CN114769941A - Water-soluble aluminum-silicon soldering paste and preparation method thereof - Google Patents
Water-soluble aluminum-silicon soldering paste and preparation method thereof Download PDFInfo
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- CN114769941A CN114769941A CN202210448366.XA CN202210448366A CN114769941A CN 114769941 A CN114769941 A CN 114769941A CN 202210448366 A CN202210448366 A CN 202210448366A CN 114769941 A CN114769941 A CN 114769941A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
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- Nonmetallic Welding Materials (AREA)
Abstract
The invention discloses a water-soluble aluminum-silicon soldering paste and a preparation method thereof, wherein the water-soluble aluminum-silicon soldering paste comprises the following components: 45-65 wt% of aluminum-silicon alloy brazing powder, 5-35 wt% of fluoride brazing flux and 10-45 wt% of aqueous paste forming body; wherein the aqueous paste-forming body comprises: 5-30 wt% of water-based acrylate polymer and 70-95 wt% of water-based solvent; the water-based acrylate polymer is obtained by copolymerization reaction of an acrylate monomer, a hydroxyl-containing acrylate hydrophilic monomer and a styrene hydrophobic monomer. The water-soluble aluminum-silicon soldering paste and the preparation method thereof provided by the invention have the advantages that the water-soluble aluminum-silicon soldering paste has environmental protection and storage stability, and meanwhile, the solderability of the soldering paste can be effectively improved.
Description
Technical Field
The invention belongs to the technical field of welding materials, and particularly relates to a water-soluble aluminum-silicon soldering paste and a preparation method thereof.
Background
Aluminum and aluminum alloys are widely applied to industries in various fields such as artificial satellites, rockets, missiles, airplanes, automobile water tanks, air-conditioning radiators and the like due to small density, high thermal conductivity and high electrical conductivity, and accordingly welding among aluminum, aluminum alloys and stainless steel is more and more involved. The traditional aluminum welding material is matched with powdered brazing flux and powdered, filamentous, foil-shaped and sheet-shaped brazing filler metals for use. However, with the development of the times and the progress of science and technology, the types of products to be welded are increasing, and the miniaturization of welding workpieces, the irregularity and diversification of joint forms, the automation of welding processes and the like become popular and trends gradually. The traditional welding material can not meet the requirements of modern welding, and on the basis of the traditional welding material, the aluminum soldering paste integrates aluminum soldering flux, aluminum brazing filler metal and paste forming body, has the characteristics of convenience, flexibility and high efficiency, and is produced at the right moment.
The aluminum brazing flux is mainly used for removing chemical auxiliary effect of oxide skin on the surfaces of the base metal and the aluminum brazing filler metal; the aluminum brazing filler metal is mainly used for realizing the main body welding effect of firm metallurgical connection of two base metals. The two are matched for use, but one is not necessary, the aluminum brazing flux acts in the front, and the aluminum brazing filler metal acts in the back. The paste body is a bridge and a link which are connected with aluminum brazing filler metal and aluminum soldering flux. The finished paste body should meet the following conditions: the paste can well combine the aluminum soldering flux and the aluminum solder together, stably coexist with the aluminum soldering flux and the solder, and do not generate chemical reaction; the ointment has no pungent smell and is suitable for factory operation; the paste is easy to volatilize before the aluminum soldering flux and the brazing filler metal are melted; the paste is not deposited with carbon and has no residue after volatilization or firing.
The traditional oily or solvent-based paste forming body takes oily organic matters as a carrier, and the oily or solvent-based paste forming body is oily and can cause environmental sanitation and difficult cleaning; smoke is generated during heating and welding, so that the environment is not protected; the cracking is difficult to be complete, and carbon deposition can be remained after welding. Although the aqueous paste-forming body can avoid using organic matters and is very environment-friendly, the aqueous paste-forming body has two defects: water cannot effectively bond the aluminum brazing flux solder together due to low viscosity; if water is used as a carrier, the powdered aluminum solder can react with water chemically due to the chemical activity of the powdered aluminum solder, so that the oxide skin of the aluminum solder is thickened, and the welding quality is affected.
Disclosure of Invention
Based on the technical problems, the invention provides the water-soluble aluminum-silicon soldering paste and the preparation method thereof, and the water-soluble aluminum-silicon soldering paste has environmental protection property and storage stability and can effectively improve the solderability of the soldering paste.
The invention provides a water-soluble aluminum-silicon soldering paste, which comprises the following components: 45-65 wt% of aluminum-silicon alloy brazing powder, 5-35 wt% of fluoride brazing flux and 10-45 wt% of aqueous paste;
wherein the aqueous paste-forming body comprises: 5-30 wt% of water-based acrylate polymer and 70-95 wt% of water-based solvent;
the water-based acrylate polymer is obtained by copolymerization reaction of an acrylate monomer, a hydroxyl-containing acrylate hydrophilic monomer and a styrene hydrophobic monomer.
In the soldering paste, the water-based paste forming body consists of the water-based acrylate polymer and the water-based solvent, and the water-based acrylate polymer comprises the hydroxyl-containing acrylate hydrophilic monomer and the styrene hydrophobic monomer, so that the water-based acrylate polymer has the amphiphilic characteristics of hydrophilicity and lipophilicity, and on one hand, the polar hydrophilic hydroxyl group and the aluminum-silicon alloy powder form effective affinity, so that the aluminum-silicon alloy brazing powder can be coated, the aluminum-silicon alloy brazing powder is favorably dispersed in the water-based solvent, and the contact between the aluminum-silicon alloy brazing powder and the water-based solvent or water can be prevented, so that the aluminum-silicon alloy brazing powder is prevented from reacting with the water, and higher storage stability is obtained; on the other hand, the water-based acrylate polymer with the amphiphilic characteristics of hydrophilicity and lipophilicity can be used for preparing the soldering paste with proper viscosity and rheological property in water, so that the aluminum-silicon alloy brazing powder and the fluoride brazing flux are prevented from layering, higher sedimentation resistance is obtained, and the stable welding quality is ensured.
Preferably, the mass ratio of the acrylate monomer, the hydroxyl-containing acrylate hydrophilic monomer and the styrene hydrophobic monomer is 3-6:1-2: 1-4.
According to the invention, the viscosity of the paste body can be better ensured by the water-based acrylic polymer in the content proportion, and the welding performance of the aluminum-silicon soldering paste prepared from the paste body can be effectively improved.
Preferably, the acrylate monomer is at least one of methyl acrylate, ethyl acrylate, n-butyl acrylate, isobutyl acrylate, methyl methacrylate, ethyl methacrylate, n-butyl methacrylate or glycidyl methacrylate; the hydroxyl-containing acrylate hydrophilic monomer is at least one of hydroxyethyl acrylate, hydroxyethyl methacrylate, hydroxypropyl acrylate, hydroxypropyl methacrylate or polyethylene glycol methacrylate; the styrene hydrophobic monomer is at least one of styrene, p-methylstyrene, m-methylstyrene or p-chlorostyrene.
Preferably, the aqueous solvent is at least one of water, ethanol, propanol, isopropanol, ethylene glycol, propylene glycol, glycerol, ethylene glycol methyl ether or ethylene glycol butyl ether.
Preferably, the aluminum-silicon alloy brazing powder is at least one of an aluminum-silicon alloy, an aluminum-silicon-zinc alloy, an aluminum-silicon-magnesium alloy or an aluminum-silicon-copper alloy;
preferably, the aluminum-silicon alloy brazing powder is at least one of aluminum-12 silicon alloy, aluminum-10 silicon alloy or aluminum-10 silicon-1 zinc alloy.
Preferably, the fluoride based flux is at least one of potassium fluoroaluminate, potassium fluoride, aluminum fluoride, lithium fluoride, sodium fluoride, cesium fluoride, potassium fluoroaluminate-cesium complex, cesium fluoroaluminate, potassium fluorozincate, or cesium fluorozincate.
Preferably, the fluoride based flux comprises: 25-40 wt% of aluminum fluoride, 25-30 wt% of potassium fluoride, 5-10 wt% of lithium fluoride, 10-25 wt% of potassium fluoroaluminate and 10-20 wt% of cesium fluoride.
In the invention, the aluminum-silicon alloy brazing powder and the fluoride brazing flux with specific proportion and content are controlled, so that the effects of the brazing powder and the brazing flux are better exerted, and the quality of a welded product is greatly improved.
The invention provides a preparation method of water-soluble aluminum-silicon soldering paste, which comprises the following steps: and uniformly mixing the aluminum-silicon alloy brazing powder, fluoride brazing flux and aqueous paste according to a designed proportion to obtain the water-soluble aluminum-silicon soldering paste.
The invention also provides an application of the water-soluble aluminum-silicon soldering paste in the brazing of aluminum products.
Preferably, the application comprises: and coating the soldering paste on the aluminum product, and heating after assembly.
Compared with the prior art, the invention has the following beneficial effects:
(1) in the invention, the paste forming body contains the water-based acrylate polymer, so that the contact between the aluminum-silicon alloy brazing powder and water can be prevented, the storage stability of the soldering paste can be ensured, the viscosity of the soldering paste system can be improved, and the anti-settling property can be greatly improved.
(2) In the invention, the aluminum-silicon soldering paste has proper viscosity and rheological property, and is easy to coat on the parts needing to be connected; the paste is stable, sedimentation and delamination are not easy to occur in the storage process, and the corrosion resistance of a soldered joint is strong; the welding method has the advantages of good welding characteristics, compact welding seam interface after welding, good air tightness, good tensile strength and low residues after welding.
Drawings
Fig. 1 is a diagram of an aluminum silicon solder paste according to embodiment 1 of the present invention.
Detailed Description
The present invention will be described in detail below with reference to specific examples, but these examples should be specifically mentioned for illustration, but should not be construed as limiting the scope of the present invention.
Example 1
This example proposes a water-soluble aluminum silicon solder paste, which is prepared by the following method:
preparing aluminum-silicon alloy brazing powder: smelting Al-12Si alloy in a medium-frequency induction furnace, and preparing powder in an ultrasonic centrifugal atomization mode to obtain spherical aluminum-silicon alloy brazing powder with the average particle size of 30 microns;
preparation of fluoride type brazing flux: mixing 35 wt% of aluminum fluoride, 28 wt% of potassium fluoride, 7 wt% of lithium fluoride, 16 wt% of potassium fluoroaluminate and 14 wt% of cesium fluoride according to weight percentage, carrying out ball milling, and uniformly ball milling to obtain a powdery fluoride brazing flux;
preparing aqueous paste: dissolving 0.5 part of initiator azobisisobutyronitrile in 50 parts of acetone according to the parts by weight, adding 15 parts of methyl methacrylate, 5 parts of butyl acrylate, 7 parts of hydroxyethyl methacrylate, 11 parts of styrene and 2 parts of acrylic acid, heating in a water bath, stirring for reaction, keeping the temperature at 70 ℃, condensing and refluxing, finishing the reaction after 6 hours, stirring for hydration, distilling to remove the acetone solvent, adding a pH regulator, and adjusting to be neutral to obtain the water-based acrylate polymer; uniformly stirring the water-based acrylate polymer and water to obtain a water-based paste-forming body with the water-based acrylate polymer content of 20 wt%;
preparing water-soluble aluminum-silicon soldering paste: mixing 56 wt% of aluminum-silicon alloy brazing powder, 25 wt% of fluoride brazing flux and 19 wt% of aqueous paste forming body according to the weight percentage, stirring and uniformly mixing under the condition that the stirring speed is 30r/min, sealing and standing for 24 hours to obtain the water-soluble aluminum-silicon soldering paste.
Referring to fig. 1, it is seen from fig. 1 that the water-soluble aluminum-silicon solder paste obtained in this example has a moderate paste viscosity and good fluidity, does not settle or delaminate within 1 month, and does not generate bubbles.
Example 2
This example proposes a water-soluble aluminum silicon solder paste, which is prepared by the following method:
preparing aluminum-silicon alloy brazing powder: smelting Al-12Si alloy by using a medium-frequency induction furnace, and preparing powder by using an ultrasonic centrifugal atomization mode to obtain spherical aluminum-silicon alloy brazing powder with the average particle size of 30 mu m;
preparation of fluoride type brazing flux: mixing 30 wt% of aluminum fluoride, 30 wt% of potassium fluoride, 5 wt% of lithium fluoride, 25 wt% of potassium fluoroaluminate and 10 wt% of cesium fluoride according to the weight percentage, carrying out ball milling, and uniformly ball milling to obtain a powdery fluoride brazing flux;
preparing an aqueous paste forming body: dissolving 0.5 part of initiator azobisisobutyronitrile in 50 parts of acetone according to the parts by weight, adding 10 parts of methyl methacrylate, 5 parts of n-butyl methacrylate, 5 parts of butyl acrylate, 7 parts of hydroxyethyl methacrylate, 11 parts of styrene and 2 parts of acrylic acid, heating in a water bath, stirring for reaction, keeping the temperature at 70 ℃ for condensation reflux, finishing the reaction after 6 hours, stirring for hydration, distilling to remove the acetone solvent, adding a pH regulator, and adjusting to be neutral to obtain the water-based acrylate polymer; uniformly stirring the water-based acrylate polymer and water to obtain a water-based paste-forming body with the water-based acrylate polymer content of 20 wt%;
preparing water-soluble aluminum-silicon soldering paste: mixing 65 wt% of aluminum-silicon alloy brazing powder, 25 wt% of fluoride brazing flux and 10 wt% of aqueous paste forming agent according to the weight percentage, stirring and uniformly mixing under the condition that the stirring speed is 30r/min, sealing and standing for 24 hours to obtain the water-soluble aluminum-silicon soldering paste.
The water-soluble aluminum-silicon soldering paste obtained in the embodiment has moderate paste viscosity and good fluidity, does not settle or delaminate within 1 month, and does not generate bubbles.
Example 3
This example proposes a water-soluble aluminum silicon solder paste, which is prepared by the following method:
preparing aluminum-silicon alloy brazing powder: smelting Al-12Si alloy by using a medium-frequency induction furnace, and preparing powder by using an ultrasonic centrifugal atomization mode to obtain spherical aluminum-silicon alloy brazing powder with the average particle size of 30 mu m;
preparation of fluoride brazing flux: mixing 35 wt% of aluminum fluoride, 25 wt% of potassium fluoride, 10 wt% of lithium fluoride, 10 wt% of potassium fluoroaluminate and 20 wt% of cesium fluoride according to the weight percentage, carrying out ball milling, and uniformly ball milling to obtain a powdery fluoride brazing flux;
preparing aqueous paste: dissolving 0.5 part of initiator azobisisobutyronitrile in 50 parts of acetone according to the parts by weight, adding 15 parts of methyl methacrylate, 5 parts of butyl acrylate, 8 parts of hydroxypropyl methacrylate, 10 parts of styrene and 2 parts of acrylic acid, heating in a water bath, stirring for reaction, keeping the temperature at 70 ℃, condensing and refluxing, finishing the reaction after 6 hours, stirring for hydration, distilling to remove the acetone solvent, adding a pH regulator, and adjusting to be neutral to obtain the water-based acrylate polymer; uniformly stirring the water-based acrylate polymer and water to obtain a water-based paste-forming body with the water-based acrylate polymer content of 20 wt%;
preparing water-soluble aluminum-silicon soldering paste: mixing 45 wt% of aluminum-silicon alloy brazing powder, 20 wt% of fluoride brazing flux and 35 wt% of water-based paste-forming body according to weight percentage, stirring and uniformly mixing under the condition that the stirring speed is 30r/min, and sealing and standing for 24 hours to obtain the water-soluble aluminum-silicon soldering paste.
The water-soluble aluminum-silicon soldering paste obtained in the embodiment has moderate paste viscosity and good fluidity, does not settle or delaminate within 1 month, and does not generate bubbles.
Example 4
This example proposes a water-soluble aluminum silicon solder paste, which is prepared by the following method:
preparing aluminum-silicon alloy brazing powder: smelting Al-10Si alloy by using a medium-frequency induction furnace, and preparing powder by using an ultrasonic centrifugal atomization mode to obtain spherical aluminum-silicon alloy brazing powder with the average particle size of 30 mu m;
preparation of fluoride brazing flux: mixing 35 wt% of aluminum fluoride, 28 wt% of potassium fluoride, 7 wt% of lithium fluoride, 16 wt% of potassium fluoroaluminate and 14 wt% of cesium fluoride according to the weight percentage, carrying out ball milling, and uniformly ball milling to obtain a powdery fluoride brazing flux;
preparing an aqueous paste forming body: dissolving 0.5 part of initiator azobisisobutyronitrile in 60 parts of acetone according to the parts by weight, adding 10 parts of methyl methacrylate, 5 parts of butyl acrylate, 10 parts of hydroxyethyl methacrylate, 20 parts of styrene and 2 parts of acrylic acid, heating in a water bath, stirring for reaction, keeping the temperature at 70 ℃, condensing and refluxing, finishing the reaction after 6 hours, stirring for hydration, distilling to remove the acetone solvent, adding a pH regulator, and adjusting to be neutral to obtain the water-based acrylate polymer; uniformly stirring the water-based acrylate polymer and water to obtain a water-based paste-forming body with the water-based acrylate polymer content of 20 wt%;
preparing water-soluble aluminum-silicon soldering paste: mixing 56 wt% of aluminum-silicon alloy brazing powder, 25 wt% of fluoride brazing flux and 19 wt% of water-based paste-forming agent according to weight percentage, stirring and uniformly mixing under the condition that the stirring speed is 30r/min, and sealing and standing for 24 hours to obtain the water-soluble aluminum-silicon soldering paste.
The water-soluble aluminum-silicon soldering paste obtained in the embodiment has moderate paste viscosity and good fluidity, does not generate sedimentation and delamination within 1 month, and does not generate bubbles.
Comparative example 1
The comparative example proposes a water-soluble aluminum-silicon solder paste, which is prepared by the following method:
preparing aluminum-silicon alloy brazing powder: smelting Al-12Si alloy in a medium-frequency induction furnace, and preparing powder in an ultrasonic centrifugal atomization mode to obtain spherical aluminum-silicon alloy brazing powder with the average particle size of 30 microns;
preparation of fluoride brazing flux: mixing 35 wt% of aluminum fluoride, 28 wt% of potassium fluoride, 7 wt% of lithium fluoride, 16 wt% of potassium fluoroaluminate and 14 wt% of cesium fluoride according to the weight percentage, carrying out ball milling, and uniformly ball milling to obtain a powdery fluoride brazing flux;
preparing water-soluble aluminum-silicon soldering paste: mixing 56 wt% of aluminum-silicon alloy brazing powder, 25 wt% of fluoride brazing flux and 19 wt% of water according to weight percentage, stirring and uniformly mixing under the condition that the stirring speed is 30r/min, and sealing and standing for 24 hours to obtain the water-soluble aluminum-silicon soldering paste.
The water-soluble aluminum-silicon soldering paste obtained by the comparative example has low paste viscosity and low consistency, fluoride brazing flux and aluminum-silicon alloy brazing powder are separated and float on the aluminum-silicon alloy brazing powder, bubbles begin to generate within 20min, and delamination begins within 2 h.
Comparative example 2
The comparative example proposes a water-soluble aluminum-silicon solder paste, which is prepared by the following method:
preparing aluminum-silicon alloy brazing powder: smelting Al-12Si alloy by using a medium-frequency induction furnace, and preparing powder by using an ultrasonic centrifugal atomization mode to obtain spherical aluminum-silicon alloy brazing powder with the average particle size of 30 mu m;
preparation of fluoride type brazing flux: mixing 35 wt% of aluminum fluoride, 28 wt% of potassium fluoride, 7 wt% of lithium fluoride, 16 wt% of potassium fluoroaluminate and 14 wt% of cesium fluoride according to weight percentage, carrying out ball milling, and uniformly ball milling to obtain a powdery fluoride brazing flux;
preparing an ointment body: dissolving 0.5 part of initiator azobisisobutyronitrile into 50 parts of acetone according to the parts by weight, adding 28 parts of methyl methacrylate, 10 parts of butyl acrylate and 2 parts of acrylic acid, heating in a water bath, stirring for reaction, keeping the temperature at 70 ℃, condensing and refluxing, finishing the reaction after 6 hours, stirring for hydration, distilling to remove the acetone solvent, adding a pH regulator, and adjusting to be neutral to obtain the acrylate polymer; uniformly stirring the acrylic ester polymer and water to obtain a paste-forming body with the content of the water-based acrylic ester polymer being 20 wt%;
preparing water-soluble aluminum-silicon soldering paste: mixing 56 wt% of aluminum-silicon alloy brazing powder, 25 wt% of fluoride brazing flux and 19 wt% of water-based paste-forming agent according to the weight percentage, stirring and uniformly mixing under the condition that the stirring speed is 30r/min, and sealing and standing for 24 hours to obtain the water-soluble aluminum-silicon soldering paste.
The water-soluble aluminum-silicon soldering paste obtained by the comparative example has high paste viscosity, is slightly layered after 48 hours, and begins to generate bubbles.
The water-soluble aluminum-silicon soldering pastes obtained in the examples and the comparative examples are printed on a 3A21 aluminum plate, heated for 60s in a furnace at the temperature of (590 +/-5) DEG C, and the expansion rate and the residual rate after soldering are tested, and the shear strength of each soldered joint is tested to measure the quality of the mechanical property of each soldered joint according to GB 11363-.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered as the technical solutions and the inventive concepts of the present invention within the technical scope of the present invention.
Claims (10)
1. A water-soluble aluminum silicon solder paste, characterized by comprising: 45-65 wt% of aluminum-silicon alloy brazing powder, 5-35 wt% of fluoride brazing flux and 10-45 wt% of aqueous paste forming body;
wherein the aqueous paste-forming body comprises: 5-30 wt% of water-based acrylate polymer and 70-95 wt% of water-based solvent;
the water-based acrylate polymer is obtained by copolymerization reaction of an acrylate monomer, a hydroxyl-containing acrylate hydrophilic monomer and a styrene hydrophobic monomer.
2. The water-soluble aluminum silicon solder paste as claimed in claim 1, wherein the mass ratio of the acrylate monomer, the hydroxyl-containing acrylate hydrophilic monomer and the styrene hydrophobic monomer is 3-6:1-2: 1-4.
3. The water-soluble aluminum silicon solder paste according to claim 2, wherein the acrylate monomer is at least one of methyl acrylate, ethyl acrylate, n-butyl acrylate, isobutyl acrylate, methyl methacrylate, ethyl methacrylate, n-butyl methacrylate or glycidyl methacrylate; the hydroxyl-containing acrylate hydrophilic monomer is at least one of hydroxyethyl acrylate, hydroxyethyl methacrylate, hydroxypropyl acrylate, hydroxypropyl methacrylate or polyethylene glycol methacrylate; the styrene hydrophobic monomer is at least one of styrene, p-methylstyrene, m-methylstyrene or p-chlorostyrene.
4. The water-soluble aluminum silicon solder paste according to any one of claims 1 to 3, wherein the aqueous solvent is at least one of water, ethanol, propanol, isopropanol, ethylene glycol, propylene glycol, glycerol, ethylene glycol methyl ether, and ethylene glycol butyl ether.
5. The water soluble aluminum silicon solder paste according to any one of claims 1 to 4, wherein the aluminum silicon alloy brazing powder is at least one of an aluminum-silicon alloy, an aluminum-silicon-zinc alloy, an aluminum-silicon-magnesium alloy, or an aluminum-silicon-copper alloy;
preferably, the aluminum-silicon alloy brazing powder is at least one of aluminum-12 silicon alloy, aluminum-10 silicon alloy or aluminum-10 silicon-1 zinc alloy.
6. The water-soluble aluminum silicon solder paste according to any one of claims 1 to 5, wherein the fluoride-based flux is at least one of potassium fluoroaluminate, potassium fluoride, aluminum fluoride, lithium fluoride, sodium fluoride, cesium fluoride, a potassium fluoroaluminate-cesium complex, cesium fluoroaluminate, potassium fluorozincate, or cesium fluorozincate.
7. The water-soluble aluminum silicon solder paste according to claim 6, wherein the fluoride based flux comprises: 25-40 wt% of aluminum fluoride, 25-30 wt% of potassium fluoride, 5-10 wt% of lithium fluoride, 10-25 wt% of potassium fluoroaluminate and 10-20 wt% of cesium fluoride.
8. A method for preparing a water soluble aluminum silicon solder paste according to any one of claims 1 to 7, comprising: and uniformly mixing the aluminum-silicon alloy brazing powder, fluoride brazing flux and aqueous paste according to a designed proportion to obtain the water-soluble aluminum-silicon soldering paste.
9. Use of a water-soluble aluminium silicon solder paste according to any one of claims 1 to 7 for soldering aluminium articles.
10. Use according to claim 9, characterized in that it comprises: and coating the soldering paste on the aluminum product, and heating after assembly.
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| WO1980002524A1 (en) * | 1979-05-18 | 1980-11-27 | Ohara Metal Ind Co Ltd | Water-soluble soft-brazing aid |
| JP2000079496A (en) * | 1998-09-03 | 2000-03-21 | Furukawa Electric Co Ltd:The | Binder resin used in paste for brazing aluminum material, paste for brazing aluminum material and aluminum material |
| CN1263485A (en) * | 1997-07-15 | 2000-08-16 | 清美化学股份有限公司 | Composition for preventing creeping of flux for soldering |
| US20080274454A1 (en) * | 2004-04-07 | 2008-11-06 | Mirkin Chad A | Reversible and Chemically Programmable Micelle Assembly With Dna Block-Copolymer Amphiphiles |
| CN101462208A (en) * | 2007-12-21 | 2009-06-24 | 播磨化成株式会社 | Paste composition for aluminum brazing |
| US20090169721A1 (en) * | 2007-12-27 | 2009-07-02 | Shekhawat Linda A | Amphiphilic block copolymers for improved flux application |
| JP2014097514A (en) * | 2012-11-13 | 2014-05-29 | Harima Chemicals Inc | PASTE FOR Al-Cu BRAZING AND Al-Cu BRAZING METHOD |
| CN107755921A (en) * | 2017-09-18 | 2018-03-06 | 广东省焊接技术研究所（广东省中乌研究院） | A kind of water-based organic aluminium soldering paste into lotion and its comprising this into lotion |
-
2022
- 2022-04-27 CN CN202210448366.XA patent/CN114769941A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1980002524A1 (en) * | 1979-05-18 | 1980-11-27 | Ohara Metal Ind Co Ltd | Water-soluble soft-brazing aid |
| CN1263485A (en) * | 1997-07-15 | 2000-08-16 | 清美化学股份有限公司 | Composition for preventing creeping of flux for soldering |
| JP2000079496A (en) * | 1998-09-03 | 2000-03-21 | Furukawa Electric Co Ltd:The | Binder resin used in paste for brazing aluminum material, paste for brazing aluminum material and aluminum material |
| US20080274454A1 (en) * | 2004-04-07 | 2008-11-06 | Mirkin Chad A | Reversible and Chemically Programmable Micelle Assembly With Dna Block-Copolymer Amphiphiles |
| CN101462208A (en) * | 2007-12-21 | 2009-06-24 | 播磨化成株式会社 | Paste composition for aluminum brazing |
| US20090169721A1 (en) * | 2007-12-27 | 2009-07-02 | Shekhawat Linda A | Amphiphilic block copolymers for improved flux application |
| JP2014097514A (en) * | 2012-11-13 | 2014-05-29 | Harima Chemicals Inc | PASTE FOR Al-Cu BRAZING AND Al-Cu BRAZING METHOD |
| CN107755921A (en) * | 2017-09-18 | 2018-03-06 | 广东省焊接技术研究所（广东省中乌研究院） | A kind of water-based organic aluminium soldering paste into lotion and its comprising this into lotion |
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