CN114713908A - Cutting device is used in processing of semiconductor aluminum plate - Google Patents

Cutting device is used in processing of semiconductor aluminum plate Download PDF

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Publication number
CN114713908A
CN114713908A CN202210425066.XA CN202210425066A CN114713908A CN 114713908 A CN114713908 A CN 114713908A CN 202210425066 A CN202210425066 A CN 202210425066A CN 114713908 A CN114713908 A CN 114713908A
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CN
China
Prior art keywords
fixedly connected
aluminum plate
plate
guide rail
cleaning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN202210425066.XA
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Chinese (zh)
Inventor
华巍
赵海龙
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangsu Xinhang Oriental Technology Co ltd
Original Assignee
Jiangsu Xinhang Oriental Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangsu Xinhang Oriental Technology Co ltd filed Critical Jiangsu Xinhang Oriental Technology Co ltd
Priority to CN202210425066.XA priority Critical patent/CN114713908A/en
Publication of CN114713908A publication Critical patent/CN114713908A/en
Withdrawn legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23DPLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D47/00Sawing machines or sawing devices working with circular saw blades, characterised only by constructional features of particular parts
    • B23D47/02Sawing machines or sawing devices working with circular saw blades, characterised only by constructional features of particular parts of frames; of guiding arrangements for work-table or saw-carrier
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23DPLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D47/00Sawing machines or sawing devices working with circular saw blades, characterised only by constructional features of particular parts
    • B23D47/04Sawing machines or sawing devices working with circular saw blades, characterised only by constructional features of particular parts of devices for feeding, positioning, clamping, or rotating work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23DPLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D59/00Accessories specially designed for sawing machines or sawing devices
    • B23D59/006Accessories specially designed for sawing machines or sawing devices for removing or collecting chips
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

Abstract

The invention discloses a cutting device for processing a semiconductor aluminum plate, which comprises a workbench table, wherein the top of the workbench table is provided with an aluminum plate to be cut, a cutting knife module, an aluminum plate fixing module and a table top cleaning mechanism, the table top cleaning mechanism comprises guide rail boxes fixedly connected to two sides of the top of the workbench table, a cleaning strip is movably connected between the two guide rail boxes, two ends of the cleaning strip extend into the guide rail boxes and are fixedly connected with accommodating boxes, the inner parts of the accommodating boxes are fixedly connected with traveling motors, and rotating shafts of the traveling motors extend to the outer parts of the accommodating boxes and are fixedly connected with traveling gears. According to the invention, the table top cleaning mechanism is arranged at the top of the table top of the workbench, and the walking motor drives the walking gear to move on the rack during cleaning, so that the cleaning strip can sweep away metal debris on the table top, and the cutting machine has the advantage of quickly cleaning up the metal debris on the workbench after cutting.

Description

Cutting device is used in processing of semiconductor aluminum plate
Technical Field
The invention relates to the technical field of semiconductor aluminum plate processing, in particular to a cutting device for semiconductor aluminum plate processing.
Background
The aluminum plate is a rectangular plate rolled by an aluminum ingot, and is classified into a pure aluminum plate, an alloy aluminum plate, a thin aluminum plate, a medium-thickness aluminum plate, and a patterned aluminum plate, where an aluminum material having a thickness of 0.2mm or more and 500mm or less, a width of 200mm or more, and a length of 16m or less is referred to as an aluminum plate or an aluminum sheet, an aluminum material having a thickness of 0.2mm or less and a width of 200mm or less is referred to as an aluminum plate or an aluminum sheet, and a row material or a bar material is referred to as an aluminum plate having a width of 200mm or less (of course, with the progress of large equipment, there are many aluminum plates having a maximum width of 600 mm). And semiconductor aluminum plate adds man-hour needs to cut monoblock aluminum plate into a plurality of fritters, when cutting, has metal piece to drop on the workstation, and these pieces are not in time cleared up, can lead to aluminum plate to be in states such as perk because of the table surface unevenness when placing lower aluminum plate, are unfavorable for aluminum plate's fine processing to the size that cuts that leads to aluminum plate appears the deviation easily.
Disclosure of Invention
In order to solve the problems in the background art, the invention aims to provide a cutting device for processing a semiconductor aluminum plate, which has the advantage of quickly cleaning metal fragments on a workbench after cutting, and solves the problem that the existing cutting device cannot timely clean the metal fragments falling on the workbench.
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a cutting device is used in processing of semiconductor aluminum plate, includes the workstation table, the top of workstation table is provided with and waits to cut aluminum plate, cutting knife module, aluminum plate fixed module and mesa clearance mechanism, mesa clearance mechanism includes the guide rail box of fixed connection in workstation table top both sides, and swing joint has between two guide rail boxes to clean the strip, the both ends of cleaning the strip all extend to the inside and fixedly connected with of guide rail box and hold the box, the inside fixedly connected with walking motor who holds the box, the pivot of walking motor extends to the outside and the fixedly connected with walking gear that holds the box, the inner wall fixedly connected with of guide rail box is located the rack of walking gear bottom, walking wheel and rack toothing, the both sides of workstation table all are provided with scale removal mechanism.
Preferably, the sweeping strip comprises a connecting strip body fixedly connected with the accommodating box, the bottom of the connecting strip body is fixedly connected with a sponge, and the bottoms of two sides of the connecting strip body are fixedly connected with bristles.
Preferably, the top of the inner wall of the guide rail box is fixedly connected with a pressure spring, the bottom of the pressure spring is fixedly connected with a pressure plate, and the pressure plate is in sliding connection with the accommodating box.
Preferably, the descaling mechanism comprises scale storage grooves arranged on two sides of the top of the table top of the workbench, the top of the guide rail box is fixedly connected with a water spraying plate positioned on the top of the scale storage groove, a water inlet of the water spraying plate is communicated with a water distribution pipe, two sides of the bottom of the table top of the workbench are fixedly connected with water storage tanks, the outer wall of each water storage tank is fixedly connected with a water pump, a water inlet pipe and a water outlet pipe of each water pump are respectively communicated with the water storage tank and the water distribution pipe, and the scale storage grooves are communicated with the water storage tanks through pipelines.
Preferably, a filter screen is fixedly connected to the inside of the scale storage tank.
Preferably, the cutting knife module comprises a rack fixedly connected to two sides of the top of the table top of the workbench, the top of the rack is fixedly connected with a first air cylinder, the output end of the first air cylinder extends into the rack and is fixedly connected with a connecting frame, a screw rod is movably mounted at the bottom of the connecting frame through a bearing, the back of the connecting frame is fixedly connected with a transmission motor, the output end of the transmission motor is fixedly connected with the screw rod, the surface of the screw rod is in threaded connection with a transmission sleeve, the transmission sleeve is in sliding connection with the connecting frame, the bottom of the transmission sleeve is fixedly connected with a connecting cover, the inside of the connecting cover is movably connected with a saw blade, the right side of the connecting cover is fixedly connected with a cutting motor, and the output end of the cutting motor is fixedly connected with the saw blade.
Preferably, the aluminum plate fixing module comprises a fixing frame fixedly connected to two sides of the bottom of the workbench table plate, the bottom of the fixing frame is fixedly connected with a second air cylinder, an output end of the second air cylinder extends into the fixing frame and is fixedly connected with a pressure head, and the top end of the pressure head extends to the top of the workbench table plate and is attached to the top of the aluminum plate to be cut.
Compared with the prior art, the invention has the following beneficial effects:
1. according to the invention, the table top cleaning mechanism is arranged at the top of the table top of the workbench, and the walking motor drives the walking gear to move on the rack during cleaning, so that the cleaning strip can sweep metal scraps on the table top of the workbench, and the cleaning device has the advantage of quickly cleaning the metal scraps on the workbench after cutting.
2. According to the invention, the cleaning strip consisting of the sponge and the bristles is arranged, so that large-particle metal debris is swept away by the bristles and the small-particle metal debris is adsorbed and pushed by the sponge during cleaning, and the table top is cleaned.
3. According to the invention, by arranging the pressure spring and the pressure plate, when the cleaning strip moves, the downward pressure is applied to the accommodating box to enhance the adhesion tightness between the cleaning strip and the working table board, and the meshing tightness between the traveling gear and the rack can be enhanced.
4. According to the invention, the descaling mechanism is arranged, after the sweeping strip sweeps off the metal debris, the metal debris is adhered to the brush and the sponge, the adhered metal debris is removed in a water spraying cleaning mode and is concentrated in the scale storage tank, so that the concentrated cleaning effect can be achieved, and the sprayed water can be recycled in the water storage tank for reuse, so that the energy-saving and environment-friendly effects are realized.
5. According to the invention, by arranging the filter screen, when the metal debris on the sweeping strip is cleaned by spraying water, the metal debris can possibly flow into the water storage box, solid-liquid separation is realized by using the filter screen, and the large metal debris is prevented from entering the water storage box.
6. According to the invention, the cutting knife module is arranged, the saw blade can move up and down and back and forth by utilizing the matching of the air cylinder and the transmission motor, the saw blade is lifted after cutting, the phenomenon that the saw blade obstructs the operation of a table top cleaning mechanism is avoided, and the structure can also facilitate the adjustment of the saw blade according to the specification of an aluminum plate.
7. According to the aluminum plate cutting device, the aluminum plate fixing module is arranged, the pressure head is driven by the air cylinder to press the aluminum plate to be cut downwards during cutting, the aluminum plate to be cut can not move during cutting, and therefore the cutting precision is guaranteed.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic side view of a cutting blade module according to the present invention;
FIG. 3 is a perspective view of the indenter of the present invention;
FIG. 4 is a schematic top view of the guide rail box of the present invention;
FIG. 5 is a schematic top view of the table top cleaning mechanism of the present invention;
FIG. 6 is a schematic view of a compression spring and a compression plate of the present invention;
FIG. 7 is a schematic view of a sweeping strip of the present invention;
FIG. 8 is a schematic view of the descaling mechanism according to the present invention.
In the figure: 1. a table plate of the working table; 2. an aluminum plate to be cut; 3. a cutter module; 31. a frame; 32. a first cylinder; 33. a connecting frame; 34. a screw; 35. a drive motor; 36. a driving sleeve; 37. a connecting cover; 38. a saw blade; 39. cutting the motor; 4. fixing the module by an aluminum plate; 41. a fixed mount; 42. a second cylinder; 43. a pressure head; 5. a table top cleaning mechanism; 51. a guide rail box; 52. cleaning strips; 521. a connecting bar body; 522. a sponge; 523. brushing; 53. accommodating the box; 54. a traveling motor; 55. a traveling gear; 56. a rack; 6. a descaling mechanism; 61. a scale storage tank; 62. a water spray plate; 63. a water diversion pipe; 64. a water storage tank; 65. a water pump; 7. a pressure spring; 8. pressing a plate; 9. and (4) a filter screen.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1 to 8, a cutting device for processing a semiconductor aluminum plate comprises a worktable table 1, wherein an aluminum plate 2 to be cut, a cutter module 3, an aluminum plate fixing module 4 and a table top cleaning mechanism 5 are arranged at the top of the worktable table 1, the table top cleaning mechanism 5 comprises guide rail boxes 51 fixedly connected at two sides of the top of the worktable table 1, and swing joint has cleaning strip 52 between two guide rail boxes 51, cleaning strip 52's both ends all extend to the inside of guide rail box 51 and fixedly connected with holds box 53, hold box 53's inside fixedly connected with walking motor 54, walking motor 54's pivot extends to the outside and the fixedly connected with walking gear 55 that hold box 53, the inner wall fixedly connected with of guide rail box 51 is located the rack 56 of walking gear 55 bottom, walking gear 55 and rack 56 mesh, the both sides of workstation table 1 all are provided with descaling mechanism 6.
Referring to fig. 7, the sweeping bar 52 includes a connecting bar body 521 fixedly connected to the accommodating case 53, a sponge 522 fixedly connected to the bottom of the connecting bar body 521, and bristles 523 fixedly connected to the bottoms of both sides of the connecting bar body 521.
As a technical optimization scheme of the invention, by arranging the sweeping strip 52 consisting of the sponge 522 and the bristles 523, large-particle metal debris is swept away by the bristles 523 and is adsorbed and pushed by the sponge 522 during sweeping, so that the table top is swept clean.
Referring to fig. 6, a pressure spring 7 is fixedly connected to the top of the inner wall of the guide rail box 51, a pressure plate 8 is fixedly connected to the bottom of the pressure spring 7, and the pressure plate 8 is slidably connected to the accommodating box 53.
As a technical optimization scheme of the invention, by arranging the pressure spring 7 and the pressure plate 8, when the cleaning strip 52 moves, the downward pressure is given to the accommodating box 53 to enhance the close fit between the cleaning strip 52 and the workbench table plate 1, and simultaneously, the close fit between the walking gear 55 and the rack 56 can be enhanced.
Referring to fig. 1 and 8, the descaling mechanism 6 includes deposit groove 61 that sets up in 1 top both sides of workstation table, the top fixedly connected with of guide rail box 51 is located the water spray plate 62 at deposit groove 61 top, the water inlet intercommunication of water spray plate 62 has distributive pipe 63, the equal fixedly connected with in both sides of workstation table 1 bottom deposits water tank 64, the outer wall fixedly connected with water pump 65 of depositing water tank 64, water pump 65's inlet tube and outlet pipe communicate with deposit water tank 64 and distributive pipe 63 respectively, through the pipeline intercommunication between deposit groove 61 and the deposit water tank 64.
As a technical optimization scheme of the invention, by arranging the descaling mechanism 6, after the sweeping strip 52 sweeps off the metal debris, the metal debris is adhered to the brush and the sponge 522, the adhered metal debris is removed in a water spraying cleaning mode and is concentrated in the scale storage groove 61, so that the concentrated cleaning effect can be achieved, and the sprayed water can be recycled in the water storage tank 64 for reuse, thereby saving energy and protecting environment.
Referring to fig. 8, a filter screen 9 is fixedly connected to the inside of the scale storage tank 61.
As a technical optimization scheme of the invention, by arranging the filter screen 9, when the metal debris on the cleaning strip 52 is cleaned by spraying water, the metal debris may flow into the water storage tank 64, and the filter screen 9 is utilized to realize solid-liquid separation, so that the large metal debris is prevented from entering the water storage tank 64.
Referring to fig. 1 and 2, the cutting knife module 3 includes a frame 31 fixedly connected to both sides of the top of the table top 1, a first cylinder 32 fixedly connected to the top of the frame 31, an output end of the first cylinder 32 extends to the inside of the frame 31 and is fixedly connected with a connecting frame 33, a screw 34 is movably mounted at the bottom of the connecting frame 33 through a bearing, a transmission motor 35 is fixedly connected to the back of the connecting frame 33, an output end of the transmission motor 35 is fixedly connected with the screw 34, a surface thread of the screw 34 is connected with a transmission sleeve 36, the transmission sleeve 36 is slidably connected with the connecting frame 33, a connecting cover 37 is fixedly connected to the bottom of the transmission sleeve 36, a saw blade 38 is movably connected to the inside of the connecting cover 37, a cutting motor 39 is fixedly connected to the right side of the connecting cover 37, and an output end of the cutting motor 39 is fixedly connected with the saw blade 38.
As a technical optimization scheme of the invention, by arranging the cutter module 3 and utilizing the matching of the air cylinder and the transmission motor 35, the saw blade 38 can move up and down and back and forth, and the saw blade 38 is lifted after cutting, so that the condition that the saw blade 38 hinders the operation of the table top cleaning mechanism 5 is avoided, and the structure can also facilitate the adjustment of the saw blade 38 according to the specification of an aluminum plate.
Referring to fig. 1, 3 and 4, aluminum plate fixing module 4 includes a fixing frame 41 fixedly connected to both sides of bottom of work table board 1, a second cylinder 42 is fixedly connected to bottom of fixing frame 41, an output end of second cylinder 42 extends to inside of fixing frame 41 and is fixedly connected with a pressure head 43, and a top end of pressure head 43 extends to the top of work table board 1 and is attached to the top of aluminum plate 2 to be cut.
As a technical optimization scheme of the invention, the aluminum plate fixing module 4 is arranged, and the air cylinder drives the pressure head 43 to press the aluminum plate 2 to be cut downwards during cutting, so that the aluminum plate 2 to be cut can not move during cutting, and the cutting precision is ensured.
According to the invention, the aluminum plate 2 to be cut is placed at the top of the table plate 1 of the workbench, the second air cylinder 42 is used for driving the pressure head 43 to move downwards to press the aluminum plate 2 to be cut, then the cutting motor 39 is used for driving the saw blade 38 to rotate, the first air cylinder 32 is used for driving the connecting frame 33 to move downwards to adjust the height of the saw blade 38, the transmission motor 35 is used for driving the screw 34 to rotate to adjust the back-and-forth movement distance of the saw blade 38, after the cutting is finished, the second air cylinder 42 is used for lifting the pressure head 43, then the cut aluminum plate 2 to be cut is taken down, then the cleaning is started, and during the cleaning, the traveling motor 54 is used for driving the traveling gear 55 to rotate, so that the traveling gear 55 travels on the rack 56, the traveling motor 54 is used for driving the containing box 53 to move, and the containing box 53 is used for driving the cleaning strip 52 to move to clean the top of the table plate 1 of the workbench.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (7)

1. The utility model provides a cutting device is used in processing of semiconductor aluminum plate, includes workstation table (1), its characterized in that: the top of the workbench table plate (1) is provided with an aluminum plate (2) to be cut, a cutting knife module (3), an aluminum plate fixing module (4) and a table top cleaning mechanism (5), the table top cleaning mechanism (5) comprises guide rail boxes (51) fixedly connected to two sides of the top of the workbench table plate (1), a cleaning strip (52) is movably connected between the two guide rail boxes (51), two ends of the cleaning strip (52) extend to the inside of the guide rail boxes (51) and are fixedly connected with accommodating boxes (53), the inside of each accommodating box (53) is fixedly connected with a walking motor (54), a rotating shaft of the walking motor (54) extends to the outside of the accommodating boxes (53) and is fixedly connected with a walking gear (55), the inner wall of each guide rail box (51) is fixedly connected with a rack (56) located at the bottom of the walking gear (55), and the walking gear (55) is meshed with the rack (56), and descaling mechanisms (6) are arranged on two sides of the working table plate (1).
2. The cutting device for processing the semiconductor aluminum plate as claimed in claim 1, wherein: the sweeping strip (52) comprises a connecting strip body (521) fixedly connected with the accommodating box (53), the bottom of the connecting strip body (521) is fixedly connected with a sponge (522), and the bottoms of two sides of the connecting strip body (521) are fixedly connected with bristles (523).
3. The cutting device for processing the semiconductor aluminum plate as claimed in claim 2, wherein: the top fixedly connected with pressure spring (7) of guide rail box (51) inner wall, the bottom fixedly connected with clamp plate (8) of pressure spring (7), clamp plate (8) with hold box (53) sliding connection.
4. The cropping device for processing the semiconductor aluminum plate as recited in claim 3, wherein: descaling mechanism (6) are including offering deposit dirt groove (61) in workstation table (1) top both sides, the top fixedly connected with of guide rail box (51) is located water spray plate (62) at deposit dirt groove (61) top, the water inlet intercommunication of water spray plate (62) has distributive pipe (63), the equal fixedly connected with in both sides of workstation table (1) bottom deposits water tank (64), the outer wall fixedly connected with water pump (65) of depositing water tank (64), the inlet tube and the outlet pipe of water pump (65) communicate with water tank (64) and distributive pipe (63) respectively, deposit through the pipeline intercommunication between dirt groove (61) and the water tank (64).
5. The cropping device for processing the semiconductor aluminum plate as recited in claim 4, wherein: the inside of the scale storage tank (61) is fixedly connected with a filter screen (9).
6. The cropping device for processing the semiconductor aluminum plate as recited in claim 5, wherein: the cutting knife module (3) comprises a frame (31) fixedly connected to two sides of the top of the workbench table plate (1), a first air cylinder (32) fixedly connected to the top of the frame (31), an output end of the first air cylinder (32) extends to the inside of the frame (31) and is fixedly connected with a connecting frame (33), a screw rod (34) is arranged at the bottom of the connecting frame (33) through a bearing movable mounting mode, a transmission motor (35) is fixedly connected to the back of the connecting frame (33), an output end of the transmission motor (35) is fixedly connected with the screw rod (34), a transmission sleeve (36) is connected to the surface thread of the screw rod (34), the transmission sleeve (36) is slidably connected with the connecting frame (33), a connecting cover (37) is fixedly connected to the bottom of the transmission sleeve (36), and a saw blade (38) is movably connected to the inside of the connecting cover (37), the right side fixedly connected with cutting motor (39) of connecting cover (37), the output and saw bit (38) fixed connection of cutting motor (39).
7. The cropping device for processing the semiconductor aluminum plate as recited in claim 6, wherein: aluminum plate fixed module (4) include mount (41) of fixed connection in workstation table (1) bottom both sides, the bottom fixedly connected with second cylinder (42) of mount (41), the output of second cylinder (42) extends to the inside and the fixedly connected with pressure head (43) of mount (41), the top of pressure head (43) extend to the top of workstation table (1) and with wait to cut the top laminating of aluminum plate (2).
CN202210425066.XA 2022-04-22 2022-04-22 Cutting device is used in processing of semiconductor aluminum plate Withdrawn CN114713908A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210425066.XA CN114713908A (en) 2022-04-22 2022-04-22 Cutting device is used in processing of semiconductor aluminum plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210425066.XA CN114713908A (en) 2022-04-22 2022-04-22 Cutting device is used in processing of semiconductor aluminum plate

Publications (1)

Publication Number Publication Date
CN114713908A true CN114713908A (en) 2022-07-08

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Application Number Title Priority Date Filing Date
CN202210425066.XA Withdrawn CN114713908A (en) 2022-04-22 2022-04-22 Cutting device is used in processing of semiconductor aluminum plate

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117020307A (en) * 2023-10-09 2023-11-10 江苏攀森智能科技有限公司 Sawing device for machining motor shell and sawing method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117020307A (en) * 2023-10-09 2023-11-10 江苏攀森智能科技有限公司 Sawing device for machining motor shell and sawing method thereof
CN117020307B (en) * 2023-10-09 2023-12-19 江苏攀森智能科技有限公司 Sawing device for machining motor shell and sawing method thereof

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Application publication date: 20220708