CN114702706A - 400 ℃ high-temperature-resistant colorless transparent polyimide film and preparation method thereof - Google Patents

400 ℃ high-temperature-resistant colorless transparent polyimide film and preparation method thereof Download PDF

Info

Publication number
CN114702706A
CN114702706A CN202210160348.1A CN202210160348A CN114702706A CN 114702706 A CN114702706 A CN 114702706A CN 202210160348 A CN202210160348 A CN 202210160348A CN 114702706 A CN114702706 A CN 114702706A
Authority
CN
China
Prior art keywords
film
mixed
diamine
temperature
dianhydride
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202210160348.1A
Other languages
Chinese (zh)
Other versions
CN114702706B (en
Inventor
冷劲松
肖鑫礼
刘彦菊
孔德艳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Harbin Institute of Technology
Original Assignee
Harbin Institute of Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harbin Institute of Technology filed Critical Harbin Institute of Technology
Priority to CN202210160348.1A priority Critical patent/CN114702706B/en
Publication of CN114702706A publication Critical patent/CN114702706A/en
Application granted granted Critical
Publication of CN114702706B publication Critical patent/CN114702706B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18Manufacture of films or sheets
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C41/00Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
    • B29C41/24Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of indefinite length
    • B29C41/28Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of indefinite length by depositing flowable material on an endless belt
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C55/00Shaping by stretching, e.g. drawing through a die; Apparatus therefor
    • B29C55/02Shaping by stretching, e.g. drawing through a die; Apparatus therefor of plates or sheets
    • B29C55/10Shaping by stretching, e.g. drawing through a die; Apparatus therefor of plates or sheets multiaxial
    • B29C55/12Shaping by stretching, e.g. drawing through a die; Apparatus therefor of plates or sheets multiaxial biaxial
    • B29C55/16Shaping by stretching, e.g. drawing through a die; Apparatus therefor of plates or sheets multiaxial biaxial simultaneously
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003Preparatory processes
    • C08G73/1007Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1039Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2007/00Flat articles, e.g. films or sheets
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Shaping By String And By Release Of Stress In Plastics And The Like (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)

Abstract

The invention discloses a 400 ℃ high-temperature-resistant colorless transparent polyimide film and a preparation method thereof. The method comprises the following steps: dissolving mixed diamine in an aprotic polar solvent, adding mixed dianhydride in several times, performing polycondensation reaction to obtain a precursor polyamic acid solution, casting the precursor polyamic acid solution on a steel belt through a casting machine, and baking to reduce the content of the aprotic polar solvent to obtain a self-supporting film; carrying out thermal imidization and stretching treatment on the self-supporting film; finally, cooling and post-processing to obtain a CPI film; mixing diamine: 9, 9-bis- (3-fluoro-4-aminophenyl) fluorene: 2, 2' -bis (trifluoromethyl) diaminobiphenyl: 9, 9-bis- (4-aminophenyl) fluorene: 2, 2-bis (4-aminophenyl) hexafluoropropane; mixed dianhydride: 9, 9-bis (3, 4-dicarboxyphenyl) fluorene dianhydride: 4,4' — (hexafluoroisopropylidene) diphthalic anhydride: 3,3 ', 4,4' -benzophenone tetracarboxylic dianhydride; the CPI film prepared by the invention has a cold-heat expansion ratio of not more than 0.20% at 400 ℃, and the light transmittance of a 75-micron thick film at 450nm is not less than 89%.

Description

400 ℃ high-temperature-resistant colorless transparent polyimide film and preparation method thereof
Technical Field
The invention relates to a 400 ℃ high-temperature-resistant colorless transparent polyimide film and a preparation method thereof.
Background
The flexible substrate is an important component of the whole flexible display device, plays an important role in protecting and supporting the flexible display device, has performance which directly affects the quality and service life of the flexible electronic device, is a key for realizing the flexible display technology, and is also a serious difficulty in the research process. At present, colored Polyimide (PI) suitable for Top-emission (Top-emission) devices has begun to be widely applied to flexible display devices due to its excellent high temperature, dimensional stability and good mechanical properties. However, the colored PI reduces the transmittance of the flexible electrode, affects the absorption and transmission of light, and reduces the performance of the device. In contrast, a colorless transparent polyimide (CPI) substrate suitable for both top-emission and Bottom-emission type (Bottom-emission) devices has a greater potential for application in the field of flexible displays. However, the conventional CPI has obvious defects in heat resistance level, high-temperature dimensional stability and high-temperature transparency.
CPI heat resistance requirements are considered based on process temperatures of key components in flexible devices, such as transistor (TFT) backplanes, which are most commonly low temperature poly-silicon (LTPS) process temperatures in TFT technology, often as high as 400 ℃, which is responsible for the CPI glass transition temperature (T ℃)g) Put forward a high demand, TgMust be higher than 400 deg.c. Secondly, if the flexible substrate can not maintain excellent dimensional stability in a high temperature process, the quality and reliability of the final display device will be seriously affected. For example, excessive dimensional changes of the substrate at high temperatures may cause deterioration of optical alignment accuracy and generation of internal stress at interfaces of material layers, resulting in reduction of display accuracy of the device and delamination between layers upon bending.
Disclosure of Invention
Based on the defects, the invention aims to provide the colorless transparent polyimide film capable of resisting the high temperature of 400 ℃ and the preparation method thereof, and solves the problem that the current CPI cannot be used in a high-temperature process for manufacturing a flexible display device based on low-temperature polycrystalline silicon and needs to resist the high temperature of 400 ℃ in a short time.
The technical scheme adopted by the invention is as follows: a preparation method of a colorless transparent polyimide film resistant to high temperature of 400 ℃ comprises the following steps: dissolving mixed diamine in an aprotic polar solvent, adding mixed dianhydride for polycondensation reaction in several times to obtain a precursor polyamic acid solution, casting the precursor polyamic acid solution on a steel belt through a casting machine, and baking to reduce the content of the aprotic polar solvent to obtain a self-supporting film; carrying out thermal imidization and stretching treatment on the self-supporting film; finally, cooling and post-processing to obtain the CPI film, which is characterized in that mixed diamine is added into an aprotic polar solvent and stirred in a nitrogen atmosphere until the mixed diamine is completely dissolved to obtain a mixed diamine solution; the solid-liquid ratio of the mixed diamine to the aprotic polar solvent is 12.0-18.0 Kg: 150L; the mixed diamine is prepared by mixing the following raw materials in a molar ratio:
9, 9-bis- (3-fluoro-4-aminophenyl) fluorene: 2, 2' -bis (trifluoromethyl) diaminobiphenyl: 9, 9-bis- (4-aminophenyl) fluorene: 2, 2-bis (4-aminophenyl) hexafluoropropane 1 to 17: 1-17: 1-17: 1-12;
adding mixed dianhydride into the mixed diamine solution for multiple times, introducing nitrogen, and stirring at room temperature;
the mixed dianhydride is prepared by mixing the following raw materials in a molar ratio:
9, 9-bis (3, 4-dicarboxyphenyl) fluorene dianhydride: 4,4' — (hexafluoroisopropylidene) diphthalic anhydride: 3,3 ', 4,4' -benzophenone tetracarboxylic dianhydride 1-16: 1-14: 1-12;
the molar ratio of the added mixed dianhydride to the added mixed diamine is 0.95: 1-1.06: 1.
The invention also has the following technical characteristics:
1. the aprotic polar solvent is N, N-dimethylformamide, N-dimethylacetamide or N-methylpyrrolidone
2. The upwind temperature of the steel belt of the casting machine is 80-120 ℃, and the downwind temperature of the steel belt is 100-150 ℃.
3. Synchronous or asynchronous bidirectional stretching treatment is adopted; the synchronous biaxial stretching has a longitudinal stretching ratio of 1.00-1.40 and a transverse stretching ratio of 1.00-1.30; the asynchronous biaxial stretching has a longitudinal stretching ratio of 1.00-1.50 and a transverse stretching ratio of 1.00-1.30.
4. The temperature in the imidization furnace is controlled to be 350-380 ℃.
5. A colorless transparent polyimide film prepared by the preparation method described above.
6. The colorless transparent polyimide film has a glass transition temperature of 410 deg.C or higher, a cold/hot expansion ratio of 0.20% or higher at 400 deg.C, and a light transmittance of 89% or higher at 450nm for a thick film of 75 μm.
The principle of the invention is as follows: the invention selects a plurality of special monomers for copolymerization to obtain the CPI film capable of bearing the high temperature of 400 ℃, wherein four diamine monomers are respectively 9, 9-bis- (3-fluoro-4-aminophenyl) fluorene (FFDA) with fluorine atoms in the ortho-position of amino groups and large-volume aromatic ring substituent groups, 2' -bis (trifluoromethyl) diaminobiphenyl (TFDB) with trifluoromethyl in the meta-position of amino groups, 9-bis- (4-aminophenyl) Fluorene (FDA) with large-volume aromatic ring substituent groups and 2, 2-bis (4-aminophenyl) hexafluoropropane (FA) containing hexafluoroisopropyl. The three dianhydride monomers are respectively 9, 9-bis (3, 4-dicarboxyphenyl) fluorene dianhydride (BPAF) containing a main chain with a large group, 4,4' - (hexafluoroisopropylidene) diphthalic anhydride (6FDA) containing hexafluoroisopropyl and 3,3 ', 4,4' -benzophenonetetracarboxylic dianhydride (BTDA) with stronger rigidity. The principle of the invention is as follows: the invention adopts four diamine monomers and three dianhydride monomers with special structures to carry out random copolymerization to obtain the CPI film which can resist the high temperature of 400 ℃. The trifluoromethyl group in the 2,2 '-bis (trifluoromethyl) diaminobiphenyl (TFDB) is in a meta position of an amino group, on one hand, the trifluoromethyl group strongly adsorbs amino electrons to reduce the CTC effect of the 2, 2' -bis (trifluoromethyl) diaminobiphenyl (TFDB), and on the other hand, the trifluoromethyl group is positioned to prevent charge transfer to reduce the CTC effect, so that the transparency is improved. Meanwhile, the strong rigidity caused by the direct connection of two benzene rings and the difficulty of molecular chain movement caused by the large-volume trifluoromethyl side group lead to the CPI has a very high Tg. However, TFDB is very rigid, and a pure TFDB easily causes that a complete film cannot be formed. Thus, other flexible diamines were introduced. The isopropyl bis-trifluoromethyl strong electronegativity and isopropyl structure of 2, 2-bis (4-aminophenyl) hexafluoropropane (FA) can effectively hinder the effect of a Charge Transfer Complex (CTC) and reduce the color of the CTC; the hexafluoroisopropyl macro group can block the free movement of molecular chain and has higher TgAnd meanwhile, certain flexibility is brought to the film so that the film is easy to form into a complete film. The fluorine atom with high electronegativity in 9, 9-bis- (3-fluoro-4-aminophenyl) fluorene (FFDA) is adjacent to the amino group, so that an electron pair on the amino group can be effectively adsorbed, and the CTC effect is reduced to lighten the color of the FFDA; at the same time, fluorine atoms can also form intermolecular hydrogen bonds to improve Tg(ii) a Two amino para-positions are connected with a tert-butyl carbon atom of polycyclic aromatic hydrocarbon fluorene, and the bulky side group destroys a coplanar structure, so that the CTC effect is reduced and the color is reduced; meanwhile, the molecular chain movement is hindered by the bulky side group, so that high T is generatedg. Two amino para-positions in 9, 9-bis- (4-aminophenyl) Fluorene (FDA) are connected with tertiary butyl carbon atom of polycyclic aromatic hydrocarbon fluorene, and the polycyclic aromatic hydrocarbon structure of fluorene ensures that the fluorene has high Tg(ii) a Meanwhile, the bulky side group also destroys the coplanar structure, and reduces the CTC effect to lighten the color of the CTC. The structure of 9, 9-bis (3, 4-dicarboxylic acid phenyl) fluorene dianhydride (BPAF) in the three dianhydride monomers is characterized in that two benzene ring anhydrides are directly connected with a tertiary butyl carbon atom of polycyclic aromatic hydrocarbon fluorene, and the polycyclic aromatic hydrocarbon structure ensures that the fluorene dianhydride has high Tg(ii) a Meanwhile, the polycyclic aromatic hydrocarbon serving as a bulky side group also destroys a coplanar structure, and reduces the CTC effect to lighten the color of the composite material. The isopropyl bis-trifluoromethyl strong electronegativity and isopropyl structure of 4,4' - (hexafluoroisopropylidene) diphthalic anhydride (6FDA) effectively hinder the CTC effect, so that the color of the obtained CPI is reduced; meanwhile, the hexafluoroisopropyl macro group blocks the free movement of molecular chains, so that the hexafluoroisopropyl macro group has higher Tg. Ketone bonds in the middle of molecules in 3,3 ', 4,4' -benzophenonetetracarboxylic dianhydride (BTDA) hinder the strong CTC effect when benzene rings are directly connected, so that the color is reduced; meanwhile, two benzene rings are connected through ketone, and the rigidity is higher, so that the T is highergHigher. Thus, in the present invention, 2' -bis (trifluoromethyl) diaminobiphenyl, 2-bis (4-aminophenyl) hexafluoropropane, 9-bis- (3-fluoro-4-aminophenyl) fluorene (FFDA) are mentioned,The light transmittance is more than or equal to 89% when the thickness of the random copolymerization CPI of the four diamines of 9, 9-bis- (4-aminophenyl) Fluorene (FDA), 9, 9-bis (3, 4-dicarboxyphenyl) fluorene dianhydride, 4,4' - (hexafluoroisopropylidene) diphthalic anhydride and 3,3 ', 4,4' -benzophenonetetracarboxylic dianhydride is 75 microns, the cold-heat expansion ratio at the high temperature of 400 ℃ is less than or equal to 0.20%, and the high-temperature requirement of low-temperature polysilicon manufacturing is met.
The invention has the following beneficial effects and advantages: the CPI film prepared by the invention has excellent thermal stability, dimensional stability and optical performance, the glass transition temperature is not lower than 410 ℃, the cold-hot expansion ratio at 400 ℃ is not higher than 0.20%, the light transmittance of a 75-micron thick film at 450nm is not less than 89%, and the CPI film has wide application prospect in flexible display.
Drawings
FIG. 1 is a chart of the 400 ℃ high temperature CPI infrared spectrum of example 11;
FIG. 2 is a chart of the UV-Vis spectra of CPI prepared in example 11 for 400 deg.C resistance.
Detailed Description
The invention is further illustrated by the following examples:
example 1
The colorless transparent polyimide film capable of resisting the high temperature of 400 ℃ of the embodiment is prepared by the following steps:
first, 150L of solvent was added to a 300L dissolution vessel equipped with mechanical stirring and nitrogen inlet/outlet: n, N-Dimethylacetamide (DMAc) was purged with nitrogen. Adding four diamine monomers including FFDA, TFDB, FDA and FA into a dissolving kettle, wherein the molar ratio of the substances is FFDA to TFDB to FDA to FA to 2:3:2: 3; stirring until the diamine is completely dissolved to obtain a mixed diamine solution; the volume ratio of the weight of the diamine to the aprotic polar solvent was 16Kg to 150L.
Secondly, the mixed diamine solution in the dissolution kettle is completely pressed into a 300L resin kettle which is provided with a mechanical stirring and a nitrogen inlet and outlet through a pressure pump, and nitrogen is introduced. Then 6FDA, BTDA, BPAF mixed dianhydride was added to the resin kettle in portions in a mass ratio of 6FDA: BTDA: BPAF to 6:3: 1.
The molar ratio of the added mixed dianhydride to the added mixed diamine is 1.06:1, and the PAA solution is obtained after polymerization reaction for 22 hours under the conditions of room temperature and high-speed stirring.
And thirdly, pressing the PAA solution into a 400L defoaming kettle by a pressure pump, and filtering, standing and defoaming to obtain a uniform solution.
And fourthly, uniformly casting the defoamed PAA solution on a circularly operated stainless steel belt through an extrusion die head, wherein the upwind temperature of the steel belt is 100 ℃, and the downwind temperature of the steel belt is 150 ℃. After steel strip baking, the self-supporting PAA film is obtained, wherein the content of DMAc solvent is 25%.
And fifthly, peeling the self-supporting PAA film from the steel belt, fixing the self-supporting PAA film by using a stainless steel clamp, and then feeding the self-supporting PAA film into an imidization furnace through a guide roller.
And sixthly, synchronously performing bidirectional stretching by synchronously stretching in the longitudinal direction and the transverse direction, wherein the longitudinal stretching ratio is 1.00, the transverse stretching ratio is 1.00, and the highest control temperature of stretching in an imidization furnace is 350 ℃.
Seventhly, after the biaxial tension treatment at high temperature, cooling, trimming and rolling the film to finally prepare the CPI film with the width of 600mm and the thickness of 75 mu m, wherein the T of the CPI filmgIt was 415 ℃.
Example 2
The colorless transparent polyimide film capable of resisting the high temperature of 400 ℃ of the embodiment is prepared by the following steps:
firstly, 150L of N, N-dimethylformamide is added into a 300L dissolving kettle provided with a mechanical stirring and a nitrogen inlet and outlet, and nitrogen is introduced. Adding four diamine monomers including FFDA, TFDB, FDA and FA into a dissolving kettle, wherein the molar ratio of the substances is FFDA to TFDB to FDA to FA to 17:1:1: 1; stirring until the diamine is completely dissolved to obtain a mixed diamine solution; the volume ratio of the weight of the diamine to the aprotic polar solvent is 12.0Kg to 150L.
Secondly, the mixed diamine solution in the dissolution kettle is completely pressed into a 300L resin kettle which is provided with a mechanical stirring and a nitrogen inlet and outlet through a pressure pump, and nitrogen is introduced. Then 6FDA, BTDA, BPAF mixed dianhydride was added to the resin kettle in portions at a mass ratio of 6FDA: BTDA: BPAF: 16:2: 2.
The molar ratio of the added mixed dianhydride to the added mixed diamine is 0.95:1, and the PAA solution is obtained after polymerization reaction for 20 hours at room temperature and high-speed stirring.
And thirdly, pressing the PAA solution into a 400L defoaming kettle by a pressure pump, filtering, standing and defoaming to obtain a uniform solution.
And fourthly, uniformly casting the defoamed PAA solution on a circularly operated stainless steel belt through an extrusion die head, wherein the upwind temperature of the steel belt is 80 ℃, and the downwind temperature of the steel belt is 150 ℃. And (3) obtaining the self-supporting PAA film after baking the steel strip, wherein the content of N, N-dimethylformamide is 25%.
And fifthly, peeling the self-supporting PAA film from the steel belt, fixing the self-supporting PAA film by using a stainless steel clamp, and then feeding the self-supporting PAA film into an imidization furnace through a guide roller.
Sixthly, asynchronous bidirectional stretching is carried out step by adopting stretching in the longitudinal direction and the transverse direction, the longitudinal stretching ratio is 1.40, the transverse stretching ratio is 1.18, and the highest control temperature for stretching in an imidization furnace is 380 ℃.
Seventhly, after the biaxial tension treatment at high temperature, cooling, trimming and rolling the film to finally prepare the CPI film with the width of 1100mm and the thickness of 75 mu m, wherein the T of the CPI filmgIt was 417 ℃.
Example 3
The colorless transparent polyimide film capable of resisting the high temperature of 400 ℃ of the embodiment is prepared by the following steps:
firstly, 150 LN-methyl pyrrolidone is added into a 300L dissolving kettle which is provided with a mechanical stirring and a nitrogen inlet and outlet, and nitrogen is introduced. Adding four diamine monomers including FFDA, TFDB, FDA and FA into a dissolving kettle, wherein the molar ratio of the substances is FFDA to TFDB to FDA to FA is 1:17:1: 1; stirring until the diamine is completely dissolved to obtain a mixed diamine solution; the volume ratio of the weight of the diamine to the aprotic polar solvent was 13Kg to 150L.
Secondly, the mixed diamine solution in the dissolution kettle is completely pressed into a 300L resin kettle which is provided with a mechanical stirring and a nitrogen inlet and outlet through a pressure pump, and nitrogen is introduced. Then 6FDA, BTDA, BPAF mixed dianhydride was added to the resin kettle in portions in a mass ratio of 6FDA: BTDA: BPAF to 3:14: 3. The molar ratio of the added mixed dianhydride to the mixed diamine is 1.04:1, and the PAA solution is obtained after polymerization reaction for 22 hours at room temperature and high-speed stirring.
And thirdly, pressing the PAA solution into a 400L defoaming kettle by a pressure pump, and filtering, standing and defoaming to obtain a uniform solution.
And fourthly, uniformly casting the defoamed PAA solution on a circularly operated stainless steel belt through an extrusion die head, wherein the upwind temperature of the steel belt is 100 ℃, and the downwind temperature of the steel belt is 150 ℃. Obtaining the self-supporting PAA film after baking the steel strip, wherein the content of N-methyl pyrrolidone is 21 percent.
And fifthly, peeling the self-supporting PAA film from the steel belt, fixing the self-supporting PAA film by using a stainless steel clamp, and then feeding the self-supporting PAA film into an imidization furnace through a guide roller.
And sixthly, synchronously performing bidirectional stretching by synchronously stretching in the longitudinal direction and the transverse direction, wherein the longitudinal stretching ratio is 1.20, the transverse stretching ratio is 1.28, and the highest control temperature of stretching in an imidization furnace is 360 ℃.
Seventhly, after the biaxial tension treatment at high temperature, cooling, trimming and rolling the film to finally prepare the CPI film with the width of 1220mm and the thickness of 70 mu m, wherein the T of the CPI filmgThe temperature was 418 ℃.
Example 4
The colorless transparent polyimide film capable of resisting the high temperature of 400 ℃ of the embodiment is prepared by the following steps:
first, 150L of DMAc solvent was placed in a 300L dissolution vessel equipped with mechanical stirring and a nitrogen inlet and outlet, and nitrogen was introduced. Adding four diamine monomers including FFDA, TFDB, FDA and FA into a dissolving kettle, wherein the molar ratio of the substances is FFDA to TFDB to FDA to FA is 1:1:17: 1; stirring until the diamine is completely dissolved to obtain a mixed diamine solution; the volume ratio of the weight of the diamine to the aprotic polar solvent is 15Kg to 150L.
Secondly, the mixed diamine solution in the dissolution kettle is completely pressed into a 300L resin kettle which is provided with a mechanical stirrer and a nitrogen inlet and outlet through a pressure pump, and nitrogen is introduced. Then 6FDA, BTDA, BPAF mixed dianhydride was added to the resin kettle in portions in a mass ratio of 6FDA: BTDA: BPAF to 4:4: 12. The molar ratio of the added mixed dianhydride to the added mixed diamine is 1.03:1, and the PAA solution is obtained after the polymerization reaction for 12 hours under the conditions of room temperature and high-speed stirring.
And thirdly, pressing the PAA solution into a 400L defoaming kettle by a pressure pump, and filtering, standing and defoaming to obtain a uniform solution.
And fourthly, uniformly casting the defoamed PAA solution on a circularly operated stainless steel belt through an extrusion die head, wherein the upwind temperature of the steel belt is 80 ℃, and the downwind temperature of the steel belt is 100 ℃. After baking the steel strip, a self-supporting PAA film was obtained, in which the DMAc solvent content was 28%.
And fifthly, peeling the self-supporting PAA film from the steel belt, fixing the film by using a stainless steel clamp, and then entering the imidization furnace through a guide roller.
And sixthly, synchronously performing bidirectional stretching by synchronously stretching in the longitudinal direction and the transverse direction, wherein the longitudinal stretching ratio is 1.40, the transverse stretching ratio is 1.30, and the highest control temperature of stretching in an imidization furnace is 370 ℃.
Seventhly, after the biaxial tension treatment at high temperature, cooling, trimming and rolling the film to finally prepare the CPI film with the width of 1200mm and the thickness of 60 mu m, wherein the T of the CPI filmgIt was 417 ℃.
Example 5
The colorless transparent polyimide film capable of resisting the high temperature of 400 ℃ of the embodiment is prepared by the following steps:
first, 150L of DMAc solvent was placed in a 300L dissolution vessel equipped with mechanical stirring and a nitrogen inlet and outlet, and nitrogen was introduced. Adding four diamine monomers including FFDA, TFDB, FDA and FA into a dissolving kettle, wherein the molar ratio of the substances is FFDA to TFDB to FDA to FA is 2:2:4: 12; stirring until the diamine is completely dissolved to obtain a mixed diamine solution; the volume ratio of the weight of the diamine to the aprotic polar solvent is 18Kg to 150L.
Secondly, the mixed diamine solution in the dissolution kettle is completely pressed into a 300L resin kettle which is provided with a mechanical stirring and a nitrogen inlet and outlet through a pressure pump, and nitrogen is introduced. Then 6FDA, BTDA, BPAF mixed dianhydride was added to the resin kettle in portions in a mass ratio of 6FDA: BTDA: BPAF to 3:2: 5. The molar ratio of the added mixed dianhydride to the added mixed diamine is 1.02:1, and the PAA solution is obtained after the polymerization reaction for 16 hours under the conditions of room temperature and high-speed stirring.
And thirdly, pressing the PAA solution into a 400L defoaming kettle by a pressure pump, and filtering, standing and defoaming to obtain a uniform solution.
And fourthly, uniformly casting the defoamed PAA solution on a circularly operated stainless steel belt through an extrusion die head, wherein the upwind temperature of the steel belt is 110 ℃, and the downwind temperature of the steel belt is 150 ℃. After baking the steel strip, a self-supporting PAA film was obtained, in which the DMAc solvent content was 28%.
And fifthly, peeling the self-supporting PAA film from the steel belt, fixing the self-supporting PAA film by using a stainless steel clamp, and then feeding the self-supporting PAA film into an imidization furnace through a guide roller.
Sixthly, asynchronous bidirectional stretching is carried out step by adopting stretching in the longitudinal direction and the transverse direction, the longitudinal stretching ratio is 1.00, the transverse stretching ratio is 1.00, and the highest control temperature for stretching in an imidization furnace is 380 ℃.
Seventhly, after the biaxial tension treatment at high temperature, cooling, trimming and rolling the film to finally prepare the CPI film with the width of 500mm and the thickness of 75 mu m, wherein the T of the CPI filmgThe temperature was 420 ℃.
Example 6
The colorless transparent polyimide film capable of resisting the high temperature of 400 ℃ of the embodiment is prepared by the following steps:
first, 150L of DMAc solvent was placed in a 300L dissolution vessel equipped with mechanical stirring and a nitrogen inlet and outlet, and nitrogen was introduced. Adding four diamine monomers including FFDA, TFDB, FDA and FA into a dissolving kettle, wherein the molar ratio of the substances is FFDA to TFDB to FDA to FA to 3:2:3: 2; stirring until the diamine is completely dissolved to obtain a mixed diamine solution; the volume ratio of the weight of the diamine to the aprotic polar solvent was 14.0Kg to 150L.
Secondly, the mixed diamine solution in the dissolution kettle is completely pressed into a 300L resin kettle which is provided with a mechanical stirring and a nitrogen inlet and outlet through a pressure pump, and nitrogen is introduced. Then 6FDA, BTDA and BPAF mixed dianhydride is added into the resin kettle in multiple times, and the mass ratio of the mixed dianhydride is 6FDA, BTDA and BPAF is 8:0.5: 1.5. The molar ratio of the added mixed dianhydride to the added mixed diamine is 1.01:1, and the PAA solution is obtained after polymerization reaction for 8 hours at room temperature and high-speed stirring.
And thirdly, pressing the PAA solution into a 400L defoaming kettle by a pressure pump, and filtering, standing and defoaming to obtain a uniform solution.
And fourthly, uniformly casting the defoamed PAA solution on a circularly operated stainless steel belt through an extrusion die head, wherein the upwind temperature of the steel belt is 100 ℃, and the downwind temperature of the steel belt is 130 ℃. After steel strip baking, a self-supporting PAA film is obtained, wherein the content of DMAc solvent is 19%.
And fifthly, peeling the self-supporting PAA film from the steel belt, fixing the self-supporting PAA film by using a stainless steel clamp, and then feeding the self-supporting PAA film into an imidization furnace through a guide roller.
And sixthly, synchronously performing bidirectional stretching by synchronously stretching in the longitudinal direction and the transverse direction, wherein the longitudinal stretching ratio is 1.30, the transverse stretching ratio is 1.20, and the highest control temperature of stretching in an imidization furnace is 360 ℃.
Seventhly, after the biaxial tension treatment at high temperature, cooling, trimming and rolling the film to finally prepare the CPI film with the width of 1100mm and the thickness of 65 mu m, wherein the T of the CPI filmgIt was 421 ℃.
Example 7
The colorless transparent polyimide film capable of resisting the high temperature of 400 ℃ of the embodiment is prepared by the following steps:
first, 150L of DMAc solvent was placed in a 300L dissolution vessel equipped with mechanical stirring and a nitrogen inlet and outlet, and nitrogen was introduced. Adding four diamine monomers including FFDA, TFDB, FDA and FA into a dissolving kettle, wherein the molar ratio of the substances is FFDA to TFDB to FDA to FA is 3:3:3: 1; stirring until the diamine is completely dissolved to obtain a mixed diamine solution; the volume ratio of the weight of the diamine to the volume of the aprotic polar solvent is 12Kg to 150L.
Secondly, the mixed diamine solution in the dissolution kettle is completely pressed into a 300L resin kettle which is provided with a mechanical stirring and a nitrogen inlet and outlet through a pressure pump, and nitrogen is introduced. Then 6FDA, BTDA, BPAF mixed dianhydride was added to the resin kettle in portions in a mass ratio of 6FDA: BTDA: BPAF to 4:1: 5. The molar ratio of the added mixed dianhydride to the added mixed diamine is 1:1, and the PAA solution is obtained after the polymerization reaction for 12 hours under the conditions of room temperature and high-speed stirring.
And thirdly, pressing the PAA solution into a 400L defoaming kettle by a pressure pump, and filtering, standing and defoaming to obtain a uniform solution.
And fourthly, uniformly casting the defoamed PAA solution on a circularly operated stainless steel belt through an extrusion die head, wherein the upwind temperature of the steel belt is 90 ℃, and the downwind temperature of the steel belt is 120 ℃. After baking the steel strip, a self-supporting PAA film was obtained, in which the DMAc solvent content was 28%.
And fifthly, peeling the self-supporting PAA film from the steel belt, fixing the self-supporting PAA film by using a stainless steel clamp, and then feeding the self-supporting PAA film into an imidization furnace through a guide roller.
Sixthly, synchronous biaxial stretching is synchronously carried out by adopting stretching in the longitudinal direction and the transverse direction, the longitudinal stretching ratio is 1.25, the transverse stretching ratio is 1.20, and the highest control temperature of stretching in an imidization furnace is 370 ℃.
Seventhly, after the biaxial tension treatment at high temperature, cooling, trimming and rolling the film to finally prepare the CPI film with the width of 700mm and the thickness of 80 mu m, wherein the T of the CPI filmgThe temperature was 423 ℃.
Example 8
The colorless transparent polyimide film capable of resisting the high temperature of 400 ℃ of the embodiment is prepared by the following steps:
first, 150L of DMAc solvent was placed in a 300L dissolution vessel equipped with mechanical stirring and a nitrogen inlet and outlet, and nitrogen was introduced. Adding four diamine monomers including FFDA, TFDB, FDA and FA into a dissolving kettle, wherein the molar ratio of the substances is FFDA to TFDB to FDA to FA is 3:2:2: 3; stirring until the diamine is completely dissolved to obtain a mixed diamine solution; the volume ratio of the weight of the diamine to the aprotic polar solvent is 15Kg to 150L.
Secondly, the mixed diamine solution in the dissolution kettle is completely pressed into a 300L resin kettle which is provided with a mechanical stirring and a nitrogen inlet and outlet through a pressure pump, and nitrogen is introduced. Then 6FDA, BTDA, BPAF mixed dianhydride was added to the resin kettle in portions in a mass ratio of 6FDA: BTDA: BPAF to 3:3: 4. The molar ratio of the added mixed dianhydride to the added mixed diamine is 0.99:1, and the PAA solution is obtained after polymerization reaction for 25 hours at room temperature and high-speed stirring.
And thirdly, pressing the PAA solution into a 400L defoaming kettle by a pressure pump, and filtering, standing and defoaming to obtain a uniform solution.
And fourthly, uniformly casting the PAA solution after defoaming on a stainless steel belt which circularly runs through an extrusion die head, wherein the upwind temperature of the steel belt is 100 ℃, and the downwind temperature of the steel belt is 140 ℃. After steel strip baking, the self-supporting PAA film is obtained, wherein the content of DMAc solvent is 22%.
And fifthly, peeling the self-supporting PAA film from the steel belt, fixing the film by using a stainless steel clamp, and then entering the imidization furnace through a guide roller.
Sixthly, asynchronous bidirectional stretching is carried out step by adopting stretching in the longitudinal direction and the transverse direction, the longitudinal stretching ratio is 1.50, the transverse stretching ratio is 1.30, and the highest control temperature for stretching in an imidization furnace is 360 ℃.
Seventhly, after the biaxial tension treatment at high temperature, cooling, trimming and rolling the film to finally prepare the CPI film with the width of 1100mm and the thickness of 70 mu m, wherein the T of the CPI filmgAt 422 ℃.
Example 9
The colorless transparent polyimide film capable of resisting the high temperature of 400 ℃ of the embodiment is prepared by the following steps:
first, 150L of DMAc solvent was placed in a 300L dissolution vessel equipped with mechanical stirring and a nitrogen inlet and outlet, and nitrogen was introduced. Adding four diamine monomers including FFDA, TFDB, FDA and FA into a dissolving kettle, wherein the molar ratio of the substances is FFDA to TFDB to FDA to FA is 2:1:1: 6; stirring until the diamine is completely dissolved to obtain a mixed diamine solution; the volume ratio of the weight of the diamine to the aprotic polar solvent was 16.0Kg to 150L.
Secondly, the mixed diamine solution in the dissolution kettle is completely pressed into a 300L resin kettle which is provided with a mechanical stirring and a nitrogen inlet and outlet through a pressure pump, and nitrogen is introduced. Then 6FDA, BTDA, BPAF mixed dianhydride was added to the resin kettle in portions in a mass ratio of 6FDA: BTDA: BPAF to 3:3: 4. The molar ratio of the added mixed dianhydride to the added mixed diamine is 0.98:1, and the PAA solution is obtained after polymerization reaction for 18 hours at room temperature under the condition of high-speed stirring.
And thirdly, pressing the PAA solution into a 400L defoaming kettle by a pressure pump, and filtering, standing and defoaming to obtain a uniform solution.
And fourthly, uniformly casting the defoamed PAA solution on a circularly operated stainless steel belt through an extrusion die head, wherein the upwind temperature of the steel belt is 100 ℃, and the downwind temperature of the steel belt is 130 ℃. After steel strip baking, the self-supporting PAA film is obtained, wherein the content of DMAc solvent is 22%.
And fifthly, peeling the self-supporting PAA film from the steel belt, fixing the self-supporting PAA film by using a stainless steel clamp, and then feeding the self-supporting PAA film into an imidization furnace through a guide roller.
Sixthly, synchronous biaxial stretching is synchronously carried out by adopting stretching in the longitudinal direction and the transverse direction, the longitudinal stretching ratio is 1.16, the transverse stretching ratio is 1.28, and the highest control temperature of stretching in an imidization furnace is 370 ℃.
Seventhly, after the biaxial tension treatment at high temperature, cooling, trimming and rolling the film to finally prepare the CPI film with the width of 1100mm and the thickness of 65 mu m, wherein the T of the CPI filmgIt was 425 ℃.
Example 10
The colorless transparent polyimide film capable of resisting the high temperature of 400 ℃ of the embodiment is prepared by the following steps:
first, 150L of DMAc solvent was placed in a 300L dissolution vessel equipped with mechanical stirring and a nitrogen inlet and outlet, and nitrogen was introduced. Adding four diamine monomers including FFDA, TFDB, FDA and FA into a dissolving kettle, wherein the molar ratio of the substances is FFDA to TFDB to FDA to FA is 2:2:4: 2; stirring until the diamine is completely dissolved to obtain a mixed diamine solution; the volume ratio of the weight of the diamine to the aprotic polar solvent was 16.0Kg to 150L.
Secondly, the mixed diamine solution in the dissolution kettle is completely pressed into a 300L resin kettle which is provided with a mechanical stirring and a nitrogen inlet and outlet through a pressure pump, and nitrogen is introduced. Then 6FDA, BTDA, BPAF mixed dianhydride was added to the resin kettle in portions in a mass ratio of 6FDA: BTDA: BPAF to 3:2: 5. The molar ratio of the added mixed dianhydride to the added mixed diamine is 0.97:1, and the PAA solution is obtained after the polymerization reaction for 19 hours under the conditions of room temperature and high-speed stirring.
And thirdly, pressing the PAA solution into a 400L defoaming kettle by a pressure pump, and filtering, standing and defoaming to obtain a uniform solution.
And fourthly, uniformly casting the defoamed PAA solution on a circularly operated stainless steel belt through an extrusion die head, wherein the upwind temperature of the steel belt is 110 ℃, and the downwind temperature of the steel belt is 150 ℃. After steel strip baking, a self-supporting PAA film is obtained, wherein the content of DMAc solvent is 26%.
And fifthly, peeling the self-supporting PAA film from the steel belt, fixing the self-supporting PAA film by using a stainless steel clamp, and then feeding the self-supporting PAA film into an imidization furnace through a guide roller.
And sixthly, synchronously performing bidirectional stretching in the longitudinal direction and the transverse direction synchronously, wherein the longitudinal stretching ratio is 1.15, the transverse stretching ratio is 1.15, and the highest control temperature of stretching in an imidization furnace is 360 ℃.
Seventhly, after the biaxial tension treatment at high temperature, cooling, trimming and rolling the film to finally prepare the CPI film with the width of 1200mm and the thickness of 75 mu m, wherein the T of the CPI filmgIt was 419 ℃.
Example 11
The colorless transparent polyimide film capable of resisting the high temperature of 400 ℃ of the embodiment is prepared by the following steps:
first, 150L of DMAc solvent was placed in a 300L dissolution vessel equipped with mechanical stirring and a nitrogen inlet and outlet, and nitrogen was introduced. Adding four diamine monomers including FFDA, TFDB, FDA and FA into a dissolving kettle, wherein the molar ratio of the substances is FFDA to TFDB to FDA to FA is 2:2:3: 3; stirring until the diamine is completely dissolved to obtain a mixed diamine solution; the volume ratio of the weight of the diamine to the aprotic polar solvent was 15.0Kg to 150L.
Secondly, the mixed diamine solution in the dissolution kettle is completely pressed into a 300L resin kettle which is provided with a mechanical stirrer and a nitrogen inlet and outlet through a pressure pump, and nitrogen is introduced. Then 6FDA, BTDA, BPAF mixed dianhydride was added to the resin kettle in portions in a mass ratio of 6FDA: BTDA: BPAF to 3:3: 4. The molar ratio of the added mixed dianhydride to the added mixed diamine is 0.99:1, and the PAA solution is obtained after polymerization reaction for 15 hours at room temperature and high-speed stirring.
And thirdly, pressing the PAA solution into a 400L defoaming kettle by a pressure pump, and filtering, standing and defoaming to obtain a uniform solution.
And fourthly, uniformly casting the defoamed PAA solution on a circularly operated stainless steel belt through an extrusion die head, wherein the upwind temperature of the steel belt is 110 ℃, and the downwind temperature of the steel belt is 150 ℃. After steel strip baking, a self-supporting PAA film is obtained, wherein the content of DMAc solvent is 26%.
And fifthly, peeling the self-supporting PAA film from the steel belt, fixing the self-supporting PAA film by using a stainless steel clamp, and then feeding the self-supporting PAA film into an imidization furnace through a guide roller.
Sixthly, synchronous biaxial stretching is synchronously carried out by adopting stretching in the longitudinal direction and the transverse direction, the longitudinal stretching ratio is 1.10, the transverse stretching ratio is 1.18, and the highest control temperature of stretching in an imidization furnace is 370 ℃.
Seventhly, after the biaxial tension treatment at high temperature, the film is cooled, cut and rolled to prepare the CPI film with the width of 600mm and the thickness of 75 mu m, and the T of the CPI filmgThe temperature was 420 ℃.
The infrared spectrum of the CPI prepared in this example is shown in FIG. 1, and the characteristic absorption peaks indicate that the CPI has been highly imidized.
The UV-Vis spectrum of the CPI prepared in this example is shown in FIG. 2, from which it can be seen that the average light transmission of a 75 μm thick CPI film was 89.5%. The cold-heat expansion ratio of the film after being cooled to room temperature in a high-temperature environment of 400 ℃ for 120s is 0.20%.
Example 12
The colorless transparent polyimide film capable of resisting the high temperature of 400 ℃ of the embodiment is prepared by the following steps:
first, 150L of DMAc solvent was placed in a 300L dissolution vessel equipped with mechanical stirring and a nitrogen inlet and outlet, and nitrogen was introduced. Adding four diamine monomers including FFDA, TFDB, FDA and FA into a dissolving kettle, wherein the molar ratio of the substances is FFDA to TFDB to FDA to FA is 2:1:6: 1; stirring until the diamine is completely dissolved to obtain a mixed diamine solution; the volume ratio of the weight of the diamine to the aprotic polar solvent was 16.0Kg to 150L.
Secondly, the mixed diamine solution in the dissolution kettle is completely pressed into a 300L resin kettle which is provided with a mechanical stirring and a nitrogen inlet and outlet through a pressure pump, and nitrogen is introduced. Then 6FDA, BTDA, BPAF mixed dianhydride was added to the resin kettle in portions in a mass ratio of 6FDA: BTDA: BPAF to 3:3: 4. The molar ratio of the added mixed dianhydride to the added mixed diamine is 0.96:1, and the PAA solution is obtained after polymerization reaction for 20 hours at room temperature and high-speed stirring.
And thirdly, pressing the PAA solution into a 400L defoaming kettle by a pressure pump, and filtering, standing and defoaming to obtain a uniform solution.
And fourthly, uniformly casting the PAA solution after defoaming on a stainless steel belt which circularly runs through an extrusion die head, wherein the upwind temperature of the steel belt is 100 ℃, and the downwind temperature of the steel belt is 140 ℃. After baking the steel strip, a self-supporting PAA film is obtained, wherein the DMAc solvent content is 22 percent.
And fifthly, peeling the self-supporting PAA film from the steel belt, fixing the film by using a stainless steel clamp, and then entering the imidization furnace through a guide roller.
Sixthly, asynchronous bidirectional stretching is carried out step by adopting stretching in the longitudinal direction and the transverse direction, the longitudinal stretching ratio is 1.20, the transverse stretching ratio is 1.25, and the highest control temperature for stretching in an imidization furnace is 380 ℃.
Seventhly, after the biaxial tension treatment at high temperature, cooling, trimming and rolling the film to finally prepare the CPI film with the width of 650mm and the thickness of 75 mu m, wherein the T of the CPI filmgAt 426 ℃.
The 75 μm thick CPI film prepared in this example had an average light transmission of 88.2% and a cold-to-hot stretch ratio of 0.18% when the film was cooled to room temperature in a high temperature environment of 400 ℃ for 120 seconds.
Example 13
The colorless transparent polyimide film capable of resisting the high temperature of 400 ℃ of the embodiment is prepared by the following steps:
first, 150L of DMAc solvent was placed in a 300L dissolution vessel equipped with mechanical stirring and a nitrogen inlet and outlet, and nitrogen was introduced. Adding four diamine monomers including FFDA, TFDB, FDA and FA into a dissolving kettle, wherein the molar ratio of the substances is FFDA to TFDB to FDA to FA to is 4:2:3: 1; stirring until the diamine is completely dissolved to obtain a mixed diamine solution; the volume ratio of the weight of diamine to the volume of aprotic polar solvent was 17.0Kg to 150L.
Secondly, the mixed diamine solution in the dissolution kettle is completely pressed into a 300L resin kettle which is provided with a mechanical stirring and a nitrogen inlet and outlet through a pressure pump, and nitrogen is introduced. Then 6FDA, BTDA, BPAF mixed dianhydride was added to the resin kettle in portions in a mass ratio of 6FDA: BTDA: BPAF: 4:3: 3. The molar ratio of the added mixed dianhydride to the added mixed diamine is 1.02:1, and the PAA solution is obtained after polymerization reaction for 20 hours at room temperature and high-speed stirring.
And thirdly, pressing the PAA solution into a 400L defoaming kettle by a pressure pump, and filtering, standing and defoaming to obtain a uniform solution.
And fourthly, uniformly casting the defoamed PAA solution on a circularly operated stainless steel belt through an extrusion die head, wherein the upwind temperature of the steel belt is 100 ℃, and the downwind temperature of the steel belt is 150 ℃. After steel strip baking, the self-supporting PAA film is obtained, wherein the content of DMAc solvent is 22%.
And fifthly, peeling the self-supporting PAA film from the steel belt, fixing the self-supporting PAA film by using a stainless steel clamp, and then feeding the self-supporting PAA film into an imidization furnace through a guide roller.
Sixthly, asynchronous bidirectional stretching is carried out step by adopting stretching in the longitudinal direction and the transverse direction, the longitudinal stretching ratio is 1.25, the transverse stretching ratio is 1.28, and the highest control temperature for stretching in an imidization furnace is 360 ℃.
Seventhly, after the biaxial tension treatment at high temperature, cooling, trimming and rolling the film to finally prepare the CPI film with the width of 1100mm and the thickness of 70 mu m, wherein the T of the CPI filmgAt 417 deg.C.
The 70 μm thick CPI film prepared in this example had an average light transmission of 88.6% and a cold to hot stretch ratio of 0.20% at 400 deg.C for 120 seconds and then cooled to room temperature.
Example 14
The colorless transparent polyimide film capable of resisting the high temperature of 400 ℃ of the embodiment is prepared by the following steps:
first, 150L of DMAc solvent was placed in a 300L dissolution vessel equipped with mechanical stirring and a nitrogen inlet and outlet, and nitrogen was introduced. Adding four diamine monomers including FFDA, TFDB, FDA and FA into a dissolving kettle, wherein the molar ratio of the substances is FFDA to TFDB to FDA to FA is 4:3:2: 1; stirring until the diamine is completely dissolved to obtain a mixed diamine solution; the volume ratio of the weight of the diamine to the aprotic polar solvent was 13.0Kg to 150L.
Secondly, the mixed diamine solution in the dissolution kettle is completely pressed into a 300L resin kettle which is provided with a mechanical stirring and a nitrogen inlet and outlet through a pressure pump, and nitrogen is introduced. Then 6FDA, BTDA, BPAF mixed dianhydride was added to the resin kettle in portions in a mass ratio of 6FDA: BTDA: BPAF to 4:5: 1. The molar ratio of the added mixed dianhydride to the added mixed diamine is 1.03:1, and the PAA solution is obtained after polymerization reaction for 8 hours at room temperature and high-speed stirring.
And thirdly, pressing the PAA solution into a 400L defoaming kettle by a pressure pump, and filtering, standing and defoaming to obtain a uniform solution.
And fourthly, uniformly casting the defoamed PAA solution on a circularly operated stainless steel belt through an extrusion die head, wherein the upwind temperature of the steel belt is 90 ℃, and the downwind temperature of the steel belt is 130 ℃. After steel strip baking, the self-supporting PAA film is obtained, wherein the content of DMAc solvent is 22%.
And fifthly, peeling the self-supporting PAA film from the steel belt, fixing the self-supporting PAA film by using a stainless steel clamp, and then feeding the self-supporting PAA film into an imidization furnace through a guide roller.
Sixthly, synchronous biaxial stretching is carried out by synchronously stretching in the longitudinal direction and the transverse direction, the longitudinal stretching ratio is 1.20, the transverse stretching ratio is 1.26, and the highest control temperature of stretching in an imidization furnace is 370 ℃.
Seventhly, after the biaxial tension treatment at high temperature, cooling, trimming and rolling the film to finally prepare the CPI film with the width of 600mm and the thickness of 65 mu m, wherein the T of the CPI filmgIt was 421 ℃.
The 65 μm thick CPI film prepared in this example had an average light transmission of 90.1% and a cold to hot stretch ratio of 0.18% at 400 deg.C for 120 seconds and then cooled to room temperature.
Example 15
The colorless transparent polyimide film capable of resisting the high temperature of 400 ℃ of the embodiment is prepared by the following steps:
first, 150L of DMF solvent was added to a 300L dissolution vessel equipped with mechanical stirring and nitrogen inlet and outlet, and nitrogen was introduced. Adding four diamine monomers including FFDA, TFDB, FDA and FA into a dissolving kettle, wherein the molar ratio of the substances is FFDA to TFDB to FDA to FA is 3:3:4: 1; stirring until the diamine is completely dissolved to obtain a mixed diamine solution; the volume ratio of the weight of the diamine to the aprotic polar solvent was 16.0Kg to 150L.
Secondly, the mixed diamine solution in the dissolution kettle is completely pressed into a 300L resin kettle which is provided with a mechanical stirring and a nitrogen inlet and outlet through a pressure pump, and nitrogen is introduced. Then 6FDA, BTDA and BPAF mixed dianhydride is added into the resin kettle in multiple times, and the mass ratio of the mixed dianhydride is 6FDA, BTDA and BPAF is 5:3: 2. The molar ratio of the added mixed dianhydride to the mixed diamine is 1.01:1, and the PAA solution is obtained after polymerization reaction for 8 hours at room temperature and under the condition of high-speed stirring.
And thirdly, pressing the PAA solution into a 400L defoaming kettle by a pressure pump, and filtering, standing and defoaming to obtain a uniform solution.
And fourthly, uniformly casting the defoamed PAA solution on a circularly operated stainless steel belt through an extrusion die head, wherein the upwind temperature of the steel belt is 80 ℃, and the downwind temperature of the steel belt is 150 ℃. Obtaining the self-supporting PAA film after baking the steel strip, wherein the content of DMF solvent is 22 percent.
And fifthly, peeling the self-supporting PAA film from the steel belt, fixing the self-supporting PAA film by using a stainless steel clamp, and then feeding the self-supporting PAA film into an imidization furnace through a guide roller.
Sixthly, asynchronous bidirectional stretching is carried out step by adopting stretching in the longitudinal direction and the transverse direction, the longitudinal stretching ratio is 1.12, the transverse stretching ratio is 1.15, and the highest control temperature for stretching in an imidization furnace is 370 ℃.
Seventhly, after the biaxial tension treatment at high temperature, cooling, trimming and rolling the film to finally prepare the CPI film with the width of 1100mm and the thickness of 60 mu m, wherein the T of the CPI filmgAt 422 ℃.
The 60 μm thick CPI film produced in this example had an average light transmission of 89.6% and a cold-hot stretch ratio of 0.20% when the film was heated at 400 deg.C for 120 seconds and then cooled to room temperature.
Example 16
The colorless transparent polyimide film capable of resisting the high temperature of 400 ℃ of the embodiment is prepared by the following steps:
first, 150L of NMP solvent was added to a 300L dissolution vessel equipped with mechanical stirring and nitrogen inlet and outlet, and nitrogen was introduced. Adding four diamine monomers including FFDA, TFDB, FDA and FA into a dissolving kettle, wherein the molar ratio of the substances is FFDA to TFDB to FDA to FA is 3:2:2: 3; stirring until the diamine is completely dissolved to obtain a mixed diamine solution; the volume ratio of the weight of the diamine to the aprotic polar solvent was 17.0Kg to 150L.
Secondly, the mixed diamine solution in the dissolution kettle is completely pressed into a 300L resin kettle which is provided with a mechanical stirring and a nitrogen inlet and outlet through a pressure pump, and nitrogen is introduced. Then 6FDA, BTDA, BPAF mixed dianhydride was added to the resin kettle in portions in a mass ratio of 6FDA: BTDA: BPAF to 5:4: 1. The molar ratio of the added mixed dianhydride to the added mixed diamine is 1:1, and the PAA solution is obtained after polymerization reaction for 28 hours at room temperature and under the condition of high-speed stirring.
And thirdly, pressing the PAA solution into a 400L defoaming kettle by a pressure pump, and filtering, standing and defoaming to obtain a uniform solution.
And fourthly, uniformly casting the defoamed PAA solution on a circularly operated stainless steel belt through an extrusion die head, wherein the upwind temperature of the steel belt is 100 ℃, and the downwind temperature of the steel belt is 130 ℃. The self-supporting PAA film is obtained after steel strip baking, wherein the content of NMP solvent is 21 percent.
And fifthly, peeling the self-supporting PAA film from the steel belt, fixing the self-supporting PAA film by using a stainless steel clamp, and then feeding the self-supporting PAA film into an imidization furnace through a guide roller.
And sixthly, synchronously performing bidirectional stretching by synchronously stretching in the longitudinal direction and the transverse direction, wherein the longitudinal stretching ratio is 1.26, the transverse stretching ratio is 1.30, and the highest control temperature of stretching in an imidization furnace is 380 ℃.
Seventhly, after the biaxial tension treatment at high temperature, cooling, trimming and rolling the film to finally prepare the CPI film with the width of 600mm and the thickness of 65 mu m, wherein the T of the CPI filmgIt was 419 ℃.
The 65 μm thick CPI film prepared in this example had an average light transmission of 89.2% and a cold to hot stretch ratio of 0.19% at 400 deg.C for 120 seconds and then cooled to room temperature.

Claims (7)

1. A preparation method of a colorless transparent polyimide film resistant to high temperature of 400 ℃ comprises the following steps: dissolving mixed diamine in an aprotic polar solvent, adding mixed dianhydride in several times, performing polycondensation reaction to obtain a precursor polyamic acid solution, casting the precursor polyamic acid solution on a steel belt through a casting machine, and baking to reduce the content of the aprotic polar solvent to obtain a self-supporting film; carrying out thermal imidization and stretching treatment on the self-supporting film; finally, cooling and post-processing to obtain the CPI film, which is characterized in that mixed diamine is added into an aprotic polar solvent and stirred in a nitrogen atmosphere until the mixed diamine is completely dissolved to obtain a mixed diamine solution; the solid-liquid ratio of the mixed diamine to the aprotic polar solvent is 12.0-18.0 Kg: 150L; the mixed diamine is prepared by mixing the following raw materials in a molar ratio:
9, 9-bis- (3-fluoro-4-aminophenyl) fluorene: 2, 2' -bis (trifluoromethyl) diaminobiphenyl: 9, 9-bis- (4-aminophenyl) fluorene: 2, 2-bis (4-aminophenyl) hexafluoropropane 1 to 17: 1-17: 1-17: 1-12;
adding mixed dianhydride into the mixed diamine solution for multiple times, introducing nitrogen, and stirring at room temperature; the mixed dianhydride is prepared by mixing the following raw materials in a molar ratio:
9, 9-bis (3, 4-dicarboxyphenyl) fluorene dianhydride: 4,4' — (hexafluoroisopropylidene) diphthalic anhydride: 3,3 ', 4,4' -benzophenone tetracarboxylic dianhydride 1-16: 1-14: 1-12;
the molar ratio of the added mixed dianhydride to the added mixed diamine is 0.95: 1-1.06: 1.
2. The method for preparing the colorless transparent polyimide film capable of resisting the high temperature of 400 ℃ according to claim 1, wherein the method comprises the following steps: the aprotic polar solvent is N, N-dimethylformamide, N-dimethylacetamide or N-methylpyrrolidone.
3. The method for preparing the colorless transparent polyimide film capable of resisting the high temperature of 400 ℃ according to claim 2, wherein the method comprises the following steps: the upwind temperature of the steel belt of the casting machine is 80-120 ℃, and the downwind temperature of the steel belt is 100-150 ℃.
4. The method for preparing the colorless transparent polyimide film capable of resisting the high temperature of 400 ℃ according to claim 2, wherein the method comprises the following steps: synchronous or asynchronous bidirectional stretching treatment is adopted; the synchronous biaxial stretching has a longitudinal stretching ratio of 1.00-1.40 and a transverse stretching ratio of 1.00-1.30; the asynchronous biaxial stretching has a longitudinal stretching ratio of 1.00-1.50 and a transverse stretching ratio of 1.00-1.30.
5. The method for preparing the colorless transparent polyimide film capable of resisting the high temperature of 400 ℃ according to claim 2, wherein the method comprises the following steps: the temperature in the imidization furnace is controlled to be 350-380 ℃.
6. The colorless transparent polyimide film prepared by the preparation method of the colorless transparent polyimide film with the high temperature resistance of 400 ℃ according to any one of claims 1 to 5.
7. The colorless transparent polyimide film according to claim 6, wherein: the glass transition temperature is not lower than 410 ℃, the cold-heat expansion ratio at 400 ℃ is not higher than 0.20%, and the light transmittance of a 75-micron thick film at 450nm is not less than 89%.
CN202210160348.1A 2022-02-22 2022-02-22 400 ℃ high-temperature-resistant colorless transparent polyimide film and preparation method thereof Active CN114702706B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210160348.1A CN114702706B (en) 2022-02-22 2022-02-22 400 ℃ high-temperature-resistant colorless transparent polyimide film and preparation method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210160348.1A CN114702706B (en) 2022-02-22 2022-02-22 400 ℃ high-temperature-resistant colorless transparent polyimide film and preparation method thereof

Publications (2)

Publication Number Publication Date
CN114702706A true CN114702706A (en) 2022-07-05
CN114702706B CN114702706B (en) 2022-11-08

Family

ID=82166767

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210160348.1A Active CN114702706B (en) 2022-02-22 2022-02-22 400 ℃ high-temperature-resistant colorless transparent polyimide film and preparation method thereof

Country Status (1)

Country Link
CN (1) CN114702706B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116655915A (en) * 2023-07-26 2023-08-29 北京建工环境修复股份有限公司 Polyimide compound and preparation method and application thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111533909A (en) * 2020-06-08 2020-08-14 武汉柔显科技股份有限公司 Polyamide-imide, polyamide-imide film and display device
US20210095076A1 (en) * 2019-09-29 2021-04-01 Goldengate Quantum Technology Co. Ltd. High modulus colorless polyimide film and method of preparation
CN113185693A (en) * 2021-05-06 2021-07-30 吉林奥来德光电材料股份有限公司 Polyamide acid solution and preparation method thereof, polyimide and polyimide film
WO2021189723A1 (en) * 2020-03-27 2021-09-30 中天电子材料有限公司 Polyimide colorless transparent thin film, preparation method therefor, and optical pi film
CN113831533A (en) * 2021-07-30 2021-12-24 杭州福斯特电子材料有限公司 Polyimide composition, polyimide polymer, polyimide film and flexible copper clad laminate

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210095076A1 (en) * 2019-09-29 2021-04-01 Goldengate Quantum Technology Co. Ltd. High modulus colorless polyimide film and method of preparation
WO2021189723A1 (en) * 2020-03-27 2021-09-30 中天电子材料有限公司 Polyimide colorless transparent thin film, preparation method therefor, and optical pi film
CN111533909A (en) * 2020-06-08 2020-08-14 武汉柔显科技股份有限公司 Polyamide-imide, polyamide-imide film and display device
CN113185693A (en) * 2021-05-06 2021-07-30 吉林奥来德光电材料股份有限公司 Polyamide acid solution and preparation method thereof, polyimide and polyimide film
CN113831533A (en) * 2021-07-30 2021-12-24 杭州福斯特电子材料有限公司 Polyimide composition, polyimide polymer, polyimide film and flexible copper clad laminate

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
闫子然: "交联型耐高温高透明PI材料的合成及性能研究", 《中国优秀硕士学位论文全文数据库 (工程科技Ⅰ辑)》 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116655915A (en) * 2023-07-26 2023-08-29 北京建工环境修复股份有限公司 Polyimide compound and preparation method and application thereof
CN116655915B (en) * 2023-07-26 2023-11-03 北京建工环境修复股份有限公司 Polyimide compound and preparation method and application thereof

Also Published As

Publication number Publication date
CN114702706B (en) 2022-11-08

Similar Documents

Publication Publication Date Title
JP7514369B2 (en) Polyamic acid, polyamic acid solution, polyimide, polyimide film, laminate and flexible device
EP2847250B1 (en) Thermally stable, flexible substrates for electronic devices
CN113621234B (en) Ultrahigh-modulus high-transmittance polyimide film and preparation method and application thereof
CN101392059B (en) Colorless transparent aromatic polyimide film and preparation method thereof
WO2023160563A1 (en) High-temperature-resistant colorless transparent polyimide film for lead-free welding reflow in electronic industry, and preparation method therefor
CN110317339B (en) Polyimide precursor, polyimide film, and display device including the same
JPS627733A (en) Colorless clear polyimide formed body and its production
CN114702706B (en) 400 ℃ high-temperature-resistant colorless transparent polyimide film and preparation method thereof
CN109627439B (en) Polyimide containing caged phosphate ester structure and preparation method thereof
CN114685986A (en) Polyimide film and preparation method and application thereof
JP2018193569A (en) Polyimide, and polyimide precursor
JP7084755B2 (en) A method for producing a polyamic acid, a polyamic acid solution, a polyimide, a polyimide film, a laminate and a flexible device, and a polyimide film.
JP5923887B2 (en) Polyimide and polyimide precursor
EP0572196B1 (en) Polyimide, and preparation process of same
CN116096820A (en) Polymer composition, varnish, and polyimide film
JP2022044020A (en) Polyamide acid, polyamide acid solution, polyimide, polyimide film, laminate and flexible device, and method for producing polyimide film
CN114456381B (en) Method for preparing polyimide film by unidirectional stretching
CN112708130A (en) Colorless transparent polyimide film and preparation method thereof
CN114702669B (en) Colorless transparent polyimide film for flexible active matrix organic light emitting display
CN114773600B (en) Polyimide film and preparation method and application thereof
CN116057109B (en) Polymer composition, varnish, and polyimide film
CN114685786B (en) Polyimide film and preparation method and application thereof
CN109734907A (en) Polyimide precursor, precursor composition, polyimides, thermostable transparent Kapton and preparation method thereof
CN111471176B (en) Polyimide precursor, polyimide, film and display device
CN114015044A (en) Colorless transparent polyimide resin film and preparation method thereof

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant