CN114755559A - Probe clamp suitable for semiconductor chip test system - Google Patents
Probe clamp suitable for semiconductor chip test system Download PDFInfo
- Publication number
- CN114755559A CN114755559A CN202210369841.4A CN202210369841A CN114755559A CN 114755559 A CN114755559 A CN 114755559A CN 202210369841 A CN202210369841 A CN 202210369841A CN 114755559 A CN114755559 A CN 114755559A
- Authority
- CN
- China
- Prior art keywords
- side wall
- probe
- clamping
- fixedly arranged
- polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention discloses a probe clamp suitable for a semiconductor chip test system, which relates to the technical field of semiconductor photoelectron and comprises a base and a movable clamping device, wherein the movable clamping device is adjustably arranged on the base and is provided with a clamping component for clamping a probe, when the probe needs to be replaced, the movable clamping device is used for clamping the probe to return to an initial position, and the probe can be replaced by releasing the clamping component.
Description
Technical Field
The invention relates to the technical field of probe clamps, in particular to a probe clamp suitable for a semiconductor chip test system.
Background
In recent years, semiconductor process technology has been rapidly advanced, which advances the prediction rule of Moore's law for several years, and advances to below 7 nm at present. The product is light, thin, short, small, the IC volume is smaller and smaller, the function is stronger and stronger, the pin number is more and more, in order to reduce the occupied area of the chip packaging and improve the IC efficiency, the flip chip packaging mode at the present stage is generally applied to a drawing chip, a chip group, a memory, a CPU and the like, the unit price of the high-level packaging mode is high, if the chip testing can be carried out before the packaging, and the defective products are found to exist in the wafer, the marking is carried out until the defective products marked before the back-stage packaging process, and the unnecessary packaging cost can be saved.
The test probe is in the in-process of production and processing, need polish the polishing to it for the probe is fine more smooth, and nevertheless the probe structure is less, and therefore the handheld polishing of staff is inconvenient, can't carry out the polishing effect of different degrees simultaneously, makes the polishing effect not good, leads to the smooth degree of product not perfect enough, and then makes the yield reduce, for this reason, we propose a probe anchor clamps that is applicable to semiconductor chip test system, solve above problem.
Disclosure of Invention
The invention aims to solve the defects in the prior art and provides a probe clamp suitable for a semiconductor chip testing system.
In order to achieve the purpose, the invention adopts the following technical scheme:
a probe fixture suitable for use in a semiconductor chip testing system, comprising:
the top of the base is provided with a sliding chute for moving equipment;
the movable clamping device is arranged at the top of the base and is used for clamping the probe and enabling the probe to rotate and advance;
the polishing clamping device is arranged on one side, away from the movable clamping device, of the base and is used for clamping the probe and polishing the probe;
And the spraying device is arranged on the polishing clamping device and used for cleaning the side wall of the probe.
Preferably, the movable clamping device comprises a movable support movably arranged on the inner side wall of the sliding groove, the movable support can slide on the inner side wall of the sliding groove, a connecting groove is formed in the inner side wall of the movable support, a rotary clamping pipe is movably arranged on the inner side wall of the movable support, the rotary clamping pipe can rotate on the inner side wall of the movable support, a clamping assembly is arranged on the side wall of the rotary clamping pipe, and a transmission assembly is arranged on the base.
Preferably, the polishing clamping device comprises a polishing support fixedly arranged on one side of the base away from the movable support, a polishing clamping pipe is fixedly arranged at the top of the polishing support, an elastic grinding block is fixedly arranged on the inner side wall of the polishing clamping pipe, a lifting pipe is fixedly arranged in the middle of the polishing support, a lifting plate is fixedly arranged at the top of the lifting pipe, a lifting spring is fixedly arranged at the bottom of the lifting plate, the bottom of the lifting spring abuts against the bottom of the lifting pipe, a push rod is fixedly arranged at the top of the lifting plate and penetrates through the side wall of the lifting pipe, a water tank is fixedly arranged at the top of the push rod, a connecting plate is fixedly arranged at the top of the water tank, a motor is fixedly arranged on the side wall of the connecting plate, and a rotating grinding roller is movably arranged on the inner side wall of the connecting plate, the output end of the motor penetrates through the connecting plate and is fixedly connected with the rotating grinding roller, a threaded rod is fixedly arranged on one side, away from the motor, of the rotating grinding roller, and the threaded rod penetrates through the side wall of the connecting plate.
Preferably, sprinkler is including fixed setting the extrusion case at water tank top, the activity is provided with the stripper plate on the inside wall of extrusion case, the fixed stripper bar that is provided with in top of stripper plate, the stripper bar runs through the top of extrusion case, the fixed atress board that is provided with in top of stripper bar, the stripper bar extends the cover is equipped with the answer spring on one section lateral wall of extrusion case, the fixed one-way feed liquor pipe that is provided with in bottom of extrusion case, one-way feed liquor pipe extends to the inside of water tank, the fixed one-way spray pipe that is provided with on the lateral wall of extrusion case, the one-way one end that the extrusion case was kept away from to one-way spray pipe extends to the lateral wall of the clamp pipe of polishing.
Preferably, the clamping assembly comprises a bolt in threaded connection with the side wall of the rotating clamping pipe, the bolt extends into the rotating clamping pipe, a clamping plate is movably arranged at one end of the bolt inside the rotating clamping pipe, and a clamping pad is fixedly arranged on one side, away from the bolt, of the clamping plate.
Preferably, the transmission assembly is including fixed the setting fixed plate on the base, the fixed drive lead screw that is provided with on the lateral wall of fixed plate, the drive lead screw runs through the lateral wall of movable support, movable support can slide on the lateral wall that drives the lead screw, the activity is provided with the swivel becket on movable support's the lateral wall, the swivel becket can rotate on the movable support, the swivel becket cover is established the outer lane of drive lead screw, the fixed rotation slide bar that is provided with on the inside wall of swivel becket, the rotation slide bar is kept away from the one end of swivel becket extends to inside the thread groove on the lateral wall of drive lead screw, the tip of rotation slide bar with the thread groove looks adaptation on the lateral wall of drive lead screw.
Preferably, one end of the threaded rod, which is far away from the rotating grinding roller, is in threaded connection with the side wall of the connecting groove, and the connecting groove is an oval groove.
Preferably, an elliptical wheel is fixedly arranged on the side wall of one end, close to the connecting plate, of the threaded rod, and the elliptical wheel is abutted against the top of the stress plate.
Preferably, the top of the return spring abuts against the bottom of the stress plate, and the bottom of the return spring abuts against the top of the compression box.
Preferably, a conveyor belt is sleeved on the outer side wall of the rotating ring, and a end, far away from the rotating ring, of the conveyor belt is sleeved on the outer side wall of the rotating clamping pipe.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the probe polishing device, the movable clamping device and the polishing clamping device are matched for use, after the probe is clamped and fixed, the grinding roller is rotated to drive the threaded rod to rotate, the movable support is moved, the probe can rotate in the advancing process through the arranged transmission assembly, and after entering the interior of the rotating grinding roller, the probe can be extruded by the elastic grinding block and uniformly polished under the active polishing effect of the rotating grinding roller and the passive friction effect of the elastic grinding block, the probe is not required to be operated by a worker in the polishing process, the probe polishing device is convenient to use, the probe polishing efficiency is effectively improved, the smoothness of a product is higher, and the yield is improved.
2. According to the invention, through the matching use of the polishing clamping device and the spraying device, when the threaded rod rotates, the elliptical wheel rotates, under the matching of the return spring, the stress plate reciprocates up and down, the interior of the extrusion box reciprocates to suck, water liquid is sprayed on the outer wall of the polishing probe through the one-way spraying pipe, the probe is cleaned, the polishing is more convenient, the polishing efficiency is effectively improved, the cleanliness of the probe is higher, and the functionality of equipment is enhanced;
3. according to the invention, in the process of spraying water liquid, the water liquid inside the water tank is changed, the abutting degree of the rotating grinding roller is controlled, when the water tank is used for the first time, the gravity of the water tank is large, the rotating grinding roller can be enabled to perform shallow contact grinding and polishing, after the probe is ground, the probe can become thinner, the gravity of the water tank can be reduced, under the elastic action of the lifting spring, the rotating grinding roller can be enabled to abut upwards for deep grinding, the rotating grinding roller can be enabled to cling to the side wall of the probe constantly, multiple deep clinging and polishing can be performed, the grinding degree is not required to be adjusted manually, excessive grinding in initial work is avoided, the probe is damaged, the problem that the subsequent grinding degree is insufficient is solved, the polishing effect is poor, the grinding functionality of the equipment is effectively improved, and the grinding quality of the probe is effectively guaranteed.
Drawings
FIG. 1 is a schematic structural diagram of a probe fixture suitable for a semiconductor chip testing system according to the present invention;
FIG. 2 is a side view of a probe fixture for use in a semiconductor chip testing system according to the present invention;
FIG. 3 is a structural backside view of a probe fixture for a semiconductor chip testing system according to the present invention;
FIG. 4 is a top view of a probe fixture for a semiconductor chip testing system according to the present invention;
FIG. 5 is a cross-sectional view of a probe fixture for a semiconductor chip testing system according to the present invention;
FIG. 6 is an enlarged view of a probe fixture A suitable for use in a semiconductor chip testing system according to the present invention;
FIG. 7 is an enlarged view of a probe holder B for use in a semiconductor chip testing system according to the present invention;
fig. 8 is an enlarged view of a probe card C suitable for use in a semiconductor chip testing system according to the present invention.
In the figure: 1. a base; 2. a chute; 3. moving the support; 4. connecting grooves; 5. rotating the clamping pipe; 6. a bolt; 7. a propping plate; 8. tightly abutting against the cushion; 9. a fixing plate; 10. driving the screw rod; 11. a rotating ring; 12. rotating the sliding rod; 13. a conveyor belt; 14. polishing the bracket; 15. polishing the pipe clamp; 16. an elastic grinding block; 17. a lifting pipe; 18. a lifting plate; 19. a lift spring; 20. a push rod; 21. a water tank; 22. a connecting plate; 23. a motor; 24. rotating the grinding roller; 25. a threaded rod; 26. a one-way spray pipe; 27. an elliptical wheel; 28. extruding the box; 29. a pressing plate; 30. an extrusion stem; 31. a return spring; 32. a stress plate; 33. a one-way liquid inlet pipe.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Referring to fig. 1-8, a probe fixture suitable for use in a semiconductor chip testing system, comprising:
the device comprises a base 1, wherein the top of the base 1 is provided with a chute 2 for moving equipment;
the movable clamping device is arranged at the top of the base 1 and adjustably arranged on the base, and is used for clamping the probe and enabling the probe to rotate and advance; the movable clamping device comprises a movable support 3 movably arranged on the inner side wall of the chute 2, the movable support 3 can slide on the inner side wall of the chute 2, a connecting groove 4 is formed in the inner side wall of the movable support 3, a rotating clamping pipe 5 is movably arranged on the inner side wall of the movable support 3, the rotating clamping pipe 5 can rotate on the inner side wall of the movable support 3, a clamping assembly is arranged on the side wall of the rotating clamping pipe 5 and comprises a bolt 6 in threaded connection with the side wall of the rotating clamping pipe 5, the bolt 6 extends into the rotating clamping pipe 5, a clamping plate 7 is movably arranged at one end of the bolt 6 positioned in the rotating clamping pipe 5, and a clamping pad 8 is fixedly arranged on one side, away from the bolt 6, of the clamping plate 7;
One end of a probe to be polished penetrates through the interior of the rotary clamping pipe 5, and at the moment, the bolt 6 is rotated, so that the bolt 6 pushes the abutting plate 7 to move relative to the interior of the rotary clamping pipe 5, and the abutting plate 7 fixes the probe through the abutting pad 8;
a transmission assembly is arranged on the base 1 and comprises a fixed plate 9 fixedly arranged on the base 1, a driving screw rod 10 is fixedly arranged on the side wall of the fixed plate 9, the driving screw rod 10 penetrates through the side wall of the movable support 3, the movable support 3 can slide on the outer side wall of the driving screw rod 10, a rotating ring 11 is movably arranged on the side wall of the movable support 3, a conveying belt 13 is sleeved on the outer side wall of the rotating ring 11, one end, far away from the rotating ring 11, of the conveying belt 13 is sleeved on the outer side wall of the rotating clamping pipe 5, the rotating ring 11 can rotate on the movable support 3, the rotating ring 11 is sleeved on the outer ring of the driving screw rod 10, a rotating slide rod 12 is fixedly arranged on the inner side wall of the rotating ring 11, one end, far away from the rotating ring 11, of the rotating slide rod 12 extends into a thread groove on the side wall of the driving screw rod 10, and the end part of the rotating slide rod 12 is matched with a thread groove on the side wall of the driving screw rod 10;
the polishing clamping device is arranged on one side, away from the movable clamping device, of the base 1 and is used for clamping the probe and polishing the probe; the polishing clamping device comprises a polishing support 14 fixedly arranged on one side, far away from a movable support 3, of a base 1, a polishing clamping pipe 15 is fixedly arranged at the top of the polishing support 14, an elastic grinding block 16 is fixedly arranged on the inner side wall of the polishing clamping pipe 15, an elevator pipe 17 is fixedly arranged in the middle of the base 1, which is positioned on the polishing support 14, an elevator plate 18 is fixedly arranged at the top of the elevator pipe 17, an elevator spring 19 is fixedly arranged at the bottom of the elevator plate 18, the bottom of the elevator spring 19 abuts against the bottom of the elevator pipe 17, a push rod 20 is fixedly arranged at the top of the elevator plate 18, the push rod 20 penetrates through the side wall of the elevator pipe 17, a water tank 21 is fixedly arranged at the top of the push rod 20, a connecting plate 22 is fixedly arranged at the top of the water tank 21, a motor 23 is fixedly arranged on the side wall of the connecting plate 22, a rotating grinding roller 24 is movably arranged on the inner side wall of the connecting plate 22, and the output end of the motor 23 penetrates through the connecting plate 22 to be fixedly connected with the rotating grinding roller 24, a threaded rod 25 is fixedly arranged on one side of the rotating grinding roller 24, which is far away from the motor 23, the threaded rod 25 penetrates through the side wall of the connecting plate 22, one end of the threaded rod 25, which is far away from the rotating grinding roller 24, is in threaded connection with the side wall of the connecting groove 4, and the connecting groove 4 is an elliptical groove;
Through the matching use between the movable clamping device and the polishing clamping device, after the probe is clamped and fixed, the rotating grinding roller 24 drives the threaded rod 25 to rotate, so that the movable support 3 moves, the probe can rotate in the advancing process through the arranged transmission assembly, and after entering the rotating grinding roller 24, the probe can be extruded by the rotating grinding roller 24 and simultaneously extruded by the elastic grinding block 16, and the probe can be uniformly ground and polished under the active grinding effect of the rotating grinding roller 24 and the passive friction effect of the elastic grinding block 16;
the spraying device is arranged on the polishing clamping device and used for cleaning the side wall of the probe; the spraying device comprises a fixed extrusion box 28 arranged at the top of the water tank 21, an extrusion plate 29 is movably arranged on the inner side wall of the extrusion box 28, an extrusion rod 30 is fixedly arranged at the top of the extrusion plate 29, the extrusion rod 30 penetrates through the top of the extrusion box 28, a stress plate 32 is fixedly arranged at the top of the extrusion rod 30, an elliptical wheel 27 is fixedly arranged on the side wall of one end, close to the connecting plate 22, of the threaded rod 25, the elliptical wheel 27 abuts against the top of the stress plate 32, the extrusion rod 30 extends out of one section of outer side wall of the extrusion box 28 and is provided with a return spring 31 in a sleeved mode, the top of the return spring 31 abuts against the bottom of the stress plate 32, the bottom of the return spring 31 abuts against the top of the extrusion box 28, a unidirectional liquid inlet pipe 33 is fixedly arranged at the bottom of the extrusion box 28, the unidirectional liquid inlet pipe 33 extends to the inside of the water tank 21, a unidirectional spraying pipe 26 is fixedly arranged on the side wall of the extrusion box 28, and one end, far away from the extrusion box 28, extends to the side wall of the grinding clamping pipe 15, of the unidirectional spraying pipe 26.
Through the matching use of the polishing clamping device and the spraying device, when the threaded rod 25 rotates, the elliptical wheel 27 rotates, under the matching of the return spring 31, the stress plate 32 reciprocates up and down, the interior of the extrusion box 28 reciprocates to suck, water liquid is sprayed on the outer wall of the grinding probe through the one-way spraying pipe 26, the probe is cleaned, the grinding is more convenient, the grinding efficiency is effectively improved, the cleanliness of the probe is higher, and the functionality of the device is enhanced;
through spraying the water liquid in-process, the inside water liquid of water tank 21 changes, the tight degree of supporting of grinding roller 24 is rotated in control, when using for the first time, water tank 21's gravity is great, will make to rotate grinding roller 24 and carry out shallow layer contact burnishing and polishing, after the probe receives polishing, will become thinner, water tank 21's gravity also can reduce this moment, under lifting spring 19's spring action, will make to rotate grinding roller 24 and upwards support tightly, carry out the degree of depth and polish, make to rotate grinding roller 24 and hug closely the probe lateral wall constantly, carry out the polishing of hugging closely of multiple degree of depth, make the degree of polishing need not the manual work and transfer, avoid initial work to excessively polish, cause the injury to the probe, prevent that follow-up degree of polishing is not enough, lead to the polishing effect not good, the effectual functional that has improved equipment and polished, effectively guarantee probe polishing quality.
When the probe fixing device is used, one end of a probe to be polished penetrates through the inside of the rotary clamping tube 5, the bolt 6 is rotated at the moment, the bolt 6 pushes the abutting plate 7 to rotate relative to the inside of the rotary clamping tube 5 to move, and the abutting plate 7 fixes the probe through the abutting pad 8;
at this moment, the motor 23 is started, when the motor 23 rotates, the rotating grinding roller 24 can rotate, and simultaneously the threaded rod 25 rotates, when the threaded rod 25 rotates, the movable bracket 3 can move under the arrangement of the connecting groove 4, the movable bracket 3 can move, the probe can move towards the interior of the grinding clamping pipe 15, when the movable bracket 3 moves, the rotating ring 11 can synchronously move, when the rotating ring 11 moves, the rotating slide rod 12 can slide along the side wall of the driving screw rod 10, and further the rotating ring 11 rotates, when the rotating ring 11 rotates, the conveying belt 13 can drive the rotating clamping pipe 5 to rotate, and further the probe under clamping can rotate, when the probe enters the interior of the grinding clamping pipe 15, the probe can be extruded by the rotating grinding roller 24 and simultaneously extruded by the elastic grinding block 16, at this moment, the rotating grinding roller 24 can tightly support the probe to grind and polish the probe, and during the advancing and polishing process of the probe, will rotate, under the initiative of turning the grinding roller 24 and passive friction effect of the elasticity abrasive brick 16, polish the probe evenly;
When the threaded rod 25 rotates, the elliptical wheel 27 rotates, when the elliptical wheel 27 rotates, the elliptical wheel 27 can reciprocally press the stress plate 32, under the cooperation of the return spring 31, the stress plate 32 reciprocally moves up and down, when the stress plate 32 moves up, the extrusion rod 30 can upwards pull the extrusion plate 29, so that negative pressure is generated inside the extrusion box 28, water is absorbed into the extrusion box 28 through the one-way liquid inlet pipe 33, when the stress plate 32 moves down, the extrusion plate 29 is pushed to move down, and when the extrusion plate 29 moves down, water inside the extrusion box 28 can be sprayed on the outer wall of the polishing probe through the one-way spraying pipe 26, so that the probe is cleaned, and meanwhile, the polishing efficiency is improved;
when the grinding position penetrates through the grinding clamping pipe 15, the motor 23 rotates reversely at the moment to enable the probe to return to realize reciprocating grinding and polishing, after grinding for a period of time, the probe becomes thin, the grinding efficiency of the rotary grinding roller 24 is reduced, and when the water quantity passing through the water tank 21 is reduced, the lifting plate 18 rises upwards under the elastic force of the lifting spring 19, the water tank 21 is pushed upwards through the push rod 20, the rotary grinding roller 24 rises to carry out deep grinding, so that the rotary grinding roller 24 can be attached to the side wall of the probe at any time to carry out multi-depth attached polishing;
When needing to be changed the probe, reply initial position with removing clamping device centre gripping probe to can change through removing the centre gripping subassembly, when moving movable support 3 and reply initial position once more, can close motor 23 this moment, the antiport bolt 6 takes off the probe.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the equipment or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered as the technical solutions and the inventive concepts of the present invention within the technical scope of the present invention.
Claims (10)
1. A probe fixture suitable for use in a semiconductor chip testing system, comprising:
the device comprises a base (1), wherein a sliding groove (2) for moving equipment is formed in the top of the base (1);
the movable clamping device is arranged at the top of the base (1) and is used for clamping the probe and enabling the probe to rotate and advance;
the polishing clamping device is arranged on one side, away from the moving clamping device, of the base (1), and is used for clamping and polishing the probe;
and the spraying device is arranged on the polishing clamping device and used for cleaning the side wall of the probe.
2. The probe clamp suitable for the semiconductor chip testing system according to claim 1, wherein the movable clamping device comprises a movable support (3) movably disposed on the inner side wall of the sliding groove (2), the movable support (3) can slide on the inner side wall of the sliding groove (2), a connecting groove (4) is formed in the inner side wall of the movable support (3), a rotary clamping tube (5) is movably disposed on the inner side wall of the movable support (3), the rotary clamping tube (5) can rotate on the inner side wall of the movable support (3), a clamping assembly is disposed on the side wall of the rotary clamping tube (5), and a transmission assembly is disposed on the base (1).
3. The probe clamp suitable for the semiconductor chip testing system according to claim 2, wherein the polishing clamping device comprises a polishing support (14) fixedly arranged on one side of the base (1) far away from the movable support (3), a polishing clamping tube (15) is fixedly arranged on the top of the polishing support (14), an elastic grinding block (16) is fixedly arranged on the inner side wall of the polishing clamping tube (15), a lifting tube (17) is fixedly arranged in the middle of the polishing support (14) of the base (1), a lifting plate (18) is fixedly arranged on the top of the lifting tube (17), a lifting spring (19) is fixedly arranged on the bottom of the lifting plate (18), the bottom of the lifting spring (19) abuts against the bottom of the lifting tube (17), and a push rod (20) is fixedly arranged on the top of the lifting plate (18), push rod (20) run through the lateral wall of fall way (17), the fixed water tank (21) that is provided with in top of push rod (20), the fixed connecting plate (22) that is provided with in top of water tank (21), the fixed motor (23) that is provided with on the lateral wall of connecting plate (22), the activity is provided with on the inside wall of connecting plate (22) and rotates grinding roller (24), the output through connection board (22) of motor (23) with rotate grinding roller (24) fixed connection, it is fixed threaded rod (25) that is provided with to rotate one side that motor (23) were kept away from in grinding roller (24), and threaded rod (25) run through the lateral wall of connecting plate (22).
4. The probe clamp suitable for the semiconductor chip testing system according to claim 3, wherein the spraying device comprises a squeezing box (28) fixedly arranged at the top of the water tank (21), a squeezing plate (29) is movably arranged on the inner side wall of the squeezing box (28), a squeezing rod (30) is fixedly arranged at the top of the squeezing plate (29), the squeezing rod (30) penetrates through the top of the squeezing box (28), a stress plate (32) is fixedly arranged at the top of the squeezing rod (30), a return spring (31) is sleeved on one section of outer side wall of the squeezing rod (30) extending out of the squeezing box (28), a one-way liquid inlet pipe (33) is fixedly arranged at the bottom of the squeezing box (28), the one-way liquid inlet pipe (33) extends into the water tank (21), a one-way spraying pipe (26) is fixedly arranged on the side wall of the squeezing box (28), one end of the one-way spray pipe (26) far away from the extrusion box (28) extends to the side wall of the grinding clamping pipe (15).
5. The probe clamp suitable for the semiconductor chip testing system according to claim 4, wherein the clamping assembly comprises a bolt (6) screwed on a side wall of the rotary clamping tube (5), the bolt (6) extends into the rotary clamping tube (5), one end of the bolt (6) located inside the rotary clamping tube (5) is movably provided with a clamping plate (7), and one side of the clamping plate (7) far away from the bolt (6) is fixedly provided with a clamping pad (8).
6. The probe clamp suitable for the semiconductor chip testing system according to claim 5, wherein the transmission assembly comprises a fixing plate (9) fixedly disposed on the base (1), a driving screw rod (10) is fixedly disposed on a side wall of the fixing plate (9), the driving screw rod (10) penetrates through a side wall of the movable bracket (3), the movable bracket (3) can slide on an outer side wall of the driving screw rod (10), a rotating ring (11) is movably disposed on a side wall of the movable bracket (3), the rotating ring (11) can rotate on the movable bracket (3), the rotating ring (11) is sleeved on an outer ring of the driving screw rod (10), a rotating slide rod (12) is fixedly disposed on an inner side wall of the rotating ring (11), and one end of the rotating slide rod (12) far away from the rotating ring (11) extends to an inner portion of a thread groove on the side wall of the driving screw rod (10), the end part of the rotary sliding rod (12) is matched with a thread groove on the side wall of the driving screw rod (10).
7. A probe holder for a semiconductor chip testing system according to claim 3, characterized in that the end of the threaded rod (25) remote from the rotating grinding roller (24) is in threaded connection with the side wall of the connection groove (4), the connection groove (4) being an oval groove.
8. The probe clamp suitable for the semiconductor chip testing system according to claim 4, wherein an elliptical wheel (27) is fixedly arranged on a side wall of one end of the threaded rod (25) close to the connecting plate (22), and the elliptical wheel (27) abuts against the top of the stress plate (32).
9. The probe clamp suitable for semiconductor chip testing system according to claim 4, wherein the top of the return spring (31) abuts against the bottom of the stress plate (32), and the bottom of the return spring (31) abuts against the top of the squeeze box (28).
10. The probe clamp suitable for the semiconductor chip testing system according to claim 6, wherein a conveyor belt (13) is sleeved on an outer side wall of the rotating ring (11), and an end of the conveyor belt (13) far away from the rotating ring (11) is sleeved on an outer side wall of the rotating clamping tube (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210369841.4A CN114755559B (en) | 2022-04-08 | 2022-04-08 | Probe fixture suitable for semiconductor chip test system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210369841.4A CN114755559B (en) | 2022-04-08 | 2022-04-08 | Probe fixture suitable for semiconductor chip test system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114755559A true CN114755559A (en) | 2022-07-15 |
| CN114755559B CN114755559B (en) | 2023-06-27 |
Family
ID=82329576
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210369841.4A Active CN114755559B (en) | 2022-04-08 | 2022-04-08 | Probe fixture suitable for semiconductor chip test system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114755559B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104390835A (en) * | 2014-12-04 | 2015-03-04 | 南京理工大学 | Three-dimensional atom probe sample preparation first-stage polishing device |
| CN210335477U (en) * | 2019-07-19 | 2020-04-17 | 浙江老鹰半导体技术有限公司 | Needle grinding device for LED chip testing equipment |
| CN212886800U (en) * | 2020-08-12 | 2021-04-06 | 深圳市宾德宝电子科技有限公司 | Semi-automatic test probe sharpening machine |
| CN113030534A (en) * | 2021-05-27 | 2021-06-25 | 琉明光电(常州)有限公司 | Blunt cleaning device is fallen with syringe needle to LED chip electrical property detection |
| CN113186588A (en) * | 2021-04-06 | 2021-07-30 | 南京理工大学 | Automatic intelligent polishing equipment for preparing metal nanometer needle point sample |
| CN214503816U (en) * | 2021-09-23 | 2021-10-26 | 福建慧芯激光科技有限公司 | Probe clamp suitable for semiconductor chip test system |
| CN215433000U (en) * | 2021-07-26 | 2022-01-07 | 丹东富田精工机械有限公司 | Efficient polishing and grinding equipment for probe component |
| CN215700523U (en) * | 2021-06-22 | 2022-02-01 | 深圳市道格特科技有限公司 | Portable needle grinding machine |
-
2022
- 2022-04-08 CN CN202210369841.4A patent/CN114755559B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104390835A (en) * | 2014-12-04 | 2015-03-04 | 南京理工大学 | Three-dimensional atom probe sample preparation first-stage polishing device |
| CN210335477U (en) * | 2019-07-19 | 2020-04-17 | 浙江老鹰半导体技术有限公司 | Needle grinding device for LED chip testing equipment |
| CN212886800U (en) * | 2020-08-12 | 2021-04-06 | 深圳市宾德宝电子科技有限公司 | Semi-automatic test probe sharpening machine |
| CN113186588A (en) * | 2021-04-06 | 2021-07-30 | 南京理工大学 | Automatic intelligent polishing equipment for preparing metal nanometer needle point sample |
| CN113030534A (en) * | 2021-05-27 | 2021-06-25 | 琉明光电(常州)有限公司 | Blunt cleaning device is fallen with syringe needle to LED chip electrical property detection |
| CN215700523U (en) * | 2021-06-22 | 2022-02-01 | 深圳市道格特科技有限公司 | Portable needle grinding machine |
| CN215433000U (en) * | 2021-07-26 | 2022-01-07 | 丹东富田精工机械有限公司 | Efficient polishing and grinding equipment for probe component |
| CN214503816U (en) * | 2021-09-23 | 2021-10-26 | 福建慧芯激光科技有限公司 | Probe clamp suitable for semiconductor chip test system |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114755559B (en) | 2023-06-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20160297048A1 (en) | Wafer polishing apparatus | |
| CN108067993B (en) | Double-sided processing device for silicon wafer | |
| CN112045522B (en) | Part grinding device for mechanical manufacturing | |
| CN114755559A (en) | Probe clamp suitable for semiconductor chip test system | |
| US11318579B2 (en) | Multiple nozzle slurry dispense scheme | |
| US6736710B2 (en) | Polisher for polishing end surface of semiconductor wafer | |
| JP2016215284A (en) | Polishing device | |
| US6685543B2 (en) | Compensating chemical mechanical wafer polishing apparatus and method | |
| TWI285575B (en) | Polishing method | |
| CN219380034U (en) | Magnetic polishing machine convenient for discharging | |
| CN108453615B (en) | Multi-surface polishing device and method for tubular part | |
| CN214488162U (en) | Crystallizer copper pipe chromium plating belt cleaning device | |
| CN212856813U (en) | Casting liquid port cleaning device of casting mould | |
| CN216577088U (en) | Elastic polishing head for processing aspheric surface | |
| CN207255965U (en) | Automatic charging type safety valve cylindrical grinding machine | |
| CN219113738U (en) | Stop diameter piece and throw both ends apparatus for producing | |
| CN111993766A (en) | PE pipe surface printing device and printing method thereof | |
| CN218874915U (en) | Machining mold surface processing equipment | |
| CN218192339U (en) | Mechanical forging rapid demoulding device | |
| CN217966216U (en) | Grinding machine is used in processing of convenient fixed spraying roller | |
| CN216399067U (en) | Bottleneck grinding device of plastic bottle production | |
| CN214054833U (en) | High-precision mechanical polishing device | |
| CN220762095U (en) | Bathroom ceramic embryo dust collector that polishes | |
| CN214135486U (en) | Metal product polishing mechanism | |
| CN211867372U (en) | Automatic grinding machine with adjustable clamping structure for producing temperature sensing piece |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |