CN114806469B - Waterproof type single-component tile back adhesive and preparation method thereof - Google Patents
Waterproof type single-component tile back adhesive and preparation method thereof Download PDFInfo
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- CN114806469B CN114806469B CN202210089745.4A CN202210089745A CN114806469B CN 114806469 B CN114806469 B CN 114806469B CN 202210089745 A CN202210089745 A CN 202210089745A CN 114806469 B CN114806469 B CN 114806469B
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- 239000000853 adhesive Substances 0.000 title claims abstract description 44
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 44
- 238000002360 preparation method Methods 0.000 title abstract description 10
- 239000000839 emulsion Substances 0.000 claims abstract description 77
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 45
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 39
- 239000004593 Epoxy Substances 0.000 claims abstract description 26
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 18
- 239000012752 auxiliary agent Substances 0.000 claims abstract description 18
- 239000003822 epoxy resin Substances 0.000 claims abstract description 17
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 17
- 239000013530 defoamer Substances 0.000 claims abstract description 15
- 239000007822 coupling agent Substances 0.000 claims abstract description 8
- 239000003112 inhibitor Substances 0.000 claims abstract description 8
- -1 demulsifier Substances 0.000 claims abstract description 7
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 claims description 22
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 12
- 229910001870 ammonium persulfate Inorganic materials 0.000 claims description 11
- 239000000178 monomer Substances 0.000 claims description 11
- 230000001804 emulsifying effect Effects 0.000 claims description 9
- 230000003449 preventive effect Effects 0.000 claims description 9
- 238000003756 stirring Methods 0.000 claims description 9
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 8
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 8
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 claims description 7
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 7
- 239000002518 antifoaming agent Substances 0.000 claims description 7
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 claims description 7
- 239000003795 chemical substances by application Substances 0.000 claims description 7
- 125000002091 cationic group Chemical group 0.000 claims description 6
- 238000006243 chemical reaction Methods 0.000 claims description 6
- 239000003995 emulsifying agent Substances 0.000 claims description 6
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 5
- 238000007599 discharging Methods 0.000 claims description 5
- GVGUFUZHNYFZLC-UHFFFAOYSA-N dodecyl benzenesulfonate;sodium Chemical compound [Na].CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVGUFUZHNYFZLC-UHFFFAOYSA-N 0.000 claims description 5
- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 claims description 5
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 claims description 4
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 claims description 4
- UIIMBOGNXHQVGW-DEQYMQKBSA-M Sodium bicarbonate-14C Chemical compound [Na+].O[14C]([O-])=O UIIMBOGNXHQVGW-DEQYMQKBSA-M 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- DAFHKNAQFPVRKR-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylpropanoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)C DAFHKNAQFPVRKR-UHFFFAOYSA-N 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 3
- 238000001914 filtration Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 claims description 2
- 239000000654 additive Substances 0.000 claims description 2
- 230000000996 additive effect Effects 0.000 claims description 2
- 238000002156 mixing Methods 0.000 claims description 2
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 claims description 2
- 229940051841 polyoxyethylene ether Drugs 0.000 claims description 2
- 229920000056 polyoxyethylene ether Polymers 0.000 claims description 2
- 235000017557 sodium bicarbonate Nutrition 0.000 claims description 2
- 229910000030 sodium bicarbonate Inorganic materials 0.000 claims description 2
- 240000007263 Pinus koraiensis Species 0.000 claims 1
- 235000011615 Pinus koraiensis Nutrition 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 238000001035 drying Methods 0.000 abstract description 10
- 238000010276 construction Methods 0.000 abstract description 4
- 239000000919 ceramic Substances 0.000 description 12
- RNMDNPCBIKJCQP-UHFFFAOYSA-N 5-nonyl-7-oxabicyclo[4.1.0]hepta-1,3,5-trien-2-ol Chemical compound C(CCCCCCCC)C1=C2C(=C(C=C1)O)O2 RNMDNPCBIKJCQP-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 238000010521 absorption reaction Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- YRIUSKIDOIARQF-UHFFFAOYSA-N dodecyl benzenesulfonate Chemical compound CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 YRIUSKIDOIARQF-UHFFFAOYSA-N 0.000 description 4
- 229940071161 dodecylbenzenesulfonate Drugs 0.000 description 4
- 102100026735 Coagulation factor VIII Human genes 0.000 description 3
- 101000911390 Homo sapiens Coagulation factor VIII Proteins 0.000 description 3
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 3
- 239000011449 brick Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 description 2
- 229910052921 ammonium sulfate Inorganic materials 0.000 description 2
- 235000011130 ammonium sulphate Nutrition 0.000 description 2
- 238000007334 copolymerization reaction Methods 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 239000013022 formulation composition Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 125000004368 propenyl group Chemical group C(=CC)* 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- AEQDJSLRWYMAQI-UHFFFAOYSA-N 2,3,9,10-tetramethoxy-6,8,13,13a-tetrahydro-5H-isoquinolino[2,1-b]isoquinoline Chemical compound C1CN2CC(C(=C(OC)C=C3)OC)=C3CC2C2=C1C=C(OC)C(OC)=C2 AEQDJSLRWYMAQI-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 229910021536 Zeolite Inorganic materials 0.000 description 1
- CNLWCVNCHLKFHK-UHFFFAOYSA-N aluminum;lithium;dioxido(oxo)silane Chemical compound [Li+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O CNLWCVNCHLKFHK-UHFFFAOYSA-N 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000872 buffer Substances 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 239000011083 cement mortar Substances 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 150000002148 esters Chemical group 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- JPMIIZHYYWMHDT-UHFFFAOYSA-N octhilinone Chemical group CCCCCCCCN1SC=CC1=O JPMIIZHYYWMHDT-UHFFFAOYSA-N 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229920005646 polycarboxylate Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- 230000002335 preservative effect Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000001932 seasonal effect Effects 0.000 description 1
- 229910021487 silica fume Inorganic materials 0.000 description 1
- 239000000176 sodium gluconate Substances 0.000 description 1
- 235000012207 sodium gluconate Nutrition 0.000 description 1
- 229940005574 sodium gluconate Drugs 0.000 description 1
- 229910052642 spodumene Inorganic materials 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J151/08—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The application discloses a waterproof type single-component tile back adhesive and a preparation method thereof, and relates to the technical field of tile back adhesives. The water-resistant single-component tile adhesive comprises the following components: epoxy modified acrylic emulsion, aqueous tackifying emulsion, demulsifier, coupling agent, defoamer, film-forming auxiliary agent and mildew inhibitor. The single-component tile back adhesive product with good water resistance, high drying speed, high bonding strength and strong initial viscosity is prepared by modifying the acrylic emulsion by adopting epoxy resin and matching with components such as demulsifier, tackifying emulsion and silane coupling agent, so that the problems of poor water resistance and slow drying of the single-component tile back adhesive are solved, the tile hollowing and falling risks of the tile caused by poor water resistance are reduced, and the construction efficiency of workers is improved.
Description
Technical Field
The application relates to the technical field of tile back glue, in particular to a waterproof single-component tile back glue and a preparation method thereof.
Background
With the rapid development of the ceramic tile industry, a large number of ceramic tiles with low water absorption, even zero water absorption and large size, such as ceramic sheets, vitrified tiles, polished tiles and the like, rapidly appear in recent years, and ceramic tile paving materials also develop from cement mortar to ceramic tile adhesives and ceramic tile back adhesives. The polished tiles, vitrified tiles and other tiles have low water absorption, smooth and compact bonding surfaces, the conventional paving materials and modes are difficult to meet the actual tile paving requirements, and the tiles have high strength, are sensitive to temperature change and have different thermal expansion coefficients with cement, so that the tiles with larger specifications are subjected to temperature difference stress after being paved, the bonding effect of the tiles and the bonding materials is damaged due to seasonal temperature difference oscillation, and the problems of hollowing and falling of the tiles are caused.
The tile back adhesive is an interface treatment product used for the back of a tile during tile paving, plays roles of enhancing the bonding performance between a tile bonding material and the tile and preventing the tile from falling off, and is mainly divided into single-component emulsion back adhesive and double-component back adhesive. The single-component emulsion type back adhesive is widely accepted by market consumers due to the characteristics of convenient use, good brick drop prevention effect, low cost and the like. Unlike common adhesive, the tile back adhesive is specially applied to the back treatment of wet-pasted tiles, and is also suitable for stone with low water absorption, compact texture and smooth surface.
Chinese patent application CN201811024678.8 discloses a tile back adhesive, a preparation method and a use method thereof, wherein the tile back adhesive comprises 36 weight percent of acrylic emulsion, 1.25 weight percent of vinyl trimethoxy silane, 0.3 weight percent of thickener, 0.4 weight percent of polycarboxylate water reducer, 0.05 weight percent of pH regulator, 0.2 weight percent of defoamer, 0.3 weight percent of dispersant, 0.4 weight percent of preservative, 0.3 weight percent of antistatic agent, 20 weight percent of silica fume, 0.5 weight percent of polyethylene oxide, 15 weight percent of zeolite powder, 25 weight percent of spodumene powder and 0.3 weight percent of sodium gluconate; the ceramic tile back adhesive provided by the application adopts a chemical bonding principle, has strong bonding force and enough flexibility, is enough to resist damage caused by climate change and slight vibration of a high-rise building, and can enable ceramic tiles to be permanently and firmly bonded; the current situation that the intensity of the ceramic tile adhesive is poor due to the change of the temperature and the external environment of the ceramic tile adhesive in the market is improved.
The single-component tile back adhesive in the prior art is mainly prepared from an acrylic emulsion with low Tg (glass transition temperature is less than-20 ℃) and an auxiliary agent, and has the defects of low bonding strength, high water absorption, poor water resistance and the like, and particularly when the single-component tile back adhesive is used for paving tiles in a high-humidity environment for a long time, the bonding strength is reduced, so that the tiles are empty and fall off. In addition, the emulsion type back adhesive has slow drying rate, and especially in low-temperature or high-humidity environment, the construction efficiency is seriously affected.
In view of the above, the application provides a preparation method of a single-component tile adhesive-backed product which can be used for tile paving in a long-term high-humidity environment. The single-component tile back adhesive product with good water resistance, high drying speed, high bonding strength and strong initial viscosity is prepared by modifying the acrylic emulsion by adopting epoxy resin and matching with components such as demulsifier, tackifying emulsion and silane coupling agent, so that the problems of poor water resistance and slow drying of the single-component tile back adhesive are solved, the tile hollowing and falling risks of the tile caused by poor water resistance are reduced, and the construction efficiency of workers is improved.
Disclosure of Invention
The application aims to provide a waterproof type single-component tile back adhesive and a preparation method thereof.
In order to achieve the above object, the present application has the following technical scheme:
in one aspect, the application provides a water-resistant single-component tile adhesive backing, comprising the following components: epoxy modified acrylic emulsion, aqueous tackifying emulsion, demulsifier, coupling agent, defoamer, film-forming auxiliary agent and mildew inhibitor.
Preferably, the composition comprises the following components in parts by weight: 80-100 parts of epoxy modified acrylic emulsion, 3-20 parts of aqueous tackifying emulsion, 0.1-1 part of demulsifier, 0.05-0.5 part of silane coupling agent, 0.1-1 part of defoamer, 0.3-1 part of film forming auxiliary agent and 0.1-0.8 part of mildew preventive.
Further preferably, the composition comprises the following components in parts by weight: 85-95 parts of epoxy modified acrylic emulsion, 5-15 parts of aqueous tackifying emulsion, 0.5 part of demulsifier, 0.1-0.3 part of silane coupling agent, 0.3-0.6 part of defoamer, 0.5-1 part of film forming auxiliary agent and 0.2 part of mildew preventive.
Most preferably, the composition comprises the following components in parts by weight: 95 parts of epoxy modified acrylic emulsion, 5 parts of aqueous tackifying emulsion, 0.5 part of demulsifier, 0.1 part of silane coupling agent, 0.3 part of defoamer, 0.5 part of film forming auxiliary agent and 0.2 part of mildew preventive.
The epoxy modified acrylic emulsion refers to epoxy resin modified acrylic, and as a preferred embodiment of the present application, the epoxy modified acrylic emulsion comprises the following components: water, styrene (St), butyl Acrylate (BA), methacrylic acid (MAA), hydroxyethyl acrylate (HEMA), acrylamide (AM), epoxy resin E-44, polyoxyethylene nonylphenol ether (NP-10), MS-1 sodium bicarbonate, sodium Dodecyl Benzene Sulfonate (DBS), ammonium persulfate and a curing agent T31. Further, the epoxy modified acrylic emulsion comprises the following components in parts by weight: 80-100 parts of water, 10-25 parts of styrene (St), 60-80 parts of Butyl Acrylate (BA), 2-4 parts of methacrylic acid (MAA), 1-3 parts of hydroxyethyl acrylate (HEMA), 1-3 parts of Acrylamide (AM), 8-15 parts of epoxy resin, 1-1.5 parts of nonylphenol polyoxyethylene ether, 1-1.5 parts of sodium bicarbonate, 0.5-1 part of sodium Dodecyl Benzene Sulfonate (DBS), 0.5-1 part of ammonium persulfate and 1-3 parts of curing agent.
Further, the epoxy modified acrylic emulsion is prepared by the following method: and introducing propenyl unsaturated double bonds at two ends of an epoxy resin molecular chain, carrying out graft copolymerization with different acrylic monomers to obtain copolymers with different structures, and then combining the copolymers with different structures together in a covalent bond mode.
As a preferred embodiment of the present application, the epoxy modified acrylic emulsion is prepared according to the following steps: emulsifying 60% of the formula amount of emulsifier and sodium bicarbonate in a water bath at 40 ℃ for 8-12min, adding 80% of the formula amount of acrylic acid monomer and all the epoxy resin dissolved in isopropanol, emulsifying for 40min to obtain a pre-emulsion, and taking out for later use. Adding the rest of emulsifying agent, acrylic acid monomer, sodium dodecyl benzene sulfonate and styrene into a four-mouth bottle, emulsifying for 10min at 40 ℃, slowly heating to 80 ℃, and adding 40% ammonium persulfate to form seed emulsion. After 20min, the dropwise addition of the pre-emulsion containing the epoxy resin was started, and the dropwise addition was completed for about 4 hours while continuing to dropwise add the 40% ammonium sulfate solution. After the monomer emulsion is added dropwise, the reaction system is heated to 85 ℃, the temperature is kept for 1h, and the rest ammonium persulfate is added twice. Then cooling the reaction system to 35-45 ℃, adding a curing agent, continuously preserving heat for 20min, adjusting the pH value to 9.0, filtering and discharging.
Preferably, the aqueous tackifying emulsion is rosin emulsion, and the main component is rosin modified resin. The rosin modified resin contains a large amount of phenolic hydroxyl groups, carboxyl groups, ester bonds, ether bonds and the like, and can easily form a hydrogen bond network structure with epoxy modified acrylic acid, so that the viscoelasticity of a thickened object is changed, the optimal viscosity is obtained, in addition, the tackifying emulsion can improve the wettability of the acrylic emulsion on the back surface of the ceramic tile, and the bonding effect of a product is improved. As a specific example of the present application, an aqueous rosin emulsion SNOWTACK780G was used.
Preferably, the demulsifier is a cationic demulsifier. The epoxy modified acrylic emulsion stabilizing system is an anion-nonionic system, hydrophilic groups generated after the cationic demulsifier is dissolved in water are positively charged particle groups, so that the stability of a product system can be reduced, the demulsification rate of the emulsion can be improved on the premise of not influencing the storage stability of the product, the product can be quickly demulsified and solidified into a film in the drying process, the drying efficiency of the product is improved, and the dosage of the auxiliary agent is severely required by a formula. As a specific example of the present application, cationic demulsifier DR-951 was used.
Preferably, the coupling agent is a silane coupling agent. The silane coupling agent acts with the acrylic emulsion, so that the strength and the water resistance of the product can be effectively improved, and the adhesive force of the product to an inorganic substrate can be improved. As a specific example of the present application, KH560 silane coupling agent was used.
Preferably, the defoamer is a silicone defoamer, and BYK-024 is adopted as a specific embodiment of the application.
Preferably, the film forming auxiliary agent is ester alcohol twelve, and the film forming auxiliary agent can improve the film forming rate and the film forming state of the product at low temperature, and is adopted as one specific embodiment of the application, namely, izeman Texanol.
Preferably, the mildew inhibitor is pinocembrane.
On the other hand, the application provides a preparation method of the waterproof single-component tile adhesive, which comprises the following steps:
the water-resistant single-component tile adhesive is prepared by physically mixing epoxy modified acrylic emulsion, water-based tackifying emulsion, demulsifier, coupling agent, defoamer, film-forming auxiliary agent and mildew inhibitor.
Preferably, the method comprises the following steps:
adding the epoxy modified acrylic emulsion into a three-neck flask, stirring, sequentially adding the defoamer, the film forming auxiliary agent, the mildew preventive and the silane coupling agent, stirring, sequentially adding the demulsifier and the aqueous tackifying emulsion, stirring, and discharging to obtain the water-resistant single-component tile back adhesive.
The beneficial effects of the application are as follows:
(1) According to the application, the purpose of improving the bonding strength and the water resistance of the product is achieved by preparing the low Tg epoxy modified acrylic emulsion and matching with the water-based tackifying emulsion and the silane coupling agent, and the purpose of rapidly demulsifying and solidifying the product to form a film under a certain condition is achieved by adding a certain amount of demulsifier and film forming auxiliary agent, so that the construction efficiency of the product is improved.
(2) The acrylic emulsion is grafted and modified by adopting epoxy resin through a free radical copolymerization method, namely, propenyl unsaturated double bonds are introduced at two ends of an epoxy resin molecular chain and then copolymerized with other monomers, and two copolymers with different compositions and structures are combined together in a covalent bond form, so that the properties of the original two (or more) polymers are changed, and the modified product has the characteristics of good water resistance, high bonding strength, good flexibility, low cost and the like of the epoxy resin, and meanwhile, the rosin modified resin and the epoxy modified acrylic acid form a hydrogen bond network structure, so that the bonding effect of the product is greatly improved.
Detailed Description
In order to make the technical means, the creation features, the achievement of the purpose and the effect of the present application easy to understand, the present application will be further elucidated with reference to the specific embodiments, but the following embodiments are only preferred embodiments of the present application, not all of them. Based on the examples in the embodiments, those skilled in the art can obtain other examples without making any inventive effort, which fall within the scope of the application. In the following examples, unless otherwise specified, the methods of operation used were conventional, the equipment used was conventional, and the materials used in the examples were the same.
In the following examples, epoxy modified acrylic emulsions were prepared according to the following formulation and method:
the formula comprises the following components: 90 parts of water, 15 parts of styrene (St), 70 parts of Butyl Acrylate (BA), 3 parts of methacrylic acid (MAA), 2 parts of hydroxyethyl acrylate (HEMA), 2 parts of Acrylamide (AM), 12 parts of epoxy resin E-44, 1.2 parts of polyoxyethylene nonylphenol ether (NP-10), 1.2 parts of MS-1 sodium bicarbonate, 0.8 part of sodium Dodecyl Benzene Sulfonate (DBS), 0.8 part of ammonium persulfate and 2 parts of curing agent T31.
The preparation method comprises the following steps: emulsifier NP-10 in an amount of 60% of the formulation and buffer NaHCO 3 Emulsifying in 40deg.C water bath for about 10min, adding 80% of acrylic monomer and epoxy resin dissolved in isopropanol, emulsifying for 40min, and taking out. Adding the remaining emulsifiers NP-10, acrylic acid monomer and DBS into a four-mouth bottle, emulsifying for 10min at 40 ℃, then slowly heating to 80 ℃, and adding 40% of initiator ammonium persulfate to form seed emulsion. After 20min, the dropwise addition of the pre-emulsion containing the epoxy resin was started, and the dropwise addition was completed for about 4 hours while continuing to dropwise add the 40% ammonium sulfate solution. After the monomer emulsion is added dropwise, the reaction system is heated to 85 ℃, the temperature is kept for 1h, and the rest ammonium persulfate initiator is added twice. Then cooling the reaction system to about 40 ℃, adding a metered amount of T31 curing agent, continuously preserving heat for 20min, and regulating the pH value to 9.0 by using AMP-95And (5) filtering and discharging.
In the following examples, the aqueous tackifying emulsion was SNOWTACK780G in the chemical industry of shanghai Sang Jing; the demulsifier is a cationic demulsifier DR-951, and the coupling agent is a silane coupling agent KH560; the defoaming agent is an organosilicon defoaming agent BYK-024; the film forming additive is Isman Texanol; the mildew inhibitor is Kathon mildew inhibitor of Michael 410; the conventional acrylic emulsion 1 is purchased with Baderfu, model number is FS-350; conventional acrylic emulsion 2 was purchased as Baderfu, model FS-338K.
Examples 1 to 3
The formulation compositions of examples 1-3 are shown in Table 1:
table 1.
Comparative examples 1 to 5
The formulation compositions of comparative examples 1-5 are shown in Table 2:
table 2.
Examples 1-3 and comparative examples 1-5 were each prepared as follows:
adding epoxy modified acrylic emulsion (conventional acrylic emulsion) into a three-neck flask at normal temperature, starting stirring, sequentially adding a defoaming agent, a film forming auxiliary agent, a mildew preventive and a silane coupling agent, stirring for 30min, sequentially adding a demulsifier and an aqueous tackifying emulsion, and continuously stirring for 10min to obtain the material.
Result detection
The preparation and testing methods of the bonding strength comprise the following steps: coating back adhesive on the back of a standard brick under standard environmental conditions, and preparing and testing a sample according to JC/T547-2017 ceramic brick adhesive standards after the back adhesive is completely dried;
initial tack test method: under standard environmental conditions, testing is carried out according to the initial tackiness test method (ball method) of the GB/T4852-2002 pressure sensitive adhesive tape;
the real-dry time testing method comprises the following steps: and under the standard environmental conditions, the artificial judgment is carried out.
The results of the measurements are shown in tables 3-4:
table 3.
Table 4.
From the test results of the examples and the comparative examples, the Tg value of the formula of the application is higher under the condition that the initial viscosity is close, and the formula is far superior to the conventional acrylic emulsion type back adhesive product in terms of drying efficiency, bonding strength and water resistance. The demulsifier is added in the formula, so that the drying time of the product is obviously reduced, the mechanical property and the initial viscosity are basically consistent, and the demulsifier can effectively improve the drying efficiency of the product; compared with example 3, example 1 shows that the formula adjusts the proportion of the epoxy modified acrylic emulsion to the tackifying emulsion, and from the test data, as the dosage proportion of the two types of emulsions is increased, the initial viscosity of the Tg value of the product is reduced, and the bonding strength is improved.
The foregoing description of the preferred embodiments of the application is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the application.
Claims (8)
1. The waterproof type single-component tile back adhesive is characterized by comprising the following components: 80-100 parts of epoxy modified acrylic emulsion, 3-20 parts of aqueous tackifying emulsion, 0.1-1 part of demulsifier, 0.05-0.5 part of silane coupling agent, 0.1-1 part of defoamer, 0.3-1 part of film forming auxiliary agent and 0.1-0.8 part of mildew preventive;
the epoxy modified acrylic emulsion comprises the following components in parts by weight: 80-100 parts of water, 10-25 parts of styrene, 60-80 parts of butyl acrylate, 2-4 parts of methacrylic acid, 1-3 parts of hydroxyethyl acrylate, 1-3 parts of acrylamide, 8-15 parts of epoxy resin, 1-1.5 parts of nonylphenol polyoxyethylene ether, 1-1.5 parts of sodium bicarbonate, 0.5-1 part of sodium dodecyl sulfur benzenesulfonate, 0.5-1 part of ammonium persulfate and 1-3 parts of curing agent;
the demulsifier is a cationic demulsifier DR-951.
2. The water-resistant single-component tile adhesive according to claim 1, comprising the following components in parts by weight: 85-95 parts of epoxy modified acrylic emulsion, 5-15 parts of aqueous tackifying emulsion, 0.5 part of demulsifier, 0.1-0.3 part of silane coupling agent, 0.3-0.6 part of defoamer, 0.5-1 part of film forming auxiliary agent and 0.2 part of mildew preventive.
3. The water-resistant single-component tile adhesive according to claim 2, comprising the following components in parts by weight: 95 parts of epoxy modified acrylic emulsion, 5 parts of aqueous tackifying emulsion, 0.5 part of demulsifier, 0.1 part of silane coupling agent, 0.3 part of defoamer, 0.5 part of film forming auxiliary agent and 0.2 part of mildew preventive.
4. The water-resistant single-component tile adhesive according to claim 1, wherein,
the epoxy modified acrylic emulsion is prepared according to the following steps: emulsifying 60% of the formula amount of emulsifier and sodium bicarbonate in a water bath at 40 ℃ for 8-12min, adding 80% of the formula amount of acrylic acid monomer and all the isopropanol-dissolved epoxy resin, emulsifying for 40min to obtain a pre-emulsion, and taking out for later use; adding the rest emulsifier, acrylic acid monomer, sodium dodecyl benzene sulfonate and styrene into a four-mouth bottle, emulsifying for 10min at 40 ℃, slowly heating to 80 ℃, and adding 40% ammonium persulfate to form seed emulsion; after 20min, beginning to dropwise add the pre-emulsion containing the epoxy resin, and continuously dropwise adding 40% ammonium persulfate solution after the completion of 4h of dropwise addition; after the monomer emulsion is dripped, the temperature of the reaction system is raised to 85 ℃, the temperature is kept for 1h, and the rest ammonium persulfate is added twice during the period; then cooling the reaction system to 35-45 ℃, adding a curing agent, continuously preserving heat for 20min, adjusting the pH value to 9.0, filtering and discharging.
5. A water-resistant single-component tile adhesive according to any one of claims 1 to 3, wherein the aqueous tackifying emulsion is a rosin emulsion, the main component being a rosin modified resin; the demulsifier is a cationic demulsifier; the coupling agent is a silane coupling agent; the defoaming agent is an organosilicon defoaming agent.
6. The water resistant single component tile backing adhesive of claim 5, wherein the aqueous tackifying emulsion is an aqueous rosin emulsion SNOWTACK780G; the coupling agent is KH560 silane coupling agent; the defoaming agent is BYK-024 organic silicon defoaming agent; the film forming additive is Isman Texanol; the mildew inhibitor is pinus koraiensis.
7. The method for preparing the waterproof type single-component tile adhesive backing according to any one of claims 1 to 6, which is characterized by comprising the following steps:
the water-resistant single-component tile adhesive is prepared by physically mixing epoxy modified acrylic emulsion, water-based tackifying emulsion, demulsifier, coupling agent, defoamer, film-forming auxiliary agent and mildew inhibitor.
8. The method of manufacturing according to claim 7, comprising the steps of:
adding the epoxy modified acrylic emulsion into a three-neck flask, stirring, sequentially adding the defoamer, the film forming auxiliary agent, the mildew preventive and the silane coupling agent, stirring, sequentially adding the demulsifier and the aqueous tackifying emulsion, stirring, and discharging to obtain the water-resistant single-component tile back adhesive.
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0762315A (en) * | 1993-08-27 | 1995-03-07 | Mitsui Toatsu Chem Inc | Adhesive for tile |
| KR101964008B1 (en) * | 2018-08-21 | 2019-04-01 | 주식회사 쌍곰켐 | Superior acrylic emulsion adhesive composition is freeze and thawing for tile adhesive |
| CN110157357A (en) * | 2019-04-30 | 2019-08-23 | 清清通(大连)厨卫防臭技术开发有限公司 | A kind of old ceramic tile free removal, new ceramic tile anti-dropout special glue |
| CN111732921A (en) * | 2020-06-09 | 2020-10-02 | 武汉天成旭邦新型建材有限公司 | Vitrified tile back adhesive and preparation method thereof |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0762315A (en) * | 1993-08-27 | 1995-03-07 | Mitsui Toatsu Chem Inc | Adhesive for tile |
| KR101964008B1 (en) * | 2018-08-21 | 2019-04-01 | 주식회사 쌍곰켐 | Superior acrylic emulsion adhesive composition is freeze and thawing for tile adhesive |
| CN110157357A (en) * | 2019-04-30 | 2019-08-23 | 清清通(大连)厨卫防臭技术开发有限公司 | A kind of old ceramic tile free removal, new ceramic tile anti-dropout special glue |
| CN111732921A (en) * | 2020-06-09 | 2020-10-02 | 武汉天成旭邦新型建材有限公司 | Vitrified tile back adhesive and preparation method thereof |
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