CN114733740B - Modularized high-power ultrasonic transducer - Google Patents
Modularized high-power ultrasonic transducer Download PDFInfo
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- CN114733740B CN114733740B CN202210535275.XA CN202210535275A CN114733740B CN 114733740 B CN114733740 B CN 114733740B CN 202210535275 A CN202210535275 A CN 202210535275A CN 114733740 B CN114733740 B CN 114733740B
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- cover plate
- module assembly
- power
- rear cover
- front cover
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- 230000000712 assembly Effects 0.000 claims abstract description 33
- 238000000429 assembly Methods 0.000 claims abstract description 33
- 238000000034 method Methods 0.000 abstract description 5
- 238000009210 therapy by ultrasound Methods 0.000 abstract description 5
- 238000010438 heat treatment Methods 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 3
- 230000004308 accommodation Effects 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 238000002604 ultrasonography Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
- Y02A90/00—Technologies having an indirect contribution to adaptation to climate change
- Y02A90/30—Assessment of water resources
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Percussion Or Vibration Massage (AREA)
- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
Abstract
The invention discloses a modularized high-power ultrasonic transducer, which comprises: the power module assembly is connected with the output module assembly, the power module assembly at one end is connected with the rear end module assembly, and natural frequencies of the output module assembly, the rear end module assembly and each power module assembly are consistent. The power capacity of the single transducer is effectively improved by increasing the number of the power module assemblies, and as the natural frequencies of the output module assemblies, the rear end module assemblies and each power module assembly are consistent, high-frequency electric signals can be input into the output module assemblies, the rear end module assemblies and the power module assemblies by only arranging one power amplifier matching circuit, and finally ultrasonic waves are output by the front ends of the output module assemblies, so that ultrasonic power can be conveniently adjusted in the ultrasonic treatment test process, and the power device has the advantages of high flexibility, high power, flexible and convenient connection, low heating and the like.
Description
Technical Field
The invention relates to the technical field of power ultrasound, in particular to a modularized high-power ultrasonic transducer.
Background
The rod type ultrasonic system structure with ultra-high power in the prior art is simply connected with single transducers in series, and the same-frequency resonance among all the monomers is difficult to realize, so that a plurality of power matching circuits are configured in an ultrasonic signal generating circuit, the complex power regulation and control are difficult to implement technically, if different treatment effects are required to be achieved in the ultrasonic treatment test process, the power of the transducers needs to be frequently regulated, and a great amount of time and labor are required to be consumed when the power of the transducers is regulated by the existing ultrasonic system structure.
In summary, how to solve the problems of the existing rod-type ultrasound system, such as high difficulty in power regulation and low efficiency of adjusting the transducer during the ultrasonic treatment test, is a urgent problem to be solved by those skilled in the art.
Disclosure of Invention
Therefore, the invention aims to provide the modularized high-power ultrasonic transducer, which is only provided with one power amplifier matching circuit, thereby reducing the difficulty of power regulation.
In order to achieve the above object, the present invention provides the following technical solutions:
a modular high power ultrasonic transducer comprising: the power module assembly is connected with the output module assembly, the power module assembly at one end is connected with the rear end module assembly, and natural frequencies of the output module assembly, the rear end module assembly and each power module assembly are consistent.
Preferably, the output module assembly includes a plurality of first piezoelectric elements, a first front cover plate, a first rear cover pad, a first rear cover plate and a first screw rod, wherein the first front cover plate, all the first piezoelectric elements, the first rear cover pad and the first rear cover plate are sequentially arranged, the first screw rod passes through the centers of the first center screw holes of the first front cover plate, all the first piezoelectric elements, the first rear cover pad and the first rear cover plate, and the rear end of the first screw rod protrudes out of the first rear cover pad.
Preferably, the power module assembly comprises a plurality of second piezoelectric elements, a second front cover plate, a second rear cover pad, a second rear cover plate and a second screw rod, wherein the second front cover plate, all the second piezoelectric elements, the second rear cover pad and the second rear cover plate are sequentially arranged, the second screw rod penetrates through the centers of the second front cover plate, all the second piezoelectric elements, the second rear cover pad and the second rear cover plate, the rear end of the second screw rod protrudes out of the second rear cover pad, a first accommodating groove is formed in the end face of the second front cover plate, and when the power module assembly is connected with the output module assembly, the rear end of the first screw rod is inserted into a second center screw hole of the second front cover plate.
Preferably, the rear end module assembly comprises a plurality of third piezoelectric elements, a third front cover plate, a third rear cover pad, a third rear cover plate and a third screw rod, wherein the third front cover plate, all the third piezoelectric elements, the third rear cover pad and the third rear cover plate are sequentially arranged, the third screw rod penetrates through the centers of the third front cover plate, all the third piezoelectric elements, the third rear cover pad and the third rear cover plate, the rear end of the third screw rod is flush with the third rear cover pad, the end face of the third front cover plate is provided with a second accommodating groove for accommodating the second rear cover pad, and when the power module assembly is connected with the output module assembly, the rear end of the second screw rod is inserted into a third center screw hole of the third front cover plate.
Preferably, the natural frequencies of the output module assembly, the back-end module assembly and all the power module assemblies are half-wavelength frequencies.
The modularized high-power ultrasonic transducer provided by the application effectively improves the power capacity of the single transducer by increasing the number of the power module assemblies, and has the advantages of high flexibility, high power, flexible and convenient connection, low heating and the like because the natural frequencies of the output module assemblies, the rear end module assemblies and the power module assemblies are consistent, and only one power amplifier matching circuit is arranged to input high-frequency electric signals into the output module assemblies, the rear end module assemblies and the power module assemblies, and finally the front end of the output module assemblies outputs ultrasonic waves, so that ultrasonic power can be conveniently adjusted in the ultrasonic treatment test process, different treatment effects can be realized.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only embodiments of the present invention, and that other drawings can be obtained according to the provided drawings without inventive effort for a person skilled in the art.
FIG. 1 is a cross-sectional view of a modular high power ultrasonic transducer provided by the present invention;
FIG. 2 is a cross-sectional view of an output module assembly provided by the present invention;
FIG. 3 is a cross-sectional view of a power module assembly provided by the present invention;
FIG. 4 is a cross-sectional view of a back end module assembly provided by the present invention;
fig. 5 is a schematic diagram of natural frequencies of an output module assembly, a back-end module assembly and all power module assemblies provided by the present invention.
In fig. 1-5:
1-output module assembly, 2-power module assembly, 3-back end module assembly, 4-first front cover plate, 5-first piezoelectric element, 6-first back cover pad, 7-first back cover plate, 8-first screw, 9-first accommodation groove, 10-second front cover plate, 11-second piezoelectric element, 12-second back cover pad, 13-second back cover plate, 14-second screw, 15-second accommodation groove, 16-third front cover plate, 17-third piezoelectric element, 18-third back cover pad, 19-third back cover plate, 20-third screw.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The core of the invention is to provide a modularized high-power ultrasonic transducer, which is only provided with one power amplifier matching circuit, thereby reducing the difficulty of power regulation.
Referring to fig. 1 to 5, a modularized high-power ultrasonic transducer includes: the power module comprises an output module assembly 1, a rear end module assembly 3 and a plurality of power module assemblies 2, wherein all the power module assemblies 2 are connected in series, the power module assembly 2 at one end is connected with the output module assembly 1, the power module assembly 2 at the other end is connected with the rear end module assembly 3, and the natural frequencies of the output module assembly 1, the rear end module assembly 3 and each power module assembly 2 are consistent.
The back end module assembly 3, all the power module assemblies 2 and the output module assembly 1 are transducers, which can convert high-frequency electric signals into high-frequency vibrations, amplify the amplitudes, input current signals from the back end module assembly 3, all the power module assemblies 2 and the output module assembly 1, and finally the back end module assembly 3, all the power module assemblies 2 and the output module assembly 1 output the high-frequency vibrations to the front end of the output module assembly 1 to generate ultrasonic waves.
The modularized high-power ultrasonic transducer provided by the application effectively improves the power capacity of the single transducer by increasing the number of the power module assemblies 2, and has the advantages of high flexibility, high power, flexible and convenient connection, low heating and the like because the natural frequencies of the output module assemblies 1, the rear end module assemblies 3 and each power module assembly 2 are consistent, and only one power amplifier matching circuit is arranged to input high-frequency electric signals into the output module assemblies 1, the rear end module assemblies 3 and the power module assemblies 2, and finally the front end of the output module assembly 1 outputs ultrasonic waves, so that ultrasonic power can be conveniently adjusted in the ultrasonic treatment test process, different treatment effects can be realized.
As a further preferred aspect of the above embodiment, the output module assembly 1 includes a plurality of first piezoelectric elements 5, a first front cover plate 4, a first rear cover pad 6, a first rear cover plate 7, and a first screw rod 8, where the first front cover plate 4, all the first piezoelectric elements 5, the first rear cover pad 6, and the first rear cover plate 7 are sequentially disposed, and the first screw rod 8 passes through the center of the first front cover plate 4, all the first piezoelectric elements 5, the first rear cover pad 6, and the first rear cover plate 7, and the rear end of the first screw rod 8 protrudes from the first rear cover pad 6.
The first piezoelectric element 5 is a circular-ring plate-shaped structure, the first front cover plate 4, the first rear cover pad 6 and the first rear cover plate 7 are all of circular cylindrical structures, internal threads are arranged on hollow parts of the first front cover plate 4, the first rear cover pad 6 and the first rear cover plate 7, the first screw rod 8 penetrates through all the first piezoelectric elements 5, the first front cover plate 4, the first rear cover pad 6 and the first rear cover plate 7, all the first piezoelectric elements 5 are arranged side by side, and all the first piezoelectric elements 5 are clamped along two sides of all the first piezoelectric elements 5 through the first front cover plate 4 and the first rear cover pad 6. The rear end of the first screw 8 protrudes from the first rear cover pad 6 to facilitate connection with the power module assembly 2.
On the basis of the above embodiment, as a further preferred embodiment, the power module assembly 2 includes a plurality of second piezoelectric elements 11, a second front cover plate 10, a second rear cover pad 12, a second rear cover plate 13, and a second screw 14, the second front cover plate 10, all the second piezoelectric elements 11, the second rear cover pad 12, and the second rear cover plate 13 are sequentially disposed, the second screw 14 passes through the centers of the second front cover plate 10, all the second piezoelectric elements 11, the second rear cover pad 12, and the second rear cover plate 13, the rear end of the second screw 14 protrudes from the second rear cover pad 12, the end face of the second front cover plate 10 is provided with the first accommodating groove 9, and when the power module assembly 2 is connected with the output module assembly 1, the rear end of the first screw 8 is inserted into the second center screw hole of the second front cover plate 10.
The second piezoelectric element 11 is a circular-ring plate-shaped structure, the second front cover plate 10, the second rear cover pad 12 and the second rear cover plate 13 are all circular cylindrical structures, internal threads are arranged in hollow parts of the second front cover plate 10, the second rear cover pad 12 and the second rear cover plate 13, the second screw 14 penetrates through all the second piezoelectric elements 11, the second front cover plate 10, the second rear cover pad 12 and the second rear cover plate 13, all the second piezoelectric elements 11 are arranged side by side, and all the second piezoelectric elements 11 are clamped along two sides of all the second piezoelectric elements 11 through the second front cover plate 10 and the second rear cover pad 12. The rear end of the second screw 14 protrudes from the second rear cover pad 12 to facilitate connection with the power module assembly 2.
When the output module assembly 1 is connected with the power module assembly 2, the first screw rod 8 is inserted and connected along the central screw hole of the second front cover plate 10, and the first rear cover pad 6 is inserted into the first accommodating groove 9. When each power module assembly 2 is connected with each other, the second screw 14 of the power module assembly 2 at the front end is inserted and connected along the central screw hole of the second front cover plate 10 of the power module assembly 2 at the rear end, and the second rear cover pad 12 of the power module assembly 2 at the front end is inserted into the first accommodating groove 9 of the power module assembly 2 at the rear end.
On the basis of the above embodiment, as a further preferred embodiment, the back end module assembly 3 includes a plurality of third piezoelectric elements 17, a third front cover plate 16, a third back cover pad 18, a third back cover plate 19, and a third screw rod 20, the third front cover plate 16, all the third piezoelectric elements 17, the third back cover pad 18, and the third back cover plate 19 are sequentially disposed, the third screw rod 20 passes through the centers of the third front cover plate 16, all the third piezoelectric elements 17, the third back cover pad 18, and the third back cover plate 19, the back end of the third screw rod 20 is flush with the third back cover pad 18, the end surface of the third front cover plate 16 is provided with a second accommodating groove 15 for accommodating the second back cover pad 12, and when the power module assembly 2 is connected with the output module assembly 1, the back end of the second screw rod 14 is inserted into the third center screw hole of the third front cover plate 16.
The third piezoelectric element 17 is in a circular annular plate structure, the third front cover plate 16, the third rear cover pad 18 and the third rear cover plate 19 are all in a circular cylindrical structure, internal threads are arranged in hollow parts of the third front cover plate 16, the third rear cover pad 18 and the third rear cover plate 19, the third screw rod 20 penetrates through all the third piezoelectric elements 17, the third front cover plate 16, the third rear cover pad 18 and the third rear cover plate 19, all the third piezoelectric elements 17 are arranged side by side, and all the third piezoelectric elements 17 are clamped along two sides of all the third piezoelectric elements 17 through the third front cover plate 16 and the third rear cover pad 18.
When the power module assembly 2 is connected with the rear end module assembly 3, the second screw 14 is inserted and connected along the central screw hole of the third front cover plate 16, and the second rear cover pad 12 is inserted into the second accommodating groove 15.
Further preferably, in the above embodiment, the natural frequencies of the output module assembly 1, the back end module assembly 3 and all the power module assemblies 2 are half-wavelength frequencies. As shown in fig. 5, the half-wavelength frequency is the half-wavelength of the wavelength passing through the output module assembly 1, the back-end module assembly 3, and all the power module assemblies 2.
In the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, and identical and similar parts between the embodiments are all enough to refer to each other.
The modularized high-power ultrasonic transducer provided by the invention is described in detail above. The principles and embodiments of the present invention have been described herein with reference to specific examples, the description of which is intended only to facilitate an understanding of the method of the present invention and its core ideas. It should be noted that it will be apparent to those skilled in the art that various modifications and adaptations of the invention can be made without departing from the principles of the invention and these modifications and adaptations are intended to be within the scope of the invention as defined in the following claims.
Claims (1)
1. A modular high power ultrasonic transducer comprising: the power module comprises an output module assembly (1), a rear end module assembly (3) and a plurality of power module assemblies (2), wherein all the power module assemblies (2) are connected in series, the power module assembly (2) at one end is connected with the output module assembly (1), the power module assembly (2) at the other end is connected with the rear end module assembly (3), and the natural frequencies of the output module assembly (1), the rear end module assembly (3) and each power module assembly (2) are consistent;
the natural frequencies of the output module assembly (1), the rear end module assembly (3) and all the power module assemblies (2) are half-wavelength frequencies;
the output module assembly (1) comprises a plurality of first piezoelectric elements (5), a first front cover plate (4), a first rear cover pad (6), a first rear cover plate (7) and a first screw rod (8), wherein the first front cover plate (4), all the first piezoelectric elements (5), the first rear cover pad (6) and the first rear cover plate (7) are sequentially arranged, the first screw rod (8) penetrates through the centers of the first central screw hole of the first front cover plate (4), all the first piezoelectric elements (5), the first rear cover pad (6) and the first rear cover plate (7), and the rear end of the first screw rod (8) protrudes out of the first rear cover pad (6);
the power module assembly (2) comprises a plurality of second piezoelectric elements (11), a second front cover plate (10), a second rear cover pad (12), a second rear cover plate (13) and a second screw rod (14), wherein the second front cover plate (10), all the second piezoelectric elements (11), the second rear cover pad (12) and the second rear cover plate (13) are sequentially arranged, the second screw rod (14) penetrates through the centers of the second front cover plate (10), all the second piezoelectric elements (11), the second rear cover pad (12) and the second rear cover plate (13), the rear end of the second screw rod (14) protrudes out of the second rear cover pad (12), a first accommodating groove (9) is formed in the end face of the second front cover plate (10), and when the power module assembly (2) is connected with the output module screw hole assembly (1), the rear end of the first screw rod (8) is inserted into the second center of the second front cover plate (10).
The rear end module assembly (3) comprises a plurality of third piezoelectric elements (17), a third front cover plate (16), a third rear cover plate pad (18), a third rear cover plate (19) and a third screw rod (20), wherein the third front cover plate (16), all the third piezoelectric elements (17), the third rear cover plate pad (18) and the third rear cover plate (19) are sequentially arranged, the third screw rod (20) penetrates through the centers of the third front cover plate (16), all the third piezoelectric elements (17), the third rear cover pad (18) and the third rear cover plate (19), the rear end of the third screw rod (20) is flush with the third rear cover plate (19), the end face of the third front cover plate (16) is provided with a second accommodating groove (15) for accommodating the second rear cover plate (13), and when the power module assembly (2) is connected with the rear end module assembly (3), the rear end of the second screw rod (14) is inserted into the third front cover plate (16).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210535275.XA CN114733740B (en) | 2022-05-17 | 2022-05-17 | Modularized high-power ultrasonic transducer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210535275.XA CN114733740B (en) | 2022-05-17 | 2022-05-17 | Modularized high-power ultrasonic transducer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114733740A CN114733740A (en) | 2022-07-12 |
| CN114733740B true CN114733740B (en) | 2023-08-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210535275.XA Active CN114733740B (en) | 2022-05-17 | 2022-05-17 | Modularized high-power ultrasonic transducer |
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| CN (1) | CN114733740B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115350892B (en) * | 2022-07-22 | 2023-10-20 | 东北大学 | Variable-frequency and variable-amplitude ultrasonic transducer, driving circuit thereof and use method |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6274963B1 (en) * | 1997-04-28 | 2001-08-14 | Ethicon Endo-Surgery, Inc. | Methods and devices for controlling the vibration of ultrasonic transmission components |
| RU44547U1 (en) * | 2004-09-09 | 2005-03-27 | Кошкур Олег Николаевич | ELECTRO-ACOUSTIC TRANSMITTER AND ULTRASONIC RADIATOR (OPTIONS) |
| CN203108765U (en) * | 2013-02-21 | 2013-08-07 | 湖北瑜晖电子科技有限公司 | Water-cooling-type large-power ultrasonic transducer |
| CN107694892A (en) * | 2017-11-17 | 2018-02-16 | 杭州成功超声设备有限公司 | A kind of bar type ultrasonic system structure of super high power |
| CN108838056A (en) * | 2018-07-03 | 2018-11-20 | 广东固特超声股份有限公司 | A kind of multiple activation round tube high power altrasonic transducer |
| CN111744755A (en) * | 2020-08-04 | 2020-10-09 | 浙江师范大学 | Novel ultrasonic bar |
-
2022
- 2022-05-17 CN CN202210535275.XA patent/CN114733740B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6274963B1 (en) * | 1997-04-28 | 2001-08-14 | Ethicon Endo-Surgery, Inc. | Methods and devices for controlling the vibration of ultrasonic transmission components |
| RU44547U1 (en) * | 2004-09-09 | 2005-03-27 | Кошкур Олег Николаевич | ELECTRO-ACOUSTIC TRANSMITTER AND ULTRASONIC RADIATOR (OPTIONS) |
| CN203108765U (en) * | 2013-02-21 | 2013-08-07 | 湖北瑜晖电子科技有限公司 | Water-cooling-type large-power ultrasonic transducer |
| CN107694892A (en) * | 2017-11-17 | 2018-02-16 | 杭州成功超声设备有限公司 | A kind of bar type ultrasonic system structure of super high power |
| CN108838056A (en) * | 2018-07-03 | 2018-11-20 | 广东固特超声股份有限公司 | A kind of multiple activation round tube high power altrasonic transducer |
| CN111744755A (en) * | 2020-08-04 | 2020-10-09 | 浙江师范大学 | Novel ultrasonic bar |
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| CN114733740A (en) | 2022-07-12 |
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