CN114684781A - Method for manufacturing three-dimensional micro-nano device based on curved surface substrate - Google Patents
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Abstract
The disclosure relates to a method for manufacturing a three-dimensional micro-nano device based on a curved surface substrate. The method comprises the following steps: carrying out prestress loading on the curved surface substrate according to a corresponding prestress loading strategy to obtain an expanded curved surface substrate; transferring a two-dimensional precursor manufactured according to a three-dimensional micro-nano device with a target space structure to a curved surface substrate after expansion; fixing a part to be fixed of the two-dimensional precursor on the curved substrate after the unfolding; releasing the prestress loaded on the curved surface substrate after the expansion so as to deform the two-dimensional precursor into a three-dimensional micro-nano device, thereby obtaining the curved surface substrate and the three-dimensional micro-nano device fixedly assembled on the curved surface substrate. The method can efficiently, quickly and accurately design and assemble abundant three-dimensional micro-nano devices on the curved surface with complex geometric morphology. The applicable assembling range is wider, and the assembling richness of the topological structure is stronger. The method can be used for developing novel three-dimensional flexible electronic devices which are suitable for curved surfaces and have wide application range.
Description
Technical Field
The disclosure relates to the technical field of advanced manufacturing, in particular to a design and manufacturing method of a three-dimensional micro-nano device based on a curved substrate.
Background
Due to the particularity of space size and structural design, the three-dimensional micro-nano device has the advantages of enhanced performance, high integration degree, rich new functions and the like, so the three-dimensional micro-nano device has important application potential in the fields of microelectronics, flexible electronics, biomedical treatment, energy collection, micro-electro-mechanical systems and the like. The design and preparation of the three-dimensional micro-nano device require wide application material range, large processing scale span, high assembly precision, high processing speed, rich geometric topological structure and the like. However, in the manufacturing methods provided by the related technologies, the three-dimensional micro-nano device can only be assembled on a planar substrate, and how to provide a method for designing and assembling the three-dimensional micro-nano device for a curved surface with a complex geometric shape and curvature distribution is a technical problem to be solved urgently.
Disclosure of Invention
In view of the above, the present disclosure provides a method for manufacturing a three-dimensional micro-nano device based on a curved substrate.
According to an aspect of the disclosure, a method for manufacturing a three-dimensional micro-nano device based on a curved substrate is provided, the method comprising:
carrying out prestress loading on the curved surface substrate according to a prestress loading strategy corresponding to the curved surface substrate to obtain an expanded curved surface substrate;
transferring a two-dimensional precursor to the stretched curved surface substrate, wherein the two-dimensional precursor is manufactured according to a three-dimensional micro-nano device with a target space structure to be manufactured;
fixing a part to be fixed of the two-dimensional precursor to the curved surface substrate after unfolding;
releasing the prestress loaded on the curved surface substrate after the unfolding so that the two-dimensional precursor is deformed into a three-dimensional micro-nano device in the prestress releasing process, and obtaining the curved surface substrate and the three-dimensional micro-nano device fixedly assembled on the curved surface substrate.
In one possible implementation, the method further includes:
and reversely designing and manufacturing a curved substrate which can be matched and installed on the target object based on the three-dimensional structure of the target object.
In one possible implementation, the method further includes:
determining a prestress loading strategy aiming at the curved substrate based on the three-dimensional micro-nano device and/or the structure of the curved substrate;
wherein the prestress loading strategy comprises any one of: uniaxial tension loading, biaxial tension loading, triaxial tension loading, multiaxial tension loading, tension-torsion coupling tension loading and stretch-bending coupling tension loading.
In one possible implementation, the curved surface of the curved substrate includes a combination of one or more of the following: a first-stage serpentine curved surface, a fractal serpentine curved surface, a hemispherical convex curved surface, a hemispherical concave curved surface, a multistage hemispherical convex curved surface, a multistage hemispherical concave curved surface, a bionic curved surface corresponding to a bionic object, a hyperboloid, a cylindrical surface, a three-way pipe curved surface, a torsion curved surface, a spiral curved surface, and an archimedes solenoid-shaped curved surface;
wherein the bionic object comprises any one of the following: heart, skull, face, blood vessels.
In one possible implementation, the method further includes:
determining a first parameter of a simulated planar structure corresponding to the three-dimensional micro-nano device according to a target structure parameter of a target space structure of the three-dimensional micro-nano device;
performing buckling assembly simulation on the simulated planar structural body based on the first parameters to obtain simulated structural parameters of a simulated space structural body corresponding to the simulated planar structural body after the simulated planar structural body is assembled on the curved surface substrate;
if the relative error between the simulated structure parameter and the target structure parameter is larger than an error threshold value, adjusting the first parameter according to the relative error, and continuing to perform buckling assembly simulation based on the adjusted first parameter; or alternatively
And if the relative error between the simulated structure parameter and the target structure parameter is less than or equal to an error threshold value, manufacturing the two-dimensional precursor according to the first parameter of the current simulated planar structure.
In a possible implementation manner, performing a buckling assembly simulation on the simulated planar structural body based on the first parameter to obtain a simulated structural parameter of a simulated spatial structural body corresponding to the simulated planar structural body assembled on the curved substrate includes:
and performing buckling assembly simulation on the simulated planar structural body in a finite element simulation mode based on the first parameter to obtain the simulated structural parameters of the simulated spatial structural body corresponding to the simulated planar structural body assembled on the curved substrate.
In one possible implementation, fixing the portion of the two-dimensional precursor to be fixed to the curved substrate comprises:
fixing the part to be fixed of the two-dimensional precursor on the curved surface substrate after unfolding in a sticking mode;
and the part to be fixed is determined according to the target space structure of the three-dimensional micro-nano device.
In a possible implementation manner, the target space structure of the three-dimensional micro-nano device includes one or more of the following combinations:
strip structure, film structure, laminated structure, paper-cut structure, paper-folded structure.
In one possible implementation, the method further includes:
and installing the curved surface substrate and the three-dimensional micro-nano device fixedly assembled on the curved surface substrate on a target object.
According to the manufacturing method of the three-dimensional micro-nano device based on the curved surface substrate, the abundant three-dimensional micro-nano devices can be efficiently, quickly and accurately designed and assembled on the curved surface with complex geometric shapes through the combination of multiple loading modes. Compared with a method based on a planar substrate in the related art, the method disclosed by the invention is wider in applicable assembly range and stronger in assembly richness of a topological structure. The method can be used for developing novel three-dimensional flexible electronic devices suitable for curved surfaces, and has important significance in various fields such as biomedicine, health care, electromagnetic sensing, robots and the like.
Other features and aspects of the present disclosure will become apparent from the following detailed description of exemplary embodiments, which proceeds with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate exemplary embodiments, features, and aspects of the disclosure and, together with the description, serve to explain the principles of the disclosure.
Fig. 1 shows a flow chart of a method for manufacturing a three-dimensional micro-nano device based on a curved substrate according to an embodiment of the disclosure.
Fig. 2A-2N are schematic diagrams illustrating a curved substrate in a method for manufacturing a three-dimensional micro-nano device based on the curved substrate according to an embodiment of the disclosure.
Fig. 3 shows a flow chart of manufacturing a two-dimensional precursor in a method for manufacturing a three-dimensional micro-nano device based on a curved substrate according to an embodiment of the disclosure.
Fig. 4A to 4D are schematic diagrams illustrating a process of manufacturing a three-dimensional micro-nano device in a method for manufacturing a three-dimensional micro-nano device based on a curved substrate according to an embodiment of the disclosure.
Detailed Description
Various exemplary embodiments, features and aspects of the present disclosure will be described in detail below with reference to the accompanying drawings. In the drawings, like reference numbers can indicate functionally identical or similar elements. While the various aspects of the embodiments are presented in drawings, the drawings are not necessarily drawn to scale unless specifically indicated.
The word "exemplary" is used exclusively herein to mean "serving as an example, embodiment, or illustration. Any embodiment described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other embodiments.
Furthermore, in the following detailed description, numerous specific details are set forth in order to provide a better understanding of the present disclosure. It will be understood by those skilled in the art that the present disclosure may be practiced without some of these specific details. In some instances, methods, means, elements and circuits that are well known to those skilled in the art have not been described in detail so as not to obscure the present disclosure.
In the related technology, various methods for preparing and assembling three-dimensional micro-nano devices have been reported at home and abroad, such as micro-nano processing etching, 4D printing, assembly based on active material strain driving and the like. In recent years, a mechanical-guided three-dimensional assembly method developed based on a mechanical buckling deformation theory provides a new way for preparing a complex three-dimensional micro-nano structure. The method is based on the traditional planar microelectronic processing technology to prepare an initial two-dimensional structure and transfer the initial two-dimensional structure onto a pre-stretched and flattened planar substrate, and then the planar structure selectively transferred onto the substrate is accurately assembled into a three-dimensional structure with complex and rich geometric morphology by releasing the pre-stretched substrate. The method meets the basic requirements of design and preparation of the three-dimensional micro-nano structure and can be well compatible with the traditional micro-nano processing technology. However, in the currently reported buckling assembly method based on mechanical guidance, the assembly of three-dimensional structures is mainly focused on a planar substrate, however, most of the surfaces of living bodies in nature have complex curvature distribution and geometric shapes, such as human skin, internal organs, veins/artery vessels, and the like. Therefore, in consideration of the advantages of the curved substrate such as complex space geometry and human body surface fitting, a method for manufacturing a three-dimensional micro-nano device based on the curved substrate is urgently needed.
In order to solve the technical problems, the disclosure provides a method for manufacturing a three-dimensional micro-nano device based on a curved substrate, and the abundant three-dimensional micro-nano devices can be efficiently, quickly and accurately designed and assembled on a curved surface with a complex geometric shape through combination of multiple loading modes. Compared with a method based on a planar substrate in the related art, the method disclosed by the invention is wider in applicable assembly range and stronger in assembly richness of a topological structure. The method can be used for developing novel three-dimensional flexible electronic devices suitable for curved surfaces, and has important significance in various fields such as biomedicine, health and medical treatment, electromagnetic sensing, robots and the like.
Fig. 1 shows a flow chart of a method for manufacturing a three-dimensional micro-nano device based on a curved substrate according to an embodiment of the disclosure. As shown in fig. 1, the method includes: step S11-step S14.
In step S11, a pre-stress is applied to the curved substrate according to a pre-stress application strategy corresponding to the three-dimensional structure of the curved substrate, so as to obtain an expanded curved substrate.
In one possible implementation, before step S11, the method may further include: and inversely designing and manufacturing a curved substrate which can be matched and installed on the target object based on the three-dimensional stereo structure of the target object.
In this implementation manner, the material of the curved substrate may be a flexible material that can be stretched, so as to ensure that the finally manufactured three-dimensional micro-nano device assembled on the curved substrate can be mounted on the surface of the target object under the action of the curved substrate. The curved substrate can be a thin film matched with a target object, for example, the size and the thickness of the curved substrate can be reduced, so that the curved substrate is more matched with the curved surface of the target object, conformal adaptation is facilitated, and the three-dimensional micro-nano device is convenient to assemble.
In some embodiments, to meet the use requirement, the thickness of the curved substrate may also be set, for example, the thickness of the curved substrate may be increased to appropriately increase the strength and rigidity of the three-dimensional micro-nano device and the curved substrate for adapting to complicated deformation or use conditions.
Fig. 2A-2N are schematic diagrams illustrating a curved substrate in a method for manufacturing a three-dimensional micro-nano device based on the curved substrate according to an embodiment of the disclosure. In one possible implementation, the curved surface of the curved substrate may include a combination of one or more of the following: a first-order serpentine curved surface (e.g., M shown in fig. 2A, which is similar to a shape of a snake body), a fractal serpentine curved surface (e.g., M shown in fig. 2B, which is similar to a shape formed by combining fractal and serpentine), a convex curved surface (e.g., M shown in fig. 2C and 2F) having a convex shape such as a hemisphere, a concave curved surface (e.g., M shown in fig. 2D) having a concave shape such as a hemisphere, a convex curved surface (e.g., M shown in fig. 2E, which may be formed by connecting together a plurality of stages of shapes such as a hemisphere, an ellipsoid), a multi-stage hemispherical concave curved surface, a bionic curved surface corresponding to a bionic object, a hyperboloid (e.g., M shown in fig. 2J, which may be a hyperboloid, etc.), a shape such as a column), a curved surface (e.g., a curved surface corresponding to a bionic object), a curved surface (e.g., a curved surface corresponding to a fractal shape of a snake body, a fractal curved surface), a fractal curved surface, a fractal surface, a cylindrical surface (M as shown in fig. 2I), a tee curved surface (M as shown in fig. 2K), a twisted curved surface (M as shown in fig. 2H), a spiral curved surface (M as shown in fig. 2N, the three-dimensional structure of the curved surface can be similar to the shape of a vine, etc.), and an archimedean spiral tubular curved surface (M as shown in fig. 2M, the shape of the curved surface in a top view is the same as or similar to the shape of the archimedean spiral).
Wherein the bionic object may comprise any one of the following: heart, skull, face (M as shown in fig. 2G), blood vessels (M as shown in fig. 2L). It will be appreciated that the shape of the curved substrate may be any shape other than the relatively regular shape illustrated by way of example above, and the disclosure is not limited in this respect.
In this implementation, after determining the three-dimensional spatial structure of the desired curved substrate, the manufacturing of the curved substrate may be implemented by using one or more of mechanical cast molding, 3D printing, laser cutting, and the like, which is not limited by the present disclosure.
In one possible implementation, the method may further include: before step S11, a pre-stress loading strategy for the curved substrate is determined based on the three-dimensional micro-nano device and/or the structure of the curved substrate. Wherein the pre-stress loading strategy may comprise any one of: uniaxial tension loading, biaxial tension loading, triaxial tension loading, multiaxial tension loading, tension-torsion coupling tension loading and stretch-bending coupling tension loading.
In this implementation, uniaxial tensile loading may refer to stretching a curved substrate in a certain direction to achieve pre-stress loading. Biaxial tensile loading may refer to stretching a curved substrate in two different directions to achieve a pre-stress loading. The triaxial tensile loading can refer to the stretching of a curved substrate in three different directions to achieve prestress loading. Multiaxial tensile loading may refer to stretching a curved substrate in different multiple directions to achieve pre-stress loading. Tension-torsion coupled tensile loading may refer to stretching and twisting of a curved substrate to achieve pre-stress loading. Stretch-bend coupled tensile loading may refer to stretching and bending a curved substrate to achieve a pre-stress loading. If the prestress loading strategy comprises multiple loads, the front and back sequence of the loads can be set according to the design requirements of the three-dimensional space structure of the curved surface substrate and the target space structure of the three-dimensional micro-nano device.
In the implementation mode, the curved substrate is preloaded to ensure that the two-dimensional precursor can be fixed to the post-expansion curved substrate, and the two-dimensional precursor can be deformed into the three-dimensional micro-nano device with the target space structure by releasing the prestress loaded on the post-expansion curved substrate. Therefore, corresponding prestress loading strategies can be set for different curved surface substrates and/or three-dimensional micro-nano devices.
For example, if the curved substrate is a one-level serpentine substrate as shown in fig. 2A, the pre-stress loading strategy may be uniaxial tensile loading. If the curved substrate is a fractal serpentine curved substrate as shown in fig. 2B, the pre-stress loading strategy may be uniaxial tensile loading. If the curved substrate is a hemispherical convex curved substrate as shown in fig. 2C or a hemispherical concave curved substrate as shown in fig. 2D, the pre-stress loading strategy may be biaxial tensile loading. If the curved substrate is a multi-stage hemispherical convex curved substrate as shown in fig. 2E, the pre-stress loading strategy may be biaxial tensile loading. If the curved substrate is a bionic curved substrate corresponding to the apex of the heart (bionic object) as shown in fig. 2F, the pre-stress loading strategy may be biaxial stretching loading. If the curved substrate is a cylindrical substrate as shown in fig. 2I, the pre-stress loading strategy may be uniaxial tensile loading. If the curved substrate is a hyperboloid substrate as shown in fig. 2J, the pre-stress loading strategy may be uniaxial tensile loading.
If the curved substrate is a tee curved substrate as shown in fig. 2K, the pre-stress loading strategy may be a tri-axial tensile loading.
If the curved substrate is a bionic curved substrate corresponding to an aorta (bionic object) as shown in fig. 2L, the pre-stress loading strategy may be a triaxial tensile loading. If the curved substrate is a twisted curved substrate as shown in fig. 2H, the pre-stress loading strategy may be tension-twist coupled loading. If the curved substrate is an archimedes solenoid-shaped curved substrate as shown in fig. 2M, the pre-stress loading strategy may be stretch-bending coupled loading. If the curved substrate is a spiral curved substrate (e.g., a vine-like curved substrate) as shown in fig. 2N, the pre-stress loading strategy may be tension-torsion coupling loading.
In this embodiment, the curved surface substrate has different three-dimensional structures (i.e., three-dimensional spatial structures) due to the difference of the target objects, and the curved surface substrate after the unfolding may be a substrate of a flattened plane or a substrate of an expandable curved surface due to the difference of the three-dimensional structures of the curved surface substrate. Therefore, the two-dimensional precursor can be fixed on the curved-surface substrate after being unfolded by a transfer printing method, and the curved-surface substrate after being unfolded after the prestress is released can be rebounded to the original state before the prestress is loaded. For example, for the hemispherical convex curved substrate shown in fig. 2C or the hemispherical concave curved substrate shown in fig. 2D, the pre-stress loading strategy may be biaxial tensile loading, and the stretched curved substrate obtained after loading the pre-stress is a flattened planar structure. For the cylindrical curved substrate shown in fig. 2I, the pre-stress loading strategy may be uniaxial tensile loading, and the stretched curved substrate obtained after loading the pre-stress is still a cylindrical surface (i.e., a developable curved surface).
In step S12, a two-dimensional precursor is transferred to the stretched curved substrate, where the two-dimensional precursor is manufactured according to a three-dimensional micro-nano device with a target spatial structure to be manufactured. The number of the two-dimensional precursors of the three-dimensional micro-nano device can be one or more. If the number of the two-dimensional precursors of the three-dimensional micro-nano device is multiple, the multiple two-dimensional precursors can be arranged in a large-scale densely-distributed array, and the disclosure does not limit the arrangement.
In one possible implementation, the method may further include: before performing step S12, a two-dimensional precursor is manufactured. Fig. 3 shows a flow chart of manufacturing a two-dimensional precursor in a method for manufacturing a three-dimensional micro-nano device based on a curved substrate according to an embodiment of the disclosure. As shown in fig. 3, the step of manufacturing a two-dimensional precursor includes: step S301 to step S306.
In step S301, a first parameter of a simulated planar structure corresponding to the three-dimensional micro-nano device is determined according to a target structure parameter of a target spatial structure of the three-dimensional micro-nano device. The first parameter may include geometric parameters such as length, width, and thickness of different parts of the simulated planar structure, and may also include physical and/or chemical performance parameters of the simulated planar structure, which are not limited in this disclosure.
In step S302, a buckling assembly simulation is performed on the simulated planar structural body based on the first parameter, so as to obtain a simulated structural parameter of a simulated spatial structural body corresponding to the simulated planar structural body after the simulated planar structural body is assembled on the curved substrate.
In a possible implementation manner, in step S302, based on the first parameter, a buckling assembly simulation may be performed on the simulated planar structural body in a finite element simulation manner, so as to obtain a simulated structural parameter of the simulated spatial structural body corresponding to the simulated planar structural body after the simulated planar structural body is installed on the curved substrate. Therefore, the simulation structure parameters can be determined through simulation, and the process of verifying the assembly of the simulation plane structural body to form the simulation space structural body can be simplified. It is understood that the implementation of the buckling assembly simulation may also be provided by those skilled in the art, and the present disclosure is not limited thereto.
In step S303, a relative error between the simulated structural parameter and the target structural parameter is calculated.
The target structure parameters may include one or more parameters, such as the height of different parts of the three-dimensional micro-nano device relative to the curved substrate, the relative thickness or relative width of different parts, physical and/or chemical performance parameters of the three-dimensional micro-nano device after an external field acts under actual application conditions, and the like. The calculated relative error may include a relative error between the simulated structure parameter and each corresponding target structure parameter, for example, a relative error of a spatial coordinate between a target spatial structure of the three-dimensional micro-nano device and the simulated spatial structure.
In step S304, if it is determined that the relative error between the simulated structural parameter and the target structural parameter is greater than the error threshold, step S305 is performed. If the relative error between the simulated structural parameter and the target structural parameter is less than or equal to the error threshold, step S306 is executed.
The error threshold may be set corresponding to different parameters according to different parameters in the target structure parameter. The relative error is less than or equal to the error threshold, which may mean that the relative error corresponding to each simulation structure parameter is less than or equal to the corresponding error threshold; otherwise, the relative error is larger than the error threshold value. Or the relative error is less than or equal to the error threshold, which may mean that the relative error corresponding to at least a specified number of parameters in the simulation structure parameters is less than or equal to the corresponding error threshold; otherwise, the relative error is larger than the error threshold value. The relative error is greater than the error threshold and the relative error is less than or equal to the error threshold, which can be set by those skilled in the art according to practical needs, and the disclosure does not limit this.
In step S305, a first parameter of the simulated planar structure is adjusted according to the relative error, and step S302 is executed after the first parameter is adjusted.
The first parameter of the simulated planar structure can be adjusted according to the relative error between the simulated structural parameter and the target structural parameter, so that the simulated structural parameter of the simulated spatial structure corresponding to the simulated planar structure after being assembled on the curved substrate can be adjusted, and the relative error between the simulated structural parameter and the target structural parameter can be reduced.
In step S306, a first parameter of the current simulated planar structure is determined as a first parameter of a two-dimensional precursor of the three-dimensional micro-nano structure to be manufactured, and the two-dimensional precursor is manufactured according to the first parameter of the current simulated planar structure.
In this implementation manner, according to the first parameter of the current simulated planar structure, one or more of the techniques such as 3D printing, laser cutting, lithography micro-nano processing, etc. may be adopted to manufacture the two-dimensional precursor, which is not limited by the present disclosure.
In step S13, a portion to be fixed of the two-dimensional precursor is fixed onto the curved-surface-stretched substrate.
In one possible implementation, step S13 may include: and fixing the part to be fixed of the two-dimensional precursor on the curved-surface substrate after unfolding in a sticking mode. And the part to be fixed is determined according to the target space structure of the three-dimensional micro-nano device.
In the implementation mode, the part to be fixed in the two-dimensional precursor can be set according to the target space structure of the three-dimensional micro-nano device, so that the two-dimensional precursor can be fixed on the post-expansion curved substrate, and the part to be fixed does not influence the deformation of the two-dimensional precursor into the three-dimensional micro-nano device in the process of releasing the prestress.
In step S14, releasing the pre-stress loaded on the curved substrate after the unfolding so that the two-dimensional precursor is deformed into a three-dimensional micro-nano device in the process of releasing the pre-stress, thereby obtaining the curved substrate before the pre-stress is loaded and the three-dimensional micro-nano device fixedly assembled on the curved substrate.
Fig. 4A to 4D are schematic diagrams illustrating a process of manufacturing a three-dimensional micro-nano device in a method for manufacturing a three-dimensional micro-nano device based on a curved substrate according to an embodiment of the disclosure.
For example, as shown in fig. 4A, the curved substrate M is a hemispherical convex curved substrate, and the ends of the two-dimensional precursors including the first precursor Q1 and the second precursor Q2, and the first precursor Q1 and the second precursor Q2 are set as the portions Z to be fixed. Then the substrate M' with the semi-spherical convex curved surface is obtained after the biaxial stretching loading is applied to the substrate M with the semi-spherical convex curved surface. And then the first precursor Q1 and the second precursor Q2 are respectively fixed on the semi-spherical convex curved substrate M 'after the expansion, and the part Z to be fixed is fixedly pasted on the semi-spherical convex curved substrate M' after the expansion in a pasting mode. Finally, the prestress of the semi-spherical convex curved substrate M' after the stretching is released is rebounded to form the semi-spherical convex curved substrate M, and the first precursor Q1 and the second precursor Q2 protrude upwards in the process of releasing the prestress to form the three-dimensional micro-nano device S.
As shown in fig. 4B, the curved substrate M is a cylindrical curved substrate, and the end of the two-dimensional precursor Q is set as the portion to be fixed Z. And then, applying uniaxial tension loading to the cylindrical curved surface substrate M to obtain the post-expansion cylindrical curved surface substrate. And then fixing the two-dimensional precursor Q on the curved substrate of the post-extension column, and fixedly sticking the part to be fixed Z on the curved substrate of the post-extension column in a sticking mode. And finally, the prestress of the expanded column curved surface substrate is released to rebound to form a column curved surface substrate M, and the two-dimensional precursor Q protrudes upwards in the prestress releasing process to form the three-dimensional micro-nano device S.
As shown in fig. 4C, the curved substrate M is a twisted curved substrate, and the end of the two-dimensional precursor Q is set as a portion to be fixed Z. And applying tension-torsion coupling loading to the torsional curved surface substrate M to obtain the unfolded torsional curved surface substrate. And then fixing the two-dimensional precursor Q on the unfolded torsional curved surface substrate, and fixing and pasting the part Z to be fixed on the unfolded torsional curved surface substrate in a pasting mode. And finally, the prestress of the unfolded torsional curved surface substrate is released to be rebounded to a torsional curved surface substrate M, and the two-dimensional precursor Q protrudes upwards in the process of releasing the prestress to form the three-dimensional micro-nano device S.
As shown in fig. 4D, the curved substrate M is a spiral curved substrate, and the end portions and the middle portion of the two-dimensional precursor Q, which is similar to a serpentine shape, are provided with the portions to be fixed Z. And then applying uniaxial tension loading to the spiral curved surface substrate M to obtain the stretched spiral curved surface substrate. And then fixing the two-dimensional precursor Q on the unfolded spiral curved substrate, and fixedly adhering the part to be fixed Z on the unfolded spiral curved substrate in an adhering mode. And finally, the prestress of the expanded spiral curved substrate is released to be rebounded to form a spiral curved substrate M, and the two-dimensional precursor Q protrudes upwards in the prestress releasing process to form the three-dimensional micro-nano device S.
It can be understood that, with reference to the examples of the curved surface substrate and the three-dimensional micro-nano device shown in fig. 4A to 4D, a person skilled in the art can set the curved surface substrate and the three-dimensional micro-nano device according to actual needs to meet the structural setting requirements of the curved surface substrate and the three-dimensional micro-nano device in different use scenes.
In a possible implementation manner, the target space structure of the three-dimensional micro-nano device may include one or more of the following combinations: strip structure, film structure, laminated structure, paper-cut structure, paper-folded structure. The three-dimensional structure of the three-dimensional micro-nano device can be set by a person skilled in the art according to actual needs, and the disclosure does not limit the three-dimensional structure.
In one possible implementation manner, the material of the three-dimensional micro-nano device may be a semiconductor material such as silicon (Si), Indium Tin Oxide (ITO), and the like; metal conductive materials such as copper, gold, and titanium; dielectric materials such as Polyimide (PI) and polyethylene terephthalate (PET); graphene, molybdenum disulfide (MoS)2) Etc. of two-dimensional material. Therefore, the three-dimensional micro-nano device is convenient to combine with other two-dimensional functional materials.
In this embodiment, the manufactured three-dimensional micro-nano device can be used as an independent device capable of independent operation. The manufactured three-dimensional micro-nano device can also be a part of a device capable of working independently, and the three-dimensional micro-nano device is combined with other parts to form a complete independent device and has corresponding functions. The size of the three-dimensional micro-nano device can be 1 micron to 1 meter, so that the size of the three-dimensional micro-nano device spans the range from meter to micron, and the three-dimensional micro-nano device has a wider application range.
In one possible implementation, the method may further include: after the step S14, the curved substrate and the three-dimensional micro-nano device fixedly assembled on the curved substrate are mounted on a target object.
It should be noted that, although the method for manufacturing a three-dimensional micro-nano device based on a curved substrate is described above by taking the above embodiments as examples, a person skilled in the art can understand that the disclosure should not be limited thereto. In fact, the user can flexibly set each step according to personal preference and/or actual application scene, as long as the technical scheme of the disclosure is met.
Having described embodiments of the present disclosure, the foregoing description is intended to be exemplary, not exhaustive, and not limited to the disclosed embodiments. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is chosen in order to best explain the principles of the embodiments, the practical application, or improvements made to the technology in the marketplace, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein.
Claims (9)
1. A method for manufacturing a three-dimensional micro-nano device based on a curved substrate is characterized by comprising the following steps:
carrying out prestress loading on the curved surface substrate according to a prestress loading strategy corresponding to the curved surface substrate to obtain an expanded curved surface substrate;
transferring a two-dimensional precursor to the stretched curved surface substrate, wherein the two-dimensional precursor is manufactured according to a three-dimensional micro-nano device with a target space structure to be manufactured;
fixing the part to be fixed of the two-dimensional precursor to the curved surface substrate after unfolding;
releasing the prestress loaded on the curved surface substrate after the unfolding so that the two-dimensional precursor is deformed into a three-dimensional micro-nano device in the prestress releasing process, and obtaining the curved surface substrate and the three-dimensional micro-nano device fixedly assembled on the curved surface substrate.
2. The method of claim 1, further comprising:
based on the three-dimensional structure of the target object, a curved substrate capable of being mounted in a matched manner on the target object is manufactured.
3. The method according to claim 1 or 2, characterized in that the method further comprises:
determining a prestress loading strategy aiming at the curved substrate based on the three-dimensional micro-nano device and/or the structure of the curved substrate;
wherein the prestress loading strategy comprises any one of: uniaxial tension loading, biaxial tension loading, triaxial tension loading, multiaxial tension loading, tension-torsion coupling tension loading and stretch-bending coupling tension loading.
4. The method of claim 1, wherein the curved surface of the curved substrate comprises a combination of one or more of: a first-stage serpentine curved surface, a fractal serpentine curved surface, a hemispherical convex curved surface, a hemispherical concave curved surface, a multistage hemispherical convex curved surface, a multistage hemispherical concave curved surface, a bionic curved surface corresponding to a bionic object, a hyperboloid, a cylindrical surface, a three-way pipe curved surface, a torsion curved surface, a spiral curved surface, and an Archimedes spiral tubular curved surface;
wherein the bionic object comprises any one of the following: heart, skull, face, blood vessels.
5. The method of claim 1, further comprising:
determining a first parameter of a simulated planar structure corresponding to the three-dimensional micro-nano device according to a target structure parameter of a target space structure of the three-dimensional micro-nano device;
performing buckling assembly simulation on the simulated planar structural body based on the first parameters to obtain simulated structural parameters of a simulated space structural body corresponding to the simulated planar structural body after the simulated planar structural body is assembled on the curved substrate;
if the relative error between the simulated structure parameter and the target structure parameter is greater than an error threshold, adjusting the first parameter according to the relative error, and continuing to perform buckling assembly simulation based on the adjusted first parameter; or
And if the relative error between the simulated structure parameter and the target structure parameter is less than or equal to an error threshold value, manufacturing the two-dimensional precursor according to the first parameter of the current simulated planar structure.
6. The method according to claim 5, wherein performing a buckling assembly simulation on the simulated planar structure based on the first parameter to obtain simulated structural parameters of a simulated space structure corresponding to the simulated planar structure after the simulated planar structure is assembled on the curved substrate comprises:
and performing buckling assembly simulation on the simulated planar structural body in a finite element simulation mode based on the first parameter to obtain the simulated structural parameters of the simulated spatial structural body corresponding to the simulated planar structural body assembled on the curved substrate.
7. The method of claim 1, wherein fixing the portion of the two-dimensional precursor to be fixed to the post-expansion curved substrate comprises:
fixing the part to be fixed of the two-dimensional precursor on the curved surface substrate after unfolding in a sticking mode;
and the part to be fixed is determined according to the target space structure of the three-dimensional micro-nano device.
8. The method according to claim 1, wherein the target space structure of the three-dimensional micro-nano device comprises one or more of the following combinations:
strip structure, film structure, laminated structure, paper-cut structure, paper-folded structure.
9. The method of claim 1, further comprising:
and installing the curved surface substrate and the three-dimensional micro-nano device fixedly assembled on the curved surface substrate on a target object.
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