CN114748061A - Sensor base and manufacturing method thereof - Google Patents

Abstract

A sensor base comprises a main body part, a battery accommodating part and a buckling part, wherein the battery accommodating part and the buckling part are positioned on two opposite sides of the main body part; the main body part is provided with a sensor probe mounting part and an emitter conduction part; the sensor base is provided with a battery and a conduction plate, the battery is located inside the battery accommodating part, and the conduction plate is located inside the battery accommodating part and the main body part. According to the sensor base, the battery and the conduction plate are packaged in the sensor base, so that the battery can be used as a consumable, the battery with relatively small capacity and volume is selected, the volume of the dynamic blood glucose monitoring device is reduced, a user does not need to replace the battery, and the use experience is enhanced; the battery and the conduction plate are packaged, so that the waterproof structure is simplified, the waterproof performance grade is enhanced, and the size of the dynamic blood sugar monitoring device is further reduced.

Description

Sensor base and manufacturing method thereof

Technical Field

The invention relates to the field of dynamic blood glucose monitoring sensors, in particular to a sensor base and a manufacturing method of the sensor base.

Background

The dynamic blood glucose monitoring system (RGMS) is a new type of continuous dynamic blood glucose monitoring system that has been in clinical use in recent years and is connected to a probe, such as a needle, for placement in the subcutaneous tissue. The diameter of the probe is very small, and the patient has no obvious pain and discomfort when the probe is placed in the body. The instrument receives an electric signal reflecting blood sugar change from the probe at a certain time interval, and converts the average value of the electric signals collected for a plurality of times into the blood sugar value to be stored. Hundreds of blood glucose values can be recorded daily. The dynamic blood glucose monitor can also simultaneously store the time of eating, moving, taking medicine and the like. Therefore, the patient can not suffer from acupuncture every day, and the blood glucose monitoring system can provide a daily blood glucose graph, a multi-day blood glucose graph fluctuation trend analysis and a summary of daily blood glucose data, and is a new breakthrough of blood glucose detection.

In order to reduce user's use cost, developments blood sugar monitoring devices generally regard the sensor as the consumptive material, the transmitter lasts the use, wear in the human body after assembling sensor and transmitter, be used for transmitting blood sugar data, the subassembly of sensor and transmitter can make the whole volume of developments blood sugar monitoring devices great, especially thickness is thicker, take place to collide with, rub with external object easily after wearing, thereby make the sensor probe wear the position human tissue relatively and produce the displacement, light then arouse inflammation and influence the accuracy of blood sugar data, make whole sensor drop heavy. Therefore, it is necessary to design a sensor base to reduce the size and thickness of the dynamic blood glucose monitoring device, so as to reduce the influence of physical factors on the accuracy of blood glucose monitoring data.

Disclosure of Invention

Aiming at the defects in the prior art, the invention provides the sensor base, the battery and the conduction plate are packaged in the sensor base, and the battery can be used as a consumable, so that the battery with relatively small capacity and volume is selected, the volume of the dynamic blood sugar monitoring device is reduced, a user does not need to replace the battery, and the use experience is enhanced; the battery and the conduction plate are packaged, so that the waterproof structure is simplified, the waterproof performance grade is enhanced, and the size of the dynamic blood sugar monitoring device is further reduced. The invention also provides a manufacturing method of the sensor base, the damage of the battery due to overhigh temperature is avoided by once injection molding of the protective shell with lower temperature, and then the structure is simplified and the waterproof performance is enhanced by once injection molding with higher temperature.

The specific technical scheme of the invention is as follows: a sensor base comprises a main body part, a battery accommodating part and a buckling part, wherein the battery accommodating part and the buckling part are positioned on two opposite side edges of the main body part; the main body part is provided with a sensor probe mounting part and an emitter conduction part; the sensor base is internally provided with a battery and a conduction plate, the battery is located inside the battery accommodating part, and the conduction plate is located inside the battery accommodating part and the main body part.

Developments blood glucose monitoring devices generally regard the sensor as the consumptive material, wear in the human body with the transmitter equipment back for transmit blood glucose data, and the subassembly of sensor and transmitter can make the whole volume of developments blood glucose monitoring devices great, wear the back easily with outside object take place to collide with, rub, thereby make the sensor probe wear the position human tissue relatively and produce the displacement, light then arouse the accuracy that the inflammation influences blood glucose data, heavy messenger's whole sensor drops. Therefore, it is important to reduce the volume, and particularly the thickness, of the dynamic blood glucose monitoring device, thereby reducing the effects of contact with external objects. The dynamic blood sugar monitoring device is internally provided with a battery for supplying power, and the size of the battery is the most important factor influencing the volume of the dynamic blood sugar monitoring device. The battery the conduction board adopt modes such as moulding plastics to encapsulate in inside the sensor base, possess following advantage: 1. the battery is used as a consumable material, the battery with relatively small capacity can be selected, and the size of the battery is correspondingly smaller, so that the size of the dynamic blood glucose monitoring device is reduced; 2. the battery and the conduction plate are packaged, so that a waterproof structure is simplified, the waterproof performance grade is enhanced, and the size of the dynamic blood glucose monitoring device is further reduced; 3. will the battery uses as the consumptive material, need not the user and changes, and it is more convenient to use.

Preferably, the sensor probe mounting portion is provided with at least one probe fixing groove, and an upper surface of the conduction plate is exposed to a bottom of the probe fixing groove.

Therefore, the sensor probe is installed at the probe fixing groove, and the sensor probe can be fixed by injecting the solidified glue into the probe fixing groove.

Preferably, the emitter conduction part is provided with a conduction groove and a conduction assembly mounted in the conduction groove.

Therefore, contacts of the anode and the cathode of the battery and a connecting contact of the sensor probe are arranged in the conduction groove, the contact is also arranged at the position opposite to the bottom of the emitter, the emitter and the sensor base are buckled and connected and then conducted, the battery supplies power for the emitter, and the emitter supplies power for the sensor probe after being rectified by a circuit.

In the present invention, it is preferable that the conduction plate has an arc-shaped battery receiving notch at one side thereof, and the battery is mounted in the battery receiving notch.

Therefore, the battery is arranged at the battery accommodating notch, and the thickness of the sensor base can be reduced.

Preferably, the conduction plate is provided with battery conduction interfaces at two sides of the battery accommodation gap respectively; and the positive electrode and the negative electrode of the battery are respectively welded with metal soldering pieces in a pasting mode, the thickness of each metal soldering piece is not more than 0.5mm, and the metal soldering pieces are connected and conducted with the two battery conduction interfaces after being bent.

Therefore, the battery can reduce the thickness of the sensor base through the metal soldering lug and the battery conduction interface.

Preferably, a probe conducting pad is arranged on the conducting plate and positioned in the probe fixing groove, a probe conducting through hole is arranged in the middle of the probe conducting pad, a probe through hole is arranged at a position, opposite to the probe conducting through hole, of the bottom of the sensor probe mounting portion, and the probe through hole and the probe conducting through hole penetrate through each other.

Thereby, the sensor probe passes through the probe through hole and the probe conducting through hole, and is conducted with the probe conducting pad through a process of welding or injecting a conducting adhesive and the like.

Preferably, the conduction plate is provided with a plurality of conduction contacts at the conduction groove, the battery conduction interface is connected and conducted with the conduction contacts through wiring in the conduction plate, and the conductive pad is connected and conducted with the conduction contacts through wiring in the conduction plate.

Therefore, the conducting plate is generally a PCB, the conducting contacts are all positioned in the conducting grooves and can be conveniently conducted with the emitter, and the waterproof performance of the conducting positions is improved only by making the waterproof performance of the conducting grooves.

Preferably, the conducting assembly includes conductive silica gel and an elastic sealing element, the conductive silica gel is respectively arranged at the opposite positions of the conducting contacts, the elastic sealing element is filled in the conducting groove, the top of the elastic sealing element is higher than the opening of the conducting groove, and the conductive silica gel main body penetrates through the elastic sealing element and the top of the conductive silica gel main body is exposed out of the elastic sealing element.

Therefore, the bottom of the conductive silica gel is conducted with the conducting contact, the top of the conductive silica gel is conducted with the contact on the emitter after the emitter is buckled and connected, and the elastic sealing element is extruded by the contact surface of the emitter to form sealing.

Preferably, the area of the bottom of the conductive silicone rubber is larger than that of the top of the conductive silicone rubber, and the elastic sealing element is provided with a through hole with the same cross section as that of the conductive silicone rubber.

Therefore, the area of the bottom of the conductive silica gel is larger than that of the top of the conductive silica gel, so that the conductive silica gel cannot fall off from bottom to top after being arranged in the elastic sealing element, and the conductive silica gel can be prevented from falling off in the transportation and dismounting processes; conductive silica gel can be the structure that possesses "protruding" font vertical cross-section, elastic sealing element is insulating rubber, the bottom pass through the viscose with the conduction groove tank bottom bonding, thereby guarantee elastic sealing element with conductive silica gel install in can not break away from in the conduction groove.

A method of manufacturing a sensor mount, comprising the steps of:

step A, welding the metal soldering lug and the battery;

step B, mounting the assembly of the battery and the metal soldering lug at the battery accommodating notch of the conduction plate;

step C, welding the other end of the metal soldering lug at the battery conduction interface of the conduction plate;

step D, performing injection molding on the whole assembly of the conduction plate, the battery and the metal soldering lug, wherein the injection molding temperature is 130-150 ℃, the duration time of the injection molding process is no more than 8 seconds when the temperature is more than 100 ℃, and the injection molding thickness is 0.3-0.6 mm;

and E, performing injection molding on the assembly subjected to the first injection molding again, wherein the injection molding temperature is 150-250 ℃.

In the step A, the welding temperature between the metal welding sheet and the battery is not more than 200 ℃, and the duration time of the temperature of more than 150 ℃ in the welding process is not more than 5 seconds, so that the battery is prevented from being damaged due to overhigh temperature; b, positioning the conduction plate and the battery by using a positioning mechanism to ensure that relative positions have higher consistency after welding into a whole; and D, firstly, performing injection molding on a protective layer of 0.3-0.6 mm in the injection molding process in the step E to ensure that the temperature of the injection molding in the step E does not influence the battery within the range that the battery cannot be damaged.

In conclusion, the invention has the following beneficial effects:

according to the sensor base, the battery and the conduction plate are packaged in the sensor base, so that the battery can be used as a consumable material, the battery with relatively small capacity and volume is selected, the volume of the dynamic blood sugar monitoring device is reduced, a user does not need to replace the battery, and the use experience is enhanced; the battery and the conduction plate are packaged, so that the waterproof structure is simplified, the waterproof performance grade is enhanced, and the size of the dynamic blood sugar monitoring device is further reduced. The invention also provides a manufacturing method of the sensor base, which avoids the damage of the battery due to overhigh temperature through one-time injection molding of the protective shell with lower temperature, and simplifies the structure and strengthens the waterproof performance through one-time injection molding with higher temperature.

Drawings

FIG. 1 is a perspective view of a sensor mount of the present invention without a conductive component mounted thereto;

FIG. 2 is a perspective view of a sensor base mount conductive assembly of the present invention;

FIG. 3 is a cross-sectional view of a sensor base mount lead-through assembly of the present invention;

FIG. 4 is a front elevation view of a perspective view of a sensor base battery and conduction plate weld assembly of the present invention;

FIG. 5 is a back side view of a perspective view of a sensor base battery and conduction plate weld assembly of the present invention;

FIG. 6 is a schematic diagram of a sensor base according to an embodiment of the present invention showing a separated state of a conductive element;

in the figure, 1-a main body part, 11-a sensor probe mounting part, 111-a probe fixing groove, 112-a probe perforation, 12-an emitter conduction part, 121-a conduction groove, 122-a conduction assembly, 1221-conductive silica gel, 1222-an elastic sealing element, 2-a battery accommodating part, 3-a buckling part, 4-a battery, 41-a metal welding sheet, 5-a conduction plate, 51-a battery accommodating notch, 52-a battery conduction interface, 53-a probe conductive welding disc, 531-a probe conduction perforation and 54-a conduction contact.

Detailed Description

The invention will be further illustrated by means of specific embodiments in the following description with reference to the drawings.

As shown in fig. 1, 2 and 3, a sensor base includes a main body 1, and a battery accommodating portion 2 and a locking portion 3 located on two opposite sides of the main body 1, wherein the main body 1, the battery accommodating portion 2 and the locking portion 3 are an integral structure; the main body part 1 is provided with a sensor probe installation part 11 and an emitter conduction part 12; inside still being equipped with battery 4 and the board 5 that leads to of sensor base, battery 4 is located inside battery container portion 2, leads to board 5 to be located inside battery container portion 2 and main part 1.

Developments blood glucose monitoring devices generally regard the sensor as the consumptive material, wear in the human body with the transmitter equipment back for transmit blood glucose data, and the subassembly of sensor and transmitter can make the whole volume of developments blood glucose monitoring devices great, wear the back easily with outside object take place to collide with, rub, thereby make the sensor probe wear the position human tissue relatively and produce the displacement, light then arouse the accuracy that the inflammation influences blood glucose data, heavy messenger's whole sensor drops. Therefore, it is important to reduce the volume, and particularly the thickness, of the dynamic blood glucose monitoring device, thereby reducing the effects of contact with external objects. The dynamic blood sugar monitoring device is internally provided with a battery for supplying power, and the size of the battery is the most important factor influencing the volume of the dynamic blood sugar monitoring device. Battery 4, conduction board 5 adopt modes such as moulding plastics to encapsulate inside the sensor base, possess following advantage: 1. the battery 4 is used as a consumable material, a battery with relatively small capacity can be selected, and the volume of the battery is correspondingly smaller, so that the volume of the dynamic blood glucose monitoring device is reduced; 2. the battery 4 and the conduction plate 5 are packaged, so that the waterproof structure is simplified, the waterproof performance grade is enhanced, and the size of the dynamic blood sugar monitoring device is further reduced; 3. the battery 4 is used as a consumable, so that the user does not need to replace the battery, and the use is more convenient.

As shown in fig. 1, 2 and 3, the sensor probe mounting portion 11 is provided with at least one probe fixing groove 111, and the upper surface of the conduction plate 5 is exposed to the bottom of the probe fixing groove 111.

Thus, the sensor probes are attached to the probe fixing grooves 111, and the sensor probes are fixed by injecting a solidified gel into the probe fixing grooves 111.

As shown in fig. 1, 2 and 3, the emitter conduction part 12 includes a conduction groove 121 and a conduction block 122 mounted in the conduction groove 121.

Therefore, contacts of the anode and the cathode of the battery 4 and a connecting contact of the sensor probe are arranged in the conduction groove 121, the contact is also arranged at the position opposite to the bottom of the transmitter, the transmitter is connected with the sensor base in a buckling mode and then conducted, the battery 4 supplies power for the transmitter, and the transmitter supplies power for the sensor probe after being rectified by a circuit.

As shown in fig. 4 and 5, the conduction plate 5 has an arc-shaped battery accommodating notch 51 at one side thereof, and the battery 4 is mounted in the battery accommodating notch 51.

Thus, the battery 4 is mounted in the battery receiving notch 51, and the thickness of the sensor base can be reduced.

As shown in fig. 4 and 5, the conduction plate 5 is provided with battery conduction interfaces 52 on two sides of the battery accommodation gap 51; the positive and negative electrodes of the battery 4 are respectively welded with metal soldering lugs 41 in a sticking way, the thickness of the metal soldering lugs 41 is not more than 0.5mm, and the metal soldering lugs are connected and conducted with two battery conducting interfaces 52 after being bent.

Thus, the battery 4 can be reduced in thickness by the metal tab 41 and the battery conduction interface 52.

As shown in fig. 1, 2, 3, 4, and 5, a probe conductive pad 53 is disposed on the conduction plate 5 at a position inside the probe fixing groove 111, a probe through hole 531 is disposed at a middle position of the probe conductive pad 53, a probe through hole 112 is disposed at a position opposite to the probe through hole 531 at the bottom of the sensor probe mounting portion 11, and the probe through hole 112 and the probe through hole 531 penetrate through each other.

Thereby, the sensor probe passes through the probe through hole 112 and the probe through hole 531, and is electrically connected to the probe conductive pad 53 through a process such as soldering or injecting a conductive paste.

As shown in fig. 1 and 4, the conduction plate 5 is provided with a plurality of conduction contacts 54 at the conduction grooves 121, the battery conduction interface 52 is connected and conducted to the conduction contacts 54 through the wiring in the conduction plate 5, and the conduction pad 53 is connected and conducted to the conduction contacts 54 through the wiring in the conduction plate 5.

Therefore, the conduction plate 5 is generally a PCB, the conduction contacts 54 are all located in the conduction grooves 121 and can be conveniently conducted with the emitters, and only the waterproofing of the conduction grooves 121 needs to be done, so as to improve the waterproofing performance of the conduction positions.

As shown in fig. 2, 3 and 6, the conducting assembly 122 includes a conductive silicone 1221 and an elastic sealing element 1222, the conductive silicone 1221 is respectively disposed at opposite positions of the conducting contacts 54, the elastic sealing element 1222 is filled inside the conducting slot 121, and the top of the elastic sealing element 1222 is higher than the opening of the conducting slot 121, and the main body of the conductive silicone 1221 penetrates through the elastic sealing element 1222 and the back top of the elastic sealing element 1222 is exposed out of the elastic sealing element 1222.

Thus, the bottom of the conductive silicone 1221 is in contact with the conductive contacts 54, the top is in contact with the contacts on the emitter after the emitter is snap-fit, and the elastomeric seal 1222 is compressed by the emitter interface to form a seal.

As shown in fig. 3 and 6, the bottom of the conductive silicone 1221 is larger than the top, and the elastic sealing member 1222 has a through hole with the same cross section as the conductive silicone 1221.

Therefore, the area of the bottom of the conductive silica gel 1221 is larger than that of the top of the conductive silica gel 1221, the conductive silica gel 1221 cannot fall off from bottom to top after being installed in the elastic sealing element 1222, and the conductive silica gel 1221 can be prevented from falling off in the transportation and dismounting processes; the conductive silicone 1221 may be a structure having a vertical cross section in a shape like a Chinese character 'tu', the elastic sealing member 1222 is an insulating rubber, and the bottom of the elastic sealing member 1222 is adhered to the bottom of the conduction groove 121 by an adhesive, so as to ensure that the elastic sealing member 1222 and the conductive silicone 1221 are mounted in the conduction groove 121 without being separated.

A method of manufacturing a sensor mount, comprising the steps of:

step A, welding a metal welding sheet 41 and a battery 4;

step B, mounting the assembly of the battery 4 and the metal soldering lug 41 at the battery accommodating notch 51 of the conduction plate 5;

step C, welding the other end of the metal soldering lug 41 to the battery conduction interface 52 of the conduction plate 5;

Step D, performing injection molding on the assembly of the conduction plate 5, the battery 4 and the metal soldering lug 41 integrally, wherein the injection molding temperature is 130-150 ℃, the duration of the injection molding process is no more than 8 seconds at the temperature of more than 100 ℃, and the injection molding thickness is 0.3-0.6 mm;

and E, performing injection molding on the assembly subjected to the first injection molding again, wherein the injection molding temperature is 150-250 ℃.

In the step A, the welding temperature between the metal welding sheet 41 and the battery 4 is not more than 200 ℃, and the duration of the welding process with the temperature of more than 150 ℃ is not more than 5 seconds, so that the battery 4 is not damaged due to overhigh temperature; step B and step C need to use a positioning mechanism to position the conduction plate 5 and the battery 4 so as to ensure that the relative positions have higher consistency after the welding is integrated; and D, firstly, performing injection molding on a protective layer of 0.3-0.6 mm in the range of ensuring that the temperature is not damaged by the battery 4 in the injection molding process in the step E so as to ensure that the molding injection molding temperature in the step E does not influence the battery 4.

The above-described embodiments are merely illustrative of the preferred embodiments of the present invention and do not limit the spirit and scope of the present invention. Various modifications and improvements of the technical solutions of the present invention may be made by those skilled in the art without departing from the design concept of the present invention, and the technical contents of the present invention are all described in the claims.

Claims (10)

1. A sensor base, its characterized in that: the battery box comprises a main body part (1), and a battery accommodating part (2) and a buckling part (3) which are positioned on two opposite side edges of the main body part (1), wherein the main body part (1), the battery accommodating part (2) and the buckling part (3) are of an integrated structure; the main body part (1) is provided with a sensor probe installation part (11) and an emitter conduction part (12); the sensor base is internally provided with a battery (4) and a conduction plate (5), the battery (4) is positioned inside the battery accommodating part (2), and the conduction plate (5) is positioned inside the battery accommodating part (2) and the main body part (1).

2. A sensor mount according to claim 1, wherein: sensor probe installation department (11) are equipped with no less than one probe fixed slot (111), conduction board (5) upper surface is exposed in probe fixed slot (111) tank bottom.

3. A sensor mount according to claim 2, wherein: the emitter conduction part (12) is provided with a conduction groove (121) and a conduction assembly (122) installed in the conduction groove (121).

4. A sensor mount as claimed in claim 3, wherein: circular arc-shaped battery accommodating gaps (51) are formed in one side of the conduction plate (5), and the batteries (4) are mounted in the battery accommodating gaps (51).

5. A sensor mount according to claim 4, wherein: the conduction plate (5) is provided with battery conduction interfaces (52) at two sides of the battery accommodating notch (51) respectively; the positive pole and the negative pole of the battery (4) are respectively attached with a metal soldering lug (41), the thickness of the metal soldering lug (41) is not more than 0.5mm, and the metal soldering lug is connected and conducted with the battery conduction interfaces (52) at two positions after being bent.

6. A sensor mount according to claim 5, wherein: lie in on conduction board (5) probe fixed slot (111) internal position is equipped with probe and leads electric bonding pad (53), probe conductive bonding pad (53) intermediate position is equipped with the probe and switches on perforation (531), sensor probe installation department (11) bottom with the probe switches on perforation (531) relative position and is equipped with probe perforation (112), probe perforation (112) with the probe switches on perforation (531) to wearing.

7. A sensor mount according to claim 6, wherein: the conduction plate (5) is provided with a plurality of conduction contacts (54) at the conduction groove (121), the battery conduction interface (52) is connected and conducted with the conduction contacts (54) through wiring in the conduction plate (5), and the conduction welding disc (53) is connected and conducted with the conduction contacts (54) through wiring in the conduction plate (5).

8. A sensor mount according to claim 7, wherein: the conducting assembly (122) comprises conducting silica gel (1221) and an elastic sealing element (1222), the conducting silica gel (1221) are respectively arranged at the opposite positions of the conducting contacts (54), the elastic sealing element (1222) is filled in the conducting groove (121), the top of the elastic sealing element (1222) is higher than the notch of the conducting groove (121), and the main body of the conducting silica gel (1221) penetrates through the elastic sealing element (1222) and the top of the conducting silica gel (1221) is exposed out of the elastic sealing element (1222).

9. A sensor mount according to claim 8, wherein: the bottom area of the conductive silicone (1221) is larger than the top area of the conductive silicone, and the elastic sealing element (1222) is provided with a through hole with the same section as that of the conductive silicone (1221).

10. A method for manufacturing a sensor mount according to claim 9, comprising the steps of:

step A, welding the metal soldering lug (41) and the battery (4);

b, mounting the assembly of the battery (4) and the metal welding sheet (41) at the battery accommodating notch (51) of the conduction plate (5);

step C, welding the other end of the metal welding sheet (41) to the battery conduction interface (52) of the conduction plate (5);

D, integrally performing injection molding on the assembly of the conduction plate (5), the battery (4) and the metal soldering lug (41), wherein the injection molding temperature is 130-150 ℃, the duration time of the injection molding process is no more than 8 seconds when the temperature is higher than 100 ℃, and the injection molding thickness is 0.3-0.6 mm;

and E, performing injection molding on the assembly subjected to the first injection molding again, wherein the injection molding temperature is 150-250 ℃.

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