CN114690584A - Method for asymmetric calibration of overlay error measurement - Google Patents

Method for asymmetric calibration of overlay error measurement Download PDF

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Publication number
CN114690584A
CN114690584A CN202011643709.5A CN202011643709A CN114690584A CN 114690584 A CN114690584 A CN 114690584A CN 202011643709 A CN202011643709 A CN 202011643709A CN 114690584 A CN114690584 A CN 114690584A
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light
overlay
measurement
overlay mark
spot
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郑振飞
管小飞
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Shanghai Micro Electronics Equipment Co Ltd
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Shanghai Micro Electronics Equipment Co Ltd
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605Workpiece metrology
    • G03F7/70616Monitoring the printed patterns
    • G03F7/70633Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7019Calibration
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7046Strategy, e.g. mark, sensor or wavelength selection
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7049Technique, e.g. interferometric

Abstract

The invention provides an asymmetry calibration method for overlay error measurement, which comprises the following steps: providing an overlay mark, projecting the measuring light spot onto the overlay mark, and reflecting the measuring light spot by the overlay mark to form diffracted light; adjusting the overlay mark to a first position, moving the overlay mark in a stepping manner for multiple times along the direction of the horizontal component of the measuring light spot, acquiring the light intensity of diffracted light of the overlay mark after each stepping movement, generating a first measuring signal, and taking the mean value of the first measuring signal as a first reference signal; adjusting the overlay mark to a second position, moving the overlay mark along the direction of the horizontal component of the measuring light spot for multiple times in a stepping manner, acquiring the light intensity of diffracted light of the overlay mark after each stepping movement, generating a second measuring signal, and taking the mean value of the second measuring signal as a second reference signal; and acquiring a reference signal according to the first reference signal and the second reference signal. The method for calibrating the asymmetry of the overlay error measurement can enable the overlay error measurement to have more stability.

Description

Method for asymmetric calibration of overlay error measurement
Technical Field
The invention relates to the technical field of photoetching, in particular to an asymmetry calibration method for overlay error measurement.
Background
According to a photolithography measurement Technology Roadmap given by the semiconductor industry organization (International Technology Roadmap for Semiconductors, ITRS), as the Critical Dimension (CD) of a photolithography pattern enters 22nm and below process nodes, especially the application and development of Double exposure (Double Patterning) and EUVL technologies, the measurement accuracy requirement for photolithography process parameter Overlay (Overlay) has entered the sub-nanometer field. Due to the limitation of Imaging resolution, the conventional Imaging-Based overlay error measurement technology (IBO) Based on Imaging and image recognition has gradually failed to meet the requirements of new process nodes on overlay error measurement, and the overlay error measurement technology (DBO) Based on Diffraction light detection and the overlay error measurement technology (DBO) Based on micro-mark Diffraction light detection are becoming the main means of overlay error measurement.
For example, chinese patent CN106933046A discloses a DB0 technology, which obtains alignment error by measuring asymmetry between the same diffraction orders in the angle-resolved spectrum of the diffracted light of the alignment mark. The diffraction angle of the diffracted light changes with the incident angle of the incident light, and the reflected light angle-resolved spectrum refers to the light intensity distribution formed by the diffracted light at different angles after the incident light at different angles is diffracted by the mark. The scheme is essentially based on the relationship between the light intensity of each level of diffracted light generated by incidence on the overlay mark and the overlay error to measure the overlay error. Therefore, a series of factors such as the spatial distribution nonuniformity and the disturbance thereof of the incident light, the sensitivity nonuniformity of a signal receiving device, i.e., a detector, the nonuniformity of the transmittance of any optical element in the optical path, and the like cause the actually measured light intensity to deviate from an ideal value, and further introduce a measurement error, thereby influencing the measurement accuracy of the overlay error.
Similarly, after the position of the overlay mark is changed, the relative position of the incident light and the overlay mark is often changed, which causes the light intensity distribution of the diffracted light to be changed, and further affects the measurement accuracy of overlay error measurement.
When overlay error measurement is performed, the overlay error measurement apparatus needs to perform asymmetry calibration to eliminate the transmittance asymmetry in the optical path and obtain a reference signal without obtaining any overlay signal, which is called asymmetry calibration.
Disclosure of Invention
The invention aims to provide an overlay error measuring device and method, which can solve the problem that the measurement precision is influenced by the change of the light intensity distribution of diffracted light caused by the change of the position of an overlay mark.
In order to achieve the above object, the present invention provides a method for asymmetry calibration of overlay error measurement, comprising:
providing an overlay mark, projecting a measuring light spot onto the overlay mark, and reflecting the measuring light spot by the overlay mark to form diffracted light;
adjusting the overlay mark to a first position, moving the overlay mark along the direction of the horizontal component of the measuring light spot for multiple times in a stepping manner, obtaining the light intensity of diffracted light of the overlay mark and generating a first measuring signal after each stepping movement, and taking the mean value of the first measuring signal as the first reference signal;
adjusting the overlay mark to a second position, moving the overlay mark along the direction of the horizontal component of the measuring light spot for multiple times in a stepping manner, obtaining the light intensity of diffracted light of the overlay mark and generating a second measuring signal after each stepping movement, and taking the mean value of the second measuring signal as a second reference signal;
and acquiring a reference signal according to the first reference signal and the second reference signal.
Optionally, the step of acquiring the reference signal by the processing module includes:
the reference signal OV _ ref is calculated using the following equation:
OV_ref=OV_0+OV_180;
wherein, OV _0 is the first reference signal, OV _180 is the second set of reference numbers.
Optionally, the measurement light spot is split to form a monitoring light spot.
Optionally, when the obtained diffracted light is processed to obtain the first signal and the second signal, the diffracted light of the overlay mark and the light intensity of the monitoring light spot are normalized to eliminate light intensity disturbance.
Optionally, the overlay mark includes a first grating and a second grating stacked together, and the first grating and the second grating have the same structure period.
Optionally, the overlay mark is disposed on the substrate or the workpiece stage.
Optionally, the displacement Y of the step movement of the workpiece stage satisfies the following formula:
Y=P/N;
wherein, N is the number of stepping movement, and P is the grating structure period.
Optionally, the number of times of the step movement of the workpiece stage is 4.
Optionally, the second position is obtained by rotating the first position by 180 degrees.
Optionally, the measurement spot is a single wavelength of light.
In the method for calibrating asymmetry of overlay error measurement provided by the invention, the overlay mark is adjusted to a first position, the overlay mark is moved in a stepping manner for a plurality of times along the direction of the horizontal component of the measurement light spot, after each stepping movement, the light intensity of diffracted light of the overlay mark is obtained and a first measurement signal is generated, and the mean value of the first measurement signal is taken as the first reference signal; and adjusting the overlay mark to a second position, stepping and moving the overlay mark for multiple times along the direction of the horizontal component of the measuring light spot, acquiring the light intensity of diffracted light of the overlay mark and generating a second measuring signal after each stepping and moving, and taking the mean value of the second measuring signal as the second reference signal. The method can be used for floating the light intensity change of the diffracted light caused by the relative position change of the measuring light spot and the overlay mark, so that the reference signal obtained by the asymmetry calibration of the overlay error measurement is more accurate, and the accuracy and the stability of the overlay error measurement are improved.
Drawings
Fig. 1 is a schematic structural diagram of an overlay error measurement apparatus according to a first embodiment of the present invention;
FIG. 2 is a diagram of the positions of signal spots and monitoring spots in accordance with a first embodiment of the present invention;
fig. 3 is a schematic structural diagram of a first view angle of an overlay mark according to a first embodiment of the present invention;
FIG. 4 is a diagram illustrating reflected diffracted light from the overlay mark according to a first embodiment of the present invention;
FIG. 5 is a schematic diagram illustrating a second view angle of an overlay mark according to a first embodiment of the present invention;
FIG. 6 is a comparison of the overlay mark rotated 180 degrees from the first viewing angle according to a first embodiment of the present invention;
FIG. 7 is a schematic view of a projection of a measurement spot on an overlay mark according to a first embodiment of the present invention;
FIG. 8 is a graph showing the relationship between the size of the projection and the asymmetry of the positive and negative diffracted lights according to a first embodiment of the present invention;
FIG. 9 is a first relationship diagram of the relative positions of the measurement spot and the overlay mark and the overlay error test result in the second embodiment of the present invention;
FIG. 10 is a diagram showing the relationship between the relative positions of the measurement spot and the overlay mark and the difference between the positive and negative diffracted lights in accordance with the second embodiment of the present invention;
fig. 11 is a second relationship diagram of the relative positions of the measurement light spot and the overlay mark and the overlay error test result in the second embodiment of the present invention;
fig. 12 is a flowchart of acquiring a reference signal according to a third embodiment of the present invention;
wherein the reference numbers are as follows:
100-a light source module; 110-a light source; 120-a collimating lens; 130-narrow band filter segment; 140-a polarizer; 141-aperture diaphragm;
200-relay lens group; 210-a first lens; 220-a second lens; 230-variable field stop;
300-a beam splitter;
400-objective lens; 410-pupil plane;
500-a substrate; 510-overlay mark; 510 a-first overlay sub-mark; 510 b-first overlay sub-mark; 511-a first grating; 512-a second grating; 513-a transition layer;
600-a mirror;
700-a lens group;
800-a detector;
s-signal spot; m-monitoring the light spot; d-projection.
Detailed Description
The following describes in more detail embodiments of the present invention with reference to the schematic drawings. The advantages and features of the present invention will become more apparent from the following description. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present invention.
Example one
Fig. 1 is a schematic structural diagram of an overlay error measurement apparatus in this embodiment. As shown in fig. 1, the overlay error measuring apparatus includes:
and the light source module 100 is used for providing a measuring light spot. The light source module 100 is sequentially provided with: a light source 110, a collimating lens 120, a narrow band filter 130, a polarizer 140, and an aperture stop 150.
The light source 110 may be a white light source 110, a broadband light source 110, or a composite light source 110 composed of several discrete spectral lines. The light source 110 may be a surface light source 110, a line light source 110 or a point light source 110, and the light source 110 has other light spot shapes, and the measurement light spot generated by the light source module 100 is several of ultraviolet light, visible light and infrared light. Preferably, the light of the measuring light spot is light with a single wavelength
The white light source 110 may employ Xe light source 110 or the like; broadband refers to producing light that includes ultraviolet, visible, and infrared bands or combinations thereof; the composite light source 110 may be obtained by mixing several lasers of different wavelengths. The light emitted from the light source 110 sequentially passes through the collimating lens 120, the narrow-band filter 130, the polarizer 140 and the aperture diaphragm 150 along the light path to form a measurement light spot. Light emitted by the light source 110 is collimated by the collimating beam splitter, and then enters the narrow-band filter 130, and then light with a single wavelength is obtained, and then linearly polarized light is obtained through the polarizer 140, and the linearly polarized light enters the aperture stop 150, where the aperture stop 150 may be a circular hole or other shapes, which is not limited. The light source module 100 passes through the aperture stop 150 to generate a measurement spot that meets the shape requirement of the incident light.
The relay lens group 200 receives and relays the measurement light spot, and a variable field stop 230 is disposed on a conjugate surface of the relay lens group 200 for adjusting the size of the measurement light spot. Further, the variable field diaphragm 230 is in a conjugate relationship with the surface of the overlay mark 510, so that the size of the measurement spot can be effectively adjusted when the variable field diaphragm 230 is changed. Further, the variable field stop 230 has a circular or square ring shape. It should be understood that the variable field stop 230 may be any other shape, and is not limited herein.
The relay lens group 200 includes a first lens element 210 and a second lens element 220. The first lens 210 and the second lens 220 are used for condensing light, and the measuring light spots are adjusted by the first lens 210 and the second lens 220 and then further condensed.
A beam splitter 300 for reflecting the subsequent measurement spot to project the measurement spot onto the objective lens 400.
And the objective lens 400 is used for projecting the relayed measuring light spot onto the overlay mark 510 on the substrate 500, and the measuring light spot is reflected by the overlay mark 510 to form diffracted light. Meanwhile, the objective lens 400 collects the diffracted light reflected by the overlay mark 510 and converges the diffracted light to the pupil plane 410 of the objective lens 400.
The detector 800 is located on the pupil plane 410 of the objective lens 400, and is located on the same line with the beam splitter 300, the lens assembly 700, the objective lens 400, and the overlay mark 510. The diffracted light passes through the objective lens 400 again to reach the detector 800, and the detector 800 acquires the light intensity of the diffracted light and generates a measurement signal.
And the processing module is used for acquiring an overlay error according to the measurement signal.
Preferably, in order to improve the accuracy of the measurement, the light intensity disturbance monitoring is required to be carried out on the measurement light spot. Therefore, the overlay error measuring apparatus further includes a reflecting prism 600, the beam splitter 300 further transmits the measurement light spot after the relay, the reflecting prism 600 reflects the measurement light spot transmitted through the beam splitter 300 back to the beam splitter 300, the beam splitter 300 reflects the measurement light spot reflected back by the reflecting prism 600 again to form a monitoring light spot, and the detector 800 obtains the light intensity of the monitoring light spot to monitor the light intensity disturbance of the light source 110.
Fig. 2 is a diagram of the positions of the signal spot and the monitoring spot in the present embodiment. As shown in fig. 1 and 2, the signal spot s is formed by converging diffracted light, which is formed by irradiating the measurement spot onto the overlay mark 510, through the objective lens 400, and then projecting the converged diffracted light onto the detector 800 through the beam splitter 300 and the lens assembly 700, and the monitoring spot m is directly projected onto the detector 800 without passing through the objective lens 400 and the overlay mark 510. Meanwhile, the influence of the disturbance of the light intensity of the light source 110 on the measurement light spot and the monitoring light spot m is synchronous, and similarly, the influence of the disturbance of the light intensity of the light source 110 on the measurement light spot and the diffraction light (namely, the signal light spot s) is also synchronous, so that the influence of the disturbance of the light intensity of the light source 110 on the measurement light spot and the diffraction light (namely, the signal light spot s) can be eliminated by normalizing the light intensities of the signal light spot s and the monitoring light spot m. The light intensity disturbance normalization can adopt two modes of point division normalization and integer division normalization. The point-division normalization is to perform the pixel-to-pixel point-division normalization processing on the position of the signal light spot s from the position converted from the monitoring light spot m to the position of the signal light spot s based on the position relationship between the signal light spot s and the monitoring light m-light spot on the detector 800. The integer division normalization is performed by calculating the average intensity value of the monitoring light spot m and dividing the signal light spot s by the intensity value. It should be appreciated that one skilled in the art can choose to use either point-divide normalization or integer-divide normalization depending on the magnitude of the perturbation frequency. Further, the processing module normalizes the signal light spot s and the monitoring light spot m, and after normalization, the influence of the disturbance of the light intensity of the light source 110 on overlay error measurement can be eliminated.
Fig. 3 is a schematic structural diagram of a first viewing angle of an overlay mark in this embodiment. As shown in fig. 3, the overlay mark 510 includes a first grating 511 and a second grating 512 stacked, and the first grating 511 and the second grating 512 have the same structure period.
Specifically, the overlay mark 510 used in this embodiment includes a first grating 511 formed on the substrate 500 and a second grating 512 formed on the first grating 511, and an offset is formed between two grating structures of the overlay mark 510, wherein the first grating 511 is formed by exposing patterns through processes including developing, etching and depositing, and may specifically be a fluorine-doped silicon oxide dielectric thin film (copper (Cu) deposited in FSG), and a transition layer 513 may be provided between the first grating 511 and the second grating 512, in an embodiment of this embodiment, the transition layer 513 includes a SiN layer, a FSG layer, a Si0N layer and a anti-reflective coating (BARC) sequentially formed on the first grating 511, the second grating 512 is an exposed and developed photoresist pattern on the anti-reflective coating, as can be seen in fig. 3, the first grating 511 and the second grating 512 are both periodic structures, preferably the periods are the same.
The overlay error epsilon refers to the position error between two exposures. The position deviation between the overlay marks 510 may reflect the position deviation of the actual pattern, i.e., the overlay error epsilon.
FIG. 4 is a diagram illustrating the diffracted light reflected by the overlay mark 510 according to this embodiment. As shown in fig. 4, an overlay error ∈ exists between the overlay marks 510, that is, a position deviation exists between the first grating 511 and the second grating 512, and at this time, the light intensities of the positive diffraction light and the negative diffraction light generated from the measurement spots onto the overlay marks 510 are not symmetrical. In this specification, the positive order diffracted light may be simply referred to as positive order light, and the negative order diffracted light may be simply referred to as negative order light.
Based on this, the principle of measuring overlay error is as follows:
the measurement light spot is projected into the objective lens 400 through the light source 110, the relay lens group 200 and the beam splitter 300, the objective lens 400 projects the measurement light spot onto the overlay mark 510, and when the measurement light spot is projected onto the overlay mark 510, the diffraction light is asymmetric due to asymmetry of upper and lower layers of gratings of the overlay mark 510 caused by overlay error. It is to be understood that the asymmetry of the diffracted light includes the asymmetry of the optical path transmittance and the asymmetry of the intensity of the diffracted light. The optical path transmittance asymmetry is caused by the optical path itself. The asymmetry of the diffracted light intensity is caused by the overlay marks. The technical scheme in the embodiment is to calibrate the asymmetry of the light path transmittance.
Normally the diffracted light has multiple positive and negative ordersThus, the intensity of each order of diffracted light is asymmetric, and when the number of structural periods of the grating is large, the diffracted light generally follows the grating diffraction equation. The asymmetry of the light intensity varies approximately linearly with the overlay error within a small overlay error range. If the overlay mark 510 has an overlay error of epsilon, the measured light intensity I of the positive order diffraction light in the diffraction light reflected by the overlay mark 510+And the asymmetry of the intensity of the negative diffracted light I-can be approximated as:
A=I+-I-=k·ε (1)
where k is a factor related to the overlay mark 510 process and the measured spot property, and is an unknown quantity.
Fig. 5 is a schematic structural diagram of a second viewing angle of the overlay mark in this embodiment.
To remove this unknown quantity k, and obtain an overlay error epsilon, as shown in fig. 5, a number of sets of overlay marks are typically provided on the substrate, the sets of overlay marks being arranged in the pattern shown in fig. 5, the sets of overlay marks comprising a first overlay sub-mark 510a and a second overlay sub-mark 510b having the same structure period. In the upper part of fig. 5, an offset is not preset in the upper and lower grating structures of the first overlay sub-mark 510a and the second overlay sub-mark 510b, and in the lower part of fig. 5, a preset offset exists between the upper and lower gratings of the first overlay sub-mark 510a and the second overlay sub-mark 510b, the offset of the first overlay sub-mark 510a is- Δ, and the offset of the second overlay sub-mark 510b is + Δ. At this time, the asymmetry of the diffracted light on the first and second overlay sub-marks 510a and 510b, respectively, is measured to obtain:
Aright=k·(ε+Δ) (2)
Aleft=k·(ε-Δ) (3)
combining equations (4) and (5), the resulting overlay error ε is:
Figure BDA0002880359080000081
thus, overlay error can be calculated from asymmetry of the intensity of diffracted light. However, since the obtained diffracted lights are all reflected by the overlay mark 510, the overlay information (even if it is an ideal optical path, the obtained positive diffracted light I) is mixed in all the optical signals of the diffracted lights+The intensity of the negative diffracted light I-will not be equal). In order to obtain the reference light (i.e., the reference signal in the present embodiment) without the overlay information, the asymmetry of the optical path transmittance needs to be calibrated (i.e., the asymmetry calibration in the present embodiment).
Fig. 6 is a comparison of the overlay mark in this embodiment before and after being rotated 180 degrees at the first viewing angle.
As shown in FIG. 6, for any overlay mark 510, after it rotates 180 degrees, it diffracts the positive order light I+Is equal to the light intensity of the original negative order diffracted light I-, namely:
Figure BDA0002880359080000082
combining equations (1) and (4), one can obtain:
Figure BDA0002880359080000083
as can be seen from the above, in order to eliminate the optical path transmittance asymmetry, the overlay mark 510 needs to be rotated by 180 degrees.
The overlay error measuring apparatus further includes a workpiece stage, the substrate 500 is placed on the workpiece stage, and the workpiece stage can drive the substrate 500 to rotate, so that the overlay mark 510 can rotate 180 degrees.
Optionally, the workpiece stage is capable of stepping movement in the direction of the horizontal component of the measurement spot.
In this way, the substrate 500 and the overlay mark 510 carried by the workpiece stage can be moved stepwise in the direction of the horizontal component of the measurement spot.
When measuring the overlay error, the device for measuring the overlay error needs to perform asymmetry calibration to eliminate the transmittance asymmetry in the optical path and obtain a reference signal without any overlay signal. Then, the actual overlay signal point is divided by the reference signal to obtain an overlay error value. This step is well known to those of ordinary skill in the art and will not be described further herein.
In addition, the invention also provides a method for calibrating the asymmetry of overlay error measurement, which comprises the following steps:
the light source module 100 provides a measurement light spot, the measurement light spot passes through the relay lens group 200, the beam splitter 300 and the objective lens 400 and then is projected to the overlay mark 510 on the substrate 500, and is reflected by the overlay mark 510 to form diffracted light, and the diffracted light passes through the objective lens 400 again to reach the detector 800;
setting the substrate 500 at a first position, adjusting the variable field diaphragm 230 to adjust the size of the measurement light spot until the diffracted light meets the control requirement, and acquiring the light intensity of the diffracted light and generating a first reference signal by the detector 800;
the substrate 500 is arranged at a second position, the variable field diaphragm 230 is adjusted to adjust the size of the measurement light spot until the diffracted light meets the control requirement, and the detector 800 acquires the light intensity of the diffracted light again and generates a second reference signal;
and the processing module acquires a reference signal according to the first reference signal and the second reference signal so as to finish asymmetry calibration.
Further, the second position is obtained by rotating the first position by 180 degrees. That is, the substrate 500 is rotated by 180 degrees after the first reference signal is generated, so that the overlay mark 510 can be rotated by 180 degrees. Then, the diffracted light reflected by the overlay mark 510 is acquired again by the detector 800 to generate a second reference signal.
It is noted that the light intensity of the positive and negative diffracted lights is expressed as follows:
Figure BDA0002880359080000091
Figure BDA0002880359080000092
wherein the phase shift Ψ0,1Is determined by the geometry of the gratings (first grating 511 and second grating 512), the wavelength of the measuring spot and the angle of diffraction fluctuation, P is the pitch of the two gratings (first grating 511 and second grating 512), and X isSIs the overlay value. Wherein, T0And T1Refractive indices, R, of the materials of the first and second gratings 511 and 512, respectively0And R1The reflectivity of the first grating 511 and the second grating 512, respectively.
Refractive index T of the first grating 5110And refractive index T of the second grating 5121The amount is a spatially varying amount, and therefore, the intensity of the diffracted light on the pupil plane 410 of the objective lens varies with the position of the overlay mark 510 illuminated by the measurement spot, which affects the first reference signal and the second reference signal, and further affects the result of the asymmetry calibration, and finally affects the accuracy and repeatability of the overlay error measurement.
However, in practical cases, the relative positions of the measurement spot and the overlay mark 510 tend to change after rotating the overlay mark 510 by 180 degrees. The positions of the overlay marks 510 irradiated by the measurement light spots are different, which causes the light intensity of the positive and negative diffracted light to change, so that the relative light intensity of the positive and negative diffracted light changes after the overlay marks 510 rotate by 180 degrees, thereby affecting the accuracy of overlay error measurement.
The step of acquiring the reference signal by the processing module comprises:
the reference signal OV _ ref is calculated using the following equation:
OV_ref=OV_0+OV_180;
wherein, OV _0 is a first reference signal, and OV _180 is a second reference signal.
Furthermore, the diffracted light comprises positive-order diffracted light and negative-order diffracted light, a relation curve is generated by the light intensity difference of the positive-order diffracted light and the negative-order diffracted light and the size of the measuring light spot, and when the slope of the relation curve reaches the maximum, the diffracted light meets the control requirement.
Fig. 7 is a schematic view of the projection of the measurement spot on the overlay mark in this embodiment. As shown in fig. 7, the applicant found that, in a projection D of the measurement spot on the surface of the overlay mark 510, the ratio of the groove area and the ridge area of the gratings (i.e., the first grating 511 and the second grating 512) of the overlay mark 510 varies periodically with the intensity of the diffracted light reflected by the gratings, which results in the asymmetry of the intensities of the positive and negative diffracted lights varying periodically. Therefore, the size of the measurement spot has a direct relationship with the change of the intensity of the positive and negative diffracted lights, and based on this, the applicant proposes to replace the field stop in the light path with the variable field stop 230, so that the size of the measurement spot can be adjusted at any time, and the size of the projection D of the measurement spot on the surface of the overlay mark 510 can be adjusted. And then the ratio of the grating groove area and the grating ridge area of the gratings (i.e. the first grating 511 and the second grating 512) of the overlay mark 510 in the projection D is controlled, so as to adjust the change of the diffracted light intensity caused by the 180-degree rotation of the overlay mark 510.
Fig. 8 is a graph showing the relationship between the size of the projection and the asymmetry of the light intensity of the positive and negative diffracted lights in this embodiment. As shown in FIG. 8, the size of the projection D and the light intensity difference (I) of the positive and negative diffracted lights+-I-) is periodically varied. That is, the measured spot size (characterized by the size of the projection D) varies periodically with the effect of asymmetry in the intensity of the positive and negative diffracted light. Based on this, we can adjust the size of the measurement spot by adjusting the variable field stop 230 and measure the light intensity difference between the positive order diffracted light and the negative order diffracted light in real time when acquiring the first reference signal. As shown in FIG. 8, the light intensity difference between the positive order diffracted light and the negative order diffracted light has a periodic relationship with the size of the measuring spot, and based on this, when the slope of the light intensity difference between the positive order diffracted light and the negative order diffracted light along with the change of the size of the measuring spot is the largest, the diffracted light is obtained by the detector 800 to generate the first reference signal. Then the overlay mark 510 is rotated by 180 degreesThe variable field stop 230 is adjusted again to adjust the size of the measurement spot. Similarly, when the slope of the light intensity difference between the positive order diffracted light and the negative order diffracted light along with the change of the measurement spot size is the largest, the detector 800 acquires the diffracted light to generate a second reference signal.
It should be appreciated that when the variable field stop 230 is adjusted, the size of the measurement spot is less than or equal to the size of the overlay mark 510. This is to enable the projection of the measurement spot on the surface of the overlay mark 510 to fall completely within the overlay mark 510.
With continued reference to fig. 1 and 2, in one embodiment of this embodiment, the variable field stop 230 has a circular shape, and thus, the measurement spot has a circular shape. Based on this, the diameter of the measurement spot is less than or equal to 30 um. It will be appreciated that an excessively large measurement spot may result in an increase in the size of the overlay mark 510, which is undesirable.
Further, the overlay error measuring apparatus further includes a reflection prism 600, the beam splitter 300 further transmits the measurement light spot after the relay, the reflection prism 600 reflects the measurement light spot transmitted through the beam splitter 300 back to the beam splitter 300, the beam splitter 300 reflects the measurement light spot reflected back by the reflection prism 600 again to form a monitoring light spot m, and the detector 800 obtains the light intensity of the monitoring light spot m to monitor the light intensity disturbance of the light source 110.
The detector 800 obtains the light intensity of the diffracted light (i.e. the signal light spot s) and generates a first measurement signal, obtains the monitoring light spot m to generate a first monitoring signal, and performs normalization processing on the first measurement signal and the first monitoring signal to obtain the first reference signal.
The detector 800 obtains the light intensity of the diffracted light (i.e. signal light spot s) and generates a second measurement signal, obtains the monitoring light spot m to generate a second monitoring signal, and performs normalization processing on the second measurement signal and the second monitoring signal to obtain the second reference signal.
In detail, referring to fig. 2 and 5, the first reference signal is obtained in such a manner that when the overlay mark 510 is at 0 degree, the detector 800 receives the diffracted light and the monitoring light spot m, and performs light intensity disturbance normalization processing on the diffracted light and the monitoring light spot m, that is, the detector 800 simultaneously obtains the light intensities of the diffracted light and the monitoring light spot m to generate a first measurement signal and a first monitoring signal, and then performs normalization processing on the first measurement signal and the first monitoring signal to obtain a first reference signal. Then, after the rotatable workpiece table drives the overlay mark 510 to rotate 180 degrees, the detector 800 receives the diffracted light and the monitoring light spot m again, and performs light intensity disturbance normalization processing on the diffracted light and the monitoring light spot m, that is, the detector 800 simultaneously obtains the light intensities of the diffracted light and the monitoring light spot m to generate a second measurement signal and a second monitoring signal, and then performs normalization processing on the second measurement signal and the second monitoring signal to obtain a second reference signal.
Example two
In the method for asymmetric calibration of overlay error measurement provided in this embodiment, the same portions as those in the first embodiment are not described again, and only different points will be described below.
The present embodiment is different from the first embodiment in that the step of acquiring the light intensity of the diffracted light and generating the first reference signal by the detector 800 further includes:
when the detector 800 obtains the diffracted light, the overlay mark 510 moves step by step for a plurality of times along the direction of the horizontal component of the measurement light spot, after each step, the detector 800 obtains the light intensity of the diffracted light of the overlay mark 510 and generates a first measurement signal, and the mean value of the first measurement signal is taken as the first reference signal.
The step of the detector 800 acquiring the light intensity of the diffracted light and generating a second reference signal comprises:
when the detector 800 obtains the diffracted light, the overlay mark 510 moves step by step for a plurality of times along the direction of the horizontal component of the measurement light spot, after each step, the detector 800 obtains the light intensity of the diffracted light of the overlay mark 510 and generates a second measurement signal, and the mean value of the second measurement signal is taken as the second reference signal.
It will be appreciated that the size of the measurement spot has been adjusted by adjusting the variable field stop 230 until the diffracted light meets the control requirements before the overlay mark 510 is moved stepwise a plurality of times in the direction of the horizontal component of the measurement spot to take a plurality of first measurement signals when the first reference signal is acquired. Similarly, when the second reference signal is acquired, the variable field stop 230 is adjusted to adjust the size of the measurement spot until the diffracted light satisfies the control requirement, and then the engraved mark is moved in steps in the direction of the horizontal component of the measurement spot for a plurality of times to acquire a plurality of second measurement signals.
Fig. 9 is a first relationship diagram of the relative positions of the measurement spot and the overlay mark and the overlay error test result in this embodiment. As shown in fig. 9, the relationship between the relative position X of the measurement spot and the overlay mark and the reference signal OV changes regularly, when the measurement spot is irradiated at different positions of the overlay mark 510, the ratio of the area of the grating grooves and the area of the grating ridges of the grating (i.e. the first grating 511 and the second grating 512) of the overlay mark 510 in the projection D of the measurement spot on the overlay mark 510 changes periodically with the intensity of the diffracted light reflected by the grating, and the diffracted light reflected by the overlay mark 510 changes, so that the asymmetry of the intensities of the positive and negative diffracted lights of the diffracted light reflected by the overlay mark 510 changes periodically.
Further, the overlay mark 510 includes a first grating 511 and a second grating 512 stacked, the structure periods of the first grating 511 and the second grating 512 are the same, and the total displacement amount of the overlay mark 510 after multiple stepping movements is equal to the structure period.
FIG. 10 is a graph showing the relationship between the relative positions of the measurement spot and the overlay mark and the difference between the positive and negative diffracted lights in this example. As shown in FIG. 10, the relative position X of the measurement spot and the overlay mark 510 is compared with the light intensity difference (I) between the positive and negative diffracted lights+The relationship between-I-) varies periodically. The asymmetry of the light intensity of the positive and negative diffracted lights can be embodied by the light intensity difference of the positive and negative diffracted lights, and the diffracted light intensity can be obviously seen from the figure (in the figure)Overlay error test result X may be indicative of diffracted intensity) is consistent with the structural period of the gratings (first grating 511 and second grating 512). Based on this, in order to eliminate the variation of asymmetry of the positive and negative order diffracted light intensities caused by the different positions of the measurement light spots on the overlay mark 510, when a first reference signal is obtained, the overlay mark 510 is moved step by step along the direction of the horizontal component of the measurement light spot for a plurality of times, after each step, the detector 800 obtains the light intensity of the diffracted light of the overlay mark 510 and generates a first measurement signal, and an average value of a plurality of first measurement signals is taken as the first reference signal. Similarly, when the second reference signal is obtained, the overlay mark 510 moves step by step along the direction of the horizontal component of the measurement spot for multiple times, after each step, the detector 800 obtains the light intensity of the diffracted light of the overlay mark 510 and generates a second measurement signal, and the average value of the multiple second measurement signals is taken as the second reference signal.
Fig. 11 is a second relationship diagram of the relative positions of the measurement spot and the overlay mark and the overlay error test result in this embodiment. As shown in fig. 9 and fig. 11, after the method for asymmetric calibration of overlay error measurement according to the present embodiment is adopted, we can find that even though the position of the measurement spot has a very large change, because the overlay mark 510 moves stepwise a plurality of times along the direction of the horizontal component of the measurement spot, a plurality of samples are taken and the average of a plurality of measurement signals (i.e. the first measurement signal or the second measurement signal) is taken, so that the change of the light intensity of the diffracted light caused by the change of the position of the measurement spot can be smoothed. Therefore, the asymmetry calibration method in this embodiment can obtain a more accurate (i.e. without any overlay signal) reference signal, so that the overlay error measurement is less affected by the position change of the measurement spot, and is more stable.
EXAMPLE III
In the method for asymmetric calibration of overlay error measurement provided in this embodiment, the same portions as those in the first embodiment and the second embodiment are not described again, and only different points will be described below.
The present embodiment is different from the first and second embodiments in that, in the present embodiment, the overlay error measuring apparatus may not be provided with the variable field stop 230 or the variable field stop 230 may not be used. The method for calibrating asymmetry of overlay error measurement provided by the embodiment comprises the following steps:
step S1, providing an overlay mark 510, projecting a measurement light spot onto the overlay mark 510, and reflecting the measurement light spot by the overlay mark 510 to form diffracted light;
step S2, adjusting the overlay mark 510 to a first position, moving the overlay mark 510 along the direction of the horizontal component of the measuring spot by steps for a plurality of times, obtaining the light intensity of the diffracted light of the overlay mark 510 after each step movement and generating a first measuring signal, and taking the mean value of the first measuring signal as the first reference signal;
step S3, adjusting the overlay mark 510 to a second position, moving the overlay mark 510 in a step-by-step manner for multiple times along the direction of the horizontal component of the measurement light spot, after each step-by-step movement, obtaining the light intensity of the diffracted light of the overlay mark 510 and generating a second measurement signal, and taking the mean value of the second measurement signal as the second reference signal;
and step S4, acquiring an overlay error according to the first reference signal and the second reference signal.
Specifically, in step S1, the overlay mark 510 is disposed on the substrate 500 or the workpiece stage, the measurement light spot emitted by the light source module 100 is projected onto the overlay mark 510 through the relay lens assembly 200, the beam splitter 300 and the objective lens 400, the measurement light spot is reflected by the overlay mark 510 to form diffracted light, and the detector 800 is configured to capture the diffracted light. And the processing module acquires a reference signal according to the first reference signal and the second reference signal to finish asymmetry calibration.
The step of processing the acquired reference signal by the processing module comprises:
the reference signal OV _ ref is calculated using the following equation:
OV_ref=OV_0+OV_180;
wherein, OV _0 is a first reference signal, and OV _180 is a second reference signal.
Similarly, the reference signal OV _ ref needs to be normalized by the optical intensity perturbation. In order to better explain the process of acquiring the first reference signal and the second reference signal in this example, the following description is made with reference to the accompanying drawings.
Fig. 12 is a flowchart of acquiring a reference signal in the present embodiment. As shown in fig. 12, the reference signal is acquired in the following manner:
the overlay mark 510 is moved and a plurality of signals are acquired. That is, the overlay mark 510 is moved in a plurality of steps along the direction of the horizontal component of the measurement spot, and after each step movement, the light intensity of the diffracted light of the overlay mark 510 is obtained and a first measurement signal is generated.
Taking the mean value of the first measurement signal as the first reference signal. That is, a signal of the overlay mark 510 at 0 degrees is obtained.
When the overlay mark 510 is 0 degree, after each step movement, the detector 800 receives the diffracted light and the monitoring spot m, and performs light intensity disturbance normalization processing on the diffracted light and the monitoring spot m, that is, the detector 800 simultaneously obtains the light intensities of the diffracted light and the monitoring spot m to generate a first measurement signal and a first monitoring signal, and then performs normalization processing on the first measurement signal and the first monitoring signal, and averages the result of the normalization processing to obtain a first reference signal. That is, the intensity perturbations are normalized and averaged. Preferably, the light intensity perturbation normalization is performed by dot division normalization.
Then, the overlay mark 510 is rotated by 180 degrees, the overlay mark 510 is moved, and a plurality of signals are collected to acquire a second measurement signal.
Taking the mean value of the second measurement signal as the second reference signal. That is, a signal is obtained for the overlay mark 510 at 180 degrees.
When the overlay mark 510 is 180 degrees, after each step movement, the detector 800 receives the diffracted light and the monitoring spot m, and performs light intensity disturbance normalization processing on the diffracted light and the monitoring spot m, that is, the detector 800 simultaneously obtains the light intensities of the diffracted light and the monitoring spot m to generate a first measurement signal and a first monitoring signal, and then performs normalization processing on the first measurement signal and the first monitoring signal, and averages the result of the normalization processing to obtain a second reference signal. That is, the intensity perturbations are normalized and averaged. Preferably, the light intensity perturbation normalization is performed by dot division normalization.
Finally, the first reference signal and the second reference signal are added to obtain a reference signal without any overlay signal, and the asymmetry calibration of the overlay error measurement is completed.
It should be noted that in one embodiment of the present embodiment, the substrate 500 provided with the overlay mark 510 is placed on a stage, and therefore, the step movement of the overlay mark 510 is realized by step-moving the stage, and the displacement Y of the step movement satisfies the following formula:
Y=P/N;
wherein, N is the number of stepping movement, and P is the structural period of the grating.
Further, when the first measurement signal or the second measurement signal is acquired, the number of times of the stepping movement is 4.
In summary, the present invention provides an overlay error measurement apparatus, including a light source module, a relay lens group, a beam splitter, an objective lens, a detector and a processing module, wherein the light source module provides a measurement light spot, the relay lens group receives and relays the measurement light spot, and a conjugate surface of the relay lens group is provided with a variable field diaphragm for adjusting the size of the measurement light spot; the beam splitter is used for reflecting the measurement light spots after the relay; the objective lens is used for projecting the subsequent measuring light spot onto an overlay mark on a substrate and reflecting the measurement light spot by the overlay mark to form diffracted light; the detector enables the diffracted light to pass through the objective lens again to reach the detector, and the detector acquires the light intensity of the diffracted light and generates a measurement signal; the processing module is used for acquiring an overlay error according to the measurement signal. When the relative positions of the measuring light spot and the overlay mark are changed, the size of the measuring light spot can be adjusted through the variable field diaphragm so as to adjust the light intensity of the diffracted light. The problem that measurement accuracy is affected due to the change of light intensity distribution of diffracted light after the position of the overlay mark is changed is solved.
The above description is only a preferred embodiment of the present invention, and does not limit the present invention in any way. It will be understood by those skilled in the art that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (10)

1. A method of asymmetry calibration of overlay error measurements, comprising:
providing an overlay mark, projecting a measuring light spot onto the overlay mark, and reflecting the measuring light spot by the overlay mark to form diffracted light;
adjusting the overlay mark to a first position, moving the overlay mark along the direction of the horizontal component of the measuring light spot for multiple times in a stepping manner, obtaining the light intensity of diffracted light of the overlay mark and generating a first measuring signal after each stepping movement, and taking the mean value of the first measuring signal as the first reference signal;
adjusting the overlay mark to a second position, moving the overlay mark along the direction of the horizontal component of the measuring light spot for multiple times in a stepping manner, obtaining the light intensity of diffracted light of the overlay mark and generating a second measuring signal after each stepping movement, and taking the mean value of the second measuring signal as a second reference signal;
and acquiring a reference signal according to the first reference signal and the second reference signal.
2. The method for asymmetry calibration of overlay error measurements according to claim 1, wherein said step of said processing module acquiring said reference signal comprises:
the reference signal OV _ ref is calculated using the following equation:
OV_ref=OV_0+OV_180;
wherein, OV _0 is the first reference signal, OV _180 is the second set of reference numbers.
3. The method for asymmetry calibration of an overlay error measurement according to claim 1, wherein said measurement spot is split to form a monitor spot.
4. The method for asymmetry calibration of overlay error measurements according to claim 3, wherein the diffracted light of said overlay mark and the intensity of the monitoring spot are normalized to eliminate intensity perturbations when the obtained diffracted light is processed to obtain said first measurement signal and said second measurement signal.
5. The method for asymmetry calibration of overlay error measurements according to claim 1, wherein said overlay mark comprises a first grating and a second grating stacked, said first grating and said second grating having the same structure period.
6. The method for asymmetry calibration of overlay error measurements according to claim 5, wherein said overlay mark is provided on a substrate or a workpiece stage.
7. The method for asymmetry calibration of overlay error measurements according to claim 6, wherein said stage is moved in steps by an amount Y satisfying the following equation:
Y=P/N;
wherein, N is the number of stepping movement, and P is the grating structure period.
8. The method for asymmetry calibration of an overlay error measurement according to claim 7, wherein said stage is moved in steps 4 times.
9. The method for asymmetry calibration of overlay error measurements according to claim 1, wherein said second position is obtained after rotating said first position 180 degrees.
10. The method for asymmetry calibration of overlay error measurements according to claim 1 wherein said measurement spot is a single wavelength of light.
CN202011643709.5A 2020-12-31 2020-12-31 Method for asymmetric calibration of overlay error measurement Pending CN114690584A (en)

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