CN114806419A - Solution and method for debonding a component - Google Patents
Solution and method for debonding a component Download PDFInfo
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- CN114806419A CN114806419A CN202210492460.5A CN202210492460A CN114806419A CN 114806419 A CN114806419 A CN 114806419A CN 202210492460 A CN202210492460 A CN 202210492460A CN 114806419 A CN114806419 A CN 114806419A
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- solution
- adhesive
- novec71ipa
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
- C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The present application relates to a solution for debonding a component. The component is attached to the substrate via an adhesive. The solution comprises a fluorinated liquid. The fluorinated liquid is substantially non-toxic (or has low toxicity), non-flammable, insulating, and/or does not readily produce residues. The application also relates to a method for debonding a component using the above solution. The solution and method according to the present application are environmentally friendly, reliable, can avoid damage to the component, and/or can allow the component to be easily detached from the adhesive.
Description
Technical Field
The present application relates to a solution and method for debonding components, and in particular to a solution and method for debonding electronic components.
Background
Tapes made of Pressure Sensitive Adhesive (PSA) are a widely used bonding technique and generally have sufficient bond strength. For example, adhesive tapes made of pressure sensitive adhesive are widely used for bonding sensitive and fragile electronic components, such as batteries, into electronic products.
However, the currently available methods may cause environmental damage or damage to the electronic components when the electronic components bonded by the adhesive tape are disassembled. For example, flammable or toxic solutions may contaminate the ambient atmosphere while dissolving the tape. As another example, some of the solution may remain on the electronic component while dissolving the tape, thereby possibly causing a short circuit or a malfunction of the electronic component. In addition, some solvents are difficult to penetrate into the adhesive tape when dissolving the adhesive tape, and thus cannot effectively disassemble the electronic component.
Disclosure of Invention
In view of the above-mentioned problems in the prior art, the present application proposes a method of debonding a component. The method can meet the requirement of environmental protection, can avoid damaging the components and/or can effectively separate the components from bonding.
According to one aspect of the present application, a solution for debonding a component is provided, wherein the component is attached to a substrate via an adhesive. The solution comprises a fluorinated liquid.
In some embodiments, the fluorinated liquid comprises 3M TM Novec TM Series of fluorinated liquids and/or 3M TM Fluorinert TM A series of fluorinated liquids.
In some embodiments, the 3M TM Novec TM The series of fluorinated liquids is selected from at least one of: novec 7000, Novec 7100, Novec71 DA, Novec71 DE, Novec71IPA, Novec 7200, Novec 72DA, Novec 72DE, Novec 7300, Novec 73DE, and Novec 7500.
In some embodiments, the fluorinated liquid comprises Novec71IPA and Novec7500, wherein the Novec71IPA and the Novec7500 are mixed in a predetermined ratio.
In some embodiments, the ratio of the Novec71IPA to the Novec7500 is one of: 5:5, 6:4, 7:3, and 8: 2.
In some embodiments, the 3M TM Fluorinert TM The series of fluorinated liquids includes: FC-72, FC-770, FC-3283 and FC-40.
In some embodiments, the fluorinated liquid comprises Novec71IPA and FC-40, wherein the Novec71IPA and the FC-40 are mixed in a predetermined ratio.
In some embodiments, the ratio of the Novec71IPA and the FC-40 is one of: 5:5, 6:4 and 7: 3.
According to another aspect of the present application, a method of debonding a component from a substrate by the above solution is provided. The method comprises the following steps: preparing the solution; placing the solution around an adhesive for bonding the parts; waiting for a predetermined time; and separating the component from the adhesive.
In some embodiments, the step of preparing the solution comprises: in the case where the adhesive is of a rubber-based or acrylic-based adhesive, Novec71IPA and Novec7500 are mixed in a predetermined ratio to prepare the solution.
In some embodiments, the step of preparing the solution comprises: in the case where the adhesive is of a silicone adhesive system, Novec71IPA and FC-40 are mixed in a predetermined ratio to prepare the solution.
The solution and method for debonding a component according to the present application have at least the following advantages:
the fluorinated liquid may be substantially non-toxic or very low in toxicity. Thus, the solutions and methods according to the present application are environmentally friendly and safe.
The fluorinated liquid may be inert, free of any corrosive/erosive properties, and non-flammable. Thus, the solution and method according to the present application are safe and reliable.
The fluorinated liquid may be a pure organic substance and substantially insulating. Thus, the solution and method according to the present application may avoid failures such as short circuits.
The fluorinated liquid may have a suitable boiling point. Thus, the solution and method according to the present application leaves the parts unbonded with little residue, no contamination, and no additional cleaning.
The fluorinated liquid may have a low viscosity and a low surface tension. Thus, the solutions and methods according to the present application can have good permeability to effectively debond components.
Drawings
The features and advantages of one or more embodiments of the present application will become more readily understood by the following description with reference to the accompanying drawings, in which:
FIG. 1 is a schematic flow diagram of a method for debonding a component according to an embodiment of the present application;
FIG. 2 is a schematic view of the tape placement when the tape is tested; and
fig. 3 is a graph showing test results for different separation methods.
Detailed Description
The following description of the preferred embodiment(s) is merely exemplary in nature and is in no way intended to limit the invention, its application, or uses. The same reference numerals are used to designate the same components in the respective drawings, and thus the configurations of the same components will not be described repeatedly.
The present application presents a solution and method for debonding a component. Adhesives (i.e., glues) are often utilized in many areas of technology to attach components, such as batteries in smart phones that are attached by adhesives. In some cases, it is necessary to debond the part from the adhesive for rework of the production line, after-market repair, product recycling, etc. The solutions and methods according to the present application can debond components in an environmentally friendly manner. The solution and the method according to the application can avoid damage to the components. The solution and method according to the present application can effectively penetrate the solution for release into the adhesive, thereby allowing the part to be easily released from the adhesive.
Adhesives include the Pressure Sensitive Adhesives (PSAs) that are widely used, particularly in the electronics field. The pressure-sensitive adhesive mainly comprises a silica gel adhesive system, a rubber adhesive system and an acrylic adhesive system. The rubber system has high initial viscosity and general temperature resistance, but has poor oxidation resistance and aging resistance. The silica gel system has general viscosity and good temperature resistance. The acrylic adhesive has excellent comprehensive performance, and can achieve high bonding strength, high temperature resistance, excellent ageing resistance and the like through the adjustment of a formula. The solutions and methods according to the present application can be adapted to various types of adhesives.
The solution according to the present application comprises a fluorinated liquid. The fluorinated liquid may be prepared according to the composition of the glue (adhesive). As used herein, "fluorinated liquid" refers to a solution of fluorine-substituted alkanes or ethers.
The fluorinated fluids prepared herein are substantially non-toxic or have very low toxicity. Thus, the solution according to the present application is environmentally friendly and safe.
The fluorinated liquid prepared herein may be inert, free of any corrosive/erosive properties, and non-flammable. The solution according to the present application is therefore safe, reliable and particularly suitable for delicate or expensive parts.
The fluorinated liquid prepared herein is a pure organic substance and is substantially insulating, unlike the conductive "particulate fluorine-containing solution". Thus, the fluorinated liquid described herein allows electronic components to be immersed therein without affecting their normal operation and without causing failures such as short circuits.
The fluorinated liquid prepared herein can have a suitable boiling point such that there is little residue, no contamination, and no additional cleaning after debonding the component.
The fluorinated liquids prepared herein can have low viscosity and low surface tension. In this way, the fluorinated liquid easily penetrates into the adhesive, i.e., has good permeability. In this way, the parts can be effectively debonded.
The fluorinated solution may be selected from 3M commercially available 3M TM Novec TM Series (hydrofluoroether series) and 3M TM Fluorinert TM Series (fluorocarbon series) of fluorinated liquids.
By way of example, 3M is listed in Table 1 below TM Novec TM Some fluorinated liquids of the series and their properties.
TABLE 1
By way of example, 3M is listed in Table 2 below TM Fluorinert TM Some fluorinated liquids of the series and their properties.
TABLE 2
Some of the fluorinated liquids are listed herein as examples. However, the present invention should not be limited to the fluorination liquids specifically listed herein. For example, the present invention may be employed in addition to 3M TM Novec TM Series (hydrofluoroether series) and 3M TM Fluorinert TM Fluorinated liquids of other series than the series (fluorocarbon series).
A method 100 for debonding a component according to an embodiment of the present application will be described below with reference to fig. 1. Fig. 1 is a schematic flow diagram of a method 100 for debonding a component according to an embodiment of the present application.
As shown in fig. 1, the method 100 includes preparing a fluorinated liquid (step S10), for example, a small molecule fluorinated liquid. The fluorinated liquid has the properties as described above. In the step S10 of preparing the fluorinated liquid, different fluorinated liquids may be mixed in a predetermined ratio. For example, the same series (e.g., 3M) may be used TM Novec TM Series) of two fluorinated liquids, or different series (e.g., 3M) may be mixed TM Novec TM Series and 3M TM Fluorinert TM Series) of two fluorinated liquids were mixed.
After the fluorinated liquid is prepared, the fluorinated liquid is placed around the adhesive (step S30). The fluorinated liquid around the adhesive gradually penetrates into the adhesive, and the adhesive dissolves, swells, or weakens the adhesive interface (adhesive force), thereby detaching the member from the adhesive.
In step S30, the component (or the bonded portion of the component) may be immersed in the fluorinated liquid, since the fluorinated liquid does not cause any damage to the component as described above.
In an alternative example, in step S30, a tool such as a dropper may be used to drop the fluorinated liquid around the adhesive. Thus, the amount of the fluorinated liquid used can be reduced, and damage or interference to surrounding parts can be prevented. It is advantageous to attach the components by several small adhesive areas with gaps between the adhesive areas. In this case it is particularly suitable to drip the fluorinated liquid around several small bonding areas to increase the speed of penetration and thus to quickly debond the component.
In order to allow the fluorinated liquid to well penetrate into the adhesive, a predetermined time is waited (step S50), for example, 3 minutes to 10 minutes, preferably 3 minutes to 5 minutes. The waiting time may be determined according to the type of adhesive, the bonding area, the ambient temperature, and the like.
After the fluorinated liquid has completely penetrated into the adhesive, the member may be taken out, i.e., separated from the adhesive (step S70). For example, a pulling force may be applied to the component that does not damage the component.
It is to be understood that the method according to the present application is not limited to the specific examples shown in the drawings and described herein, but may be varied according to actual needs.
The inventors performed tensile tests on different separation methods under the same test conditions.
Fig. 2 is a schematic view of the tape placement when the tape is tested. As shown in fig. 2, an aluminum plate 11 having a square shape with a side length W1 of 25mm is provided. 3 double-sided tapes 12 are pasted in parallel to the aluminum plate 11. The length of the tape 12 was 25mm, which was the same as the side length W1 of the aluminum plate, and the width W2 of the tape 12 was 5 mm. The gap G1 between the tapes 12 is 1mm to 1.5 mm. The aluminum plate 11 and the adhesive tape 12 were pressed on a stainless steel plate (not shown) and continued at room temperature for 3 days to firmly attach the aluminum plate to the stainless steel plate by the adhesive tape for the subsequent tensile test.
Fig. 3 is a graph showing test results for different separation methods. In the tensile test, the stretching was performed at a separation speed of 10 mm/min. The applied tensile force (in N) required for each test example was then measured. The stretching force is small, which indicates easy separation. If the tensile force is large, the separation is not easy.
In the test example without using any solvent, the stretching was directly performed at a separation speed of 10mm/min, and the stretching force was measured up to 250N.
In test examples using alcohol (EtOH), Novec71IPA, or a mixture of Novec71IPA and Novec7500 (mixed in a ratio of 7: 3), these solutions were placed around the tape and allowed to wait for 3 minutes. Then, stretching was performed at a separation speed of 10 mm/min.
In the test example using alcohol, the tensile force was 150N. Although alcohol is a common solvent in the prior art, alcohol is flammable, presents a high risk, particularly for electronic devices such as batteries, and is not readily available for purchase and transport.
In a test example using Novec71IPA according to an embodiment of the present application, the tensile force was 180N. In a test example using a mixture of Novec71IPA and Novec7500 according to an embodiment of the present application, the tensile force was 100N. From the test results, it is shown that the fluorinated fluids described herein can significantly effectively separate aluminum plates. Furthermore, both Novec71IPA and Novec71IPA are environmentally friendly fluorinated liquids, which can also improve safety and reliability. Even more, the separation effect of the mixture of Novec71IPA and Novec71IPA is significantly due to the separation effect of alcohol in the prior art.
The inventors also performed tensile tests at the same test conditions for different types of adhesives.
The adhesive tape is a double-sided adhesive tape of a PET base material. Each tape has a width of 5mm, a length of 25mm and a thickness of 0.1 mm. Three such tapes are attached to the aluminum T-block at intervals of about 1mm to 2mm, and then the aluminum T-block is bonded to the aluminum plate and pressed. After 24 hours of standing at room temperature, the tack of the tape had built up gradually, approaching the final bond strength. Separation tests can be performed at this point.
In the tensile test, the stretching was performed at a separation speed of 10 mm/min. The applied tensile force (in N) required for each test example was then measured. Similarly, in the case of a solvent, it will wait 3 minutes for it to penetrate into the glue.
The tensile test results are shown in table 3 below.
TABLE 3
Alcohol has a significant debonding effect on all three glue systems, as alcohol does swell glue. However, after the silica gel and the acrylic glue are soaked in alcohol, the glue can fall off from the PET substrate and is left on the aluminum plate, so that the glue is called as residual glue, and the removal of the residual glue is not easy, so that the residual glue is not desirable.
Novec71IPA has a boiling point of 55 degrees, and quickly evaporates well when meeting a room temperature environment, so that Novec71IPA needs to be continuously dripped on glue, otherwise, the debonding effect can hardly be generated. To slow the evaporation of Novec71IPA, a Novec7500 fluorinated liquid with a boiling point of about 128 degrees may be used in combination with it. Fluorinated fluids in which Novec71IPA was mixed with Novec7500 in different ratios (e.g., 8:2, 7:3, and 6:4, respectively, in table 3) had significant debonding effects on rubber and acrylic gums. The mixing ratio of the Novec71IPA and the Novec7500 electronic fluorinated liquid can be more than or equal to 5: 5.
FC-40 is another system of fluorinated liquids commercially available from 3M. Compared with the mixed solution of Novec71IPA and Novec7500, the solution in which Novec71IPA and FC-40 are mixed (for example, mixed at a ratio of 7:3 and 6:4 in table 3), has a better effect of releasing the tackiness of the silicone rubber system and a slightly lower effect of releasing the tackiness of the rubber system. The mixing ratio of Novec71IPA and FC-40 electronic fluorinated liquid can be more than or equal to 5: 5.
The fluorinated liquid or the mixture of fluorinated liquids may be selected according to the type or properties (in particular, molecular weight, boiling point, surface tension, etc.) of the fluorinated liquid with respect to the type or main component of the binder.
The particular examples illustrated are for the purpose of illustrating the invention only and are not to be construed as limiting the invention, so that variations in the particular examples described above are possible. Although some embodiments and modifications of the present application have been specifically described, it will be understood by those skilled in the art that the present application is not limited to the embodiments and modifications described above and shown in the drawings but may include other various possible combinations and combinations. Other modifications and variations may be effected by one skilled in the art without departing from the spirit and scope of the application. All such variations and modifications are intended to fall within the scope of the present application. Moreover, all the components described herein may be replaced by other technically equivalent components.
Claims (11)
1. A solution for debonding a component, wherein the component is attached to a substrate via an adhesive, characterized in that the solution comprises a fluorinated liquid.
2. The solution of claim 1, wherein the fluorinated liquid comprises 3M TM Novec TM Series of fluorinated liquids and/or 3M TM Fluorinert TM A series of fluorinated liquids.
3. The solution of claim 2, wherein the 3M is TM Novec TM The series of fluorinated liquids is selected from at least one of: novec 7000, Novec 7100, Novec71 DA, Novec71 DE, Novec71IPA, Novec 7200, Novec 72DA, Novec 72DE, Novec 7300, Novec 73DE, and Novec 7500.
4. The solution of claim 2 wherein said fluorinated liquid comprises Novec71IPA and Novec7500, wherein said Novec71IPA and said Novec7500 are mixed in a predetermined ratio.
5. The solution of claim 4 wherein the ratio of Novec71IPA to Novec7500 is one of: 5:5, 6:4, 7:3, and 8: 2.
6. The solution of claim 2, wherein the 3M is TM Fluorinert TM The series of fluorinated liquids includes: FC-770, FC-3283, FC-40 and FC-72.
7. The solution of claim 2 wherein said fluorinated liquid comprises Novec71IPA and FC-40, wherein said Novec71IPA and said FC-40 are mixed in a predetermined ratio.
8. The solution of claim 7 wherein the ratio of said Novec71IPA and said FC-40 is one of: 5:5, 6:4 and 7: 3.
9. A method of debonding a component by means of a solution according to any one of claims 1 to 8, comprising the steps of:
preparing the solution;
placing the solution around an adhesive for bonding the parts;
waiting for a predetermined time; and
separating the component from the adhesive.
10. The method of claim 9, wherein the step of preparing the solution comprises: in the case where the adhesive is of a rubber-based or acrylic-based adhesive, Novec71IPA and Novec7500 are mixed in a predetermined ratio to prepare the solution.
11. The method of claim 9, wherein the step of preparing the solution comprises: in the case where the adhesive is of a silicone adhesive system, Novec71IPA and FC-40 are mixed in a predetermined ratio to prepare the solution.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210492460.5A CN114806419A (en) | 2022-05-07 | 2022-05-07 | Solution and method for debonding a component |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210492460.5A CN114806419A (en) | 2022-05-07 | 2022-05-07 | Solution and method for debonding a component |
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| CN114806419A true CN114806419A (en) | 2022-07-29 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210492460.5A Pending CN114806419A (en) | 2022-05-07 | 2022-05-07 | Solution and method for debonding a component |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0317173A (en) * | 1989-06-14 | 1991-01-25 | Shikishima Boseki Kk | Solvent for peeling tacky tape |
| CN109608312A (en) * | 2018-09-29 | 2019-04-12 | 天津市长芦化工新材料有限公司 | Hydrofluoroether compounds and its preparation method and application |
-
2022
- 2022-05-07 CN CN202210492460.5A patent/CN114806419A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0317173A (en) * | 1989-06-14 | 1991-01-25 | Shikishima Boseki Kk | Solvent for peeling tacky tape |
| CN109608312A (en) * | 2018-09-29 | 2019-04-12 | 天津市长芦化工新材料有限公司 | Hydrofluoroether compounds and its preparation method and application |
Non-Patent Citations (1)
| Title |
|---|
| 王振华编著: "《含氢氯氟烃（HCFCs）替代技术指南》", 武汉理工大学出版社, pages: 351 - 352 * |
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