CN114798264B - Glue homogenizing nozzle moisturizing device and glue homogenizing equipment - Google Patents
Glue homogenizing nozzle moisturizing device and glue homogenizing equipment Download PDFInfo
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- CN114798264B CN114798264B CN202210392886.3A CN202210392886A CN114798264B CN 114798264 B CN114798264 B CN 114798264B CN 202210392886 A CN202210392886 A CN 202210392886A CN 114798264 B CN114798264 B CN 114798264B
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- moisturizing
- liquid
- nozzle
- glue
- hole
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- 230000003020 moisturizing effect Effects 0.000 title claims abstract description 116
- 239000003292 glue Substances 0.000 title claims abstract description 99
- 239000007788 liquid Substances 0.000 claims abstract description 123
- 238000003860 storage Methods 0.000 claims abstract description 23
- 238000003780 insertion Methods 0.000 claims abstract description 9
- 230000037431 insertion Effects 0.000 claims abstract description 9
- 238000002347 injection Methods 0.000 claims description 30
- 239000007924 injection Substances 0.000 claims description 30
- 239000002699 waste material Substances 0.000 claims description 30
- 238000003892 spreading Methods 0.000 claims description 24
- 238000009434 installation Methods 0.000 claims description 2
- 229920002120 photoresistant polymer Polymers 0.000 abstract description 16
- 238000000034 method Methods 0.000 abstract description 8
- 239000011550 stock solution Substances 0.000 abstract description 4
- 239000007789 gas Substances 0.000 description 14
- 238000004528 spin coating Methods 0.000 description 13
- 238000004140 cleaning Methods 0.000 description 12
- 238000005507 spraying Methods 0.000 description 8
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- 238000007599 discharging Methods 0.000 description 5
- 238000001035 drying Methods 0.000 description 4
- 239000007921 spray Substances 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- 229910001873 dinitrogen Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 238000007664 blowing Methods 0.000 description 2
- 239000003504 photosensitizing agent Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000012864 cross contamination Methods 0.000 description 1
- 238000010981 drying operation Methods 0.000 description 1
- 239000003906 humectant Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000000935 solvent evaporation Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
- B05B15/50—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter
- B05B15/55—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter using cleaning fluids
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
- B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
Landscapes
- Coating Apparatus (AREA)
Abstract
The invention provides a glue homogenizing nozzle moisturizing device and glue homogenizing equipment, wherein the glue homogenizing nozzle moisturizing device comprises a cover body and a box body which is arranged below the cover body and has a hollow structure, and the cover body is provided with an insertion hole for vertically inserting a glue homogenizing nozzle; an overflow plate which is vertically arranged is arranged in the box body so as to divide the inner cavity of the box body into a liquid storage cavity and a moisturizing cavity through the overflow plate, and a first through hole for moisturizing liquid to flow into the liquid storage cavity is formed in the side part of the box body; even gluey nozzle inserts the patchhole to closed moisturizing chamber and stock solution chamber, first through-hole highly lie in the highest liquid level top that the moisturizing liquid in the stock solution chamber formed along vertical direction. In the application, the moisturizing nozzle is moisturized by moisturizing liquid contained in the liquid storage cavity in the closed moisturizing cavity due to the moisturizing atmosphere formed by volatilization, so that the phenomenon that the glue nozzle is blocked due to the fact that the glue nozzle is exposed in the air due to the fact that the photoresist is solidified is effectively prevented, and the continuous and reliable glue evening process is guaranteed to be executed.
Description
Technical Field
The invention relates to the technical field of semiconductor equipment, in particular to a glue homogenizing nozzle moisturizing device and glue homogenizing equipment.
Background
The spin coater is a semiconductor apparatus that drops a photoresist on a substrate rotating at a high speed to uniformly coat the photoresist on the substrate (e.g., a wafer) by a centrifugal force. The photoresist is composed of a solvent, a photosensitizer and resin, wherein the solvent is volatile in the air, the photosensitizer and the resin are solidified at a nozzle (namely a glue nozzle) of the glue homogenizing device to form a block due to the volatilization of the solvent, and the generation of the block seriously influences the coating effect of the glue homogenizing device, so that the glue nozzle needs to be moisturized to ensure that the photoresist is kept smooth when being spit out next time.
In the prior art, it is common to immerse the nozzle in a container containing a continuously flowing photoresist to prevent the nozzle from curing. However, this prior art has a drawback that the photoresist is wasted. Meanwhile, after the glue nozzle finishes certain times of glue discharging operation, dirt may adhere to the periphery of the glue nozzle, so that the glue nozzle needs to be cleaned. However, the process of cleaning the nozzle filled with photoresist can not only result in the waste of photoresist, but also increase the manufacturing and using costs of the spin coater to a certain extent.
In view of the above, there is a need to improve the device for moisturizing the glue homogenizing nozzle included in the glue homogenizing apparatus in the prior art to solve the above problems.
Disclosure of Invention
The invention aims to disclose a glue homogenizing nozzle moisturizing device and glue homogenizing equipment, which are used for moisturizing a glue homogenizing nozzle used in a glue homogenizing process, preventing the glue nozzle from being blocked due to the solidification of photoresist when the glue nozzle is exposed in the air, and cleaning and drying the glue nozzle, so that the glue homogenizing process is continuously and reliably executed.
In order to achieve one of the above objects, the present invention provides a moisturizing device for a glue homogenizing nozzle, comprising:
the glue homogenizing device comprises a cover body, a box body and a glue homogenizing nozzle, wherein the cover body is arranged below the cover body and is provided with a hollow box body, and an insertion hole for vertically inserting the glue homogenizing nozzle is formed in the cover body;
an overflow plate which is vertically arranged is arranged in the box body, so that the inner cavity of the box body is divided into a liquid storage cavity and a moisturizing cavity through the overflow plate, and a first through hole for moisturizing liquid to flow into the liquid storage cavity is formed in the side part of the box body;
even gluey nozzle inserts the patchhole is in order to close moisturizing chamber and stock solution chamber, first through-hole highly is located along vertical direction the highest liquid level top that moisturizing liquid formed in the stock solution chamber.
As a further improvement of the invention, the cover body forms an accommodating cavity for accommodating the glue homogenizing nozzle, the accommodating cavity is formed above the moisturizing cavity and is communicated with the moisturizing cavity, and the volume of the accommodating cavity is smaller than that of the moisturizing cavity.
As a further improvement of the present invention, the cover body forms an annular gas path and an annular liquid path, the circumferential side wall of the accommodating cavity is provided with a plurality of annularly arranged gas injection holes and a plurality of annularly arranged liquid injection holes, the gas injection holes are communicated with the annular gas path, the liquid injection holes are communicated with the annular liquid path, the annular gas path forms a second through hole extending to the outside of the cover body, and the annular liquid path forms a third through hole extending to the outside of the cover body.
As a further improvement of the invention, the gas injection holes and the liquid injection holes are symmetrically arranged and formed on two sides of the accommodating cavity.
As a further improvement of the invention, the cover body forms an air injection channel which is obliquely arranged and is connected with the annular air path and the air injection hole, and the cover body forms a liquid injection channel which is horizontally arranged and is connected with the annular liquid path and the liquid injection hole.
As a further improvement of the present invention, the cover body is provided with a first joint embedded in the first through hole, a second joint embedded in the second through hole, and a third joint embedded in the third through hole.
As a further improvement of the invention, the method also comprises the following steps: the bracket surrounds the box body and is movably embedded with the box body.
As a further improvement of the invention, a waste discharge hole for discharging the moisturizing liquid out of the box body is formed at the bottom of the moisturizing cavity;
the glue homogenizing nozzle moisturizing device further comprises: set up in the waste liquid eduction gear of bracket below, the bracket includes that the part encloses bearing curb plate, the bearing bottom plate of locating the box body bottom to and the subtend set up in the installation piece in the bearing curb plate outside, the bearing bottom plate form with the fourth through-hole of exhaust hole intercommunication.
As a further improvement of the invention, the waste liquid discharge device comprises a waste discharge joint which is screwed into the fourth through hole, and a waste discharge pipe which is connected with the waste discharge joint and is vertically arranged.
Based on the same invention idea, the invention also provides glue homogenizing equipment, which comprises:
the invention creates a moisturizing device for a glue homogenizing nozzle according to any one of the preceding inventions.
Compared with the prior art, the invention has the beneficial effects that:
in the application, after the glue homogenizing nozzle is inserted into the insertion hole above the cover body, the moisturizing cavity in a closed state is formed by closing the moisturizing cavity and the liquid storage cavity, the height of the first through hole in the vertical direction is positioned above the highest liquid level formed by the moisturizing liquid in the liquid storage cavity, so that the glue homogenizing nozzle is not immersed in the liquid storage cavity, and the moisturizing atmosphere formed by volatilization of the moisturizing liquid contained in the liquid storage cavity in the moisturizing cavity in the closed state moisturizes the glue homogenizing nozzle, so that the phenomenon that the glue nozzle is blocked due to curing of photoresist when the glue nozzle is exposed in the air is effectively prevented; meanwhile, the glue homogenizing nozzle does not need to be contacted with or immersed in the moisturizing liquid, so that the using amount of the moisturizing liquid is saved, and cross contamination to the glue homogenizing nozzle possibly caused in the process of performing moisturizing operation on the glue homogenizing nozzle for many times is effectively avoided; finally, the glue homogenizing nozzle moisturizing device disclosed by the application also achieves the cleaning and drying effects on the glue homogenizing nozzle, so that the glue homogenizing process is continuously and reliably executed.
Drawings
Fig. 1 is a perspective view of the glue spreading nozzle moisturizing device of the present invention from one perspective;
FIG. 2 is a perspective view of the leveling nozzle moisturizing device of the present invention from another perspective;
FIG. 3 is a front view of the moisturizing device of the glue spreading nozzle of the present invention;
FIG. 4 is a perspective view of two glue spreading nozzles inserted into the glue spreading nozzle moisturizing device with the glue spreading nozzles integrally embedded in the block;
FIG. 5 isbase:Sub>A schematic cross-sectional view taken along line A-A of FIG. 3;
FIG. 6 is a schematic cross-sectional view taken along line B-B of FIG. 3;
FIG. 7 is a schematic cross-sectional view taken along line C-C of FIG. 2 and taken longitudinally through the cover;
FIG. 8 is a schematic partial cross-sectional view of the block carrying two glue spreading nozzles inserted into the insertion holes in the top of the cover to form a closed moisturizing chamber from the same perspective as shown in FIG. 7;
FIG. 9 is a perspective view of the moisturizing device of the glue spreading nozzle of the present invention with the cover omitted;
fig. 10 is a partial cross-sectional view of the case and the bracket taken along the direction C-C in fig. 2.
Detailed Description
The present invention is described in detail with reference to the embodiments shown in the drawings, but it should be understood that these embodiments are not intended to limit the present invention, and those skilled in the art should understand that functional, methodological, or structural equivalents or substitutions made by these embodiments are within the scope of the present invention.
It should be understood that in the present application, the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be considered as limiting the present disclosure.
Referring to fig. 1 to 10, an embodiment of a moisturizing device for a glue spreading nozzle is disclosed. This spin coating nozzle moisturizing device is at spin coating nozzle that spin coating equipment set up after the playback, to spin coating nozzle moisturize, wash and drying process, perhaps, also can only carry out the moisturizing process to spin coating nozzle after the playback to avoid because the condition emergence of spin coating nozzle that solvent evaporation in the photoetching glue leads to takes place the solidification and the even nozzle of jam takes place to take place.
The rotatable glue homogenizing nozzle of the glue homogenizing equipment is integrally and vertically arranged in the block 11, and the vertically arranged glue homogenizing nozzle 111 and the glue homogenizing nozzle 112 are arranged in the block 11. The spin coater nozzle 111 and the spin coater nozzle 112 are hereinafter collectively referred to as "spin coater nozzle". The block 11 is composed of an upper block 101 and a lower block 102 forming an annular step. The glue spreading nozzle 111 and the glue spreading nozzle 112 integrally extend over the lower end surface of the lower block 102 in the vertical direction, and the insertion hole 150 in fig. 7 is integrally shielded by the lower block 102, so that a moisturizing atmosphere full of moisturizing gas formed by volatilization of the moisturizing liquid is formed by the block 11 together with the cover 10 and the case 20, the moisturizing atmosphere is formed by the moisturizing vapor formed by volatilization of the moisturizing liquid, and the glue spreading nozzle is moisturized by the moisturizing atmosphere.
In this embodiment, the glue spreading nozzle moisturizing device includes: a cover body 10, a box body 20 with a hollow structure arranged below the cover body 10, an inserting hole 150 for vertically inserting the glue homogenizing nozzle is formed on the cover body 10. The box body 20 is internally provided with an overflow plate 202 which is vertically arranged, so that the inner cavity of the box body 20 is divided into a liquid storage cavity 21 and a moisturizing cavity 22 through the overflow plate 202, and the side part of the box body 20 is provided with a first through hole 215 for moisturizing liquid to flow into the liquid storage cavity 21. The excessive moisturizing liquid in the liquid storage cavity 21 is higher than the lowest point of the overflow plate 202, and then overflows into the liquid storage cavity 21, and the overflowing moisturizing liquid is discharged through the waste discharge hole 23, the fourth through hole 331 and the waste liquid discharge device 40.
The glue spreading nozzle is inserted into the rectangular insertion hole 150 (formed along the top view of the cover 10 in fig. 7) to close the moisturizing chamber 22 and the liquid storage chamber 21, and the height of the first through hole 215 in the vertical direction is above the highest liquid level formed by the moisturizing liquid (e.g., acetone) in the liquid storage chamber 21. Acetone is used as an example of the humectant, and other organic solvents having similar chemical properties to acetone (i.e., high volatility at room temperature) may also be used. The box body 20 comprises a bottom plate forming a row of waste holes 23 and four enclosing plates 201 which are vertically arranged and enclosed end to end, and the tops of the enclosing plates 201 form an opening. The cover plate 10 is screwed and fixed by four screws which continuously penetrate through the cover plate 10 and are screwed into four blind holes with internal threads which are concavely arranged on the edge opening at the top of the surrounding plate 201.
Referring to fig. 2 and 10, a first connector 214 communicating with the first through hole 215 is provided at an outer side of the case 20, and the first connector 214 is connected to a plant system or a moisturizing liquid supply tank (not shown) through a moisturizing liquid delivery pipe. The cover 10 is provided with a first contact 214 fitted into the first through hole 215, a second contact 113 fitted into the second through hole 13, and a third contact 114 fitted into the third through hole 14. The cover body 10 forms an accommodating cavity 100 for accommodating the glue homogenizing nozzle, the accommodating cavity 100 is in a flat cubic structure and is vertically arranged, the accommodating cavity 100 is formed above the moisturizing cavity 22 and is communicated with the moisturizing cavity 22, and the volume of the accommodating cavity 100 is smaller than that of the moisturizing cavity 22. Generally, the glue spreading nozzle is only inserted into the receiving cavity 100 in the vertical direction, and the bottom ends 111a and 112a of the glue spreading nozzle are ensured to be positioned in the receiving cavity 100. Since the volume of the accommodating chamber 100 is smaller than that of the moisturizing chamber 22, the delivery of the moisturizing liquid into the moisturizing chamber 22 can be stopped by a small amount of the moisturizing liquid stored in the liquid storage chamber 21. Meanwhile, since the housing chamber 100 is located above the moisture-preserving chamber 22 and the volume of the housing chamber 100 is much smaller than the volume of the moisture-preserving chamber 22, after the spin coating nozzle is inserted into the cover 10 through the insertion hole 150, the two spin coating nozzles can be in a region (i.e., the housing chamber 100) where the concentration of the moisture-preserving liquid vapor formed by the moisture-preserving liquid is higher, so as to improve the moisture-preserving effect of the moisture-preserving liquid vapor formed by volatilization of the moisture-preserving liquid on the spin coating nozzle, thereby preventing the bottom ends 111a and 112a of the spin coating nozzle from curing the photoresist, ensuring that the spin coating nozzle repeatedly sprays the photoresist on the surface of the wafer, and the photoresist is flatly coated on the surface of the wafer to form a layer of photoresist film with uniform thickness during the rotation of the wafer.
For example, in the present embodiment, referring to fig. 5 and fig. 6, the cover body 10 forms an annular air channel 130 and an annular liquid channel 140, the circumferential side wall of the accommodating cavity 100 is provided with a plurality of annularly arranged air injection holes 132 and a plurality of annularly arranged liquid injection holes 142, the air injection holes 132 are communicated with the annular air channel 130, the liquid injection holes 142 are communicated with the annular liquid channel 140, the annular air channel 130 forms a second through hole 13 extending to the outside of the cover body 10, and the annular liquid channel 140 forms a third through hole 14 extending to the outside of the cover body 10. The gas ejection holes 132 and the liquid ejection holes 142 penetrate the circumferential side wall 131 of the housing chamber 100 in a direction facing the housing chamber 100. The gas injection holes 132 and the liquid injection holes 142 are symmetrically arranged and formed at both sides of the receiving cavity 100. The cap body 10 forms an air injection passage 133 obliquely arranged and connecting the annular air passage 130 and the air injection hole 132, and the cap body 10 forms a liquid injection passage 143 horizontally arranged and connecting the annular liquid passage 140 and the liquid injection hole 142. The liquid ejecting passage 143 is located at the end of the receiving cavity 100 to form a circular liquid ejecting hole 142. The gas injection channel 133 is located at the end of the receiving chamber 100 to form a circular gas injection hole 132. Meanwhile, in the embodiment, the lowest points of the liquid spraying holes 142 and the liquid spraying channels 143 are higher than the bottom surface of the annular liquid path 140, so that a small amount of moisturizing liquid is stored in the annular area of the annular liquid path 140 located below the lowest points of the liquid spraying holes 142 and the liquid spraying channels 143, and moisturizing gas generated by volatilization of the moisturizing liquid penetrates through the liquid spraying channels 143 and the liquid spraying holes 142 to form a moisturizing atmosphere in the accommodating cavity 100, thereby further achieving the moisturizing effect of the moisturizing device for the glue homogenizing nozzle.
In this embodiment, two rows of air injection channels 133 are arranged in parallel and form 45 degrees downward sloping arrangement, thereby forming two rows of downward convergent air jets, thereby realizing the operation of blowing partial particles of the possible adhesion outside the glue homogenizing nozzle, and blow the particles to drop down to the moisturizing chamber 22, and finally discharge from the waste discharge hole 23, the fourth through hole 331 and the waste liquid discharging device 40, and effectively prevent blowing falling particles from dropping in the liquid storage chamber 21, thereby ensuring the purity and cleanliness of the moisturizing liquid stored in the liquid storage chamber 21.
Referring to fig. 1 to 3 and 10, the spin coating developing and moisturizing device further includes: a bracket 30 enclosing the box body 20, wherein the bracket 30 and the box body 20 are movably embedded. As shown in fig. 9, the bottom of the moisturizing chamber 22 forms a waste discharge hole 23 through which the moisturizing liquid is discharged from the case 20. This even nozzle moisturizing device of gluing still includes: the waste liquid discharging device 40 is disposed below the bracket 30, the bracket 30 includes a supporting side plate 31 and a supporting bottom plate 33 partially enclosing the bottom of the box body 20, and a mounting block 32 oppositely disposed on the outer side of the supporting side plate 31, the supporting bottom plate 33 forms a fourth through hole 331 communicating with the waste discharging hole 23. Specifically, the waste liquid discharge device 40 includes a waste joint 41 screwed into the fourth through hole 331, and a waste pipe 42 connected to the waste joint 41 and disposed vertically. The bracket 30 is fixedly mounted on the outer side of a glue homogenizing chamber cover (not shown) contained in the glue homogenizing device through two mounting blocks 32 arranged on the outer side wall of the bracket, and is fixedly connected with a main body frame (not shown) of the glue homogenizing device. Meanwhile, the bottom plate forming the row of waste holes 23 forms a step, and is embedded into the step formed at the top of the bearing side plate 31, and the box body 20 and the bracket 30 are connected in a clamping manner, so that the movable connection between the bracket 30 and the box body 20 is realized.
Based on the technical solutions disclosed in the foregoing embodiments, the present embodiment further discloses a glue leveling apparatus. The glue evening equipment comprises a moisturizing device of the glue evening nozzle disclosed in the previous embodiment. The specific technical scheme of the moisturizing device of the glue homogenizing nozzle in the glue homogenizing device is as described above, and is not described herein again.
The above-listed detailed description is only a specific description of a possible embodiment of the present invention, and they are not intended to limit the scope of the present invention, and equivalent embodiments or modifications made without departing from the technical spirit of the present invention should be included in the scope of the present invention.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (10)
1. A glue homogenizing nozzle moisturizing device, comprising:
the glue homogenizing device comprises a cover body, a box body and a glue homogenizing nozzle, wherein the cover body is arranged below the cover body and is provided with a hollow box body, and an insertion hole for vertically inserting the glue homogenizing nozzle is formed in the cover body;
an overflow plate which is vertically arranged is arranged in the box body, so that the inner cavity of the box body is divided into a liquid storage cavity and a moisturizing cavity through the overflow plate, and a first through hole for moisturizing to flow into the liquid storage cavity is formed in the side part of the box body;
the glue homogenizing nozzle is inserted into the insertion hole to close the moisturizing cavity and the liquid storage cavity, and the height of the first through hole in the vertical direction is above the highest liquid level formed by moisturizing liquid in the liquid storage cavity; the cover body is provided with an accommodating cavity for accommodating the glue homogenizing nozzle, the accommodating cavity is formed above the moisturizing cavity and communicated with the moisturizing cavity, and the glue homogenizing nozzle extends to the accommodating cavity.
2. The dispensing nozzle moisturizing device of claim 1, wherein the volume of the receiving chamber is less than the volume of the moisturizing chamber.
3. The glue spreading nozzle moisturizing device according to claim 2, wherein the cover body forms an annular gas path and an annular liquid path, the circumferential side wall of the accommodating cavity is provided with a plurality of gas orifices arranged annularly and a plurality of liquid orifices arranged annularly, the gas orifices are communicated with the annular gas path, the liquid orifices are communicated with the annular liquid path, the annular gas path forms a second through hole extending to the outside of the cover body, and the annular liquid path forms a third through hole extending to the outside of the cover body.
4. The glue spreading nozzle moisturizing device of claim 3, wherein the air injection holes and the liquid injection holes are symmetrically arranged and formed on two sides of the receiving cavity.
5. The glue spreading nozzle moisturizing device of claim 3, wherein the cover body forms an air injection channel that is obliquely arranged and connects the annular air channel and the air injection hole, and the cover body forms a liquid injection channel that is horizontally arranged and connects the annular liquid channel and the liquid injection hole.
6. The glue spreading nozzle moisturizing device as in claim 3, wherein the cover body is provided with a first joint embedded in the first through hole, a second joint embedded in the second through hole, and a third joint embedded in the third through hole.
7. The glue spreading nozzle moisturizing device of any one of claims 1 to 6, further comprising: the bracket surrounds the box body and is movably embedded with the box body.
8. The glue spreading nozzle moisturizing device of claim 7, wherein the bottom of the moisturizing chamber forms a waste hole for the moisturizing liquid to exit the box body;
even gluey nozzle device of moisturizing still includes: set up in the waste liquid eduction gear of bracket below, the bracket includes that the part encloses bearing curb plate, the bearing bottom plate of locating the box body bottom to and the subtend set up in the installation piece in the bearing curb plate outside, the bearing bottom plate form with the fourth through-hole of exhaust hole intercommunication.
9. The glue spreading nozzle moisturizing device of claim 8, wherein the waste liquid discharge device comprises a waste discharge joint screwed into the fourth through hole, and a waste discharge pipe connected with the waste discharge joint and vertically arranged.
10. A glue spreading apparatus, comprising:
a glue spreading nozzle moisturizing device as in any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210392886.3A CN114798264B (en) | 2022-04-15 | 2022-04-15 | Glue homogenizing nozzle moisturizing device and glue homogenizing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210392886.3A CN114798264B (en) | 2022-04-15 | 2022-04-15 | Glue homogenizing nozzle moisturizing device and glue homogenizing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114798264A CN114798264A (en) | 2022-07-29 |
| CN114798264B true CN114798264B (en) | 2023-02-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210392886.3A Active CN114798264B (en) | 2022-04-15 | 2022-04-15 | Glue homogenizing nozzle moisturizing device and glue homogenizing equipment |
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| JP2005169848A (en) * | 2003-12-11 | 2005-06-30 | Seiko Epson Corp | Liquid jet device |
| JP2013159006A (en) * | 2012-02-03 | 2013-08-19 | Seiko Epson Corp | Liquid discharge device, and humidification method |
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| CN113416403A (en) * | 2021-06-18 | 2021-09-21 | 山西中科正泰机械制造有限公司 | Moisturizing material for piezoelectric type spray head of 3D sand mold printer and using method of moisturizing material |
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| CN114798264A (en) | 2022-07-29 |
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