CN114791651B - Transistor outline package optical transceiver - Google Patents
Transistor outline package optical transceiver Download PDFInfo
- Publication number
- CN114791651B CN114791651B CN202110098687.7A CN202110098687A CN114791651B CN 114791651 B CN114791651 B CN 114791651B CN 202110098687 A CN202110098687 A CN 202110098687A CN 114791651 B CN114791651 B CN 114791651B
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- optical
- transistor
- transistor outline
- outline package
- optical signal
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4245—Mounting of the opto-electronic elements
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/40—Transceivers
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Light Receiving Elements (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
A transistor outline package optical transceiver includes a transistor outline package, a package base, a plurality of optical components, and a plurality of optical path components. The component seat is arranged inside the transistor outline package. The optical assembly includes a laser first photodetector and a second photodetector. The light path component comprises a first reflecting mirror, a second reflecting mirror, a first optical filter and a second optical filter. The laser emits an output optical signal out of the transistor outline package. The output optical signal sequentially passes through the first optical filter and the second optical filter, the first input optical signal sequentially passes through the second optical filter and the first reflecting mirror to be reflected to the first photoelectric detector, and the second input optical signal sequentially passes through the second optical filter and sequentially passes through the first optical filter and the second reflecting mirror to be reflected to the second photoelectric detector. The invention can effectively reduce the materials for transistor appearance encapsulation, and reduce the times of airtight encapsulation and optical coupling of transistor appearance encapsulation, thereby effectively reducing the complexity of assembly procedures.
Description
Technical Field
The present invention relates to a transistor outline package optical transceiver, and more particularly, to a transistor outline package optical transceiver employing a single-fiber three-way transistor outline package mode.
Background
Optical fiber communication networks have low transmission loss, high data security, excellent interference immunity, and ultra-large bandwidth, and are among the most important basic components in the optical fiber communication technology, wherein an optical transceiver (Optical Transceiver) for receiving optical signals from the optical fiber network and converting the optical signals into electrical signals for transmission, and/or converting the electrical signals into optical signals for transmission through the optical fiber network.
However, the conventional single-fiber three-way device is assembled by three independent transistor outline package components, each transistor outline package component needs to be subjected to separate processes such as bonding, gold wire bonding, airtight packaging and the like, and needs to be optically coupled with an optical filter respectively, so that the assembly process is complex, and the yield of products are affected.
Disclosure of Invention
Accordingly, in one embodiment of the present invention, a transistor outline package optical transceiver is provided, which can reduce the size of components and simplify the assembly process, so as to improve the stability of the components.
An embodiment of the invention discloses a transistor outline package optical transceiver, which is characterized by comprising a transistor outline package; the assembly seat is arranged inside the transistor outline package; the optical components comprise a laser, a first photoelectric detector and a second photoelectric detector, and are arranged on the component seat, wherein the laser emits an output optical signal and outputs the output optical signal to the outside of the transistor outline package; the plurality of light path components comprise a first reflecting mirror and a second reflecting mirror which are arranged on the component seat; the first optical filter and the second optical filter are arranged on the assembly seat and are arranged on the optical path of the output optical signal, wherein the output optical signal sequentially passes through the first optical filter and the second optical filter, a first input optical signal is sequentially reflected to the first photoelectric detector through the second optical filter and the first reflecting mirror, and a second input optical signal is sequentially reflected to the second photoelectric detector through the second optical filter and the first optical filter and the second reflecting mirror.
Another embodiment of the present invention discloses a transistor outline package optical transceiver, which is characterized by comprising a transistor outline package, including a transistor outline head and a transistor outline cap, wherein the transistor outline head is coupled with the transistor outline cap; the assembly seat is arranged at the head part of the appearance of the transistor; the optical components comprise a laser, a first photoelectric detector and a second photoelectric detector, and are arranged on the head part of the appearance of the transistor, wherein the laser emits an output optical signal and transmits the output optical signal to the outside of the appearance package of the transistor; the plurality of light path components comprise a first reflecting mirror and a second reflecting mirror which are arranged on the component seat; the first optical filter and the second optical filter are arranged on the assembly seat and are arranged on the optical path of the output optical signal, wherein the output optical signal sequentially passes through the first optical filter and the second optical filter, a first input optical signal is sequentially reflected to the first photoelectric detector through the second optical filter and the first reflecting mirror, and a second input optical signal is sequentially reflected to the second photoelectric detector through the second optical filter and the first optical filter and the second reflecting mirror.
According to an embodiment of the invention, the transistor outline package includes a transistor outline header for disposing the component base; and a transistor profile cap coupled to the transistor profile head and forming a closed space with the transistor profile head to accommodate the component holder, the optical component and the optical path component.
According to an embodiment of the invention, the component seat has a component setting surface, and the optical component and the optical path component are disposed on the component setting surface.
According to an embodiment of the present invention, the first photodetector is a PIN diode, and the second photodetector is an avalanche photodetector.
According to an embodiment of the present invention, the component seat is integrally formed with the transistor outline header.
According to an embodiment of the present invention, the semiconductor device further includes a 45 degree mirror for reflecting the output optical signal so that the output optical signal is transmitted outside the transistor outline package.
According TO the transistor outline package optical transceiver provided by the embodiment of the front cover of , a laser and two photodetectors with different wavelengths are mounted in a single transistor outline package (for example, a TO85 device), compared with the traditional single-fiber three-way device which is formed by respectively assembling three independent transistor outline package components, the material of the transistor outline head and the transistor outline cap can be effectively reduced, the number of times of airtight packaging of the transistor outline head, the transistor outline cap and optical coupling is reduced, the complexity of an assembly procedure is effectively reduced, and the yield and the output of products are relatively improved.
Drawings
Fig. 1 is a schematic diagram of a transistor outline package optical transceiver according to an embodiment of the invention.
Fig. 2 shows a schematic view of a transistor outline package optical transceiver according to an embodiment of the invention, with the transistor outline cap 16 removed.
Fig. 3 shows a side view of a transistor outline package optical transceiver according to an embodiment of the invention, with the transistor outline cap 16 removed and an illustration of the optical path added.
Description of the main reference signs
10. Transistor outline package optical transceiver
12. Optical fiber terminal
14. Transistor profile header
16. Transistor outline cap
18. Pin of electric conductor
20. Assembly seat
22. Component mounting surface
32. Laser device
34. First photodetector
36. Second photodetector
38. Monitoring type photoelectric detector
41 45-degree reflecting mirror
43. First optical filter
45. Second optical filter
47. First reflecting mirror
49. Second reflecting mirror
L1 output optical signal
L2, L3 input optical signal
The invention will be further described in the following detailed description in conjunction with the above-described figures.
Detailed Description
For the purpose of facilitating an understanding and practicing the invention by those of ordinary skill in the art, reference will be made to the following detailed description of the invention taken in conjunction with the drawings and examples, it being understood that the invention provides many applicable inventive concepts which can be embodied in a wide variety of specific forms. Those skilled in the art may utilize the details of these and other embodiments and other available structures, logical and electrical changes, and may be made to practice the invention without departing from the spirit or scope thereof.
The present description provides various examples to illustrate the features of various embodiments of the present invention. The arrangement of the elements in the embodiments is illustrative and not intended to limit the invention. And repetition of reference numerals in the embodiments is for simplicity of illustration and does not in itself dictate a relationship between the various embodiments. Wherein like reference numerals are used to refer to like or similar elements throughout the several views. The illustrations in this specification are in simplified form and are not drawn to precise scale. For clarity and ease of description, directional terms, such as top, bottom, up, down, and diagonal, are used with respect to the accompanying drawings. The directional terms used in the following description should not be construed to limit the scope of the invention unless explicitly used in the claims appended hereto.
Furthermore, in describing some embodiments of the present invention, the specification may have presented the method and/or process of the present invention as a particular sequence of steps. However, the methods and processes are not necessarily limited to the specific order of steps described, as they may not be performed in accordance with the specific order of steps described. Other sequences are possible as will be apparent to those skilled in the art. Accordingly, the particular sequence of steps described in the specification is not intended to limit the scope of the claims. Furthermore, the scope of the present application is not limited to the order of the steps performed in the methods and/or processes, and those skilled in the art will appreciate that adjusting the order of the steps performed does not depart from the spirit and scope of the present invention.
Fig. 1 is a schematic diagram of a transistor outline package optical transceiver according to an embodiment of the invention. According to the embodiment of the invention, the optical transceiver adopts a single-fiber three-way transistor appearance packaging mode. As shown, a transistor outline (Transistor Outline, TO) packaged optical transceiver 10 according TO an embodiment of the present invention is connected TO a fiber terminal 12, and the fiber terminal 12 is used TO align an optical transmission axis between the transistor outline packaged optical transceiver 10 and an optical fiber. The transistor outline package optical transceiver 10 includes a transistor outline package that is made up of a transistor outline header 14 and a transistor outline cap 16. The transistor outline portion 14 and the transistor outline cap portion 16 are assembled in an airtight state, and form a closed space. In addition, the bottom of transistor form header 14 extends a plurality of electrical conductor pins 18 through transistor form header 14. In this embodiment, the header pins 18 are in an in-line arrangement, and in other embodiments may be in a circular arrangement to achieve better RF performance at high frequency ranges.
Fig. 2 shows a schematic view of a transistor outline package optical transceiver according to an embodiment of the invention, with the transistor outline cap 16 removed. As shown, the transistor outline (Transistor Outline, TO) package optical transceiver 10 according TO an embodiment of the present invention further includes a component mount 20. The package base 20 is provided in a closed space in the transistor outline package constituted by the transistor outline header 14 and the transistor outline cap 16, and is provided on the transistor outline header 14. In this embodiment, the component holder 20 and the transistor outline portion 14 are separate components, and the component holder 20 may be disposed on the transistor outline portion 14 by adhesion, and in other embodiments, the component holder 20 may be integrally formed with the transistor outline portion 14. In fig. 2, a plurality of optical components and optical path components are also shown, which are also disposed in the enclosed space within the transistor outline package formed by the transistor outline header 14 and the transistor outline cap 16, as will be described in more detail below.
Fig. 3 shows a side view of a transistor outline package optical transceiver according to an embodiment of the invention, with the transistor outline cap 16 removed and an illustration of the optical path added. According to the optical transceiver of the embodiment of the invention, the FTTH technical scheme based on the Ethernet passive optical network (EP 0N) and the gigabit passive optical network (GP 0N) adopts the three-wavelength distribution scheme of 1310nm, 1490nm and 1550 nm. Wherein the optical signal wavelength 1490nm is used for downloading voice, data and IP video signals; the optical signal wavelength is 1550nm, which is used for downloading the analog video signal; the optical signal wavelength 1.3.0 nm is specially used for uploading data and IP video signals. As shown in fig. 3, a plurality of optical components are mounted on the component mounting face 22 of the component mount 20, the optical components including a laser 32, a first photodetector 34, and a second photodetector 36. The laser 32 is a light source. In an optical communication system, a light emitting diode or a laser diode is generally used as a light source. According to one embodiment of the present invention, the laser 22 may include a single or a plurality of vertical cavity surface emitting laser diodes (Vertical Cavity Surface Emitting Laser Diode, VCSELs) or surface emitting laser diodes (VCSELs) that form an array and are driven by a driver chip to emit optical signals. In other embodiments, other components that can be used as light sources, such as light emitting diodes, edge-emitting laser diodes (Edge Emitting Laser Diode, EELD), or distributed feedback lasers (Distributed Feedback Laser, DFB), can also be used. According to one embodiment of the present invention, the laser 32 is a distributed feedback laser, and the wavelength of the emitted output optical signal L1 is 1310nm.
The first photodetector 34 and the second photodetector 36 are configured to convert the sensed optical signal into an electrical signal. The types of photodetectors may include PN photodiodes, PIN photodiodes, avalanche photodiodes, etc., and according to an embodiment of the present invention, the first photodetector 34 may be a PIN diode for detecting the input optical signal L2, and the wavelength of the input optical signal L2 is 1550nm; the second photodetector 36 may be an avalanche photodiode for detecting the input optical signal L3, and the wavelength of the input optical signal L3 is 1490nm. According to an embodiment of the invention, a monitor photo-detector 38 may also be included for monitoring an operational parameter of the photo-detector, such as the optical signal input power. As shown in fig. 3, a plurality of optical path components are mounted on the component mounting surface 22 of the component holder 20, and the optical path components include a first filter 43 and a second filter 45 and a first mirror 47 and a second mirror 49 mounted on the component holder 20.
The first filter 43 and the second filter 45 may allow light of a specific wavelength range to be reflected or transmitted. Types of filters may include Thin film filters (Thin film filters), fiber Bragg gratings (Fiber Bragg Grating, FBGs), arrays of waveguide gratings (Array Waveguide Grating, AWGs), optical couplers (couplers), splitters (splitters), and the like. As shown in fig. 3, the output optical signal L1 emitted from the laser 22 is emitted in a direction parallel to the component placement surface 22, reflected by the 45-degree mirror 41, and then travels toward the first filter 43. According to an embodiment of the present invention, the first optical filter 43 and the second optical filter 45 are located on the optical path of the output optical signal L1 reflected by the 45-degree mirror 41 and can be transmitted by the output optical signal L1, and finally the output optical signal L1 is transmitted to an optical fiber outside the transistor outline package optical transceiver. The second filter 45 may reflect the input optical signal L2 having a wavelength of 1550nm and transmit the input optical signal L3 having a wavelength of 1490nm, and the first filter 43 may reflect the input optical signal L3 having a wavelength of 1490nm. The input optical signal L2 is thus reflected to the first photodetector 34 via the second filter 45 and the first mirror 47 in sequence, and the second input optical signal L3 is reflected to the second photodetector 36 via the second filter 45 and the first filter 43 in sequence.
It should be noted that the laser 32, the first photodetector 34, the second photodetector 36 and the monitor photodetector 38 are further electrically connected to the electrical conductor pins 18 through gold wire bonding, and the transistor outline package optical transceiver according to the embodiment of the present invention may further include other laser drivers for driving the laser 22 and other necessary circuit components for implementing the optical signal transmitting function, and may also include control circuits, which are well known to those skilled in the art, and therefore, will not be repeated for brevity.
According to another embodiment of the present invention, the optical components of the laser 32, the first photodetector 34, the second photodetector 36, and the monitor photodetector 38, as well as the 45 degree mirror 41, may be mounted on the transistor outline head 14. As shown in fig. 3, the output optical signal L1 emitted from the laser 22 is emitted in a direction parallel to the component placement surface 22, reflected by the 45-degree mirror 41, and then travels toward the first filter 43. According to an embodiment of the present invention, the first optical filter 43 and the second optical filter 45 are located on the optical path of the output optical signal L1 reflected by the 45-degree mirror 41 and can be transmitted by the output optical signal L1, and finally the output optical signal L1 is transmitted to an optical fiber outside the transistor outline package optical transceiver. The second filter 45 may reflect the input optical signal L2 having a wavelength of 1550nm and transmit the input optical signal L3 having a wavelength of 1490nm, and the first filter 43 may reflect the input optical signal L3 having a wavelength of 1490nm. The input optical signal L2 is thus reflected to the first photodetector 34 via the second filter 45 and the first mirror 47 in sequence, and the second input optical signal L3 is reflected to the second photodetector 36 via the second filter 45 and the first filter 43 in sequence. Although the optical path is also illustrated in fig. 3 in this embodiment, the optical components such as the laser 32, the first photodetector 34, the second photodetector 36, and the monitor photodetector 38, and the 45-degree mirror 41 are not disposed on the component mount 20 as in the previous embodiment, but are disposed on the transistor outline head 14.
According TO the embodiment of the invention, the lasers and the two photodetectors with different wavelengths are mounted in the single transistor outline package (for example, TO85 device), and compared with the traditional single-fiber three-way device which is formed by respectively assembling three independent transistor outline package components, the materials of the transistor outline head and the transistor outline cap can be effectively reduced, the times of hermetically packaging the transistor outline head, the transistor outline cap and the optical coupling are reduced, the complexity of an assembly procedure is effectively reduced, and the yield of products are relatively improved.
Other corresponding changes and modifications of the invention and the actual requirements of the invention as formed by combining the inventive arrangements and inventive concepts will be apparent to those skilled in the art, and such changes and modifications are intended to be within the scope of the appended claims.
Claims (10)
1. A transistor outline package optical transceiver, comprising:
transistor outline package;
the assembly seat is arranged inside the transistor outline package;
the optical components comprise a laser, a first photoelectric detector and a second photoelectric detector, and are arranged at the bottom of the arrangement surface of the component seat, wherein the laser emits an output optical signal and transmits the output optical signal to the outside of the transistor outline package; the laser, the first photoelectric detector, the second photoelectric detector and the monitoring type photoelectric detector are arranged on the same straight line and are positioned on one side of the arrangement surface of the component seat;
a plurality of light path components comprising:
the first reflecting mirror and the second reflecting mirror are arranged on the setting surface of the assembly seat;
the first optical filter and the second optical filter are arranged on the arrangement surface of the assembly seat and are arranged on the optical path of the output optical signal, wherein the output optical signal sequentially passes through the first optical filter and the second optical filter, a first input optical signal sequentially passes through the second optical filter and the first reflecting mirror to be reflected to the first photoelectric detector, and a second input optical signal passes through the second optical filter and sequentially passes through the first optical filter and the second reflecting mirror to be reflected to the second photoelectric detector.
2. The transistor outline package optical transceiver in accordance with claim 1, wherein the transistor outline package includes:
a transistor profile header for providing the component seat;
and a transistor profile cap coupled to the transistor profile head and forming a closed space with the transistor profile head to accommodate the component holder, the optical component and the optical path component.
3. The transistor outline package optical transceiver of claim 1, wherein the device mount has a device mounting surface, the optical device and the optical path device are mounted on the device mounting surface, the optical path device further comprises a 45 degree mirror for reflecting the output optical signal to transmit the output optical signal out of the transistor outline package.
4. The transistor outline package optical transceiver in accordance with claim 1, wherein the first photodetector is a PIN diode and the second photodetector is an avalanche photodetector.
5. The transistor outline package optical transceiver in accordance with claim 2, wherein the element mount is integrally formed with the transistor outline header.
6. A transistor outline package optical transceiver, comprising:
a transistor outline package including a transistor outline header coupled to a transistor outline cap;
the assembly seat is arranged at the head part of the appearance of the transistor;
the optical components comprise a laser, a first photoelectric detector and a second photoelectric detector, and are arranged on the head of the appearance of the transistor, wherein the laser emits an output optical signal and transmits the output optical signal to the outside of the appearance package of the transistor, and the optical components further comprise a monitoring type photoelectric detector for monitoring the operation parameters of the first photoelectric detector and the second photoelectric detector;
a plurality of light path components comprising:
the first reflecting mirror and the second reflecting mirror are arranged on the setting surface of the assembly seat;
the first optical filter and the second optical filter are arranged on the arrangement surface of the assembly seat and are arranged on the optical path of the output optical signal, wherein the output optical signal sequentially passes through the first optical filter and the second optical filter, a first input optical signal sequentially passes through the second optical filter and the first reflecting mirror to be reflected to the first photoelectric detector, and a second input optical signal passes through the second optical filter and sequentially passes through the first optical filter and the second reflecting mirror to be reflected to the second photoelectric detector.
7. The transistor outline package optical transceiver in accordance with claim 6, wherein the transistor outline header and the transistor outline cap form a closed space to accommodate the package base, the optical package and the optical path component.
8. The transistor outline package optical transceiver of claim 6, wherein the element mount has an element mounting surface, and the optical path element is mounted on the element mounting surface.
9. The transistor outline package optical transceiver in accordance with claim 6, wherein the first photodetector is a PIN diode and the second photodetector is an avalanche photodetector.
10. The transistor outline package optical transceiver in accordance with claim 6, further comprising a 45 degree mirror disposed on the transistor outline header for reflecting the output optical signal so that the output optical signal is transmitted outside the transistor outline package.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110098687.7A CN114791651B (en) | 2021-01-25 | 2021-01-25 | Transistor outline package optical transceiver |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110098687.7A CN114791651B (en) | 2021-01-25 | 2021-01-25 | Transistor outline package optical transceiver |
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| CN114791651A CN114791651A (en) | 2022-07-26 |
| CN114791651B true CN114791651B (en) | 2023-08-04 |
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| US20170315313A1 (en) * | 2016-04-28 | 2017-11-02 | Futurewei Technologies, Inc. | Transistor Outline (TO) Can Optical Transceiver |
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| CN102223174A (en) * | 2011-05-25 | 2011-10-19 | 青岛海信宽带多媒体技术有限公司 | Optical module integrated with function of optical time domain reflectometer |
| CN204009151U (en) * | 2014-07-17 | 2014-12-10 | 武汉电信器件有限公司 | A kind of miniature passive optical-fiber network single-fiber bidirectional optical device that adopts the encapsulation of tank type |
| CN208737057U (en) * | 2018-10-17 | 2019-04-12 | 四川光恒通信技术有限公司 | A kind of parallel photo structure is double to receive double hair hermetically sealed optical devices of cell type |
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| CN114791651A (en) | 2022-07-26 |
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