CN114789612A - Connecting piece, chip module, box body, ink box and ink bag - Google Patents

Connecting piece, chip module, box body, ink box and ink bag Download PDF

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Publication number
CN114789612A
CN114789612A CN202110114456.0A CN202110114456A CN114789612A CN 114789612 A CN114789612 A CN 114789612A CN 202110114456 A CN202110114456 A CN 202110114456A CN 114789612 A CN114789612 A CN 114789612A
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CN
China
Prior art keywords
chip
contact
pin
mounting
pins
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202110114456.0A
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Chinese (zh)
Inventor
不公告发明人
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Hangzhou Chipjet Technology Co Ltd
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Hangzhou Chipjet Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hangzhou Chipjet Technology Co Ltd filed Critical Hangzhou Chipjet Technology Co Ltd
Priority to CN202110114456.0A priority Critical patent/CN114789612A/en
Publication of CN114789612A publication Critical patent/CN114789612A/en
Pending legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/17Ink jet characterised by ink handling
    • B41J2/175Ink supply systems ; Circuit parts therefor
    • B41J2/17503Ink cartridges
    • B41J2/17553Outer structure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/17Ink jet characterised by ink handling
    • B41J2/175Ink supply systems ; Circuit parts therefor
    • B41J2/17503Ink cartridges
    • B41J2/17513Inner structure

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  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

The invention belongs to the field of printing equipment and discloses a connecting piece, a chip module, a box body, an ink box and an ink bag. The connecting piece is used for electrically connecting the first chip and the second chip and comprises an insulating body and a conductive component arranged on the insulating body, wherein the conductive component comprises a first pin and a second pin, the first pin is configured to be in contact with and electrically connected with a contact on the first chip, and the second pin is configured to be in contact with and electrically connected with a contact on the second chip; at least one of the first pin and the second pin can be deformed, and the deformable pin can be contacted with the corresponding contact and electrically connected under the action of the elastic restoring force of the deformable pin; therefore, the precision requirement on the spacing distance between the first chip and the second chip is low, the processing precision requirement on the contacts on the first chip and the second chip is low, the processing technology is simple, and the product cost is low on the premise of ensuring the effective electric connection of the first chip and the second chip.

Description

Connecting piece, chip module, box body, ink box and ink bag
Technical Field
The invention relates to the field of printing equipment, in particular to a connecting piece, a chip module, a box body, an ink box and an ink bag.
Background
With the increasing popularity of automated office equipment, printing devices play an increasingly important role in the normal work and learning of people, and inkjet printing devices are favored by users because of their advantages of low energy consumption, no pollution, and convenience in color printing.
An ink cartridge of an ink jet printing apparatus includes a cartridge body and an ink bag. The ink bag is used for storing ink. The side wall of the ink bag is provided with an ink bag chip. The outer side wall of the box body is provided with an ink box chip corresponding to the ink bag chip. The cartridge chip and the ink bag chip each have contacts. The outer side wall of the box body is provided with a connecting hole, and a part of area of the ink box chip extends into the connecting hole, so that the contact on the part of area is contacted and electrically connected with the corresponding contact on the ink bag chip.
However, since the box body has a certain thickness, in order to enable the contacts on the ink cartridge chip to effectively contact with the contacts on the ink bag chip, and simultaneously avoid the problems that the contacts on the ink cartridge chip are cracked or collapsed due to serious friction caused by replacing the ink bag for many times, the processing precision of the contacts on the ink cartridge chip and the installation precision of the ink cartridge chip in the connecting hole need to be strictly controlled by combining the factors such as the wall thickness of the box body, and the like, so that the production process and the assembly process are influenced, and the product cost is high.
Disclosure of Invention
It is an object of the invention to provide a connector for which the requirements for the machining accuracy of the contacts on the first chip and the second chip are low.
Another object of the present invention is to provide a chip module, which is easy to assemble and has low requirements for the processing precision of the contacts on the first chip or the second chip connected to the chip module.
Still another object of the present invention is to provide a case which is easy to assemble, simple in manufacturing process, and low in product cost.
Still another object of the present invention is to provide an ink cartridge which is easy to assemble, simple in manufacturing process, and low in product cost.
The invention further aims to provide the ink bag which is convenient to assemble, simple in processing technology and low in product cost.
In order to realize the purpose, the following technical scheme is provided:
in a first aspect, a connecting piece is provided for electrically connecting a first chip and a second chip, and includes an insulating body and a conductive component disposed on the insulating body, where the conductive component includes a first pin and a second pin that are electrically connected;
the first pins are configured to contact and electrically connect with contacts on the first chip, the second pins are configured to contact and electrically connect with contacts on the second chip, at least one of the first pins and the second pins is deformable, and the deformable pins are configured to contact and electrically connect with corresponding contacts under the action of self elastic restoring force.
As a preferable aspect of the connector of the present invention, the second pin is deformable, and the second pin includes a connecting arm and a contact portion connected to each other, and the contact portion is configured to be capable of contacting and electrically connecting with the contact of the second chip.
In a preferred embodiment of the connector according to the present invention, the contact portion is bent in a direction away from the insulating body.
As a preferable mode of the connector of the present invention, the connecting arm is inclined in a direction away from the insulating body.
As a preferable scheme of the connector of the present invention, the conductive component further includes a connecting portion, and both ends of the connecting portion are electrically connected to the first pin and the second pin, respectively.
As a preferable scheme of the connecting piece of the present invention, the insulating body is provided with a jack, the connecting portion includes an insertion section and a support section which are connected at an included angle, the insertion section penetrates through the jack, one end of the insertion section, which is far away from the support section, is connected with the first pin, and one end of the support section, which is far away from the insertion section, is connected with the second pin.
As a preferable scheme of the connector of the present invention, the conductive member is formed by bending and integrally molding.
As a preferred scheme of the connecting piece of the present invention, an avoiding cavity communicated with the insertion hole is formed on the insulating body, and the supporting section is located in the avoiding cavity.
As a preferable aspect of the connecting member of the present invention, the avoiding cavity penetrates through the insulating body.
As a preferable mode of the connector of the present invention, the insulating body includes a body portion and a protruding portion provided at an edge of the body portion, the body portion is configured to be connected to a mounting cavity of a mounting member, the protruding portion is configured to be connected to a mounting groove of the mounting member, and the mounting groove communicates with the mounting cavity.
As a preferable scheme of the connecting piece of the invention, the insulating body is integrally formed by injection molding.
In a second aspect, a chip module is provided, which includes a first chip and a connecting component as described above, where a first pin of the connecting component contacts and is electrically connected to a contact on the first chip, a second pin of the connecting component is deformable, and the second pin is configured to contact and be electrically connected to a contact on a second chip under the elastic restoring force of the second pin.
In a preferred embodiment of the chip module of the present invention, the first pins are soldered to the contacts on the first chip.
In a third aspect, a cartridge is provided, which includes a mounting member and the chip module as described above, wherein the chip module is disposed on the mounting member.
As a preferable scheme of the cartridge of the present invention, the mounting member is provided with a mounting cavity, and one end of the mounting member in the mounting cavity is provided with a mounting groove communicated with the mounting cavity, the insulating body includes a body portion and a protruding portion disposed at an edge of the body portion, the body portion is connected in the mounting cavity, the protruding portion is connected in the mounting groove, and the first chip is disposed at the other end of the mounting cavity and connected to the connecting member.
In a preferred embodiment of the cartridge of the present invention, the mounting cavity penetrates through an edge of the mounting member.
As a preferable scheme of the box body of the invention, the body part is bonded with the wall of the installation cavity; and/or, the bulge is bonded with the mounting groove.
As a preferable aspect of the cartridge of the present invention, the mounting member is provided with a third chip, the first chip includes a first region and a second region, the contact of the first region is electrically connected to the first pin of the connecting member, and the contact of the second region is electrically connected to the third chip.
In a fourth aspect, an ink cartridge is provided, which includes an ink bag and the cartridge body as described above, where the ink bag includes an ink bag body and a second chip disposed on the ink bag body, and a contact on the second chip contacts and is electrically connected to a second pin of the connecting member.
In a fifth aspect, a chip module is provided, which includes a second chip and the connector as described above, the second pin of the connector contacts and is electrically connected to the contact on the second chip, the first pin of the connector is deformable, and the first pin is configured to contact and electrically connect to the contact on the first chip under the elastic restoring force of the first pin.
In a sixth aspect, an ink bag is provided, which includes an ink bag body and the chip module as described above, wherein the chip module is disposed on the ink bag body.
The invention has the beneficial effects that:
the connecting piece is used for electrically connecting a first chip and a second chip, at least one of a first pin and a second pin of the connecting piece can be deformed, the deformable pin can effectively contact and be electrically connected with a contact on the corresponding chip under the action of the elastic restoring force of the deformable pin, so that the precision requirement on the spacing distance between the first chip and the second chip is lower, the precision requirement on the processing of the contact on the first chip and the second chip is lower, and compared with the existing method that the contact on the first chip is directly contacted and electrically connected with the contact on the second chip, the connecting piece has lower requirements on the processing precision of the contact on the first chip and the second chip and the mounting position precision of the first chip and the second chip, can ensure that the first chip and the second chip are effectively and electrically connected, and has low product cost.
The chip module provided by the invention is convenient to assemble, and has lower requirements on the processing precision of the contact on the first chip or the second chip connected with the chip module.
The box body provided by the invention is convenient to assemble, simple in processing technology and low in product cost.
The ink box provided by the invention is convenient to assemble, simple in processing technology and low in product cost.
The ink bag provided by the invention is convenient to assemble, simple in processing technology and low in product cost.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required to be used in the description of the embodiments of the present invention will be briefly described below, and it is obvious that the drawings in the description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings may be obtained according to the contents of the embodiments of the present invention and the drawings without creative efforts.
FIG. 1 is a first isometric view of a connector according to an embodiment of the present invention;
FIG. 2 is a second isometric view of a connection provided by an embodiment of the present invention;
FIG. 3 is a third isometric view of a connector according to an embodiment of the present invention;
FIG. 4 is a schematic view of a conductive assembly provided in accordance with an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a connection component, a first chip, and a second chip provided in an embodiment of the present invention;
FIG. 6 is a schematic structural diagram of a connecting member and a mounting member provided by an embodiment of the invention;
FIG. 7 is a schematic view of a connector mounted on a mounting member according to an embodiment of the present invention;
FIG. 8 is a schematic structural diagram of a cartridge according to an embodiment of the present invention;
FIG. 9 is a first exploded view of the case according to the first embodiment of the present invention;
FIG. 10 is a second exploded view of the case according to the embodiment of the present invention;
FIG. 11 is a schematic structural view of an ink bag according to an embodiment of the present invention;
fig. 12 is a schematic structural view of an ink cartridge provided in an embodiment of the present invention.
Reference numerals:
10. a chip module;
20. a case body; 201. a mounting member; 2011. a mounting cavity; 2012. mounting grooves; 202. an ink jet head;
30. an ink bag; 301. an ink bag body; 3011. an ink outlet;
1. a connecting member; 2. a first chip; 3. a second chip; 4. a third chip;
11. an insulating body; 12. a conductive component;
111. a jack; 112. a body portion; 113. a projection; 114. an avoidance cavity;
121. a first pin; 122. a second pin; 123. a connecting portion;
1221. a connecting arm; 1222. a contact portion;
1231. a plug section; 1232. a first support section; 1233. a second support section;
21. a first region; 22. a second region.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some structures related to the present invention are shown in the drawings, not all of them.
In the description of the present invention, unless otherwise explicitly specified or limited, the terms "connected," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the present invention, unless expressly stated or limited otherwise, the recitation of a first feature "on" or "under" a second feature may include the recitation of the first and second features being in direct contact, and may also include the recitation that the first and second features are not in direct contact, but are in contact via another feature between them. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
In the description of the present embodiment, the terms "upper", "lower", "right", etc. are used in an orientation or positional relationship based on that shown in the drawings only for convenience of description and simplicity of operation, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used only for descriptive purposes and are not intended to be limiting.
As shown in fig. 1 to 5, the present embodiment provides a connector 1 for electrically connecting two chips. For the convenience of the following description, the two chips are set as the first chip 2 and the second chip 3, respectively. The connector 1 includes an insulative housing 11 and a conductive element 12 disposed on the insulative housing 11. The insulating body 11 serves as a carrying body for the conductive assembly 12, and the conductive assembly 12 is used for electrically connecting the first chip 2 and the second chip 3. The conductive component 12 includes a first pin 121 and a second pin 122 electrically connected. The first pins 121 are used to contact and electrically connect with contacts on the first chip 2. The second pins 122 are used to contact and electrically connect with contacts on the second chip 3. The second pin 122 itself may be deformed to some extent, and the second pin 122 itself also has some elastic restoring force, under which the second pin 122 has a tendency to restore to its original state. Specifically, when the second chip 3 is connected to the connecting component 1, the second chip 3 presses the second pin 122 toward the insulating body 11, the second pin 122 deforms, and meanwhile, the second pin 122 always has a tendency to move toward a direction away from the insulating body 11 under the action of the elastic restoring force of the second pin 122, so as to return to the initial state, so that the second pin 122 can effectively contact and electrically connect with the contact on the second chip 3.
The connecting piece 1 of this embodiment is used for electrically connecting the first chip 2 and the second chip 3, the second pin 122 of the connecting piece 1 is deformable and can effectively contact and electrically connect with the contact on the second chip 3 under the action of its own elastic restoring force, so that the requirement on the precision of the separation distance between the first chip 2 and the second chip 3 is low, and meanwhile, the requirement on the processing precision of the contact on the first chip 2 and the second chip 3 is low, compared with the existing direct contact and electrical connection between the contact on the first chip 2 and the contact on the second chip 3, the connecting piece 1 of this embodiment has low requirements on the processing precision of the contact on the first chip 2 and the second chip 3 and the precision of the mounting positions of the first chip 2 and the second chip 3, and can ensure the effective electrical connection between the first chip 2 and the second chip 3, and the product cost is low.
Optionally, the first pins 121 on the connecting member 1 are soldered to the contacts on the first chip 2, which is simple in process and reliable in connection. Illustratively, the connection member 1 and the first chip 2 are soldered using an SMT soldering process. The insulating body 11 of the connector 1 is preferably a high temperature resistant plastic, which can be reflowed.
The second pin 122 includes a connecting arm 1221 and a contact portion 1222 connected to each other. The connecting arm 1221 is connected to the insulating body 11 through the connecting portion 123, see the following description. The contact portions 1222 are in contact with and electrically connected to the contacts of the second chip 3. When the second chip 3 is assembled and connected to the connector 1, the second chip 3 presses the connecting arm 1221 and slides relative to the connecting arm 1221 until the contact thereon comes into contact with the contact portion 1222.
The connecting arm 1221 is inclined towards a direction away from the insulating body 11, that is, the connecting arm 1221 always tends to be away from the insulating body 11 under the action of its own elastic restoring force, so that the connecting arm 1221 and the contact portion 1222 protrude relative to the insulating body 11, and the contact portion 1222 can contact the contact on the second chip 3. The contact portion 1222 is bent toward the direction away from the insulating body 11, a larger arc-shaped contact area is formed on the side of the contact portion 1222 away from the insulating body 11, so as to ensure the contact area between the contact portion 1222 and the contact on the second chip 3, thereby achieving effective contact, and meanwhile, the bending of the contact portion 1222 toward the direction away from the insulating body 11 can also avoid the upward warping of the connecting arm 1221 under the action of self elastic restoring force, thereby controlling the inclination angle of the connecting arm 1221 relative to the insulating body 11.
The conductive member 12 further includes a connecting portion 123, and two ends of the connecting portion 123 are electrically connected to the first pin 121 and the second pin 122, respectively. Specifically, the connecting portion 123 includes an inserting section 1231 and a supporting section connected at an included angle. The insulating body 11 is provided with an insertion hole 111. The plug section 1231 is connected through the insertion hole 111. Preferably, the plug section 1231 is in interference fit with the receptacle 111, so as to prevent the plug section 1231 from moving in the receptacle 111. Alternatively, the plug section 1231 and the inner wall of the insertion hole 111 may be bonded together by using an adhesive. The end of the inserting section 1231 far away from the supporting section is connected to the first pin 121, and the end of the supporting section far away from the inserting section 1231 is connected to the second pin 122. Illustratively, the first pin 121 is connected perpendicularly to the plug section 1231. The supporting section comprises a first supporting section 1232 and a second supporting section 1233 which are connected, the first supporting section 1232 is vertically connected with the inserting section 1231, and the second supporting section 1233 is connected with the second pin 122 after being bent.
Preferably, the conductive component 12 is formed by bending and integrating, the manufacturing process is simple, and the production efficiency is high. Alternatively, the conductive member 12 is made of a material, such as copper, which is conductive and has a certain strength and elasticity.
In this embodiment, the insulation body 11 is provided with an avoiding cavity 114 communicated with the insertion hole 111, and the support section is located in the avoiding cavity 114. When the second pin 122 is pressed by the second chip 3, the supporting section deforms to some extent along with the second pin 122, the supporting section rotates relative to the inserting section 1231 in a direction away from the second chip 3, and the avoiding cavity 114 allows the supporting section to have enough movement space. Optionally, the avoiding cavity 114 penetrates through the insulating body 11, so as to facilitate processing of the avoiding cavity 114 and installation of the conductive component 12 on the insulating body 11.
Optionally, the insulating body 11 includes a body portion 112 and a protrusion portion 113 disposed at an edge of the body portion 112. Referring to fig. 2, 6 and 7, body portion 112 is configured to be connected to mounting cavity 2011 of mounting member 201, and protruding portion 113 is configured to be connected to mounting groove 2012 of mounting member 201, which communicates with mounting cavity 2011, so as to realize the assembly of connecting member 1 on its mounting carrier (i.e., mounting member 201). When the projection 113 abuts against the bottom wall of the mounting groove 2012, the connector 1 is mounted in place on the mounting member 201. In this embodiment, the protruding portion 113 is provided along the entire circumference of the body portion 112, which improves the connection stability between the connector 1 and the mounting member 201. Optionally, body portion 112 is bonded to the wall of mounting cavity 2011; and/or the protruding part 113 is bonded with the mounting groove 2012, so that the connection between the connecting piece 1 and the mounting piece 201 is realized.
Preferably, the insulation body 11 is formed integrally by injection molding, and has a simple manufacturing process and high production efficiency.
Referring to fig. 5, the present embodiment further provides a chip module 10, which includes the first chip 2 and the above-mentioned connecting component 1. The contacts on the first chip 2 are in contact with and electrically connected to the first pins 121 of the connector 1. The first pins 121 are exemplarily solder connected to contacts on the first chip 2. Illustratively, the connection member 1 and the first chip 2 are soldered using an SMT soldering process. The first chip 2 comprises a first region 21 in contact with the connection 1 and a second region 22 not in contact with the connection 1. Preferably, the thickness of the first region 21 is greater than the thickness of the second region 22 to ensure that the first region 21 has sufficient stiffness during SMT soldering. The chip module 10 can be connected to the second chip 3 through the second pins 122 of the connector 1, and the requirement for the processing precision of the contacts on the second chip 3 is low.
Referring to fig. 6 to 8, the present embodiment further provides a case 20 including a mounting member 201 and the chip module 10 described above. The mount 201 is part of the case 20. The chip module 10 is disposed on the mount 201. Seted up the installation cavity 2011 on the installed part 201, and seted up the mounting groove 2012 that communicates with installation cavity 2011 in the one end of installation cavity 2011 on the installed part 201, insulator 11 includes this body part 112 and sets up the bulge 113 at the edge of this body part 112, and this body part 112 connects in installation cavity 2011, and bulge 113 connects in mounting groove 2012, and first chip 2 sets up in the other end of installation cavity 2011 and is connected with connecting piece 1. When the projection 113 abuts against the bottom of the mounting groove 2012, the connector 1 is mounted in place on the mounting member 201. In this embodiment, the protrusion 113 is disposed along the entire circumference of the body 112, so as to improve the connection stability between the connector 1 and the mounting member 201.
Optionally, body portion 112 is bonded to the walls of mounting cavity 2011; and/or, the protruding part 113 is adhered to the mounting groove 2012, so as to connect the connecting element 1 and the mounting element 201.
The first chip 2 is assembled with the connection member 1, and the assembled chip module 10 is mounted on the mounting member 201. When the chip module 10 is assembled with the mounting member 201, one end of the first chip 2, which is far away from the connecting member 1, passes through the mounting groove 2012 and the mounting cavity 2011, the body portion 112 of the insulating body 11 is mounted in the mounting cavity 2011, and the protrusion 113 of the insulating body 11 is mounted in the mounting groove 2012.
For example, referring to fig. 9 and 10, the mounting cavity 2011 may be a closed cavity structure (see fig. 9) or an edge cavity structure (see fig. 10) opened on the mounting member 201. The closed cavity structure means that the mounting cavity 2011 is surrounded by the mounting member 201 in a solid manner in the whole circumferential direction. The edge cavity structure means that the mounting cavity 2011 penetrates through the edge or one side surface of the mounting member 201. In this embodiment, the mounting cavity 2011 penetrates through the upper edge of the mounting member.
When the mounting cavity 2011 is a closed cavity structure opened on the mounting member 201, the first chip 2 is a flexible chip, so that the first chip 2 can be bent and deformed to pass through the mounting groove 2012 and the mounting cavity 2011. When the mounting cavity 2011 is a semi-open edge cavity structure opened on the mounting member 201, the first chip 2 may be a flexible chip or a rigid chip, which is not limited herein. In addition, when the size of the mounting member 201 is limited, the mounting cavity 2011 tends to have a cavity-edge configuration.
Optionally, a third chip 4 is disposed on the box 20, and the first chip 2 includes a first area 21 and a second area 22. The contacts of the first area 21 are connected to the first pins 121 of the connector 1 and the contacts of the second area 22 are electrically connected to the third chip 4.
The third chip 4 may be solder-connected to the second region 22 of the first chip 2. When the case 20 is made of a material that does not have high temperature resistance, the third chip 4 and the second region 22 of the first chip 2 need to be cold-welded.
Referring to fig. 11, the present embodiment also provides an ink bag 30, the ink bag 30 including an ink bag body 301 and a second chip 3. The ink bag body 301 is for storing ink. The second chip 3 is disposed on the ink bag body 301. The second chip 3 is configured to be in contact electrical connection with the second pins 122 of the connector 1.
Referring to fig. 12, the present embodiment also provides an ink cartridge including the ink bag 30 and the cartridge body 20 described above. The mounting member 201 is a part of the case 20. The cartridge 20 further includes an inkjet head 202 provided to the mounting member 201. The ink bag 30 includes an ink bag body 301 and a second chip 3. The ink bag body 301 is for storing ink. The ink bag body 301 is mounted on the mount 201. The ink outlet 3011 of the ink bag body 301 communicates with the inkjet head 202. The second chip 3 is disposed on the ink bag body 301. The contacts on the second chip 3 are in contact with and electrically connected to the second pins 122 of the connector 1, so that the third chip 4 on the case 20 is electrically connected to the second chip 3 through the first chip 2.
It should be noted that the inkjet head 202 on the cartridge 20 is an important structure, and the manufacturing process thereof is complicated and costly. The ink bag 30 of the embodiment is detachably connected to the mounting member 201 of the ink cartridge, and after the ink is used up, a new ink bag 30 can be replaced, and the mounting member 201 and the cartridge body 20 can be reused, thereby effectively utilizing the ink jet head and reducing the product cost.
The embodiment also provides a printing arrangement comprising the ink cartridge. A control chip is arranged in the printing device. The third chip 4 in the case 20 may be electrically connected to a control chip within the printing apparatus. Data such as ink amount, use programs and the like are written in at least one of the first chip 2 and the second chip 3, so that when the ink box is placed in the printing equipment, a contact of a control chip in the printing equipment is electrically connected with a contact of the third chip 4, the control chip is electrically connected with the second chip 3 through the third chip 4 and the first chip 2, and the ink printing function, the residual ink amount monitoring function and the like of the ink box are achieved.
It should be noted that, in other embodiments, the second pin 122 of the connecting component 1 may be configured to contact and electrically connect with the contact on the second chip 3, and the first pin 121 may be deformable and may contact and electrically connect with the contact on the first chip 2 under the action of its own elastic force. That is, at least one of the first stitch 121 and the second stitch 122 may be deformed. Correspondingly, the chip module 10 comprises a connection 1 and a second chip 3. Correspondingly, the ink bag 30 includes an ink bag body 301 and the chip module 10 disposed on the ink bag body 301. When the ink bag 30 is loaded into the ink cartridge, the first pins 121 may be deformed and extend into the mounting cavity 2011 to be electrically connected with the contacts of the first chip 2. Alternatively, the first region 21 of the first chip 2 on the case 20 of the ink cartridge may extend from the mounting cavity 2011 into the case 20 and be connected to the inner wall of the case 20, so that the first pins 121 can be electrically connected with the contacts of the first chip 2.
It is to be noted that the foregoing description is only exemplary of the invention and that the principles of the technology may be employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in some detail by the above embodiments, the invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the invention, and the scope of the invention is determined by the scope of the appended claims.

Claims (21)

1. A connector for electrically connecting a first chip (2) and a second chip (3), comprising an insulating body (11) and a conductive component (12) disposed on the insulating body (11), wherein the conductive component (12) comprises a first pin (121) and a second pin (122) which are electrically connected;
the first pins (121) are configured to contact and electrically connect with contacts on the first chip (2), the second pins (122) are configured to contact and electrically connect with contacts on the second chip (3), at least one of the first pins (121) and the second pins (122) is deformable, and the deformable pins are configured to contact and electrically connect with corresponding contacts under the action of self elastic restoring force.
2. The connector according to claim 1, characterized in that the second pins (122) are deformable, the second pins (122) comprising a connecting arm (1221) and a contact portion (1222) connected thereto, the contact portion (1222) being configured to be able to make contact with and electrically connect to a contact of the second chip (3).
3. The connection according to claim 2, characterized in that the contact portion (1222) is bent away from the insulating body (11).
4. The connecting element according to claim 2, characterized in that the connecting arm (1221) is inclined away from the insulating body (11).
5. The connector according to claim 1, characterized in that the conductive member (12) further comprises a connecting portion (123), and both ends of the connecting portion (123) are electrically connected to the first pin (121) and the second pin (122), respectively.
6. The connecting piece of claim 5, wherein a jack (111) is formed in the insulating body (11), the connecting portion (123) includes an inserting section (1231) and a supporting section connected at an included angle, the inserting section (1231) penetrates through the jack (111), one end of the inserting section (1231) far away from the supporting section is connected with the first pin (121), and one end of the supporting section far away from the inserting section (1231) is connected with the second pin (122).
7. The connector of claim 6, wherein the conductive member (12) is bent and formed integrally.
8. The connecting piece according to claim 6, wherein the insulating body (11) is provided with a bypass cavity (114) communicated with the insertion hole (111), and the supporting section is located in the bypass cavity (114).
9. The connection according to claim 8, characterized in that the relief cavity (114) extends through the insulating body (11).
10. The connector according to claim 1, wherein the insulative housing (11) comprises a body portion (112) and a protrusion (113) disposed at an edge of the body portion (112), the body portion (112) is configured to be coupled to a mounting cavity (2011) of a mounting member (201), the protrusion (113) is configured to be coupled to a mounting groove (2012) of the mounting member (201), and the mounting groove (2012) is in communication with the mounting cavity (2011).
11. A connector according to any one of claims 1-10, characterized in that the insulating body (11) is injection moulded in one piece.
12. A chip module comprising a first chip (2) and a connector according to any one of claims 1 to 11, the first pins (121) of the connector being in contact with and electrically connected to contacts on the first chip (2), the second pins (122) of the connector being deformable, the second pins (122) being configured to be able to be in contact with and electrically connected to contacts on the second chip (3) under the effect of their own elastic restoring force.
13. A chip module according to claim 12, characterized in that the first pin (121) is in soldered connection with a contact on the first chip (2).
14. A cartridge, characterized by a mounting (201) and a chip module according to claim 12 or 13, which is arranged on the mounting (201).
15. The box body according to claim 14, wherein a mounting cavity (2011) is formed in the mounting member (201), a mounting groove (2012) communicated with the mounting cavity (2011) is formed in one end of the mounting cavity (2011) of the mounting member (201), the insulating body (11) includes a body portion (112) and a protruding portion (113) arranged at an edge of the body portion (112), the body portion (112) is connected in the mounting cavity (2011), the protruding portion (113) is connected in the mounting groove (2012), and the first chip (2) is arranged at the other end of the mounting cavity (2011) and connected with the connecting piece.
16. The cartridge according to claim 15, characterized in that the mounting cavity (2011) passes through the edge of the mounting (201).
17. A cartridge according to claim 15, characterized in that the body portion (112) is bonded to a wall of the mounting chamber (2011); and/or the bulge part (113) is bonded with the mounting groove (2012).
18. The case according to claim 15, characterised in that a third chip (4) is provided on the mount (201), the first chip (2) comprising a first area (21) and a second area (22), the contacts of the first area (21) being electrically connected to the first pins (121) of the connector, the contacts of the second area (22) being electrically connected to the third chip (4).
19. An ink cartridge comprising an ink bag and a cartridge body according to any one of claims 14 to 18, the ink bag comprising an ink bag body (301) and a second chip (3) provided on the ink bag body (301), the contacts on the second chip (3) being in contact with and electrically connected to the second stitches (122) of the connector.
20. A chip module comprising a second chip (3) and a connector according to any one of claims 1 to 11, the second pins (122) of the connector being in contact with and electrically connected to contacts on the second chip (3), the first pins (121) of the connector being deformable, the first pins (121) being configured to be able to be in contact with and electrically connected to contacts on the first chip (2) under the effect of their own elastic restoring force.
21. An ink bag, comprising an ink bag body (301) and the chip module of claim 20, the chip module being provided on the ink bag body (301).
CN202110114456.0A 2021-01-26 2021-01-26 Connecting piece, chip module, box body, ink box and ink bag Pending CN114789612A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110114456.0A CN114789612A (en) 2021-01-26 2021-01-26 Connecting piece, chip module, box body, ink box and ink bag

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110114456.0A CN114789612A (en) 2021-01-26 2021-01-26 Connecting piece, chip module, box body, ink box and ink bag

Publications (1)

Publication Number Publication Date
CN114789612A true CN114789612A (en) 2022-07-26

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Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
CN (1) CN114789612A (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0615116D0 (en) * 2006-03-17 2006-09-06 Giga Byte Tech Co Ltd Chip adapter seat
US20070020961A1 (en) * 2005-07-20 2007-01-25 Yi-Tse Ho Electrical connector
WO2016198559A1 (en) * 2015-06-10 2016-12-15 Fairphone B.V. Connector for an electronic device
WO2018028411A1 (en) * 2016-08-12 2018-02-15 珠海纳思达企业管理有限公司 Ink cartridge chip, ink cartridge and ink-jet printer
CN110936723A (en) * 2019-06-28 2020-03-31 珠海纳思达企业管理有限公司 Ink box
CN112026367A (en) * 2020-06-05 2020-12-04 珠海益捷科技有限公司 Ink container recycling method and recycled ink container

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070020961A1 (en) * 2005-07-20 2007-01-25 Yi-Tse Ho Electrical connector
GB0615116D0 (en) * 2006-03-17 2006-09-06 Giga Byte Tech Co Ltd Chip adapter seat
WO2016198559A1 (en) * 2015-06-10 2016-12-15 Fairphone B.V. Connector for an electronic device
WO2018028411A1 (en) * 2016-08-12 2018-02-15 珠海纳思达企业管理有限公司 Ink cartridge chip, ink cartridge and ink-jet printer
CN110936723A (en) * 2019-06-28 2020-03-31 珠海纳思达企业管理有限公司 Ink box
CN112026367A (en) * 2020-06-05 2020-12-04 珠海益捷科技有限公司 Ink container recycling method and recycled ink container

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