CN114763984A - Device and method for measuring thickness of dielectric layer in circuit board - Google Patents
Device and method for measuring thickness of dielectric layer in circuit board Download PDFInfo
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- CN114763984A CN114763984A CN202110047101.4A CN202110047101A CN114763984A CN 114763984 A CN114763984 A CN 114763984A CN 202110047101 A CN202110047101 A CN 202110047101A CN 114763984 A CN114763984 A CN 114763984A
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- 238000000034 method Methods 0.000 title claims abstract description 21
- 239000004020 conductor Substances 0.000 claims abstract description 96
- 238000012360 testing method Methods 0.000 claims abstract description 30
- 230000001939 inductive effect Effects 0.000 claims description 6
- 238000005259 measurement Methods 0.000 claims description 4
- 239000000523 sample Substances 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 15
- 230000003287 optical effect Effects 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
- G01B7/06—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
- G01B7/06—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness
- G01B7/08—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness using capacitive means
Abstract
The method for measuring the thickness of the dielectric layer in the circuit board of the present invention comprises the following steps: firstly, a circuit board is provided, the circuit board comprises at least one dielectric layer and at least two circuit layers, the dielectric layer is arranged between the circuit layers, the circuit board also comprises a test area, a test pattern and a through hole are arranged on the test area, and the test pattern comprises at least one first conductor part and at least two second conductor parts. The distance between the side edge of the through hole and the second conductor part is smaller than the distance between the side edge of the through hole and the first conductor part. And finally, providing a measuring device, wherein the measuring device comprises a conductive pin and a sensing assembly. And then, electrifying the conductive pin and electrically connecting one end of the conductive pin with the second conductor part. Then, the sensing component goes deep into the through hole and moves along the through hole to measure a sensing curve, and the thickness of the dielectric layer is obtained by the change of the sensing curve. The invention has the advantages that the thickness of the dielectric layer of the circuit board can be measured quickly and conveniently without damaging the circuit board.
Description
Technical Field
The present invention relates to a device and a method for measuring the thickness of a dielectric layer in a circuit board, and more particularly, to a device and a method for measuring the thickness of a dielectric layer in a circuit board by using a sensor.
Background
At present, the dielectric layer thickness of the circuit board is mainly measured by destructive methods, such as: a part of the area of the circuit board to be tested is cut off and then is sliced into measurement slices, and then an Optical Microscope (Optical Microscope) or a Scanning Electron Microscope (Scanning Electron Microscope) is used to measure the thickness of the dielectric layer of the circuit board. However, this measurement method is time and labor consuming and can also damage the circuit board by damaging it over a large area.
Therefore, it is worth the thinking of those skilled in the art to measure the thickness of the dielectric layer of the circuit board quickly and conveniently.
Disclosure of Invention
The present invention provides a method for measuring the thickness of a dielectric layer in a circuit board, which can measure the thickness of the dielectric layer of the circuit board quickly and conveniently without damaging the circuit board.
The method for measuring the thickness of the dielectric layer in the circuit board of the present invention comprises the following steps:
firstly, a circuit board is provided, the circuit board comprises at least one dielectric layer and at least two circuit layers, the dielectric layer is arranged between the circuit layers, the circuit board also comprises a test area, a test pattern and a through hole are arranged on the test area, the test pattern comprises at least one first conductor part and at least two second conductor parts, the first conductor part is connected between the two second conductor parts, the second conductor parts belong to one part of the circuit layers, and the first conductor part penetrates through the dielectric layer. The distance between the side edge of the through hole and the second conductor part is smaller than the distance between the side edge of the through hole and the first conductor part. And then, providing a measuring device, wherein the measuring device comprises a conductive pin and a sensing assembly, and the sensing assembly comprises a sensing end, a connecting part and an insulating part. Wherein, the connecting part is connected with the sensing end, and the insulating part is coated on the periphery of the connecting part. And then, electrifying the conductive pin and electrically connecting one end of the conductive pin with the second conductor part. Then, the sensing component is penetrated into the through hole and moved along the through hole to measure a sensing curve, and the thickness of the dielectric layer is obtained according to the change of the sensing curve.
In the method for measuring the thickness of the dielectric layer in the circuit board, the sensing element moves along the through hole in a constant speed manner.
In the method for measuring the thickness of the dielectric layer in the circuit board, the length of the sensing terminal is smaller than the thickness of the second conductor portion.
In the method for measuring the thickness of the dielectric layer in the circuit board, the sensing element is a capacitive sensing element or an inductive sensing element.
Another object of the present invention is to provide a measuring device, which can measure the thickness of the dielectric layer of the circuit board quickly and conveniently without damaging the circuit board.
The invention relates to a measuring device which is applied to measuring the thickness of a dielectric layer of a circuit board, the circuit board comprises at least one dielectric layer and at least two circuit layers, the dielectric layer is arranged between the circuit layers, the circuit board also comprises a test area, a test pattern and a through hole are arranged on the test area, the test pattern comprises at least one first conductor part and at least two second conductor parts, the first conductor part is connected between the two second conductor parts, the second conductor parts belong to one part of the circuit layers, and the first conductor part penetrates through the dielectric layer. The distance between the side edge of the through hole and the second conductor part is smaller than the distance between the side edge of the through hole and the first conductor part. In addition, the measuring device comprises a sensing component and a conductive pin. The sensing assembly comprises a sensing end, a connecting portion and an insulating portion. In addition, the connecting part is connected with the sensing end, and the insulating part is coated on the periphery of the connecting part.
One end of the conductive pin is electrically connected with the second conductor part. When the thickness of the dielectric layer is measured, the sensing element penetrates into the through hole and moves along the through hole to measure a sensing curve.
In the above-mentioned measuring apparatus, the sensing element is a capacitive probe or an inductive probe.
In the above-mentioned measuring apparatus, the number of the dielectric layers is plural.
The invention has the following advantages: the induction component can extend into the through hole to measure the thickness of the dielectric layer of each layer of the circuit board only by forming the through hole on the preset test area, the required area is small, the operation is quick and convenient, and the circuit board does not need to be damaged.
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. It is noted that the components in the drawings are merely schematic and are not necessarily to scale.
Drawings
FIG. 1 is a schematic diagram illustrating a method for measuring a thickness of a dielectric layer in a circuit board according to the present invention.
Fig. 2A is a schematic diagram of the circuit board 10.
Fig. 2B is a schematic diagram of the measuring apparatus 8.
Fig. 2C is a schematic diagram illustrating the conductive pin 81 connected to the second conductor portion 1022.
Fig. 3A is a schematic diagram illustrating the sensing element 80 penetrating into the through hole 10H.
Fig. 3B is a schematic diagram illustrating the sensing terminal 801 moving to a position below the through hole 10H.
FIG. 3C is a schematic diagram of a sensing curve 80C measured by the sensing element 80 of FIG. 3B.
Fig. 4 is a schematic diagram of a sensing curve 80H.
Fig. 5 is a partial cross-sectional view of the circuit board 20.
Detailed Description
Referring to fig. 1, fig. 1 is a schematic diagram illustrating a method for measuring a thickness of a dielectric layer in a circuit board according to the present invention. The method for measuring the thickness of the dielectric layer in the circuit board comprises the following steps:
first, referring to step S1 and fig. 2A, fig. 2A is a partial cross-sectional view of a circuit board 10, providing a circuit board 10, wherein the circuit board 10 includes three dielectric layers 12 and four circuit layers 13, but it should be understood by those skilled in the art that the circuit board 10 may include more dielectric layers 12 and circuit layers 13 in practice, or the circuit board 10 may include only one dielectric layer 12 and two circuit layers 13. The dielectric layer 12 is interposed between the two circuit layers 13. In addition, the circuit board 10 further includes a testing region 10T, a testing pattern 102 and a through hole 10H are disposed on the testing region 10T, the testing pattern 102 includes at least one first conductor portion 1021 and at least two second conductor portions 1022, the first conductor portion 1021 penetrates through the dielectric layer 12, and the first conductor portion 1021 is connected between the two second conductor portions 1022.
In addition, the second conductor part 1022 belongs to a part of the circuit layer 13. In detail, in the manufacturing process of the circuit board, the second conductor portion 1022 and the circuit layer 13 are formed simultaneously, and the first conductor portion 1021 is formed by, for example, punching a hole in the dielectric layer 12 and depositing a metal. Therefore, the number of the second conductor portions 1022 in this embodiment is four as in the wiring layer 13, and the number of the first conductor portions 1021 is the same as that of the dielectric layer 12 (three in this embodiment). In this embodiment, the lateral dimension of the second conductor part 1022 is greater than the lateral dimension of the first conductor part 1021, that is, the distance between the side of the through hole 10H and the second conductor part 1022 is smaller than the distance between the side of the through hole 10H and the first conductor part 1021. Moreover, the dielectric layer 12 and the second conductor portion 1022 are exposed at the side surface of the through hole 10H.
Referring to step S2 and fig. 2B, fig. 2B is a schematic diagram of the measuring apparatus 8 according to the present invention, in which the measuring apparatus 8 includes a conductive pin 81 and a sensing element 80, and the sensing element 80 is, for example, a capacitive sensing element. The sensing element 80 includes a sensing end 801, a connecting portion 802 and an insulating portion 803, wherein the connecting portion 802 is connected to the sensing end 801, and the insulating portion 803 covers the periphery of the connecting portion 802. In one embodiment, the length of the sensing terminal 801 is less than the thickness of the second conductor part 1022. Therefore, the sensing terminal 801 can sense the change of the capacitance value more accurately. In the present embodiment, the conductive pin 81 and the sensing end 801 of the sensing element 80 are in the same electronic circuit. In the present embodiment, the conductive pin 81 is connected to the positive pole of the measuring device 8, and the sensing element 80 is connected to the negative pole of the measuring device 8.
Thereafter, referring to step S3 and fig. 2C, fig. 2C is a schematic diagram illustrating the conductive pin 81 being connected to the second conductor portion 1022, and the conductive pin 81 is powered on and one end of the conductive pin 81 is electrically connected to the uppermost second conductor portion 1022 (of course, one end of the conductive pin 81 may also be electrically connected to the lowermost second conductor portion 1022). Since the first conductor portion 1021 is electrically connected to the second conductor portion 1022, the first conductor portion 1021 and the second conductor portion 1022 have the same electrical property (e.g., positive electrical property) as the conductive pin 81, and the electrical property of the sensing element 80 is opposite (e.g., negative electrical property). Therefore, the capacitance between the sensing element 80 and the first conductor portion 1021 and the second conductor portion 1022 is formed.
Then, in step S4, the sensing element 80 is inserted into the through hole 10H and moved along the through hole 10H to obtain a sensing curve 80C, and the thickness of the dielectric layer 12 is obtained according to the variation of the sensing curve 80C. The detailed description is as follows:
referring to fig. 3A, 3B and 3C, fig. 3A is a schematic diagram illustrating the sensing element 80 penetrating into the through hole 10H, fig. 3B is a schematic diagram illustrating the sensing end 801 moving to a position below the through hole 10H, and fig. 3C is a schematic diagram illustrating a sensing curve 80C measured by the sensing element 80 of fig. 3B. In fig. 3A, the sensing element 80 is moved downward at a constant speed into the through hole 10H. In fig. 3B, the sensing terminal 801 has moved to a position below the through hole 10H, and the capacitance of the first conductor portion 1021 and the capacitance of the second conductor portion 1022 in each layer are measured during the movement of the sensing element 80. In addition, during the measurement process, since the second conductive portion 1022 is closer to the sensing terminal 801 than the first conductive portion 1021, the capacitance of the second conductive portion 1022 is greater than that of the first conductive portion 1021.
For example, the capacitance value of the uppermost second conductor portion 1022 corresponds to the peak curve C1 of fig. 3C, the capacitance value of the second conductor portion 1022 of the second layer corresponds to the peak curve C2 of fig. 3C, the capacitance value of the second conductor portion 1022 of the third layer corresponds to the peak curve C3 of fig. 3C, and the capacitance value of the second conductor portion 1022 of the fourth layer corresponds to the peak curve C4 of fig. 3C. A curve valley D1 is located between the curve peak C1 and the curve peak C2, and the ordinate of the curve valley D1 is the capacitance corresponding to the uppermost first conductor 1021. Similarly, a valley D2 is provided between the peak C2 and the peak C3, the valley D2 corresponds to the capacitance of the first conductor portion 1021 in the second layer, and a valley D3 is provided between the peak C3 and the peak C4, and the valley D3 corresponds to the capacitance of the first conductor portion 1021 in the lowest layer.
In the present embodiment, the widths of each of the peak curves C1-C4 and each of the valleys D1-D3 represent the time (t) required for the sensing terminal 801 to pass through the second conductor part 1022 and the first conductor part 1021, respectively. The thickness (d, d) of each dielectric layer 12 can be calculated by measuring the width of the bottom of the curve (i.e., the required time (t)) and considering the moving speed (v) of the sensing element 80. Similarly, the thickness of each circuit layer 13 can be estimated by measuring the widths of the peaks C1-C4 of the curves and considering the moving speed (v) of the sensor element 80. In one embodiment, the sensing element 80 moves along the through hole 10H in a constant speed manner.
In the present embodiment, the sensing element 80 is a capacitive sensing element as an example. However, in other embodiments, the sensing element 80 may be an inductive sensing element for measuring the inductance of the first conductor portion 1021 and the second conductor portion 1022. That is, when the sensing element 80 enters the through hole 10H, the sensing element 80 can measure a sensing curve 80H of the inductance value variation of the test pattern 102 (see fig. 4, fig. 4 is a schematic diagram of the sensing curve 80H).
In fig. 4, the inductance value of the uppermost second conductor portion 1022 corresponds to the peak H1, the inductance value of the second conductor portion 1022 of the second layer corresponds to the peak H2, the inductance value of the second conductor portion 1022 of the third layer corresponds to the peak H3, and the inductance value of the second conductor portion 1022 of the fourth layer corresponds to the peak H4. In addition, the ordinate of the curve bottom D '1 is the inductance value corresponding to the uppermost first conductor portion 1021, the curve bottom D '2 is the inductance value corresponding to the second-level first conductor portion 1021, and the curve bottom D '3 is the inductance value corresponding to the lowermost first conductor portion 1021. The thickness (D, D ═ v × t) of each dielectric layer 12 can be similarly estimated by measuring the widths of the bottom curves D '1 to D'3 (i.e., the required time (t)) and considering the moving speed (v) of the sensor element 80. Similarly, the thickness of each wiring layer 13 can be estimated by measuring the widths of the peaks H1 to H4 of the curves and considering the moving speed (v) of the sensor element 80.
Referring to fig. 5 and fig. 2C, fig. 5 is a schematic partial cross-sectional view of a circuit board 20 according to another embodiment. In the testing region 10T of the circuit board 10 of the embodiment shown in fig. 2C, all of the second conductor portions 1022 are exposed at the side surfaces of the through holes 10H. However, in the embodiment shown in fig. 5, the second conductor portions 1022 of the second layer and the third layer of the test area 20T of the circuit board 20 are covered by the dielectric layer 12, so the second conductor portions 1022 are not exposed on the side surfaces of the through holes 20H. However, as long as the test pattern 102 is in a conductive state, even though the second conductor part 1022 is covered by the dielectric layer 12, the sensing element 80 can still detect the capacitance or inductance of the first conductor part 1021 and the second conductor part 1022. Moreover, in the embodiment shown in fig. 5, the distance between the side of the through hole 20H and the second conductor portion 1022 is smaller than the distance between the side of the through hole 20H and the first conductor portion 1021, so that the sensing element 80 can still measure the sensing curve 80C similar to that of fig. 3C by moving the sensing element 80 downward along the through hole 200H.
In summary, the present invention only needs to form a through hole 10H on the preset test area 10T, so that the sensing element 80 can be inserted into the through hole 10H to measure the thickness of the dielectric layer of each layer of the circuit board, and the required area is small, fast and convenient. Therefore, compared with the traditional method for measuring the thickness of the dielectric layer of the circuit board, the method for measuring the thickness of the dielectric layer in the circuit board can quickly and conveniently measure the thickness of the dielectric layer of the circuit board without damaging the circuit board.
The above-described embodiments are merely exemplary for convenience of description, and various modifications may be made by those skilled in the art without departing from the scope of the invention as claimed in the claims.
Claims (7)
1. A method for measuring the thickness of a dielectric layer in a circuit board, comprising:
providing a circuit board, wherein the circuit board comprises at least one dielectric layer and at least two circuit layers, the dielectric layer is arranged between the circuit layers, the circuit board also comprises a test area, a test pattern and a through hole are arranged on the test area, the test pattern comprises at least one first conductor part and at least two second conductor parts, the first conductor part is connected between the two second conductor parts, the second conductor parts belong to one part of the circuit layers, the first conductor part penetrates through the dielectric layer, and the distance between the side edge of the through hole and the second conductor parts is smaller than the distance between the side edge of the through hole and the first conductor part;
providing a measuring device, wherein the measuring device comprises a conductive pin and a sensing assembly, the sensing assembly comprises a sensing end, a connecting part and an insulating part, the connecting part is connected with the sensing end, and the insulating part is coated on the periphery of the connecting part;
electrifying the conductive pin and electrically connecting one end of the conductive pin with the second conductor part; and
the sensing component is inserted into the through hole and moved along the through hole to measure a sensing curve, and the thickness of the dielectric layer is obtained according to the change of the sensing curve.
2. The method of claim 1, wherein the sensor assembly moves along the through hole in a constant velocity manner.
3. The method as claimed in claim 1, wherein the length of the sensing terminal is less than the thickness of the second conductive portion.
4. The method of claim 1, wherein the sensor is a capacitive sensor or an inductive sensor.
5. A measuring device, characterized in that, it is used for measuring the dielectric layer thickness of a circuit board, the circuit board includes at least one dielectric layer and at least two circuit layers, the dielectric layer is between the circuit layers, and the circuit board also includes a testing area, there is a testing pattern and a through hole on the testing area, the testing pattern includes at least one first conductor part and at least two second conductor parts, the first conductor part is connected between two second conductor parts, the second conductor part belongs to a part of the circuit layer, the first conductor part runs through the dielectric layer, wherein the distance between the side of the through hole and the second conductor part is less than the distance between the side of the through hole and the first conductor part, the measuring device includes:
an inductive component, comprising:
a sensing end;
a connecting part connected with the sensing end; and
an insulating part, which is coated on the periphery of the connecting part; and
one end of the conductive needle is electrically connected with the second conductor part;
when the thickness of the dielectric layer is measured, the sensing component penetrates into the through hole and moves along the through hole to measure a sensing curve.
6. The measurement device of claim 5, wherein the sensing element is a capacitive probe or an inductive probe.
7. The measurement device of claim 5, wherein the dielectric layer has a plurality of layers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110047101.4A CN114763984B (en) | 2021-01-14 | 2021-01-14 | Device and method for measuring thickness of dielectric layer in circuit board |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110047101.4A CN114763984B (en) | 2021-01-14 | 2021-01-14 | Device and method for measuring thickness of dielectric layer in circuit board |
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| CN114763984A true CN114763984A (en) | 2022-07-19 |
| CN114763984B CN114763984B (en) | 2024-04-19 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020110396A1 (en) * | 1999-11-18 | 2002-08-15 | Fujitsu Limited | Thickness detecting apparatus |
| CN1515871A (en) * | 2003-01-08 | 2004-07-28 | 友达光电股份有限公司 | Method for measuring thickness of dielectric layer and its device |
| US20050055841A1 (en) * | 2002-11-15 | 2005-03-17 | Bernhard Scherzinger | Measurement probe, in particular for an apparatus for measurement of the thickness of thin layers |
| US20130275083A1 (en) * | 2012-04-16 | 2013-10-17 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Apparatus and method for measuring thickness of printed circuit board |
| US20140333329A1 (en) * | 2013-05-09 | 2014-11-13 | Avago Technologies General IP (Singapore) Pte. Ltd . | Method and apparatus for measuring thickness of layer in printed circuit board |
-
2021
- 2021-01-14 CN CN202110047101.4A patent/CN114763984B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020110396A1 (en) * | 1999-11-18 | 2002-08-15 | Fujitsu Limited | Thickness detecting apparatus |
| US20050055841A1 (en) * | 2002-11-15 | 2005-03-17 | Bernhard Scherzinger | Measurement probe, in particular for an apparatus for measurement of the thickness of thin layers |
| CN1515871A (en) * | 2003-01-08 | 2004-07-28 | 友达光电股份有限公司 | Method for measuring thickness of dielectric layer and its device |
| US20130275083A1 (en) * | 2012-04-16 | 2013-10-17 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Apparatus and method for measuring thickness of printed circuit board |
| US20140333329A1 (en) * | 2013-05-09 | 2014-11-13 | Avago Technologies General IP (Singapore) Pte. Ltd . | Method and apparatus for measuring thickness of layer in printed circuit board |
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