CN114696029B - Electronic equipment - Google Patents
Electronic equipment Download PDFInfo
- Publication number
- CN114696029B CN114696029B CN202011582862.1A CN202011582862A CN114696029B CN 114696029 B CN114696029 B CN 114696029B CN 202011582862 A CN202011582862 A CN 202011582862A CN 114696029 B CN114696029 B CN 114696029B
- Authority
- CN
- China
- Prior art keywords
- radiator
- insulating layer
- electronic device
- bracket
- coupling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000008878 coupling Effects 0.000 claims abstract description 51
- 238000010168 coupling process Methods 0.000 claims abstract description 51
- 238000005859 coupling reaction Methods 0.000 claims abstract description 51
- 239000010410 layer Substances 0.000 claims description 53
- 239000012790 adhesive layer Substances 0.000 claims description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 239000006260 foam Substances 0.000 claims description 3
- 238000003475 lamination Methods 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 2
- 238000000926 separation method Methods 0.000 claims 1
- 238000009413 insulation Methods 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000001808 coupling effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005288 electromagnetic effect Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/04—Construction or manufacture in general
- H01M10/0404—Machines for assembling batteries
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
- H01M10/425—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
- H01M10/4257—Smart batteries, e.g. electronic circuits inside the housing of the cells or batteries
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The present disclosure relates to an electronic device. The electronic device includes: a housing; the support is positioned inside the shell; the radiator is arranged on the support; the coupling branch knot is arranged on one side of the shell facing the interior of the electronic equipment and is coupled with the radiator; the insulation layer is arranged between the radiator and the coupling branch, and the insulation layer is respectively connected with the radiator and the coupling branch.
Description
Technical Field
The disclosure relates to the technical field of terminals, and in particular relates to electronic equipment.
Background
In a related art, silver paste may be directly printed on the inner surface of the battery cover to couple with an antenna radiator in the electronic device, but at a high cost. Therefore, in another related art, in order to reduce the cost, the branches can be attached to the inner surface of the battery cover, but because the materials of the battery cover and the branches are different, the expansion rates of the battery cover and the branches are different, so that auxiliary material marks are easy to appear in the environment with strong ultraviolet rays or extremely high and low temperature, and the attractiveness is influenced.
Disclosure of Invention
The present disclosure provides an electronic device to solve the deficiencies in the related art.
According to a first aspect of embodiments of the present disclosure, there is provided an electronic device, comprising:
A housing;
A bracket located inside the housing;
the radiator is arranged on the bracket;
the coupling branch is arranged on one side of the shell facing the inside of the electronic equipment, and is coupled with the radiator;
The insulating layer is arranged between the radiator and the coupling branch, and the insulating layer is respectively connected with the radiator and the coupling branch.
Optionally, the insulating layer includes a buffer insulating layer, and a deformation direction of the buffer insulating layer is the same as a lamination direction of the insulating layer, the radiator, and the coupling branch.
Optionally, the buffer insulating layer comprises buffer foam or a buffer silica gel layer.
Optionally, the minimum compressed thickness of the buffer insulating layer is greater than or equal to a preset distance, and the preset distance is a minimum interval distance between the coupling branch and the radiator.
Optionally, the insulation layer and the coupling branch are bonded by the first bonding layer.
Optionally, the coupling stub includes a copper foil layer.
Optionally, the method further comprises:
A second adhesive layer that adheres the bracket and the insulating layer to enclose the radiator between the second adhesive layer and the bracket; or the second adhesive layer adheres the insulating layer and the radiator.
Optionally, the electronic device further includes a motherboard, and the stand covers or surrounds the motherboard.
Optionally, the electronic device further includes a main board and a speaker electrically connected to the main board, the support includes a hollow portion, the speaker is disposed in the hollow portion, the support is connected to the main board and the speaker respectively, and the support and the main board enclose a sound cavity of the speaker.
Optionally, the support comprises a plastic support, and the radiator comprises a laser-formed radiator formed on the plastic support.
The technical scheme provided by the embodiment of the disclosure can comprise the following beneficial effects:
According to the embodiment, the insulating layer can be arranged between the radiator and the coupling branch knot to ensure that the radiator and the coupling branch knot are not conducted, the insulating layer is also connected with the radiator and the coupling branch knot respectively, so that the coupling branch knot and the insulating layer can be fixed under the condition that the coupling support is not directly connected with the shell, and then the insulating layer can be fixed relative to the radiator, auxiliary material marks can be prevented from being formed on the shell, the attractiveness of electronic equipment is influenced, and meanwhile, production cost can be reduced relative to a scheme of printing silver paste.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the disclosure and together with the description, serve to explain the principles of the disclosure.
Fig. 1 is a schematic cross-sectional view of an electronic device in the related art.
Fig. 2 is a schematic diagram of an electronic device according to an exemplary embodiment.
Fig. 3 is a schematic partial cross-sectional view of an electronic device, according to an example embodiment.
Fig. 4 is a schematic partial cross-sectional view of another electronic device shown in accordance with an exemplary embodiment.
Fig. 5 is a schematic partial cross-sectional view of yet another electronic device, shown in accordance with an exemplary embodiment.
Detailed Description
Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numbers in different drawings refer to the same or similar elements, unless otherwise indicated. The implementations described in the following exemplary examples are not representative of all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with some aspects of the present disclosure as detailed in the accompanying claims.
The terminology used in the present disclosure is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. As used in this disclosure and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any or all possible combinations of one or more of the associated listed items.
It should be understood that although the terms first, second, third, etc. may be used in this disclosure to describe various information, these information should not be limited to these terms. These terms are only used to distinguish one type of information from another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the present disclosure. The word "if" as used herein may be interpreted as "at … …" or "at … …" or "in response to a determination" depending on the context.
Fig. 1 is a schematic cross-sectional view of an electronic device in the related art. As shown in fig. 1, the electronic device may include a battery cover 101, a coupling branch 102, and a radiator 103, where the coupling branch 102 is disposed between the radiator 103 and the battery cover 101, and the coupling branch 102 is bonded to a side of the battery cover 101 facing the inside of the electronic device, and the radiator 103 may be disposed on the electronic device with a gap between the radiator 103 and the coupling branch 102, and the two achieve gap coupling. However, in the related art, since the coupling branches 102 are directly connected with the battery cover 101, in the environment with strong ultraviolet rays or extremely high temperature or extremely low temperature, the shrinkage rate of the coupling branches 102 is different from that of the battery cover 101, so that auxiliary material imprinting occurs on the battery cover 101 easily, and especially when the color of the battery cover 101 is lighter, the coupling branches 102 can be visually checked, the aesthetic degree is insufficient, and the user experience is poor.
Fig. 2 is a schematic structural view of an electronic device 100 according to an exemplary embodiment, and fig. 3 is a schematic partial sectional view of the electronic device 100 according to an exemplary embodiment. As shown in fig. 2 and 3, the electronic device 100 may include a housing 1, a bracket 2, a radiator 3, a coupling stub 4, and an insulating layer 5. Wherein, this casing 1 can form the outward appearance surface of electronic equipment 100, and support 2, radiator 3, coupling branch 4 and insulating layer 5 all set up in the inside of casing 1, and this radiator 3 can set up in the surface of support 2 moreover, and coupling branch 4 sets up in the inside one side of casing 1 towards electronic equipment 100, and this coupling branch 4 can couple with radiator 3 moreover to widen the radiation frequency channel of radiator 3, perhaps draw down the frequency of radiator 3. The insulating layer 5 can be arranged between the radiator 3 and the coupling branch 4 to ensure that the radiator 3 and the coupling branch 4 are not conducted, and the insulating layer 5 can be respectively connected with the radiator 3 and the coupling branch 4, so that the coupling branch 4 and the insulating layer 5 can be fixed under the condition that the coupling bracket 4 is not directly connected with the shell 1, and further the insulating layer 5 can be fixed relative to the radiator 3, thereby avoiding forming auxiliary material marks on the shell 1 and affecting the attractiveness of the electronic equipment 100.
Wherein, the bracket 2 can comprise a plastic bracket, and the radiator 3 can comprise a laser forming antenna formed on the plastic bracket; the radiator 3 may be used for radiating wifi antenna signals or GPS antenna signals, etc. The coupling stub 4 may include a copper foil layer.
In this embodiment, the insulating layer 5 may be an insulating structure made of an organic material; or may be made of an inorganic and non-conductive insulating material. The insulating layer 5 may be a buffer insulating layer that is deformable in the lamination direction of the coupling stub 4, the insulating layer 5, and the radiator 3. In this way, when the housing 1 of the electronic device 100 is assembled, the tolerance of the housing 1 and the bracket 2 in the stacking direction can be absorbed by the buffer insulating layer, so that the bracket 2, the radiator 3, the insulating layer 5 and the coupling branch 4 are prevented from abutting or pressing against the housing 1, and the mounting difficulty of the housing 1 is increased or deformed. The buffer insulating layer may include a buffer foam or a buffer silicone layer or a buffer rubber layer, to which the present disclosure is not limited.
Further, in order to ensure the coupling effect between the coupling branch 4 and the radiator 3, the minimum compressed thickness of the buffer insulating layer after compression should be greater than or equal to a preset distance, where the preset distance may be the minimum distance of coupling between the coupling branch 4 and the radiator 3, so that the antenna structure of the electronic device 100 may be ensured to normally transmit the antenna signal.
As shown in fig. 4, the electronic device 100 may further include a first adhesive layer 6 and a second adhesive layer 7, where the first adhesive layer 6 may adhere the insulating layer 5 and the coupling stub 4, so that the insulating layer 5 and the coupling stub 4 may be fixed by the first adhesive layer 6, which is convenient and simple. The second adhesive layer 7 may adhere the bracket 2 and the insulating layer 5, whereby the insulating layer 5 may be further fixed to the bracket 2, and the radiator 3 may be surrounded by the bracket 2 and the second adhesive layer 7 to maintain the relative positional relationship between the radiator 3 and the coupling stub 4. Or in other embodiments, the second adhesive layer 7 may also be an adhesive layer that adheres the radiator 3 and the insulating layer 5, which is not limited by the present disclosure.
Based on the technical solution of the present disclosure, in some embodiments, the bracket 2 may be used as an antenna bracket only, and in other embodiments, the bracket 2 may be used as a protective bracket with other structures. For example, in some cases, as shown in fig. 5, the electronic apparatus 100 may further include a main board 8 and a speaker 9 connected to the main board 8, the stand 2 may be connected to the main board 8, and the stand 2 may include a hollow portion 21, the speaker 9 being disposed in the hollow portion 21 to divide the hollow portion 21 into an upper half and a lower half, and the upper half or the lower half may be sealed with the main board 8 to form a sound cavity of the speaker 9 when the stand 2 is connected to the main board 8. Based on this, the radiator 3 can be laser-molded with the holder 2 existing for constructing the sound cavity of the speaker 9, facilitating the internal layout of the electronic apparatus 100, as opposed to the scheme in which an antenna holder is provided separately for the radiator 3. Of course, in order for the loudspeaker 9 to be able to transmit sound outwards, the holder 2 may also comprise a sound outlet 22, which sound outlet 22 is separate from the radiator 3. In still other embodiments, the stand 2 may also cover the motherboard 8 or surround the motherboard 8 to protect the motherboard 8 from electromagnetic effects of other electronic components.
Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This disclosure is intended to cover any adaptations, uses, or adaptations of the disclosure following the general principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.
It is to be understood that the present disclosure is not limited to the precise arrangements and instrumentalities shown in the drawings, and that various modifications and changes may be effected without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.
Claims (9)
1. An electronic device, comprising:
A housing;
A bracket located inside the housing;
the radiator is arranged on the bracket;
The coupling branch is arranged on one side of the shell facing the inside of the electronic equipment, the coupling branch is not directly connected with the shell, and the coupling branch is coupled with the radiator;
the insulating layer is arranged between the radiator and the coupling branch, and the insulating layer is respectively connected with the radiator and the coupling branch;
The insulating layer comprises a buffer insulating layer, and the deformation direction of the buffer insulating layer is the same as the lamination direction of the insulating layer, the radiator and the coupling branch.
2. The electronic device of claim 1, wherein the buffer insulating layer comprises a buffer foam or a buffer silicone layer.
3. The electronic device of claim 1, wherein a minimum compressed thickness of the buffer insulating layer is greater than or equal to a preset distance, the preset distance being a minimum separation distance of coupling between the coupling stub and the radiator.
4. The electronic device of claim 1, further comprising a first adhesive layer that adheres the insulating layer and the coupling stub.
5. The electronic device of claim 1, wherein the coupling stub comprises a copper foil layer.
6. The electronic device of claim 1, further comprising:
A second adhesive layer that adheres the bracket and the insulating layer to enclose the radiator between the second adhesive layer and the bracket; or the second adhesive layer adheres the insulating layer and the radiator.
7. The electronic device of claim 1, further comprising a motherboard, wherein the bracket covers or encloses the motherboard.
8. The electronic device of claim 1, further comprising a motherboard and a speaker electrically connected to the motherboard, wherein the bracket comprises a hollow portion, wherein the speaker is disposed in the hollow portion, wherein the bracket is respectively connected to the motherboard and the speaker, and wherein the bracket and the motherboard define a sound cavity of the speaker.
9. The electronic device of claim 1, wherein the support comprises a plastic support and the radiator comprises a laser formed radiator formed in the plastic support.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011582862.1A CN114696029B (en) | 2020-12-28 | 2020-12-28 | Electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011582862.1A CN114696029B (en) | 2020-12-28 | 2020-12-28 | Electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114696029A CN114696029A (en) | 2022-07-01 |
| CN114696029B true CN114696029B (en) | 2024-08-06 |
Family
ID=82129288
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011582862.1A Active CN114696029B (en) | 2020-12-28 | 2020-12-28 | Electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114696029B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106099321A (en) * | 2016-05-31 | 2016-11-09 | 北京奇虎科技有限公司 | Metal intelligent watch and full frequency band tuned antenna thereof |
| CN111430893A (en) * | 2020-03-31 | 2020-07-17 | Oppo广东移动通信有限公司 | Electronic device |
| CN111725607A (en) * | 2019-03-20 | 2020-09-29 | Oppo广东移动通信有限公司 | Millimeter wave antenna module and electronic equipment |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM493362U (en) * | 2014-08-26 | 2015-01-11 | Asustek Comp Inc | Wearable electronic device |
| CN205595455U (en) * | 2016-05-10 | 2016-09-21 | 合肥联宝信息技术有限公司 | Combined antenna , communication terminal's casing and communication terminal |
| CN205666332U (en) * | 2016-06-03 | 2016-10-26 | 合肥联宝信息技术有限公司 | Antenna, electronic equipment's frame and electronic equipment |
| CN106848594B (en) * | 2017-03-06 | 2019-10-11 | 北京小米移动软件有限公司 | Anneta module and electronic equipment |
| CN111864341B (en) * | 2019-04-30 | 2022-05-06 | Oppo广东移动通信有限公司 | Antenna assembly and electronic equipment |
| CN110336112B (en) * | 2019-05-09 | 2021-06-22 | 天通凯美微电子有限公司 | Electronic equipment with antenna feed unit, tuning unit and display screen assembly combined |
-
2020
- 2020-12-28 CN CN202011582862.1A patent/CN114696029B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106099321A (en) * | 2016-05-31 | 2016-11-09 | 北京奇虎科技有限公司 | Metal intelligent watch and full frequency band tuned antenna thereof |
| CN111725607A (en) * | 2019-03-20 | 2020-09-29 | Oppo广东移动通信有限公司 | Millimeter wave antenna module and electronic equipment |
| CN111430893A (en) * | 2020-03-31 | 2020-07-17 | Oppo广东移动通信有限公司 | Electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114696029A (en) | 2022-07-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN114554367B (en) | Sound producing device and electronic equipment | |
| US10757493B2 (en) | Speaker module | |
| CN208797169U (en) | Intelligence wearing equipment with antenna structure | |
| EP2632171B1 (en) | Loudspeaker housing and mobile terminal device | |
| CN109216874A (en) | Wearable device with antenna structure | |
| CN106454654B (en) | Single loudspeaker shell, single loudspeaker module and electronic equipment | |
| CN106954146B (en) | Silica gel vibrating diaphragm assembling structure for loudspeaker and preparation method | |
| GB2444360A (en) | Antenna embedded in a laminated and moulded shell of a device | |
| CN207665206U (en) | Electroacoustic transducer and electronic equipment | |
| CN212572950U (en) | Loudspeaker | |
| CN110572746A (en) | A conducting film and sound generating mechanism for sound generating mechanism | |
| CN114696029B (en) | Electronic equipment | |
| CN220292186U (en) | Sound producing device and electronic equipment | |
| CN209823995U (en) | Sound production device | |
| CN215818531U (en) | Head-wearing type Bluetooth earphone | |
| CN113543011B (en) | Loudspeaker module, processing technology of shell of loudspeaker module and electronic equipment | |
| CN206759708U (en) | Silica gel vibrating diaphragm package assembly for loudspeaker | |
| CN205454088U (en) | Flat loudspeaker | |
| CN102835131B (en) | Customized audio/antenna module and method for making the same | |
| TW201225417A (en) | Antenna system | |
| CN212572958U (en) | Loudspeaker | |
| CN205622856U (en) | Flexible formula film speaker | |
| CN219876118U (en) | Vibration sounding device and electronic equipment | |
| CN220493140U (en) | Vibration sounding device, vibration sounding module and electronic equipment | |
| CN112830447B (en) | MEMS sensor and electronic device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |