CN114774027A - Hot melt adhesive for siphon plate and preparation method thereof - Google Patents
Hot melt adhesive for siphon plate and preparation method thereof Download PDFInfo
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- CN114774027A CN114774027A CN202111667027.2A CN202111667027A CN114774027A CN 114774027 A CN114774027 A CN 114774027A CN 202111667027 A CN202111667027 A CN 202111667027A CN 114774027 A CN114774027 A CN 114774027A
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- resin
- eva resin
- hot melt
- melt adhesive
- siphon
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- 239000004831 Hot glue Substances 0.000 title claims abstract description 53
- 238000002360 preparation method Methods 0.000 title abstract description 17
- 229920005989 resin Polymers 0.000 claims abstract description 175
- 239000011347 resin Substances 0.000 claims abstract description 175
- 238000003756 stirring Methods 0.000 claims abstract description 45
- 238000010438 heat treatment Methods 0.000 claims abstract description 39
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 25
- 230000003078 antioxidant effect Effects 0.000 claims abstract description 25
- 239000002994 raw material Substances 0.000 claims abstract description 25
- 238000001914 filtration Methods 0.000 claims abstract description 9
- 239000000203 mixture Substances 0.000 claims description 23
- 239000003208 petroleum Substances 0.000 claims description 20
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical group CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 claims description 7
- 239000000155 melt Substances 0.000 claims description 7
- 229920003315 Elvax® EVA Polymers 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 4
- JKIJEFPNVSHHEI-UHFFFAOYSA-N Phenol, 2,4-bis(1,1-dimethylethyl)-, phosphite (3:1) Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C JKIJEFPNVSHHEI-UHFFFAOYSA-N 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 abstract description 13
- 239000000853 adhesive Substances 0.000 abstract description 12
- 239000000126 substance Substances 0.000 abstract description 6
- 230000032683 aging Effects 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 231100000252 nontoxic Toxicity 0.000 abstract description 3
- 230000003000 nontoxic effect Effects 0.000 abstract description 3
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 abstract description 2
- 238000002156 mixing Methods 0.000 abstract description 2
- 239000007800 oxidant agent Substances 0.000 abstract description 2
- 230000001590 oxidative effect Effects 0.000 abstract description 2
- 230000000052 comparative effect Effects 0.000 description 20
- 239000000463 material Substances 0.000 description 14
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 8
- 229920001903 high density polyethylene Polymers 0.000 description 7
- 239000004700 high-density polyethylene Substances 0.000 description 7
- 229920001684 low density polyethylene Polymers 0.000 description 7
- 239000004702 low-density polyethylene Substances 0.000 description 7
- 238000004383 yellowing Methods 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 238000005469 granulation Methods 0.000 description 5
- 230000003179 granulation Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000003292 glue Substances 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000000084 colloidal system Substances 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 239000004746 geotextile Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 1
- 208000005374 Poisoning Diseases 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- HQCVEGNPQFRFPC-UHFFFAOYSA-N carboxy acetate Chemical compound CC(=O)OC(O)=O HQCVEGNPQFRFPC-UHFFFAOYSA-N 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000010411 cooking Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000009459 flexible packaging Methods 0.000 description 1
- 239000003574 free electron Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 231100000956 nontoxicity Toxicity 0.000 description 1
- 230000009965 odorless effect Effects 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000012785 packaging film Substances 0.000 description 1
- 229920006280 packaging film Polymers 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 231100000572 poisoning Toxicity 0.000 description 1
- 230000000607 poisoning effect Effects 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000009967 tasteless effect Effects 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/04—Homopolymers or copolymers of ethene
- C09J123/08—Copolymers of ethene
- C09J123/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
- C09J123/0853—Vinylacetate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
Abstract
The invention discloses a hot melt adhesive for siphon plates and a preparation method thereof, wherein the hot melt adhesive comprises the following raw materials: the adhesive comprises a first EVA resin, a second EVA resin, a tackifying resin, Fischer-Tropsch wax and an antioxidant; wherein the VA content in the first EVA resin is 25-30 wt%, and the VA content in the second EVA resin is 15-20 wt%; the tackifying resin comprises a first tackifying resin with a softening point of 98-110 ℃ and a second tackifying resin with a softening point of 130-150 ℃. The hot melt adhesive can improve the adhesion of the siphon plate, and has good chemical stability, aging resistance and ozone resistance. The preparation method of the hot melt adhesive comprises the steps of mixing Fischer-Tropsch wax and an oxidant, adding the second tackifying resin and the first EVA resin, adding the first tackifying resin and the second EVA resin, heating and stirring to completely melt the raw materials, filtering, and granulating to obtain the hot melt adhesive for the siphon plate, so that the production is environment-friendly, nontoxic, safe and efficient.
Description
Technical Field
The invention relates to the technical field of hot melt adhesives, and particularly relates to a hot melt adhesive for a siphon plate and a preparation method thereof.
Background
The siphon drainage plate is an important product of a rainwater collection system (siphon drainage system) in sponge city construction in recent years. The siphon drainage plate consists of a high-molecular HDPE/LDPE concave-convex plastic drainage plate and self-adhesive geotextile. Regarding HDPE/LDPE materials: HDPE is a highly crystalline, non-polar thermoplastic resin produced by the copolymerization of ethylene. LDPE, also called high-pressure polyethylene, is the lightest variety of polyethylene resins and is in the form of milky, tasteless, odorless, nontoxic and matte wax-like particles.
The HDPE/LDPE contains low surface energy and nonpolar polyethylene components, so that the siphon drainage plate is difficult to glue. At present, a plurality of different nonpolar films are compounded together by using a common adhesive, so that a high-performance composite flexible packaging film meeting specific packaging requirements is obtained. At present, most of adhesives of non-polar materials are aqueous polyurethane (WPU) adhesives, but the adhesives have large surface tension, poor wettability to the non-polar materials, poor water resistance and heat resistance and the like, are easy to hydrolyze under high-temperature cooking conditions, cause the reduction of bonding performance, and are difficult to meet the composite assembly requirements of the siphon plate.
Disclosure of Invention
In order to overcome the defects of the prior art, one of the purposes of the invention is to provide the hot melt adhesive for the siphon plate, wherein two EVA resins with different VA contents are adopted and then two tackifying resins with different softening points are adopted, so that the adhesive force on the surface of the siphon plate is improved, and the hot melt adhesive has chemical stability, aging resistance and water resistance; the second purpose of the invention is to provide a preparation method of the hot melt adhesive for the siphon plate, which controls the feeding sequence of raw materials according to the softening point and the VA content, and ensures that the hot melt adhesive is completely melted by controlling the temperature, the stirring speed and the vacuum degree, thereby improving the uniformity of the hot melt adhesive.
One of the purposes of the invention is realized by adopting the following technical scheme:
a hot melt adhesive for siphon plates comprises the following raw materials in parts by weight: 25-35 parts of first EVA resin, preferably 30 parts of second EVA resin, 15-25 parts of second EVA resin, preferably 20 parts of tackifying resin, preferably 45 parts of Fischer-Tropsch wax, 5-10 parts of Fischer-Tropsch wax, preferably 5 parts of antioxidant, and 0.1-1 part of antioxidant, preferably 0.3 part of tackifying resin; wherein the VA content in the raw materials used by the first EVA resin is 25-30 wt%, preferably 28 wt%, and the VA content in the raw materials used by the second EVA resin is 15-20 wt%, preferably 18 wt%; the tackifying resin comprises a first tackifying resin with a softening point of 98-110 ℃ and a second tackifying resin with a softening point of 130-150 ℃.
Further, the first EVA resin is an EVA resin with a Melt Index (MI) of 145-155 g/10min and/or 395-405 g/10 min; the second EVA resin is an EVA resin with a melt index of 145-155 g/10min and/or 395-405 g/10 min. The larger the MI, the better the fluidity of the glue, and the easier it is to coat.
Still further, the first EVA resin and the second EVA resin are one or a mixture of more than two of LG Chem18150, LG Chem28400, DuPont Elvax-EVA resin-410 and DuPont Elvax-EVA resin-420.
Further, the tackifying resin comprises 10-20 parts of first hydrogenated petroleum resin with a softening point of 98-110 ℃ and 20-30 parts of second hydrogenated petroleum resin with a softening point of 130-150 ℃.
Further, the tackifying resin is a mixture of more than two of Shandong Rayssen 5100S, Ningbo Jinhai JH6100, Ningbo Jinhai JH-6130, Nanyang 5130, Isemann 5400 and Hanhua KH-100S.
The Fischer-Tropsch wax is one or a mixture of more than two of the Fischer-Tropsch wax H1, the Fischer-Tropsch wax C80 and the Fischer-Tropsch wax SX-105.
Still further, the Fischer-Tropsch wax is one or a mixture of more than two of the Fischer-Tropsch wax H1, the Fischer-Tropsch wax C80 and the Fischer-Tropsch wax SX-105.
Further, the antioxidant is antioxidant 1010 and/or antioxidant 168.
The second purpose of the invention is realized by adopting the following technical scheme:
the preparation method of the hot melt adhesive for the siphon board comprises the following steps:
1) adding Fischer-Tropsch wax and an antioxidant into a heating and stirring device, and heating until the Fischer-Tropsch wax is completely melted;
2) continuously adding the second tackifying resin and the first EVA resin into the heating and stirring device, stirring to completely melt the second tackifying resin and the first EVA resin, and vacuumizing;
3) continuously adding the first tackifying resin and the second EVA resin into the heating and stirring device, stirring to completely melt the EVA resin, and vacuumizing to obtain a mixture solution;
4) and filtering the mixture solution, and granulating to obtain the hot melt adhesive for the siphon board.
Further, the temperature of the heating and stirring device is set to be 160-170 ℃; in the step 2) and the step 3), the vacuum degree is-0.1 to-0.01 MPa.
Compared with the prior art, the invention has the beneficial effects that:
(1) the hot melt adhesive provided by the invention adopts two EVA resins with different VA contents as one of raw materials, wherein the EVA resin contains carboxyl acetate, and the C ═ O double bond contains free electrons of active waves, so that a common electron pair is easily formed with olefin double bonds in a PE material, and chemical bonds are formed between the materials, so that the hot melt adhesive has certain adhesive force, so that the polar high polymer material EVA resin has a better adhesive effect on the two nonpolar materials, and the adhesive resin with two different softening points, Fischer-Tropsch wax and an antioxidant are used as auxiliary materials, so that the adhesive property of the iris absorption plate HDPE/LDPE can be improved, and the hot melt adhesive has good chemical stability, ageing resistance and ozone resistance. But also has no toxicity and harm, good water resistance, moisture resistance and no water absorption, and is suitable for bonding the siphon plate.
The first EVA resin can improve the adhesive force to the HDPE/LDPE sheet material, strengthen the flexibility test of products in winter, and avoid brittle fracture and peeling phenomena at low temperature; the second EVA resin can improve the cohesive strength of the colloid under the high-temperature condition and the adhesive force to the base material under the high temperature condition in summer; when the right-angle vertical surface appears, the separation of the product siphon board and the geotextile can be effectively avoided. Tackifying resins with different softening points are selected, the first tackifying resin with a low softening point (98-110 ℃) is used for improving the hot adhesiveness of the material, and if the using amount is too large, the whole colloid is hardened, and even peeling can occur; the second tackifying resin with a high softening point (130-150 ℃) can improve the thermal adhesiveness to the material, increase the tensile strength at high temperature and increase the stability of the product. If the amount is too large, the whole colloid becomes hard and even peeling occurs. The Fischer-Tropsch wax can improve the composite speed of online production, and simultaneously reduce the reverse seepage of the glue solution of the geotextile, thereby influencing the rolling. The antioxidant can delay or inhibit the polymer oxidation process, thereby preventing the polymer from aging and prolonging the service life of the polymer; because of its high price, excessive use of the catalyst results in increased cost.
(2) The preparation method of the hot melt adhesive comprises the steps of mixing the Fischer-Tropsch wax and the oxidant, adding the second tackifying resin with a high softening point and the first EVA resin with a high VA content, and adding the first tackifying resin with a low softening point and the second EVA resin with a low VA content. Heating and stirring to completely melt the raw materials, filtering, and granulating to obtain the hot melt adhesive for the siphon board. No solvent and toxic and harmful substances are added in the process of preparing the hot melt adhesive, the finally produced hot melt adhesive belongs to an environment-friendly and nontoxic adhesive, the risk of poisoning of the toluene organic solvent is more efficiently reduced, the troubles of solvent volatilization and recovery are thoroughly solved, no solvent residue occurs, and the potential safety hazard of the storage and use links of organic chemicals is more importantly eliminated; thoroughly achieves the production of environmental protection, innocuity, safety and high efficiency.
Detailed Description
The present invention is further described below with reference to specific embodiments, and it should be noted that, without conflict, any combination between the embodiments or technical features described below may form a new embodiment.
Example 1
A hot melt adhesive for siphon plates comprises the following raw materials in parts by weight: 30 parts of first EVA resin, 20 parts of second EVA resin, 45 parts of tackifying resin, 5 parts of Fischer-Tropsch wax and 0.3 part of antioxidant;
wherein the VA content in the raw materials used by the first EVA resin is 28 wt%, and the first EVA resin is the EVA resin with the melt index of 145g/10 min; the content of VA in the raw materials used by the second EVA resin is 18 wt%, and the second EVA resin is 395 melt index EVA resin; the tackifying resin is 15 parts of first hydrogenated petroleum resin with a softening point of 100 ℃ and 20 parts of second hydrogenated petroleum resin with a softening point of 150 ℃.
In particular, the fischer-tropsch wax is saso fischer-tropsch wax H1. The antioxidant is antioxidant 1010.
The preparation method of the hot melt adhesive for the siphon plate comprises the following steps:
1) adding Fischer-Tropsch wax and an antioxidant into a heating and stirring device, and heating until the Fischer-Tropsch wax is completely melted; wherein the temperature of the heating and stirring device is set to be 160 ℃;
2) continuously adding the second tackifying resin and the first EVA resin into the heating and stirring device, stirring at constant temperature to completely melt the second tackifying resin and the first EVA resin, and vacuumizing until the vacuum degree is-0.08 MPa;
3) continuously adding the first tackifying resin and the second EVA resin into a heating and stirring device, stirring at constant temperature to completely melt the EVA resin, and vacuumizing until the vacuum degree is-0.08 MPa to obtain a mixture solution;
4) and filtering the mixture solution, and carrying out underwater granulation by an extruder to obtain the hot melt adhesive for the siphon board.
Example 2
A hot melt adhesive for siphon plates comprises the following raw materials in parts by weight: 25 parts of first EVA resin, 15 parts of second EVA resin, 30 parts of tackifying resin, 6 parts of Fischer-Tropsch wax and 0.1 part of antioxidant;
the EVA resin is prepared from the following raw materials in parts by weight, wherein the VA content in the raw materials used by the first EVA resin is 25 wt%, and the mass ratio of the first EVA resin is 1: 1, 155g/10min and 395g/10min of melt index; the content of VA in the raw materials used by the second EVA resin is 15 wt%, and the second EVA resin is prepared from the following raw materials in a mass ratio of 1: 1, 155g/10min and 405g/10min of melt index; the tackifying resin is 10 parts of a first hydrogenated petroleum resin with a softening point of 98 ℃ and 20 parts of a second hydrogenated petroleum resin with a softening point of 130 ℃.
Specifically, the Fischer-Tropsch wax is one or a mixture of more than two of the components of the Fischer-Tropsch wax H1, the Fischer-Tropsch wax C80 and the Fischer-Tropsch wax SX-105. The antioxidant is antioxidant 1010 and/or antioxidant 168.
The preparation method of the hot melt adhesive for the siphon plate comprises the following steps:
1) adding Fischer-Tropsch wax and an antioxidant into a heating and stirring device, and heating until the Fischer-Tropsch wax is completely melted; wherein the temperature of the heating and stirring device is set to be 160-170 ℃;
2) continuously adding the second tackifying resin and the first EVA resin into the heating and stirring device, stirring at constant temperature to completely melt the second tackifying resin and the first EVA resin, and vacuumizing until the vacuum degree is-0.1 to-0.01 MPa;
3) continuously adding the first tackifying resin and the second EVA resin into a heating and stirring device, stirring at constant temperature to completely melt the EVA resin, and vacuumizing until the vacuum degree is-0.1 to-0.01 MPa to obtain a mixture solution;
4) and filtering the mixture solution, and carrying out underwater granulation through an extruder to obtain the hot melt adhesive for the siphon board.
Example 3
A hot melt adhesive for siphon plates comprises the following raw materials in parts by weight: 35 parts of first EVA resin, 25 parts of second EVA resin, 50 parts of tackifying resin, 10 parts of Fischer-Tropsch wax and 1 part of antioxidant;
the EVA resin is prepared from raw materials, wherein the VA content in the raw materials used by the first EVA resin is 30 wt%, and the first EVA resin is an EVA resin with a melt index of 405g/10 min; the content of VA in the raw materials used by the second EVA resin is 20 wt%, and the second EVA resin is EVA resin with the melt index of 155g/10 min; the tackifying resin is 20 parts of a first hydrogenated petroleum resin with a softening point of 110 ℃ and 30 parts of a second hydrogenated petroleum resin with a softening point of 150 ℃.
Specifically, the Fischer-Tropsch wax is a SaxoFischer-Tropsch wax SX-105. The antioxidant is antioxidant 1010.
The preparation method of the hot melt adhesive for the siphon board comprises the following steps:
1) adding Fischer-Tropsch wax and an antioxidant into a heating and stirring device, and heating until the Fischer-Tropsch wax is completely melted; wherein the temperature of the heating and stirring device is set to be 170 ℃;
2) continuously adding the second tackifying resin and the first EVA resin into the heating and stirring device, stirring at constant temperature to completely melt the second tackifying resin and the first EVA resin, and vacuumizing until the vacuum degree is-0.01 MPa;
3) continuously adding the first tackifying resin and the second EVA resin into a heating and stirring device, stirring at constant temperature to completely melt the EVA resin, and vacuumizing until the vacuum degree is-0.01 MPa to obtain a mixture solution;
4) and filtering the mixture solution, and carrying out underwater granulation by an extruder to obtain the hot melt adhesive for the siphon board.
Example 4
A hot melt adhesive for siphon plates comprises the following raw materials in parts by weight: 30 parts of first EVA resin, 20 parts of second EVA resin, 40 parts of tackifying resin, 8 parts of Fischer-Tropsch wax and 0.5 part of antioxidant;
the first EVA resin is U.S. DuPont Elvax-EVA resin-410, and the second EVA resin is U.S. DuPont Elvax-EVA resin-420. The first hydrogenated petroleum resin is Ningbo Jinhai JH6100, and the second hydrogenated petroleum resin is Ningbo Jinhai JH-6130. The Fischer-Tropsch wax is a Saxol Fischer-Tropsch wax SX-105. The antioxidant is antioxidant 1010.
The preparation method of the hot melt adhesive for the siphon board comprises the following steps:
1) adding Fischer-Tropsch wax and an antioxidant into a heating and stirring device, and heating until the Fischer-Tropsch wax is completely melted; wherein the temperature of the heating and stirring device is set to be 165 ℃;
2) continuously adding the second tackifying resin and the first EVA resin into the heating and stirring device, stirring at constant temperature to completely melt the second tackifying resin and the first EVA resin, and vacuumizing until the vacuum degree is-0.1 MPa;
3) continuously adding the first tackifying resin and the second EVA resin into a heating and stirring device, stirring at constant temperature to completely melt the EVA resin, and vacuumizing until the vacuum degree is-0.1 MPa to obtain a mixture solution;
4) and filtering the mixture solution, and carrying out underwater granulation through an extruder to obtain the hot melt adhesive for the siphon board.
Example 5
A hot melt adhesive for siphon plates comprises the following raw materials in parts by weight: 25 parts of first EVA resin, 15 parts of second EVA resin, 35 parts of tackifying resin, 5 parts of Fischer-Tropsch wax and 0.8 part of antioxidant;
wherein the first EVA resin and the second EVA resin are LG Chem18150 and LG Chem28400, respectively. The first hydrogenated petroleum resin and the second hydrogenated petroleum resin are Ningbo Jinhai JH6100 and Ningbo Jinhai JH-6130 respectively. The Fischer-Tropsch wax is a SaxoFischer-Tropsch wax C80. The antioxidant is an antioxidant 1010.
The preparation method of the hot melt adhesive for the siphon plate comprises the following steps:
1) adding Fischer-Tropsch wax and an antioxidant into a heating and stirring device, and heating until the Fischer-Tropsch wax is completely melted; wherein the temperature of the heating and stirring device is set to be 160 ℃;
2) continuously adding the second tackifying resin and the first EVA resin into the heating and stirring device, stirring at constant temperature to completely melt the second tackifying resin and the first EVA resin, and vacuumizing until the vacuum degree is-0.05 MPa;
3) continuously adding the first tackifying resin and the second EVA resin into a heating and stirring device, stirring at constant temperature to completely melt the EVA resin, and vacuumizing until the vacuum degree is-0.05 MPa to obtain a mixture solution;
4) and filtering the mixture solution, and carrying out underwater granulation by an extruder to obtain the hot melt adhesive for the siphon board.
Comparative example 1
Comparative example 1 is a hot melt adhesive available from the traded adhesive limited of Dongguan.
Comparative example 2
Comparative example 2 differs from example 1 in that: comparative example 2 no first EVA resin was added. The remaining components and preparation were the same as in example 1.
Comparative example 3
Comparative example 3 differs from example 1 in that: comparative example 3 no second EVA resin was added. The remaining components and preparation were the same as in example 1.
Comparative example 4
Comparative example 4 differs from example 1 in that: comparative example 4 no first hydrogenated petroleum resin was added. The remaining components and preparation were the same as in example 1.
Comparative example 5
Comparative example 5 differs from example 1 in that: comparative example 5 no second hydrogenated petroleum resin was added. The remaining components and preparation were the same as in example 1.
Effect test and evaluation
The hot melt adhesives of the embodiment 1 and the comparative examples 1-5 are pressed on HDPE/LDPE siphon boards, and the coating glue amount is 60g/m2The areas of the groups of siphon plates are the same. And respectively carrying out a bonding test and a heating yellowing test on the siphon plates after the groups of siphon plates are bonded. The conditions of the adhesion test were: performing broken material stretching at 25 ℃, 0 ℃, minus 20 ℃ and 40 ℃, and recording the single-point tension value; and (4) soaking in water at 25 ℃ for 24 hours, taking out the glass, and recording the single-point tension value. Test conditions of heating yellowing: and (5) standing at 50 ℃ for 24 hours, and observing whether the yellowing phenomenon exists or not. Specific data are shown in table 1.
Table 1 results of viscosity test and thermal yellowing test for each group
As can be seen from table 1, the hot melt adhesive of example 1 has high temperature resistance, water resistance and thermal stability, is suitable for adhesion between siphon plates, and has more excellent effects than the commercial comparative example 1. Comparative example 2 without addition of the first EVA resin, the single-point tensile values at 0 ℃ and-20 ℃ were significantly lower than those of example 1, and a yellowing effect occurred after being left at high temperature for 24 hours, indicating that the first EVA resin had low temperature resistance and thermal stability. Comparative example 3 no second EVA resin was added, the single point tensile values at 25 ℃ and 40 ℃ were significantly lower than example 1, and also yellowing effect occurred after 24h of high temperature storage, indicating that the second EVA resin had high temperature resistance and thermal stability. Comparative example 4 without the addition of the first hydrogenated petroleum resin, the single-point tensile values at 25 ℃ and 40 ℃ were significantly lower than those of example 1, indicating that the first hydrogenated petroleum resin could improve the hot tack to the material. Comparative example 4, in which the second hydrogenated petroleum resin was not added, also had a significantly lower single-point tensile value at 25 ℃ and 40 ℃ than in example 1, and yellowing occurred after 24 hours of high-temperature standing, indicating that the second hydrogenated petroleum resin could improve hot-tack properties to the material, increase tensile strength at high temperature, and increase thermal stability of the product.
The above embodiments are only preferred embodiments of the present invention, and the protection scope of the present invention is not limited thereby, and any insubstantial changes and substitutions made by those skilled in the art based on the present invention are within the protection scope of the present invention.
Claims (10)
1. The hot melt adhesive for the siphon plate is characterized by comprising the following raw materials in parts by weight: 25-35 parts of first EVA resin, 15-25 parts of second EVA resin, 30-50 parts of tackifying resin, 5-10 parts of Fischer-Tropsch wax and 0.1-1 part of antioxidant; wherein the VA content in the raw materials used by the first EVA resin is 25-30 wt%, and the VA content in the raw materials used by the second EVA resin is 15-20 wt%; the tackifying resin comprises a first tackifying resin with a softening point of 98-110 ℃ and a second tackifying resin with a softening point of 130-150 ℃.
2. A hot melt adhesive for siphon plates according to claim 1, wherein the first EVA resin is an EVA resin having a melt index of 145-155 g/10min and/or 395-405 g/10 min; the second EVA resin is an EVA resin with a melt index of 145-155 g/10min and/or 395-405 g/10 min.
3. A hot melt adhesive for siphon plates according to claim 1, wherein the first EVA resin and the second EVA resin are one or a mixture of two or more of LG Chem18150, LG Chem28400, DuPont Elvax-EVA resin-410, and DuPont Elvax-EVA resin-420.
4. A hot melt adhesive for siphon plates according to claim 1, wherein the tackifying resin comprises 10 to 20 parts of a first hydrogenated petroleum resin having a softening point of 98 to 110 ℃ and 20 to 30 parts of a second hydrogenated petroleum resin having a softening point of 130 to 150 ℃.
5. A hot melt adhesive for siphon plate according to claim 4, wherein said tackifier resin is a mixture of two or more of Shandong Richard 5100S, Ningbo Kinghai JH6100, Ningbo Kinghai JH-6130, Richard 5130, Exxon 5400, and Shandong Kari KH-100S.
6. A hot melt adhesive for siphon plates according to claim 1, wherein the Fischer-Tropsch wax is one or a mixture of two or more of the following Fischer-Tropsch wax H1, Fischer-Tropsch wax C80 and Fischer-Tropsch wax SX-105.
7. A hot melt adhesive for siphon board according to claim 1, wherein the Fischer-Tropsch wax is one or a mixture of more than two of the group consisting of Fisher-Tropsch wax H1, Fisher-Tropsch wax C80 and Fisher-Tropsch wax SX-105.
8. A hot melt adhesive for siphon plates, according to claim 1, wherein the antioxidant is antioxidant 1010 and/or antioxidant 168.
9. The method for preparing the hot melt adhesive for the siphon plate according to any one of claims 1 to 8, characterized by comprising the following steps:
1) adding Fischer-Tropsch wax and an antioxidant into a heating and stirring device, and heating until the Fischer-Tropsch wax is completely melted;
2) continuously adding the second tackifying resin and the first EVA resin into the heating and stirring device, stirring to completely melt the second tackifying resin and the first EVA resin, and vacuumizing;
3) continuously adding the first tackifying resin and the second EVA resin into the heating and stirring device, stirring to completely melt the EVA resin, and vacuumizing to obtain a mixture solution;
4) and filtering the mixture solution, and granulating to obtain the hot melt adhesive for the siphon board.
10. The method for preparing a hot melt adhesive for a siphon plate according to claim 9, wherein the temperature of the heating and stirring device is set to 160-170 ℃; in the step 2) and the step 3), the vacuum degree is-0.1 to-0.01 MPa.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115648765A (en) * | 2022-10-26 | 2023-01-31 | 江苏利特尔绿色包装股份有限公司 | High-barrier heavy-packaging one-way breathable bag and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115648765A (en) * | 2022-10-26 | 2023-01-31 | 江苏利特尔绿色包装股份有限公司 | High-barrier heavy-packaging one-way breathable bag and preparation method thereof |
| CN115648765B (en) * | 2022-10-26 | 2023-09-26 | 江苏利特尔绿色包装股份有限公司 | High-barrier heavy-packaging unidirectional air-permeable bag and preparation method thereof |
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