CN114825306A - High-energy composite surge protector - Google Patents

Abstract

The invention relates to the technical field of Surge Protectors (SPDs), and provides a high-energy composite surge protector.A MOV chip parallel module and a GDT parallel module are designed to be connected in series to form a high-energy composite SPD, so that the blank of the high-energy composite SPD is filled; a short-circuit protection mechanism is formed by a thermal separation device and an alarm linkage device which are connected on the MOV chip component through temperature alloy, and when the short circuit of the series branch is detected, thermal separation and alarm prompt are simultaneously executed; a backup protection module is arranged on the GDT parallel module, and when the series branch is open-circuited, a high-temperature trigger alarm device generated by the discharge of a backup electrode (an upper discharge electrode and a lower discharge electrode) gives an alarm. The invention comprehensively protects two failure conditions of short circuit and open circuit, has high sensitivity, maintains the safety of the power grid, and simultaneously has the advantages of low cost, long service life, no follow current and high reliability.

Description

High-energy composite surge protector

Technical Field

The invention relates to the technical field of Surge Protectors (SPDs), in particular to a high-energy composite surge protector.

Background

The Surge Protector (SPD) is mainly composed of a Metal Oxide Varistors (MOV) chip or a GDT, which has a special nonlinear current-voltage characteristic, i.e., a nonlinear relationship between current and voltage, and is generally characterized by a nonlinear coefficient (nonlinear Parameter). When abnormal conditions occur, such as lightning stroke, electromagnetic field interference, frequent action of a power switch, power system failure and the like, the voltage on a circuit suddenly increases and exceeds the conducting voltage of the SPD, the SPD enters a conducting area, the nonlinear coefficient of the SPD can reach tens or hundreds under the condition, the impedance of the SPD becomes low and only has a few ohms, so that the overvoltage forms surge current to flow out, and the connected electronic products or expensive components are protected.

At present, the high-energy SPD mainly comprises gap type modules, and the gap type modules are divided into graphite gaps and GDT. The SPD manufactured by the graphite gap is greatly influenced by climate, the discharge voltage is unstable due to the high and low air pressure and the humidity, and the cost of the SPD manufactured by the GDT (discharge tube) is high. They have the common feature that once a short circuit is formed, a follow current is generated, which affects the safety of the power supply line, and once an open circuit is generated, the protection function is lost, which causes the damage of the electronic equipment in the power supply load.

Disclosure of Invention

The invention provides a high-energy composite surge protector, which fills the vacancy of a composite large-energy SPD and solves the technical problems that the existing high-energy SPD cannot be compatible with cost and stability, and once a short circuit is formed, follow current can be caused, so that the safety of a power supply circuit is influenced, once the high-energy SPD is opened, the protection function can be lost, and the damage of electronic equipment in a power supply load can be caused.

In order to solve the technical problems, the invention provides a high-energy composite surge protector which comprises a packaging shell, and a plug-in module, a GDT module and a backup protection module which are arranged in the packaging shell and connected in sequence; the plug-pull module comprises an MOV chip assembly, a thermal release device and an alarm linkage device, wherein the MOV chip assembly is connected with the thermal release device through temperature alloy welding, and the thermal release device is mechanically connected with the alarm linkage device; the MOV chip assembly is connected with the GDT module in series; the backup protection module comprises an open circuit detection module and an alarm module, and the open circuit detection module is connected with the GDT module and the alarm module;

when the circuit is short-circuited, the MOV chip assembly generates heat to break the welding connection relation with the thermal release device, and the thermal release device is released to push the alarm linkage device to trigger the alarm module to give an alarm;

when the GDT module is opened, the open circuit detection module detects the temperature rise caused by discharge arc discharge, and then triggers the alarm module to give an alarm.

The basic scheme designs that an MOV chip parallel module (namely a first MOV chip set and a second MOV chip set which are connected in parallel) and a GDT parallel module (namely a plurality of GDTs which are connected in parallel) are connected in series to form a high-energy composite SPD, and the blank of the high-energy composite SPD is filled; connecting a thermal separation device and an alarm linkage device on the MOV chip component through temperature alloy to form a short-circuit protection mechanism, and simultaneously executing thermal separation and alarm prompt when detecting the short circuit of the series branch; set up the reserve protection module on GDT module, when the series branch is opened a way, the high temperature that is discharged and produces by reserve electrode (go up discharge electrode, lower discharge electrode) triggers alarm device and reports to the police. The short-circuit failure warning device and the open-circuit failure warning device have the advantages of high response sensitivity, maintenance of power grid safety, low cost, long service life, no follow current and high reliability.

In a further embodiment, the MOV chip assembly comprises a first MOV chipset and a second MOV chipset connected in parallel, the first MOV chipset and the second MOV chipset being identical in structure; the first MOV chip set comprises a plug electrode, a first MOV chip, a first lead-out electrode and a second MOV chip which are connected in sequence, and the second MOV chip is also connected with the plug electrode; the plug-in electrodes are radially led out and are connected with the GDT module in series; the first extraction electrode is axially extracted and is connected with the thermal separation device in a welding mode through a temperature alloy; the first MOV chip and the second MOV chip are connected in parallel.

This scheme sets up two sets of the same MOV chip subassembly (being MOV chip parallelly connected module) that constitutes by two high energy chips (first MOV chip, second MOV chip) are parallelly connected, again with GDT module is established ties to fill the compound SPD blank of high energy, possessed 25 KA's under the 10/350us wave form throughput, had that response speed is fast, the good advantage that the residual voltage is low.

In a further embodiment, the GDT module comprises a bottom plate, a lower discharge electrode, an upper plate, an upper discharge electrode, and two sets of connection sockets corresponding to the MOV chip assemblies, a first wire pressing frame, and 1 GDT or more than 1 GDT connected in parallel; the bottom plate and the upper plate are respectively and electrically connected with two ends of each GDT; one end of the connecting socket is electrically connected with the MOV chip assembly, the other end of the connecting socket is connected with the upper plate, and each GDT is connected with the plug-in electrode in series through the connecting socket; the outer side of the upper plate is provided with an installation hole; one side of the bottom plate extends outwards to form a second extraction electrode, and the other side of the bottom plate extends outwards to form the lower discharge electrode; the second extraction electrode is connected into the first wire pressing frame; the upper discharge electrode is fixed on the installation hole and corresponds to the lower discharge electrode.

This scheme sets up a plurality of parallelly connected GDT and MOV chip subassembly series one by one, possesses the passing capacity more than 25K under the 10/350us waveform, has that response speed is fast, the good advantage that the residual voltage is low. The surge in the circuit can be effectively inhibited or absorbed, and the service life and the reliability of the product are improved.

In a further embodiment, the open circuit detection module comprises a temperature fuse, the temperature fuse is tightly attached to the lower discharging electrode and is connected with the alarm module in series;

when the GDT module is opened, the discharge arc on the discharge electrode leads to temperature rise to enable the temperature fuse to be fused, and then the warning module is triggered to give an alarm.

This scheme sets up the temperature insurance and hugs closely one side of transferring the electrode, warning module, judges whether open a way the circuit according to the temperature that transfers the electrode to produce, and then triggers and reports to the police the module and report to the police and remind.

In a further embodiment, the open circuit detection module comprises a third spring and a fastener, the fastener is a plate-shaped structure with the middle part bent upwards, the back of the middle part is provided with a rotating shaft, the left side of the fastener is provided with a second welding hole and a spring hole from inside to outside, and the right side of the fastener is bridged on the switch handle and is abutted against the alarm linkage device; the second welding hole is welded with the upper discharge electrode through temperature alloy; one end of the third spring is fixed on the upper plate, and the other end of the third spring is installed on the spring hole after being stretched;

when the circuit is short-circuited, the MOV chip assembly generates heat to break the welding connection relation with the thermal release device, and the thermal release device rises to release the alarm linkage device, so that the fastener is jacked up by the alarm module and rotates upwards along the axis, and the alarm module is triggered to give an alarm;

when the GDT module is opened, the upper discharge electrode is heated by the discharge arc to melt the temperature alloy, the second welding hole is separated from the upper discharge electrode, the third spring pulls the fastener to contract towards the left side, the fastener is separated from the lap joint of the alarm module, and the GDT module is triggered to alarm.

According to the scheme, the buckle piece welded by the temperature alloy is used for detecting whether the GDT module is open-circuited in real time, the temperature alloy melts after the GDT module is open-circuited, the buckle piece is separated from the upper discharge electrode, the third spring elastically resets to pull the buckle piece to be separated from the lap joint with the switch handle, and then the micro switch is triggered, so that open-circuit alarm reminding can be completed; meanwhile, when the circuit is short-circuited, the snap piece is separated from the resisting force of the alarm rod and is upwards tilted along the axis to be separated from the lap joint with the switch handle under the thrust generated by upwards bouncing of the microswitch handle, so that short-circuit alarm is performed, the structure is simple, and the short-circuit alarm is not interfered with each other.

In a further embodiment, the alarm linkage device comprises an assembly box, an alarm structure and two groups of push plate structures which are symmetrically arranged at two sides of the alarm structure; the alarm structure comprises an alarm rod, a first spring, a stop plate and a warp plate, wherein the stop plate is arranged at the top end of the alarm rod, the warp plate is movably arranged on the side surface of the stop plate, and the alarm rod is sleeved with the first spring and then movably penetrates through the assembly box; the push plate structure comprises a second spring, an interruption push plate and lugs, the interruption push plate is fixed on the assembly box through the second spring, and the lugs are mounted at the upper parts of two sides of the interruption push plate and abut against the warping plate;

the middle part of the assembly box is provided with a partition plate, two sides of the assembly box are provided with symmetrical semi-surrounding box bodies, the partition plate extends outwards to form a limiting bulge, the middle part of the box body is an inner cavity embedded with the MOV chip assembly, the bottom of the box body is provided with an installation notch matched with the extension of the plug-in electrode, and one side close to the push plate structure is also provided with a tripping hole matched with the first leading-out electrode;

when the alarm linkage device is not triggered, the interruption push plate is pressed by the thermal release device, and the second spring is in a compressed state; the rocker is pressed by the lug, the first spring is in a compressed state, and the warning rod is abutted with the warning module;

after any one alarm linkage device is triggered, the interruption push plate is separated from the pressing of the thermal separation device, the second spring extends, and the interruption push plate rises; the wane perk gives way and breaks away from the suppression of lug, it is by to end the board spacing arch is spacing, first spring extension makes the warning pole with report an emergency and ask for help or increased vigilance the mode component and separate the trigger alarm, if two sets of the aggregate unit of reporting an emergency and asking for help or increased vigilance all is triggered the back, then the wane is along with both sides the shutoff push pedal simultaneous movement.

In a further embodiment, the thermal release device comprises a release electrode plate and an indicator plate, wherein the top end of the release electrode plate is connected with the indicator plate, the upper part of the release electrode plate is provided with a first welding hole, and the bottom part of the release electrode plate penetrates through the assembly box and is used as a connecting electrode to be connected with an external circuit; the first welding hole is embedded with the first leading-out electrode and is welded and connected with the first leading-out electrode through temperature alloy;

when the circuit short circuit, MOV chip subassembly generates heat and leads to first extraction electrode with the connection of first welding hole is not hard up, the outside elasticity in dropout electrode piece upper portion resets, and it is right to release the suppression of interdiction push pedal, interdiction push pedal elasticity resets and promotes the outside swing of indicator plate carries out the window and reports an emergency and asks for help or increased vigilance, and the interdiction push pedal interdicts simultaneously first extraction electrode is connected with the air of dropout electrode piece to prevent the electric arc that the dropout in-process probably produced.

According to the scheme, the alarm linkage device is designed by the assembly box, the alarm structure and the push plate structure, a sequential linkage mechanism of 'MOV chip assembly-tripping electrode plate-push plate structure-alarm module' is formed, short circuit of a circuit can be detected, fed back and alarmed in time, and the alarm linkage device is simple in structure, low in cost and high in equipment stability.

In a further embodiment, the alarm module comprises a PCB board, and a micro switch and a remote signaling port mounted on the PCB board, wherein a switch handle is arranged on a top surface of the micro switch, the switch handle abuts against the alarm linkage device, and the switch handle is in lap joint with the open circuit detection module;

when the circuit is short-circuited, the MOV chip assembly generates heat to break the welding connection relation with the thermal release device, and the thermal release device falls off, so that the alarm linkage device is separated from the switch handle, and the microswitch is triggered to start the remote signaling port to alarm.

In a further embodiment, the present invention further comprises a mounting fitting, wherein the mounting fitting comprises a second wire pressing frame, a connecting plate and an electrode socket which are sequentially connected, the connecting plate is provided with an insertion through hole corresponding to the alarm rod, and the electrode socket is embedded with the connecting electrode; the second wire pressing frame is connected with an external circuit.

In a further embodiment, the package housing comprises a base, a base box; one end of the base is provided with a T-shaped partition board which protrudes upwards, the middle part of the base is provided with a first cavity, and the other end of the base is provided with a socket groove, a second cavity, a clamping groove and a third cavity which protrude upwards from the inside to the outside; the GDT module is embedded on the T-shaped partition plate and the first cavity; the mounting fitting is mounted on the socket slot and the second cavity; the alarm module is embedded in the clamping groove and the third cavity;

the base box is in a shape of Chinese character 'ao', is embedded with the plug module, is provided with two groups of connecting socket holes and electrode jacks which respectively correspond to the MOV chip assembly and the heat release device at the middle part of the base box, and is also provided with a port access hole for the remote signaling port at the side surface of the base box.

This scheme sets up base, the base box of gomphosis, carries out the aggregate erection of integration to plug module, GDT module and reserve protection module, has further improved the stability of device.

Drawings

Fig. 1 is an exploded view of a high-energy composite surge protector according to embodiment 1 of the present invention;

FIG. 2 is a perspective view of an MOV chip module provided in embodiments 1 to 4 of the present invention;

FIG. 3 is a partial structure diagram of a GDT module provided in embodiments 1 to 4 of the present invention;

FIG. 4 is a schematic diagram of an assembly of a first MOV chipset and a GDT module provided in embodiments 1-4 of the present invention;

FIG. 5 is an equivalent circuit diagram of FIG. 3 provided in embodiments 1 to 4 of the present invention;

FIG. 6 is a perspective view of the alarm linkage device according to embodiments 1 to 4 of the present invention before assembly;

FIG. 7 is a perspective view of an assembled alarm linkage device according to embodiments 1 to 4 of the present invention;

fig. 8 is a schematic connection diagram of a GDT module and an open circuit detection module in embodiment 1 or 3 according to an embodiment of the present invention;

fig. 9 is an equivalent circuit diagram of fig. 7 provided in embodiment 1 or 3 of the present invention;

fig. 10 is a perspective view of a fastening member provided in embodiment 2 or 4 of the present invention;

fig. 11 is a schematic view of the fastening device according to embodiment 2 or 4 of the present invention in a normal operation of the circuit;

FIG. 12 is a schematic diagram showing short-circuit failure of the circuit provided in embodiment 2 or 4 of the present invention;

fig. 13 is a schematic diagram of an open circuit failure provided in embodiment 2 or 4 of the present invention;

fig. 14 is an assembly diagram of the plugging module provided in embodiments 1 to 4 of the present invention;

FIG. 15 is an assembled perspective view of the structure of FIG. 13 provided in embodiments 1 to 4 of the present invention

FIG. 16 is a perspective view of a mounting member provided in embodiments 1 to 4 of the present invention;

fig. 17 is a perspective view of a base provided in embodiment 1 or 2 of the present invention;

fig. 18 is an assembled schematic view of a base provided in embodiment 1 or 2 of the present invention;

fig. 19 is an assembly schematic view of a package case a provided in embodiment 1 or 2 of the present invention;

FIG. 20 is an assembled perspective view of FIG. 18 according to embodiment 1 or 2 of the present invention

Fig. 21 is a structural view of a 4-in-one base provided in embodiment 3 or 4 of the present invention;

FIG. 22 is an assembled view of the base 20 provided in embodiment 3 or 4 of the present invention;

FIG. 23 is a schematic view of a 4-in-one base box provided in embodiment 3 or 4 of the present invention;

fig. 24 is a structural diagram of a 4-bit integrated alarm module provided in embodiment 3 of the present invention;

fig. 25 is an equivalent circuit diagram of fig. 23 provided in embodiment 3 of the present invention.

Wherein: the socket comprises a packaging shell A, a base 1, a T-shaped partition plate 11, a first cavity 12, a socket groove 13, a second cavity 14, a clamping groove 15 and a third cavity 16; a base case 2 having a connection socket hole 21, an electrode insertion hole 22, and a port access hole 23;

the plug-in module B, a first MOV chip group 3, a second MOV chip group 30, a plug electrode 31, a first MOV chip 32, a first lead-out electrode 33 and a second MOV chip 34;

a thermal release device 4, a release electrode sheet 41, and an indicator plate 42;

the alarm linkage device 5, an alarm rod 50, a first spring 51, a stop plate 52 and a rocker 53; a second spring 54, a blocking push plate 55, a lug 56; partition 57, semi-enclosed box 58, upper box 59;

a GDT module 6; a bottom plate 61, a second lead electrode 611, a lower discharge electrode 612, an upper plate 62, an upper discharge electrode 63, a connection socket 64, a first wire frame 65, and a GDT (gas discharge tube) 66;

a backup protection module C; an open circuit detection module 7 (not shown), a temperature fuse 71, a third spring 72, and a fastener 73; the alarm module 8, the PCB 81, the microswitch 82, the remote signaling port 83 and the switch handle W1;

the mounting fitting 9, a second wire frame 91, a connecting plate 92, and an electrode socket 93.

Detailed Description

The embodiments of the present invention will be described in detail below with reference to the accompanying drawings, which are given solely for the purpose of illustration and are not to be construed as limitations of the present invention, including reference to and illustration of the accompanying drawings, which are not to be construed as limitations of the scope of the invention, since many variations thereof are possible without departing from the spirit and scope of the invention.

Example 1

As shown in fig. 1 to 8 and 13 to 19, the high-energy composite surge protector according to an embodiment of the present invention includes a package housing a, and a plug module B, GDT module 6 and a backup protection module C installed in the package housing a and sequentially connected to each other; the plug-pull module B comprises an MOV chip assembly, a thermal release device 4 and an alarm linkage device 5, wherein the MOV chip assembly is connected with the thermal release device 4 through temperature alloy welding, and the thermal release device 4 is mechanically connected with the alarm linkage device 5; the MOV chip component is connected with the GDT module 6 in series; the backup protection module C comprises an open circuit detection module 7 and an alarm module 8, wherein the open circuit detection module 7 is connected with the GDT module 6 and the alarm module 8;

when the circuit is short-circuited, the MOV chip component generates heat to break the welding connection relation with the thermal release device 4, and the thermal release device 4 is released to push the alarm linkage device 5 to trigger the alarm module 8 to give an alarm;

when GDT module 6 opens the way, open a way detection module 7 and detect the temperature rise because of letting out the arc and leading to, and then trigger warning module 8 and report to the police.

In this embodiment, the MOV chip assembly includes a first MOV chipset 3 and a second MOV chipset 30 connected in parallel, and the first MOV chipset 3 and the second MOV chipset 30 have the same structure; the first MOV chip group 3 comprises a plug electrode 31, a first MOV chip 32, a first lead-out electrode 33 and a second MOV chip 34 which are connected in sequence; the plug-in electrode 31 is radially led out and is connected with the GDT module 6 in series; the first leading-out electrode 33 is axially led out and is connected with the thermal release device 4 through welding by a temperature alloy;

specifically, one end of the plug electrode 31 is respectively connected with the outer side walls of the first MOV chip 32 and the second MOV chip 34, and the other end is radially led out to be connected in series with the GDT module 6; one end of the first lead-out electrode 33 is embedded into a gap between the first MOV chip 32 and the second MOV chip 34 and is respectively electrically connected with the first MOV chip 32 and the second MOV chip 34, and the other end is axially led out to be connected with a trip electrode sheet 41 in the thermal trip device 4 in a welding mode through a temperature alloy.

The first MOV chip 32 and the second MOV chip 34 are connected in parallel.

This embodiment sets up two sets of the same MOV chip subassemblies (having formed MOV chip parallel module promptly) that constitute by two high energy chips (first MOV chip 32, second MOV chip 34) parallelly connected, and establish ties with the GDT module again, has filled the compound SPD blank of high energy, possesses the trafficability ability more than 25KA under the 10/350us waveform, has advantages such as response speed is fast, the residual voltage is low, long service life.

In the present embodiment, the GDT module 6 includes a bottom plate 61, an upper plate 62, an upper discharge electrode 63, and two sets of connection sockets 64 corresponding to the MOV chip assemblies (i.e. the first MOV chipset 3 and the second MOV chipset 30), a first wire pressing frame 65, and 1 GDT66 or 1 or more GDTs 66 (i.e. gas discharge tubes) connected in parallel; the bottom plate 61 and the upper plate 62 are electrically connected with two ends of the plurality of GDTs 66 respectively; one end of the connection socket 64 is electrically connected with the MOV chip assembly, the other end is connected with the upper plate 62, and a plurality of GDT66 are connected into a GDT parallel module through the bottom plate 61 and the upper plate 62 and are connected with the plugging electrodes in series through the corresponding connection sockets; the outer side of the upper plate 62 is provided with a mounting hole; one side of the bottom plate 61 extends outwards to form a second extraction electrode 611, and the other side extends outwards to form a lower discharge electrode 612; the second extraction electrode 611 is connected to the first wire pressing frame 65; the upper discharge electrode 63 is fixed to the installation hole in concert with the lower discharge electrode 612.

The first wire pressing frame 65 is connected to an external circuit.

Referring to the equivalent circuit diagram of fig. 5, GDTs 66 (gas discharge tubes) are connected in parallel and in series with any MOV chip. The discharge distance from the tip of the discharge electrode on the upper discharge electrode 63 to the lower discharge electrode 612 is adjusted so that the discharge voltage is 1.5 to 5 times higher than the GDT discharge voltage (the specific value can be adjusted according to actual conditions).

In the embodiment, a plurality of GDTs 66 connected in parallel are arranged in series with the MOV chip assembly, so that the surge in the circuit can be effectively inhibited or absorbed; protecting the power circuit from the interference of the surge; due to the existence of the GDT, the MOV does not bear the voltage of a power grid under the normal working condition, and no leakage current is generated, so that the service life of the product is prolonged, and the cost performance of the product is high.

In this embodiment, the open circuit detection module 7 includes a temperature fuse 71, the temperature fuse 71 is tightly attached to the lower discharge electrode 612, and the circuit thereof is connected in series with the micro switch 82;

when the GDT module 6 is opened, the temperature of the discharging electrode 612 rises due to the released arc, so that the temperature fuse 71 is fused, the electric connection with the microswitch 82 is disconnected, and the microswitch 82 gives an alarm through the remote signaling port 83.

In this embodiment, the temperature fuse 71 is disposed on one side of the lower discharging electrode 612 and the alarm module 8, and whether the circuit is open-circuited is determined according to the temperature generated by the lower discharging electrode 612, so as to trigger the alarm module 8 to alarm.

In this embodiment, the alarm linkage device 5 includes an assembly box, an alarm structure, and two sets of push plate structures symmetrically installed on two sides of the alarm structure; the warning structure comprises a warning rod 50, a first spring 51, a stop plate 52 and a warped plate 53, wherein the stop plate 52 is installed at the top end of the warning rod 50, the warped plate 53 is movably installed on the side surface of the stop plate 52, and the warning rod 50 is sleeved with the first spring 51 and then movably penetrates through the assembly box; the push plate structure comprises a second spring 54, an interruption push plate 55 and lugs 56, the interruption push plate 55 is fixed on the assembly box through the second spring 54, and the lugs 56 are arranged at the upper parts of two sides of the interruption push plate 55 and are abutted against the warping plate 53;

wherein, the lower part of the obstructing push plate 55 is an open groove, and one end of the second spring is fixed in the open groove.

The alarm linkage device 5 further comprises an upper box 59 matched with the assembly box, movable pages are further arranged on two sides of the upper box 59, convex-concave grooves which are arranged in a combined mode are formed in the movable pages, when the plug-in module B is embedded and mounted on the packaging shell A, the movable pages on two sides of the upper box 59 are pushed to deform inwards, the plug-in module B can be inserted conveniently, after the plug-in module B is in place, the movable pages are released (the movable pages are not completely elastically reset), and the convex-concave grooves in the movable pages and the packaging shell A are positioned in an extruding mode; similarly, when the plug module B is replaced, the movable pages on the two sides of the upper box 59 are pushed to deform inwards, the packaging shell a is loosened, and the plug module B is convenient to pull out.

The middle part of the assembly box is provided with a partition plate 57, two sides of the assembly box are provided with symmetrical semi-surrounding box bodies 58, the partition plate 57 extends outwards to form a limiting bulge, the middle part of the box body is an inner cavity embedded with an MOV chip assembly (namely a first MOV chip set 3 and a second MOV chip set 30), the bottom of the box body is provided with a mounting notch matched with the extension of the plug-in electrode 31, and one side close to the push plate structure is also provided with a tripping hole matched with the first leading-out electrode 33;

when the alarm linkage 5 is not triggered, the intercepting push plate 55 is pressed by the thermal release device 4, and the second spring 54 is in a compressed state; the rocker 53 is pressed by the lug 56, the first spring 51 is in a compressed state, and the warning rod 50 is abutted with the warning module 8;

after the alarm linkage device 5 is triggered, the blocking push plate 55 is separated from the pressing of the thermal separation device 4, the second spring 54 extends, and the blocking push plate 55 rises; the seesaw 53 is tilted to enable the path to be separated from the pressing of the lug 56, the stop plate 52 is limited by the limiting protrusion, and the first spring 51 extends to enable the warning rod 50 to be separated from the warning module 8 to trigger warning.

In this embodiment, the thermal trip device 4 includes a trip electrode plate 41 and an indicator plate 42, the top end of the trip electrode plate 41 is connected to the indicator plate 42, the upper portion of the trip electrode plate is provided with a first welding hole, and the bottom portion of the trip electrode plate passes through the assembly box and is connected to an external circuit as a connection electrode; the first welding hole is embedded with the first leading-out electrode 33 and is connected with the first leading-out electrode through welding of temperature alloy;

when the circuit is short-circuited, the MOV chip assembly generates heat to disconnect the first leading-out electrode 33 from the first welding hole, the upper part of the trip electrode sheet 41 is elastically reset outwards, the pressing of the interruption push plate 55 is released, the interruption push plate 55 is elastically reset and pushes the indicating plate 42 to swing outwards, and a window alarm is carried out. Meanwhile, the blocking push plate 55 blocks the air connection between the first leading electrode 33 and the trip electrode sheet 41, thereby preventing the electric arc which may be generated in the process of separation.

Wherein, the indication board 42 can be coated with corresponding warning pigment to form color-changing alarm, and the specific color selection can be set according to the requirement, such as red and green.

In the embodiment, the alarm linkage device 5 is designed by the assembly box, the alarm structure and the push plate structure, so that a sequential linkage mechanism of an MOV chip assembly, a trip electrode plate 41, the push plate structure, the alarm structure and the alarm module 8 is formed, the detection, feedback and alarm can be timely performed on a short circuit, and the alarm linkage device is simple in structure, low in cost and high in equipment stability.

In this embodiment, the alarm module 8 includes a PCB 81, a micro switch 82 and a remote signaling port 83 mounted on the PCB 81, a switch handle W1 is disposed on a top surface of the micro switch 82, the switch handle W1 abuts against the alarm linkage device 5, and the switch handle W1 is overlapped with the open circuit detection module 7;

when the circuit is short-circuited, the MOV chip assembly generates heat to break the welding connection relation with the thermal release device 4, the thermal release device 4 falls off, the alarm linkage device 5 is separated from the switch handle W1, and the micro switch 82 is triggered to start the remote signaling port 83 to give an alarm.

In this embodiment, the present invention further includes an installation fitting 9, the installation fitting 9 includes a second wire pressing frame 91, a connection plate 92 and an electrode socket 93 connected in sequence, the connection plate 92 is provided with an insertion through hole corresponding to the alarm rod 50, and the electrode socket 93 is embedded with the connection electrode; the second wire frame 91 is connected to an external circuit.

In the present embodiment, the package casing a includes a base 1, a base box 2; one end of the base 1 is provided with a T-shaped partition plate 11 which protrudes upwards, the middle part of the base is provided with a first cavity 12, and the other end of the base is provided with a socket groove 13, a second cavity 14, a clamping groove 15 and a third cavity 16 which protrude upwards from inside to outside; a first wire pressing frame 65 of the GDT module 6 is embedded in two symmetrical cavities formed by the T-shaped partition plate 11, and a bottom plate 61 of the GDT module 6 is arranged on the first cavity 12; the electrode socket 93 of the mounting fitting 9 is erected on the socket groove 13, and the second wire pressing frame 91 is mounted on the second cavity 14; the remote signaling port 83 of the alarm module 8 is embedded in the card slot 15, and the PCB 81 is placed on the third cavity 16;

the base box 2 is in a concave shape and is embedded with the plug-in module B, two groups of connecting sockets 64 holes 21 and electrode jacks 22 which respectively correspond to the MOV chip assembly and the heat release device 4 are arranged at the concave part of the middle part, and port access holes 23 for remote signaling ports 83 are also arranged on the side surface.

The base 1 and the base box 2 which are embedded are arranged in the embodiment, the plugging module B, GDT module 6 and the backup protection module C are integrally assembled and installed, and the stability of the device is further improved, and the possibility of automatic assembly is further improved.

In the embodiment of the invention, MOV chip parallel modules (namely a first MOV chip 32 and a second MOV chip 34 which are connected in parallel) and GDT parallel modules (namely a plurality of GDTs which are connected in parallel) are designed to be connected in series to form a high-energy composite SPD, so that the blank of the high-energy composite SPD is filled; connecting a thermal separation device 4 and an alarm linkage device 5 on the MOV chip component through temperature alloy to form a short-circuit protection mechanism, and simultaneously executing thermal separation and alarm prompt when detecting the short circuit of the series branch; a backup protection module C is arranged on the GDT module 6, and when the series branch is open-circuited, a high-temperature trigger alarm device generated by discharge of backup electrodes (an upper discharge electrode 612 and a lower discharge electrode 63) gives an alarm. The short-circuit failure warning device and the open-circuit failure warning device have the advantages of high response sensitivity, maintenance of power grid safety, low cost, long service life, no follow current and high reliability.

Example 2

The difference between the present embodiment and embodiment 1 lies in the difference of the open circuit detection module 7, referring to fig. 9 to 12, the open circuit detection module 7 in the present embodiment includes a third spring 72 and a fastener 73, the fastener 73 is a plate-shaped structure with a middle portion bent upward, a rotating shaft is disposed on the back of the middle portion of the plate-shaped structure, a second welding hole and a spring hole are disposed on the left side from inside to outside, a switch handle W1 is overlapped on the right side, and the alarm lever 50 is pressed against the top surface of the fastener 73 on the right side; the second welding hole is welded with the upper discharge electrode 63 through temperature alloy; one end of the third spring 72 is fixed on the upper plate 62, and the other end is installed on the spring hole after being stretched;

when the circuit is short-circuited, the MOV chip assembly generates heat to break the welding connection relation with the thermal release device 4, the thermal release device 4 rises to release the alarm linkage device 5, the release elastic force of the microswitch 82 enables the switch handle W1 to tilt up, the right plane of the buckle piece 73 is jacked up to enable the switch handle W1 to rotate upwards along the axis, the path is released from the microswitch 82, and then the telecommand port 83 is started to alarm;

when the GDT module 6 is opened, the temperature of the upper discharge electrode 63 rises due to the discharge arc, so that the temperature alloy is melted, the second welding hole is separated from the upper discharge electrode 63, the third spring 72 pulls the fastener 73 to contract towards the left side, the fastener is separated from the overlap joint with the switch handle W1, the microswitch 82 is triggered, and an alarm is given through the remote signaling port 83.

In the embodiment, the fastener 73 welded by the temperature alloy is used for detecting whether the GDT module 6 is open or not in real time, the temperature alloy melts after the opening, the fastener is separated from the upper discharge electrode 63, at the moment, the third spring 72 elastically resets to pull the fastener 73 to be separated from the lap joint with the switch handle W1, and then the microswitch 82 is triggered, so that the open-circuit alarm reminding can be completed; meanwhile, when the circuit is short-circuited, the snap fastener 73 is separated from the resisting force of the alarm rod 50, the switch handle W1 of the micro switch 82 is released (namely, the switch handle W1 is tilted upwards), and at the moment, the right plane of the snap fastener 73 rotates upwards along the axis, so that short-circuit alarm is performed.

Example 3

The present embodiment is different from embodiment 1 in the difference of the package box a: the multiple-unit composite surge protector is provided in multiple units, for example, referring to fig. 20 to 24, the base 1 of the present embodiment is 4 units of the base 1 in embodiment 1, and similarly, the base box 2 is 4 units of the base box 2 in embodiment 1.

In the present embodiment, a remote signaling port 83 is adopted to be connected in series with the PCB 81, such that the remote signaling port 83 is connected in series with each micro switch 82; and each microswitch 82 is connected in parallel.

Example 4

The present embodiment is different from embodiment 2 in the difference of the package box a: the multiple-unit composite surge protector is provided in multiple units, for example, referring to fig. 20 to 22, the base 1 of the present embodiment is 4 units of the base 1 in embodiment 1, and similarly, the base box 2 is 4 units of the base box 2 in embodiment 1.

In the present embodiment, a remote signaling port 83 is adopted to be connected in series with the PCB 81, such that the remote signaling port 83 is connected in series with each micro switch 82; and each microswitch 82 is connected in parallel.

The above embodiments are preferred embodiments of the present invention, but the present invention is not limited to the above embodiments, and any other changes, modifications, substitutions, combinations, and simplifications which do not depart from the spirit and principle of the present invention should be construed as equivalents thereof, and all such changes, modifications, substitutions, combinations, and simplifications are intended to be included in the scope of the present invention.

Claims (10)

1. A high-energy composite surge protector is characterized in that: the device comprises a packaging shell, and a plugging module, a GDT module and a backup protection module which are arranged in the packaging shell and connected in sequence; the plug-pull module comprises an MOV chip assembly, a thermal release device and an alarm linkage device, wherein the MOV chip assembly is connected with the thermal release device through temperature alloy welding, and the thermal release device is mechanically connected with the alarm linkage device; the MOV chip assembly is connected with the GDT module in series; the backup protection module comprises an open circuit detection module and an alarm module, and the open circuit detection module is connected with the GDT module and the alarm module;

when the circuit is short-circuited, the MOV chip assembly generates heat to break the welding connection relation with the thermal release device, and the thermal release device is released to push the alarm linkage device to trigger the alarm module to give an alarm;

when the GDT module is opened, the open circuit detection module detects the temperature rise caused by discharge arc discharge, and then triggers the alarm module to give an alarm.

2. A high-energy composite surge protector as claimed in claim 1, wherein: the MOV chip assembly comprises a first MOV chip set and a second MOV chip set which are connected in parallel, and the first MOV chip set and the second MOV chip set have the same structure; the first MOV chip set comprises a plug electrode, a first MOV chip, a first lead-out electrode and a second MOV chip which are connected in sequence, and the second MOV chip is also connected with the plug electrode; the plug-in electrodes are radially led out and are connected with the GDT module in series; the first extraction electrode is axially extracted and is connected with the thermal separation device in a welding mode through a temperature alloy.

3. A high-energy composite surge protector as claimed in claim 2, wherein: the GDT module comprises a bottom plate, a lower discharging electrode, an upper plate, an upper discharging electrode, two groups of connecting sockets corresponding to the MOV chip assembly, a first wire pressing frame and 1 GDT or more than 1 GDT connected in parallel; the bottom plate and the upper plate are respectively and electrically connected with two ends of each GDT; one end of the connecting socket is electrically connected with the MOV chip assembly, the other end of the connecting socket is connected with the upper plate, and each GDT is connected with the plug-in electrode in series through the connecting socket; the outer side of the upper plate is provided with an installation hole; one side of the bottom plate extends outwards to form a second extraction electrode, and the other side of the bottom plate extends outwards to form the lower discharge electrode; the second extraction electrode is connected into the first wire pressing frame; the upper discharge electrode is fixed on the installation hole and corresponds to the lower discharge electrode.

4. A high-energy composite surge protector as claimed in claim 3, wherein: the open circuit detection module comprises a temperature fuse, and the temperature fuse is tightly attached to the lower discharging electrode and is connected with the alarm module in series;

when the GDT module is opened, the discharge arc on the discharge electrode leads to temperature rise to enable the temperature fuse to be fused, and then the warning module is triggered to give an alarm.

5. A high-energy composite surge protector as claimed in claim 3, wherein: the open circuit detection module comprises a third spring and a fastener, the fastener is of a plate-shaped structure with the middle part bent upwards, the back of the middle part is provided with a rotating shaft, the left side of the fastener is provided with a second welding hole and a spring hole from inside to outside, and the right side of the fastener is bridged on the switch handle and is abutted against the alarm linkage device; the second welding hole is welded with the upper discharge electrode through temperature alloy; one end of the third spring is fixed on the upper plate, and the other end of the third spring is installed on the spring hole after being stretched;

when the circuit is short-circuited, the MOV chip assembly generates heat to break the welding connection relation with the thermal release device, and the thermal release device rises to release the alarm linkage device, so that the fastener is jacked up by the alarm module and rotates upwards along the axis, and the alarm module is triggered to give an alarm;

when the GDT module is opened, the upper discharge electrode is heated by the discharge arc to melt the temperature alloy, the second welding hole is separated from the upper discharge electrode, the third spring pulls the fastener to contract towards the left side, the fastener is separated from the lap joint of the alarm module, and the GDT module is triggered to alarm.

6. A high-energy composite surge protector as claimed in claim 2, wherein: the alarm linkage device comprises an assembly box, an alarm structure and two groups of push plate structures which are symmetrically arranged on two sides of the alarm structure; the alarm structure comprises an alarm rod, a first spring, a stop plate and a warp plate, wherein the stop plate is arranged at the top end of the alarm rod, the warp plate is movably arranged on the side surface of the stop plate, and the alarm rod is sleeved with the first spring and then movably penetrates through the assembly box; the push plate structure comprises a second spring, an interruption push plate and lugs, the interruption push plate is fixed on the assembly box through the second spring, and the lugs are mounted at the upper parts of two sides of the interruption push plate and abut against the warping plate;

the middle part of the assembly box is provided with a partition plate, two sides of the assembly box are provided with symmetrical semi-surrounding box bodies, the partition plate extends outwards to form a limiting bulge, the middle part of the box body is an inner cavity embedded with the MOV chip assembly, the bottom of the box body is provided with an installation notch matched with the extension of the plug-in electrode, and one side close to the push plate structure is also provided with a tripping hole matched with the first leading-out electrode;

when the alarm linkage device is not triggered, the interruption push plate is pressed by the thermal release device, and the second spring is in a compressed state; the rocker is pressed by the lug, the first spring is in a compressed state, and the warning rod is abutted with the warning module;

after the alarm linkage device is triggered, the interruption push plate is separated from the pressing of the thermal separation device, the second spring extends, and the interruption push plate rises; the wane perk breaks away from the suppression of lug, it is spacing to end the board by spacing arch, first spring extension makes warning pole with warning mode component separation triggers the warning.

7. A high-energy composite surge protector as claimed in claim 6, wherein: the thermal release device comprises a trip electrode plate and an indicating plate, the top end of the trip electrode plate is connected with the indicating plate, the upper part of the trip electrode plate is provided with a first welding hole, and the bottom of the trip electrode plate penetrates through the assembly box and is used as a connecting electrode to be connected with an external circuit; the first welding hole is embedded with the first leading-out electrode and is connected with the first leading-out electrode in a welding mode through temperature alloy;

when the circuit short circuit, MOV chip subassembly generates heat, and the temperature alloy melts, results in first extraction electrode with the connection of first welding hole is not hard up, the outside elasticity in dropout electrode piece upper portion resets, and it is right to release the suppression of shutoff push pedal, the shutoff push pedal elasticity resets and promotes the indicator board outwards swings, carries out the window and reports an emergency and asks for help or increased vigilance.

8. A high-energy composite surge protector as claimed in claim 1, wherein: the alarm module comprises a PCB, and a microswitch and a remote signaling port which are arranged on the PCB, wherein the top surface of the microswitch is provided with a switch handle, the switch handle is abutted against the alarm linkage device, and the switch handle is connected with the open circuit detection module;

when the circuit is short-circuited, the MOV chip assembly generates heat to break the welding connection relation with the thermal release device, and the thermal release device falls off, so that the alarm linkage device is separated from the switch handle, and the microswitch is triggered to start the remote signaling port to alarm.

9. A high-energy composite surge protector as claimed in claim 7, wherein: the alarm device is characterized by further comprising an installation accessory, wherein the installation accessory comprises a second wire pressing frame, a connecting plate and an electrode socket which are sequentially connected, the connecting plate is provided with an insertion through hole corresponding to the alarm rod, and the electrode socket is embedded with the connecting electrode; the second wire pressing frame is connected with an external circuit.

10. A high-energy composite surge protector as claimed in claim 9, wherein: the packaging shell comprises a base and a base box; one end of the base is provided with a T-shaped partition board which protrudes upwards, the middle part of the base is provided with a first cavity, and the other end of the base is provided with a socket groove, a second cavity, a clamping groove and a third cavity which protrude upwards from the inside to the outside; the GDT module is embedded on the T-shaped partition plate and the first cavity; the mounting fitting is mounted on the socket slot and the second cavity; the alarm module is embedded in the clamping groove and the third cavity;

the base box is in a shape of Chinese character 'ao', is embedded with the plug module, is provided with two groups of connecting socket holes and electrode jacks which respectively correspond to the MOV chip assembly and the heat release device at the middle part of the base box, and is also provided with a port access hole for the remote signaling port at the side surface of the base box.

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