CN114750420A - Machining process of heat exchanger pattern plate - Google Patents
Machining process of heat exchanger pattern plate Download PDFInfo
- Publication number
- CN114750420A CN114750420A CN202210296670.7A CN202210296670A CN114750420A CN 114750420 A CN114750420 A CN 114750420A CN 202210296670 A CN202210296670 A CN 202210296670A CN 114750420 A CN114750420 A CN 114750420A
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- Prior art keywords
- pattern plate
- heat exchanger
- blank
- plate blank
- film
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Links
- 238000003754 machining Methods 0.000 title claims description 14
- 239000003292 glue Substances 0.000 claims abstract description 54
- 239000000853 adhesive Substances 0.000 claims abstract description 33
- 230000001070 adhesive effect Effects 0.000 claims abstract description 33
- 238000004073 vulcanization Methods 0.000 claims abstract description 24
- 238000012545 processing Methods 0.000 claims abstract description 21
- 239000011248 coating agent Substances 0.000 claims abstract description 12
- 238000000576 coating method Methods 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 claims description 46
- 238000010438 heat treatment Methods 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 238000005488 sandblasting Methods 0.000 claims description 9
- 238000004364 calculation method Methods 0.000 claims description 5
- 239000002313 adhesive film Substances 0.000 claims 1
- 238000005516 engineering process Methods 0.000 abstract description 12
- 230000007797 corrosion Effects 0.000 abstract description 8
- 238000005260 corrosion Methods 0.000 abstract description 8
- 239000011148 porous material Substances 0.000 description 7
- 238000003825 pressing Methods 0.000 description 7
- 230000001680 brushing effect Effects 0.000 description 6
- 229920002545 silicone oil Polymers 0.000 description 6
- 235000015112 vegetable and seed oil Nutrition 0.000 description 6
- 239000008158 vegetable oil Substances 0.000 description 6
- 238000010521 absorption reaction Methods 0.000 description 5
- 238000009826 distribution Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 230000020169 heat generation Effects 0.000 description 4
- 239000003921 oil Substances 0.000 description 4
- 235000019198 oils Nutrition 0.000 description 4
- 239000011265 semifinished product Substances 0.000 description 4
- 238000004513 sizing Methods 0.000 description 4
- 229920001875 Ebonite Polymers 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 239000010499 rapseed oil Substances 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 229920000298 Cellophane Polymers 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 239000004568 cement Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/18—Heat-exchangers or parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P20/00—Technologies relating to chemical industry
- Y02P20/10—Process efficiency
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- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Oral & Maxillofacial Surgery (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The embodiment of the invention discloses a processing technology of a heat exchanger pattern plate, which comprises the following steps: obtaining a pattern plate blank and coating an adhesive on the surface of the pattern plate blank; arranging a film in a mould, placing a pattern plate blank coated with an adhesive in the mould, and enabling the adhesive to be in contact with the film; and vulcanizing the die with the pattern plate blank to enable the pattern plate blank to pass through the adhesive sheet uniformly to be adhered to obtain the pattern plate of the heat exchanger. In this application, through the mould that is equipped with in advance, will glue the piece and preset in the mould, adopt vulcanization technology will glue a piece integrated into one piece on the surface of card, form the glue film, adopt the processing technology of the heat exchanger card that this application provided, adopt integrated into one piece's mode can improve card surface anticorrosive coating's wholeness, and then avoid corrosive gas to cause the corruption to the card by corrosion resistant layer seam crossing contact card to prolong the life of card.
Description
Technical Field
The invention belongs to the technical field of heat exchanger pattern plate preparation, and particularly relates to a processing technology of a heat exchanger pattern plate.
Background
The heat exchanger is a device for transferring part of heat of hot fluid to cold fluid, and is also called a heat exchanger. The heat exchanger plays an important role in chemical industry, petroleum industry, power industry, food industry and other industrial production.
At present, a pattern plate in a heat exchanger is generally made of a metal material, and a plurality of connecting holes arranged in a row array are formed in the metal pattern plate and used for connecting a heat exchange tube.
At present, the corrosion-resistant layer is bonded on the surface of the pattern plate in the conventional common mode, namely the corrosion-resistant layer is bonded on the surface of the pattern plate through bonding glue, but in the mode, the interface between the corrosion-resistant layers at different positions cannot be sealed in percent, the integrity of the coated pattern plate is poor, and the service life of the pattern plate is further shortened.
Disclosure of Invention
The invention provides a processing technology of a heat exchanger pattern plate, which is used for solving the problems that the integrity of the pattern plate which is coated with a corrosion-resistant layer in an adhering mode is poor in the prior art, and the service life of the pattern plate is further shortened.
In order to solve the technical problem, the processing technology of the heat exchanger pattern plate disclosed by the embodiment of the invention comprises the following steps:
obtaining a pattern plate blank and coating an adhesive on the surface of the pattern plate blank;
arranging a film in a mould, placing a pattern plate blank coated with an adhesive in the mould, and enabling the adhesive to be in contact with the film;
and vulcanizing the die with the pattern plate blank to enable the pattern plate blank to pass through the adhesive sheet uniformly to be adhered to obtain the pattern plate of the heat exchanger.
Optionally, the step of obtaining the card blank includes:
designing the structure of the pattern plate blank based on the internal structure of the heat exchanger;
and obtaining a blank, and machining the blank according to the structure of the pattern plate blank to obtain the pattern plate blank.
Optionally, before the step of arranging the film in the mold, the processing process further includes:
and manufacturing a die matched with the pattern plate blank based on the structure of the pattern plate blank, wherein the die is designed without a middle die.
Optionally, before the step of arranging the film in the mold, the processing process further includes:
calculating the weight of the glue used based on the external surface area of the pattern plate blank and the thickness of the film on the surface of the pattern plate of the heat exchanger, and determining the weight of the glue block based on the process requirement and the weight of the glue used;
and extruding the rubber block to obtain the rubber sheet.
Optionally, the step is based on the outer surface area of the card blank and the film thickness of the card surface of the heat exchanger, and the calculation method includes:
a first weight: the upper surface area of the pattern plate blank is multiplied by the thickness of the rubber layer on the upper surface of the heat exchanger pattern plate;
and (3) a second weight: the lower surface area of the pattern plate blank is multiplied by the thickness of the glue layer on the lower surface of the heat exchanger pattern plate;
and a third weight: the surface area of the side wall of the hole of the pattern plate blank is multiplied by the thickness of the glue layer in the hole of the pattern plate of the heat exchanger.
Optionally, in the step of determining the weight of the rubber block based on the process requirement and the weight of the rubber, the calculation method of the weight of the rubber block comprises the following steps:
the weight of the gum block is equal to the weight of the gum used x 1.14.
Optionally, the step of applying an adhesive on the surface of the card blank comprises:
performing sand blasting treatment on the surface of the pattern plate blank to enable the surface smoothness of the pattern plate blank to reach Sa2.5 grade;
and coating an adhesive on the blank of the pattern board after the sand blasting treatment.
Optionally, the step of vulcanizing the mold with the pattern plate blank includes:
placing the mould with the pattern plate blank on a heating platform for hot mould treatment;
pressurizing and deflating the mould subjected to the hot film treatment;
carrying out positive vulcanization point treatment on the pattern plate blank in the mold after foaming and deflation;
and (4) unloading the mold after the positive vulcanization point treatment to obtain the heat exchanger pattern plate.
Optionally, the step of placing the mold with the pattern plate blank on a heating platform for hot mold treatment, wherein the heating temperature range of the heating platform is as follows: 100-170 ℃.
Optionally, before the step of arranging the film in the mold, the processing process further includes:
and carrying out anti-sticking treatment on the inner surface of the mold.
The embodiment of the invention discloses a processing technology of a heat exchanger pattern plate, which comprises the following steps: obtaining a pattern plate blank and coating an adhesive on the surface of the pattern plate blank; arranging a film in a mould, placing a pattern plate blank coated with an adhesive in the mould, and enabling the adhesive to be in contact with the film; and vulcanizing the die with the pattern plate blank to enable the pattern plate blank to pass through the adhesive sheet uniformly to be adhered to obtain the pattern plate of the heat exchanger. In this application, through the mould that is equipped with in advance, will glue the piece and preset in the mould, adopt vulcanization technology will glue a piece integrated into one piece on the surface of card, form the glue film, adopt the processing technology of the heat exchanger card that this application provided, adopt integrated into one piece's mode can improve card surface anticorrosive coating's wholeness, and then avoid corrosive gas by corrosion resistant layer seam crossing contact card to the life of extension card.
Drawings
Fig. 1 is a flowchart of a processing process of a heat exchanger tube sheet provided in this embodiment.
Detailed Description
The invention will be described in further detail with reference to the drawings and specific embodiments.
Referring to fig. 1, a flow chart of a processing process of a heat exchanger card according to the present embodiment is shown.
As shown in fig. 1, a process for processing a heat exchanger tube sheet according to an embodiment of the present invention includes: step S101-step S103.
S101, obtaining a pattern plate blank and coating an adhesive on the surface of the pattern plate blank.
In this exemplary embodiment, the pattern blank may be designed according to the size and structure of the heat exchanger to which the pattern blank is applied, and a machining drawing or a machining model is formed, and the pattern blank is manufactured by machining according to the machining drawing, for example, a 512 pattern plate, where the 512 pattern plate is characterized by an increased diameter and an increased skeleton thickness, and is capable of completing the heat exchange amount of a single heat exchanger.
Basic parameters of the 512-flower plate are as follows: thickness of the framework: 85 mm; framework and product external diameter: 1760 mm; the number of holes: 512; sealing hole diameter: 42.7 mm; height of the sealing hole: 40 mm; diameter of lower pipe hole: 39 mm; lower tube hole height: pore diameter of 59mm framework: 51; the upper surface and the lower surface of the pattern plate are thick: 7 mm; the screw hole II is deep: 12 mm; screw hole diameter: 23 adopt a small-diameter multi-bolt structure.
In the present exemplary embodiment, the above-described process of applying the adhesive to the surface of the card blank includes the following steps a to E. The method comprises the following specific steps:
A. and after the steel skeleton size and the positions of the holes are inspected to be qualified, performing sand blasting treatment, wherein the sand blasting effect requirement reaches Sa2.5 grade. The surface can not have rusty spot, and the metal is required to be completely exposed and has certain roughness.
B. The skeleton after sand blasting is required to be kept dry, sand and floating dust on the surface are cleaned, and the skeleton is cleaned by gasoline. And brushing the red glue for the first time after drying to prevent rust return. The sandblasted skeleton must be finished within 2 hours of treatment.
C. And after the first time of glue paste is dried, brushing the red glue paste twice. When brushing, the brush is required to be brushed completely in the hole and on the surface, and no adhesive cement can be accumulated in the hole. The interval between two brushing times is at least 1.5 hours.
D. And (3) coating red glue paste on one surface of each film twice, wherein the red glue paste is required to be uniformly brushed, and the interval between the brushing of the two times is at least 1.5 hours.
E. All the frames and films after being coated with the paint can be used after being parked for at least 4 hours.
And S102, arranging a film in a mould, placing the pattern plate blank coated with the adhesive in the mould, and enabling the adhesive to be in contact with the film.
In this exemplary embodiment, the mold may be configured based on the structure and size of the card, or a prepared mold may be selected, for example, when a 512 card is prepared for the second time, a mold configured when a 512 card is prepared for the first time may be selected, and the obtaining manner of the mold is not limited in this application.
In this exemplary embodiment, taking 512 flower plates as an example, the mold adapted to 512 flower plates has the following characteristics:
1. the mold adopts a design without a middle mold, and the outer edge of the framework is exposed.
2. The outer diameter of the upper die and the lower die is cut and the slope is matched (the die and the outer edge of the framework).
3. The framework requires the turning of the outer diameter to complete the trimming matching; the locating hole is used for locating the center of the narrow rib.
In order to better perform glue layer forming on the side wall of the hole of the 512-pattern plate, pins are prepared in advance, the same number of pins are selected according to the number of the 512-pattern plate holes, and the outer diameter of each pin is set according to the inner diameter of each hole of the 512-pattern plate and the thickness of the corrosion-resistant layer on the inner wall of each hole. After the setting is finished, in order to use the pins conveniently, silicone oil can be sprayed on the side walls of the big pin and the straight pin, and the side walls are wrapped with cellophane for later use.
It should be noted that the semi-finished product must be used within 8 hours after being prepared, and should be prepared again after being expired.
In the embodiment of the present invention, the film may adopt a filtered a308 size, and the thickness of the front film is controlled to be between 2mm and 4 mm. The thickness of the bottom surface film is controlled to be 8.5-9.5 mm. The film after being discharged is required to be compact and flat. The film can be processed by a precise pre-forming machine, the diameter is controlled to be about 45mm, and the weight is 100 +/-2 g. The sizing material was a filtered a308 sizing material.
The glue loading mode of the film comprises steps S1021-S1024. The method comprises the following specific steps:
and S1021, attaching the bottom surface of the frame to the surface coated with the red glue paste by using a bottom surface film, removing the excessive glue edge of the outer circle after the attachment is finished, and then removing a square piece of about 70 multiplied by 70(mm) below the large-head pin, wherein the square piece is left for later use.
And S1022, placing the rubber blocks from the front side, and replacing the rubber blocks which are too large and too small.
And S1023, adopting a 2-4 mm prepared film on the front surface, attaching one surface coated with red glue paste to the framework, removing the part outside the pin area after paving, and uniformly placing 70 x 70 square pieces dug down from the bottom surface on the outer edge of the framework.
And S1024, cutting two adhesive tapes with the width of 100mm and the length equal to that of the cross rib from the prepared adhesive tape, wherein one surface coated with the adhesive cement is opposite to the framework and is respectively lapped on the two ribs of the cross rib.
And S103, vulcanizing the die with the pattern plate blank to enable the pattern plate blank to pass through the adhesive sheet uniformly adhered by the adhesive to obtain the pattern plate of the heat exchanger.
In the present exemplary embodiment, the process of the above-described vulcanization treatment may include steps S1031 to S1036:
step S1031, hot die: when the production is discontinuous, the time is started when the temperature of the flat plate is raised to 135 ℃ (when the temperature of hot oil is raised to 135 ℃), and the flat plate is heated for 2 hours (mold cooling).
Step S1032, preparing a semi-finished product: the adhesive is coated on the pattern plate with other specifications. Wherein, the specification of the film is as follows: the thickness of the bottom sheet is 8.5 mm plus or minus 0.5 mm; the thickness of the upper piece is 3 plus or minus 0.5 mm; gluing blocks: 100 +/-2 g; the bottom plate of about 70 x 70mm is required to be dug out from the large pin part at the bottom of the half-finished product of the pattern plate and is placed on the upper surface of the pattern plate. The big pin and the small pin require the upper die to be placed from front to bottom and wrapped by cellophane.
Step S1033, die filling: the locating pins are required to be aligned when the semi-finished product is loaded. When the mold is closed, the marks of the upper mold and the lower mold of the mold are required to be aligned with the marks on the pattern plate. After the mould is closed, the mould is pressed on the flat plate, the distance between the large surface in the upper mould and the semi-finished product is about 10mm, and then the movable cushion block and the gasket (the gasket is divided into 3 specifications, and the placing method is as follows) are placed.
Step S1034, pressurizing and deflating: referring to table 1, table 1 shows a specific operation flow of the pressurizing and deflating.
| The operation steps | Continuous timing (minutes) | Remarks to note |
| Prepressing (to facilitate the release of the movable block) | Non-timing | |
| (Place 9mm gasket and corresponding center gasket) mold closing | 0 | |
| (put 7mm gasket and correspond to central gasket) and suppress 5Mpa | 5 | Deflating for one time |
| Pressing 8Mpa (placing 4mm gasket and corresponding central gasket) | 8 | Deflating once |
| Is pressed to 10MPa | 11 | Deflating once |
| Pressure relief gasket taking device | 16 | Deflating once |
| Is pressed to 12MPa | 19 | Deflating once |
| Is pressed to 15MPa | 22 | Deflating three times |
| Is pressed to 17MPa | 25 | Deflating three times |
TABLE 1
It should be noted that: the total time of the pressure bleed during vulcanization does not in principle exceed 30 minutes.
Step s1035. positive vulcanization point: 150 ℃ for 4 hours, and the time was counted from the completion of the pressing.
Step S1036, demolding: when unloading the mould, the mould puller is required to be completely placed, and the mould puller is punched for multiple times under low pressure and carefully operated to prevent the framework or the mould from deforming.
In this example embodiment, in the card one shot forming technology that this application provided, through the mould that is equipped with in advance, will glue the piece and preset in the mould, adopt vulcanization technology will glue piece integrated into one piece on the surface of card, form the glue film, adopt the processing technology of the heat exchanger card that this application provided, adopt integrated into one piece's mode can improve the wholeness of card surface anticorrosive coating, and then avoid corrosive gas to contact the card by corrosion-resistant layer seam crossing to the life of extension card.
In one embodiment, the step of obtaining a card blank comprises:
designing the structure of the pattern plate blank based on the internal structure of the heat exchanger;
and obtaining a blank, and machining the blank according to the structure of the pattern plate blank to obtain the pattern plate blank.
Specifically, through the structure and the heat transfer demand of heat exchanger, can the design of pertinence and the card of heat exchanger adaptation, can realize the customization production, improve the convenience of this application technical scheme in the in-service use scene.
In one embodiment, the processing further comprises, before the step of disposing the film in the mold:
and manufacturing a die matched with the pattern plate blank based on the structure of the pattern plate blank, wherein the die is designed without a middle die.
Specifically, the steps can be based on the customized production of the pattern plate, the mold is customized, the size of the mold can be defined according to the size of the pattern plate, and specifically, the diameter of the pattern plate plus 2 times of the thickness of the glue layer on the side wall of the pattern plate is equal to the inner diameter of the mold. The inner diameter of the die can be designed in the above manner, and then the pins are correspondingly installed on the die through the positions of the holes of the pattern plate, and then the outer diameter of the pins corresponding to the current position holes is set based on the positions of the holes of the pattern plate and the diameter of the current position holes. Based on the mode, the preparation mold can be customized. Therefore, the shipping scene of the application is not limited to the existing pattern plate, and can be shipped in the processing process of the customized pattern plate.
In one embodiment, the processing further comprises, before the step of disposing the film in the mold:
and calculating the weight of the glue based on the external surface area of the card blank and the thickness of the film on the surface of the heat exchanger card, and determining the weight of the glue block based on the process requirement and the weight of the glue.
And extruding the rubber block to obtain the rubber sheet.
Based on the outer surface area of the pattern plate blank and the thickness of the film on the surface of the pattern plate of the heat exchanger, the calculation method comprises the following steps:
a first weight: the upper surface area of the pattern plate blank is multiplied by the thickness of the rubber layer on the upper surface of the heat exchanger pattern plate.
And (3) a second weight: the lower surface area of the pattern plate blank is multiplied by the thickness of the glue layer on the lower surface of the heat exchanger pattern plate.
And a third weight: the surface area of the side wall of the hole of the pattern plate blank is multiplied by the thickness of the glue layer in the hole of the pattern plate of the heat exchanger.
The method comprises the following steps of determining the weight of the rubber block based on the process requirements and the weight of the used rubber, wherein the calculation method of the weight of the rubber block comprises the following steps:
the weight of the gum block is equal to the weight of the gum used x 1.14.
In the present exemplary embodiment, the method for calculating the weight of the rubber block is described in detail by taking a 512-card as an example:
calculating the amount of the sizing material:
some basic parameters: the specific weight of the sizing material is as follows: 1.35.
upper surface: 1.762 × 3.142 × 7 × 1.35/4 ═ 23 kg.
Deduction of the well: 0.04272 × 3.142 × 7 × 1.35/4 ═ 6.9 kg.
23-6.9-16.1 kg on S.
Lower surface: 0.0392 × 3.142 × 7 × 1.35 × 512/4 ═ 5.8 kg.
23-5.8-17.2 kg under S.
The upper part of the hole: (0.0512-0.04272) × 3.142 × 33 × 1.35 × 512/4 — 13.9 kg.
The lower part of the hole: (0.0512-0.0392) × 3.142 × 59 × 1.35 × 512/4 ═ 31.1 kg.
Sealing ring: about 0.4 kg.
S is also 13.9+31.1+0.4 kg-45.4 kg.
Total amount of gum used: total S16.1 +17.2+ 45.4-78.7 kg.
After 10% of the residual gum amount: and S is 86.6 kg.
After 15% of the residual gum amount: and S is 90.5 kg.
And (3) actual process chip production accounting:
bottom large sheet: 1.762 × 3.142 × 8.5 × 1.35/4 ═ 27.9 kg.
The upper large sheet: 1.62 × 3.142 × 4 × 1.35/4 equals 10.9 kg.
The total glue consumption of the glue blocks is as follows: 86.6-27.9-10.9 ═ 47.8 kg.
The glue consumption of each glue block is as follows: 47.8 kg/512 ═ 93.4 g.
If the air exhaust in the hole is considered, a larger glue consumption (increased by 5%) and a weighing error (increased by 2%) are required.
93.4 × 1.07 ═ 99.9 g.
Actual glue consumption: 100 grams per slab.
And (3) calculating the actual total glue consumption: 27.9+10.9+51.2 ═ 90 kg.
The actual glue consumption is excessive: 90/78.7 ═ 1.14; the residual gum amount is about 14%.
It can be considered that: 10% of the residual glue is used for overcoming small-range flowing and pressure maintaining, and 4% of the residual glue is used for reinforcing air exhaust and partially overcoming various errors and air exhaust in holes.
In one embodiment, the step of applying an adhesive to a surface of the card blank comprises:
and carrying out sand blasting treatment on the surface of the pattern plate blank so as to enable the surface finish of the pattern plate blank to reach Sa2.5 grade.
And (3) coating an adhesive on the blank of the pattern plate after the sand blasting treatment.
By adopting the mode, the bonding strength between the adhesive and the surface of the pattern plate can be effectively improved.
In one embodiment, the step of vulcanizing the mold with the pattern plate blank comprises the following steps:
and placing the die with the pattern plate blank on a heating platform for hot die processing.
And (5) performing pressurizing and air-releasing treatment on the mould subjected to the hot film treatment.
And carrying out positive vulcanization point treatment on the pattern plate blank in the mold after being subjected to air bleeding.
And (4) unloading the mould after the positive vulcanization point treatment to obtain the heat exchanger pattern plate.
In this example embodiment, the heat absorption of the carcass, the heat generated by vulcanization and the heat absorption of the compound itself need to be pre-calculated:
calculating the heat absorption capacity and the heat generation capacity of the sulfur: weight of the framework: 900 Kg; skeleton specific heat capacity: 0.12cal/g. ° c; and (3) vulcanization heat generation of the hard rubber: 300 Kcal/Kg; specific heat of hard rubber: 0.5KCal/Kg. ℃; glue consumption of an actual product: 80 Kg; the heat generation of the hard rubber during vulcanization is 300 multiplied by 80 which is 24000 Kal; temperature rise of the framework: assuming that all generated heat is used for skeleton heating, delta t is 24000/900 multiplied by 0.12 is 222 ℃; if the temperature is raised after 150 ℃ is considered, half of the heat generated by the compound is carried away from the plate. 900 × 0.12 × 130 ═ 14040Kal, at which time the framework temperature rise was: (24000-14040)/2X 900X 0.12-46 ℃; calculating the heat absorption capacity of the rubber material: calculating endotherm (30 deg.C, 160 deg.C) 80 × 0.5 × 30 ═ 1200Kcal at a temperature higher than 130 deg.C; (9960-1200)/2X 900X 0.12-40 ℃; if one considers that the actual compound is filled with a large amount of fillers and other components, the total heat generation becomes: 80 × 150/250 ═ 48 Kg; the calorific value is 300 × 48 14400 Kcal; then the framework temperature rise value at this time is: Δ t 14400/900 × 0.12 ═ 133 ℃.
The temperature rise will then be 17 ℃ below the vulcanization temperature but just above the vulcanization activation temperature. The heat absorption of the rubber and the small heat change are not counted, the vulcanization is just completed and is slightly weak at the moment, but the framework heat shortage part is completely transferred by the flat plate, and the vulcanization degree is slightly lower (compared with the prior pattern plate).
In one specific embodiment, the step of placing the mould with the pattern plate blank on a heating platform for hot mould processing comprises the following steps: 100 ℃ and 170 ℃.
In one embodiment, before the step of disposing the film in the mold, the process further comprises:
and carrying out anti-sticking treatment on the inner surface of the mold.
In the present exemplary embodiment, when the mold is completed by a new mold, the mold should be subjected to the anti-sticking treatment before the first mold test. The cleaned molds were preheated to about 80 ℃ on a flat plate. The vegetable oil is uniformly coated on the surfaces of the upper die and the lower die of the die respectively, and the pin is not brushed because the pin is electroplated. After brushing, the mould is preheated to 160 ℃ on a flat plate, and heated for about 4 hours, so that the oil film is fully cured, and the mould is prevented from being washed away and stuck during pressing.
In actual operation, the oil film is not completely solidified and only half solidified due to short heat dissipation and preheating time, but the first die is small in die sticking risk, and vulcanization is directly carried out without sticking the film. The second die and the third die are respectively coated with vegetable oil and are fully cured, so that the demolding effect is good. Later, each mould is only sprayed with silicone oil, and is not coated with vegetable oil any more, so that the demoulding condition is good. After 15 moulds are vulcanized, the coated vegetable oil is completely stuck off, but a compact oxide layer is formed on the surface of the mould, and the mould can be smoothly demoulded only by silicone oil.
Example 2 (Experimental example)
In the actual trial-manufacturing process, parameters such as the model of the gasket and the time of pressurizing and deflating can be adjusted, and the parameters of the vulcanization process are adjusted by observing the actual condition of the surface glue flow of the pattern plate, specifically:
taking a 512-pattern board as an example, in the actual trial production process, the pressurizing and air releasing process is adjusted according to the glue distribution and process observation of the upper and lower surfaces, and the change process is as follows:
1. there is a problem that the lower surface is thin
The basic idea is to reduce the pressing amount of the framework in the early stage and complete the air exhaust in the hole by using the harder time of the glue in the early stage.
After modification, the following steps are carried out:
it should be noted that, in the above-mentioned pressurizing process, the total pressurizing and air-bleeding time does not exceed 30 minutes in principle.
It should be noted that: in the actual die test, the gasket type is changed in order to gradually finish the gasket taking process. The gasket is 2mm thick, and the thickness adjusting process is completed by adding the quantity. A7 mm spacer is added to the central spacer to compensate for the thickness difference of the rubber lining layer, and three 2mm thick spacers are added. The edges are three 2mm thick shims per location.
2. After the framework is normal, the lower surface is too thin due to the fact that the gasket is taken out after the framework is pushed, and the pressing and air releasing process is readjusted, so that the upper surface and the lower surface can have normal thickness. The adjusted process is as follows:
it should be noted that, in the above-mentioned inflation and deflation process, the total inflation and deflation time does not exceed 30 minutes in principle.
It should be noted that: the process is a pressing process without a pre-gasket, the mold is closed directly to 5Mpa, after 1 minute, the mold is pressed directly to 6Mpa, the middle time is deflation, and then the gaskets are respectively taken at 6Mpa, 8Mpa and 10Mpa, and all the gaskets are taken up to 10 Mpa. The three times of deflation injected is essentially continuous deflation over 3 minutes.
And (3) test results:
in the whole process, few bubbles exist in the holes, 40 bubbles exist in the front stage, the number of the bubbles in the holes is not more than 10, mainly because two blocks have upper and lower bubbles due to the problem caused by serious pressure leakage of the middle flat plate, and the bubbles also appear in the middle of the flat plate fault. When the rape oil is coated, the first three moulds are coated with the rape oil with each consistency, and the rape oil is solidified, so that the demoulding effect is good. In the subsequent production, the mould is not coated with vegetable oil any more, and the formed oil film and the silicone oil are utilized to carry out demoulding operation, so that the effect is good. After about 15 pieces of vegetable oil films are completely stuck, and normal production is carried out. Meanwhile, because the silicone oil is not sprayed completely, 3 slightly-adhered dies are formed, and after adhesive glue is cleaned, the problem is solved by carefully spraying the silicone oil.
The overall specification and size of the pattern plate are adjustable, the pore size distribution is good after the actual measurement of the caliper in the pores, most of the pore size distribution is concentrated on 42.8, the pore size distribution does not exceed 5 pores and reaches 43, and the pore size distribution is also caused by a slight ellipse. The smallest aperture to 42.55 also presents an ellipse problem and is also small in number. The total thickness of the edges of the pattern plates is 97.5-98.5, the thickness of the edges of the upper surface is about 6.3, the thickness of the lower surface is about 6, the central parts of all the pattern plates are thicker, and the glue thickness is about 7.4. After pressure adjustment, the edge thickness is about 98-98.5, but there is an exception, if the mold-molding time is longer, the glue is preheated more, and the edge thickness can be locally thinned to 97.6.
The vulcanized hardness of the pattern plate is 72 Shore D at the edge and 78 Shore D at the center, the overall reaction is good, and the slightly lower edge hardness is favorable for reducing the aging and cracking of the edge. The framework is thick, so that the vulcanization time is properly prolonged, the positive vulcanization timing is 4 hours after the pressurization and deflation are finished, the vulcanization time is further prolonged by 15 minutes, and the hardness is not obviously improved.
Generally, the mold is successful, the worried unsmooth air exhaust in the hole does not occur, and the problem is effectively solved through glue amount control and step pressing. In addition, the upper and lower surfaces are vented significantly better than previous molds with a middle sleeve.
It should be noted that the above-described embodiments are only some of the claimed embodiments, and not all of the claimed embodiments. All other embodiments, which can be derived by one of ordinary skill in the art from the embodiments in the application without any creative effort, shall fall within the scope of protection of the application. In the present specification, each embodiment is described with emphasis on differences from other embodiments, and the same and similar parts between the embodiments may be referred to each other.
Claims (10)
1. The machining process of the heat exchanger pattern plate is characterized by comprising the following steps of:
obtaining a pattern plate blank and coating an adhesive on the surface of the pattern plate blank;
arranging a film in a mould, placing a pattern plate blank coated with an adhesive in the mould, and enabling the adhesive to be in contact with the film;
and vulcanizing the die with the pattern plate blank to enable the pattern plate blank to pass through the adhesive film uniformly adhered by the adhesive, so as to obtain the pattern plate of the heat exchanger.
2. The process for machining a heat exchanger faceplate according to claim 1, wherein the step of obtaining a faceplate blank comprises:
designing the structure of the pattern plate blank based on the internal structure of the heat exchanger;
and obtaining a blank, and machining the blank according to the structure of the pattern plate blank to obtain the pattern plate blank.
3. The process of claim 2, wherein before the step of disposing the film in the mold, the process further comprises:
and manufacturing a die matched with the pattern plate blank based on the structure of the pattern plate blank, wherein the die is designed without a middle die.
4. The process of claim 1, wherein before the step of disposing the film in the mold, the process further comprises:
calculating the weight of glue used based on the external surface area of the pattern plate blank and the thickness of the film on the surface of the pattern plate of the heat exchanger, and determining the weight of a glue block based on the process requirement and the weight of the glue used;
and extruding the rubber block to obtain the rubber sheet.
5. The process for machining the heat exchanger card according to claim 4, wherein the step of calculating is based on the outer surface area of the card blank and the film thickness of the surface of the heat exchanger card, and comprises the following steps:
a first weight: the upper surface area of the pattern plate blank is multiplied by the thickness of the rubber layer on the upper surface of the heat exchanger pattern plate;
and (3) a second weight: the lower surface area of the pattern plate blank is multiplied by the thickness of the glue layer on the lower surface of the heat exchanger pattern plate;
and a third weight: the surface area of the side wall of the hole of the pattern plate blank is multiplied by the thickness of the glue layer in the hole of the pattern plate of the heat exchanger.
6. The process for machining the heat exchanger pattern plate according to claim 4, wherein the step of determining the weight of the rubber block based on the process requirement and the weight of the rubber is that the calculation method for the weight of the rubber block is as follows:
the weight of the gum block is equal to the weight of the used gum multiplied by 1.14.
7. The process of claim 1, wherein the step of applying an adhesive to the surface of the faceplate blank comprises:
performing sand blasting treatment on the surface of the pattern plate blank to enable the surface smoothness of the pattern plate blank to reach Sa2.5 grade;
and coating an adhesive on the blank of the pattern board after the sand blasting treatment.
8. The process for machining a heat exchanger pattern plate according to claim 1, wherein the step of vulcanizing the mold with the pattern plate blank placed thereon comprises:
placing the mould with the pattern plate blank on a heating platform for hot mould treatment;
carrying out pressurizing and air-releasing treatment on the mould subjected to the hot film treatment;
carrying out positive vulcanization point treatment on the pattern plate blank in the pressed and deflated mold;
and (4) unloading the mould after the positive vulcanization point treatment to obtain the heat exchanger pattern plate.
9. The process for processing the heat exchanger pattern plate according to claim 8, wherein the step of placing the mold with the pattern plate blank on a heating platform for hot mold processing is carried out, and the heating temperature range of the heating platform is as follows: 100 ℃ and 170 ℃.
10. The process of claim 1, wherein before the step of disposing the film in the mold, the process further comprises:
and carrying out anti-sticking treatment on the inner surface of the mold.
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| CN110538420A (en) * | 2019-08-12 | 2019-12-06 | 天津市凯鑫金属制品有限公司 | Metal dumbbell anti-corrosion rubber coating process |
| CN112008921A (en) * | 2019-05-28 | 2020-12-01 | 杭州华通精工器件有限公司 | Vulcanizing device and rubber-coated screw production method based on vulcanizing device |
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| US6074717A (en) * | 1997-07-29 | 2000-06-13 | Dayco Products, Inc. | Flexible hose having an aluminum barrier layer to prevent ingestion of oxygen |
| CN101817941A (en) * | 2010-05-07 | 2010-09-01 | 山东大学 | Composite material inlaying abrasion-resistant alloy in rubber and preparation method thereof |
| CN106488796A (en) * | 2014-07-21 | 2017-03-08 | 希乐克公司 | Processing biomass |
| CN106949756A (en) * | 2017-04-28 | 2017-07-14 | 上海金由氟材料股份有限公司 | A kind of PTFE heat exchangers that card is coated with PTFE |
| CN112008921A (en) * | 2019-05-28 | 2020-12-01 | 杭州华通精工器件有限公司 | Vulcanizing device and rubber-coated screw production method based on vulcanizing device |
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