CN114734211A - Mica heating plate processing technology - Google Patents
Mica heating plate processing technology Download PDFInfo
- Publication number
- CN114734211A CN114734211A CN202210484883.2A CN202210484883A CN114734211A CN 114734211 A CN114734211 A CN 114734211A CN 202210484883 A CN202210484883 A CN 202210484883A CN 114734211 A CN114734211 A CN 114734211A
- Authority
- CN
- China
- Prior art keywords
- metal layer
- layer material
- mica
- mica plate
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010445 mica Substances 0.000 title claims abstract description 35
- 229910052618 mica group Inorganic materials 0.000 title claims abstract description 35
- 238000010438 heat treatment Methods 0.000 title claims abstract description 11
- 239000002184 metal Substances 0.000 claims abstract description 34
- 239000000463 material Substances 0.000 claims abstract description 28
- 238000010329 laser etching Methods 0.000 claims abstract description 14
- 239000002699 waste material Substances 0.000 claims abstract description 10
- 238000004806 packaging method and process Methods 0.000 claims abstract description 6
- 238000005530 etching Methods 0.000 claims abstract description 5
- 229910001220 stainless steel Inorganic materials 0.000 claims abstract description 4
- 239000010935 stainless steel Substances 0.000 claims abstract description 4
- 230000007613 environmental effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 5
- 239000002253 acid Substances 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Surface Heating Bodies (AREA)
- Laser Beam Processing (AREA)
- Laminated Bodies (AREA)
Abstract
The invention provides a mica heating plate processing technology, which comprises the following steps of (1) preparing materials: pasting a metal layer material on the mica plate; (2) laser etching: etching the metal layer material on the mica plate according to a set program by laser etching, cutting along the outer edge of the region of the metal layer material which needs to be reserved on the mica plate, and cutting off the metal layer; (3) tearing waste materials: tearing off the waste material of the metal layer material from the mica plate; (4) packaging: the mica plate is packaged by stainless steel, and is connected with the metal layer material by a wire to form an electrode to be led out to the outside, which shows that the invention has convenient processing, environmental protection and no pollution.
Description
Technical Field
The invention relates to the technical field of mica heating plate processing, in particular to a mica heating plate processing technology.
Background
The mica heating plate adopts the method that a metal layer material is pasted above a mica plate, then the metal layer material is subjected to processing such as exposure, acid washing and the like, and required lines are processed for use.
Disclosure of Invention
The invention aims to provide a mica heating plate processing technology to solve the problems mentioned in the background technology.
In order to achieve the above purpose, the invention provides the following technical scheme:
a mica heating plate processing technology comprises the following steps,
1) preparing materials: pasting a metal layer material on the mica plate;
2) laser etching: etching the metal layer material on the mica plate according to a set program by laser etching, cutting along the outer edge of the region of the metal layer material which needs to be reserved on the mica plate, and cutting off the metal layer;
3) tearing waste materials: tearing off the waste material of the metal layer material from the mica plate;
4) packaging: and packaging the mica plate through stainless steel, and connecting a metal layer material through a wire to form an electrode to be led out to the outside.
In step (2), the laser etching process is performed on the metal layer with a wavelength of 1064 nm.
The invention has the beneficial effects that:
according to the invention, the metal layer material is cut through laser etching, and after the cutting is finished, the rest metal layer waste materials are directly torn off from the mica plate, so that the environment is protected, no pollution is caused, only a small amount of smoke dust is generated in the laser etching processing, the processing is carried out through a dust collection device, and the processing is convenient, so that the mass production can be carried out.
Detailed Description
The invention is further illustrated below:
a mica heating plate processing technology comprises the following steps,
(1) preparing materials: pasting a metal layer material on the mica plate;
(2) laser etching: etching the metal layer material on the mica plate according to a set program by laser etching, cutting along the outer edge of the region of the metal layer material which needs to be reserved on the mica plate, and cutting off the metal layer; and etching the metal layer by laser etching with a wavelength of 1064nm, and only cutting the metal layer without cutting the mica plate.
(3) Tearing waste materials: tearing off the waste material of the metal layer material from the mica plate;
(4) packaging: the mica plate is packaged by stainless steel, and an electrode is formed by connecting a metal layer material through a wire and is led out to the outside.
The process mainly cuts the metal layer material through laser etching without adopting modes of exposure, acid washing and the like, and after the cutting is finished, the rest metal layer waste materials are directly torn off from the mica plate, so that the process is environment-friendly and pollution-free, and is convenient to process.
The above description is not intended to limit the technical scope of the present invention, and any modification, equivalent change and modification of the above embodiments according to the technical spirit of the present invention are still within the technical scope of the present invention.
Claims (2)
1. A mica heating plate processing technology is characterized in that: comprises the following steps of (a) carrying out,
1) preparing materials: pasting a metal layer material on the mica plate;
2) laser etching: etching the metal layer material on the mica plate according to a set program by laser etching, cutting along the outer edge of the region of the metal layer material which needs to be reserved on the mica plate, and cutting off the metal layer;
3) tearing waste materials: tearing off the waste material of the metal layer material from the mica plate;
4) packaging: and packaging the mica plate through stainless steel, and connecting a metal layer material through a wire to form an electrode to be led out to the outside.
2. The mica heating plate processing technology of claim 1, which is characterized in that: in the step (2), the laser etching adopts 1064nm wavelength to etch the metal layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210484883.2A CN114734211A (en) | 2022-05-06 | 2022-05-06 | Mica heating plate processing technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210484883.2A CN114734211A (en) | 2022-05-06 | 2022-05-06 | Mica heating plate processing technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114734211A true CN114734211A (en) | 2022-07-12 |
Family
ID=82285969
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210484883.2A Pending CN114734211A (en) | 2022-05-06 | 2022-05-06 | Mica heating plate processing technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114734211A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0292630A (en) * | 1988-09-30 | 1990-04-03 | Wakomu:Kk | Metal clad mica plate |
| CN107829125A (en) * | 2016-11-11 | 2018-03-23 | 深圳瑞之谷医疗科技有限公司 | Substrate, heating plate, humidification machine and its processing method are used in one kind heating |
| CN112804773A (en) * | 2020-12-29 | 2021-05-14 | 宁波柔碳电子科技有限公司 | Heating plate and preparation method thereof |
| CN215268753U (en) * | 2021-06-03 | 2021-12-21 | 湖北平安电工科技股份公司 | Mica heating film with external lead |
-
2022
- 2022-05-06 CN CN202210484883.2A patent/CN114734211A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0292630A (en) * | 1988-09-30 | 1990-04-03 | Wakomu:Kk | Metal clad mica plate |
| CN107829125A (en) * | 2016-11-11 | 2018-03-23 | 深圳瑞之谷医疗科技有限公司 | Substrate, heating plate, humidification machine and its processing method are used in one kind heating |
| CN112804773A (en) * | 2020-12-29 | 2021-05-14 | 宁波柔碳电子科技有限公司 | Heating plate and preparation method thereof |
| CN215268753U (en) * | 2021-06-03 | 2021-12-21 | 湖北平安电工科技股份公司 | Mica heating film with external lead |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20220712 |