CN114818591B - Method for quickly generating clearance of tool device - Google Patents

Method for quickly generating clearance of tool device Download PDF

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CN114818591B
CN114818591B CN202210764249.4A CN202210764249A CN114818591B CN 114818591 B CN114818591 B CN 114818591B CN 202210764249 A CN202210764249 A CN 202210764249A CN 114818591 B CN114818591 B CN 114818591B
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clearance
contour
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CN114818591A (en
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杨松贵
宋小亮
李俊
丁亮
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Nanjing Witsoft Technology Co Ltd
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    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00Computer-aided design [CAD]
    • G06F30/30Circuit design
    • G06F30/39Circuit design at the physical level
    • G06F30/392Floor-planning or layout, e.g. partitioning or placement
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2115/00Details relating to the type of the circuit
    • G06F2115/12Printed circuit boards [PCB] or multi-chip modules [MCM]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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Abstract

A method for quickly generating a tool device clearance comprises the following steps: s1: the analyzing component analyzes the device information file to obtain device layout information, and converts the device layout information into a tool coordinate system; s2: selecting a tool clamp coordinate and a product coordinate; s3: setting a merging distance and a clearance gap of the device; s4: the merging component merges the contours according to the merging distance and the clearance gap input in the step S3; s5: inputting a simplified value in the simplified assembly, simplifying the outline and generating a simplified clearance outline; s6: generating a keep-away feature; the invention reads device data by using an optimization algorithm to calculate and generate a cut outline section, and a device clearance cut is rapidly generated on a tool clamp; the efficiency is improved, the complexity of PCB clearance design and processing is reduced, and the processing precision is improved; the profile cross section of the cut is automatically generated, the device clearance groove or the cut can be rapidly generated on the tool clamp, and the labor intensity of a designer is reduced.

Description

Method for rapidly generating clearance of tool device
Technical Field
The invention relates to the field of PCB processing design, in particular to a method for quickly generating clearance of a tool device.
Background
The following technical problems can be faced in the electronic device clearance design process in the PCB tool:
1, more devices, less devices and hundreds of devices, and more devices and thousands of devices, and 3D (three-dimensional) images look like many lines, so that the design of reference delineation is extremely difficult;
2, the requirement on the precision of a gap between the tool and the device is high, in order to facilitate CNC, the inner corners of the clearance profile are required to be provided with proper process fillets, the clearance profile is required to be simplified as much as possible, the CNC is convenient to process efficiently, and the manual design is difficult and long in time;
3, the space between some devices is very small, and the clearance profiles of a plurality of devices in a certain distance are required to be combined into a clearance groove, so that the design result is difficult to standardize and the design of each person is possibly different;
the design of the device clearance can be seen to have a plurality of factors to be considered, the traditional design scheme is a super-tedious design process, a lot of time is occupied in the design tool, and in order to solve the problems, the method uses an optimization algorithm to read the data of the device, automatically generates the notch outline section after calculation, and can quickly generate the device clearance notch on a tool clamp.
Disclosure of Invention
The invention aims to solve the defects in the prior art, and provides a method for quickly generating a clearance of a tool device.
In order to achieve the purpose, the invention adopts the following technical scheme: a method for rapidly generating a tooling device clearance comprises a rapid generation tooling device clearance module, which comprises an analysis component, a combination component, a clearance component and a simplification component; comprises the following steps of (a) carrying out,
s1: analyzing the device information file by the analysis component to obtain device layout information, and converting the analyzed device layout information into a tool coordinate system;
the device information file is a PCB device layout information file and is an information file transmitted by an upstream PCB design; the analysis subassembly is used for analyzing the device layout information file to obtain device layout information;
the analysis component comprises an analysis sub-component and a conversion sub-component, wherein the conversion sub-component is used for converting the device layout information into a tool coordinate system and comprises the following sub-steps:
s11: the conversion sub-assembly converts the position information into new position information through a translation matrix to obtain the position coordinates of the device in a tool coordinate system;
s12: translating the device into a tool coordinate system according to the position coordinate of the device in the tool coordinate system obtained in the step S11;
s13: taking the new position information obtained in the step S11 as a central point, rotating the outline by the conversion sub-assembly according to a rotation matrix formula to obtain the outline information of the device in a tool coordinate system;
s14: the conversion component rotates the device contour in the tooling coordinate system according to the contour information obtained in the step S13 to obtain the layout of the device in the tooling coordinate system;
s2: selecting a tool clamp coordinate and a product coordinate;
s3: setting a merging distance and a clearance gap of the device;
s4: the merging component performs outline external bias according to the merging distance and the clearance gap input in the step S3, and merges the outlines;
s41: the merging component merges the distance of the adjacent devices into an integral outline according to the merging distance set in the step S3, wherein the distance of the adjacent devices is smaller than the merging distance in the tool coordinate system;
s42: the clearance avoiding assembly expands or contracts the overall outline of each device in a tool coordinate system according to the clearance avoiding gap set in the step S3;
s43: if the overall contours are overlapped after being expanded or reduced, the merging component merges the intersected overall contours into a large overall contour in a tool coordinate system according to the merging distance set in the step S3;
s44: repeating the step S43 until no intersecting overall contour appears in the tool coordinate system;
s5: inputting a simplified value in the simplified assembly, simplifying the outline and generating a simplified clearance outline;
s6: generating a keep-away feature; the simplified clearance profile generates device clearance features in Creo.
Preferably, in step S1, the layout information includes contour information and position information; the contour information is coordinates of points on the contour; the position information is the coordinates of the center point of the device or the coordinates of a certain point on the device.
Preferably, step S41 further includes the following sub-steps:
s411: the coordinates of points on the outlines of two adjacent devices in the tooling coordinate system are respectively set as follows:
(Lxi, ly, Lzi), (Mxi, Myi, Mzi), calculating the distance Di between the coordinates of points on two adjacent device contours;
s412: for the adjacent device which is judged in step S411 that two adjacent devices are merged, merging is performed.
Preferably, S412 further comprises the following sub-steps:
s4121: finding the coordinates of two points corresponding to the minimum Dimin of the distance Di between the coordinates of the points on the two device outlines;
s4122: then two end points of the corresponding line ends of the coordinates of the two points on the contour of the adjacent device are found in the step S4121 or obtained;
s4123: the two end points on the line segment obtained in S4122 are projected onto the line segment on the corresponding adjacent device to form an overall outline.
Preferably, step S42 further includes the following sub-steps:
s421: finding the midpoint of the overall outline of the device;
s422: comparing the coordinates of the points on the overall contour of the device with the coordinates of the middle points of the overall contour, and classifying the coordinates of the points on the contour;
s423: expanding or reducing the overall contour of each device in a tool coordinate system;
s424: finally, the overall contour of each device expanded or reduced in the tool coordinate system is obtained.
Preferably, step S5 further includes the following sub-steps:
s51: inputting a simplified value;
s52: the simplifying assembly fits the contour points to a straight line or a circular arc to obtain a standard clearance contour;
s53: finding a line segment with the length smaller than the simplified value and two adjacent line segments with the length smaller than the simplified value on the device outline;
s54: deleting the line segments with the length smaller than the simplified value, which are found in the step S52;
s55: and forming a new contour to obtain a simplified clearance contour.
Compared with the prior art, the invention has the beneficial effects that:
1. reading device data by using an optimization algorithm, calculating and generating a notch profile section, and quickly generating a device clearance notch on a tool clamp;
2. the number of the outlines on the PCB is reduced, and the efficiency is improved;
3. the complexity of PCB clearance design and processing is reduced, and the processing precision is improved;
4. the automatic notch profile cross section that generates can generate device clearance groove or incision on frock clamp fast, very big reduction designer's intensity of labour.
Drawings
FIG. 1 is a schematic diagram of a method for rapidly generating a clearance of a tooling device according to the present invention before merging profiles;
FIG. 2 is a schematic diagram illustrating merged contours in a method for rapidly generating a tooling device clearance according to the present invention;
FIG. 3 is a schematic diagram of a clearance feature generated after combining contours in a method for rapidly generating a clearance of a tooling device according to the present invention;
fig. 4 is a schematic diagram of an initialization window in a method for rapidly generating a tooling device clearance according to the present invention.
Detailed Description
In order to further understand the objects, structures, features and functions of the present invention, the following embodiments are described in detail.
Referring to fig. 1-4, a method for rapidly generating a tooling device clearance according to an embodiment of the present invention includes rapidly generating a tooling device clearance module, which includes an analyzing component, a combining component, a clearance component, and a simplifying component; the method comprises the following steps:
s1: analyzing the device information file by the analysis component to obtain device layout information, and converting the analyzed device layout information into a tool coordinate system;
the device information file is a PCB device layout information file and is an information file transmitted by an upstream PCB design, wherein the PCB is a printed circuit board, and the device layout information comprises device outline information and position information;
the contour is composed of points, each point on the contour comprises X-axis, Y-axis and Z-axis coordinate information, and the contour information is the coordinates of the points on the contour;
the position information is the coordinates of the middle point of the device or the X axis, the Y axis and the Z axis of a certain point on the device, is set as (X, Y, Z), and the X axis, the Y axis and the Z axis of the point represent the position of the device; each device includes 1 piece of location information;
the analysis component comprises an analysis sub-component and a conversion sub-component; the analysis subassembly is used for analyzing the device layout information file to obtain device layout information, and the layout information comprises contour information and position information; the contour information is coordinates of points on the contour; the position information is the coordinate of the central point of the device or the coordinate of a certain point on the device;
the conversion sub-assembly is used for converting the device layout information into a tool coordinate system;
the tool coordinate system comprises an X axis, a Y axis and a Z axis and is a three-dimensional coordinate of the tool;
the converting sub-assembly converts the outline and the position of the device into a tool coordinate system and comprises the following sub-steps:
s11, the conversion subassembly converts the position information into new position information through the translation matrix to obtain the position coordinates of the device in the tooling coordinate system;
setting the position information of the device as (x, y, z), the position coordinates of the device in the tool coordinate system as (x ', y ', z '),
then:
Figure 195209DEST_PATH_IMAGE001
the translation matrix is a mathematical matrix for a system, belongs to the existing mathematical formula, and is not described in detail herein, wherein Tx represents the translation amount in the X direction, Ty represents the translation amount in the Y direction, and Tz represents the translation amount in the Z direction;
s12, translating the device into the tool coordinate system according to the position coordinate of the device in the tool coordinate system obtained in the step S11;
s13, taking the new position information obtained in the step S11 as a central point, rotating the outline by the conversion sub-assembly according to a rotation matrix formula to obtain the outline information of the device in a tool coordinate system;
let the coordinates of the points on the device profile resolved by the resolution subassembly be (X φ ω, Y φ ω, Z φ ω),
the coordinates of the points of the device on the contour in the tool coordinate system are X phi, Y phi and Z phi, then
Figure 525697DEST_PATH_IMAGE002
In the formula, the content of the active carbon is shown in the specification,
Figure 376978DEST_PATH_IMAGE003
is a rotation matrix, to
Figure 275664DEST_PATH_IMAGE004
Replacing;
the rotation matrix is a commonly used mathematical matrix, belongs to the existing mathematical formula, and is not described in a cumulated manner;
s14, the conversion assembly rotates the device contour in the tool coordinate system according to the contour information obtained in the step S13 to obtain the layout of the device in the tool coordinate system;
the mode of translation and rotation is adopted, so that the calculation efficiency can be improved, and the calculation complexity can be reduced;
s2: selecting a tool clamp coordinate and a product coordinate;
the tooling fixture is a tool for fixing the PCB by clamping;
the tool clamp is a three-dimensional figure of the tool clamp and comprises contour information and position information,
the tool clamp coordinate is the coordinate of the three-dimensional figure of the tool clamp in a tool coordinate system;
the product is a three-dimensional graph of the product and comprises contour information and position information; the product coordinate is the coordinate of the product three-dimensional graph in the tool coordinate system;
in the merging assembly, respectively inputting the position information of the tool clamp and the contour information of the tool clamp into a tool coordinate system through the merging assembly;
the position of the tool clamp can be visualized by selecting the position coordinate of the tool clamp and the position coordinate of a product and placing the tool clamp in a tool coordinate system, and the other side of the tool clamp is convenient to determine the processing direction of the PCB;
s3: setting a merging distance and a clearance gap of the device;
in the merging assembly, merging distance and clearance between the devices are input;
combining the distance as the distance value between the input adjacent devices in the tool coordinate system, wherein the distance between the adjacent devices in the tool coordinate system is smaller than the combining distance, and combining the adjacent devices into an integral profile;
the clearance gap is the distance of the whole outline expansion or reduction;
s4: the merging component performs outline outer bias according to the merging distance and the clearance gap input in step S3, and merges the outlines, as shown in fig. 1-2;
s41, the merging component merges the distance of the adjacent devices into an integral outline in the tool coordinate system according to the merging distance set in the step S3;
s411, setting coordinates of points on the outlines of two adjacent devices in the tooling coordinate system as follows:
(Lxi,Lyi,Lzi),(Mxi,Myi,Mzi),
the distance Di between the coordinates of the points on the two adjacent device profiles is calculated,
Di=
Figure 349580DEST_PATH_IMAGE005
taking the minimum value Dimin of Di,
if the merging distance Dimin is greater than 0, judging that the two adjacent devices are not merged;
if the merging distance Dimin is less than or equal to 0, judging that the two adjacent devices are merged;
s412, merging the adjacent devices determined in step S411 to merge the two adjacent devices, including the following substeps:
s4121, finding coordinates (L1 xi, L1yi, L1 zi), (M1 xi, M1yi, M1 zi) of two points corresponding to a minimum value Dimin of a distance Di between the coordinates of the points on the two device profiles;
s4122, finding the corresponding line ends of the coordinates of the step S4121 or the two points on the outline of the adjacent device respectively, and finding the two end points on the corresponding line ends respectively;
s4123, projecting the two end points on the line segment obtained in the S4122 to the line segment on the corresponding adjacent device to obtain 2 projection lines, and connecting the two adjacent devices together by using the 2 projection lines to form an overall outline;
two end points on the line segment are projected to the line segment on the corresponding adjacent device to obtain 2 projection lines, and the two adjacent devices are connected together by utilizing the 2 projection lines to form an overall outline, so that the machining cutting area can be reduced;
s42, the clearance avoiding assembly expands or contracts the overall outline of each device in the tool coordinate system according to the clearance avoiding clearance set in the step S3; the method comprises the following substeps:
s421, finding the middle point of the overall device outline, and setting the coordinates of the middle point of the overall device outline as (Zxi, Zyi, Zzi);
s422, comparing the coordinates of the points on the whole outline of the device with the coordinates of the middle points of the whole outline, dividing the coordinates of the points on the outline into two types,
one is that the X-axis value of the point coordinate on the contour is less than Zxi, or the Y-axis value is less than Zyi, or the Z-axis value is less than Zzi, and is set as (Axi, Ayi, Azi);
the other is that the X-axis value of the point coordinate on the contour is larger than Zxi, or the Y-axis value is larger than Zyi, or the Z-axis value is larger than Zzi, and the value is set to be (Bxi, Byi and Bzi);
s423, expanding or reducing the overall contour of each device in the tool coordinate system;
setting an input clearance as L;
for points (Axi, Ayi and Azi) on the contour, subtracting the clearance gap L from the Axi axial value, the Ayi axial value and the Azi axial value respectively to obtain points (Axi-L, Ayi-L and Azi-L) of the enlarged contour;
adding the Axi axis value, the Ayi axis value and the Azi axis value to the clearance L to obtain points (Bxi + L, Byi + L and Bzi + L) of the expanded contour for points (Bxi, Byi and Bzi) on the contour;
if L is a positive value, the outline of each device is expanded; if L is a negative value, the outline of each device is expanded;
s424, finally obtaining the expanded or reduced overall contour of each device in the tool coordinate system;
through the space-avoiding design, the complexity of PCB processing can be reduced;
s43, if the overall contour is overlapped after being expanded or reduced, the merging component merges the intersected overall contour into a large overall contour in the tool coordinate system according to the merging distance set in the step S3;
s44, repeating the step S43 until no intersected overall contour appears in the tool coordinate system;
s5: inputting a simplified value in the simplified assembly, simplifying the outline and generating a simplified clearance outline;
the method comprises the following substeps:
s51, inputting a simplified value;
s52, fitting points of the edge part of the overall contour or the large overall contour to a straight line or a circular arc by the simplifying component, so as to obtain a standard clearance contour;
s53, finding out a line segment with the length smaller than a simplified value and two adjacent line segments with the length smaller than the simplified value on the device outline on the standard clearance contour;
s54, deleting the line segment with the length smaller than the simplified value found in the step S52 on the qualified clearance contour;
s55, extending and intersecting two adjacent line segments of the line segment with the length smaller than the simplified value, which are found in the step S52, to form a new contour, and obtaining a simplified clearance-avoiding contour;
through the steps of simplifying the outline, the processing precision is improved, and the processing complexity of the PCB is reduced.
S6: generating a keep-away feature; generating device clearance characteristics in the Creo by the simplified clearance profile;
creo is three-dimensional design software, is a market existing software, the invention does not innovate Creo, but uses the three-dimensional design software to generate the space-avoiding characteristic of the device, and as to how Creo generates the space-avoiding characteristic, the patent is not described herein;
the clearance-avoiding feature is a groove or a notch formed in the three-dimensional coordinate system of the tool for the whole outline of the device.
The invention relates to a method for quickly generating a clearance of a tool device, which is characterized in that an optimization algorithm is used for reading device data and calculating and generating a notch outline section, and a device clearance notch is quickly generated on a tool clamp;
on one hand, the number of the outlines on the PCB to be processed is reduced, and the efficiency is improved;
on the other hand, the complexity of PCB clearance design and processing is reduced, and the processing precision is improved;
the automatic notch profile cross section that generates can generate device clearance groove or incision on frock clamp fast, very big reduction designer's intensity of labour.

Claims (6)

1. A method for rapidly generating a tool device clearance is characterized by comprising the following steps: comprises the following steps of (a) carrying out,
s1: analyzing the device information file by the analysis component to obtain device layout information, and converting the analyzed device layout information into a tool coordinate system;
the device information file is a PCB device layout information file and is an information file transmitted by an upstream PCB design;
the analysis subassembly is used for analyzing the device layout information file to obtain device layout information;
the layout information includes contour information and position information;
the contour information is coordinates of points on the contour;
the position information is the coordinate of the central point of the device or the coordinate of a certain point on the device;
the analysis component comprises an analysis sub-component and a conversion sub-component, wherein the conversion sub-component is used for converting the device layout information into a tool coordinate system and comprises the following sub-steps:
s11: the conversion sub-assembly converts the position information into new position information through a translation matrix to obtain the position coordinates of the device in a tool coordinate system;
s12: according to the position coordinates of the device in the tool coordinate system obtained in the step S11, translating the device into the tool coordinate system;
s13: taking the new position information obtained in the step S11 as a central point, rotating the contour by the conversion sub-assembly according to a rotation matrix formula to obtain contour information of the device in a tool coordinate system;
s14: the conversion assembly rotates the device contour in the tool coordinate system according to the contour information obtained in the step S13 to obtain the layout of the device in the tool coordinate system;
s2: selecting a tool clamp coordinate and a product coordinate;
s3: setting a merging distance and a clearance gap of the device;
s4: the merging component performs outline external bias according to the merging distance and the clearance gap input in the step S3, and merges the outlines;
s41: the merging component merges the distance of the adjacent devices into an integral outline according to the merging distance set in the step S3, wherein the distance of the adjacent devices is smaller than the merging distance in the tool coordinate system;
s42: the clearance avoiding assembly expands or contracts the overall outline of each device in a tool coordinate system according to the clearance avoiding clearance set in the step S3;
s43: if the overall contours are overlapped after being expanded or reduced, the merging component merges the intersected overall contours into a large overall contour in the tool coordinate system according to the merging distance set in the step S3;
s44: repeating the step S43 until no intersecting overall contour appears in the tool coordinate system;
s5: inputting a simplified value in a simplified assembly, simplifying the outline and generating a simplified clearance-avoiding outline;
s6: and generating a clearance feature, wherein the simplified clearance profile generates the device clearance feature in the Creo.
2. The method for rapidly generating a clearance for a tooling device according to claim 1, wherein: in step S1, the layout information includes contour information and position information; the contour information is coordinates of points on the contour; the position information is the coordinates of the center point of the device or the coordinates of a certain point on the device.
3. The method for rapidly generating a clearance for a tooling device according to claim 1, wherein: step S41 further includes the following sub-steps:
s411: the coordinates of points on the outlines of two adjacent devices in the tooling coordinate system are respectively set as follows:
(Lxi, lyi, lzi), (Mxi, Myi, Mzi), calculating the distance Di between the coordinates of points on two adjacent device contours;
s412: for the adjacent device which is judged in step S411 that two adjacent devices are merged, merging is performed.
4. The method for rapidly generating a tooling device clearance as claimed in claim 3, wherein: s412 further includes the following sub-steps:
s4121: finding the coordinates of two points corresponding to the minimum Dimin of the distance Di between the coordinates of the points on the two device outlines;
s4122: then two end points of the corresponding line ends of the coordinates of the two points on the outline of the adjacent device are found in the step S4121 or obtained;
s4123: the two end points on the line segment obtained in S4122 are projected onto the line segment on the corresponding adjacent device to form an overall outline.
5. The method for rapidly generating the clearance of the tooling device as claimed in claim 1, wherein: step S42 further includes the following sub-steps:
s421: finding the midpoint of the overall outline of the device;
s422: comparing the coordinates of the points on the overall contour of the device with the coordinates of the middle points of the overall contour, and classifying the coordinates of the points on the contour;
s423: expanding or reducing the overall outline of each device in a tool coordinate system;
s424: finally, the overall contour of each device expanded or reduced in the tool coordinate system is obtained.
6. The method for rapidly generating the clearance of the tooling device as recited in claim 1, wherein: step S5 further includes the following sub-steps:
s51: inputting a simplified value;
s52: the simplifying assembly fits the contour points to a straight line or a circular arc to obtain a standard clearance contour;
s53: finding a line segment with the length smaller than the simplified value and two adjacent line segments with the length smaller than the simplified value on the device outline;
s54: deleting the line segments with the length smaller than the simplified value, which are found in the step S52;
s55: and forming a new contour to obtain a simplified clearance contour.
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