CN114724998A - Wafer correction adsorption device - Google Patents
Wafer correction adsorption device Download PDFInfo
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- CN114724998A CN114724998A CN202210226761.3A CN202210226761A CN114724998A CN 114724998 A CN114724998 A CN 114724998A CN 202210226761 A CN202210226761 A CN 202210226761A CN 114724998 A CN114724998 A CN 114724998A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a wafer correction adsorption device which comprises a substrate, a bearing piece, an adsorption carrying platform, a vacuum generating device and a belt transmission mechanism, wherein the bearing piece comprises an inner ring and a rotatable outer ring which are fixed on the substrate; the adsorption carrying platform is provided with a plurality of adsorption holes, the adsorption holes are communicated with the vacuum generating device, and the vacuum generating device is used for generating adsorption air flow to fix a product on the adsorption carrying platform. The invention drives the adsorption carrying platform to rotate through the bearing piece so as to adjust the position of the wafer fixed on the adsorption carrying platform to correspond to the position of the detection mechanism, thereby improving the position precision of the product during detection.
Description
Technical Field
The invention relates to the field of semiconductors, in particular to a wafer correction adsorption device.
Background
Wafer testing is an important link in the production process of semiconductor chips, and the wafer testing link can perform characteristic evaluation on electrical parameters of devices, so that qualified chips can be identified before packaging, and production personnel can evaluate the quality level of a production process according to the qualification rate of the devices.
During testing, the wafer is adsorbed on the stage, but there may be a certain angular deviation between the wafer placement position and the detection mechanism, and at this time, the stage needs to be rotated to correct the position of the wafer, so that the detection areas on the wafer correspond to the probe cards one to one. In the prior art, a rotating shaft is generally arranged below a carrier, a rotation driving mechanism is directly connected with the rotating shaft to drive the carrier to rotate, and under the condition that the carrier has large mass or large diameter, the connecting structure can cause the carrier to incline during rotation; how to solve the problem of large gap when the carrier rotates is also a problem which needs to be overcome to improve the positioning precision of the wafer.
Disclosure of Invention
In view of the above-mentioned deficiencies of the prior art, the present invention aims to: the wafer correction adsorption device can realize the rotation of the adsorption carrying platform through the bearing piece, and is provided with the limiting mechanism to reduce or eliminate the radial gap between the inner ring and the outer ring of the bearing piece, so that the positioning precision of the wafer is improved.
In order to achieve all or part of the purposes of the invention, the invention provides the following technical scheme:
the invention provides a wafer correction adsorption device which comprises a substrate, a bearing piece, an adsorption carrying platform, a vacuum generating device and a belt transmission mechanism, wherein the bearing piece is fixed on an inner ring and a rotatable outer ring on the substrate, and the outer ring is fixedly connected with the adsorption carrying platform; the belt transmission mechanism drives the outer ring of the bearing piece to rotate, so that the adsorption carrying platform is driven to rotate; the adsorption carrying platform is provided with a plurality of adsorption holes, the adsorption holes are communicated with the vacuum generating device, and the vacuum generating device is used for generating adsorption air flow to fix the product on the adsorption carrying platform. The beneficial effects of this technical scheme lie in, it is rotatory through the outer lane of taking drive mechanism drive bearing spare, and then realize adsorbing the rotation of microscope carrier, and this kind of drive mode makes the microscope carrier can not take place the slope at rotatory in-process, makes the rotation of microscope carrier more steady. The product described in the present invention may be a semiconductor device such as a wafer.
The wafer correction adsorption device can further comprise a limiting mechanism, the limiting mechanism comprises a fixed end and a limiting end, the fixed end is fixedly connected with the substrate, and the limiting end abuts against the adsorption carrying platform and applies acting force towards the rotating shaft to the adsorption carrying platform. The technical scheme has the advantages that the limiting mechanism is used for eliminating or reducing the radial gap between the inner ring and the outer ring of the bearing piece so as to ensure that the outer ring of the bearing piece does not deviate when rotating, thereby improving the positioning precision of a product on the adsorption carrier; the limiting mechanism is suitable for bearing parts with radial gaps between the inner ring and the outer ring, such as a rotary bearing and the like.
The fixed end is a connecting block, the limiting end is a roller, one end of the connecting block is connected with the roller, and the other end of the connecting block is fixedly arranged on the substrate; the circumferential surface of the adsorption carrying platform is provided with a circle of limiting grooves, and the rollers are abutted against the limiting grooves. The beneficial effect of this technical scheme lies in, the gyro wheel receives the effort of absorption platform to it and the rotation, consequently is difficult for producing serious wearing and tearing between gyro wheel and the spacing groove, is favorable to prolonging the life of device.
The limiting groove is a V-shaped limiting groove, and the surface of the roller, which is contacted with the V-shaped limiting groove, is of a matched V-shaped structure. The beneficial effects of this technical scheme lie in, guarantee to have certain area of contact between V type spacing groove and the gyro wheel to when adsorbing the microscope carrier rotation, can the stable contact between gyro wheel and the follow-up ring.
The adsorption carrying platform can further comprise a bearing part for fixing a product, and a follow-up part which is positioned below the bearing part, detachably connected with the bearing part and coaxially arranged, wherein the limiting groove is formed in the peripheral surface of the follow-up part. The technical scheme has the advantages that the size of the adsorption carrier is limited to a certain extent due to the fact that the adsorption carrier needs to bear and adsorb products such as wafers, the adsorption carrier is divided into the bearing part and the follow-up part which are detachably connected, the bearing part is used for adsorbing the products, and the follow-up part is used for arranging the limiting groove, so that the size of the follow-up part can be flexibly selected according to needs, the follow-up part and the roller are in a better matching state, and the limitation of the size of the products is not needed; preferably, the follow-up part can be arranged as a hollow follow-up ring, so that the mass of the adsorption carrier platform is reduced.
The structure that the limiting mechanism is arranged on the substrate can be as follows: the bottom of the base plate is provided with grooves corresponding to the limiting mechanisms in number, and the limiting mechanisms are arranged in the grooves.
The number of the limiting mechanisms is at least three, and the at least three limiting mechanisms are arranged around the rotating shaft of the adsorption carrying platform at equal angles at intervals.
The wafer correction adsorption device further comprises a tensioning mechanism, wherein the tensioning mechanism is installed on the base plate and used for adjusting the tensity of the synchronous belt.
The absorption carrying platform is provided with an induction block, and the base plate is provided with a sensing mechanism for sensing the induction block.
Specifically, the sensing mechanism comprises an origin sensor, and a first limit sensor and a second limit sensor which are symmetrically arranged on two sides of the origin sensor, when the rotation angle of the adsorption carrier is 0, the sensing block is located in the sensing area of the origin sensor, and when the adsorption carrier reaches a limit rotation angle, the sensing block is located in the sensing area of the first limit sensor or the second limit sensor. If the position of the wafer is accurately placed, a detection area on the wafer corresponds to the detection mechanism, the adsorption carrying platform does not need to rotate at the moment, the wafer is located at the optimal detection position, and the sensing block is located in the sensing area of the origin sensor at the moment; when the wafer is placed, the detection area on the wafer and the detection mechanism form a certain deviation angle, and at the moment, the control system controls the rotation driving mechanism to work so as to drive the adsorption carrying platform to rotate by a certain angle, so that the detection area on the product corresponds to the detection mechanism; when the first limit sensor or the second limit sensor senses the induction block, the adsorption carrier is described to have rotated to a limit position, the rotation angle of the adsorption carrier is the limit rotation angle, and if the deviation angle between the product and the detection mechanism is smaller than or equal to the limit rotation angle, the adsorption carrier can be rotated to perform positioning.
A plurality of adsorption holes on the adsorption carrier are arranged in an annular shape, an annular gas storage groove is communicated below the adsorption holes, the gas storage groove is communicated with a gas inlet, and the gas inlet is communicated with a vacuum generating device. The beneficial effects of this technical scheme lie in, realize the ascending vacuum adsorption of the whole circumferencial direction of product through round annular absorption hole, fix the product on adsorbing the microscope carrier.
Compared with the prior art, the invention has at least the following beneficial effects:
(1) the invention reduces the radial clearance between the inner ring and the outer ring of the bearing piece by arranging the limiting mechanism so as to improve the positioning precision of the wafer and ensure that the detection area of the wafer corresponds to the detection mechanism.
(2) The invention further discloses that the limiting end of the limiting mechanism can be a roller, the adsorption carrying platform can be provided with a limiting groove matched with the roller, the roller is abutted against the limiting groove to play a role in reducing/eliminating the radial clearance of the bearing piece, meanwhile, the roller and the limiting groove are not easy to generate serious abrasion, and the service life of the device is prolonged.
(3) The invention further discloses that the limiting groove can be a V-shaped limiting groove, and the contact surface of the roller, which is abutted against the limiting groove, is set to be a matched V-shaped structure so as to ensure the stability of the contact structure between the roller and the limiting groove.
Drawings
In order to more clearly illustrate the technical solutions in the specific embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings described below are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of a wafer calibration adsorption device according to an embodiment of the present invention;
FIG. 2 is a top view of a wafer alignment fixture in accordance with one embodiment of the present invention;
FIG. 3 is a cross-sectional view taken along A-A of FIG. 2;
FIG. 4 is an enlarged view at B in FIG. 3;
FIG. 5 is a bottom view of a wafer alignment adsorption apparatus according to one embodiment of the present invention;
FIG. 6 is a schematic structural diagram of a limiting mechanism and a follower ring according to a first embodiment of the present invention;
fig. 7 is a schematic diagram of an adsorption carrier according to an embodiment of the invention.
Reference numerals: 1-substrate, 101-groove, 2-bearing piece, 201-outer ring, 202-inner ring, 3-adsorption carrying platform, 301-follow-up ring, 3011-V type limiting groove, 302-carrying platform, 4-rotary driving mechanism, 5-synchronous wheel, 6-synchronous belt, 7-limiting mechanism, 701-connecting block, 702-roller, 8-tensioning mechanism, 9-induction block, 10-sensing mechanism, 1001-origin sensor, 1002-first limiting sensor, 1003-second limiting sensor, 11-adsorption hole and 12-air inlet.
Detailed Description
The technical solutions in the specific embodiments of the present invention will be clearly and completely described below, and it should be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example one
The invention provides a wafer correction adsorption device, please refer to fig. 1-3 in combination, which comprises a substrate 1, a bearing piece 2, an adsorption carrying platform 3, a vacuum generating device (not shown) and a belt transmission mechanism, wherein the belt transmission mechanism specifically comprises a rotary driving mechanism 4, a synchronous belt 6 and a synchronous wheel 5, an inner ring 202 of the bearing piece 2 is fixedly arranged on the substrate 1, an outer ring 201 is fixedly connected with the adsorption carrying platform 3, an output end of the rotary driving mechanism 4 is connected with the synchronous wheel 5, the synchronous belt 6 is sleeved on the outer ring 201 and the synchronous wheel 5 of the bearing piece 2, the rotary driving mechanism 4 drives the synchronous wheel 5 to rotate so as to drive the synchronous belt 6 to move, so that the outer ring 201 of the bearing piece 2 is driven to rotate relative to the inner ring 202, and the adsorption carrying platform 3 connected with the outer ring 201 rotates along with the synchronous belt; still be equipped with straining device 8 on the base plate 1, straining device 8 sets up in the hold-in range 6 outside for adjust hold-in range 6's rate of tension.
In the present embodiment, the rotation driving mechanism 4 is a rotating electric machine, but in other embodiments, a mechanism having the same or similar function, such as a rotating cylinder, may be used instead.
Referring to fig. 3-6, in order to reduce the radial gap between the inner ring 202 and the outer ring 201 of the bearing 2, the wafer correction adsorption device provided in this embodiment further includes four limiting mechanisms 7, the bottom of the substrate 1 is provided with four grooves 101, the limiting mechanisms 7 are installed in the grooves 101, and the four limiting mechanisms 7 are arranged in a central symmetry manner with respect to the rotation axis of the adsorption carrier 3; the limiting mechanism 7 comprises a roller 702 and a connecting block 701, one end of the connecting block 701 is fixedly installed in the groove 101, the other end of the connecting block 701 is connected with the roller 702, the adsorption carrying platform 3 comprises a bearing part and a follow-up ring 301, the bearing part is used for bearing a product, the follow-up ring 301 is detachably connected with the bearing part and coaxially arranged, a circle of V-shaped limiting groove 3011 is formed in the peripheral surface of the follow-up ring 301, the roller 702 of the limiting mechanism 7 abuts against the V-shaped limiting groove 3011, and the contact surface of the roller 702 abutting against the V-shaped limiting groove 3011 is also set to be of a corresponding V-shaped structure so as to guarantee stable contact between the roller 702 and the V-shaped limiting groove 3011. When the follower ring 301 rotates, on one hand, the connecting block 701 of the position limiting mechanism 7 is fixedly mounted on the substrate 1 and keeps a constant relative position with the inner ring 202 of the bearing member 2 also mounted on the substrate 1, and on the other hand, the roller 702 in the position limiting mechanism 7 abuts against the follower ring 301 through the V-shaped limiting groove 3011 and applies a force to the follower ring 301 in the direction of the rotation axis, and the follower ring 301 is indirectly connected with the outer ring 201 of the bearing member 2 through the bearing part of the suction stage 3, so that the roller 702 actually indirectly applies a force to the outer ring 201 of the bearing member 2 in the direction of the rotation axis to tightly press against the outer ring 201, thereby achieving the effect of reducing or eliminating the radial gap between the inner ring 202 and the outer ring 201 of the bearing member 2 and improving the alignment accuracy.
In the embodiment, the bearing piece 2 is a rotary bearing, and in order to ensure that a certain acting force is exerted between the synchronous belt 6 and the outer ring 201 of the bearing piece 2, the outer ring 201 of the bearing piece 2 is provided with grains to increase the friction force; the above-described stop mechanism 7 is also applicable to other kinds of bearing members 2 having a radial clearance, in addition to the slewing bearing. In this embodiment, limiting mechanisms 7 are four, but in other embodiments, the number of limiting mechanisms 7 can be specifically set according to the diameter of bearing piece 2 or other factors, but in order to ensure the effect of reducing the radial gap, the number of limiting mechanisms 7 is preferably not less than three, and three limiting mechanisms 7 are not simultaneously located on the same side of the symmetry axis of adsorption carrier 3. In addition, the limiting groove in this embodiment is a V-shaped groove, and the surface of the roller 702 abutting against the limiting groove is also set to be a matched V-shaped structure, so as to ensure that a certain contact area is provided between the limiting groove and the roller 702 to improve the stability of the contact structure, but in other embodiments, on the basis that the radial clearance of the bearing member 2 is reduced/eliminated by ensuring the limiting mechanism 7, the limiting groove and the roller 702 may also be other shape structures, for example, the contact structure between the limiting groove and the roller 702 is a line contact. The limiting end in this embodiment is the roller 702, and when the follower ring 301 rotates, the roller 702 rotates under the action of the follower ring 301 on the roller, so that the roller 702 and the V-shaped limiting groove 3011 are not prone to serious wear, which is beneficial to prolonging the service life of the device, but the roller 702 may be replaced by other elements with the same or similar effect.
As shown in fig. 1 and 2, an induction block 9 is disposed at an edge position of the adsorption stage 3, a sensing mechanism 10 is correspondingly disposed on the substrate 1, the sensing mechanism 10 includes an origin sensor 1001, a first limit sensor 1002, and a second limit sensor 1003, when a rotation angle of the adsorption stage 3 is 0 (that is, when the induction block 9 is located at the origin), the induction block 9 is located in an induction area of the origin sensor 1001, the first limit sensor 1002 and the second limit sensor 1003 are symmetrically disposed at two sides of the origin sensor 1001, and the induction areas of the first limit sensor 1002 and the second limit sensor 1003 are limit positions that can be reached when the adsorption stage 3 rotates. If the position of the wafer is placed accurately, each detection area on the wafer corresponds to the probe one by one, the adsorption carrying platform 3 does not need to rotate (namely the origin sensor 1001 senses the sensing block 9), the wafer is located at the optimal detection position, but actually, the wafer is placed with an angle deviation, namely, the detection area on the wafer and the probe form a certain deviation angle, and at the moment, the control system controls the rotation driving mechanism 4 to work so as to drive the adsorption carrying platform 3 to rotate by a certain angle, so that the detection area on the wafer corresponds to the probe; when the first limit sensor 1002 or the second limit sensor 1003 senses the sensing block 9, it indicates that the adsorption stage 3 has reached the limit rotation angle, and if the deviation angle between the wafer and the probe is smaller than or equal to the limit rotation angle, the positioning can be performed by rotating the adsorption stage 3.
As shown in fig. 1 and 7, a raised wafer supporting platform 302 is disposed on the adsorption carrying platform 3 for supporting a wafer, a plurality of adsorption holes 11 are disposed on the wafer supporting platform 302 in an annular arrangement, a plurality of annular gas storage tanks are communicated with the lower portions of the adsorption holes 11, each gas storage tank is provided with a gas inlet 12, the gas inlets 12 are communicated with a vacuum generating device, and the vacuum generating device is configured to generate an adsorption gas flow to fix the wafer on the wafer supporting platform 302.
Example two
The difference between this embodiment and the first embodiment is that the bearing member 2 is a cross roller bearing with a radial gap within an acceptable range, so the wafer correction adsorption apparatus in this embodiment does not need to be provided with the limiting mechanism 7 and the follower ring 301.
The wafer correction adsorption device provided by the invention is described in detail above, and the principle of the invention is explained by applying a specific example in the text, and the description of the above embodiment is only used to help understanding the method and the core idea of the invention. It should be noted that, for those skilled in the art, it is possible to make various improvements and modifications to the present invention without departing from the principle of the present invention, and those improvements and modifications also fall within the scope of the claims of the present invention.
Claims (10)
1. The wafer correction adsorption device is characterized by comprising a substrate (1), a bearing piece (2), an adsorption carrying platform (3), a vacuum generating device and a belt transmission mechanism, wherein the bearing piece (2) comprises an inner ring (202) fixed on the substrate (1) and a rotatable outer ring (201), the outer ring (201) is fixedly connected with the adsorption carrying platform (3), and the belt transmission mechanism drives the outer ring (201) of the bearing piece (2) to rotate so as to drive the adsorption carrying platform (3) to rotate; the adsorption carrying platform (3) is provided with a plurality of adsorption holes (11), the adsorption holes (11) are communicated with the vacuum generating device, and the vacuum generating device is used for generating adsorption air flow to fix a product on the adsorption carrying platform (3).
2. The wafer correction adsorption device according to claim 1, further comprising a limiting mechanism (7), wherein the limiting mechanism (7) comprises a fixed end and a limiting end, the fixed end is fixedly connected with the substrate (1), and the limiting end abuts against the adsorption stage (3) and applies a force to the adsorption stage (3) towards the rotation axis.
3. The wafer correction adsorption device according to claim 2, wherein the fixed end is a connecting block (701), the limiting end is a roller (702), one end of the connecting block (701) is connected with the roller (702), and the other end is fixedly mounted on the substrate (1); the circumferential surface of the adsorption carrying platform (3) is provided with a circle of limiting grooves, and the rollers (702) are abutted against the limiting grooves.
4. The wafer correction adsorption device of claim 3, wherein the limiting groove is a V-shaped limiting groove (3011), and the contact surface of the roller (702) and the V-shaped limiting groove (3011) is configured to be a matched V-shaped structure.
5. The wafer correction adsorption device according to claim 3, wherein the adsorption stage (3) comprises a bearing part for fixing a product, and a follow-up part which is positioned below the bearing part, detachably connected with the bearing part and coaxially arranged, and the limiting groove is opened on the peripheral surface of the follow-up part.
6. The wafer correction adsorption device according to claim 2, wherein the bottom of the substrate (1) is provided with grooves (101) corresponding to the number of the limiting mechanisms (7), and the limiting mechanisms (7) are arranged in the grooves (101).
7. The wafer correction adsorption device according to claim 2, characterized in that the number of the limiting mechanisms (7) is at least three, and the at least three limiting mechanisms (7) are arranged at equal angles around the rotation axis of the adsorption stage (3).
8. The wafer correction adsorption device according to claim 1, wherein a sensing block (9) is arranged on the adsorption stage (3), and a sensing mechanism (10) is arranged on the substrate (1) and used for sensing the sensing block (9).
9. The wafer correction adsorption device of claim 8, wherein the sensing mechanism (10) comprises a home position sensor (1001) and a first limit sensor (1002) and a second limit sensor (1003) symmetrically arranged on both sides of the home position sensor (1001), when the rotation angle of the adsorption stage (3) is 0, the sensing block (9) is located in a sensing area of the home position sensor (1001), and when the adsorption stage (3) reaches a limit rotation angle, the sensing block (9) is located in a sensing area of the first limit sensor (1002) or the second limit sensor (1003).
10. The wafer correction adsorption device according to claim 1, wherein a plurality of adsorption holes (11) on the adsorption carrier (3) are arranged in a ring shape, an annular air storage tank is communicated below the adsorption holes (11), the air storage tank is communicated with an air inlet (12), and the air inlet (12) is communicated with a vacuum generation device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210226761.3A CN114724998A (en) | 2022-03-09 | 2022-03-09 | Wafer correction adsorption device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210226761.3A CN114724998A (en) | 2022-03-09 | 2022-03-09 | Wafer correction adsorption device |
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| Publication Number | Publication Date |
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| CN114724998A true CN114724998A (en) | 2022-07-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210226761.3A Pending CN114724998A (en) | 2022-03-09 | 2022-03-09 | Wafer correction adsorption device |
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| CN (1) | CN114724998A (en) |
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- 2022-03-09 CN CN202210226761.3A patent/CN114724998A/en active Pending
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