CN1147878C - Thermally conductive silicon powder-base insulator - Google Patents
Thermally conductive silicon powder-base insulatorInfo
- Publication number
- CN1147878C CN1147878C CNB001057499A CN00105749A CN1147878C CN 1147878 C CN1147878 C CN 1147878C CN B001057499 A CNB001057499 A CN B001057499A CN 00105749 A CN00105749 A CN 00105749A CN 1147878 C CN1147878 C CN 1147878C
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- weight
- silicon
- silicon rubber
- silicone oil
- thermal conductive
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Abstract
The present invention relates to a heat conducting and insulating silicon powder base composite for heat conduction and insulation among electronic components. Silicon powder with good insulation properties is used as a main insulation component and matches other necessary components such as silicone oil, silicone rubber, metal oxide, etc., and a coupling agent is added. Heat conducting and insulating silicon powder base silicon grease or a silicon plate is obtained.
Description
Technical field
The present invention relates to a kind of thermally conductive silicon powder-base insulation composition, be used for the heat conductive insulating between the electronic devices and components.
Background technology
In electronic equipment, many contact-making surfaces and fitting surface are arranged between each electronic devices and components, exist the space between them, these spaces can make in the equipment hot-fluid not smooth, and thermal resistance increases, the dependability and the life-span of directly having reduced equipment.In order to address this problem, adopt usually and between these spaces or contact-making surface, fill thermal conductive insulator, comprise solid conductive heat insulator (as: mica sheet) and liquid thick lipid thermal conductive insulator (as: silicone grease).The thermal impedance of mica sheet is very high, therefore need mica sheet do very thin, though respond well, the mica sheet that approaches ruptures easily.Influence insulating reliability.So there are some other solid conductive heat insulators to replace mica at present, as: CN 1043583A discloses a kind of comprehensive silicon plate thermal conductive insulator, a kind of in the spraying of polyimide film two sides is key component and the composition that is mixed with compositions such as alumina powder, silicon dioxide with ethene silicon rubber, becomes the thick comprehensive silicon plate of 0.2mm.The heat conduction of this comprehensive silicon plate and insulation property all can reach requirement, and good springiness is difficult for breaking, but this comprehensive silicon plate is composited by 3 layers, and need spraying coating process, and processing is comparatively complicated, and conductive coefficient also only reaches about 0.5W/m ℃.Silicone grease is the liquid lipid thermal conductive insulator of using always, full-filling between the components and parts interface or with the mica sheet coupling, utilize flowing of silicone grease to get rid of air between the interface, reduce interface resistance.At present the silicone grease that uses is to fill metal oxide in silicone oil, utilizes the heat-conducting effect between the improved thermal conductivity components and parts of metal.As: JP55058424 A19800501, disclose a kind of silicone grease composition thermal conductive insulator, in silicone oil, filled aluminium oxide or zinc oxide, the capacity of heat transmission is made moderate progress, but, therefore make the insulation property of silicone grease undesirable because metal oxide has certain conductivity.In addition, the affine performance of metal oxide and silicone oil is bad, and segregation phenomenon is arranged, and makes and produces heat rejection between the thermally-conductive interface, and the capacity of heat transmission of metal oxide is not fully exerted.
Summary of the invention
The objective of the invention is: provide between a kind of each component and the interface to keep good affinity, do not produce heat rejection, heat conduction and good insulating, heatproof, thermal conductive insulator easy to process.
Main technical schemes of the present invention: with silica flour with good insulation performance as main insulation component, rationally cooperate with other necessary components such as silicone oil, silicon rubber, metal oxides, and dose coupling agent, obtain thermally conductive silicon powder-base insulator, the concrete relative thermally conductive silicon powder-base insulator total weight of component: (percentage by weight) is as follows:
Silica flour (specific insulation 10
14Ω .cm) 30-60 weight %
Silicone oil 1-25 weight %
Silicon rubber 1-25 weight %
Zinc oxide 5-10 weight %
Alumina powder 15-30 weight %
Coupling agent 0.5-2 weight %
Above-mentioned silica flour is the pure silicon powder that contains more than 90%, and it and silicone oil or silicon rubber all have the affine performance of good interface, can fill in a large number, do not influence the heat conductive insulating performance, and its consumption is according to the viscosity of material adjustment.
Above-mentioned silicone oil is methyl or hydroxy silicon oil, thick liquid.
Above-mentioned silicon rubber is methyl vinyl silicone rubber or terminal hydroxy group (or end acetoxyl group) silicon rubber, and its agent structure all contains-the Si-O-Si-key, and good high and low temperature resistance is arranged, and with silica flour good compatibility is arranged.Wherein the former good springiness can be processed into fine sheet, and is survivable; The latter can be normal temperature crosslinked, and molecular weight is lower, is viscous liquid, is easy to carry out stirring and processing.
Above-mentioned zinc oxide, alumina powder are that purity reaches more than 99% about 1000 orders.To improve performances such as thermal conductivity and anti-electric arc, anti-electric leakage.
Above-mentioned coupling agent is silane coupler or titanate coupling agent.Be constitution controller or processing aid.Suitably select as required.
According to the needs of using, the present invention can be the thermal conductive insulator of different shape.
When being main body with silicone oil, the present invention can be smectic, that is: thermally conductive silicon powder-base insulation silicone grease.Wherein only contain on a small quantity or do not contain terminal hydroxy group (or end acetoxyl group) silicon rubber, better the set of dispense ratio is:
Silica flour (specific insulation 10
14Ω .cm) 30-60 weight %
Silicone oil 20-25 weight %
Terminal hydroxy group (or end acetoxyl group) silicon rubber 1-5 weight %
Zinc oxide 5-10 weight %
Alumina powder 15-30 weight %
KH-550 (coupling agent) 0.5-1 weight %
When being main body with silicon rubber, the present invention can be made into thermally conductive silicon powder-base insulating silicon sheet, silica cement or silica gel.Wherein only contain on a small quantity or do not contain silicone oil, silicon plate set of dispense ratio is:
Silica flour (specific insulation 10
14Ω .cm) 35-60 weight %
Methyl vinyl silicone rubber 20-25 weight %
Silicone oil 1-5 weight %
Zinc oxide 5-10 weight %
Alumina powder 12-30 weight %
Titanate coupling agent (trying pure dose) 0.5-1 weight %
Cumyl peroxide (trying pure dose) 0.5-1 weight %
Coupling agent is a titanate coupling agent in the silicon plate, is a kind of constitution controller, to increase the compatibility of silica flour and silicon rubber.
Also containing curing agent peroxide-cumyl peroxide in the silicon plate, is the thermal cross-linking agent that adds man-hour, the physical and mechanical properties when being processed into the silicon plate with raising the present invention.
Select ambient crosslinking silicon rubber and different processing coupling agent or crosslinking agents can also make silica cement or silica gel.
Thermally conductive silicon powder-base Silicon-On-Insulator clay:
Silica flour (specific insulation 10
14Ω .cm) 30-60 weight %
Terminal hydroxy group (or end acetoxyl group) silicon rubber 20-25 weight %
Silicone oil 1-10 weight %
Zinc oxide (1000 orders, purity 99%) 5-10 weight %
Alumina powder (1000 orders, purity 99%) 15-30 weight %
KH-550 (coupling agent) 0.5-1 weight %
Thermally conductive silicon powder-base insulation silica gel:
Silica flour (specific insulation 10
14Ω .cm) 30-60 weight %
Terminal hydroxy group (or end acetoxyl group) silicon rubber 20-25 weight %
Silicone oil 1-10 weight %
Zinc oxide (1000 orders, purity 99%) 5-10 weight %
Alumina powder (1000 orders, purity 99%) 15-30 weight %
Acetoxyl group class siloxanes or alkoxyl class siloxanes 0.5-1 weight %
KH-550 (coupling agent) 0.5-1 weight %
Above-mentioned coupling agent is the effect that KH-550 plays structure control.Add the methoxyl group triacetoxysilane, be room temperature crosslinking agent.
Effect of the present invention: the present invention is necessary component to contain a large amount of silica flours, obtain thermally conductive silicon powder-base insulator, not only insulation property obviously improve, and owing between it and silicone oil or the silicon rubber good affine performance is arranged all, can fill in a large number, fit structure is adjusted coupling agent, has overcome the shortcoming of existing heat conductive insulating silicone grease and silicon plate, makes:
The heat conductive insulating silicone grease: the bonding force that reaches between filler and the main body component silicone oil between each filler improves greatly.Kept the good affinity between silicone grease and the interface, overcome the interface debonding when silicone grease uses, thereby eliminated heat rejection, the thermal conductivity of the metal oxide of dosing in the silicone grease is not fully exerted, conductive coefficient can reach 1.7W/m ℃.Electrical property, weather resisteant and the corrosion resistance of silicone grease have been improved simultaneously.
Heat conducting insulating silicon sheet: the agent structure of silicon rubber contains-the Si-O-Si-key, and therefore anti-ozone and thermal stability are arranged.The adding of silica flour does not influence heat conductive insulating, is equipped with suitable coupling agent and curing agent again, can be processed into the product of silicon plate, silica cement, silica gel different cultivars, uses flexible, convenient.The processing of silicon plate is simple, with common mill can process obtain thinner than mica sheet, good springiness, survivable thermally conductive and electrically insulating silicone plate.
It below is the performance test data of silicone grease and silicon plate.As seen effect of the present invention.
Thermally conductive silicon powder-base insulation silicone grease performance: (table 1)
| Performance | The heat-conductivity conducting silicone grease | Method of testing and standard |
| Disruptive field intensity (KV/cm) | ＞40 | JC-4 dielectric breakdown tester |
| Specific insulation (Ω .cm) | 3.6×10 14 | The TR-840 electro static instrument |
| Dielectric loss tg δ | 9(1kHz)1.43× 10 -2 | Hp4274A and HP4275ARCI table testing standard |
| Dielectric constant ξ | (1kHz)3.54 (100kHz)3.4 | TR-41 type sample test standard |
| Conductive coefficient (W/m ℃) | 1.7 | Tc-32 instrument test standard is closed Japanese JIS2618-1979 testing standard |
| Operating temperature range (℃) | -60-200℃ | |
Thermally conductive silicon powder-base insulating silicon sheet performance: (table 2)
| Performance | The heat-conductivity conducting silicone grease | Method of testing and standard |
| Thickness (mm) | 0.2±0.01 | |
| Dielectric strength (V) | ＞7000 | GB1401-78 |
| Specific insulation (Ω .cm) | 4.85×10 14 | GB1401-78 |
| Dielectric loss tg δ | (1kHz)1.02×10 -2 (100kHz)7.5×10 -3 | GB1401-78 |
| Dielectric constant ξ | (1kHz)3.54 (100kHz)3.4 | TR-41 type sample test standard |
| Conductive coefficient (W/m ℃) | 1.0 | Meet the ASTMC518-76 standard |
| Thermal resistance (℃/W) | 0.4 | The same |
| Operating temperature range (℃) | -60-180℃ | |
Embodiment
Open in detail below in conjunction with embodiment to the present invention:
Open in detail below in conjunction with embodiment to the present invention:
Embodiment 1: thermally conductive silicon powder-base insulation silicone grease and preparation: relative thermally conductive silicon powder-base insulator total weight proportioning: (percentage by weight)
Silica flour (specific insulation 10
14Ω .cm) 40 weight %
Methyl-silicone oil 20 weight %
Terminal hydroxy group (or end acetoxyl group) silicon rubber 2 weight %
Zinc oxide (1000 orders, purity 99%) 9 weight %
Alumina powder (1000 orders, purity 99%) 28 weight %
KH-550 (commercially available silane coupler, chemical plant, Gai County, Liaoning product) 1%
Above-mentioned each component was dried two hours under 80 ℃ in baking oven earlier, remove moisture, take out and in high speed agitator, mix, and adjust viscosity 400mm at the most
2/ s, taking-up can become silicone grease of the present invention.
Embodiment 2: thermally conductive silicon powder-base insulating silicon sheet, thermally conductive silicon powder-base insulator total weight proportioning relatively: (percentage by weight)
Silica flour (specific insulation 10
14Ω .cm) 40 weight %
Methyl vinyl silicone rubber 25 weight %
Silicone oil 2 weight %
Zinc oxide (1000 orders, purity 99%) 10 weight %
Alumina powder (1000 orders, purity 99%) 21 weight %
Titanate coupling agent (trying pure dose) 1 weight %
Cumyl peroxide (trying pure dose) 1 weight %
It is 1% acetone soln that titanate coupling agent is made concentration, get this solution and soak zinc oxide, aluminium oxide and silica flour, consumption with the immersion solid sub-material till, handled 2 hours down at 80 ℃, taking-up adds methyl vinyl silicone rubber in mill, and successively add the processing filler, add the crosslinking agent cumyl peroxide again.The moulding that is heating and curing under 160-200 ℃, and, make the silicon plate of 0.2mm at last 200 ℃ of following reprocessings 2 hours.
Embodiment 3: thermally conductive silicon powder-base Silicon-On-Insulator clay, thermally conductive silicon powder-base insulator total weight proportioning relatively: (percentage by weight)
Silica flour (specific insulation 10
14Ω .cm) 45 weight %
End acetoxyl group silicon rubber 20 weight %
Silicone oil 5 weight %
Zinc oxide (1000 orders, purity 99%) 9 weight %
Alumina powder (1000 orders, purity 99%) 20 weight %
KH-550 (coupling agent) 1 weight %
The preparation method: it is 1% acetone soln that KH-550 is made concentration, get this solution and soak zinc oxide, aluminium oxide and silica flour, consumption with the immersion solid powder till, high-speed stirred half an hour, add and handled 2 hours down at 80 ℃ after silicon rubber stirs half an hour again, make silica cement.
Embodiment 4: thermally conductive silicon powder-base insulation silica gel, thermally conductive silicon powder-base insulator total weight proportioning relatively: (percentage by weight)
Silica flour (specific insulation 10
14Ω .cm) 40 weight %
Hydroxy 20 weight %
Silicone oil 5 weight %
Zinc oxide (1000 orders, purity 99%) 10 weight %
Alumina powder (1000 orders, purity 99%) 24 weight %
Methoxyl group triacetoxysilane 0.5 weight %
KH-550 (coupling agent) 0.5 weight %
The preparation method is stirring later stage adding methoxyl group triacetoxysilane as room temperature crosslinking agent with embodiment 3.Make silica gel, can directly be applied in machined surface, crosslinked voluntarily under the room temperature.
Claims (7)
1, a kind of thermally conductive silicon powder-base insulator contains silicone oil or silicon rubber, metal oxide, it is characterized in that: with silica flour as the insulation component, with respect to the total weight of thermally conductive silicon powder-base insulator:
Silica flour 40-45 weight %
Silicone oil 2-20 weight %
Silicon rubber 2-25 weight %
Zinc oxide 5-10 weight %
Alumina powder 20-28 weight %
Coupling agent 0.5-2 weight %
The specific insulation 10 of described silica flour
14Ω .cm, described silicon rubber is methyl vinyl silicone rubber, hydroxy or end acetoxyl group silicon rubber, its agent structure contains-the Si-O-Si-key, and described silicone oil is methyl or hydroxy silicon oil, and described coupling agent is silane coupler or titanate coupling agent.
2, thermal conductive insulator according to claim 1 is characterized in that: the purity of silica flour is more than 90%, and its consumption is according to the viscosity of material adjustment.
3, thermal conductive insulator according to claim 1 is characterized in that: zinc oxide, alumina powder are 1000 orders, purity 99%.
4, thermal conductive insulator according to claim 1 is characterized in that: described thermal conductive insulator is a silicone grease, and based on silicone oil, proportioning is:
Silica flour 40 weight %
Silicone oil 20 weight %
Terminal hydroxy group or end acetoxyl group silicon rubber 2 weight %
Zinc oxide 9 weight %
Alumina powder 28 weight %
Silane resin acceptor kh-550 1 weight %.
5, thermal conductive insulator according to claim 1 is characterized in that: described thermal conductive insulator is the silicon plate, and based on silicon rubber, proportioning is:
Silica flour 40 weight %
Methyl vinyl silicone rubber 25 weight %
Silicone oil 2 weight %
Zinc oxide 10 weight %
Alumina powder 21 weight %
Titanate coupling agent 1 weight %,
Also contain in addition:
Cumyl peroxide 1 weight %.
6, thermal conductive insulator according to claim 1 is characterized in that: described thermal conductive insulator is a silica cement, and based on silicon rubber, proportioning is:
Silica flour 45 weight %
Terminal hydroxy group or end acetoxyl group silicon rubber 20 weight %
Silicone oil 5 weight %
Zinc oxide 9 weight %
Alumina powder 20 weight %
Silane resin acceptor kh-550 1 weight %.
7, thermal conductive insulator according to claim 1 is characterized in that: described thermal conductive insulator is a silica gel, and based on silicon rubber, proportioning is:
Silica flour 40 weight %
Terminal hydroxy group or end acetoxyl group silicon rubber 20 weight %
Silicone oil 5 weight %
Zinc oxide 10 weight %
Alumina powder 24 weight %
Silane resin acceptor kh-550 0.5 weight %,
Also contain in addition:
Acetoxyl group class siloxanes or alkoxyl class siloxanes 0.5 weight %.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB001057499A CN1147878C (en) | 2000-04-10 | 2000-04-10 | Thermally conductive silicon powder-base insulator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB001057499A CN1147878C (en) | 2000-04-10 | 2000-04-10 | Thermally conductive silicon powder-base insulator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1317805A CN1317805A (en) | 2001-10-17 |
| CN1147878C true CN1147878C (en) | 2004-04-28 |
Family
ID=4577919
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB001057499A Expired - Fee Related CN1147878C (en) | 2000-04-10 | 2000-04-10 | Thermally conductive silicon powder-base insulator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1147878C (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102260484A (en) * | 2010-05-24 | 2011-11-30 | 薛洪春 | LED (light emitting diode) heat conduction filler |
| CN104449592A (en) * | 2014-12-08 | 2015-03-25 | 闫羽 | Heat conduction and electricity conduction silicone grease |
| CN106543738A (en) * | 2016-10-31 | 2017-03-29 | 安徽博泰氟材料科技有限公司 | A kind of electrical equipment is assembled with fluorine-containing insulation fat |
| CN109909494B (en) * | 2019-03-14 | 2021-05-04 | 昆山市中迪新材料技术有限公司 | High-thermal-conductivity powder and preparation method and application thereof |
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2000
- 2000-04-10 CN CNB001057499A patent/CN1147878C/en not_active Expired - Fee Related
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| Publication number | Publication date |
|---|---|
| CN1317805A (en) | 2001-10-17 |
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