CN1147898C - Plasma display device - Google Patents
Plasma display deviceInfo
- Publication number
- CN1147898C CN1147898C CNB988043491A CN98804349A CN1147898C CN 1147898 C CN1147898 C CN 1147898C CN B988043491 A CNB988043491 A CN B988043491A CN 98804349 A CN98804349 A CN 98804349A CN 1147898 C CN1147898 C CN 1147898C
- Authority
- CN
- China
- Prior art keywords
- tce
- glass
- quenching zone
- metal core
- expansion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/20—Manufacture of screens on or from which an image or pattern is formed, picked up, converted or stored; Applying coatings to the vessel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
- H01J11/20—Constructional details
- H01J11/34—Vessels, containers or parts thereof, e.g. substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
- H01J11/20—Constructional details
- H01J11/34—Vessels, containers or parts thereof, e.g. substrates
- H01J11/38—Dielectric or insulating layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
- H01J11/20—Constructional details
- H01J11/48—Sealing, e.g. seals specially adapted for leading-in conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
- H01J9/241—Manufacture or joining of vessels, leading-in conductors or bases the vessel being for a flat panel display
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
- H01J9/241—Manufacture or joining of vessels, leading-in conductors or bases the vessel being for a flat panel display
- H01J9/242—Spacers between faceplate and backplate
Abstract
A plasma display having a transparent front panel (622) spaced from a back panel (610) which is a metal core (612) having layers of a dielectric material (614) extending over and bonded to the core. Conductive electrodes (620) are on the surface of or embedded in the dielectric layer of the back panel. The materials of which the back panel is made are chosen to form a back panel having a thermal coefficient of expansion (TCE) compatible with that of the front panel. The dielectric material is made from a green ceramic tape which is bonded to the core and cofired with the core to form the back panel. Barrier ribs (616) are formed on the back panel by embossing or scribing the green tape before cofiring the bonded assembly. Slight differences in the TCEs of the front and back panels may be compensated for by heating the panel having the lower TCE to a temperature hotter than the panel having the higher TCE during the frit seal process. Alternatively, the materials for the dieletric (614) may be chosen such that the composite TCE of the cofired assembly (610) matches the TCE of the front panel.
Description
Technical field
The present invention relates to the method for a kind of plasm display device and this device of manufacturing, particularly, relate to a kind of plasm display device, in this device, rear board is made of metal core, has the metal electrode that reaches between dielectric material layer and the dielectric layer on the dielectric above this metal core.
Background technology
Typical plasma scope comprises front panel and the rear board of being made by sheet glass (for example, float glass).Form electrical connection and mechanical structure at one of two panels.For example, can form the rib structure above the rear board, so that pixel in definition space direct current (DC) display between the rib or the pixel column in interchange (AC) display.Rib is avoided the interference of light, that is to say, avoids color to leak into contiguous pixel by a pixel.The manufacturing of these rib structures (being called as the shielding rib) has constituted a challenge to employed material and manufacture method.
By in the thin inert gas that limits selectively the stimulated luminescence discharge arrays come the operate plasma display.Form the full color display by in mist, producing light emitting discharge, mix to produce ultraviolet light as He-Xe or Ne-Xe gas.Phosphorus in the ultraviolet excitation pixel unit (as by the definition of shielding rib) is to produce the light that needs at pixel location.
Typical plasma scope rear board comprises glass substrate, has a plurality of substantially parallel, first electrodes of a distance at interval on the surface of this substrate.In the AC display, the electric dielectric material of skim, as glass, coated electrode.Between first electrode, on the surface of glass substrate, form the shielding rib.The shielding rib stretches out a distance greater than first thickness of electrode by substrate surface.Red, green and blue (R-G-B) phosphorus layer alternately covers between the rib row of first electrode in the space, also covers the wall of rib.The front transparent glass substrate, front panel covers rear board, can be placed on the shielding rib, so that by the shielding rib front panel is separated with the glass substrate of back.
Typically, the shielding rib is the wall of definition groove and passage in the plate in the back.Exchange (AC) plasma scope and typically have shielding, this shielding forms the spacer of row pixel, therefore, has vertical rib continuously in the back on the plate.On the contrary, direct current (DC) plasma scope typically has the rib shielding, and each pixel and its all neighboring pixels are isolated in this rib shielding.Therefore, concerning the DC display, the rib structure has the lattice shape layout of rectangle.In both of these case, the size of resolution that display unit needs and the shielding of its specification decision rib.In typical display, the rib height is 0.1 to 0.2mm, and wide is 0.03 to 0.2mm, and spacing is 0.1 to 1.0mm.
These ribs can separate formation with rear board, the use binding agent connects, United States Patent (USP) the 5th as people such as Wang, 674, No. 634, exercise question be " spacer constitutes, not quenching zone and form the method for plasm display device shielding rib " in propose like that, by with pottery not quenching zone be laminated to rear board, form shielding in the back on the plate, sandblast not quenching zone with the shielding between form passage, in kiln, fire rear board then, so that the quenching zone shielding does not convert to ceramic screened.
It is substantially parallel, surperficial upward apart from one another by second electrod-array of opening within it that front panel comprises.These second electrodes are basically perpendicular to first electrode and extend.One deck electricity dielectric material typically as glass, covers second electrode.One deck MgO covers dielectric layer.Affact voltage on the electrode and excite, keep and extinguish the plasma in the gas in the zone that shielding forms with correct form.Around panel, use external circuit to carry out the addressing of single pixel.Shielding construction typically is used to limit the discharge to addressed pixel, the interference of electricity and light between the elimination adjacent pixel unit.The row of pixel are separated by shielding, first electrode be arranged between the shielding at interval below.In the DC plasma scope, without glass or MgO coated electrode, typically intersect shielding construction, form box-like structure at each pixel unit.
Although the structure of foregoing description provides a kind of plasma scope with satisfactory operation condition, it can not solve some problem.Problem is caused by this true institute: i.e. it is consistent with each other that hope is used to form the material of rear board, and consistent with the glass plate that is used for front panel.Particularly, the thermal coefficient of expansion of the pottery that is formed by quenching zone not should be consistent with the thermal coefficient of expansion of rear board, and the thermal coefficient of expansion of combination rear board should be consistent with the thermal coefficient of expansion of front panel glass.This is for fear of during operation rear board being fixed to breaking of front panel sealing.
Disclosure of the present invention
A kind of have the clear glass front panel and comprise metal substrate and the such plasm display device of ceramic screened rib textural association rear board, wherein select to be used to form the material of rear board, so that the thermal coefficient of expansion that rear board has is consistent with the thermal coefficient of expansion of front panel.
According to an aspect of the present invention, be laminated to not quenching zone on the substrate, fired the panel of lamination then jointly, formed passage on the inner surface of plate or rear board in front by embossing.
According to another aspect of the present invention, when the thermal coefficient of expansion of front panel and rear board slightly not simultaneously, the method that is used for front panel is bonded to rear board is: before the beginning binder-treatment, front panel and rear board are heated to different temperature.
According to a further aspect of the invention, when the thermal coefficient of expansion of front panel and metal core slightly not simultaneously, can select to be used to form and be in turn laminated to metal core to form the electric dielectric material of back panel assemblies, so that it is consistent with the TCE of front panel to fire the TCE of component groups compound jointly.
Brief description of the drawings
Fig. 1 represents to make the flow chart of rear board method of the present invention;
Fig. 2 is illustrated in and makes the not flow chart of quenching zone method of the making used in the display rear board of the present invention;
Fig. 3 is suitable for according to the present invention forming the stereogram that plasma scope shields the embossing instrument that uses in the rib;
Fig. 4 A is the side sectional plain-view drawing of the shielding rib of institute's embossing according to the present invention;
Fig. 4 B and 4C are used to describe the side sectional plain-view drawing that shielding rib structure forms, and the top that wherein shields rib is thicker than the bottom;
Fig. 5 represents to make the flow chart of plasm display panel method of the present invention;
Fig. 6 A is the side sectional plain-view drawing of first plasm display panel according to the present invention;
Fig. 6 B is the side sectional plain-view drawing of second plasm display panel according to the present invention.
Realize mode of the present invention
In order to improve the processing method of plasma, developed one type plasma, wherein rear board comprise that metal core is dull and stereotyped and on the metal core flat board, extend, and to be bonded to the multilayer electricity dielectric material of fuse flat board.It on the surface between dielectric layer and the dielectric layer metal tape that forms various electrodes.By forming the thin belt that do not quench of electric dielectric material, and, make this rear board with do not quench at least some surfaces of belt of metal tape that forms electrode and electrically conductive ink coating.The belt that do not quench is arranged on the surface of fuse flat board, and fires assembly with certain temperature, is melted in together at this temperature belt that do not quench, and is bonded on the fuse flat board.Fire operation in the air around, do not need special gas.
Plasma scope according to the present invention comprises the front panel of being made by glass, and as float glass, its thermal coefficient of expansion is approximately 8.5 * 10
-6/ ℃, need the thermal coefficient of expansion of rear board consistent with the thermal coefficient of expansion of front panel.What this had been avoided sealing between rear board during the display operation and front panel breaks.Concerning the rear board that comprises metal core with the multi-layer ceramics material that is bondd, use the treatment system of new material and new material, consistent to guarantee rear board with the glass front plate.Fig. 1 represents to be used to form according to one embodiment of present invention a plurality of steps of rear board.
In brief, the composition of rear board is a metal core 110, and pottery is quenching zone 112 not, electrically conductive ink 114 and phosphorus printing ink 116.As described below, the metal core 110 of rear board can be formed by Titanium.Pottery not quenching zone 112 can be made by the description below figure 2.The preparation of printing ink also is described below.Phosphorus printing ink can be any in the multiple common available preparation, as is used for phosphorus is affacted the preparation of cathode ray tube (CRTs).
The first step of work in-process, step 118 uses electrically conductive ink and light conducting filler to print electrode, and on quenching zone not filling channel, the formation of light conducting filler will be described below.Can on multilayered unstretched quenching zone, realize electrode and conductive channel, as described below, and, use passage to interconnect electrode and conductive channel by the belt that do not quench.These electrodes and passage allow to comprise electrical connection by firing ceramic structure that quenching zone not forms between pixel unit and drive electronics (for example, along the installation of display edge).
Next step of work in-process, step 120 will be piled up and the various belt that do not quench of lamination.In exemplary embodiments of the present invention,, wish before the belt tegillum that do not quench is pressed, accurately to locate each different not quenching belt because form passage by some belts that do not quench at least.In exemplary embodiments of the present invention, use about 40Kg/cm
2Pressure and the about 90 ℃ temperature belt that can laminated ceramic do not quench.
Quenching zone is not behind the lamination, in step 122, by accepting to spray or the silk screen printing binding mixtures preparation metal core on the surface of quenching zone not.As described below, concerning the typical embodiment of the present invention, whole mixture can be the glass 1 that powders, and typical case's pottery is a composition of quenching zone not.Simultaneously in step 122, quenching zone is not connected to metal core, and quenching zone is not carried out embossing or scribes to form the shielding rib.Although, in exemplary embodiments of the present invention, after quenching zone is not connected to metal core, form the shielding rib, can consider also that before quenching zone is not connected to fuse can handling not, quenching zone shields rib to form.In step 124, with the about 900 ℃ temperature of peak value to metal core and moulding not the combination of quenching zone fire jointly.After the rear board of firing has jointly cooled off, printing phosphorus striped between shielding rib row, and the baking rear board is with fixing phosphorus.The application of phosphorus and the baking that is used for fixing them can be traditional fixedly phosphorus that is generally used for, and for example, phosphorus are fixed to multiple processing method any of CRT screen.
As mentioned above, wish that the thermal coefficient of expansion of metal core flat board is consistent with the thermal coefficient of expansion of front panel.Concerning front panel, (TCE is approximately 8.5 * 10 to wish to use the soda lime float glass
-6/ ℃), because its cost is low.Usually by the different metal of lamination, for example, Cu-Mo-Cu can synthesize the metal with this TCE value or other arbitrary value.In such lamination, the TCE value of external metallization is different from the TCE value of interior metal, and lamination is taked a marginal TCE value.Exact value depends on relative thickness and other characteristic of different layers.Yet, select that existing to satisfy the metal or alloy that TCE requires more convenient.A typical example is a Titanium, and its TCE is 8.5 * 10
-6/ ℃.Titanium is hard material, has intensity and weight ratio the highest in any metal or metal alloy.Titanium is the metal that enriches, and can buy easily with the form of diversified large flat, and in addition, it is relatively cheap.
Ceramic not quenching zone is both the main catalogue composition of rear board with metal core one.As shown in Figure 2, quenching zone is not made of inorganic raw material, as MgO, and Al
2O
3, SiO
2, B
2O
3, P
2O
5, PbO, ZnO, TiO
2Make with various alkali, alkalescence or heavy metallic oxide or by the material that they form.Batch mixed is prepared burden in proportion, with the characteristic that obtains to wish.With 1400-1700 ℃ of this batching of fusing, and it is quenched.Resulting glass is ground, to form powder.Glass powder combines with organic binder bond, solvent, surfactant and other improved additives, to form thin pulp.Handle by scraper, on flat surfaces, launch thin pulp.The process that forms massive plate pottery band is called " casting ".The Cast Strip of watering by such processing formation comprises glass powder, is stored in the roller easily.
Selecting to constitute the composition of belt, both can be that inorganic oxide also can be various organic substance, to form the belt characteristic that needs.Concerning the formation of rear board, these belt characteristics comprise, the ability that will form in the large tracts of land casting will or be scribed forming the ability of dull and stereotyped rib by embossing, and the ability that keeps writing board shape during firing.Usually with one to 2 meters wide, several meters long size cast ceramic quenching zone not.To large-area like this casting, can plan organic binder bond, to be formed on the high-tear strength that is used to handle during the making.Also need to guarantee uniform belt thickness and on all four casting.Also can select organic principle, with at common pressure (10-10,000Kg/cm
2) the uniform lamination of following promotion.
When the pottery band is in not as-quenched, in the time of promptly before firing,, form the shielding rib in the back on the plate by independent embossing step.Correct embossing depends on the combination of lamination plasticity and viscoelastic fluid characteristic.Mainly by the organic resin that is mixed into the thin pulp that is used for preparing belt,, control these fluid behaviours according to the distribution of the inorganic ceramic powder of using in the size of powder and the thin pulp.
During firing, promote very fast being burnt of organic substance that shielding forms.Remaining ceramic powders fusing and crystallization.Fusion temperature and crystallization temperature are different and different with material.The pottery band composition that describes below provides fusing and the crystallization property that needs, and also provides the characteristic that needs at last ceramic layer simultaneously, comprises the thermal coefficient of expansion consistent with metal core.
In sintering procedure, when the ceramic material in the belt melted, they were tending towards mobile.Crystallization stops this viscoelastic fluid flow, and promotes to solidify.For the shape that keeps embossing to shield in the quenching zone not, need ceramic powders in conjunction with having the crystallization temperature that is higher than softening point (to quenching zone not is 750-850 ℃, will be described below with reference to table 1) a little.This allows material to become closeer at softening point, allows fully to flow to show smooth surface.Yet, when belt its not in the as-quenched by embossing or when scribing, rapid crystallization impels glass to keep the shape that will make and the formation of shielding.
The thermal coefficient of expansion of last pottery is by having above and below wishing controlling in conjunction with glass of TCEs value.Adjust these component glass, with the TCE that obtains to wish.The control of TCE is crucial, to reduce the pressure of last panel, guarantees to cool off the smooth of rear board.Generation have with titanium fuse and float glass front panel same coefficient of thermal expansion and have pottery with the weight percent of the pottery band of other expected characteristics such as table 1.
Table 1
Glass 1 85.00
Glass 2 12.00
TiO
2 1.00
Cordierite 1.00
Forsterite
1.00
100.00
Glass 1 is approximately to melt 2 hours and the zinc-magnesium borosilicate glass of rapid quenching to form at 1550 ℃ respectively, adopts the pulverization process of standard to grind this kind glass subsequently.The percentage composition such as the table 2 of glass 1:
Table 2
ZnO 30.00
MgO 25.00
B
2O
3 20.00
SiO
2 25.00
100.00
Glass 2 is to append zeopan glass as nucleator with diboron trioxide and phosphorus pentoxide, respectively at about one hour of 1725 ℃ of fusings and rapid quenching, adopts the standard pulverization process to be milled to the glass of powder subsequently to form.The weight percent of glass 2 is such as table 3:
Table 3
Al
2O
3 16.81
MgO 42.01
P
2O
5 0.84
B
2O
3 0.84
SiO
2 39.50
100.00
Although the composition that provides in the table 1,2 and 3 is carried out better, can consider table 1 ', provide in 2 ' and 3 ', by the percentage by weight definition, and the corresponding composition of scope proposed to be subordinated to the ceramic material that can adopt of the present invention's use.
Table 1 '
Glass 1 65.00-95.00
Glass 2 30.00-5.00
TiO
2 0.01-2.00
Cordierite 0.01-2.00
Forsterite
0.01-2.00
100.00
Table 2 '
ZnO 15.00-50.00
MgO 10.00-45.00
B
2O
3 5.00-30.00
SiO
2 10.00-45.00
100.00
Table 3 '
Al
2O
3 5.00-30.00
MgO 30.00-55.00
P
2O
5 0.01-4.00
B
2O
3 0.01-4.00
SiO
2 7.00-40.00
100.00
By the percentage by weight shown in the table 4 glass ingredient that table 1 (or table 1 ') provides is mixed with organic solvent.
Table 4
Glass ingredient (table 1 or 1 ') 70.30
Solvent 1 13.80
Resin 1
15.90
100.00
Provide in the percentage of solvent 1 and the resin 1 weight item table 5 and 6 below.
Table 5-solvent 1
Methyl ethyl ketone 46.90
Ethanol 46.90
Fish oil
6.20
100.00
Table 6-resin 1
Methyl ethyl ketone 36.10
Ethanol 36.10
#160 plasticizer 11.10
The B-98 resin
16.70
100.00
Has another weight percent with the not quenching zone of titanium same coefficient of thermal expansion such as table
Table 7
Glass 1 66.10
Forsterite 4.20
Solvent 1 13.80
Resin 1
15.90
100.00
The processing procedure of the ceramic not quenching zone of formation as shown in Figure 2.This processing begins with raw material.As mentioned above, by mix (step 214), with the uniform temperature and the time fusing batching (step 216) of foregoing description, mixture to fusing quenches (step 218) to form glass, and glass ground to form powder, prepare glass 1 respectively, perhaps glass 2.In the typical embodiment of the present invention, milled glass 1 and glass 2 are to have about 10 microns powder size.Grind filler, forsterite, or cordierite are to have about 6.5 microns powder size.
Then, in step 222, glass and the batching pulverized with the mixed shown in the table 4 with organic substance in the beaker of 250ml are to form thin pulp.Concerning this step, glass powder mixtures is mixed with solvent 1 at first fully, mixes with resin 1 then.Also be in step 122 then, comprise 150ml 3/8 by thin pulp is placed on " ZrO
2In one liter of powder process jar of roller, and jar was placed on the roll-type flour mill levigate slurry mixture at least two hours.Then thin pulp is filled in the container, with mobile roller, and degasification one minute when stirring.Incomplete degasification meeting causes aperture and minute bubbles in watering the Cast Strip.Excessive degasification meeting causes removes too many solvent, and this can cause too thickness of thin pulp.
In step 224, use scraper to handle thin pulp is spread to flat board.The first step in this process is to detect the viscosity of degasification thin pulp.Typical viscosity 700 and 1100cps between.Then, affact dull and stereotyped upper surface by agent that silicon is got loose, three cun mylar flat boards of branch are done in preparation.Then, adjust scraper, with the tape thickness that need to obtain.The shovel gap of use 15/1000ths obtains 8/1000ths not quenching zone thickness.Then thin pulp is injected into the band casting machine.At first, with the speed drawing mylar of 20cm/min, appear at the output area of band casting machine up to thin pulp.Hauling speed is increased to 90cm/min then.Because the wearing character of thin pulp needs periodically grinding again or replacement scraper and band to water deadhead.In step 226, before flat board is removed by the band casting machine dry at least 30 minutes.As quality control step, on illumination box (light box), watch the defective of watering the Cast Strip, and detect the thickness and the density of band at several somes place along watering the Cast Strip.In step 228, quenching zone is not carried out punching, with the preparation blank, these blanks can have the conductive paste that imposes on them and fill paste, with before being in turn laminated to metal core (step 120) in Fig. 1 step 118, form electrode and connecting circuit.
Table 8 and 9 has provided the percentage by weight of suitable conductive paste composition, and table 10 has provided the percentage by weight of suitable filling paste composition.
Table 8-conductive paste
Ag powder EG (～7.6 microns) 82.40
Solvent 2 16.50
Lecithin 0.55
Terpinol
0.55
100.00
Table 9-solvent
Ethyl cellulose N-300 3.80
Ethyl cellulose N-14 7.50
Butyl carbitol 53.20
Dodecanol
35.50
100.00
Table 10-conductive fill paste
Ag powder EG (～7.6 microns) 55.90
PAS glass 22.30
Hypermer?PS-2 1.20
ECN-300 0.69
Butyl carbitol 7.91
Elvacite?2045 1.80
Terpinol 5.40
#160 plasticizer 3.60
Thixotrol
1.20
100.00
In the composition of above-mentioned conductive fill paste, PAS glass is 50% PbO, 40% SiO
2With 10% Al
2O
3, all calculate by weight.In formation, at first make PAS glass, and before being used for conductive paste, clay into power.
Before the shielding forming process, these conductive pastes are screen-printed to not on the quenching zone.The inventor determines that these pastes afford to stand the processing that shielding forms, and particularly big pressure can not destroy any lead vestige, keeps good electrical conductivity simultaneously.The composition of the filling paste that table 10 provides is consistent with sintering characteristic and thermal coefficient of expansion that the glass ceramics that above-mentioned reference table 1 to 3 is described is formed.
During lamination treatment, use smoothing preparation not quenching zone is bonded to metal core.The typical light lubrication prescription that is suitable for this purpose is formed by glass 1 powder, forms with the not quenching zone that above-mentioned reference table 1 to 6 is described to be bonded to titanium.For example forming six laminations not before the quenching zone, with such powder sandblast to metal.In addition, before lamination, can be with commercial utilizable low melting point lead base smoothing preparation, for example, Homel F-92 affacts the surface of titanium fuse.The inventor determines that the application of this smoothing preparation has reduced the oxidation of titanium, and allows titanium mechanical caging well in the glass ceramics component in lamination and common sintering procedure.
Can use the organic liquid of known quantity to mix by the powder size is reduced to less than 2 microns, mixture is affacted metal to obtain the glass of known quantity on metal core with glass powder, for example, 10mg/inch
2, make suitable bonding smoothing preparation.In stove, the smoothing preparation on the metal is shifted to an earlier date fuel feeding then with about 550 ℃ peak value firing temperature.
The inventor determines that the not quenching zone that use table 7 provides constitutes formed lamination and shown the good thermal coefficient of expansion consistent with titanium.The cermet dielectric constant that is produced when firing not quenching zone and metal core jointly approximately is 7.It has also shown rheological properties, and when in as-quenched not, this characteristic can make and be suitable for preparing the groove that shields rib and form.The typical case shielding that is up to 400 microns can not form on the quenching zone, and with reference to as described in figure 3 and the 4A, the result shields rib on the rear board of firing jointly height approximately is 274 microns as following.
In the technology of display, well-known, the black background below red, green and blue phosphorus can strengthen the contrast of displayed image.Can use simple relatively mode, before or after step 124 (shown in Figure 1) is fired panel jointly, but should be before step 126 effect phosphorus, by with black colorant, as cobalt oxide, join in the composition on band upper strata, or pass through the paste of layer spraying on tape or silk screen printing black colorant, realize this aspect of Display Technique.
In Fig. 1 step 122, lamination not quenching zone it is carried out embossing or scribes, to form the shielding rib it being appended to after the metal core.Form the shielding rib although can use to scribe,, the embodiments of the invention that describe below mainly concentrate on as forming a kind of embossing mode of rib.
Fig. 3 is the stereogram that can be used for forming in the not quenching zone structure of institute's lamination shielding rib embossing instrument or mould.Mould is " egative film " that does not need shielding construction in the quenching zone.Be stacked by the shielded metal band that width is different with thickness, form mould shown in Figure 3.The thickness of different band is determined mold interval, and the stand out of band is determined the height of rib.Can comprise stainless steel or tool steel by any material that can form band, plastics or pottery are made such mould.
Typical mould comprises that alternate thick be with 310 and strip 312.Thick band is defined in the passage between the shielding rib in the finally shaped panel.Therefore, thick be with 310 wideer than strip 12, to allow between thick band, the forming shielding rib.Need these to have level and smooth surface, to help the mobile easily and release of ceramic material of during embossed, not quenching than the broadband.The marginal zone in broadband (for example, district 320) also can have a shape of revising according to rectangle (for example, circle), and so that the edge with good release characteristics to be provided, and after embossing, this edge also can obtain the shielding shape that needs in quenching zone not.
For example, adopt the smoothness of edm (EDM), can prepare two cover metal tapes with equal length, different-thickness and width need to obtain.Alternately pile up band, by once selecting a band in every cover.For example, need to use planar metal dull and stereotyped 314 and/or metal guide rail 318, locate metal tape exactly.Should pile by a side compression of this heap then, to guarantee good assembling and uniform pitch.Can be by in several known methods any, as bonding, low temperature bonding, bonding or compress, with this heap with the fixed size of compression to iron core 316.Add because spread all over the thickness deviation of this heap metal tape, compressible metal (for example, annealed copper) can be used for the strip of less width.The compressibility of these metal tapes has compensated the tolerance of thickness.
Piling up the broadband, can process the broadband to revise their edge with before obtaining to discharge easily during the embossed not the quenching zone angle and afterwards.Can be by any modification edge in the middle of the multiple known technology, as the sandblast of glass bead, derusting by sandblasting and with machined into etc.
As above describe prepared mould and have several advantages, surpass the traditional moulds that is processed into by unitary piece of metal.Therefore, it can be done very greatly, holds the large screen plasma volumetric display; Also can easier preparation or modification, thereby have longer useful life than monolithic mould.
Best, quenching zone is not laminated to metal core with after the formation shielding rib, and mould is pressed to not quenching zone.When the band to institute's lamination carried out embossing, metal core formed firm substrate.The inventor determines that the appearance of this robust substrate has greatly strengthened the perpendicular flow of the ceramic material that do not quench, and allows its easier shape of obtaining the embossing instrument.The inventor also determines, preferably presses to operation and forms the pulsation form, that is to say, with stationary temperature, with by the separated high relatively pressure of the relaxation cycle of zero pressure, repeats mould is pressed to the not quenching zone of institute's lamination.The application of high pressure not quenching zone is pushed into space between the mould, and forming the shielding rib, relaxation cycle impels not the quenching zone powder to remove, and allows organic material to flow backward between them, reduces the not viscosity of quenching zone.Use this technology, reduced the structural maximum pressure of not quenching zone that affacts institute's lamination, this maximum pressure has reduced the distortion of mould and to the wearing and tearing of mould.Adopt above-described embossing technology can obtain shielding rib appearance ratio easily up to 10 to 1.
Wish to use this technology that the fully release of a band by mould is arranged.Can realize being, below mould, except the embossed areas outside, place partition adjustable thing (not diagram) with a kind of method that discharges fully.Compress these septs by embossing pressure, when pressure discharges, provide a lifting force instrument.The inventor determines that before instrument was pressed into the pottery that do not quench, compressing of partition adjustable thing also improved the distribution of pressure in the assembly, therefore, makes that the height of embossing shielding is more even above the whole embossed areas.Can consider, can use spring (not diagram) to replace the partition adjustable thing.
Fig. 4 A represents the structure of typical case's shielding rib, can use above-described embossing technology to obtain this structure.In the design of particular panel, can wish to obtain the shielding rib shape shown in Fig. 4 C.Such structure can not form by simple embossing operation, because shielding rib top is wideer than the bottom, therefore, does not allow to take out the embossing mould.Yet, can handle boss structure by using lamination instrument, form the structure shown in Fig. 4 C.As the first step, quenching zone is not carried out embossing, shown in Fig. 4 B, to obtain to be higher than desirable screening height.Then, lamination instrument is pressed to the not top of quenching shielding rib with controllable pressure, impels them to expand, shown in Fig. 4 C.Depend on the viscosity of not quenching zone of institute's embossing and the swell increment of rib top needs by the lamination instrument applied pressure.
Fig. 5 represents the flow chart that the surface plate display unit forms according to the present invention.This flow chart is more detailed than flow chart shown in Figure 1.Particularly, metal preparation process 111 and belt preparation process 113 affact the titanium fuse at step 111 smoothing preparation that will bond, and at step 113 cutting belt blank, conclusively show blank.Pile up titanium fuse and belt blank during in addition, step 120 is divided into step 120 ' and step 121, in step 120 ', in 121 steps, in a step that the belt blank is laminated together each other and be bonded to the titanium fuse.Step 122 ' also change to some extent by Fig. 1, it enumerates working pressure pulse shaping shielding.At last, Fig. 5 and Fig. 1 difference are to comprise front panel glass 510 and step 512, by this step front panel are connected to rear board.
Fig. 6 A obtains side sectional view along the line that expression is got according to the display delegation that is subordinated to panel structure of plasma display of the present invention.Panel comprises rear board 610, and this rear board comprises the structure 614 of titanium fuse 612 and lamination and embossing, and this structure forms the shielding rib and the substrate of display, the electronic equipment 626 of installation and control display on this substrate.Be embedded in the ceramic structure 614 is pixel capacitors 620.Above the electrode, is phosphorus 618 at each on the surface of embossing pottery rear board, excites phosphorus to send coloured light (red, green or blue).In the back plate 610 above be front panel 622.Connect sealing 624 by roasting front panel is bonded to rear board.
Form on the plate in the back although described the shielding of display floater during forming rear board, they also can form on glass front.Can realize the making of these shieldings on the front glass panel by following mode:
1. but with the form embossing of print paste or scribe the dielectric thick film that is deposited on plate glass top.Dielectric thick film is by mixing formation with the sintered glass dusty material with organic substance, and with the thermal characteristics and the chemical characteristic fit of plate glass.Can be after the glass initial treatment, after cleaning and/or electro-deposition, by the thick film deposition technique, as silk screen printing, the deposition dielectric is as one deck thick film.After the dielectric deposition, by means of mould embossing thick film, this mould has and the rib opposite configuration that needs, so that the thick film dielectrics embossing/impression that uses this mould to carry out provides the rib structure that needs.In addition, can scribe thick film dielectrics, can or remove electric dielectric material, therefore form the rib structure of channel-like, obtain shielding rib structure by means of hard instrument.Can utilize embossed to form AC or DC plasma display panel structure, and before sintering/fire thick film dielectrics, carry out this processing.Yet, only can be used to form the AC plasma display panel structure scribe processing can be before dielectric be fired (best) or carry out afterwards.
2. can use the such thick film tape of aforesaid mould embossing, to form the rib structure with the form casting of single and a plurality of thick film tapes and the thermal characteristics and the matched agglomerated material of chemical characteristic of plate glass.Embossed can be piled up (lamination) at belt and reached through carrying out after pretreated (clean and use or do not use electro-deposition) plate glass summit, also can carry out before this, piles up the summit that reaches plate glass then.Then fire/sintering is through the model of embossing.Pile up under the situation that is laminated to preliminary treatment plate glass summit earlier at belt,, scribe, can form the rib structure by using the hard instrument that can clean and remove effectively through the band of material of lamination.
3. be in hot state and on flat glass production line the time when glass, embossing or scribe plate glass.The processing that forms easily when plate glass manufactory utilizes glass to be in hot state on the spot can be used the embossing mould or scribe instrument.
Use affacts a panel or two panels frit on every side, and front panel is bonded to rear board.Panel is supported in together, and is heated to sufficiently high temperature, with melt frit.Cool off panel then, solidify, and form gas-tight seal at panel upper glass material.Frit-sealed temperature is typically between 350 ℃ to 450 ℃ scopes.When the TCE value of wishing front panel and rear board near consistent, when guaranteeing that during cooling or display operation roasting connects sealing and can not break, may be difficult to obtain unanimity accurately.
Thermal coefficient of expansion is less poor when forming sealing between the plate and front panel in the back in order to compensate, and panel can be heated to different slightly temperature during binder-treatment.If it is T that roasting connects seal temperature
s, and, if at room temperature and T
sBetween glass have an average TCE (TCE
g), Δ TCE is lower than the TCE of rear board, i.e. TCE
bIf, and the temperature Δ T of glass heats
s=T
sΔ TCE/TCE
gThe temperature that is higher than rear board, so, the gross shrinkage of glass front plate, (T
s+ Δ T
s) (TCE
b-Δ TCE), will with the gross shrinkage (T of rear board
sTCE
b), to 2
NdInferior power is identical.For example, if soda lime glass is used for front panel, has TCE
g=8.5 * 10
-6/ ℃, and if the TCE of rear board
bBe Δ TCE=0.1 * 10
-6/ ℃, greater than the TCE of front panel, realize that under 450 ℃ of temperature roasting connects sealing, so, during roasting connects sealing,, come bucking-out system by the heating of glass front plate is higher than 5.3 ℃ of rear boards.
Can use various method to realize such temperature difference.For example, can set up temperature gradient between plate and the rear board in front with being heated to different temperature with following thermal source above the stove wainscot.In addition, by after removing in the stove, change the cooling device on black box top and bottom, can realize such processing procedure by black box.
In addition, can more generally use this method to compensate between front panel and the rear board poor in the temperature relation.In the belt stove, can programme to the cooling zone, produced temperature difference special between front panel and the rear board, as the function of panel temperature, when assembly cools off so that the compensation to the TCE difference to be provided.
Between compensation metal/ceramic rear board and the glass front plate among the TCE another method of less difference be the planning ceramic component, this ceramic component have one slightly greater than or slightly less than the TCE of metal core.The ceramet system of combination has the TCE between two TCE.Can among a small circle, adjust ceramic TCE, so that median is consistent with the TCE of front panel.In addition, ceramic material can be bonded to the front and back of metal core, to avoid because the difference between each TCE, this assembly bending when common firing ceramics metal assembly.
Form with exemplary embodiments has been described the present invention, can consider, within the scope of the appended claims, to top described making amendment.
Claims (9)
1, a kind of method that forms the plasm display device rear board comprises: following steps:
Preparation has and the pottery of the corresponding to thermal coefficient of expansion of metal core thermal coefficient of expansion quenching zone not;
Do not form the shielding rib on the quenching zone at pottery;
With the pottery that forms not quenching zone be bonded to metal core; With
The pottery that firing jointly bonds forms is quenching zone and metal core not, to form rear board.
2, method according to claim 1 further may further comprise the steps:
With pottery not quenching zone cut into a plurality of blanks, each blank is consistent with metal core in shape;
Do not form electrode structure on the quenching zone blank at least one pottery; With
Laminated ceramic quenching zone not before forming the shielding rib, so as at least one pottery not the quenching zone blank be positioned at the pottery not on the quenching zone that forms electrode structure.
3, method according to claim 1, wherein the step that does not form the shielding rib on the quenching zone at pottery comprises and uses the not step of quenching zone of mould embossing pottery, this mould presents and the shielding rib opposite configuration that needs.
4, a kind of rear board of plasm display device comprises:
Metal core with a thermal coefficient of expansion;
Be bonded to the ceramic structure of metal core, this ceramic structure has a thermal coefficient of expansion consistent with the thermal coefficient of expansion of metal core, and this ceramic structure is determined the shielding rib of plasm display device.
5, the rear board of plasm display device according to claim 4, wherein ceramic structure has being made up of the percentage by weight definition:
Glass 1 65.00-95.00
Glass 2 30.00-5.00
TiO
2 0.01-2.00
Cordierite O.01-2.00
Forsterite 0.01-2.00
Wherein glass 1 has being made up of the percentage by weight definition:
ZnO 15.00-50.00
MgO 10.00-45.00
B
2O
3 5.00-30.00
SiO
2 10.00-45.00
Glass 2 has being made up of the percentage by weight definition:
Al
2O
3 5.00-30.00
MgO 30.00-55.00
P
2O
5 0.01-4.00
B
2O
3 0.01-4.00
SiO
2 7.00-40.00。
6, the rear board of plasm display device according to claim 5, wherein ceramic structure has being made up of the percentage by weight definition:
Glass 1 85.00
Glass 2 12.00
TiO
2 1.00
Cordierite 1.00
Forsterite 1.00
Wherein glass 1 has being made up of the percentage by weight definition:
ZnO 30.00
MgO 25.00
B
2O
3 20.00
SiO
2 25.00
Glass 2 has being made up of the percentage by weight definition:
A1
20
3 16.81
MgO 42.01
P
2O
5 0.84
B
2O
3 0.84
SiO
2 39.50
7, the rear board of plasm display device according to claim 4, wherein metal core is made of titanium.
8, a kind of plasm display device comprises:
By the front panel that glass forms, its thermal coefficient of expansion is 8.5 * 10
-6With
Rear board, it comprises:
Thermal coefficient of expansion is 8.5 * 10
-6Metal core; With
Determine the ceramic structure of plasm display device shielding rib, the thermal coefficient of expansion of this ceramic structure is 8.5 * 10
-6, and this ceramic structure is glued to metal core.
9, a kind of method of using metal core to form the plasm display device rear board, the thermal coefficient of expansion of metal core is TCE
m, rear board is connected to front panel, and front panel has one and TCE
mDifferent thermal coefficient of expansion TCE
g, this method may further comprise the steps:
Determine TCE
gAnd TCE
mBetween poor, Δ TCE;
Form not quenching zone of ceramic pottery, the thermal coefficient of expansion of this band is TCE
C, TCE
CWith TCE
mDiffer 2 Δ TCE;
With pottery not quenching zone be bonded to metal core, to form an assembly, fire this assembly jointly, to obtain thermal coefficient of expansion and TCE
gThe rear board that equates.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US4431097P | 1997-04-25 | 1997-04-25 | |
| US116797A | 1997-12-30 | 1997-12-30 | |
| US09/001,167 | 1997-12-30 | ||
| US60/044,310 | 1997-12-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1252888A CN1252888A (en) | 2000-05-10 |
| CN1147898C true CN1147898C (en) | 2004-04-28 |
Family
ID=46203347
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB988043491A Expired - Fee Related CN1147898C (en) | 1997-04-25 | 1998-04-24 | Plasma display device |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP0978135A4 (en) |
| JP (1) | JP2001526822A (en) |
| KR (1) | KR100497786B1 (en) |
| CN (1) | CN1147898C (en) |
| AU (1) | AU7158098A (en) |
| WO (1) | WO1998049706A1 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6140767A (en) * | 1997-04-25 | 2000-10-31 | Sarnoff Corporation | Plasma display having specific substrate and barrier ribs |
| US6577057B1 (en) * | 2000-09-07 | 2003-06-10 | Motorola, Inc. | Display and method of manufacture |
| KR100392950B1 (en) * | 2000-12-30 | 2003-07-28 | 엘지전자 주식회사 | Method of Fabricating Back Plate of Plasma Display Panel |
| CN1306538C (en) * | 2001-04-23 | 2007-03-21 | 株式会社东芝 | Image display device, and method and device for producing image display device |
| JP4574081B2 (en) | 2001-08-09 | 2010-11-04 | キヤノン株式会社 | Manufacturing method of image display device |
| WO2004101276A1 (en) * | 2003-05-16 | 2004-11-25 | Toppan Printing Co., Ltd. | Transparent gas barrier multilayer film, electroluminescent light-emitting device using same, electroluminescent display, and electrophoretic display panel |
| US8425065B2 (en) | 2010-12-30 | 2013-04-23 | Xicato, Inc. | LED-based illumination modules with thin color converting layers |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4963114A (en) * | 1987-11-25 | 1990-10-16 | Bell Communications Research, Inc. | Process for fabrication of high resolution flat panel plasma displays |
| JPH0743996B2 (en) * | 1988-03-02 | 1995-05-15 | Method for manufacturing gas discharge display device | |
| JPH06168669A (en) * | 1992-04-21 | 1994-06-14 | T T T:Kk | Discharge display device formed by using thin plate metal board |
| SG64844A1 (en) * | 1994-07-21 | 1999-05-25 | Sony Corp | Plasma-addressed display device |
| JPH08301631A (en) * | 1995-03-07 | 1996-11-19 | Asahi Glass Co Ltd | Plasma display panel |
| US5714840A (en) * | 1995-03-07 | 1998-02-03 | Asahi Glass Company Ltd. | Plasma display panel |
| JP3583144B2 (en) * | 1996-01-30 | 2004-10-27 | サーノフ コーポレイション | Plasma display and method of manufacturing the same |
-
1998
- 1998-04-24 JP JP54718198A patent/JP2001526822A/en not_active Ceased
- 1998-04-24 KR KR10-1999-7009869A patent/KR100497786B1/en not_active IP Right Cessation
- 1998-04-24 AU AU71580/98A patent/AU7158098A/en not_active Abandoned
- 1998-04-24 EP EP98918705A patent/EP0978135A4/en not_active Withdrawn
- 1998-04-24 WO PCT/US1998/008298 patent/WO1998049706A1/en active Search and Examination
- 1998-04-24 CN CNB988043491A patent/CN1147898C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| KR20010020269A (en) | 2001-03-15 |
| CN1252888A (en) | 2000-05-10 |
| EP0978135A1 (en) | 2000-02-09 |
| EP0978135A4 (en) | 2001-02-07 |
| WO1998049706A1 (en) | 1998-11-05 |
| KR100497786B1 (en) | 2005-06-29 |
| AU7158098A (en) | 1998-11-24 |
| JP2001526822A (en) | 2001-12-18 |
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