall of the second lens barrel 20 under the pulling of the first lens barrel 10 and the second lens barrel 20, that is, the first portion 301 does not exceed the actual range of the first gap 101. Therefore, the flexible circuit board 30 will not deform at will and even extend into the lens barrel to block light.
Optionally, referring to fig. 1, 5 to 9, the image capturing module further includes a photosensitive chip 60, the flexible circuit board 30 is fixedly connected to the second barrel 20, and when the second barrel 20 is located at a first position close to the photosensitive chip 60, the first portion 301 of the flexible circuit board 30 located in the first gap 101 has a first bending section 3011.
Specifically, as shown in fig. 1, 5 to 9, a photosensitive chip 60 is provided on a side of the first barrel 10 away from the second barrel 20. The first barrel 10 and the second barrel 20 are relatively movable, and when the second barrel 20 moves to a first position close to the photosensitive chip 60, the second barrel 20 retracts to the inner side of the first barrel 10. Since the entire retractable lens barrel composed of the first lens barrel 10 and the second lens barrel 20 is shortened, the required flexible circuit board 30 is also shortened, and the redundant flexible circuit board 30 needs to be stored.
The flexible circuit board 30 is fixedly connected to the surface of the second barrel 20 facing the photosensitive chip 60, so that both sides of the first portion 301 are fixed during the process of moving the second barrel 20 to the first position close to the photosensitive chip 60, and the first portion 301 of the flexible circuit board 30 can be bent into the first bending section 3011 in the first gap 101 along with the movement of the second barrel 20. The first portion 301 of the flexible circuit board 30 is accommodated in the first gap 101 in a bending manner, and under the restriction action of the inner side wall of the first lens barrel 10 and the outer side wall of the second lens barrel 20, the flexible circuit board 30 cannot be randomly deformed and even can extend into the lens barrel to shield light.
In order to avoid the situation that damage appears in the flexible circuit board 30 bending repeatedly, can thicken or strengthen the processing to first crooked section 3011, promote flexible circuit board 30's anti bending ability, and then promoted the use durability of the module of making a video recording.
Optionally, referring to fig. 8 and 9, the camera module further includes a first guide 70, and the first guide 70 is attached to the first bending section 3011; when the second barrel 20 is located at the first position, the first guide 70 bends with the first bending section 3011 and supports the first bending section 3011.
Specifically, as shown in fig. 8 and 9, the flexible circuit board 30 realizes the curved accommodation in the first gap 101 with the first curved section 3011. The flexible circuit board 30 is further provided with a first guide element 70, the first guide element 70 is attached to the first bending section 3011, and the first guide element 70 and the first bending section 3011 may be fixed by means of bonding or clamping. The first guiding element 70 may be disposed on an inner side of the first bending section 3011 or on an outer side of the first bending section 3011, where the inner side of the first bending section 3011 is a side close to a curvature center of the first bending section 3011, and the outer side of the first bending section 3011 is a side away from the curvature center of the first bending section 3011. First guides 70 may also be provided both inside and outside the first bend segment 3011.
The first guide 70 may be a flexible plate, a bendable hinge, or the like. When the second barrel 20 moves to the first position close to the photosensitive chip 60, the first portion 301 is bent from the first bent section 3011 and is received in the first gap 101. The first guide member 70 is bent along with the first bending section 3011, and the bending direction of the first guide member 70 is the same as the bending direction of the first bending section 3011.
Through setting up first guide 70, can support the first crooked section 3011 of flexible circuit board 30 and strengthen, restrict the crooked direction and the crooked size of first crooked section 3011, avoid flexible circuit board 30 to bend at will, the first lens cone 10 appears and second lens cone 20 blocks and shelters from the problem of sensitization chip 60.
Alternatively, as shown with reference to fig. 7 and 10, the first guide 70 includes a hinge 80; the hinge 80 includes a connecting shaft 801 and a plurality of support plates 802, adjacent support plates 802 being connected by the connecting shaft 801; the extending direction of the support plate 802 is parallel to the extending direction of the bending axis of the first bending section 3011.
Specifically, as shown in fig. 7 and 10, the first guide 70 may be a hinge 80, the hinge 80 includes a connecting shaft 801 and a plurality of support plates 802, the support plates 802 may be made of metal or plastic, the plurality of support plates 802 are disposed in parallel, and a space is provided between adjacent support plates 802. The plurality of support plates 802 are connected in series by a connecting shaft 801. The connecting shaft 801 may be a wire or fiber structure, and has a certain bending property, and can be bent together with the plurality of supporting plates 802. As shown in fig. 7, the point O is a bending axis of the first bending section 3011, the extending direction of the bending axis is perpendicular to the paper surface and inward, and the extending direction of the support plate 802, i.e., the length direction of the support plate 802 is parallel to the extending direction of the bending axis.
The number of the connecting shafts 801 may be one, two or more, and may be selected according to the length of the supporting plate 802, and when the length of the supporting plate 802 is long, a plurality of connecting shafts 801 may be disposed at intervals along the length direction of the supporting plate 802 in order to ensure the stability of the supporting plate 802 in series connection.
The hinge 80 is attached to the first bending section 3011 of the flexible circuit board 30, the support plate 802 can well support the first bending section 3011 and can bend along with the first bending section 3011, the bending direction of the hinge 80 is the same as that of the first bending section 3011, the bending direction and the bending size of the first bending section 3011 can be limited, the flexible circuit board 30 is prevented from being bent at will, and the problems that the first lens barrel 10 and the second lens barrel 20 are jammed and shield the photosensitive chip 60 occur.
Alternatively, referring to fig. 6 and 7, when the second barrel 20 is located at the first position, the first guide 70 is bent with the first bent section 3011 and defines a bending radius of the first bent section 3011 to be greater than or equal to 0.2 mm.
Specifically, as shown in fig. 6 and 7, when the second barrel 20 is moved to the first position close to the photosensitive chip 60, the first portion 301 is bent from the first bent section 3011 and is accommodated in the first gap 101. The first guide member 70 is bent together with the first bending section 3011, and under the support of the first guide member 70, the first bending section 3011 is bent in a U shape, and is in arc transition at the bent position, and the bending radius of the first bending section 3011 is greater than or equal to 0.2mm, so that the phenomenon of stress concentration of the flexible circuit board 30 at the first bending section 3011 is avoided, and the bending resistance of the flexible circuit board 30 is improved.
Optionally, referring to fig. 3 to 4, the camera module further includes a third barrel 90; the third barrel 90 is movably disposed inside the second barrel 20, and a second gap 102 is formed between an inner sidewall of the second barrel 20 and an outer sidewall of the third barrel 90; the second portion 302 of the flexible circuit board 30 is located within the second gap 102.
Specifically, as shown in fig. 3 to 4, the image capturing module further includes a third barrel 90, an inner diameter of the second barrel 20 is slightly larger than an outer diameter of the third barrel 90, the second barrel 20 is sleeved on the third barrel 90 for installation, an inner sidewall of the second barrel 20 is opposite to an outer sidewall of the third barrel 90, a second gap 102 is formed between the inner sidewall of the second barrel 20 and the outer sidewall of the third barrel 90, and the second gap 102 is about 0.5 mm.
The lens assembly 50 is mounted in the third lens barrel 90, and the flexible circuit board 30 is used for supplying power to the lens assembly 50. Along the optical axis direction of the camera module, the second barrel 20 and the third barrel 90 can move relatively, and specifically, a slide rail can be arranged on the inner side wall of the second barrel 20 or the outer side wall of the third barrel 90, so as to realize the relative movement of the second barrel 20 and the third barrel 90.
When the second barrel 20 and the third barrel 90 move relatively, the flexible circuit board 30 is driven to deform accordingly. A second portion 302 of the flexible circuit board 30 may be mounted in the second gap 102 for storage, wherein the second portion 302 is a portion of the flexible circuit board 30 near the third barrel 90. When the second portion 302 of the flexible circuit board 30 is located in the second gap 102, the inner sidewall of the second barrel 20 and the outer sidewall of the third barrel 90 limit the second portion 302, so as to prevent the flexible circuit board 30 from being deformed at will and even extending into the barrel to block light.
In the embodiment of the present invention, the first portion 301 of the flexible circuit board 30 is received in the first gap 101, and the second portion 302 of the flexible circuit board 30 is received in the second gap 102, so that the position of the flexible circuit board 30 inside the lens barrel is relatively fixed, the bending deformation of the flexible circuit board 30 is controllable, and the shielding of the inner space of the lens barrel can be reduced, thereby facilitating the improvement of the light entering amount of the lens, the arrangement of the photosensitive chip 60 with a larger size, and the improvement of the shooting quality.
Optionally, as shown in fig. 3 to 4, the camera module further includes a driving assembly 40 and a lens assembly 50, the lens assembly 50 is disposed in the third barrel 90, one end of the flexible circuit board 30 is electrically connected to the driving assembly 40, and the other end of the flexible circuit board 30 passes through the first gap 101 and the second gap 102 and is electrically connected to the lens assembly 50.
Specifically, as shown in fig. 3 to 4, the lens assembly 50 is disposed inside the third barrel 90. One end of the flexible circuit board 30 is electrically connected to the driving assembly 40, and the other end of the flexible circuit board 30 passes through the first gap 101 and the second gap 102 to be electrically connected to the lens assembly 50, so as to transmit an electrical signal of the driving assembly 40 to the VCM, and control the focusing and zooming functions of the lens assembly 50. By matching the VCM with the first barrel 10, the second barrel 20, and the third barrel 90, a focal length adjustment in a wider range can be achieved.
When the flexible circuit board 30 is arranged, the other end of the flexible circuit board 30 is electrically connected to the lens assembly 50 through the first gap 101 and the second gap 102, so that the first portion 301 of the flexible circuit board 30 is located in the first gap 101, and the second portion 302 of the flexible circuit board 30 is located in the second gap 102, thereby accommodating the flexible circuit board 30. Under the limiting action of the inner side wall of the first lens barrel 10, the outer side wall of the second lens barrel 20, the inner side wall of the second lens barrel 20 and the outer side wall of the third lens barrel 90, the flexible circuit board 30 cannot be deformed at will or even extend into the lens barrels to shield light.
Optionally, referring to fig. 3 to 4, the image capturing module further includes a photosensitive chip 60, when the third barrel 90 is located at a retracted position close to the photosensitive chip 60, the third barrel 90 is located inside the second barrel 20, and the second portion 302 of the flexible circuit board 30 is located in the second gap 102; when the third barrel 90 is located at the extended position away from the photosensitive chip 60, one end of the third barrel 90 extends out of the second barrel 20, and the second portion 302 is located between the inner sidewall of the second barrel 20 and the outer sidewall of the third barrel 90.
Specifically, as shown in fig. 3 to 4, a photosensitive chip 60 is provided at a side close to the first barrel 10, and the second barrel 20 and the third barrel 90 are relatively movable. Fig. 3 is a schematic structural diagram of the image pickup module in the embodiment of the present invention, when the second barrel 20 is located at the first position and the third barrel 90 is located at the retracted position, when the third barrel 90 moves to the retracted position close to the photosensitive chip 60, the third barrel 90 retracts to the inner side of the second barrel 20, and the retractable barrel formed by the second barrel 20 and the third barrel 90 shortens as a whole. The inner sidewall of the second barrel 20 is partially overlapped with the outer sidewall of the third barrel 90 to form a second gap 102, and the second portion 302 of the flexible circuit board 30 is accommodated in the second gap 102 under the driving of the second barrel 20 and the third barrel 90. Under the restriction of the inner sidewall of the second barrel 20 and the outer sidewall of the third barrel 90, the flexible circuit board 30 will not deform at will or even extend into the barrel to block light.
Fig. 4 is a schematic structural diagram of the image pickup module in the embodiment of the present invention, when the second barrel 20 is located at the second position and the third barrel 90 is located at the extended position, when the third barrel 90 moves to the extended position away from the photosensitive chip 60, that is, the third barrel 90 extends from the second barrel 20, and the retractable barrel formed by the second barrel 20 and the third barrel 90 extends as a whole. At this time, the second portion 302 of the flexible circuit board 30 is between the inner sidewall of the second barrel 20 and the outer sidewall of the third barrel 90 under the support of the second barrel 20 and the third barrel 90. It can be understood that, the inner sidewall of the second barrel 20 and the outer sidewall of the third barrel 90 project toward the photosensitive chip 60, and a region formed between the two projections is a region between the inner sidewall of the second barrel 20 and the outer sidewall of the third barrel 90, which is actually an extension of the second gap 102.
After the third barrel 90 extends out of the second barrel 20, the inner side wall of the second barrel 20 and the outer side wall of the third barrel 90 are not in an opposite state. However, since the retractable lens barrel formed by the second lens barrel 20 and the third lens barrel 90 is extended as a whole, the required length of the flexible circuit board 30 is increased, and the second portion 302 of the flexible circuit board 30 is still located between the inner sidewall of the second lens barrel 20 and the outer sidewall of the third lens barrel 90 under the pulling of the second lens barrel 20 and the third lens barrel 90, that is, the second portion 302 does not exceed the actual range of the second gap 102. Therefore, the flexible circuit board 30 will not deform at will and even extend into the lens barrel to block light.
Optionally, referring to fig. 3, 5 to 9, the image capturing module further includes a photosensitive chip 60, a connection portion 303 is disposed between the first portion 301 and the second portion 302 of the flexible circuit board 30, the connection portion 303 is fixedly connected to the second barrel 20, and when the third barrel 90 is located at the retracted position, the second portion 302 of the flexible circuit board 30 located in the second gap 102 has a second bending section 3021.
Specifically, as shown in fig. 3, 5 to 9, the second barrel 20 and the third barrel 90 are relatively movable, and when the third barrel 90 is moved to a retracted position close to the photosensitive chip 60, the third barrel 90 is retracted to the inside of the second barrel 20. Since the entire retractable lens barrel composed of the second lens barrel 20 and the third lens barrel 90 is shortened, the required flexible circuit board 30 is also shortened, and the redundant flexible circuit board 30 needs to be stored.
The flexible circuit board 30 includes a first portion 301, a second portion 302, and a connection portion 303, the connection portion 303 being located between the first portion 301 and the second portion 302. During the movement of the third barrel 90 to the retracted position close to the photosensitive chip 60, the second portion 302 of the flexible circuit board 30 is bent to form a second bent section 3021 in the second gap 102 along with the movement of the third barrel 90. The second portion 302 of the flexible circuit board 30 is accommodated in the second gap 102 by bending, and under the restriction action of the inner sidewall of the second barrel 20 and the outer sidewall of the third barrel 90, the flexible circuit board 30 will not deform at will and even stretch into the barrel to shield light.
For avoiding the flexible circuit board 30 to bend repeatedly the condition that the damage appears, can thicken or strengthen the processing to second bending section 3021, promote flexible circuit board 30's bending resistance ability, and then promoted the use durability of the module of making a video recording.
The connection portion 303 is used to be fixed to the second barrel 20, and the specific fixing manner may be bonding or snapping, for example, an adhesive may be coated on a side of the connection portion 303 close to the second barrel 20 or an adhesive layer may be provided, and the flexible circuit board 30 is bonded to the second barrel 20 through the connection portion 303. Specifically, the adhesive may be adhered to the inner wall of the second barrel 20, or may be adhered to the bottom surface of the second barrel 20 on the side close to the first barrel 10. In the process of the telescopic lens barrel, the flexible circuit board 30 is only bent on the first part 301 and the second part 302, and the rest parts are not displaced and deformed, so that the mounting stability of the flexible circuit board 30 is greatly improved.
In addition, as shown in fig. 8 to 9, the flexible circuit board 30 needs to be provided with pads 304 at two ends, the pad 304 at one end is used for connecting the lens assembly 50, and the pad 304 at the other end is used for connecting the driving assembly 40. Bending sections are respectively arranged at the bonding pads 304 close to the two ends, so that the bonding pads 304 are convenient to connect.
Optionally, referring to fig. 8 and 9, the camera module further includes a second guide 100, and the second guide 100 is attached to the second bending section 3021; when the third barrel 90 is located at the retracted position, the second guide 100 bends along with the second bending section 2021 and supports the second bending section 3021.
Specifically, as shown in fig. 8 and 9, the flexible circuit board 30 realizes the curved accommodation in the second gap 102 with the second curved section 3021. The flexible circuit board 30 is further provided with a second guide 100, and the second guide 100 is attached to the second bending section 3021, and may be fixed to the second bending section 3021 by using an adhesive or a snap-fit manner. The second guiding element 100 can be disposed on the inner side of the second curved section 3021, or disposed on the outer side of the second curved section 3021, where the inner side of the second curved section 3021 is a side close to the curvature center of the second curved section 3021, and the outer side of the second curved section 3021 is a side far from the curvature center of the second curved section 3021. A second guide 100 may also be provided both inside and outside the second curved section 3021.
The second guide 100 may be a flexible plate, a bendable hinge, or the like. When the third barrel 90 moves to the retracted position close to the photosensitive chip 60, the second portion 302 is bent at the second bent section 3021 and is received in the second gap 102. The second guide member 100 is bent together with the second bent section 3021, and the bending direction of the second guide member 100 is the same as the bending direction of the second bent section 3021.
By providing the second guide 100, the second bending section 3021 of the flexible circuit board 30 can be supported and reinforced. The bending direction and the bending size of the second bending section 3021 are limited, so that the flexible circuit board 30 is prevented from being bent at will, and the second lens barrel 20 and the third lens barrel 90 are prevented from being jammed and blocking the photosensitive chip 60.
Alternatively, as shown with reference to fig. 7 and 10, the second guide 100 includes a hinge 80; the hinge 80 includes a connecting shaft 801 and a plurality of support plates 802, adjacent support plates 802 being connected by the connecting shaft 801; the extending direction of the support plate 802 is parallel to the extending direction of the bending axis of the second bending section 3021.
Specifically, as shown in fig. 7 and 10, the second guide 100 may also be a hinge 80, the hinge 80 includes a connecting shaft 801 and a plurality of supporting plates 802, the supporting plates 802 may be made of metal or plastic, the plurality of supporting plates 802 are arranged in parallel, and a space is provided between adjacent supporting plates 802. The plurality of support plates 802 are connected in series by a connecting shaft 801. The connecting shaft 801 may be a wire or fiber structure, and has a certain bending property, and can be bent together with the plurality of supporting plates 802.
The number of the connecting shafts 801 may be one, two or more, and may be selected according to the length of the supporting plate 802, and when the length of the supporting plate 802 is long, a plurality of connecting shafts 801 may be disposed at intervals along the length direction of the supporting plate 802 in order to ensure the stability of the supporting plate 802 in series connection.
The hinge 80 is attached to the second bending section 3021 of the flexible circuit board 30, the support plate 802 can support the second bending section 3021 well, and can bend along with the second bending section 3021, and the bending direction of the hinge 80 is the same as that of the second bending section 3021, so that the bending direction and the bending size of the second bending section 3021 can be limited, the flexible circuit board 30 is prevented from being bent at will, and the problems that the second lens barrel 20 and the third lens barrel 90 are jammed and the photosensitive chip 60 is shielded are caused.
Alternatively, referring to fig. 6 and 7, when the third barrel 90 is located at the retracted position, the second guide 100 is bent along with the second curved section 3021 and defines a bending radius of the second curved section 3021 of 0.2mm or more.
Specifically, as shown in fig. 6 and 7, when the third barrel 90 is moved to the retracted position close to the photosensitive chip 60, the second portion 302 is bent at the second bent section 3021 and is accommodated in the second gap 102. The second guide member 100 is bent together with the second bending section 3021, and under the support of the second guide member 100, the second bending section 3021 is U-shaped and is in arc transition at the bent portion, and the bending radius of the second bending section 3021 is greater than or equal to 0.2mm, so that the phenomenon of stress concentration of the flexible circuit board 30 at the second bending section 3021 is avoided, and the bending resistance of the flexible circuit board 30 is improved.
Optionally, referring to fig. 3 to 4, the second barrel 20 is movably disposed inside the first barrel 10, a first gap 101 is formed between an inner sidewall of the first barrel 10 and an outer sidewall of the second barrel 20, and the first portion 301 of the flexible circuit board 30 is located in the first gap 101; the third barrel 90 is movably disposed inside the second barrel 20, and a second gap 102 is formed between an inner sidewall of the second barrel 20 and an outer sidewall of the third barrel 90; the second portion 302 of the flexible circuit board 30 is located within the second gap 102.
Specifically, as shown in fig. 3 to 4, the image pickup module adopts a three-stage lens barrel structure, which further improves the zoom capability. The camera module includes a first barrel 10, a second barrel 20 and a third barrel 90. The first barrel 10 is sleeved on the second barrel 20, and an inner sidewall of the first barrel 10 is opposite to an outer sidewall of the second barrel 20 to form a first gap 101. The second barrel 20 is sleeved on the third barrel 90, and an inner sidewall of the second barrel 20 is opposite to an outer sidewall of the third barrel 90 to form a second gap 102. The light enters the third barrel 90, the second barrel 20 and the first barrel 10 through the lens, and is finally transmitted to the photosensitive chip 60 to realize imaging. The relative movement of the first barrel 10 and the second barrel 20 and the relative movement of the second barrel 20 and the third barrel 90 can be controlled separately or collectively.
The lens assembly 50 is mounted in the third lens barrel 90, and the flexible circuit board 30 is used for supplying power to the lens assembly 50. The flexible circuit board 30 includes a first portion 301 and a second portion 302, where the first portion 301 is a portion of the flexible circuit board 30 near the first barrel 10, and the second portion 302 is a portion of the flexible circuit board 30 near the third barrel 90.
When the second barrel 20 moves to the first position close to the photosensitive chip 60 and the third barrel 90 moves to the retracted position close to the photosensitive chip 60, the first portion 301 of the flexible circuit board 30 is received in the first gap 101, the second portion 302 of the flexible circuit board 30 is received in the second gap 102, and the flexible circuit board 30 is distributed in an M shape as a whole.
In the embodiment of the present invention, the first portion 301 of the flexible circuit board 30 is received in the first gap 101, and the second portion 302 of the flexible circuit board 30 is received in the second gap 102, so that the position of the flexible circuit board 30 inside the lens barrel is relatively fixed, the bending deformation of the flexible circuit board 30 is controllable, and the shielding of the inner space of the lens barrel can be reduced, thereby facilitating the improvement of the light entering amount of the lens, the arrangement of the photosensitive chip 60 with a larger size, and the improvement of the shooting quality.
An embodiment of the present invention further provides an electronic device, including the camera module, where the electronic device may include but is not limited to at least one of a mobile phone, a tablet computer, and a wearable device, and a specific type of the electronic device may not be limited in the embodiment of the present invention.
In an embodiment of the present invention, the electronic device includes the above-mentioned camera module, and the camera module includes a first lens barrel 10, a second lens barrel 20, a third lens barrel 90, and a flexible circuit board 30; the second barrel 20 is movably disposed inside the first barrel 10, a first gap 101 is formed between an inner sidewall of the first barrel 10 and an outer sidewall of the second barrel 20, and the first portion 301 of the flexible circuit board 30 is located in the first gap 101; the third barrel 90 is movably disposed inside the second barrel 20, and a second gap 102 is formed between an inner sidewall of the second barrel 20 and an outer sidewall of the third barrel 90; the second portion 302 of the flexible circuit board 30 is located within the second gap 102. Through accomodating first part 301 with flexible circuit board 30 in first clearance 101, accomodate second part 302 of flexible circuit board 30 in second clearance 102, make flexible circuit board 30 relatively fixed in the inside position of lens cone, flexible circuit board 30's bending deformation is controllable, can reduce the sheltering from to lens cone inner space to be favorable to improving the camera lens light inlet volume, and arrange bigger size's sensitization chip 60, promoted the shooting quality.
In the description herein, reference to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.
Claims (15)
1. The utility model provides a module of making a video recording which characterized in that includes: the lens barrel comprises a first lens barrel, a second lens barrel and a flexible circuit board;
the second lens barrel is movably arranged on the inner side of the first lens barrel, a first gap is formed between the inner side wall of the first lens barrel and the outer side wall of the second lens barrel, and the first part of the flexible circuit board is located in the first gap.
2. The camera module of claim 1, further comprising a drive assembly and a lens assembly, wherein one end of the flexible circuit board is electrically connected to the drive assembly and the other end of the flexible circuit board is electrically connected to the lens assembly through the first gap.
3. The camera module according to claim 1, further comprising a photosensitive chip, wherein when the second barrel is located at a first position close to the photosensitive chip, the second barrel is located inside the first barrel, and the first portion is located in the first gap;
when the second lens barrel is located at a second position far away from the photosensitive chip, one end of the second lens barrel extends out of the first lens barrel, and the first part is located between the inner side wall of the first lens barrel and the outer side wall of the second lens barrel.
4. The camera module according to claim 1, further comprising a light sensing chip, wherein the flexible circuit board is fixedly connected to the second barrel, and when the second barrel is located at a first position close to the light sensing chip, the first portion of the flexible circuit board located in the first gap has a first curved section.
5. The camera module of claim 4, further comprising a first guide, wherein the first guide is attached to the first curved section;
when the second lens barrel is located at the first position, the first guide piece bends along with the first bending section and supports the first bending section.
6. The camera module of claim 5, wherein the first guide comprises a hinge;
the hinge comprises a connecting shaft and a plurality of supporting plates, and the adjacent supporting plates are connected through the connecting shaft;
the extending direction of the supporting plate is parallel to the extending direction of the bending shaft of the first bending section.
7. The camera module according to claim 5, wherein when the second barrel is located at the first position, the first guide member is curved with the first curved section and defines a radius of curvature of the first curved section of 0.2mm or more.
8. The camera module of claim 1, further comprising a third barrel;
the third lens cone is movably arranged on the inner side of the second lens cone, and a second gap is formed between the inner side wall of the second lens cone and the outer side wall of the third lens cone; a second portion of the flexible circuit board is located within the second gap.
9. The camera module according to claim 8, further comprising a driving assembly and a lens assembly, wherein the lens assembly is disposed in the third barrel, one end of the flexible circuit board is electrically connected to the driving assembly, and the other end of the flexible circuit board passes through the first gap and the second gap and is electrically connected to the lens assembly.
10. The camera module according to claim 8, further comprising a photosensitive chip, wherein when the third barrel is located at a retracted position close to the photosensitive chip, the third barrel is located inside the second barrel, and the second portion of the flexible circuit board is located in the second gap;
when the third lens barrel is located at the extending position far away from the photosensitive chip, one end of the third lens barrel extends out of the second lens barrel, and the second part is located between the inner side wall of the second lens barrel and the outer side wall of the third lens barrel.
11. The camera module according to claim 8, further comprising a photosensitive chip, wherein a connection portion is disposed between the first portion and the second portion of the flexible circuit board, the connection portion is fixedly connected to the second barrel, and when the third barrel is located at the retracted position, the second portion of the flexible circuit board located in the second gap has a second bending section.
12. The camera module of claim 11, further comprising a second guide, wherein the second guide is attached to the second curved section;
when the third lens barrel is located at the retraction position, the second guide member is bent along with the second bending section and supports the second bending section.
13. The camera module of claim 12, wherein the second guide comprises a hinge;
the hinge comprises a connecting shaft and a plurality of supporting plates, and the adjacent supporting plates are connected through the connecting shaft;
the extending direction of the supporting plate is parallel to the extending direction of the bending shaft of the second bending section.
14. The camera module of claim 12, wherein the second guide curves with the second curved section and defines a curve radius of the second curved section of 0.2mm or greater when the third barrel is in the retracted position.
15. An electronic device, comprising: the camera module of any of claims 1-14.
Priority Applications (2)
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CN202210436631.2A CN114827413A (en) | 2022-04-22 | 2022-04-22 | Camera module and electronic equipment |
PCT/CN2023/088570 WO2023202504A1 (en) | 2022-04-22 | 2023-04-17 | Camera module and electronic device |
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CN202210436631.2A CN114827413A (en) | 2022-04-22 | 2022-04-22 | Camera module and electronic equipment |
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WO2023202504A1 (en) * | 2022-04-22 | 2023-10-26 | 维沃移动通信有限公司 | Camera module and electronic device |
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JPH09218338A (en) * | 1996-02-14 | 1997-08-19 | Asahi Optical Co Ltd | Fpc board guiding device for zoom lens barrel |
CN1808261A (en) * | 2005-01-18 | 2006-07-26 | 佳能株式会社 | Imaging device |
CN113489882A (en) * | 2021-07-30 | 2021-10-08 | Oppo广东移动通信有限公司 | Camera module and electronic equipment |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP6155818B2 (en) * | 2013-04-30 | 2017-07-05 | 株式会社ニコン | Imaging device and imaging apparatus |
CN113411495A (en) * | 2021-05-31 | 2021-09-17 | 江西晶浩光学有限公司 | Chip module, imaging device and electronic equipment |
CN113873121A (en) * | 2021-09-24 | 2021-12-31 | 江西晶浩光学有限公司 | Camera module, assembling method thereof and electronic equipment |
CN114827413A (en) * | 2022-04-22 | 2022-07-29 | 维沃移动通信有限公司 | Camera module and electronic equipment |
-
2022
- 2022-04-22 CN CN202210436631.2A patent/CN114827413A/en active Pending
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- 2023-04-17 WO PCT/CN2023/088570 patent/WO2023202504A1/en unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH09218338A (en) * | 1996-02-14 | 1997-08-19 | Asahi Optical Co Ltd | Fpc board guiding device for zoom lens barrel |
CN1808261A (en) * | 2005-01-18 | 2006-07-26 | 佳能株式会社 | Imaging device |
CN113489882A (en) * | 2021-07-30 | 2021-10-08 | Oppo广东移动通信有限公司 | Camera module and electronic equipment |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2023202504A1 (en) * | 2022-04-22 | 2023-10-26 | 维沃移动通信有限公司 | Camera module and electronic device |
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