CN114794581A - Heating assembly and microwave heating device - Google Patents
Heating assembly and microwave heating device Download PDFInfo
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- CN114794581A CN114794581A CN202210519222.9A CN202210519222A CN114794581A CN 114794581 A CN114794581 A CN 114794581A CN 202210519222 A CN202210519222 A CN 202210519222A CN 114794581 A CN114794581 A CN 114794581A
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- outer layer
- conductive outer
- heating assembly
- heating
- thermistor
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- A—HUMAN NECESSITIES
- A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
- A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
- A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
- A24F40/40—Constructional details, e.g. connection of cartridges and battery parts
- A24F40/46—Shape or structure of electric heating means
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- A—HUMAN NECESSITIES
- A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
- A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
- A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
- A24F40/40—Constructional details, e.g. connection of cartridges and battery parts
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Abstract
The invention relates to a heating assembly and a microwave heating device. A heating assembly for contacting an aerosolized substrate in a microwave heating apparatus, the heating assembly comprising: an electrically conductive outer layer for transmitting microwaves for heating the atomized matrix; the temperature measuring unit comprises a temperature measuring body arranged in the conductive outer layer; and the first insulating layer is arranged between the conductive outer layer and the temperature measuring body. The conductive outer layer can effectively shield microwaves, the microwaves are prevented from reaching the temperature measuring body, the temperature measuring body cannot generate vortex current under the action of the microwaves, the vortex current is prevented from interfering the temperature of the temperature measuring body, the temperature measuring body can accurately reflect the real-time temperature of the atomized matrix, and therefore the accuracy of the temperature measuring body in measuring the temperature of the atomized matrix is improved.
Description
Technical Field
The invention relates to the technical field of heating atomization, in particular to a heating assembly and a microwave heating device comprising the same.
Background
The microwave heating device heats the atomized substrate in a non-combustible heating mode to atomize the atomized substrate, so that harmful substances in aerosol formed by atomizing the atomized substrate are reduced, and the use health safety of the microwave heating device is improved. Generally, the microwave heating device adopts the resistance wire to heat the atomized matrix, and the mode of heating by the resistance wire can lead to the atomized matrix to be heated unevenly, which causes the phenomena that the atomized matrix is unfavorable for smoking taste, such as dry burning or coking, and the like due to local high temperature. The improved microwave heating device adopts a microwave heating mode, so that the defect that the atomized matrix is heated unevenly can be overcome well, but the improved microwave heating device still has the defect that the heating temperature of the atomized matrix cannot be accurately detected and regulated.
Disclosure of Invention
The invention solves the technical problem of improving the accuracy of the heating assembly for measuring the temperature.
A heating assembly for contacting an aerosolized substrate in a microwave heating apparatus, the heating assembly comprising:
an electrically conductive outer layer for transmitting microwaves for heating the atomized matrix;
the temperature measuring unit comprises a temperature measuring body arranged in the conductive outer layer; and the first insulating layer is arranged between the conductive outer layer and the temperature measuring body.
In one embodiment, the temperature measuring unit further comprises a base body made of an insulating material, and the temperature measuring body is attached to the base body.
In one embodiment, the temperature measuring unit further comprises a base body and a second insulating layer, the base body is made of a conductive material, and the second insulating layer is located between the base body and the temperature measuring body.
In one embodiment, the first insulating layer is solid and has a thickness of no more than 1 mm.
In one embodiment, the thickness of the conductive outer layer is not more than 1mm, and the thickness of the conductive outer layer is larger than the skin depth of the microwave in the microwave heating cavity in the conductive outer layer.
In one embodiment, the conductive layer further comprises a smooth protective layer attached to the conductive outer layer.
In one embodiment, the heating element is a sheet or column structure having spikes.
In one embodiment, the temperature measuring unit further includes a conducting wire, a positive electrode body and a negative electrode body outside the microwave heating cavity, the positive electrode body and the negative electrode body are both disposed on the temperature measuring body, and the positive electrode body and the negative electrode body are both electrically connected to different conducting wires.
In one embodiment, the first insulating layer and the conductive outer layer are both attached using a plating, printing, or dip coating process.
In one embodiment, the temperature measuring body is a thermistor.
In one embodiment, the method further comprises at least one of the following steps:
the conductive outer layer is made of copper, aluminum or stainless steel materials;
the first insulating layer is made of a high polymer material or a ceramic material, or the first insulating layer is a gas layer.
A microwave heating device comprises a containing body and the heating assembly, wherein the containing body is provided with a heating cavity used for containing atomized matrixes, the heating assembly penetrates through the containing body and is used for being inserted into the atomized matrixes, and the conductive outer layer is electrically connected with the containing body.
One technical effect of one embodiment of the invention is that: the conductive outer layer can effectively shield microwaves, the microwaves are prevented from reaching the temperature measuring body, the temperature measuring body cannot generate vortex current under the action of the microwaves, the vortex current is prevented from interfering the temperature of the temperature measuring body, the temperature measuring body can accurately reflect the real-time temperature of the atomized matrix, and therefore the accuracy of the temperature measuring body for measuring the temperature of the atomized matrix is improved.
Drawings
Fig. 1 is a schematic partial sectional view of a microwave heating device according to an embodiment;
FIG. 2 is a schematic plan sectional view of a heating assembly provided in a first embodiment of a microwave heating apparatus;
FIG. 3 is a schematic plan view of the heating assembly of FIG. 2 inserted into an atomizing substrate;
FIG. 4 is a schematic plan sectional view of a heating assembly provided in a second embodiment of the microwave heating apparatus;
fig. 5 is a schematic plan sectional view of a heating assembly provided in a third embodiment of the microwave heating apparatus.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "inner", "outer", "left", "right" and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Referring to fig. 1, 2 and 3, a microwave heating apparatus 10 according to an embodiment of the present invention includes a heating element 11 and a container 12, where the container 12 may have a cylindrical structure, such as a prism or a cylinder. The container 12 encloses a microwave heating chamber 12a, and the microwave heating chamber 12a can be used as a resonant cavity for propagating microwaves. The frequency of the microwave can be 2.45GHz, and the resonant frequency of the resonant cavity is matched with the frequency of the microwave, so that the microwave can be smoothly transmitted in the microwave heating cavity 12 a. The atomized substrate 20 is accommodated in the microwave heating cavity 12a, so that the atomized substrate 20 can absorb the microwaves in the microwave heating cavity 12a, the atomized substrate 20 after absorbing the microwaves generates heat through the microwave heating principle, and finally the atomized substrate 20 is atomized under the action of the heat to form aerosol for the user to suck. The accommodating body 12 is made of a metal material, and the accommodating body 12 has a certain thickness, so that the accommodating body 12 has a good shielding function for microwaves, and for the microwaves in the microwave heating cavity 12a, the microwaves cannot pass through the accommodating body 12 and leak out of the microwave heating cavity 12a, so that on one hand, the microwave loss can be prevented, and the energy utilization rate of the microwave heating device 10 is improved. On the other hand, radiation damage caused by microwave leakage can be prevented, and the safety of the microwave heating device 10 in use is improved.
The heating element 11 is disposed in the container 12 such that a major portion of the heating element 11 is located inside the microwave heating cavity 12a and a minor portion of the heating element 11 is located outside the microwave heating cavity 12 a. When the atomized substrate 20 is received within the microwave heating chamber 12a, the heating assembly 11 may be inserted into the atomized substrate 20 such that the atomized substrate 20 coats the heating assembly 11. On the one hand, the atomizing substrate 20 is ensured to directly contact the heating assembly 11, so that the heat generated by the atomizing substrate 20 is rapidly transferred to the heating assembly 11, and then the heating assembly 11 is rapidly raised to the same temperature as the atomizing substrate 20, thereby laying a foundation for the heating assembly 11 to accurately detect the temperature of the atomizing substrate 20. On the other hand, the heating assembly 11 can support and limit the atomized substrate 20 to ensure that the atomized substrate 20 has a correct receiving position in the microwave heating chamber 12 a. The atomized substrate 20 may be in a granular or fibrous form, the atomized substrate 20 is wrapped and formed by an inclusion, and then is contained in the microwave heating cavity 12a, and the inclusion may be made of a paper material or the like.
The heating element 11 may be a sheet-like structure or a columnar structure, and the heating element has a spike portion at an end thereof, and by providing the spike portion, resistance generated when the heating element 11 is inserted into the atomized medium 20 can be reduced, thereby ensuring that the heating element 11 is smoothly inserted into the atomized medium 20. The heating element 11 includes a temperature measuring unit 100, a first insulating layer 200, and a conductive outer layer 300.
Referring to fig. 2 and 3, in the first embodiment, the temperature measuring unit 100 includes a temperature measuring body, a positive electrode body 121, a negative electrode body 122, and a lead 123 (see fig. 1). The Temperature measuring body may be a thermistor 110, the thermistor 110 has a resistance Temperature coefficient, which may be a positive Temperature coefficient, such that the thermistor 110 is an ntc (negative Temperature coefficient) thermistor 110, that is, the resistance of the thermistor 110 increases with the increase of Temperature, when the Temperature of the thermistor 110 increases to be greater than a critical Temperature, the resistance of the thermistor 110 increases by multiple orders of magnitude in an exponential relationship from an initial range, such that the thermistor 110 is converted from a conductor to an insulating layer, and when the Temperature of the thermistor 110 decreases to be equal to or less than the critical Temperature, the resistance of the thermistor 110 rapidly returns to the initial range, such that the thermistor 110 returns to a conductor. A portion of the thermistor 110 is located within the microwave heating chamber 12a and another portion of the thermistor 110 is located outside the microwave heating chamber 12 a. The number of the wires 123 is two, and the number of the positive electrode bodies 121 and the negative electrode bodies 122 is one. The lead 123, the positive electrode 121 and the negative electrode 122 may be located outside the microwave heating cavity 12a, the positive electrode 121 and the negative electrode 122 may be conical welding stages, the positive electrode 121 and the negative electrode 122 are respectively welded to the thermistor 110 located outside the microwave heating cavity 12a and located at different positions of the thermistor 110, one end of one lead 123 is electrically connected to the positive electrode 121, and one end of the other lead 123 is electrically connected to the negative electrode 122. The wire 123, the thermistor 110, the positive electrode body 121 and the negative electrode body 122 may form a circuit loop, and specifically, when the temperature of the thermistor 110 changes, the resistance of the thermistor 110 changes, and then the voltage or current of the whole circuit loop changes, so that the voltage or current of the circuit loop and the temperature of the thermistor 110 form a one-to-one correspondence relationship, and the temperature of the thermistor 110 may be measured by measuring the voltage or current of the circuit loop. Of course, since the temperature of the thermistor 110 and the resistance value of the thermistor 110 form a one-to-one correspondence relationship, the temperature of the thermistor 110 can also be determined by directly measuring the resistance value of the thermistor 110.
Referring to FIG. 4, in the second embodiment, compared with the first embodiment, the temperature measuring unit 100 of the second embodiment further includes a base 130, i.e. the base 130 is added to the temperature measuring unit 100 of the second embodiment in structure compared with the temperature measuring unit 100 of the first embodiment. The substrate 130 is made of a non-metal material, so that the substrate 130 is an insulating layer, the thermistor 110 is directly attached to the substrate 130, and the thermistor 110 can be attached by a coating, electroplating, printing or dip-coating process. The base 130 has two surfaces facing opposite directions in its thickness direction, and the thermistor 110 may be attached to both surfaces. The thickness of the thermistor 110 is small, and the thickness of the base 130 can be much greater than that of the thermistor 110, so that the base 130 has higher bending resistance than the thermistor 110, thereby reasonably improving the mechanical strength of the entire heating assembly 11 and preventing the heating assembly 11 from being damaged due to bending deformation or even complete fracture during the insertion of the atomizing substrate 20.
Referring to fig. 5, in the third embodiment, compared with the second embodiment, the temperature measuring unit 100 of the third embodiment further includes a second insulating layer 140, that is, the second insulating layer 140 is added to the structure of the temperature measuring unit 100 of the third embodiment, compared with the temperature measuring unit 100 of the second embodiment, and the base 130 of the temperature measuring unit 100 of the third embodiment is made of a metal material, so that the base 130 is a conductor. The second insulating layer 140 may be made of a solid material such as a polymer material or ceramic, and the second insulating layer 140 is directly attached to the substrate 130, but the second insulating layer 140 may also be a gas layer made of gas. The base 130 has two surfaces facing opposite directions in its thickness direction, and the second insulating layer 140 may be attached to both surfaces. The thermistor 110 is directly attached to the second insulating layer 140, the thermistor 110 can be attached to the portion of the second insulating layer 140 on one surface of the substrate 130, the thermistor 110 can be attached to the portion of the second insulating layer 140 on the other surface of the substrate 130, and the thermistor 110 can be attached by a plating, electroplating, printing or dip coating process. The second insulating layer 140 can provide good insulation between the thermistor 110 and the metal substrate 130. Likewise, the thickness of both the thermistor 110 and the second insulating layer 140 is small, so that the thickness of the base 130 can be much greater than that of the thermistor 110, and can also be much greater than that of the second insulating layer 140, so that the base 130 has higher bending resistance than the thermistor 110 and the second insulating layer 140, thereby reasonably improving the mechanical strength of the whole heating assembly 11 and preventing the heating assembly 11 from being damaged during the process of inserting the atomizing substrate 20.
In some embodiments, the first insulating layer 200 may be made of an insulating non-metallic material such as a polymer material or ceramic, and the first insulating layer 200 is directly attached to the thermistor 110 by a plating, electroplating, printing or dip coating process, so that the portion of the thermistor 110 located in the microwave heating cavity 12a is completely covered by the first insulating layer 200, and the portion of the thermistor 110 located outside the microwave heating cavity 12a is also covered by the first insulating layer 200. The thickness of the first insulating layer 200 is relatively thin, the thickness of the first insulating layer 200 is not more than 1mm, for example, the specific value of the thickness of the first insulating layer 200 may be 1mm, 0.8mm, or 0.5 mm. In view of the thin thickness of the first insulating layer 200, the entire heating element 11 is relatively thin, thereby achieving a miniaturized design of the heating element 11. The first insulating layer 200 has good thermal conductivity, and can ensure rapid heat transfer to the thermistor 110 through the first insulating layer 200. In other embodiments, the first insulating layer 200 may be a gas layer, i.e., the first insulating layer 200 is a gas filled between the thermistor 110 and the conductive outer layer 300.
In some embodiments, the conductive outer layer 300 may be made of copper, aluminum, or stainless steel, and it is apparent that the conductive outer layer 300 is a conductor. The conductive outer layer 300 may be directly attached to the first insulating layer 200 by a plating, electroplating, printing or dip coating process, so that the portion of the first insulating layer 200 located in the microwave heating cavity 12a is completely covered by the conductive outer layer 300, and the portion of the first insulating layer 200 located outside the microwave heating cavity 12a may also be covered by the conductive outer layer 300. Whereas the conductive outer layer 300 covers the first insulating layer 200, the conductive outer layer 300 will also cover the thermistor 110. The thickness of the conductive outer layer 300 is relatively thin, and the thickness of the conductive outer layer 300 is not more than 1mm, for example, the specific value of the thickness of the conductive outer layer 300 may be 1mm, 0.8mm, or 0.5 mm. The thickness of the conductive outer layer 300 is thin, so that the entire heating assembly 11 is relatively thin, thereby achieving a miniaturized design of the heating assembly 11.
Since the conductive outer layer 300 is a conductor and covers the thermistor 110, the conductive outer layer 300 can shield the microwaves, so that the microwaves in the microwave heating cavity 12a cannot enter the thermistor 110 through the conductive outer layer 300, in other words, the microwaves in the microwave heating cavity 12a can be effectively prevented from acting on the thermistor 110 through the shielding effect of the conductive outer layer 300. For microwaves with a frequency of 2.45GHz, the surface layer of the conductive outer layer 300 can generate current under the action of the microwaves, and the deep layer of the conductive outer layer 300 cannot generate current, so the microwaves cannot penetrate through the deep layer of the conductive outer layer 300, and the thickness of the surface layer of the conductive outer layer 300 with the current can be recorded as a skin depth, which can represent the penetration depth of the microwaves in the conductive outer layer 300, for example, the skin depth of the copper conductive outer layer 300 is 1.3171 μm, that is, the maximum penetration depth of the microwaves in the copper conductive outer layer 300 is 1.3171 μm, and when the thickness of the copper conductive outer layer 300 is greater than the skin depth, the microwaves are effectively prevented from penetrating through the whole copper conductive outer layer 300, so that the shielding effect of the copper conductive outer layer 300 on the microwaves is fully exerted. Also, for example, the skin depth of the aluminum conductive outer layer 300 is 1.6567 μm, that is, the maximum penetration depth of the microwave in the aluminum conductive outer layer 300 is 1.6567 μm, when the thickness of the aluminum conductive outer layer 300 is greater than the skin depth, the microwave is effectively prevented from penetrating through the entire aluminum conductive outer layer 300, and the shielding effect of the aluminum conductive outer layer 300 on the microwave can be fully exerted.
Therefore, when the thickness of the conductive outer layer 300 is greater than the skin depth of the microwave, the shielding function of the conductive outer layer 300 against the microwave can be effectively ensured, thereby preventing the microwave from acting on the thermistor 110.
The conductive outer layer 300 directly contacts the container 12 such that a conductive connection is formed between the conductive outer layer 300 and the container 12. Thus, when microwaves are emitted into the microwave heating chamber 12a through the other antenna, the length of the conductive outer layer 300 may be such that the microwave heating chamber 12a has a reasonable resonant frequency, such that the conductive outer layer 300 functions to transmit microwaves, ensuring that relatively high microwave energy is present near the conductive outer layer 300, thereby achieving rapid heating of the atomized substrate 20, and also improving the utilization of the microwave energy and the thermal efficiency of the microwave heating apparatus 10. Without the additional antenna, the conductive outer layer 300 itself may act as an antenna, i.e., emit microwaves directly through the conductive outer layer 300 into the microwave heating chamber 12a, again with relatively high microwave energy in the vicinity of the conductive outer layer 300 to achieve rapid heating of the aerosolized matrix 20.
When the microwave heating apparatus 10 is in operation, the heating assembly 11 is inserted into the nebulizing matrix 20, and the nebulizing matrix 20 directly overlies the electrically conductive outer layer 300 such that the nebulizing matrix 20 directly contacts the electrically conductive outer layer 300. In the case that the atomizing substrate 20 absorbs the microwave to heat and atomize, the heat on the atomizing substrate 20 will sequentially pass through the conductive outer layer 300 and the first insulating layer 200 to reach the thermistor 110, so that the thermistor 110 absorbs the heat and rapidly rises to the same temperature as the atomizing substrate 20, and since the temperature of the thermistor 110 and the resistance thereof form a one-to-one correspondence relationship, or the temperature of the thermistor 110 and the current or voltage on the thermistor 110 form a one-to-one correspondence relationship, the temperature of the thermistor 110 can be measured by detecting the resistance, the current or the voltage of the thermistor 110, and then the temperature of the atomizing substrate 20 can be measured. Since the temperature of the aerosol substrate 20 can be measured by the thermistor 110, the heating temperature of the aerosol substrate 20 can be reasonably controlled by the temperature information fed back by the thermistor 110, the heating temperature of the aerosol substrate 20 is prevented from being controlled in a reasonable range, and the phenomenon of dry burning or coking of the aerosol substrate 20 due to overhigh temperature is avoided, so that the smoking taste of the aerosol is improved.
If the metal shield and the first insulating layer 200 are not provided, the microwave in the microwave heating chamber 12a will directly act on the thermistor 110, and a vortex current will be induced on the thermistor 110. This, on the one hand, causes the thermistor 110 to disturb the energy distribution of the microwaves in the microwave heating chamber 12a, so that the atomized substrate 20 cannot sufficiently absorb the microwaves, thereby seriously affecting the rate of temperature rise of the atomized substrate 20 and the thermal efficiency of the entire microwave heating apparatus 10. On the other hand, the eddy current on the thermistor 110 will make the thermistor 110 unable to reflect the true temperature of the nebulized substrate 20, thereby affecting the accuracy of the temperature measurement by the thermistor 110. On the other hand, the thermistor 110 has a relatively sharp protrusion, which is liable to cause the thermistor 110 to discharge in the microwave heating cavity 12a according to the point discharge principle, thereby affecting the safety of the whole microwave heating apparatus 10.
For the heating element 11 of the above embodiment, the conductive outer layer 300 can effectively shield the microwave and prevent the microwave from reaching the thermistor 110, which will result in the following advantages: firstly, the thermistor 110 does not generate eddy current under the action of microwaves, so that the eddy current is prevented from interfering the temperature of the thermistor 110, the thermistor 110 accurately reflects the real-time temperature of the atomized substrate 20, the accuracy of the thermistor 110 in measuring the temperature of the atomized substrate 20 is improved, and a foundation is laid for the microwave heating device 10 to accurately regulate and control the temperature of the atomized substrate 20 through the temperature information accurately fed back by the thermistor 110. Secondly, the thermistor 110 cannot interfere with the microwave distribution in the microwave heating chamber 12a, and the thermistor 110 is prevented from destroying the energy density distribution of the microwaves in the microwave heating chamber 12a, so that the microwave energy is sufficiently absorbed by the atomized substrate 20, and the atomized substrate 20 is ensured to absorb enough microwaves per unit time, thereby increasing the temperature rise rate of the atomized substrate 20 and the thermal efficiency of the entire microwave heating apparatus 10. Thirdly, the thermistor 110 does not generate a point discharge phenomenon, thereby improving the safety of the microwave heating apparatus 10.
Moreover, the thicknesses of the first insulating layer 200 and the conductive outer layer 300 are small, which is beneficial to the light and thin design of the heating element 11; the good adhesion between the first insulating layer 200, the conductive outer layer 300 and the thermistor 110, in addition to the good thermal conductivity of the first insulating layer 200 and the conductive outer layer 300, can reduce the heat capacity of the first insulating layer 200 and the conductive outer layer 300, thereby reducing the heat capacity of the entire heating assembly 11. In this way, in the process that the heat of the atomizing substrate 20 is transferred to the thermistor 110 through the first insulating layer 200 and the conductive outer layer 300, the first insulating layer 200, the conductive outer layer 300 and the thermistor 110 can be rapidly raised to the same temperature as the atomizing substrate 20 in a short time, so that the real-time temperature of the atomizing substrate 20 can be accurately detected by the thermistor 110, the phenomenon of delay and delay in temperature measurement by the thermistor 110 is prevented, and the accuracy and the sensitivity of the thermistor 110 in temperature measurement are improved.
In some embodiments, the heating assembly 11 may further include a smooth protective layer, the surface of which is smooth and has high corrosion resistance. The smooth protective layer is assisted on the conductive outer layer 300, and the portion of the conductive outer layer 300 located within the microwave heating cavity 12a may be entirely covered by the smooth protective layer. By providing the smooth protective layer, the insertion resistance of the heating assembly 11 into the atomized substrate 20 can be reduced, and the condensate generated during the heating process of the atomized substrate 20 can be prevented from adhering to the heating assembly 11, thereby avoiding the influence of the condensate on the heat capacity of the whole heating assembly 11 and ensuring the accuracy and sensitivity of the thermistor 110 to temperature measurement. Meanwhile, the smooth protective layer can prevent the conductive outer layer 300 from being oxidized, and prevent the oxidized conductive outer layer 300 from influencing the microwave shielding performance and the resonant frequency of the microwave heating cavity 12 a.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (12)
1. A heating assembly for contacting an aerosolized substrate in a microwave heating apparatus, the heating assembly comprising:
an electrically conductive outer layer for transmitting microwaves for heating the atomized matrix;
the temperature measuring unit comprises a temperature measuring body arranged in the conductive outer layer; and
the first insulating layer is arranged between the conductive outer layer and the temperature measuring body.
2. The heating assembly of claim 1, wherein the thermometric unit further comprises a substrate made of an insulating material, the thermometric body being attached to the substrate.
3. The heating assembly of claim 1, wherein the thermometric unit further comprises a base body made of an electrically conductive material and a second insulating layer located between the base body and the thermometric body.
4. The heating element of claim 1, wherein the first insulating layer is solid and has a thickness of no more than 1 mm.
5. The heating assembly of claim 1, wherein the thickness of the conductive outer layer is no more than 1mm and is greater than the skin depth of microwaves within the microwave heating cavity within the conductive outer layer.
6. The heating assembly of claim 1, further comprising a lubricious protective layer adhered to the conductive outer layer.
7. The heating assembly of claim 1, wherein the heating assembly is a sheet or column structure having spikes.
8. The heating assembly of claim 1, wherein the temperature measuring unit further comprises a conducting wire, a positive electrode body and a negative electrode body, the conducting wire, the positive electrode body and the negative electrode body are located outside the microwave heating cavity, the positive electrode body and the negative electrode body are both disposed on the temperature measuring body, and the positive electrode body and the negative electrode body are both electrically connected with different conducting wires.
9. The heating assembly of claim 1, wherein both the first insulating layer and the conductive outer layer are attached using a plating, printing, or dip coating process.
10. A heating assembly according to claim 1, wherein the temperature sensing body is a thermistor.
11. The heating assembly of claim 1, further comprising at least one of:
the conductive outer layer is made of copper, aluminum or stainless steel materials;
the first insulating layer is made of a high polymer material or a ceramic material, or the first insulating layer is a gas layer.
12. A microwave heating device, comprising a housing and the heating assembly of any one of claims 1 to 11, wherein the housing has a heating cavity for receiving the atomized substrate, the heating assembly is inserted into the housing and is inserted into the atomized substrate, and the conductive outer layer is electrically connected to the housing.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210519222.9A CN114794581A (en) | 2022-05-13 | 2022-05-13 | Heating assembly and microwave heating device |
| PCT/CN2023/083983 WO2023216741A1 (en) | 2022-05-13 | 2023-03-27 | Heating assembly and microwave heating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210519222.9A CN114794581A (en) | 2022-05-13 | 2022-05-13 | Heating assembly and microwave heating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114794581A true CN114794581A (en) | 2022-07-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210519222.9A Pending CN114794581A (en) | 2022-05-13 | 2022-05-13 | Heating assembly and microwave heating device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN114794581A (en) |
| WO (1) | WO2023216741A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115399509A (en) * | 2022-09-21 | 2022-11-29 | 北京航天雷特机电工程有限公司 | Control method for microwave heating of cigarette smoking set |
| WO2023216741A1 (en) * | 2022-05-13 | 2023-11-16 | 海南摩尔兄弟科技有限公司 | Heating assembly and microwave heating device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104913350A (en) * | 2015-06-29 | 2015-09-16 | 广东美的厨房电器制造有限公司 | Temperature measurement assembly for microwave equipment and microwave equipment with temperature measurement assembly |
| CN108261050B (en) * | 2018-03-29 | 2023-10-31 | 广东美的厨房电器制造有限公司 | Temperature measuring device and microwave cooking utensil |
| CN210143835U (en) * | 2019-06-19 | 2020-03-17 | 云南巴菰生物科技有限公司 | Coaxial heating chamber and electronic cigarette device with same |
| CN113925220A (en) * | 2021-11-16 | 2022-01-14 | 深圳麦时科技有限公司 | Aerosol generating device |
| CN114009840B (en) * | 2021-12-06 | 2024-10-11 | 深圳麦克韦尔科技有限公司 | Atomizer and electronic atomization device |
| CN114391670A (en) * | 2021-12-30 | 2022-04-26 | 深圳麦时科技有限公司 | Atomizing device and microwave heating assembly |
| CN114794581A (en) * | 2022-05-13 | 2022-07-29 | 海南摩尔兄弟科技有限公司 | Heating assembly and microwave heating device |
-
2022
- 2022-05-13 CN CN202210519222.9A patent/CN114794581A/en active Pending
-
2023
- 2023-03-27 WO PCT/CN2023/083983 patent/WO2023216741A1/en unknown
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023216741A1 (en) * | 2022-05-13 | 2023-11-16 | 海南摩尔兄弟科技有限公司 | Heating assembly and microwave heating device |
| CN115399509A (en) * | 2022-09-21 | 2022-11-29 | 北京航天雷特机电工程有限公司 | Control method for microwave heating of cigarette smoking set |
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