CN114824150A - OLED display panel, OLED display screen and preparation method - Google Patents

Abstract

The application provides an OLED display panel, an OLED display screen and a preparation method, relates to the technical field of display, and solves the problem that poor contact is caused by residual film layers when an electroluminescent layer is removed in a laser drilling mode; sequentially forming an anode layer, an auxiliary electrode layer, a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer and an electron injection layer on a substrate; removing all the film layers above the region where the auxiliary electrode layer is located, and forming a through hole; introducing conductive particles into the through hole, and forming a micro conductive layer at the bottom of the through hole; and forming a cathode layer on the electron injection layer and in the space formed by the through hole and the micro conductive layer, wherein the cathode layer is electrically connected with the auxiliary electrode layer through the micro conductive layer. This application forms little conducting layer in the bottom of through-hole, and the cathode layer well contacts and switches on with auxiliary electrode layer, has solved display panel pressure drop still great problem, and then improves OLED display panel's demonstration inequality.

Description

OLED display panel, OLED display screen and preparation method

Technical Field

The application relates to the technical field of display, in particular to an OLED display panel, an OLED display screen and a preparation method.

Background

The flat panel display industry is one of the supporting industries of the electronic information industry, and is very important for the development of technology and economy in a country and a region by virtue of the huge economic effect and the industrial gathering effect. Although the liquid crystal display technology of Thin film transistor liquid crystal display (TFT-LCD) occupies the mainstream of display nowadays, the technology of organic light-emitting diode (AMOLED) is most likely to replace the TFT-LCD technology at present to become a next generation of new display technology.

In the manufacture of large-sized OLED panels, the mainstream method at present is to manufacture each layer structure of the OLED panel by vacuum evaporation or IJP (Ink Jet Printing), because the cathode surface resistance increases with the size, the voltage drop between the center and the edge of the cathode is greatly different, which can cause the uneven display (Mura) of the product, and in order to solve the problem, usually after the auxiliary electrode is manufactured, removing an Electroluminescent (EL) layer (between a cathode and an auxiliary electrode) formed by the auxiliary electrode film by a laser (laser) punching mode, then manufacturing a connecting structure of the cathode and the auxiliary electrode at the bottom, in the case of an OLED device structure made by Ink Jet Printing (IJP), the ETL functional layer can be removed well in the above manner, however, there is a problem that the ink-jet printed film remains, resulting in poor contact, and the improvement of Mura is limited.

Disclosure of Invention

The application provides an OLED display panel, an OLED display screen and a preparation method, wherein the problem of voltage drop in the panel can be well solved, and the problem of uneven display of the OLED display panel is solved.

In one aspect, the present application provides a method for manufacturing an OLED display panel, including:

providing a substrate with a pixel array;

sequentially forming an anode layer, an auxiliary electrode layer, a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer and an electron injection layer on a substrate;

removing all the film layers above the region where the auxiliary electrode layer is located, and forming a through hole;

introducing conductive particles into the through hole, and forming a micro conductive layer at the bottom of the through hole;

and forming a cathode layer on the electron injection layer and in a space formed by the through hole and the micro conductive layer, wherein the cathode layer is electrically connected with the auxiliary electrode layer through the micro conductive layer.

In one possible implementation manner of the present application, before the conductive particles are introduced into the through hole and the micro conductive layer is formed at the bottom of the through hole, the method includes:

and shielding other areas except the area where the through hole is located by adopting a photomask above the electron injection layer to expose the through hole.

In one possible implementation manner of the present application, the introducing conductive particles into the through hole and forming a micro conductive layer at the bottom of the through hole includes:

and introducing conductive particles into the through hole in a sputtering mode or a vacuum evaporation mode, and forming a micro conductive layer at the bottom of the through hole.

In a possible implementation manner of the application, the thickness of the micro conductive layer is 1/10-3/10 of the depth of the through hole.

In one possible implementation of the present application, the conductive particles include aluminum particles, silver particles, magnesium particles, or alloy particles of any two of the foregoing.

In a possible implementation manner of the present application, the removing all the film layers above the region where the auxiliary electrode layer is located and forming a through hole includes:

and removing all film layers above the area where the auxiliary electrode layer is located by adopting a laser drilling mode, and forming the through hole.

In one possible implementation manner of the present application, sequentially forming an anode layer, an auxiliary electrode layer, a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer on a substrate includes:

and sequentially forming a hole injection layer, a hole transport layer and a light-emitting layer by adopting an ink-jet printing mode.

In one possible implementation manner of the present application, sequentially forming an anode layer, an auxiliary electrode layer, a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer on a substrate includes:

and sequentially forming an electron transport layer and an electron injection layer by adopting a vacuum evaporation mode.

In another aspect, the present application provides an OLED display panel manufactured by the method for manufacturing an OLED display panel.

In another aspect, the present application provides an OLED display panel using the OLED display panel.

The method comprises sequentially forming an anode layer, an auxiliary electrode layer, a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer and an electron injection layer on a substrate with a pixel array, removing all film layers above the region where the auxiliary electrode layer is located, forming a through hole, introducing conductive particles into the through hole, forming a micro conductive layer at the bottom of the through hole, forming a cathode layer on the electron injection layer and in a space formed by the through hole and the micro conductive layer, electrically connecting the cathode layer with the auxiliary electrode layer through the micro conductive layer, and forming a micro conductive path in the through hole through the micro conductive layer when the film layers of the hole injection layer, the hole transport layer, the light emitting layer, the electron transport layer and the electron injection layer above the auxiliary electrode layer are removed, if the film layers which are not completely removed exist, so that the cathode layer and the auxiliary electrode layer are in good contact and conduction, the problem that the voltage drop of the center and the edge of the cathode layer is still large due to the fact that the film layer is not completely removed is solved, and the problem of uneven display of the OLED display panel is further improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

FIG. 1 is a schematic diagram of a prior art OLED panel;

FIG. 2 is a schematic flow chart of a method for fabricating an OLED display panel provided in an embodiment of the present application;

FIG. 3 is a schematic structural diagram of an OLED display panel provided in an embodiment of the present application during a manufacturing process;

FIG. 4 is a schematic structural diagram of an OLED display panel provided in an embodiment of the present application during a manufacturing process;

FIG. 5 is a schematic structural diagram of an OLED display panel provided in an embodiment of the present application during a fabrication process;

fig. 6 is a schematic structural diagram of an OLED display panel provided in an embodiment of the present application in a manufacturing process.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it is to be understood that, furthermore, the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first", "second" may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.

In this application, the word "exemplary" is used to mean "serving as an example, instance, or illustration. Any embodiment described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other embodiments. The following description is presented to enable any person skilled in the art to make and use the invention. In the following description, details are set forth for the purpose of explanation. It will be apparent to one of ordinary skill in the art that the present invention may be practiced without these specific details. In other instances, well-known structures and processes are not shown in detail to avoid obscuring the description of the invention with unnecessary detail. Thus, the present invention is not intended to be limited to the embodiments shown, but is to be accorded the widest scope consistent with the principles and features disclosed herein.

The current OLED panel display technology does not need to adopt a backlight source, but self-emits light through a light emitting layer. As shown in fig. 1, the OLED panel includes an Anode Layer 11(Anode), a Hole Injection Layer 12 (HIL), a Hole Transport Layer 13 (HTL), a light Emitting Layer 14(Emitting Layer), an Electron Transport Layer 15 (ETL), an Electron Injection Layer 16 (EIL), and a Cathode Layer 17(Cathode) stacked in this order, and the Anode Layer 11 and the Cathode Layer 17 are energized to apply an electric field to the OLED panel, and electrons and holes are injected into the Electron Injection Layer 16 and the Hole Injection Layer 12, respectively, and then migrate from the Electron Transport Layer 15 and the Hole Transport Layer 13 to the light Emitting Layer 14, and are combined in the light Emitting Layer 14 to generate excitons, and the excitons migrate by the electric field, and the energy thereof is transferred to the light Emitting molecules to generate photons, thereby Emitting light.

The embodiment of the application provides an OLED display panel, an OLED display screen and a preparation method, which are respectively described in detail below.

As shown in fig. 2, which is a schematic flow chart of an embodiment of a method for manufacturing an OLED display panel in the embodiment of the present application, the method for manufacturing an OLED display panel includes the following steps:

101. providing a substrate with a pixel array;

102. an anode layer 11, an auxiliary electrode layer 20, a hole injection layer 12, a hole transport layer 13, a light emitting layer 14, an electron transport layer 15, and an electron injection layer 16 are sequentially formed on a substrate to form a structure as shown in fig. 3;

103. removing all the film layers above the region where the auxiliary electrode layer 20 is located, and forming a through hole 18 to form the structure shown in fig. 4;

104. introducing conductive particles into the through hole 18, and forming a micro conductive layer 19 on the bottom of the through hole 18 to form a structure shown in fig. 5;

105. a cathode layer 17 is formed on the electron injection layer 16 and in the space formed by the through hole 18 and the micro conductive layer 19, and the cathode layer 17 is electrically connected to the auxiliary electrode layer 20 through the micro conductive layer 19, thereby forming the structure shown in fig. 6.

The method comprises the steps of removing all film layers above the area where the auxiliary electrode layer 20 is located, forming the through hole 18, introducing conductive particles into the through hole 18, forming the micro conductive layer 19 at the bottom of the through hole 18, forming the cathode layer 17 on the electron injection layer 16 and in the space formed by the through hole 18 and the micro conductive layer 19, wherein the cathode layer 17 is electrically connected with the auxiliary electrode layer 20 through the micro conductive layer 19, and if the film layers of the hole injection layer 12, the hole transport layer 13, the light emitting layer 14, the electron transport layer 15 and the electron injection layer 16 above the auxiliary electrode layer 20 are removed, if the film layers which are not completely removed exist, forming a micro conductive path in the through hole 18 through the micro conductive layer 19, so that the cathode layer 17 is in good contact with the auxiliary electrode layer 20 to be conducted, and the problem that the pressure drop of the center and the edge of the cathode layer 17 is still large due to the incomplete film layer residue being removed is avoided, thereby improving the display unevenness of the OLED display panel.

In this embodiment, a pixel array may be formed on a substrate by using a pixel array manufacturing method disclosed in the prior art, which is not described herein again.

The anode layer 11 having a predetermined pattern may be prepared using a vacuum evaporation process or an etching process. Taking an etching process as an example, a full-surface metal layer is formed on a substrate by using a Physical Vapor Deposition (PVD) method, where the metal layer may be a transparent ITO (Indium Tin Oxide) film or other metal layers capable of achieving electrical conduction, and the method is not limited in this embodiment.

In this embodiment, the cathode layer 17 may be fabricated using the same fabrication process as the anode layer 11. The material used for the cathode layer 17 may be a metal such as aluminum, calcium, or magnesium, or an alloy of any of the metals with a noble metal such as gold or silver.

In this embodiment, before introducing the conductive particles into the through hole 18 and forming the micro conductive layer 19 on the bottom of the through hole 18, the method includes: a mask is used to cover the area above the electron injection layer 16 except the area where the through hole 18 is located, exposing the through hole 18. The mask has a transparent region for allowing light to pass through and a light-blocking region for blocking light, the transparent region is located in a region corresponding to the through hole 18, and other regions of the electron injection layer 16 are located in the light-blocking region.

Subsequently, conductive particles are introduced into the through-hole 18 by a sputtering method or a vacuum evaporation method, and a micro conductive layer 19 is formed on the bottom of the through-hole 18.

In the present embodiment, the thickness of the micro conductive layer 19 is 1/10-3/10 of the depth of the through hole 18. The thickness of the micro conductive layer 19 is controlled to be 1/10-3/10 of the depth of the through hole 18, so that the micro conductive layer 19 can be completely filmed in the through hole, the conductivity of the micro conductive layer 19 is ensured, and the cathode layer 17 can be ensured to be in good contact with the auxiliary electrode layer 20 through the micro conductive layer 19.

In this embodiment, the conductive particles include aluminum particles, silver particles, magnesium particles, or alloy particles of any two of them, and other conductive particles that can achieve conductivity may be used, and are not particularly limited in this embodiment.

In the present embodiment, all the layers above the region where the auxiliary electrode layer 20 is located are removed by laser drilling, and the through hole 18 is formed.

In this embodiment, the hole injection layer 12, the hole transport layer 13, and the light-emitting layer 14 are formed in this order by an ink jet printing method. The hole injection layer 12 and the hole transport layer 13 may be made of aromatic amine fluorescent compound, and the light emitting layer 14 may be made of organic fluorescent material, which has the characteristics of strong fluorescence, good carrier transport performance, good thermal stability and chemical stability, and high quantum efficiency in solid state.

In this embodiment, the electron transport layer 15 and the electron injection layer 16 are formed in this order by a vacuum evaporation method. The material used for the electron transport layer 15 and the electron injection layer 16 may be an organic conductive material.

In another embodiment of the present application, an OLED display panel is provided, which is manufactured by the above method for manufacturing an OLED display panel.

In another embodiment of the present application, an OLED display panel is provided, and the OLED display panel is an OLED display panel as described above.

The OLED display panel, the OLED display screen and the manufacturing method provided in the embodiments of the present application are described in detail above, and a specific example is applied in the present application to explain the principle and the implementation manner of the present invention, and the description of the above embodiments is only used to help understanding the method and the core idea of the present invention; meanwhile, for those skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.

Claims (10)

1. A preparation method of an OLED display panel is characterized by comprising the following steps:

providing a substrate with a pixel array;

sequentially forming an anode layer, an auxiliary electrode layer, a hole injection layer, a hole transport layer, a luminescent layer, an electron transport layer and an electron injection layer on a substrate;

removing all the film layers above the region where the auxiliary electrode layer is located, and forming a through hole;

introducing conductive particles into the through hole, and forming a micro conductive layer at the bottom of the through hole;

and forming a cathode layer on the electron injection layer and in a space formed by the through hole and the micro conductive layer, wherein the cathode layer is electrically connected with the auxiliary electrode layer through the micro conductive layer.

2. The method of claim 1, wherein prior to introducing conductive particles into the via and forming a micro-conductive layer at the bottom of the via, the method comprises:

and shielding other areas except the area where the through hole is located by adopting a photomask above the electron injection layer to expose the through hole.

3. The method of claim 2, wherein the introducing conductive particles into the via and forming a micro-conductive layer at the bottom of the via comprises:

and introducing conductive particles into the through hole in a sputtering mode or a vacuum evaporation mode, and forming a micro conductive layer at the bottom of the through hole.

4. The method for manufacturing the OLED display panel according to claim 3, wherein the thickness of the micro conductive layer is 1/10-3/10 of the depth of the through hole.

5. The method of claim 4, wherein the conductive particles comprise aluminum particles, silver particles, magnesium particles, or an alloy of any two thereof.

6. The method for manufacturing the OLED display panel according to claim 1, wherein the removing all the film layers above the region where the auxiliary electrode layer is located and forming a through hole includes:

and removing all film layers above the area where the auxiliary electrode layer is located by adopting a laser drilling mode, and forming the through hole.

7. The method of claim 1, wherein the sequentially forming an anode layer, an auxiliary electrode layer, a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer on the substrate comprises:

and sequentially forming a hole injection layer, a hole transport layer and a light-emitting layer by adopting an ink-jet printing mode.

8. The method of claim 1, wherein the sequentially forming an anode layer, an auxiliary electrode layer, a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer on the substrate comprises:

and sequentially forming an electron transport layer and an electron injection layer by adopting a vacuum evaporation mode.

9. An OLED display panel, characterized in that, the OLED display panel is manufactured by the method for manufacturing the OLED display panel as claimed in claims 1 to 8.

10. An OLED display panel, wherein the OLED display panel is the OLED display panel according to claim 9.

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