CN114754713B - Probe damage detection method for atomic force microscope - Google Patents
Probe damage detection method for atomic force microscope Download PDFInfo
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- CN114754713B CN114754713B CN202210659131.5A CN202210659131A CN114754713B CN 114754713 B CN114754713 B CN 114754713B CN 202210659131 A CN202210659131 A CN 202210659131A CN 114754713 B CN114754713 B CN 114754713B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/10—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring diameters
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01Q—SCANNING-PROBE TECHNIQUES OR APPARATUS; APPLICATIONS OF SCANNING-PROBE TECHNIQUES, e.g. SCANNING PROBE MICROSCOPY [SPM]
- G01Q20/00—Monitoring the movement or position of the probe
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01Q—SCANNING-PROBE TECHNIQUES OR APPARATUS; APPLICATIONS OF SCANNING-PROBE TECHNIQUES, e.g. SCANNING PROBE MICROSCOPY [SPM]
- G01Q60/00—Particular types of SPM [Scanning Probe Microscopy] or microscopes; Essential components thereof
- G01Q60/24—AFM [Atomic Force Microscopy] or apparatus therefor, e.g. AFM probes
- G01Q60/38—Probes, their manufacture, or their related instrumentation, e.g. holders
Abstract
The invention provides a probe damage detection method for an atomic force microscope, which comprises the following steps: 1) providing a standard sample, wherein a pattern with a characteristic dimension is formed on the surface of the standard sample; 2) selecting a probe and sweeping the standard sample to obtain a track of the probe moving along the surface fluctuation of the standard sample; 3) fitting the moving track of the probe with the graphic profile of the standard sample to obtain the quality level of the probe; 4) and responding to the quality level of the probe, and judging whether to replace the probe for measuring the sample to be measured. According to the damage detection method for the probe tip, provided by the invention, by configuring the damage detection method for the probe tip before the same batch of samples to be detected is measured, the wear degree and the service life of the probe tip can be timely and effectively monitored, the precision and the repeatability of the test are ensured, and the influence on the throughput of the test caused by unnecessary repeated measurement in the measurement process is avoided.
Description
Technical Field
The present invention relates generally to semiconductor inspection techniques; in particular, the present invention relates to a method for detecting probe damage.
Background
An Atomic Force Microscope (AFM) is a detection instrument with atomic level high resolution, and can be used for characterizing physical properties of various materials and samples in a nanometer region, such as characterizing the microscopic topography of the surface of the material and the electromagnetic properties thereof. The AFM measuring system has nanometer-scale measuring resolution, and the AFM detection process is not limited by materials, so that the range of AFM detection objects is very wide. On the other hand, as the critical dimensions of integrated circuit designs shrink, the reduction in the feature size of the chip places higher demands on the inspection equipment.
The AFM probe is one of key components for realizing high-resolution detection as an important component of an AFM, and parameters and precision of the probe have important influence on a test result. Generally, a probe is mainly composed of a substrate, a micro-cantilever and a tip, and during a test, the tip contacts a sample surface to generate an interaction force, which causes the micro-cantilever of the probe to bend, and various information is obtained by detecting the bending size of the micro-cantilever. However, the probe tip is continuously worn during the test process, which results in a decrease in the test accuracy, especially in the case where the detection of a fine structure such as a trench or a step cannot contact the bottom of the sample, resulting in a low resolution, a deviation of the detection result from the actual morphology of the sample, and a decrease in the measurement accuracy and repeatability.
Therefore, it is necessary to provide a probe damage detection method for an atomic force microscope.
Disclosure of Invention
In view of the above-mentioned shortcomings of the prior art, the present invention provides a method for detecting probe damage of an atomic force microscope, which is used to solve the problems that the wear degree and the service life of the probe tip of the atomic force microscope are not effectively monitored in the existing production measurement process, resulting in unnecessary repeated measurement and wasting the yield of the machine.
To achieve the above and other related objects, the present invention provides a probe damage detecting method for an atomic force microscope, the probe damage detecting method including:
1) providing a standard sample, wherein a pattern with a characteristic dimension is formed on the surface of the standard sample;
2) selecting a probe and sweeping the standard sample to obtain a track of the probe moving along the surface fluctuation of the standard sample;
3) fitting the movement track of the probe with the graph outline of the standard sample to obtain the quality level of the probe, wherein the step 3) comprises 3-1) obtaining an actual value of the characteristic size of the probe tip based on a fitting curve of the movement track of the probe and the graph outline of the standard sample; 3-2) acquiring the abrasion degree of the probe tip based on the actual value and the reference value of the characteristic dimension of the probe tip;
4) and responding to the quality level of the probe, and judging whether to replace the probe for measuring the sample to be measured.
Optionally, the pattern is formed on the surface of the standard sample by an etching process, the pattern includes at least one of a trench or a step structure having a height difference, and the pattern has a line width in a range of 500nm to 1000 nm.
Optionally, step 4) comprises:
4-1) setting a first threshold to a tip critical height that allows the probe to perform a measurement;
4-2) judging that the selected probe is used for measuring the sample to be measured according to the fact that the abrasion degree of the probe is not higher than the first threshold value.
Optionally, the probe damage detection method further comprises:
4-1) setting a first threshold to a tip critical height that allows the probe to perform a measurement;
4-2) judging to replace the selected probe according to the fact that the abrasion degree of the probe is higher than the first threshold value;
5) pick up another probe of the same model, repeat steps 2) to 4).
Optionally, in step 2), a measurement program is called according to the critical dimension of the feature pattern on the surface of the sample to be measured, and a probe is selected based on the measurement program and the standard sample is swept to obtain a track along which the probe moves along the surface of the standard sample in an undulated manner, where the sample to be measured is a micro-structure processed in the same batch.
Optionally, the feature pattern on the surface of the sample to be tested includes a step structure or a trench, an aspect ratio of the step structure is less than 1:1, and an aspect ratio of the trench is less than 10: 1.
Optionally, the probe damage detection method further comprises: 6) collecting probes of the same type with the abrasion degree higher than a first threshold value; setting a second threshold value as a critical tip diameter allowing the probe to perform measurement, grading and marking the probe with the actual tip diameter lower than the second threshold value according to the obtained abrasion degree of the probe tip, and obtaining a plurality of sets of probe sets with abrasion grades for measuring the characteristic sizes of different size ranges.
Optionally, step 6) further comprises: and judging that the probe with the actual tip diameter higher than the second threshold value is scrapped.
Optionally, a first measurement program is invoked according to the depth of the trench formed on the surface of the sample to be measured: and classifying and marking the probes selected based on the first measurement program according to the wear degrees of the probe tips to obtain a plurality of sets of probe sets with wear levels for measuring grooves with different depth levels.
As described above, the probe damage detection method for an atomic force microscope according to the present invention has the following advantageous effects:
according to the damage detection method for the probe tip, the damage detection method for the probe tip is configured before the same batch of samples to be detected is measured, so that the wear degree of the probe tip can be timely and effectively monitored, the reduction of the measurement precision caused by the probe damage is prevented, and the waste of the machine capacity caused by the influence of unnecessary repeated measurement on the test throughput in the measurement process is avoided.
The probe damage detection method can also mark the damaged needle points based on the abrasion degree of the needle points, and some damaged needle points can be reused in a degradation use mode, so that the maintenance cost of a measurement procedure is saved, and the utilization rate of test consumables is improved. In addition, test parameters are optimized by combining the information of the abrasion degree of the tip of the probe, unnecessary repeated measurement or weight is reduced, and the abrasion rate of the probe is favorably reduced.
Drawings
Fig. 1 is a flowchart of a probe damage detection method for an atomic force microscope according to an embodiment of the present invention.
FIG. 2 shows an initial probe tip image of an atomic force microscope and a schematic thereof.
FIG. 3 shows an example of a chip structure measured with an atomic force microscope probe.
FIG. 4 is a schematic structural diagram of a standard sample in an embodiment of the present invention.
Fig. 5 is a schematic diagram showing a probe tip moving along the surface of the standard sample in step 2) of the probe damage detection method for AFM according to the embodiment of the present invention.
FIG. 6A is a diagram illustrating a tip movement trajectory of a damaged probe tip for measuring a surface topography of a standard sample according to an embodiment of the probe damage detection method for AFM of the present invention; FIG. 6B is an actual tip topography based on a fitting of the tip movement trace of FIG. 6A to a graphical profile of a standard sample.
FIG. 7A shows a tip movement trace obtained by measuring the surface topography of a standard sample with a damaged probe tip according to an AFM probe damage detection method of an embodiment of the present invention; FIG. 7B is an actual tip topography based on a fitting of the tip movement trace of FIG. 7A to a graphical profile of a standard sample.
Fig. 8 shows an example in which step 6) of the probe damage detection method for AFM according to the embodiment of the present invention is classified and marked according to the abrasion degree of the obtained probe tip.
Detailed Description
The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.
As used herein, although the terms "first," "second," "third," etc. may describe various elements, components, regions, layers and/or sections, none of them is limited by these terms. These terms are only used to distinguish one element, component, region, material, layer or section from another element, component, region, material, layer or section.
It should be noted that the drawings provided in the present embodiment are only for illustrating the basic idea of the present invention, and the components related to the present invention are only shown in the drawings rather than drawn according to the number, shape and size of the components in actual implementation, and the type, quantity and proportion of the components in actual implementation may be changed freely, and the layout of the components may be more complicated.
In addition to the main process of chip manufacturing, the defect detection and critical dimension testing of the chip are also essential important processes in the process flow. The atomic force microscope obtains microscopic information of a sample surface mainly by detecting interatomic force between a needle point and a test wafer, and thus can be used for measuring semiconductors or insulators. There are several modes of operation of the AFM, and the common modes of operation are: the contact type, the non-contact type and the tapping type are adopted, because the tapping mode overcomes the adhesion force between the needle point and the sample by providing enough amplitude of the needle point, the needle point is prevented from being clamped on the surface of the sample, so the sample is hardly damaged during scanning, and the advantages of high resolution, clear imaging and the like are achieved.
Although in the tapping mode, the sample surface is knocked by the vibration of the cantilever beam driving the probe tip, the sample surface is less affected by the transverse force, and thus the sample is less worn, but the probe tip can continuously wear in the testing process. The main indicators of the probe tip portion are the radius of curvature of the probe tip and the height of the probe tip, and a small tip diameter and a large tip height will enhance AFM imaging, see initial probe tip image and schematic of the atomic force microscope shown in fig. 2. However, as the probe tip is worn during the test, the tip diameter of the tip increases and/or the tip height decreases, which leads to a decrease in the test accuracy, especially in the case of detecting a fine structure such as a trench or a step that cannot contact the bottom of the sample, resulting in a low resolution, a deviation of the detection result from the actual topography of the sample, and a deterioration in the accuracy and reproducibility of the measurement value.
In order to effectively monitor the abrasion degree and the service life of a probe tip of an atomic force microscope, the invention provides a probe damage detection method for the atomic force microscope, which comprises the following steps:
1) providing a standard sample, wherein a pattern with a characteristic dimension is formed on the surface of the standard sample;
2) selecting a probe and sweeping the standard sample to obtain a track of the probe moving along the surface fluctuation of the standard sample;
3) fitting the moving track of the probe with the graphic profile of the standard sample to obtain the quality level of the probe;
4) and responding to the quality level of the probe, and judging whether to replace the probe for measuring the sample to be measured.
Hereinafter, the probe damage detecting method for an atomic force microscope of the present invention will be described in detail with reference to fig. 1 to 7.
As shown in fig. 1, step 1) is first performed to provide a standard sample, and a pattern with a characteristic dimension is formed on the surface of the standard sample. Specifically, the graphics may include, but are not limited to: at least one of a via, a blind via, a recess, a trench, or a stepped structure having a height difference. In one example, the standard sample may be a chip with a feature pattern formed on the surface, the feature pattern having a nominal feature size, such as the semiconductor chip structure with a trench formed therein shown in fig. 2. In other examples, the pattern may be obtained by performing a photolithography etching process on the surface of a standard sample, such as the pattern 100 shown in fig. 3. The feature size of the pattern is, for example, a line width a in the range of 500nm to 1000 nm.
Then step 2) is carried out, a probe is selected and the standard sample is swept to obtain a track of the undulation movement of the probe along the surface of the standard sample. Specifically, the sample to be measured is a micro structure processed in the same batch, and the step 2) includes: calling a measurement program according to the characteristic graph of the sample to be measured, the key dimension and/or the processing precision range, selecting the type of the probe for measuring the sample to be measured based on the measurement program, and acquiring scanning parameters for measuring the sample to be measured, such as an amplitude set point, a free amplitude and a scanning speed. In one example, the sample to be measured is a trench having a depth, and a first measurement program may be invoked according to the depth of the trench formed on the surface of the sample to be measured: a fine probe of type FIB2-100A will be selected based on the first measurement modality and swept across the standard sample to obtain a trajectory for the probe to follow the surface relief movement of the standard sample. In another example, the sample to be measured is a step structure with a height difference, and a second measurement program can be invoked according to the depth of a trench formed on the surface of the sample to be measured: a coarse probe of type rtesapa will be selected based on the second measurement modality and swept across the standard to obtain a trajectory for the probe to follow the surface undulations of the standard. As an example, a selected probe may be swept through a standard sample (as shown in fig. 4) with a line width a based on the measurement program, and a track of the probe moving along the surface relief of the standard sample, see the track 100' shown in fig. 5, may be obtained. In this embodiment, the feature pattern on the surface of the sample to be tested includes a step structure or a trench, an aspect ratio of the step structure is smaller than 1:1, and an aspect ratio of the trench is smaller than 10: 1.
And 3) fitting the movement track of the probe with the graphic profile of the standard sample to acquire the quality level of the probe. Specifically, step 3) includes: 3-1) acquiring an actual value of the characteristic size of the probe tip based on a fitting curve of the movement track of the probe and the graph outline of the standard sample; 3-2) acquiring the abrasion degree of the probe tip based on the actual value and the reference value of the characteristic size of the probe tip, wherein the characteristic size of the probe tip comprises a tip diameter and a tip height. At step 3-1), based on the fitted curve of the movement locus of the probe and the graph profile of the standard sample, for example, fig. 6A and 7A show tip movement loci 1100a 'and 2100 a' obtained by measuring the surface topography of the standard sample by using the tip of the damage probe, wherein the graph profile of the standard sample is shown; accordingly, FIG. 6B shows an actual tip topography 1100B 'based on the fit of the tip movement trace 1100 a' obtained in FIG. 6A to the graphical profile of the standard sample, and FIG. 7B shows an actual tip topography 2100B 'based on the fit of the tip movement trace 2100 a' of FIG. 7A to the graphical profile of the standard sample. As can be seen from fig. 6B and 7B, the tip diameter and the tip height of the damage probe obtained by fitting are worn to different degrees, the tip height of the damaged tip shown in fig. 7B is not much different from that of the damaged tip shown in fig. 6B, the actual values of the tip heights are respectively reduced by 200nm compared with the reference value, and the damaged tip shown in fig. 7B has a tip diameter of 150nm to 200nm, which is larger than that of the damaged tip shown in fig. 6B.
In this embodiment, at step 3-2), the degree of wear of the probe tip is obtained based on the actual value of the characteristic dimension of the probe tip and the reference value, and is characterized by a ratio of a tip reduction height to a reference height, that is, a difference between the reference height and the actual height of the probe tip is compared with a value of the reference height.
After step 3), continuing to step 4), responding to the quality level of the probe, and judging whether to replace the probe for measuring the sample to be measured. Specifically, step 4) includes: 4-1) setting a first threshold to a tip critical height that allows the probe to perform a measurement; after the step 4-1), the step 4) further comprises the following steps: 4-2) judging that the selected probe is used for measuring the sample to be measured according to the fact that the abrasion degree of the probe is not higher than the first threshold value; or judging to replace the selected probe according to the fact that the abrasion degree of the probe is higher than the first threshold value. The AFM detection technology is applied to detecting patterns formed by micro-processing on a chip, such as a groove formed by etching, a probe tip is adopted to scan the surface of a sample to obtain a phase or three-dimensional image of the surface appearance, the size and the shape of the probe tip directly influence the detection resolution, the abrasion degree of the probe tip is timely and effectively monitored, and the precision and the repeatability of the test can be ensured.
The probe damage detection method further comprises the following steps: after step 4-2) determining to replace the selected probe according to the fact that the wear degree of the probe is higher than the first threshold value, step 5) is executed, another probe of the same model is picked up, and steps 2) to 4) are repeated.
Optionally, after step 5), step 6) may be performed to collect probes of the same type having a wear level higher than the first threshold, set a second threshold as a critical tip diameter allowing the probes to perform measurement, grade and mark probes having tip diameters with actual values lower than the second threshold according to the wear level of the obtained probe tips, and obtain a probe set with several sets of wear levels for measuring feature sizes of different size ranges, wherein each wear level corresponds to a feature size range of the pattern measured by the probe. As an example, a groove is formed on the sample to be tested, the characteristic dimension is the depth of the groove, and a probe of one wear grade in a plurality of wear grades is used for measuring the groove with a corresponding depth level. Specifically, the probes selected based on the first measurement program are classified and marked according to the wear degree of the probe tips, and a plurality of sets of probe sets with wear degrees are obtained for measuring grooves with different depth levels. Fig. 8 shows an example of grading and marking a damaged probe of type FIB2-100A according to step 6) by the wear level of the resulting probe tip, as can be seen from the graph, the probe of each wear grade is used to measure a trench corresponding to a depth level, and as the wear grade of the tip increases, the depth level of the measurement trench decreases, ensuring that the damaged probe used to degrade is in effective contact with and detects the bottom of the trench. Step 6) also comprises the following steps: and judging the probe with the actual tip diameter higher than the second threshold value as being rejected. Further, based on the tip height and tip diameter after the collection probe is worn, the measurement parameters can be optimized. Therefore, the embodiment can not only ensure the testing precision of the effective AFM execution of the probe and the sample surface by timely acquiring the abrasion degree of the probe tip and the line width of the calibrated tip in the measuring process, but also prolong the utilization rate of the probe by marking and grading the damaged probe, and is favorable for prolonging the service life of the tip.
In summary, the probe damage detection method for the atomic force microscope provided by the invention has the following beneficial effects:
according to the invention, the abrasion degree of the probe tip is monitored by introducing the damage detection method of the probe tip before the sample is measured, so that the measurement problem caused by the damage of the probe is prevented, and the waste of the machine capacity caused by the influence on the test throughput due to unnecessary repeated measurement in the measurement process is avoided; in addition, the probe damage detection method can be used for acquiring the abrasion degree of the probe in time, and the probe with lower abrasion degree can be marked and used in a grading way, so that the utilization rate of the AFM probe can be improved, the test parameters can be optimized by combining the abrasion degree information of the tip of the probe tip, unnecessary dosage or weight can be reduced, and the abrasion rate of the probe can be reduced. The probe damage detection method has the advantages of simple process, strong operability and the like.
Therefore, the invention effectively overcomes various defects in the prior art and has high industrial utilization value.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (7)
1. A probe damage detection method for an atomic force microscope is characterized by comprising the following steps: the probe damage detection method comprises the following steps:
1) providing a standard sample, wherein the surface of the standard sample is formed with a characteristic dimension pattern, and the pattern comprises at least one of a groove structure or a step structure with a height difference;
2) selecting a probe and sweeping the standard sample to obtain a track of the probe moving along the surface fluctuation of the standard sample;
3) fitting the moving track of the probe with the graphic profile of the standard sample to obtain the quality level of the probe, wherein the step 3) comprises the following steps:
3-1) acquiring an actual value of the characteristic size of the probe tip based on a fitting curve of the movement track of the probe and the graph outline of the standard sample;
3-2) acquiring the abrasion degree of the probe tip based on the actual value and the reference value of the characteristic dimension of the probe tip, wherein the characteristic dimension of the probe tip comprises the tip diameter and the tip height, and at the step 3-2), acquiring the abrasion degree of the probe tip based on the actual value and the reference value of the characteristic dimension of the probe tip and representing the abrasion degree by the ratio of the tip reduced height to the reference height;
4) in response to the quality level of the probe, determining whether to replace the probe for measuring the sample to be measured, the step 4) including:
4-1) setting a first threshold to a tip critical height that allows the probe to perform a measurement;
4-2) judging to replace the selected probe according to the fact that the abrasion degree of the probe is higher than the first threshold value;
5) picking up another probe of the same model, and repeating the steps 2) to 4);
6) collecting probes of the same type with the abrasion degree higher than a first threshold value; setting a second threshold value as a critical tip diameter allowing the probe to perform measurement, grading and marking the probe with the actual tip diameter lower than the second threshold value according to the obtained abrasion degree of the probe tip, and obtaining a plurality of sets of probe sets with abrasion grades for measuring the characteristic sizes of different size ranges.
2. The method for detecting probe damage according to claim 1, characterized in that: and forming the pattern on the surface of the standard sample by an etching process, wherein the pattern has a line width in the range of 500nm to 1000 nm.
3. The method for detecting probe damage according to claim 1, wherein the step 4) comprises:
4-1) setting a first threshold to a tip critical height that allows the probe to perform a measurement;
4-2) judging that the selected probe is used for measuring the sample to be measured according to the fact that the abrasion degree of the probe is not higher than the first threshold value.
4. The method for detecting probe damage according to claim 1, characterized in that: in step 2), a measurement program is called according to the critical dimension of the feature pattern of the surface of the sample to be measured, a probe is selected based on the measurement program, and the standard sample is swept to obtain the track of the probe moving along the surface of the standard sample in an undulated manner, wherein the sample to be measured is a micro structure processed in the same batch.
5. The method for detecting probe damage according to claim 4, characterized in that: the characteristic pattern of the surface of the sample to be detected comprises a step structure or a groove, the depth-to-width ratio of the step structure is smaller than 1:1, and the depth-to-width ratio of the groove is smaller than 10: 1.
6. The method for detecting probe damage according to claim 1, wherein step 6) further comprises: and judging that the probe with the actual tip diameter higher than the second threshold value is scrapped.
7. The method for detecting probe damage according to claim 1, characterized in that: calling a first measurement program according to the depth of the groove formed on the surface of the sample to be measured: and classifying and marking the probes selected based on the first measurement program according to the wear degrees of the probe tips to obtain a plurality of sets of probe sets with wear levels for measuring grooves with different depth levels.
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| US5565623A (en) * | 1993-09-30 | 1996-10-15 | Aircraft Gear Corporation | Method and means for measuring wear in constant velocity joints |
| JP4218107B2 (en) * | 1999-01-22 | 2009-02-04 | 株式会社島津製作所 | Scanning probe microscope |
| US7578176B2 (en) * | 2006-12-22 | 2009-08-25 | Veeco Metrology, Inc. | Systems and methods for utilizing scanning probe shape characterization |
| CN103542824A (en) * | 2012-07-10 | 2014-01-29 | 苏州工业园区高登威科技有限公司 | Method for checking slide rail assembling systems |
| CN107748811B (en) * | 2017-09-20 | 2018-07-03 | 华中科技大学 | A kind of outline to be measured algorithm for reconstructing after tip wear |
| CN110068707B (en) * | 2018-01-24 | 2021-08-10 | 中国科学院沈阳自动化研究所 | AFM three-dimensional measurement method based on two-dimensional feedback control |
| TWI639846B (en) * | 2018-02-12 | 2018-11-01 | 黃彥凱 | Method of retesting a wafer |
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