CN114750963B - Low-temperature thermal diode anti-icing device - Google Patents
Low-temperature thermal diode anti-icing device Download PDFInfo
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- CN114750963B CN114750963B CN202210677591.0A CN202210677591A CN114750963B CN 114750963 B CN114750963 B CN 114750963B CN 202210677591 A CN202210677591 A CN 202210677591A CN 114750963 B CN114750963 B CN 114750963B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B64—AIRCRAFT; AVIATION; COSMONAUTICS
- B64D—EQUIPMENT FOR FITTING IN OR TO AIRCRAFT; FLIGHT SUITS; PARACHUTES; ARRANGEMENTS OR MOUNTING OF POWER PLANTS OR PROPULSION TRANSMISSIONS IN AIRCRAFT
- B64D15/00—De-icing or preventing icing on exterior surfaces of aircraft
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B64—AIRCRAFT; AVIATION; COSMONAUTICS
- B64D—EQUIPMENT FOR FITTING IN OR TO AIRCRAFT; FLIGHT SUITS; PARACHUTES; ARRANGEMENTS OR MOUNTING OF POWER PLANTS OR PROPULSION TRANSMISSIONS IN AIRCRAFT
- B64D15/00—De-icing or preventing icing on exterior surfaces of aircraft
- B64D15/12—De-icing or preventing icing on exterior surfaces of aircraft by electric heating
Abstract
The invention is suitable for the technical field of anti-icing and deicing, and provides a low-temperature thermal diode anti-icing device which comprises a heating layer, a porous heat conducting layer, an interval bracket and a condensing plate which are sequentially stacked; the heating layer is arranged on the inner surface or the outer surface of the object surface to be anti-iced of the heating layer; the heat exchanger also comprises an evaporation heat exchanger, and the evaporation heat exchanger is immersed in the porous heat conduction layer; the spacing bracket is internally provided with a plurality of channels which are perpendicular to the surface of the porous heat-conducting layer; the heating layer, the porous heat conduction layer, the spacing support, the condensing plate and the evaporation heat exchanger are sealed together. The anti-icing device can accelerate the heat transfer inside and outside the anti-icing device when the local external temperature is low, and slow down the heat transfer inside and outside the anti-icing device when the local temperature is slightly high, thereby achieving the technical effect of autonomous and targeted local heat exchange. The deicing control of the surface subareas of the aircraft is very conveniently and simply realized.
Description
Technical Field
The invention relates to the technical field of deicing prevention, in particular to a low-temperature thermal diode anti-icing device.
Background
Icing is one of the main causes of aircraft flight accidents, and icing on the leading edges of the wings and the empennage of the aircraft can cause serious flight accidents due to increased wing profile resistance, reduced lift force, reduced critical attack angle and deteriorated maneuverability and stability, so that the aircraft is widely concerned and researched by people. According to different energy forms adopted by anti-icing, the system can be divided into a mechanical deicing system, an electric pulse anti-icing system, a liquid anti-icing system, a hot air anti-icing system and an electric heating anti-icing system. The electric heating deicing, hot air deicing and other deicing schemes are widely applied at present. The electric heating scheme is gradually applied to small airplanes and commercial airplanes (Boeing 787) along with the mature process due to the advantages of high energy utilization rate, simple structure and the like.
Due to improper power adaptation of the pneumatic surface thermal anti-icing system, the water film may be frozen again in the process of flowing downstream along the pneumatic surface, and overflow ice is formed. Therefore, the engineering often adopts a method of increasing the thermal protection area and the thermal protection power, which results in a large amount of energy being wasted in the aerodynamic cooling of the wall surface. This energy waste is particularly pronounced in leading edge anti-icing systems that require high temperature anti-icing.
When ships and equipment in cold regions are designed for thermal anti-icing, due to the fact that icing strength is related to wind direction, obvious energy waste can exist when omnidirectional protection is adopted.
In order to reduce the waste of thermal anti-icing energy, zone heating control based on the temperature of the protective surface is an ideal solution, but the problems of complicated sensor and heating control exist.
Disclosure of Invention
In order to solve the defects of the prior art, the invention aims to provide the anti-icing device for the object surface to be anti-iced of the low-temperature thermal diode.
A low-temperature thermal diode anti-icing device is characterized by comprising a heating layer, a porous heat conduction layer, an interval bracket and a condensation plate which are sequentially stacked;
the heating layer is arranged on the inner surface or the outer surface of the object surface to be anti-iced of the heating layer;
the evaporation heat exchange agent is immersed in the porous heat conduction layer;
the spacing bracket is internally provided with a plurality of channels which are perpendicular to the surface of the porous heat-conducting layer;
the distance between the porous heat conduction layer and the condensation plate is within 2000 mu m;
the heating layer, the porous heat conduction layer, the spacing support, the condensing plate and the evaporation heat exchanger are sealed together.
Further, when the heating layer is fixedly arranged on the inner surface of the object to be anti-iced, a heat insulation layer is further arranged on the other surface of the heating layer; when the heating layer is fixedly arranged on the outer surface of the object surface to be anti-iced, the inner surface of the object surface to be anti-iced is also provided with a heat insulation layer.
Further, the porous heat conduction layer is one of super-hydrophilic foam metal, a porous carbon product and hydrophilic fiber fabric.
Further, the spacing support is of a grid or strip structure.
Furthermore, the material of the spacing bracket is polytetrafluoroethylene or memory alloy.
Further, the section of the memory alloy is Y-shaped or V-shaped.
Further, the evaporation heat exchanger is ethanol or a mixture of ethanol and water.
Further, the inner surface of the condensation plate is a smooth super-hydrophobic surface or a smooth super-hydrophilic surface.
Further, the condensing plate has an in-plane thermal conductivity that is lower than an out-of-plane thermal conductivity.
Further, the filling proportion of the evaporation heat exchange agent is 10% -50% of the space surrounded by the heating layer and the condensing plate.
Compared with the prior art, the low-temperature thermal diode anti-icing device at least has the following beneficial effects:
1. by adopting the low-temperature thermal diode anti-icing device, the heat transfer inside and outside the anti-icing device can be accelerated when the local external temperature is low, and the heat transfer inside and outside the anti-icing device can be slowed down when the local temperature is slightly high, so that the technical effect of autonomous and targeted local heat exchange is achieved. The deicing control of the surface subarea of the aircraft is very conveniently and simply realized;
2. for the local area with small temperature difference between the inside and the outside of the low-temperature thermal diode anti-icing device, the heat transfer from the inside of the anti-icing device to the outside is less, the ineffective heat dissipation is reduced, the heating power required by the heating layer is reduced, and the energy consumption can be effectively reduced;
3. according to the invention, the proper distance is reserved between the porous heat conduction layer and the condensation plate by arranging the spacing bracket, so that water drops on the condensation plate can form a liquid bridge, thereby improving the heat exchange efficiency;
4. according to the invention, the spacing support is arranged, so that the effect of autonomous zone control is enhanced;
5. the memory alloy is selected and used, so that the memory alloy can be bent when the working temperature is low, and the distance between the porous heat conduction layer and the condensation plate is reduced, thereby reducing the distance required by liquid drops to reach the heat conduction layer after being condensed on the condensation plate, accelerating the liquid bridge establishment process, and accelerating the heat exchange at low temperature.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments of the present invention or in the description of the prior art will be briefly described below, and it is obvious that the drawings described below are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a low-temperature thermal diode anti-icing device according to embodiment 1 of the present invention.
In the figure: 10-a heat insulation layer, 20-a heating layer, 30-a heat conduction layer, 40-a spacing bracket and 50-a condensation plate.
Detailed Description
The following description provides many different embodiments, or examples, for implementing different features of the invention. The particular examples set forth below are illustrative only and are not intended to be limiting.
Example 1
An anti-icing device for a low-temperature thermal diode is shown in fig. 1 and comprises a heating layer 20, a porous heat conduction layer 30, an interval bracket 40 and a condensation plate 50 which are sequentially arranged in a laminating way;
the inner surface or the outer surface of the heating layer 20 to be anti-icing surface;
further comprises an evaporative heat transfer agent, which is immersed in the porous heat conducting layer 30;
the spacing brackets 40 are internally provided with a plurality of channels which are perpendicular to the surface of the porous heat-conducting layer 30;
the distance between the porous heat conduction layer 30 and the condensation plate 50 is within 2000 μm;
the heating layer 20, the porous heat conducting layer 30, the spacing bracket 40, the condensing plate 50 and the evaporation heat exchanger are sealed together.
In this embodiment, the distance between the porous heat conducting layer and the condensing plate is controlled to build a liquid bridge between the porous heat conducting layer and the condensing plate. Specifically, when the heating layer on the inner surface or the outer surface of the ice-proof object surface is heated under the external low-temperature condition, the evaporation heat exchange agent adsorbed by the porous heat conduction layer due to the capillary action is evaporated or boiled and passes through the spacing bracket to reach the inner surface of the condensation plate; because the temperature of the outer surface of the condensing plate is low, the evaporated heat exchange agent is quickly condensed into liquid drops. On one hand, the liquid drops release heat when being condensed, and the heat is transferred to the outer surface of the condensing plate; more importantly, the liquid drops are gathered to form large liquid drops, a liquid bridge is formed between the porous heat conduction layer and the condensation plate, the porous heat conduction layer and the condensation plate are connected, and heat of the porous heat conduction layer is transferred to the condensation plate through the liquid bridge, so that the outer surface of the condensation plate is prevented from being frozen or the outer surface of the condensation plate is deiced. When the evaporation heat exchange agent is accumulated on the inner surface of the condensing plate and drops as spherical liquid drops, the evaporation heat exchange agent passes through the spacing bracket and is adsorbed by the porous heat conduction layer again, and the circulation is carried out.
Conversely, when the temperature at the end of the cold plate is high, there is no reverse thermal energy transfer because there are fewer droplets on the inner surface of the cold plate and there is limited evaporation of the droplets. This structure is therefore referred to as a "thermal diode".
According to the invention, through the arrangement, the liquid drops condensed on the inner surface of the condensation plate form a liquid bridge between the porous heat conduction layer and the condensation plate to transfer heat, so that the heat transfer of the liquid drops with the size is hardly influenced by the weight of the liquid drops, the problem that the traditional thermal diode is seriously dependent on the gravity of a phase change medium is solved, and the heat-conducting type phase change diode is suitable for preventing and removing ice at any position of the surface of an airplane.
In this embodiment, the object surface to be ice-protected may be a skin of an aircraft such as an airplane, and is used to protect the surface of the skin of the airplane from ice. It will be understood by those skilled in the art that the heating layer may adopt an electric heating structure, a heating film, etc. commonly used in the art, and is not limited to the present invention.
In order to avoid ineffective loss of heat, a heat insulating layer can be arranged below the heat source. When the heating layer 20 is fixedly arranged on the inner surface of the object surface to be anti-iced, the other surface of the heating layer 20 is also provided with a heat insulation layer 10; when the heating layer 20 is fixedly arranged on the outer surface of the object surface to be anti-iced, the inner surface of the object surface to be anti-iced is also provided with a heat insulation layer 10. The selection of the insulating material is well known to those skilled in the art and, for example, a carbon aerogel insulation may be selected, but the selection of the specific insulation material is not a limitation on the present invention as long as the insulation is achieved.
In this embodiment, the porous heat conducting layer 30 can adsorb the evaporation heat exchanger, and has a heat conducting effect. Therefore, the porous heat conduction layer 30 should be made of a base material having good ductility and certain compressibility, and the surface of the porous material is modified for the evaporation heat exchanger to have good wicking action. Preferably, the porous heat conduction layer 30 may be made of one of a super-hydrophilic foam metal, a porous carbon product and a hydrophilic fiber fabric, for example, a copper foam may be selected, the surface of the heating layer 20 or the surface of the object to be protected from ice is coated with a 50-200 mesh copper foam having a vertical thickness of 200 μm, and in order to improve the heat transfer effect, the copper foam may be soaked in a mixed solution of sodium hydroxide and potassium persulfate in advance to form a super-hydrophilic rough micro-nano surface.
In this embodiment, the spacing brackets 40 are disposed between the porous heat conducting layer 30 and the condensing plate 50, and the spacing brackets 40 are in a grid or strip structure, as long as they can provide channels for the evaporation heat transfer agent in the porous heat conducting layer to flow upward and downward, and may be in a structure of multiple rows or multiple columns, or a regular or irregular polygonal grid, for example.
The spacer bracket 40 serves three main functions, firstly, to support the entire device, but this is not so important; second, the distance between the porous heat conducting layer 30 and the cold plate 50 is controlled such that a "liquid bridge" is formed between the porous heat conducting layer and the cold plate; and thirdly, the device is partitioned, each partition runs independently, and the influence between the partitions is small, so that the device is favorable for realizing autonomous partition control.
The height of the spacing bracket is matched with the distance between the porous heat conduction layer and the condensation plate according to the heat conduction requirement. In addition, in order to reduce the thermal resistance, the copper foam is welded between the two adjacent layers in a tin melting mode.
The spacer 40 may be a thermally insensitive material, or may be designed to be a temperature sensitive thermally expansive or cold expansive material structure, or a temperature sensitive memory alloy structure, depending on the engineering requirements. Preferably, the material of the spacer 40 is polytetrafluoroethylene or memory alloy with good weather resistance and hydrophobicity. More preferably, nickel-titanium memory alloy is selected, the interval support loses rigidity at the low temperature of 0 ℃, the interval is reduced, a liquid bridge is formed between the interval support and the heat conducting layer more easily, and heat dissipation is facilitated; the support resumes rigidity at higher temperature time interval more than 30 ℃, the interval grow, heat conduction efficiency reduces, thereby can cooperate low temperature diode anti-icing device's autonomy, when needs prevent deicing, for example near zero degree, distance between porous heat-conducting layer and the condensing panel reduces, the route that evaporation heat transfer agent need be walked shortens, and the liquid drop that condenses on the condensing panel, form "liquid bridge" between easier and the heat-conducting layer, thereby can carry out the heat transfer more rapidly, can improve local heat exchange efficiency.
In this embodiment, as shown in fig. 1, the cross section of the memory alloy is Y-shaped or V-shaped, which has a better partitioning effect and increases the structural stability of the grid during the switching process in the high and low temperature environments.
In this embodiment, the evaporation heat exchanger is ethanol or a mixture of ethanol and water. For example, a mixed solution of 95.63% by weight of ethanol and 4.37% by weight of water can be used as a positive azeotrope to realize efficient boiling heat exchange at high temperature difference.
The inner surface of the condensation plate 50 is a smooth super-hydrophobic surface or a smooth super-hydrophilic surface. The smooth super-hydrophobic surface can enable the liquid drops to form large spherical liquid drops more quickly, and a liquid bridge is built between the porous heat conduction layer and the condensation plate quickly, so that the heat exchange efficiency is high; the smooth super-hydrophilic surface can adsorb larger spherical liquid drops due to good effect of adsorbing the liquid drops, and a liquid bridge built between the porous heat conduction layer and the condensation plate is more stable, so that the heat conduction efficiency is better. In this embodiment, the condensing plate is made of an alloy aluminum plate with a thickness of 0.2mm, and the lower surface of the condensing plate is modified with perfluorosilane to form a super-hydrophobic surface.
Preferably, the condensation plate 50 has an in-plane thermal conductivity that is lower than an out-of-plane thermal conductivity. That is, the heat conductivity coefficient of the horizontal direction in the condensation plate is lower than the heat conductivity coefficient of the vertical direction of the condensation plate, the inner surface and the outer surface, namely, the condensation plate mainly realizes the heat transfer of the spaces at two sides of the condensation plate, and the heat transfer in the condensation is smaller, thereby being more beneficial to realizing the targeted local and autonomous heat exchange.
The filling proportion of the evaporation heat exchange agent is 10-50% of the space surrounded by the heating layer 20 and the condensing plate 50.
The principle of the low-temperature thermal diode anti-icing device is as follows: when the heating layer on the inner surface or the outer surface of the anti-icing object surface is heated under the condition of low temperature outside, the evaporation heat exchange agent adsorbed by the porous heat conduction layer due to the capillary action is evaporated or boiled and penetrates through the spacing bracket to reach the inner surface of the condensation plate; because the temperature of the outer surface of the condensing plate is low, the evaporated heat exchange agent is quickly condensed into liquid drops. On one hand, the liquid drops release heat when being condensed, and the heat is transferred to the outer surface of the condensing plate; more importantly, the liquid drops are gathered to form large liquid drops, a liquid bridge is formed between the porous heat conduction layer and the condensation plate, the porous heat conduction layer and the condensation plate are connected, and heat of the porous heat conduction layer is transferred to the condensation plate through the liquid bridge, so that the outer surface of the condensation plate is prevented from being frozen or the outer surface of the condensation plate is deiced. When the evaporation heat exchange agent is accumulated on the inner surface of the condensation plate and drops as spherical liquid drops, the evaporation heat exchange agent passes through the spacing bracket and is adsorbed by the porous heat conduction layer again, and the circulation is carried out.
If the local external temperature is lower, the heat transfer of the inner surface and the outer surface of the condensation plate is faster in the local range, the condensation speed of the evaporation heat exchange agent on the inner surface of the condensation plate is faster, and the heat transfer of the low-temperature thermal diode anti-icing device on the local area is faster; in other regions with higher temperature, the temperature difference between the inner surface and the outer surface of the condensing plate is smaller, so the heat transfer between the inner surface and the outer surface of the condensing plate is slower, and the condensation speed of the evaporation heat-exchange agent on the inner surface of the condensing plate in the local range is slower and the heat transfer of the low-temperature thermal diode ice-proof device on the local range is slower; therefore, the technical effect of self-directed local heat exchange is achieved.
And for the condition that the temperature difference between the inside and the outside of the low-temperature thermal diode anti-icing device is small, the heat transfer from the inside of the anti-icing device to the outside is less, the ineffective heat dissipation is reduced, the heating power required by the heating layer is reduced, and the energy consumption can be reduced.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. The anti-icing device of the low-temperature thermal diode is characterized by comprising a heating layer (20), a porous heat conduction layer (30), an interval bracket (40) and a condensation plate (50) which are sequentially stacked;
the heating layer (20) is arranged on the inner surface or the outer surface of the object surface to be anti-iced;
the heat transfer layer also comprises an evaporation heat transfer agent which is immersed in the porous heat transfer layer (30);
the spacing brackets (40) are internally provided with a plurality of channels which are perpendicular to the surface of the porous heat-conducting layer (30);
the distance between the porous heat conduction layer (30) and the condensation plate (50) is within 2000 mu m;
the heating layer (20), the porous heat conduction layer (30), the spacing bracket (40), the condensation plate (50) and the evaporation heat exchange agent are sealed together.
2. The low-temperature thermal diode anti-icing device as claimed in claim 1, characterized in that when the heating layer (20) is fixedly arranged on the inner surface of the object surface to be anti-iced, the other surface of the heating layer (20) is further provided with a heat insulation layer (10); when the heating layer (20) is fixedly arranged on the outer surface of the object surface to be anti-iced, the inner surface of the object surface to be anti-iced is also provided with a heat insulation layer (10).
3. A cold thermal diode ice protection device according to claim 1 or 2, wherein said porous heat conductive layer (30) is one of a super hydrophilic foam metal, a porous carbon product, a hydrophilic fabric.
4. The cryothermal diode ice protection device according to claim 1, wherein said spacer support (40) is of a grid or strip structure.
5. The device as claimed in claim 4, wherein the spacer (40) is made of Teflon or memory alloy.
6. The device of claim 5, wherein the cross-section of the memory alloy is Y-shaped or V-shaped.
7. A thermal diode ice protection device as claimed in any one of claims 1,2,4 to 6 wherein said evaporative heat transfer agent is ethanol or a mixture of ethanol and water.
8. The cryothermal diode ice protection device according to claim 6, wherein the inner surface of the cold plate (50) is a smooth superhydrophobic surface or a smooth superhydrophilic surface.
9. The cryothermal diode ice protection device according to claim 6, wherein said cold plate (50) has an in-plane thermal conductivity lower than an out-of-plane thermal conductivity.
10. The device as claimed in claim 6, wherein the filling ratio of the evaporation heat exchange agent is 10% -50% of the space enclosed by the heating layer (20) and the condensing plate (50).
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