CN114808449B - Surface treatment device and method - Google Patents

Surface treatment device and method Download PDF

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Publication number
CN114808449B
CN114808449B CN202111283616.0A CN202111283616A CN114808449B CN 114808449 B CN114808449 B CN 114808449B CN 202111283616 A CN202111283616 A CN 202111283616A CN 114808449 B CN114808449 B CN 114808449B
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gas
treated
treatment device
guide roller
plasma treatment
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CN114808449A (en
Inventor
杜怡君
邓禹
谷琛
周军
樊钰
周松松
吕晓露
方泳皓
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China Electric Power Research Institute Co Ltd CEPRI
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China Electric Power Research Institute Co Ltd CEPRI
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    • DTEXTILES; PAPER
    • D06TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
    • D06MTREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
    • D06M14/00Graft polymerisation of monomers containing carbon-to-carbon unsaturated bonds on to fibres, threads, yarns, fabrics, or fibrous goods made from such materials
    • D06M14/18Graft polymerisation of monomers containing carbon-to-carbon unsaturated bonds on to fibres, threads, yarns, fabrics, or fibrous goods made from such materials using wave energy or particle radiation

Abstract

The invention provides a surface treatment device and a surface treatment method. The device comprises: a first guide roller, a second guide roller, a plasma treatment device and a gas phase grafting treatment device; the first guide roller and the second guide roller are arranged at intervals, the first guide roller conveys the material to be treated, and the second guide roller conveys the treated material to be treated; the plasma treatment device and the gas-phase grafting treatment device are arranged between the first guide roller and the second guide roller at intervals; the plasma treatment device is close to the first guide roller to carry out plasma treatment on the material to be treated; the gas phase grafting treatment device is close to the second guide roller to carry out gas phase grafting polymerization treatment on the material to be treated after plasma treatment. In the invention, the surface of the material to be treated can be etched after plasma treatment, and then the material to be treated is polymerized with the gas grafting reactant, so that the modification effect of etching is effectively prolonged, the surface performance is improved, the long-term modification effect is obtained, and the material to be treated can be kept in a dry state.

Description

Surface treatment device and method
Technical Field
The invention relates to the technical field of material treatment, in particular to a surface treatment device and a surface treatment method.
Background
With the development of science and technology, in the modern society, the variety of composite materials is more and more, the application is wider and wider, and the importance is more and more prominent. In particular, the method has important roles in the high and new technical fields such as aerospace, high-speed railways, national defense and military, biomedicine, electronics and electrics and the like. Some high-performance reinforcing materials (such as aramid fiber and carbon fiber) have high chemical inertness on the surface, so that the bonding capability of the high-performance reinforcing materials with a matrix is poor, and therefore the excellent performance of the composite material cannot be fully exerted.
In order to fully exert the excellent properties of the composite material, surface treatment is required to improve the interfacial bonding condition of the reinforcing material and the matrix. Common surface treatment methods are heat treatment, chemical oxidation, coupling agents, ion sputtering, electron beam, irradiation, corona modification, plasma treatment, and the like. The plasma surface modification technology has the advantages of no influence on the performance of the material body, high treatment efficiency, cleanness, environmental protection and the like, and has wide industrial application prospect. In plasma processing, active species such as positive and negative ions, atoms, ultraviolet radiation, and free radicals collide with molecules on the surface of the material, causing a large number of chemical and physical interactions between the plasma and the surface of the material. However, the modifying effect of the plasma is rapidly reduced with the increase of the storage time, and the effect of the plasma treatment is reduced.
Disclosure of Invention
In view of this, the present invention proposes a surface treatment apparatus, which aims to solve the problem that the modifying effect of plasma treatment in the prior art is reduced with the extension of the storage time. The invention also provides a surface treatment method.
In one aspect, the present invention provides a surface treatment apparatus comprising: a first guide roller, a second guide roller, a plasma treatment device and a gas phase grafting treatment device; the first guide roller is used for receiving and conveying the material to be treated, and the second guide roller is used for receiving and conveying the treated material to be treated; the plasma treatment device and the gas-phase grafting treatment device are arranged between the first guide roller and the second guide roller at intervals; the plasma treatment device is close to the first guide roller and is used for carrying out plasma treatment on the material to be treated; the gas phase grafting treatment device is close to the second guide roller and is used for carrying out gas phase grafting polymerization treatment on the material to be treated after plasma treatment.
Further, in the above surface treatment apparatus, the vapor phase grafting treatment apparatus includes: the reaction kettle and the first gas adjusting mechanism; the reaction kettle is provided with a material inlet and a material outlet through which a material to be treated can pass in a sliding manner, and is also provided with a first air inlet and a second air inlet, wherein the first air inlet is used for conveying a gas grafting reactant into the reaction kettle, the second air inlet is connected with a first gas regulating mechanism, and the first gas regulating mechanism is used for conveying regulating gas into the reaction kettle before conveying the gas grafting reactant so as to enable the reaction kettle to reach a preset atmosphere.
Further, in the surface treatment apparatus, the vapor phase grafting treatment apparatus further includes: a plurality of guide wheels; wherein, each guide wheel is rotatably arranged in the reaction kettle, and each guide wheel is spirally distributed along the height direction of the reaction kettle; the material inlet is arranged near the bottom of the reaction kettle, and the material outlet is arranged near the top of the reaction kettle; the material to be treated is orderly and slidably wound on each guide wheel along the height direction of the reaction kettle in a fold line shape.
Further, in the above surface treatment apparatus, the plasma treatment apparatus includes: a housing, two electrodes, two barrier dielectric layers, and a second gas regulating mechanism; wherein, the shell is provided with an inlet and an outlet through which the material to be treated can slide; the two electrodes are arranged in the shell in parallel, and the material to be treated can pass through the space between the two electrodes in a sliding way; the opposite surfaces of the two electrodes are provided with a blocking dielectric layer, and the two electrodes are connected with a power supply system which is used for applying current to the two electrodes so as to generate plasma between the two blocking dielectric layers; the shell is also provided with an air supply port and an air exhaust port, the air supply port is connected with a second air regulating mechanism, and the second air regulating mechanism is used for conveying regulating air into the shell so as to enable the shell to reach a preset atmosphere; the exhaust port is used for exhausting hot gas containing ozone generated in the plasma treatment process.
Further, in the above surface treatment apparatus, the plasma treatment apparatus further includes: an oxidation reaction chamber; the oxidation reaction cavity is arranged between the plasma treatment device and the gas-phase grafting treatment device, an inlet and an outlet are formed in the oxidation reaction cavity, the material to be treated can pass through the inlet and the outlet in a sliding mode, a gas transmission port is further formed in the oxidation reaction cavity, the gas transmission port is communicated with the gas exhaust port, the oxidation reaction cavity is used for receiving the material to be treated after plasma treatment and hot gas containing ozone, so that the material to be treated after plasma treatment and the ozone perform oxidation reaction, and the material to be treated after the oxidation reaction is output to the gas-phase grafting treatment device.
Further, the surface treatment apparatus further includes: a control device; the gas transmission port is communicated with the gas exhaust port through a pipeline, and the pipeline is provided with a switch valve; the control device is electrically connected with the first gas regulating mechanism, the second gas regulating mechanism and the switch valve and is used for controlling the first gas regulating mechanism to convey regulating gas into the reaction kettle, controlling the second gas regulating mechanism to convey regulating gas into the shell, and controlling the switch valve to be opened so as to convey hot gas containing ozone into the oxidation reaction cavity.
Further, in the surface treatment apparatus, the first gas adjusting mechanism includes: the first gas cylinder is used for storing the regulating gas, the first gas inlet pipe and the first regulating valve; the outlet of the first gas cylinder is communicated with the second gas inlet through a first gas inlet pipe, and a first regulating valve is arranged on the first gas inlet pipe; and/or the second gas regulating mechanism comprises: the second gas cylinder is used for storing the regulating gas, the second gas inlet pipe and the second regulating valve; the outlet of the second gas cylinder is communicated with the gas supply port through a second gas inlet pipe, and a second regulating valve is arranged on the second gas inlet pipe.
Further, the surface treatment apparatus further includes: a speed control mechanism; the speed control mechanism is arranged on the first guide roller or the second guide roller and is used for controlling the conveying speed of the material to be processed.
According to the invention, the material to be treated is conveyed between the first guide roller and the second guide roller, the plasma treatment device carries out plasma treatment on the material to be treated, and the gas phase grafting treatment device carries out gas phase grafting polymerization treatment on the material to be treated after the plasma treatment, so that the surface of the material to be treated can be etched after the plasma treatment, and the material to be treated is polymerized with a gas grafting reactant after the etching, the etched modification effect can be effectively prolonged, the surface performance of the material to be treated is improved, the long-term modification effect is obtained, the problem that the modification effect of the plasma treatment is reduced along with the extension of the storage time in the prior art is solved, the material to be treated can be kept in a dry state in the reaction process, and the material to be treated after the treatment is not required to be cleaned.
In another aspect, the present invention also provides a surface treatment method, which includes the steps of: a regulating step of inputting regulating gas into the plasma processing device and the gas phase grafting processing device respectively so that the plasma processing device and the gas phase grafting processing device reach respective preset atmospheres; an input step of stopping inputting the adjusting gas into the gas-phase grafting treatment device after the gas-phase grafting treatment device reaches a preset atmosphere, and inputting the gas grafting reactant into the gas-phase grafting treatment device; a plasma treatment step of conveying a material to be treated into a plasma treatment device for plasma treatment; a grafting treatment step, namely conveying the material to be treated after plasma treatment into a gas-phase grafting treatment device to carry out gas-phase grafting polymerization treatment with a gas grafting reactant; and a recovery step of recovering the material to be treated after the gas phase graft polymerization treatment.
Further, the surface treatment method further comprises, between the plasma treatment step and the grafting treatment step: an oxidation step, wherein the material to be treated after plasma treatment is subjected to oxidation reaction with ozone generated in the plasma treatment process; in the grafting treatment step, the material to be treated after the oxidation reaction and the gas grafting reactant are subjected to gas-phase grafting polymerization treatment.
In the method, the material to be treated is subjected to plasma treatment, so that the surface of the material to be treated can be etched, and then is subjected to gas phase graft polymerization treatment with a gas graft reactant, the modification effect of etching can be effectively prolonged, the surface property of the material to be treated is improved, the long-term modification effect is obtained, the material to be treated can be kept in a dry state in the reaction process, the advantages of gas phase graft polymerization reaction are fully exerted, the treated material to be treated can be preserved for a long time, the reaction degree is easy to control, the operability is strong, the method can be carried out under normal pressure, and the method is suitable for industrialized popularization.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. Also, like reference numerals are used to designate like parts throughout the figures. In the drawings:
fig. 1 is a schematic structural diagram of a surface treatment apparatus according to an embodiment of the present invention;
fig. 2 is a flowchart of a surface treatment method according to an embodiment of the present invention.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art. It should be noted that, without conflict, the embodiments of the present invention and features of the embodiments may be combined with each other. The invention will be described in detail below with reference to the drawings in connection with embodiments.
Surface treatment apparatus example:
referring to fig. 1, fig. 1 is a schematic structural diagram of a surface treatment apparatus according to an embodiment of the present invention. As shown, the surface treatment apparatus includes: a first guide roller (not shown), a second guide roller (not shown), a plasma processing apparatus 1, and an air-phase grafting processing apparatus 2. The first guiding roller and the second guiding roller are arranged at intervals, the first guiding roller is used for receiving the material 3 to be processed and conveying the material 3 to be processed, specifically, the first guiding roller can receive the material 3 to be processed conveyed by other equipment, and the other equipment can be an unreeling device or other processing devices, so that the embodiment is not limited in any way.
The second guide roller is used for receiving the processed material to be processed 3 and conveying the processed material to be processed 3. Specifically, the treated material 3 is the material 3 to be treated after being subjected to the plasma treatment and the vapor phase graft polymerization treatment. The second guide roller may convey the processed material 3 to other devices, which may be a winding device for storage, or may be other processing devices for further processing, which is not limited in this embodiment.
The plasma processing apparatus 1 and the gas phase grafting processing apparatus 2 are disposed between the first guide roller and the second guide roller with a certain distance between the plasma processing apparatus 1 and the gas phase grafting processing apparatus 2, which can be determined according to the actual situation, and this embodiment is not limited in any way.
The plasma treatment device 1 is close to the first guide roller, and the plasma treatment device 1 is used for carrying out plasma treatment on the material 3 to be treated. The gas phase grafting treatment device 2 is close to the second guide roller, and the gas phase grafting treatment device 2 is used for carrying out gas phase grafting polymerization treatment on the material 3 to be treated after plasma treatment.
In this embodiment, the material 3 to be treated is subjected to plasma treatment and then is subjected to gas-phase graft polymerization treatment, and the surface of the material 3 to be treated is etched by the plasma, so that the radicals on the surface of the material 3 to be treated react with H, O, N and other elements in the gas in the plasma treatment device 1 to form active centers, thereby facilitating the subsequent modification treatment of gas-phase graft polymerization, and meanwhile, the roughness of the surface of the material 3 to be treated is increased after the plasma etching, thereby facilitating the enhancement of the specific surface area of the material 3 to be treated and the subsequent reaction. After the gas phase graft polymerization, the active functional groups on the surface of the material to be treated 3 can be preserved for a long time, so that the effective time of the plasma treatment effect is prolonged. The material 3 to be treated is kept in a dry state in the reaction process, the advantages of the gas phase reaction are fully exerted, the reaction degree is easy to control, the surface of the material 3 to be treated is not easy to accumulate excessive gas grafting reactants, and the surface polymer is not required to be cleaned after the treatment.
In particular, the material 3 to be treated may be continuous filament fibers, fiber fabrics, prepregs, etc.
It can be seen that, in this embodiment, the material 3 to be treated is conveyed between the first guide roller and the second guide roller, the plasma treatment device 1 performs plasma treatment on the material 3 to be treated, and the gas phase grafting treatment device 2 performs gas phase grafting polymerization treatment on the material 3 to be treated after the plasma treatment, so that the surface of the material 3 to be treated can be etched after the plasma treatment, and the material 3 to be treated can be polymerized with a gas grafting reactant after the etching, so that the modification effect of the etching can be effectively prolonged, the surface property of the material 3 to be treated is improved, the long-term modification effect is obtained, the problem that the modification effect of the plasma treatment in the prior art is reduced along with the extension of the storage time is solved, and the material 3 to be treated can be kept in a dry state in the reaction process without cleaning the material 3 to be treated.
With continued reference to fig. 1, in the above embodiment, the vapor phase grafting processing apparatus 2 may include: a reaction kettle 21 and a first gas adjusting mechanism 22. Wherein, the reaction kettle 21 is provided with a material inlet and a material outlet which are used for the material 3 to be treated after plasma treatment to pass through in a sliding way. Since the material to be treated 3 is conveyed between the first guide roller and the second guide roller, the material to be treated 3 after plasma treatment is slidingly introduced into the reaction vessel 21 from the material inlet and is slidingly discharged from the material outlet out of the reaction vessel 21.
The reaction kettle 21 is further provided with a first air inlet and a second air inlet, the first air inlet is used for conveying the gas grafting reactants into the reaction kettle 21, the second air inlet is connected with a first gas regulating mechanism 22, before the first air inlet conveys the gas grafting reactants into the reaction kettle 21, the first gas regulating mechanism 22 is used for conveying regulating gas into the reaction kettle 21 so that the interior of the reaction kettle 21 reaches a preset atmosphere, and thus, the original air in the reaction kettle 21 can be effectively discharged, and the gas phase grafting polymerization reaction is carried out in a proper atmosphere environment.
Specifically, first, the conditioning gas is supplied into the reaction kettle 21 through the first gas conditioning mechanism 22 and the second gas inlet to bring the reaction kettle 21 to a preset atmosphere. After reaching the preset atmosphere, the first gas adjusting mechanism 22 stops conveying the adjusting gas into the reaction kettle 21, conveys the gas grafting reactant into the reaction kettle 21 through the first gas inlet, conveys the material 3 to be treated into the reaction kettle 21 from the material inlet, carries out gas phase grafting polymerization reaction on the material 3 to be treated and the gas grafting reactant, and finally outputs the material 3 to be treated after gas phase grafting polymerization treatment from the material outlet to the reaction kettle 21.
In specific implementation, the preset atmosphere may be determined according to practical situations, which is not limited in this embodiment.
In the concrete implementation, the first air inlet can be communicated with a grafting reactant container through a connecting pipeline, the grafting reactant container stores grafting reactants, and a gas regulating valve is arranged on the connecting pipeline. The vessel for grafting reactants is heated to boiling point, and then the gas regulating valve is opened, and the vapor of grafting reactants, i.e., the gas grafting reactants, is delivered into the reaction vessel 21 through the connecting pipe and the first gas inlet.
Preferably, the first gas regulating mechanism 22 includes: a first air bottle 221, a first air inlet pipe 222 and a first regulating valve 223. The first gas cylinder 221 is used for storing a conditioning gas, which may be nitrogen, argon, or the like. The outlet of the first air bottle 221 is communicated with one end of the first air inlet pipe 222, the other end of the first air inlet pipe 222 is communicated with the second air inlet, and the first regulating valve 223 is arranged on the first air inlet pipe 222. The first gas cylinder 221 supplies the conditioning gas into the reaction vessel 21 through the first gas inlet pipe 222 and the second gas inlet, and the opening and closing of the first control valve 223 controls whether the first gas inlet pipe 222 supplies the conditioning gas into the reaction vessel 21.
Preferably, the vapor phase grafting treatment apparatus 2 further comprises: a plurality of guide wheels 23. Each guide wheel 23 is rotatably disposed in the reaction kettle 21, and each guide wheel 23 is spirally distributed along the height direction (from top to bottom as shown in fig. 1) of the reaction kettle 21. Specifically, each guide wheel 23 is divided into two rows along the height direction of the reaction kettle 21, and each guide wheel 23 in each row is arranged at intervals. In the direction perpendicular to the height direction of the reaction kettle 21, each guide wheel 23 is arranged in a plurality of rows, only one guide wheel 23 is arranged in each row, and the guide wheels 23 in two adjacent rows are staggered, so that each guide wheel 23 is staggered along the height direction of the reaction kettle 21 to form spiral distribution.
The material inlet is opened near the bottom (lower part shown in fig. 1) of the reaction kettle 21, and the material outlet is opened near the top (upper part shown in fig. 1) of the reaction kettle 21. The material 3 to be treated is sequentially and slidably wound around each guide wheel 23 in a zigzag shape along the height direction of the reaction kettle 21, specifically, the material 3 to be treated is sequentially and slidably wound around each guide wheel 23 in the reaction kettle 21 after being input from the material inlet, and is output from the material outlet after being wound. The material 3 to be processed is alternately and continuously arranged between the guide wheels 23 in a penetrating manner along the first direction and the second direction, namely, the material 3 to be processed is orderly wound around the guide wheels 23 along the height direction of the reaction kettle 21 from the guide wheel 23 near the material inlet, so as to form the structure in the reaction kettle 21 in fig. 1. The first direction and the second direction are two opposite directions, and the first direction and the second direction are perpendicular to the height direction of the reaction kettle 21.
Thus, the material inlet is arranged at the bottom of the reaction kettle 21, the material outlet is arranged at the top of the reaction kettle 21, the material 3 to be treated slides back and forth between the guide wheels 23, the residence time of the material 3 to be treated in the reaction kettle 21 can be effectively prolonged, namely, the gas phase grafting polymerization reaction time is prolonged, the material 3 to be treated can be fully and effectively subjected to gas phase grafting polymerization reaction with the gas grafting reactant in the reaction kettle 21, the etching modification effect is further effectively prolonged, and the surface property of the material 3 to be treated is improved.
It can be seen that in this embodiment, the vapor phase grafting treatment device 2 has a simple structure, is convenient to implement, and can ensure that the material 3 to be treated and the gas grafting reactant undergo sufficient vapor phase grafting polymerization reaction, thereby effectively prolonging the modification effect of etching.
With continued reference to fig. 1, in the above embodiments, the plasma processing apparatus 1 includes: a housing 11, two electrodes 12, two barrier dielectric layers 13 and a second gas regulating mechanism 14. Wherein the housing 11 is provided with an inlet and an outlet for slidably receiving the material 3 to be treated. Since the material to be treated 3 is conveyed between the first guide roller and the second guide roller, the material to be treated 3 is slidingly introduced into the housing 11 from the inlet and is slidingly discharged from the housing 11 from the outlet.
The two electrodes 12 are arranged in parallel in the housing 11, a certain distance is provided between the two electrodes 12, and the material 3 to be treated is slidably arranged between the two electrodes 12. Specifically, the inlet and the outlet correspond to the gaps between the two electrodes 12, respectively, and the material 3 to be treated can be directly fed from the inlet into the housing 11 from between the two electrodes 12 and then discharged from the outlet into the housing 11.
In particular, referring to fig. 1, the casing 11 may be rectangular, the inlet and the outlet may be formed on two opposite side walls of the casing 11, the two electrodes 12 respectively correspond to two opposite side walls in the casing 11, and the side walls of the two electrodes 12 and the side walls of the inlet and the outlet are four adjacent side walls. That is, with respect to fig. 1, the two electrodes 12 correspond to the upper and lower sidewalls of the case 11, respectively, and the inlet and outlet correspond to the left and right sidewalls of the case 11, respectively, and then the inlet and outlet are disposed at the left and right sides of the two electrodes 12, respectively, and correspond to the gap between the two electrodes 12.
In practice, the distance between the two electrodes 12 may be determined according to practical situations, and this embodiment is not limited in any way.
The opposite surfaces of the two electrodes 12 are provided with a blocking dielectric layer 13, and a certain gap is still reserved between the two blocking dielectric layers 13, so that the material 3 to be treated can be slidably penetrated. Both electrodes 12 are connected to a power supply system for applying a current to both electrodes 12 so that a plasma is generated between the two barrier dielectric layers 13, and the material 3 to be treated is treated by the generated plasma when the material 3 to be treated is passed between the two barrier dielectric layers 13.
In practice, when a high voltage and high frequency pulse current is applied to the two electrodes 12 by the power supply system, a micro-channel discharge is generated between the two barrier dielectric layers 13, so that plasma is generated, and the plasma is used for plasma treatment of the material 3 to be treated, and ozone is generated in the process.
The housing 11 is further provided with an air supply port and an air exhaust port, the air supply port is connected with a second air adjusting mechanism 14, and the second air adjusting mechanism 14 is used for conveying adjusting air into the housing 11 so as to enable the interior of the housing 11 to reach a preset atmosphere. The exhaust port is used to exhaust hot gas containing ozone generated during the plasma treatment process to prevent overheating of the electrode 12.
Specifically, the conditioning gas is first supplied into the housing 11 through the second gas conditioning mechanism 14 and the gas supply port to bring the housing 11 to a preset atmosphere. After reaching the preset atmosphere, the second gas regulating mechanism 14 continuously supplies the regulating gas into the housing 11 through the gas supply port, and performs plasma treatment on the material 3 to be treated.
In specific implementation, the preset atmosphere may be determined according to practical situations, which is not limited in this embodiment.
In practice, the exhaust port of the housing 11 may be in communication with an inlet of the exhaust device 15, and the exhaust device 15 is configured to extract the hot gas in the housing 11 and output the hot gas. The hot gas contains ozone. In this way, the hot air in the case 11 is discharged, and the cooling effect can be achieved, thereby avoiding overheating of the electrode 12 in the case 11.
Preferably, the second gas regulating mechanism 14 includes: a second gas cylinder 141, a second gas inlet pipe 142, and a second regulating valve 143. The second gas cylinder 141 is used for storing a conditioning gas, which may be nitrogen, argon, or the like. The outlet of the second gas cylinder 141 is connected to one end of the second gas inlet pipe 142, the other end of the second gas inlet pipe 142 is connected to the gas supply port, and the second regulating valve 143 is provided in the second gas inlet pipe 142. The second gas cylinder 141 feeds the regulated gas into the housing 11 through the second gas inlet pipe 142 and the gas supply port, and the opening and closing of the second regulating valve 143 controls whether the second gas inlet pipe 142 feeds the regulated gas into the housing 11. By supplying the conditioning gas into the housing 11 in this way, the air existing in the housing 11 can be exhausted, and the plasma treatment process can be performed in a proper atmosphere.
It can be seen that in this embodiment, the plasma processing apparatus 1 has a simple structure and is easy to implement.
With continued reference to fig. 1, in the foregoing embodiment, the surface treatment apparatus further includes: an oxidation reaction chamber 6. Wherein the oxidation reaction chamber 6 is disposed between the plasma processing apparatus 1 and the vapor phase grafting processing apparatus 2. The oxidation reaction chamber 6 is provided with an inlet and an outlet, and the inlet and the outlet are used for allowing the material 3 to be treated after plasma treatment to pass through in a sliding manner, namely, the material 3 to be treated enters the shell 11 in a sliding manner from the inlet and then is output from the shell 11 in a sliding manner from the outlet.
The oxidation reaction cavity 6 is further provided with a gas transmission port, the gas transmission port is communicated with the gas exhaust port of the shell 11, and the oxidation reaction cavity 6 is used for receiving the material 3 to be treated after plasma treatment and hot gas containing ozone and output by the gas exhaust port, so that the material 3 to be treated after plasma treatment and ozone perform oxidation reaction, and the material 3 to be treated after oxidation reaction is output to the gas phase grafting treatment device 2. Specifically, the material 3 to be treated is first input into the housing 11 for plasma treatment, and the material 3 to be treated after the plasma treatment is conveyed into the oxidation reaction chamber 6. In addition, the hot gas containing ozone generated in the plasma treatment process is also conveyed into the oxidation reaction cavity 6, so that the material 3 to be treated and the ozone in the hot gas are subjected to oxidation reaction in the oxidation reaction cavity 6. The material 3 to be treated after the oxidation reaction is conveyed to the gas-phase grafting treatment device 2, and the material 3 to be treated after the oxidation reaction and the gas-phase grafting reactant are subjected to gas-phase grafting polymerization.
In practice, the gas delivery port communicates with the outlet of the exhaust device 15, and the exhaust device 15 extracts the hot gas in the housing 11 and delivers the hot gas into the oxidation reaction chamber 6.
It can be seen that, in this embodiment, the hot gas generated in the plasma treatment process is conveyed into the oxidation reaction cavity 6, and the ozone in the hot gas and the material to be treated 3 after the plasma treatment perform an oxidation reaction, so that the surface of the material to be treated 3 generates oxygen-containing functional groups, which can effectively increase the surface performance of the material to be treated 3, improve the wettability, further facilitate the modification treatment of the subsequent gas phase graft polymerization, improve the modification treatment effect of the material to be treated 3, and recycle the exhaust gas discharged from the housing 11, improve the energy utilization rate, and simultaneously perform the cooling function on the housing 11, and avoid the overheating of the electrode 12.
Preferably, the first gas regulating mechanism 22 includes: a first gas bottle 221 for storing a regulated gas, a first gas inlet pipe 222, and a first regulating valve 223; the outlet of the first air bottle 221 is communicated with the second air inlet through a first air inlet pipe 222, and a first regulating valve 223 is arranged on the first air inlet pipe 222; and/or the second gas regulating mechanism 14 includes: a second gas cylinder 141 for storing a regulated gas, a second gas inlet pipe 142, and a second regulating valve 143; the outlet of the second gas cylinder 141 is communicated with the gas supply port through a second gas inlet pipe 142, and a second regulating valve 143 is provided to the second gas inlet pipe 142.
In the above embodiment, the surface treatment apparatus may further include: and a control device 4. Wherein, the gas delivery port is communicated with the gas exhaust port through a pipeline, and the pipeline is provided with a switch valve. The control device 4 is electrically connected with the first gas adjusting mechanism 22, the second gas adjusting mechanism 14 and the switch valve, and the control device 4 is used for controlling the first gas adjusting mechanism 22 to convey the adjusting gas into the reaction kettle 21, simultaneously controlling the second gas adjusting mechanism 14 to convey the adjusting gas into the shell 11, and controlling the switch valve to be opened to convey the hot gas containing ozone into the oxidation reaction cavity 6.
Specifically, the control device 4 is electrically connected to the first control valve 223, the second control valve 143, and the on-off valve, and the control device 4 determines whether to supply the control gas into the reaction vessel 21 by controlling the opening and closing of the first control valve 223, determines whether to supply the control gas into the casing 11 by controlling the opening and closing of the second control valve 143, and determines whether to supply the hot gas into the oxidation reaction chamber 6 by controlling the opening and closing of the on-off valve.
It can be seen that in this embodiment, the control device 4 controls the first gas adjusting mechanism 22, the second gas adjusting mechanism 14 and the on-off valve, so that automatic control is realized, the reaction degree is convenient to control, manual control is not needed, and simplicity and convenience are achieved.
In the above embodiments, the surface treatment apparatus may further include: a speed control mechanism 5. Wherein the speed control mechanism 5 is provided at the first guide roller or the second guide roller, and the speed control mechanism 5 is used for controlling the conveying speed of the material 3 to be processed. In this way, the conveyance speed of the material to be processed 3 can be accurately controlled, ensuring that the material to be processed 3 is stably conveyed.
In particular, the speed control mechanism 5 may be further electrically connected to the control device 4, where the control device 4 is configured to control the speed control mechanism 5 to adjust the conveying speed of the material 3 to be processed.
In particular, the speed control mechanism 5 may comprise: the servo motor is connected with the first guide roller to drive the first guide roller to rotate, and then the material 3 to be processed is conveyed. The displacement sensor detects the conveying speed of the material to be processed 3, the displacement sensor is electrically connected with the control device 4, and the control device 4 controls the driving of the servo motor to the first guide roller according to the detected conveying speed of the material to be processed 3.
In particular, the surface treatment device may further include: and displaying an interface. The speed control mechanism 5, the power supply system, the first regulating valve 223, the second regulating valve 143, and the on-off valve are monitored and controlled through the display interface.
In summary, in this embodiment, after plasma treatment, etching can be performed on the surface of the material to be treated 3, and polymerization treatment is performed with the gas grafting reactant after etching, so that the modification effect of etching can be effectively prolonged, the surface performance of the material to be treated 3 is improved, a long-term modification effect is obtained, and the material to be treated 3 can be kept in a dry state in the reaction process without cleaning the treated material to be treated 3. The device can give full play to the advantages of the gas phase graft polymerization reaction, can also ensure that the treated material 3 to be treated is preserved for a long time, has easy control of the reaction degree and strong operability, can be carried out under normal pressure, and is suitable for industrialized popularization.
Surface treatment method example:
the embodiment also provides a surface treatment method, which is a treatment method performed by the surface treatment device. Referring to fig. 2, the surface treatment method includes the steps of:
and a regulating step S1, wherein regulating gases are respectively input into the plasma treatment device and the gas phase grafting treatment device so that the plasma treatment device and the gas phase grafting treatment device reach respective preset atmospheres.
In specific implementation, the respective preset atmospheres may be determined according to actual situations, which is not limited in this embodiment.
The structures of the plasma processing apparatus and the vapor phase grafting processing apparatus are described in the above embodiments of the surface processing apparatus, and the embodiments are not described herein.
Specifically, the control device 4 simultaneously controls the first regulating valve 223 and the second regulating valve 143 to be opened, the first gas cylinder 221 supplies the regulating gas into the reaction kettle 21 in the vapor phase grafting processing device 2 so that the inside of the reaction kettle 21 reaches a preset atmosphere, and the second gas cylinder 141 supplies the regulating gas into the housing 11 in the plasma processing device so that the inside of the housing 11 reaches the preset atmosphere.
And S2, stopping inputting the regulating gas into the gas-phase grafting treatment device after the gas-phase grafting treatment device reaches the preset atmosphere, and inputting the gas grafting reactant into the gas-phase grafting treatment device.
Specifically, when the inside of the reaction kettle 21 reaches the preset atmosphere, the control device 4 controls the first regulating valve 223 to be closed, i.e., stops the input of the regulating gas to the reaction kettle 21. Then, the first gas inlet is opened, and the gas grafting reactant is introduced into the reaction vessel 21.
And a plasma treatment step S3, conveying the material to be treated into a plasma treatment device for plasma treatment.
Specifically, the material 3 to be treated is input into the housing 11 from the inlet of the housing 11, then the material 3 to be treated is slidably disposed between the two electrodes 12, and after the high voltage and high frequency pulse current is applied to the power supply system, the two electrodes 12 generate micro-channel discharge between the two barrier dielectric layers 13 between the two electrodes 12, so as to generate plasma, and the plasma performs plasma treatment on the material 3 to be treated, so that ozone is generated in the process.
And S4, conveying the material to be treated after plasma treatment to a gas-phase grafting treatment device to carry out gas-phase grafting polymerization treatment with a gas grafting reactant.
Specifically, the material 3 to be treated after plasma treatment is conveyed into the reaction kettle 21, and the material 3 to be treated and the gas grafting reactant undergo gas phase graft polymerization reaction.
And S5, recycling the material to be treated after the gas-phase graft polymerization treatment.
Specifically, the material to be treated 3 after the gas-phase graft polymerization treatment is conveyed by a guide roller and then recovered or subjected to the next treatment, which is not limited in any way in this example.
It can be seen that in this embodiment, the material to be treated is subjected to plasma treatment, so that etching can be performed on the surface of the material to be treated, and gas-phase graft polymerization treatment is performed with the gas-phase graft reactant after etching, so that the modification effect of etching can be effectively prolonged, the surface performance of the material to be treated is improved, a long-term modification effect is obtained, the material to be treated can be kept in a dry state in the reaction process, the advantages of gas-phase graft polymerization reaction are fully exerted, long-term storage of the treated material to be treated can be ensured, the reaction degree is easy to control, the operability is strong, and the method can be performed under normal pressure, and is suitable for industrial popularization.
In the above embodiment, between the plasma treatment step S3 and the grafting treatment step S4, further included are:
and S6, carrying out oxidation reaction on the material to be treated after the plasma treatment and ozone generated in the plasma treatment process.
Specifically, the material 3 to be treated is first input into the housing 11 for plasma treatment, and the material 3 to be treated after the plasma treatment is conveyed into the oxidation reaction chamber 6. In addition, the hot gas containing ozone generated in the plasma treatment process is also conveyed into the oxidation reaction cavity 6, so that the material 3 to be treated and the ozone in the hot gas are subjected to oxidation reaction in the oxidation reaction cavity 6.
The structure of the oxidation reaction chamber 6 may be referred to the above description of the embodiment of the surface treatment apparatus, and this embodiment is not described herein.
In the grafting treatment step S4, the material to be treated after the oxidation reaction and the gas grafting reactant are subjected to gas-phase grafting polymerization treatment.
Specifically, the material 3 to be treated after the oxidation reaction is conveyed to the gas-phase grafting treatment device 2, and the material 3 to be treated after the oxidation reaction and the gas-phase grafting reactant undergo gas-phase grafting polymerization reaction.
It can be seen that in this embodiment, the oxidation reaction is performed on the ozone in the hot gas generated in the plasma treatment process and the material to be treated after the plasma treatment, so that the oxygen-containing functional group is generated on the surface of the material to be treated, which can effectively increase the surface performance of the material to be treated, improve the wettability, further facilitate the modification treatment of the subsequent gas phase graft polymerization, improve the modification treatment effect of the material to be treated, and recycle the exhaust gas discharged in the plasma treatment process, thereby improving the energy utilization rate.
The principle of the surface treatment apparatus and the surface treatment method in the present invention is the same, and the relevant points can be referred to each other.
It should be noted that, in the description of the present invention, terms such as "upper," "lower," "left," "right," "inner," "outer," and the like indicate directions or positional relationships based on the directions or positional relationships shown in the drawings, which are merely for convenience of description, and do not indicate or imply that the apparatus or elements must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.
Furthermore, it should be noted that, in the description of the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention can be understood by those skilled in the art according to the specific circumstances.
It will be apparent to those skilled in the art that various modifications and variations can be made to the present invention without departing from the spirit or scope of the invention. Thus, it is intended that the present invention also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.

Claims (7)

1. A surface treatment method characterized by comprising the steps of:
a regulating step of inputting regulating gas into the plasma processing device and the gas phase grafting processing device respectively so that the plasma processing device and the gas phase grafting processing device reach respective preset atmospheres;
an input step of stopping inputting the adjusting gas into the gas-phase grafting treatment device after the gas-phase grafting treatment device reaches a preset atmosphere, and inputting a gas grafting reactant into the gas-phase grafting treatment device;
a plasma treatment step of conveying a material to be treated into the plasma treatment device for plasma treatment;
an oxidation step, wherein the material to be treated after plasma treatment is subjected to oxidation reaction with ozone generated in the plasma treatment process;
a grafting treatment step, namely carrying out gas-phase grafting polymerization treatment on the material to be treated after the oxidation reaction and the gas grafting reactant;
a recovery step of recovering the material to be treated after the gas phase graft polymerization treatment;
the material to be treated comprises: continuous filament fibers, fibrous fabrics, and prepregs.
2. A surface treatment apparatus using the surface treatment method according to claim 1, comprising: the device comprises a first guide roller, a second guide roller, a plasma treatment device (1), a gas phase grafting treatment device (2) and an oxidation reaction cavity (6); wherein,
the first guide roller and the second guide roller are arranged at intervals, the first guide roller is used for receiving and conveying the material (3) to be processed, and the second guide roller is used for receiving and conveying the processed material (3) to be processed; the material to be treated (3) comprises: continuous filament fibers, fibrous fabrics, and prepregs;
the plasma treatment device (1) and the gas-phase grafting treatment device (2) are arranged between the first guide roller and the second guide roller at intervals;
the plasma treatment device (1) is close to the first guide roller and is used for carrying out plasma treatment on the material (3) to be treated;
the gas-phase grafting treatment device (2) is close to the second guide roller and is used for carrying out gas-phase grafting polymerization treatment on the material (3) to be treated after plasma treatment;
the vapor phase grafting treatment device (2) comprises: a reaction kettle (21) and a first gas adjusting mechanism (22); the reaction kettle (21) is provided with a material inlet and a material outlet through which the material (3) to be treated can slide, the reaction kettle (21) is also provided with a first air inlet and a second air inlet, the second air inlet is connected with the first gas regulating mechanism (22), and the first gas regulating mechanism (22) is used for conveying regulating gas into the reaction kettle (21) before conveying the gas grafting reactant so as to enable the reaction kettle (21) to reach a preset atmosphere and stopping conveying the regulating gas after reaching the preset atmosphere; the first air inlet is used for conveying a gas grafting reactant into the reaction kettle (21) after reaching a preset atmosphere;
the plasma processing apparatus (1) includes: a housing (11); the shell (11) is provided with an exhaust port which is used for exhausting hot gas containing ozone generated in the plasma treatment process;
the oxidation reaction cavity (6) is arranged between the plasma treatment device (1) and the gas-phase grafting treatment device (2), an inlet and an outlet which are used for the material (3) to be treated to pass through in a sliding way are formed in the oxidation reaction cavity (6), a gas transmission port is formed in the oxidation reaction cavity (6), the gas transmission port is communicated with the gas exhaust port, the oxidation reaction cavity (6) is used for receiving the material (3) to be treated after plasma treatment and hot gas containing ozone, so that the material (3) to be treated after plasma treatment and the ozone perform oxidation reaction, and the material (3) to be treated after the oxidation reaction is output to the gas-phase grafting treatment device (2), so that oxygen-containing functional groups are generated on the surface of the material (3) to be treated, the surface performance of the material (3) to be treated is further improved, and the wettability is improved.
3. The surface treatment device according to claim 2, wherein the vapor phase grafting treatment device (2) further comprises: a plurality of guide wheels (23); wherein,
each guide wheel (23) is rotatably arranged in the reaction kettle (21), and each guide wheel (23) is spirally distributed along the height direction of the reaction kettle (21);
the material inlet is formed near the bottom of the reaction kettle (21), and the material outlet is formed near the top of the reaction kettle (21); the material (3) to be treated is orderly and slidably wound on each guide wheel (23) along the height direction of the reaction kettle (21) in a fold line shape.
4. A surface treatment device according to claim 2 or 3, characterized in that the plasma treatment device (1) further comprises: two electrodes (12), two barrier dielectric layers (13) and a second gas regulating mechanism (14); wherein,
the shell (11) is provided with an inlet and an outlet through which the material (3) to be treated can slide;
the two electrodes (12) are arranged in the shell (11) in parallel, and the material (3) to be treated is slidably penetrated between the two electrodes (12);
-the opposite surfaces of the two electrodes (12) are each provided with a layer of said blocking dielectric (13), and-the two electrodes (12) are each adapted to be connected to a power supply system for applying a current to the two electrodes (12) so as to generate a plasma between the two blocking dielectric layers (13);
the shell (11) is also provided with an air supply port, the air supply port is connected with the second air regulating mechanism (14), and the second air regulating mechanism (14) is used for conveying regulating air into the shell (11) so as to enable the shell (11) to reach a preset atmosphere.
5. The surface treatment device according to claim 4, further comprising: a control device (4); wherein,
the gas transmission port is communicated with the gas exhaust port through a pipeline, and the pipeline is provided with a switch valve;
the control device (4) is electrically connected with the first gas regulating mechanism (22), the second gas regulating mechanism (14) and the switch valve, and is used for controlling the first gas regulating mechanism (22) to convey regulating gas into the reaction kettle (21), controlling the second gas regulating mechanism (14) to convey regulating gas into the shell (11), and controlling the switch valve to be opened so as to convey hot gas containing ozone into the oxidation reaction cavity.
6. A surface treatment apparatus according to claim 4, wherein,
the first gas regulating mechanism (22) includes: a first gas bottle (221) for storing a regulated gas, a first gas inlet pipe (222) and a first regulating valve (223); the outlet of the first gas cylinder (221) is communicated with the second gas inlet through the first gas inlet pipe (222), and the first regulating valve (223) is arranged on the first gas inlet pipe (222); and/or the number of the groups of groups,
the second gas regulating mechanism (14) includes: a second gas cylinder (141) for storing a regulating gas, a second gas inlet pipe (142) and a second regulating valve (143); the outlet of the second gas cylinder (141) is communicated with the gas supply port through the second gas inlet pipe (142), and the second regulating valve (143) is arranged on the second gas inlet pipe (142).
7. The surface treatment device according to claim 2, further comprising: a speed control mechanism (5); wherein,
the speed control mechanism (5) is arranged on the first guide roller or the second guide roller and is used for controlling the conveying speed of the material (3) to be processed.
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CN1108712A (en) * 1994-03-17 1995-09-20 上海市纺织科学研究院 Low-temp. plasma-treating technology for wool fiber material and apparatus thereof
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CN110761067A (en) * 2019-10-30 2020-02-07 中国人民解放军空军工程大学 Carbon fiber surface continuous treatment method and device based on normal-pressure DBD discharge
CN216338714U (en) * 2021-11-01 2022-04-19 中国电力科学研究院有限公司 Surface treatment device

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CN1108712A (en) * 1994-03-17 1995-09-20 上海市纺织科学研究院 Low-temp. plasma-treating technology for wool fiber material and apparatus thereof
JP2009120785A (en) * 2007-11-19 2009-06-04 Fuji Heavy Ind Ltd Surface treatment method and surface treatment apparatus
CN101831079A (en) * 2009-03-13 2010-09-15 中国纺织科学研究院 Method and device for modifying surface of polymer material
CN110761067A (en) * 2019-10-30 2020-02-07 中国人民解放军空军工程大学 Carbon fiber surface continuous treatment method and device based on normal-pressure DBD discharge
CN216338714U (en) * 2021-11-01 2022-04-19 中国电力科学研究院有限公司 Surface treatment device

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