CN114775007A - High-tin-content tin plate for electronic product and production method thereof - Google Patents
High-tin-content tin plate for electronic product and production method thereof Download PDFInfo
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- CN114775007A CN114775007A CN202210398099.XA CN202210398099A CN114775007A CN 114775007 A CN114775007 A CN 114775007A CN 202210398099 A CN202210398099 A CN 202210398099A CN 114775007 A CN114775007 A CN 114775007A
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- 239000005028 tinplate Substances 0.000 title claims abstract description 54
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 33
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 36
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 26
- 239000010959 steel Substances 0.000 claims abstract description 26
- 238000005406 washing Methods 0.000 claims abstract description 24
- 238000000034 method Methods 0.000 claims abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 20
- 239000000956 alloy Substances 0.000 claims abstract description 16
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 16
- 239000003513 alkali Substances 0.000 claims abstract description 15
- 238000001035 drying Methods 0.000 claims abstract description 15
- 230000003746 surface roughness Effects 0.000 claims abstract description 11
- 239000002253 acid Substances 0.000 claims abstract description 9
- 238000009713 electroplating Methods 0.000 claims abstract description 9
- 239000000126 substance Substances 0.000 claims abstract description 8
- 239000007921 spray Substances 0.000 claims abstract description 6
- 238000002161 passivation Methods 0.000 claims description 20
- 238000007747 plating Methods 0.000 claims description 13
- 238000005554 pickling Methods 0.000 claims 2
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims 1
- 238000004140 cleaning Methods 0.000 claims 1
- 230000006698 induction Effects 0.000 claims 1
- 239000010802 sludge Substances 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 241000565357 Fraxinus nigra Species 0.000 abstract description 9
- NNIPDXPTJYIMKW-UHFFFAOYSA-N iron tin Chemical compound [Fe].[Sn] NNIPDXPTJYIMKW-UHFFFAOYSA-N 0.000 abstract description 4
- 238000005299 abrasion Methods 0.000 abstract description 3
- 239000007769 metal material Substances 0.000 abstract description 2
- 239000000243 solution Substances 0.000 description 22
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000002349 favourable effect Effects 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 239000008237 rinsing water Substances 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 230000003749 cleanliness Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 235000013305 food Nutrition 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000005282 brightening Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 235000013372 meat Nutrition 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
- C25D5/36—Pretreatment of metallic surfaces to be electroplated of iron or steel
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
Abstract
The invention particularly relates to a high-tin-content tin plate for electronic products and a production method thereof, belonging to the technical field of metal material treatment, and the method comprises the following steps: carrying out alkali spray washing, electrolytic alkali washing, rinsing, drying, chemical acid washing, rinsing, pre-electroplating, rinsing, fluxing, drying, reflowing, squeezing, passivating, rinsing, drying and oiling on a steel substrate to obtain a high-tin-content tin plate; wherein the surface roughness Sa of the steel substrate is 0.6-0.85 μm, and the surface skewness Ssk of the steel substrate>0; the surface skewness Ssk of the tin plate surface is controlled by improving the surface roughness of the tin plate>0, the content of the tin plate alloy layer is more than or equal to 1.5g/m2The method improves the sharpness and hardness of the peak shape of the tin plate, further improves the self abrasion resistance of the high tin iron, and can effectively reduce the problem of friction black ash caused by the friction between the strip steel and the roller system in the production process of the high tin content tin plate.
Description
Technical Field
The invention belongs to the technical field of metal material treatment, and particularly relates to a high-tin-content tin plate for an electronic product and a production method thereof.
Background
The tin plate is a product with strong production technology, complex technology and high quality requirement, and is widely applied to non-food industries such as food packaging, pressure containers, electronic products, various containers and the like. High tin content tin plate (plating layer 8.4-15.1 g/m)2) Is a product with the highest production difficulty in tin-plated plates, and is usually used for brightening the surfaces of cans, luncheon meat, electronic connectors and the likeThe product has high requirements on corrosion resistance, and the high-tin iron has thicker surface tin layer thickness and poor wear resistance compared with a low-tin-content tin plate, so that the problem of friction black ash generated by friction between strip steel and a roller system is more easily caused in the production process, and the corrosion resistance and the aesthetic property of the surface of the high-tin iron are seriously influenced.
At present, the following methods are generally used for solving the black and gray defect on the surface of the tinned plate: firstly, the passivation current density is reduced, and the black ash generated in the passivation process is reduced, but the method can only solve the black ash problem of the passivation process and cannot solve the black ash problem generated by friction between the strip steel and the roller system; secondly, the cleanliness of the solution in the production line is improved, the rinsing water quantity is increased, and the problem of the cleanliness of the solution, which is only solved by the method, causes the defect of black ash; thirdly, the surface of the finished tinned plate is wiped by using a black and gray wiping device, so that the problem of friction black and gray caused by friction between the strip steel and a roller system can be effectively solved, but the problems that the surface of the strip steel is scratched and secondary quality of color difference is easily caused by the fact that the tin layer on the surface of the high tin iron is soft in production process are found.
Disclosure of Invention
The application aims to provide a high-tin-content tin plate for an electronic product and a production method thereof, and aims to solve the problem of friction black ash caused by friction between strip steel and a roller system in the production process of the high-tin-content tin plate at present.
The embodiment of the invention provides a production method of a high-tin-content tin plate for an electronic product, which comprises the following steps: carrying out alkali spray washing, electrolytic alkali washing, rinsing, drying, chemical acid washing, rinsing, pre-electroplating, rinsing, fluxing, drying, reflow, squeezing, passivating, rinsing, drying and oiling on a steel substrate to obtain a high-tin-content tinned plate;
wherein the surface roughness Sa of the steel substrate is 0.6-0.85 μm, and the surface skewness Ssk of the steel substrate is more than 0.
Optionally, the alkali washing solution for alkali spray washing comprises a KOH solution, the mass concentration of the KOH solution is 35g/L ± 5g/L, and the temperature of the KOH solution is 70-80 ℃; the current density of the electrolytic alkali washing is 20A/dm2-25A/dm2。
Optionally, an acid washing solution of the chemical acid washingLiquid adopts H2SO4Solution of the H2SO4The mass concentration of the solution is 45g/L +/-5 g/L, and the content of the H is2SO4The temperature of the solution was 45 ℃. + -. 5 ℃.
Optionally, the electroplating solution for electroplating adopts an MSA high-speed tin plating system, the sulfate radical concentration of the MSA high-speed tin plating system is 0.5g/L-5g/L, and the tin mud content of the MSA high-speed tin plating system is less than 1 g/L.
Optionally, the reflow is pure inductance reflow, the temperature of the reflow is more than or equal to 280 ℃, the time t1 of the reflow is more than or equal to 0.5s, and the idle time t2 of the steel substrate after the reflow is more than or equal to 1.5s is less than or equal to 3 s.
Optionally, the concentration of the passivation solution for passivation is 25g/L +/-3 g/L, the temperature for passivation is 42℃ +/-2 ℃, the pH value for passivation is 4.4 +/-0.2, and the current density for passivation is 0.4As/dm2-0.6As/dm2。
Optionally, the oil coating amount of the oil coating is 2mg/m2-10mg/m2。
Optionally, the rinsing is performed in a reverse manner, and the conductivity of the final rinsing water of the reverse rinsing is less than or equal to 1000 mus/cm.
Based on the same inventive concept, the embodiment of the invention also provides a tin plate with high tin content for electronic products, and the tin plate is prepared by the production method of the tin plate with high tin content for electronic products as claimed in claims 1 to 8.
Optionally, the tin layer weight of the tin plate is 8.4g/m2-11.2g/m2The alloy tin content of the tin-plated plate is 1.5g/m2-2.0g/m2。
One or more technical solutions in the embodiments of the present invention have at least the following technical effects or advantages:
the embodiment of the invention provides a method for producing a high-tin-content tin plate for an electronic product, which comprises the following steps: carrying out alkali spray washing, electrolytic alkali washing, rinsing, drying, chemical acid washing, rinsing, pre-electroplating, rinsing, fluxing, drying, reflow, squeezing, passivating, rinsing, drying and oiling on a steel substrate to obtain a high-tin-content tinned plate; wherein the surface roughness Sa of the steel substrate is 0.6 μm-0.85 μm, surface skewness Ssk of the steel substrate>0; by improving the surface roughness of the tin plate, the surface skewness Ssk of the tin plate is controlled>0, the content of the tin plate alloy layer is more than or equal to 1.5g/m2The hardness of the tip of the tin plate is improved, the self abrasion resistance of the high-tin iron is improved, and the problem of friction black dust generated by friction between the strip steel and the roller system in the production process of the high-tin plate can be effectively reduced.
The above description is only an overview of the technical solutions of the present invention, and the present invention can be implemented in accordance with the content of the description so as to make the technical means of the present invention more clearly understood, and the above and other objects, features, and advantages of the present invention will be more clearly understood.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on the drawings without creative efforts.
Fig. 1 is a flow chart of a method provided by an embodiment of the invention.
Detailed Description
The present invention will be specifically explained below in conjunction with specific embodiments and examples, and the advantages and various effects of the present invention will be more clearly presented thereby. It will be understood by those skilled in the art that these specific embodiments and examples are for the purpose of illustrating the invention and are not to be construed as limiting the invention.
Throughout the specification, unless otherwise specifically noted, terms used herein should be understood as having meanings as commonly used in the art. Accordingly, unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. If there is a conflict, the present specification will control.
Unless otherwise specifically stated, various raw materials, reagents, instruments, equipment and the like used in the present invention are commercially available or can be prepared by existing methods.
In order to solve the technical problems, the general idea of the embodiment of the application is as follows:
according to an exemplary embodiment of the invention, a method for producing a tin plate with high tin content for electronic products is provided, which relates to the following production process flows of a tin plating production line, namely alkali spray washing, electrolytic alkali washing, rinsing, drying, chemical acid washing, rinsing, pre-electroplating, rinsing, fluxing, drying, reflow, squeezing, passivation, rinsing, drying and oil coating. In order to solve the technical problem that the mutual friction between the high-tin-content tin plate and a roller system generates floating ash in the production process, the technical parameters of each step are as follows:
(1) the surface roughness Sa of the cold-rolled tin-electroplated steel plate substrate is between 0.6 and 0.85 mu m, and preferably the roughness of the substrate is controlled between 0.7 and 0.85 mu m; the surface skewness Ssk >0, preferably Ssk >0.3, of the cold-rolled tin-electroplated steel plate substrate;
controlling the surface roughness Sa of the substrate between 0.6-0.85 μm and the surface skewness Ssk>The reason for 0 is that the higher Sa is, the more favorable the improvement of the self friction resistance of the tin plate, the larger Ssk is, the sharper the peak shape of the substrate is, the more favorable the improvement of the friction resistance of the tin plate is, and the content of the alloy layer of the tin plate is controlled to be more than or equal to 1.5g/m2The hardness of the tip position of the tin plate can be improved, and the self wear resistance of the tin plate is further improved. When the surface roughness value is too large, the appearance and the welding performance of the tin plate are not favorable, and the roller efficiency is greatly reduced during rolling production.
(2) The alkaline washing solution is KOH solution with the concentration of 35 +/-5 g/L, the temperature of 70-80 ℃ and the electrolytic alkaline washing current density of 20-25A/dm2；
(3) The acid washing is chemical acid washing, and 45 +/-5 g/L sulfuric acid aqueous solution is adopted, and the temperature is 45 +/-5 ℃;
the electroplating solution adopts an MSA high-speed tin plating system, the sulfate radical concentration of the plating solution is controlled to be 0.5-5g/L, the tin mud content of the plating solution is less than 1g/L, the preferable sulfate radical concentration is controlled to be 1-3g/L, the tin mud content of the plating solution is controlled to be less than 0.5g/L, and the thickness of a tin layer on the surface of the high tin iron is 8.4-11.2g/m2；
(4) The reflow mode adopts pure inductance reflow, the reflow temperature is more than or equal to 280 ℃, the reflow time t1 is more than or equal to 0.5s, the dead time of the strip steel after reflow is less than or equal to 1.5s and less than or equal to t2 and less than or equal to 3s, and the content of alloy tin is more than or equal to 1.5g/m2Preferably the content of alloy tin is more than or equal to 1.6g/m2；
The reflow temperature is controlled to be more than or equal to 280 ℃, the reflow time t1 is controlled to be more than or equal to 0.5s, the alloy layer of the tin-plated plate is relatively compact in the range, and meanwhile, the alloy layer can be stably controlled to be more than or equal to 1.5g/m2Above, the compactness of the alloy layer on the surface of the tinning plate with the excessively small value is poor, and the thickness of the alloy layer cannot be stably controlled to be 1.5g/m2The above.
The residence time t2 is not less than 1.5s and not more than 3s of the strip steel after reflow is controlled, so that the stable growth of the alloy layer is facilitated, the oxidation degree of the surface of the tin plate is increased when the residence time is too large, and the stable implementation of the subsequent passivation process is not facilitated.
The thicker the alloy layer is, the better the wear resistance of the tin plate is, and the content of gold and tin is controlled to be more than or equal to 1.5g/m2The self friction resistance of the tin plate can be effectively improved.
(5) The tin plate passivation process is controlled according to the following conditions: the passivation concentration is controlled to be 25 +/-3 g/L, the passivation temperature is 42 +/-2 ℃, the passivation pH is 4.4 +/-0.2, and the passivation current density is 0.5As/dm2；
(6) Controlling the oil coating amount on the surface of the tinning plate to be 2-10mg/m2The preferred amount of oil coating is controlled to be 3-6mg/m2；
All rinsing in the production process is reverse rinsing, and the conductivity of the final stage of rinsing water is controlled below 1000 mus/cm.
The high tin content tin-plated sheet for electronic products and the production method thereof according to the present application will be described in detail below with reference to examples, comparative examples, and experimental data.
The surface floating ash of the tinned plate can not be tested by adopting a conventional black ash testing method, and the following rules are specially formulated for judging the surface floating ash:
o: after the white paper is wiped, no wiping trace exists under natural light.
X: after white paper is wiped, wiping traces can be clearly seen under natural light.
It should be noted that, in the following experiments, except for the different parameter selections in the table, the other parameters in the experiment process are the same parameters and satisfy the ranges provided by the embodiments of the present application.
The surface floating ash conditions corresponding to different surface morphologies:
it can be seen from the above table that the surface dust on the tin plate can be partially eliminated with the increase of the substrate roughness, and when the surface roughness Sa of the tin plate is controlled between 0.6-0.85 μm and the skewness Ssk >0, the surface dust on the tin plate can be completely eliminated.
Different alloy tin amount corresponds to floating ash condition
It can be seen from the above table that when the content of alloy tin is more than or equal to 1.5g/m2During the process, the floating ash on the surface of the tin plate is effectively controlled.
One or more technical solutions in the embodiments of the present invention at least have the following technical effects or advantages:
(1) the method of the embodiment of the invention controls the surface skewness Ssk of the tin plate by improving the surface roughness of the tin plate>0, the content of the tin plate alloy layer is more than or equal to 1.5g/m2The sharpness and hardness of the tin plate peak shape are improved, the self abrasion resistance of the high tin iron is improved, and 8.4g/m can be effectively reduced2-11.2g/m2The problem of friction black ash generated by friction between the strip steel and the roller system in the production process of the tin plate with high tin content;
(2) the method provided by the embodiment of the invention is suitable for products with strict requirements on the black and gray level of the surface of the tin plate, the black and gray level of the surface of the tin plate obtained by adopting the control technology of the black and gray level of the surface of the tin plate provided by the method can reach I-II level, and the surface has no floating gray defect, thereby meeting the requirements of customers on the corrosion resistance and the aesthetic property of the tin plate products.
Finally, it should also be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including the preferred embodiment and all changes and modifications that fall within the scope of the invention.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (10)
1. A method for producing a high tin content tin plate for electronic products, the method comprising: carrying out alkali spray washing, electrolytic alkali washing, rinsing, drying, chemical acid washing, rinsing, pre-electroplating, rinsing, fluxing, drying, reflow, squeezing, passivating, rinsing, drying and oiling on a steel substrate to obtain a high-tin-content tinned plate;
wherein the surface roughness Sa of the steel substrate is 0.6-0.85 μm, and the surface skewness Ssk of the steel substrate is more than 0.
2. The method for producing a high tin content tin plate for electronic products according to claim 1, wherein the alkali-sprayed alkali cleaning solution comprises a KOH solution, the KOH solution has a mass concentration of 35g/L ± 5g/L, and the KOH solution has a temperature of 70 ℃ to 80 ℃; the current density of the electrolytic alkali washing is 20A/dm2-25A/dm2。
3. The method for producing a high tin content tin-plated sheet for electronic products according to claim 1, wherein said pickling solution for chemical pickling is H2SO4Solution of the H2SO4The mass concentration of the solution is 45g/L +/-5 g/L, and the content of the H is2SO4The temperature of the solution was 45 ℃. + -. 5 ℃.
4. The method for producing a high-tin-content tin-plated plate for electronic products as claimed in claim 1, wherein the plating solution for electroplating employs an MSA high-speed tin-plating system, the MSA high-speed tin-plating system has a sulfate concentration of 0.5g/L to 5g/L, and the MSA high-speed tin-plating system has a tin sludge content of less than 1 g/L.
5. The method for producing a high-tin-content tin-plated plate for electronic products according to claim 1, wherein the reflow is pure induction reflow, the temperature of the reflow is more than or equal to 280 ℃, the time t1 of the reflow is more than or equal to 0.5s, and the idle time t2 of the steel substrate after the reflow is more than or equal to 1.5s is less than or equal to 3 s.
6. The method for producing a high tin content tin-plated sheet for electronic products according to claim 1, wherein the concentration of the passivation solution for passivation is 25g/L ± 3g/L, the temperature of the passivation is 42 ℃ ± 2 ℃, the pH of the passivation is 4.4 ± 0.2, and the current density of the passivation is 0.4As/dm2-0.6As/dm2。
7. The method for producing a high tin content tin plate for electronic products as claimed in claim 1, wherein the amount of oil applied is 2mg/m2-10mg/m2。
8. The method for producing a high-tin-content tin-plated sheet for electronic products according to claim 1, wherein the rinses are all reverse rinses, and the conductivity of the rinse water of the last stage of the reverse rinses is not more than 1000 μ s/cm.
9. A high tin content tin-plated sheet for electronic products, characterized in that the tin-plated sheet is produced by the production method of the high tin content tin-plated sheet for electronic products according to claims 1 to 8.
10. The high tin content tin-plated sheet for electronic products according to claim 9, wherein the tin-plated sheet has a tin layer weight of 8.4g/m2-11.2g/m2The alloy tin content of the tin-plated plate is 1.5g/m2-2.0g/m2。
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| 王熙禹;黎德育;李宁;王锐;: "软熔参数和基板对镀锡板锡铁合金层性能的影响", 电镀与涂饰, vol. 38, no. 24, pages 1349 - 1356 * |
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