CN114823817A - Display panel and display device - Google Patents

Abstract

The embodiment of the application provides a display panel and a display device, relates to the technical field of display, and is used for solving the technical problem that black spots easily appear in a display area of the display panel. The non-display area of the display panel comprises a substrate, a first conducting layer, a first insulating layer, a second conducting layer and a packaging layer which are sequentially stacked; the first conductive layer includes a data line group; the second conducting layer comprises a power line, the power line is provided with a deformation area and a connecting part used for being connected with an external circuit, the deformation area is an overlapped area of an orthographic projection of the power line on the substrate and an orthographic projection of the data line group on the substrate, and at least part of the orthographic projection of the side face of the connecting part located in the deformation area on the substrate is a straight line. The display panel can improve the smoothness of the packaging layer on the power line in the deformation area, prevent the packaging layer from cracking and avoid the display area from generating black spots.

Description

Display panel and display device

Technical Field

The application relates to the technical field of display, in particular to a display panel and a display device.

Background

In the field of display technology, an Organic Light Emitting Diode (OLED) display panel is widely used in display devices such as mobile phones, tablet computers, and the like because of its advantages of self-luminescence, low energy consumption, high contrast, and fast response speed. However, the display area of the display panel in the related art is prone to black spots, which affects the display effect of the display panel.

Disclosure of Invention

In view of the foregoing problems, embodiments of the present application provide a display panel and a display device to solve the technical problem in the related art that a display area of the display panel is prone to black speckles.

In order to achieve the above object, the embodiments of the present application provide the following technical solutions:

a first aspect of an embodiment of the present application provides a display panel, where the display panel has a display area and a non-display area located at a periphery of the display area; the non-display area comprises a substrate, a first conducting layer, a first insulating layer, a second conducting layer and a packaging layer which are sequentially stacked; the first conductive layer comprises a data line group; the second conducting layer comprises a power line, the power line is provided with a deformation area and a connecting part used for being connected with an external circuit, the deformation area is an overlapping area of an orthographic projection of the power line on the substrate and an orthographic projection of the data line group on the substrate, and the connecting part is located on the side face in the deformation area and at least partially in a straight line in the orthographic projection on the substrate.

The display panel of the embodiment of the application, the data line is located the first conducting layer, the power cord is located the second conducting layer on the first conducting layer, the power cord has the deformation zone, and the deformation zone is located the top of the data line group. The orthographic projection of the part of the connecting portion of the power line, which is located in the deformation area, on the substrate is at least partially set to be a straight line, so as to remove the groove located on the connecting portion in the deformation area, the lateral area of the connecting portion in the deformation area can be reduced, the area of the connecting portion in the deformation area exposed in etching liquid in a follow-up etching process is reduced, the lateral etching depth of the connecting portion in the deformation area is reduced, the smoothness of the packaging layer on the power line formed in the deformation area is improved, cracks are prevented from being generated on the packaging layer, and the display area is prevented from generating black spots.

In a possible implementation manner, an orthographic projection of a side surface of the connecting portion, which is located in the deformation region, on the substrate is a straight line.

By the arrangement, the orthographic projection of the side face of the part, located above the data line group, of the connecting part on the substrate is a straight line, so that all grooves in the side face of the connecting part located in the deformation area are eliminated, and the lateral area of the connecting part located in the deformation area is further reduced.

In one possible implementation manner, the data line group includes a plurality of data lines arranged parallel to and spaced apart from each other, and the straight line is perpendicular to an extending direction of the data lines.

By the arrangement, the area of the side face of the connecting part in the deformation area can be minimized, so that the area of the power line in the deformation area exposed to the etching liquid in the subsequent etching process is reduced.

In a possible implementation manner, a side surface of the connecting portion, which is located outside the deformation region, is provided with a plurality of grooves, and the plurality of grooves are arranged along an extending direction of the side surface of the connecting portion.

So set up, a plurality of recesses are remain to the side that connecting portion do not lie in the data line top to the route complexity of the side of increase connecting portion can play the effect that blocks to impurity such as moisture or oxygen, prevents that impurity from getting into in the display area and influencing display panel's display effect along the side of connecting portion.

In one possible implementation manner, the non-display area further includes a first retaining wall and a second retaining wall located between the encapsulation layer and the second conductive layer; the first retaining wall surrounds the display area; the second retaining wall surrounds the first retaining wall, and a blocking area is formed by the first retaining wall and the second retaining wall; the part of the side surface of the connecting part, which is positioned in the deformation area and is positioned in the blocking area in the orthographic projection of the side surface of the connecting part on the substrate is a straight line.

So set up, will be located the regional top between first barricade and the second barricade, and the side that is located the connecting portion of data line top sets up to the straight line to reduce the side direction sculpture volume of power cord, improve the planarization of packaging layer, prevent that the packaging layer from producing the crackle.

In one possible implementation, an orthographic projection of a side surface of the connecting portion on the substrate is a straight line.

So set up, can also reduce the preparation degree of difficulty of connecting portion, improve display panel's production efficiency.

In one possible implementation, the straight line is perpendicular to the extending direction of the data line.

The arrangement enables the area of the side face of the connecting part to be minimum, and therefore the area of the power line exposed to the etching liquid in the subsequent etching process is reduced.

In one possible implementation manner, the first conductive layer includes a first metal layer, a third insulating layer, and a second metal layer sequentially disposed along a direction away from the substrate, the data line group includes a plurality of data lines disposed parallel to each other and at intervals, a part of the data lines in the data group is formed by the first metal layer, and another part of the data lines in the data group is formed by the second metal layer.

According to the arrangement, a plurality of data lines in a plurality of data line groups are respectively positioned in the first metal layer and the second metal layer so as to increase the distance between the data lines; the third insulating layer insulates the data line of the first metal layer and the data line of the second metal layer to prevent short circuit among the data lines from affecting the function of the display panel.

In one possible implementation manner, the second conductive layer includes a third metal layer and a fourth metal layer, the third metal layer is located on a side of the first insulating layer facing away from the first conductive layer, and the third metal layer is provided with a first sub power line; the fourth metal layer is located on one side, back to the first insulating layer, of the third metal layer, and is provided with a second sub power line which is electrically connected with the first sub power line to form the power line.

So set up, can increase the linewidth of power cord, reduce the resistance of power cord to reduce the electric quantity loss on the power cord, and then reduced display panel's energy consumption.

In one possible implementation, the non-display region further includes an inorganic layer between the third metal layer and the fourth metal layer, the inorganic layer covering the first sub power supply line.

In one possible implementation, the inorganic layer covers a side surface of the first sub power supply line.

So set up, can prevent that the etching liquid from carrying out the sculpture to the edge of first sub-power cord, further reduce the side direction sculpture volume of power cord.

A second aspect of embodiments of the present application provides a display device including the display panel described in any one of the above.

The display device according to the embodiment of the present application includes the display panel according to any one of the above descriptions, and therefore the display device includes the advantages of the display panel according to any one of the above descriptions, which is not repeated herein.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.

FIG. 1 is a schematic diagram of a partial top view of a display panel in the related art;

FIG. 2 is an enlarged schematic view at D of FIG. 1;

FIG. 3 is a schematic cross-sectional view along direction E-E of the display panel in FIG. 2;

FIG. 4 is a focused ion beam image of a display panel according to the related art;

FIG. 5 is a schematic diagram of a power line;

FIG. 6 is an enlarged schematic view of the structure at G in FIG. 5;

fig. 7 is a partial cross-sectional structural view of another display panel in the related art;

fig. 8 is a schematic cross-sectional structure view of a display panel in the related art;

FIG. 9 is a schematic diagram illustrating a partial top view of a display panel according to an embodiment of the present disclosure;

FIG. 10 is an enlarged schematic view of FIG. 9 at H;

FIG. 11 is a schematic cross-sectional view taken along the direction J-J in FIG. 10;

FIG. 12 is a schematic diagram of a partial top view structure of a display panel according to another embodiment of the present application;

FIG. 13 is a schematic diagram of a partial top view structure of a display panel according to another embodiment of the present application;

fig. 14 is a schematic partial top view structure diagram of a display panel according to another embodiment of the present application.

Description of reference numerals:

10. a substrate;

110. a second insulating layer;

211-data lines;

230-a third insulating layer;

30. a first insulating layer;

411. a power line;

412. a connecting portion;

413. a groove;

414. a straight line;

415. a first sub power supply line;

416. a second sub power supply line;

430. an inorganic layer;

50. a packaging layer;

510. a first inorganic encapsulation layer;

520. a second inorganic encapsulation layer;

61. a first retaining wall;

62. a second retaining wall;

A. a display area;

B. a non-display area;

C. a binding region;

I. and (4) a deformation area.

Detailed Description

In the related art, referring to fig. 1, 2 and 3, a display panel includes a display area a, a non-display area B located at a periphery of the display area. The non-display area B includes a binding area C for setting an external circuit therein. The non-display region B includes a substrate 10, a first conductive layer, a first insulating layer 30, a second conductive layer, and an encapsulation layer 50, which are sequentially stacked. The first conductive layer includes two data line groups symmetrically disposed along a center line of the display panel, each data line group includes a plurality of data lines 211 disposed in parallel and at intervals, and one end of each data line 211 extends into the bonding region C to be connected with an external circuit in the bonding region C. A plurality of power lines 411 are arranged in the second conductive layer, each power line 411 includes a connection portion 412 facing the bonding region C, a plurality of grooves 413 penetrating through the power lines 411 are arranged on a side surface of the connection portion 412, and the plurality of grooves 413 are arranged along an extending direction of the side surface of the connection portion 412. The plurality of grooves 413 can increase the complexity of the path of the side surface of the connection portion 412 to block impurities such as moisture and oxygen, and prevent the impurities from entering the display region a along the side surface of the connection portion 412 to affect the display function of the display panel.

As described in the background art, the display area of the display panel in the related art is liable to appear black spots. The inventor has found that, through long-term research, the main cause of the cracking is that the encapsulation layer above the data line 211 is prone to occur at a position corresponding to the groove 413, and in subsequent process steps such as module bonding, when pressure is applied to the encapsulation layer, the cracking extends to the display area, and moisture or oxygen enters the light emitting device in the display area through the cracking, so that the light emitting device is damaged, and black spots are generated in the display area of the display panel. Referring to fig. 4, an image obtained by performing focused ion beam inspection on a display panel in the related art is shown. As can be seen in fig. 4, the encapsulation layer 50 cracks in the region F.

Specifically, referring to fig. 5 and 6, the plurality of data lines 211 of each group of data lines are disposed parallel to and spaced apart from each other on the substrate 10. The first insulating layer 30 covers the plurality of data lines 211, and the first insulating layer 30 forms a continuous first protrusion on the data lines 211 due to the limited thickness of the first insulating layer 30. When the power line 411 is fabricated, a second conductive layer is formed on the first insulating layer 30, the second conductive layer covers the first insulating layer 30, and a continuous second protrusion is formed on a portion of the second conductive layer on the continuous first protrusion, so that the originally flat second conductive layer is deformed. The second conductive layer is then etched to form the power supply line 411. Referring to fig. 6, when the second conductive layer is etched, a groove 413 of a side surface of the connection portion 412 is formed on the second protrusion. And referring to fig. 7, the area of the groove wall of the groove 413 formed on the second protrusion may be increased as compared to when the groove is formed on the flat second conductive layer, resulting in an increase in the area of the groove wall of the groove 413 on the power line 411.

Referring to fig. 8, after the power line 411 is fabricated, for example, when the first and second banks 61 and 62 are fabricated in the non-display region, an organic insulating layer is first formed on the second conductive layer, and then the organic insulating layer is etched to obtain the first and second banks 61 and 62. The power line 411 is laterally corroded by the etching liquid used for etching the organic insulating layer. As the groove wall area of the groove 413 is increased, the contact area of the groove 413 and the etching liquid is increased, and the lateral etching amount of the groove wall of the groove 413 is increased. When the package layer 50 is manufactured, the package layer 50 covers the power line 411, and the lateral etching amount of the groove 413 is large, so that the package layer 50 is broken at a position corresponding to the groove 413 to generate a crack.

To the above technical problem, the embodiment of the present application provides a display panel, the power cord has the deformation region, the deformation region is located the top of data line group, the orthographic projection at least part of the part that is located the connecting portion of power cord in the deformation region on the substrate sets up to the straight line, in order to get rid of the recess that is located the connecting portion in the deformation region, can reduce the side area that is located the connecting portion in the deformation region, thereby reduce the area that the connecting portion in the deformation region exposes in the etching solution in the follow-up etching technology, and then reduce the side of the connecting portion in the deformation region and carve the degree of depth, thereby improve the planarization of the encapsulation layer on the power cord that is formed in the deformation region, prevent that the encapsulation layer from producing the crackle, and then avoid the display area to produce the black spot.

In order to make the aforementioned objects, features and advantages of the embodiments of the present application more comprehensible, embodiments of the present application are described in detail below with reference to the accompanying drawings. It is to be understood that the described embodiments are merely a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It should be noted that the sizes and shapes of the figures in the drawings are not to be considered true scale, but are merely intended to schematically illustrate the present invention. And the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout.

Referring to fig. 9, 10, and 11, the display panel (only partially shown) of the embodiment of the present application has a display area a and a non-display area B located at the periphery of the display area a. The display area a is used for realizing the display function of the display panel. Illustratively, the display area a includes light emitting devices arranged in a matrix, and a driving array disposed corresponding to the light emitting devices and controlling the light emitting devices. The non-display area B includes a bonding area C therein for setting an external circuit of the display panel, such as a driving circuit and the like. The non-display area B is used to provide circuit connection lines to connect the light emitting devices and the driving array within the display area a with an external circuit.

Referring to fig. 11, the non-display region B includes a substrate 10, a first conductive layer, a first insulating layer 30, a second conductive layer, and an encapsulation layer 50, which are sequentially stacked. The substrate 10 is used to provide support for other film layers located thereon. Illustratively, the substrate 10 may be a rigid substrate, such as glass or the like. The substrate 10 may also be a flexible substrate, such as Polyimide (PI), so that the display panel has a flexible property to implement a bending or folding function of the display device.

Exemplarily, referring to fig. 11, a second insulating layer 110 may be further disposed on the substrate 10, and the second insulating layer 110 may serve as a gate insulating layer (GI layer) to insulate gates of the thin film transistors in the driving array in the display area a. The second insulating layer 110 may be silicon oxide or silicon nitride, or may be another organic material or inorganic material having an insulating function.

In the non-display region B, a first conductive layer may be positioned on the substrate 10. The first conductive layer includes a data line group. For example, there may be a plurality of data line groups, the plurality of data line groups are symmetrically arranged with respect to the central line S of the display panel, each data line group includes a plurality of data lines 211 arranged parallel to each other and spaced apart from each other, and an end of each data line 211 away from the display area is used for connecting with an external circuit in the bonding area C.

The first conductive layer may include a single metal layer or a plurality of metal layers. Exemplarily, referring to fig. 11, the first conductive layer includes a first metal layer, a third insulating layer 230, and a second metal layer sequentially disposed in a direction away from the substrate 10, a portion of the data lines in the data line group is formed of the first metal layer, for example, a portion of the data lines may be formed through a patterning process, and another portion of the data lines in the data line group is formed of the second metal layer, for example, another portion of the data lines may be formed through a patterning process. That is, the plurality of data lines 211 in the plurality of data line groups may be respectively located in the first metal layer and the second metal layer to increase a distance between the data lines 211; in addition, the third insulating layer 230 insulates the data line 211 in the first metal layer and the data line 211 in the second metal layer to prevent a short circuit from occurring between the data lines 211 to affect the function of the display panel.

Illustratively, the first and second metal layers may be formed of a single material layer or a composite material layer including at least one material of aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), and copper (Cu), or other suitable alloys.

The first insulating layer 30 and the second conductive layer are sequentially disposed on a side of the first conductive layer opposite to the substrate 10, and the first insulating layer 30 insulates the first conductive layer from the second conductive layer to prevent a short circuit between a line in the first conductive layer and a line in the second conductive layer.

Referring to fig. 10 and 11, a second conductive layer is formed on a side of the first insulating layer 30 opposite to the first wire layer. The second conductive layer includes a power line 411, the power line 411 has a deformation region I and a connection portion 412 for connecting to an external circuit, the deformation region I is an overlapping area of an orthographic projection of the power line 411 on the substrate 10 and an orthographic projection of the data line group on the substrate 10, and an orthographic projection of a side of the connection portion 412 in the deformation region I on the substrate is at least partially a straight line 414.

Because the orthographic projection of the side surface of the connecting part 412 of the power line 411 in the deformation region I on the substrate 10 is at least partially a straight line 414, the groove on the connecting part 412 in the deformation region I can be removed, the lateral area of the connecting part 412 in the deformation region I can be reduced, the area of the connecting part 412 in the deformation region I exposed in the etching solution in the subsequent etching process is reduced, the lateral etching depth of the connecting part 412 in the deformation region I is further reduced, the flatness of the packaging layer 50 formed on the power line 411 in the deformation region I is improved, the packaging layer 50 is prevented from cracking, and the display region A is prevented from generating black spots.

Note that the orthogonal projection of the side surface of the connection portion 412 in the deformation region I on the substrate is at least partially a straight line 414, which means that the orthogonal projection of the side surface on the substrate 10 may be partially the straight line 414 or may be entirely the straight line 414.

In some implementations of the embodiment of the present application, referring to fig. 9, an orthographic projection of a side surface of the connecting portion 412 in the deformation region I on the substrate 10 is a straight line 414, that is, an orthographic projection of all side surfaces of a portion of the connecting portion 412 above the data line group on the substrate 10 is a straight line 414, so as to eliminate all grooves on the side surface of the connecting portion 412 in the deformation region I, further reduce a lateral area of the connecting portion in the deformation region I, thereby reduce an area of the connecting portion 412 exposed in the etching solution in a subsequent etching process, and further reduce a lateral etching depth of the power line in the deformation region I, thereby improving flatness of the encapsulation layer 50 formed on the power line 411 in the deformation region I, preventing the encapsulation layer 50 from cracking, and further avoiding a black spot in the display region a.

Exemplarily, referring to fig. 9, a side surface of the connection part 412 located outside the deformation region I may be provided with a plurality of grooves 413, and the plurality of grooves 413 are arranged along an extending direction of the side surface of the connection part 412. The side of the connection part 412 not located above the data line 211 is reserved with a plurality of grooves 413 to increase the complexity of the path of the side of the connection part 412, and can block impurities such as moisture or oxygen, and prevent the impurities from entering the display area a along the side of the connection part 412 to affect the display effect of the display panel.

The power lines 411 may include a high voltage power line (VDD) and a low voltage power line (VSS). One end of the high voltage power line is used for connecting with the driving array and the light emitting device in the display area a, and the other end of the high voltage power line is used for connecting with an external circuit to provide high level for the driving array and the light emitting device. One end of the low voltage power line is for connection with the light emitting devices within the display area a, and the other end of the low voltage power line is for connection with an external circuit to provide a low level to the light emitting devices.

According to the display panel, the orthographic projection of the side face, positioned in the deformation area, of the connecting part of the power line on the substrate can be set to be a straight line; as shown in fig. 9, an orthogonal projection of a side surface of the connection portion of all power lines, which is located in the deformation region, on the substrate may also be set as a straight line, which is not limited in this embodiment of the application.

The second conductive layer may include a single metal layer or may include a plurality of metal layers. Exemplarily, referring to fig. 11, the second conductive layer includes a third metal layer and a fourth metal layer, the third metal layer is located on a side of the first insulating layer 30 facing away from the first conductive layer, and the third metal layer is provided with a first sub power line 415; the fourth metal layer is located on a side of the third metal layer opposite to the first insulating layer 30, the fourth metal layer is provided with a second sub power line 416, and the second sub power line 416 is electrically connected to the first sub power line 415 to form a power line 411. So set up, can increase the linewidth of power cord 411, reduce the resistance of power cord 411 to reduce the electric quantity loss on the power cord 411, and then reduced display panel's energy consumption.

Referring to fig. 11, the non-display region B may further include an inorganic layer 430, the inorganic layer 430 being between the third metal layer and the fourth metal layer, the inorganic layer 430 covering the first sub power line 415. The inorganic layer 430 can cover the side surface of the first sub power line 415 to prevent the etching solution from etching the side surface of the first sub power line 415, thereby further reducing the lateral etching amount of the power line 411.

Illustratively, the third metal layer and the fourth metal layer may be simple metal layers or composite metal layers, for example, the third metal layer and the fourth metal layer may each be a titanium/aluminum/titanium (Ti/Al/Ti) structure.

Referring to fig. 11, an encapsulation layer 50 is formed on a side of the second conductive layer facing away from the first insulating layer 30, and the encapsulation layer 50 is used for encapsulating the light emitting device in the display area a, so as to prevent impurities such as moisture or oxygen from entering the light emitting device and affecting the display function of the display panel. For example, in the non-display region B, the encapsulation layer 50 may include a first inorganic encapsulation layer 510 and a second inorganic encapsulation layer 520 sequentially formed on the second conductive layer.

The non-display region B may further include a first dam 61 and a second dam 62 between the package layer 50 and the second conductive layer, the first dam 61 surrounds the display region a, the second dam 62 surrounds the first dam 61, and the second dam 62 and the first dam 61 form a blocking region. For example, the first retaining wall 61 and the second retaining wall 62 may be formed simultaneously when the planarization layer, the pixel defining layer and the spacer layer in the display area a are fabricated, so as to save process steps and improve the production efficiency of the display panel.

Another embodiment of the present application provides a display panel, referring to fig. 12, having a display area a and a non-display area B located at the periphery of the display area a, the non-display area B including a substrate 10, a first conductive layer, a first insulating layer 30, a second conductive layer, and an encapsulation layer 50, which are sequentially stacked. The first conductive layer includes a data line group. The second conductive layer includes a power line 411, the power line 411 has a deformation area I overlapping the data line group, the power line 411 further has a connection portion 412 for connecting with an external circuit, and an orthogonal projection of a side surface of the connection portion 412 in the deformation area I on the substrate is at least partially a straight line 414.

The embodiment of the present application is different from the above embodiments in that: the straight line 414 is perpendicular to the extending direction of the data line 211. Since the straight line 414 is perpendicular to the extending direction of the data line 211, the area of the side surface of the connecting portion 412 in the deformation region I is minimized, so that the area of the power line 411 in the deformation region I exposed to the etching solution in the subsequent etching process is reduced, and the lateral etching depth of the power line 411 in the deformation region I is reduced, thereby improving the flatness of the encapsulating layer 50 formed on the power line 411 in the deformation region I, preventing the encapsulating layer 50 from cracking, and further preventing the display region a from generating black spots.

The remaining structures of the display panel in the embodiments of the present application can refer to the above embodiments, and are not described in detail in this embodiment of the present application.

Referring to fig. 13, another embodiment of the present application provides a display panel having a display area a and a non-display area B located at a periphery of the display area a, the non-display area B including a substrate 10, a first conductive layer, a first insulating layer 30, a second conductive layer, and an encapsulation layer 50, which are sequentially stacked. The first conductive layer includes a data line group. The second conductive layer includes a power line 411, the power line 411 has a deformation area I overlapping the data line group, the power line 411 further has a connection portion 412 for connecting with an external circuit, and an orthogonal projection of a side surface of the connection portion 412 in the deformation area I on the substrate is at least partially a straight line 414.

The difference from the above embodiment is that: the part of the side surface of the connecting part 412 in the deformation region I, which is located in the blocking region by the orthographic projection on the substrate, is a straight line. Since the encapsulation layer 50 is located on the second conductive layer and covers the first retaining wall 61 and the second retaining wall 62, the flatness of the encapsulation layer 50 located between the first retaining wall 61 and the second retaining wall 62 is further reduced, so that cracks are more likely to be generated in the encapsulation layer 50 located between the first retaining wall 61 and the second retaining wall 62. The display panel of the embodiment of the application is to be located above the region between the first retaining wall 61 and the second retaining wall 62, and the side of the connecting portion 412 located above the data line 211 is set to be a straight line, so as to reduce the lateral etching amount of the power line 411, improve the flatness of the encapsulation layer 50, and prevent the encapsulation layer 50 from generating cracks.

The remaining structures of the display panel in the embodiments of the present application may refer to the embodiments described above, and are not described in detail in the embodiments of the present application.

Referring to fig. 14, another embodiment of the present application provides a display panel including a display area a and a non-display area B located at a periphery of the display area a, the non-display area B including a substrate 10, a first conductive layer, a first insulating layer 30, a second conductive layer, and an encapsulation layer 50, which are sequentially stacked. The first conductive layer includes a data line group. The second conductive layer includes a power line 411, the power line 411 has a deformation area I overlapping the data line group, the power line 411 further has a connection portion 412 for connecting with an external circuit, and an orthogonal projection of a side surface of the connection portion 412 in the deformation area I on the substrate is at least partially a straight line 414.

The difference from the above embodiment is that: an orthogonal projection of the side surface of the connection portion 412 on the substrate 10 is a straight line 414. That is to say, the orthographic projections of the side surfaces of the connecting portion 412 on the substrate 10 are all straight lines 414, and by such arrangement, the area of the side surface of the connecting portion 412 in the deformation region I can be reduced, so that the area of the power line 411 in the deformation region I exposed in the etching solution in the subsequent etching process is reduced, and further, the lateral etching depth of the power line 411 in the deformation region I is reduced, so that the flatness of the package layer 50 formed on the power line 411 in the deformation region I is improved, cracks in the package layer 50 are prevented, and further, the black spots in the display region a are avoided. Meanwhile, the manufacturing difficulty of the connecting part 412 can be reduced, and the production efficiency of the display panel is improved.

Illustratively, the straight line 414 may also be perpendicular to the extending direction of the data line 211. Since the straight line 414 is perpendicular to the extending direction of the data line 211, the area of the side surface of the connecting portion 412 in the deformation region I is minimized, so that the area of the power line 411 in the deformation region I exposed in the etching solution in the subsequent etching process is reduced, and the lateral etching depth of the power line 411 in the deformation region I is reduced, thereby improving the flatness of the encapsulating layer 50 formed on the power line 411 in the deformation region I, preventing the encapsulating layer 50 from cracking, and further preventing the display region a from generating black spots.

The remaining structures of the display panel in the embodiments of the present application can refer to the above embodiments, and are not described in detail in this embodiment of the present application.

An embodiment of the present application further provides a display device, including the display panel of any one of the above embodiments.

The display device according to the embodiment of the present application includes the display panel according to any one of the embodiments, and therefore the display device includes the advantages of the display panel according to any one of the embodiments, which is not described herein again.

The embodiments or implementation modes in the present specification are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments may be referred to each other.

It should be noted that references in the specification to "one embodiment," "an example embodiment," "some embodiments," etc., indicate that the embodiment described may include a particular feature, structure, or characteristic, but every embodiment may not necessarily include the particular feature, structure, or characteristic. Moreover, such phrases are not necessarily referring to the same embodiment. Further, when a particular feature, structure, or characteristic is described in connection with an embodiment, it is within the knowledge of one skilled in the art to effect such feature, structure, or characteristic in connection with other embodiments whether or not explicitly described.

Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.

Claims (10)

1. The display panel is characterized by comprising a display area and a non-display area positioned at the periphery of the display area; the non-display area comprises a substrate, a first conducting layer, a first insulating layer, a second conducting layer and a packaging layer which are sequentially stacked; the first conductive layer comprises a data line group; the second conducting layer comprises a power line, the power line is provided with a deformation area and a connecting part used for being connected with an external circuit, the deformation area is an overlapping area of an orthographic projection of the power line on the substrate and an orthographic projection of the data line group on the substrate, and the connecting part is located on the side face in the deformation area and at least partially in a straight line in the orthographic projection on the substrate.

2. The display panel according to claim 1, wherein an orthographic projection of a side of the connecting portion located in the deformation region on the substrate is a straight line.

3. The display panel according to claim 2, wherein the data line group comprises a plurality of data lines arranged in parallel and spaced apart from each other, and the straight line is perpendicular to an extending direction of the data lines.

4. The display panel according to claim 2, wherein a side surface of the connecting portion outside the deformation region is provided with a plurality of grooves, and the plurality of grooves are arranged along an extending direction of the side surface of the connecting portion.

5. The display panel according to claim 1, wherein the non-display region further comprises a first retaining wall and a second retaining wall between the encapsulation layer and the second conductive layer; the first retaining wall surrounds the display area; the second retaining wall surrounds the first retaining wall, and a blocking area is formed by the second retaining wall and the first retaining wall;

the part of the side surface of the connecting part, which is positioned in the deformation area and is positioned in the blocking area in the orthographic projection of the side surface of the connecting part on the substrate is a straight line.

6. The display panel according to claim 1, wherein an orthographic projection of a side face of the connecting portion on the substrate is a straight line;

preferably, the straight line is perpendicular to an extending direction of the data line.

7. The display panel according to any one of claims 1 to 6, wherein the first conductive layer comprises a first metal layer, a third insulating layer, and a second metal layer which are provided in this order in a direction away from the substrate; the data line group comprises a plurality of data lines which are parallel to each other and arranged at intervals, one part of the data lines in the data group are formed by the first metal layer, and the other part of the data lines in the data group are formed by the second metal layer.

8. The display panel according to any one of claims 1 to 6, wherein the second conductive layer comprises a third metal layer and a fourth metal layer, the third metal layer is located on a side of the first insulating layer facing away from the first conductive layer, and the third metal layer is provided with a first sub power supply line; the fourth metal layer is located on one side, back to the first insulating layer, of the third metal layer, and is provided with a second sub power line which is electrically connected with the first sub power line to form the power line.

9. The display panel according to claim 8, wherein the non-display region further comprises an inorganic layer between the third metal layer and the fourth metal layer, the inorganic layer covering the first sub power supply line;

preferably, the inorganic layer covers a side surface of the first sub power line.

10. A display device characterized by comprising the display panel according to any one of claims 1 to 9.

Images