CN114678349A - Electronic device - Google Patents

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Publication number
CN114678349A
CN114678349A CN202111062712.2A CN202111062712A CN114678349A CN 114678349 A CN114678349 A CN 114678349A CN 202111062712 A CN202111062712 A CN 202111062712A CN 114678349 A CN114678349 A CN 114678349A
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CN
China
Prior art keywords
pixel
test switch
switch element
light emitting
test
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Pending
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CN202111062712.2A
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Chinese (zh)
Inventor
林俊贤
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Innolux Corp
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Innolux Display Corp
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Application filed by Innolux Display Corp filed Critical Innolux Display Corp
Priority to EP21210109.1A priority Critical patent/EP4020439B1/en
Priority to US17/534,473 priority patent/US20220209083A1/en
Publication of CN114678349A publication Critical patent/CN114678349A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • G01R31/2607Circuits therefor
    • G01R31/2632Circuits therefor for testing diodes
    • G01R31/2635Testing light-emitting diodes, laser diodes or photodiodes

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

The invention provides an electronic device which comprises a substrate, an electronic unit, a data line, a control unit, a test pad and a test switch element. The substrate comprises a first surface and a second surface opposite to the first surface, wherein the first surface comprises an active region. The electronic unit is arranged on the substrate and is positioned in the active area. The data line is disposed on the substrate. The control unit is arranged on the substrate and positioned in the active area, and the control unit is electrically connected between the electronic unit and the data line. The test pad is disposed on the second surface of the substrate. The test switch element is arranged on the substrate and located in the active area, and the test switch element is electrically connected between the data line and the test pad.

Description

Electronic device
Technical Field
The present invention relates to an electronic device, and more particularly, to an electronic device having a test switch element.
Background
In the manufacturing process of the light emitting device, a test element is usually used to test whether a light emitting element (e.g., a light emitting diode) on the light emitting device is damaged, so as to replace an inoperable light emitting element. In a conventional light emitting device, the test element is disposed in a peripheral region or a non-display region of the light emitting device. However, the test element disposed in the non-display area of the light emitting device may cause the screen occupation ratio of the device to be reduced, thereby affecting the display effect of the light emitting device. Therefore, how to improve the configuration of the test elements of the light emitting device remains an important issue for the art.
Disclosure of Invention
In some embodiments, the invention provides an electronic device. The electronic device comprises a substrate, an electronic unit, a data line, a control unit, a test pad and a test switch element. The substrate comprises a first surface and a second surface opposite to the first surface, wherein the first surface comprises an active region. The electronic unit is arranged on the substrate and is positioned in the active area. The data line is disposed on the substrate. The control unit is arranged on the substrate and positioned in the active area, and the control unit is electrically connected between the electronic unit and the data line. The test pad is disposed on the second surface of the substrate. The test switch element is arranged on the substrate and positioned in the active area, and the test switch element is electrically connected between the data line and the test pad.
Drawings
Fig. 1 is a schematic top view of an electronic device according to a first embodiment of the invention.
Fig. 2 is a bottom view of an electronic device according to a first embodiment of the invention.
Fig. 3 to 4 are schematic configuration diagrams of a test switch element of an electronic device according to a first embodiment of the invention.
Fig. 5 is a circuit diagram of an electronic device according to a first embodiment of the invention.
Fig. 6 to 7 are schematic configuration diagrams of a test switch element of an electronic device according to a second embodiment of the invention.
Fig. 8 is a circuit diagram of an electronic device according to a second embodiment of the invention.
FIG. 9 is a functional block diagram of an electronic device according to a third embodiment of the invention.
Fig. 10 is a circuit diagram of an electronic device according to a third embodiment of the invention.
Description of reference numerals: 100-a light emitting device; BA1, BA 2-junction area; a BP-bond pad; CP-capacitive element; CU, CU1, CU2, CU 3-control unit; DA-active region; DE. A DR-drain; DL, DL1, DL2, DL 3-data lines; DR 1-first direction; DR 2-second direction; DRU-drive unit; ED-electronic device; EU-electronic unit; FS — a first surface; GE. GA-gate; an LEU-light emitting unit; LEU 1-first light emitting unit; LEU 2-a second light emitting unit; LEU 3-a third light emitting unit; a PA-array; PC-pixel column; PC 1-first pixel column; PC 2-second pixel column; PC 3-third pixel column; PE-antistatic elements; PL-power supply line; PR-rows of pixels; PR1 — first pixel row; PR2 — second pixel row; PR 3-third pixel row; PU, PU1, PU2, PU3, PU4, PU5, PU6, PU7, PU8, PU 9-pixel regions; RS — second surface; SB-substrate; SE, SO-source; SL-scan lines; SPU 1-the first subpixel area; SPU 2-second subpixel area; SPU 3-the third subpixel area; SS-side; an SW-switch control unit; TL, Q1, QV, Q2, Q3-test signal line; TP-test pad; TU, TU1, TU2, TU 3-test switch element; TUa-a first test switch element; TUb-second test switch element; TUc-third test switch element.
Detailed Description
The present invention may be understood by reference to the following detailed description taken in conjunction with the accompanying drawings, it being noted that, for the sake of clarity and simplicity of the drawing, the various drawings in the present invention depict only some of the electronic devices and are not necessarily drawn to scale. In addition, the number and size of the elements in the drawings are merely illustrative and are not intended to limit the scope of the present invention.
Certain terms are used throughout the description and following claims to refer to particular elements. Those skilled in the art will appreciate that electronic device manufacturers may refer to the same components by different names. This document does not intend to distinguish between components that differ in function but not name.
In the following description and claims, the terms "including" and "comprising" are used in an open-ended fashion, and thus should be interpreted to mean "including, but not limited to …".
It will be understood that when an element or layer is referred to as being "disposed on" or "connected to" another element or layer, it can be directly on or directly connected to the other element or layer or intervening elements or layers may be present (not directly). In contrast, when an element is referred to as being "directly on" or "directly connected to" another element or layer, there are no intervening elements or layers present therebetween. When a component or layer is referred to as being "electrically connected" to another component or layer, it can be read as being directly or indirectly electrically connected.
The terms "about", "equal" or "identical", substantially "or" substantially "are generally construed to be within plus or minus 20% of a given value, or to be within plus or minus 10%, plus or minus 5%, plus or minus 3%, plus or minus 2%, plus or minus 1%, or plus or minus 0.5% of a given value.
Although the terms "first," "second," and "third" … may be used to describe various components, the components are not limited by this term. This term is used only to distinguish a single component from other components within the specification. The same terms may not be used in the claims, but instead first, second, and third … may be substituted for the elements in the claims in the order in which they are presented. Therefore, in the following description, a first constituent element may be a second constituent element in the claims.
It is to be understood that the embodiments described below may be implemented in various other embodiments, and that various changes, substitutions, and alterations may be made herein without departing from the spirit and scope of the invention.
Referring to fig. 1 and fig. 2, fig. 1 is a schematic top view of an electronic device according to a first embodiment of the invention, and fig. 2 is a schematic bottom view of the electronic device according to the first embodiment of the invention. According to the present invention, the electronic device ED shown in fig. 1 and fig. 2 may include, for example, a light emitting device 100, and may display a static or dynamic image or picture according to the user's requirement and operation, but not limited thereto. The electronic device ED of the present invention can be applied to, but not limited to, a notebook computer, a public display, a tiled display, a vehicle display, a touch display, a television, a monitor, a smart phone, a tablet computer, a light source module, a lighting device, or an electronic device applied to the above products. According to some embodiments, the electronic device ED may comprise a non-light emitting device. According to some embodiments, the electronic device ED may be a light emitting device, a display device, a sensing device, a splicing device or an antenna device, but is not limited thereto.
According to the present embodiment, as shown in fig. 1 and fig. 2, the electronic device ED may include a substrate SB, an electronic unit EU, a control unit CU, a data line DL, a test pad TP, and a test switch unit TU, but not limited thereto. The substrate SB may include a first surface FS and a second surface RS, wherein the first surface FS of the substrate SB may include an active region DA, and the second surface RS may be another surface of the substrate SB opposite to the first surface FS. The electronic unit EU may be disposed on the first surface FS of the substrate SB and located in the active region DA. The data line DL may be disposed on the first surface FS of the substrate SB. The control unit CU may be disposed on the first surface FS of the substrate SB, and may be located within the active area DA of the substrate SB.
As shown in fig. 1, the control unit CU can be electrically connected between the electronic unit EU and the data line DL, that is, the electronic unit EU can be electrically connected to the data line DL through the control unit CU. The test pad TP may be disposed on the second surface RS of the substrate SB. According to the embodiment, the test switch unit TU of the electronic device ED may be disposed on the first surface FS of the substrate SB and located in the active area DA. In addition, as shown in fig. 1, the test switch unit TU can be electrically connected between the data line DL and the test pad TP. That is, the electronic unit EU can be electrically connected to the test pad TP through the data line DL and the test switch element TU. The components and/or layers included in the electronic device ED will be described in detail below, and it should be noted that the components and/or wires included in the electronic device ED of the present embodiment are not limited to the above, and any suitable components and/or wires may be included according to the design requirements of the electronic device ED.
As shown in fig. 1, the electronic device ED of the present embodiment can be, for example, a light emitting device 100, and the electronic unit EU can be, for example, a light emitting unit LEU, but not limited thereto. For convenience of illustration, the electronic device ED is taken as the light emitting device 100, and the electronic unit EU is taken as the light emitting unit LEU for illustration, but the invention is not limited thereto. According to the embodiment, the electronic units EU are disposed on the first surface FS of the substrate SB and located in the active area DA. In the case that the electronic unit EU is a light emitting unit LEU, the active region DA may be, for example, a display region, wherein the display region may be a light emitting region of the light emitting device 100 or a region displaying a picture. That is, a plurality of light emitting units LEU may be disposed within the display region for displaying a picture. In some embodiments, as shown in fig. 1, an area surrounded by the connection lines of the outermost light-emitting units LEU among the plurality of light-emitting units LEU may be defined as an active area DA. In some embodiments, all the light emitting units LEU on the substrate may be lit, and an area surrounded by the connection lines of the light emitting regions at the edge may be defined as the active region DA. In some embodiments, an area surrounded by the connection lines of the control units CU at the outermost edges may be defined as an active area DA. The shape of the active region DA shown in fig. 1 is merely an example, and the present invention is not limited thereto. In some embodiments, the active region DA may have any suitable shape.
In some embodiments, the electronic device ED may be a non-light emitting device. In this case, the electronic device ED may include a plurality of electronic units EU, wherein the electronic units EU may be non-light emitting units, and the first surface FS of the substrate SB may include the active region DA. As shown in fig. 1, an area surrounded by the connections of the outermost electronic units EU among the plurality of electronic units EU is defined as an active area DA. In some embodiments, an area surrounded by the connection lines of the control units CU at the edge may be defined as an active area DA. The shape of the active region DA shown in fig. 1 is merely an example, and the present invention is not limited thereto. In some embodiments, the active region DA may have any suitable shape.
The substrate SB of the present embodiment may include, but is not limited to, a rigid substrate, a flexible substrate, or a combination thereof. The material of the rigid substrate may for example comprise glass, ceramic, quartz, sapphire or a combination of the above materials. The material of the flexible substrate may, for example, comprise Polyimide (PI), Polycarbonate (PC), polyethylene terephthalate (PET), other suitable materials, or a combination thereof. It should be noted that, although the substrate SB shown in fig. 1 and fig. 2 is a single-layer structure, the present embodiment is not limited thereto. In some embodiments, the substrate SB may include a multi-layer structure, such as a stacked structure formed by organic layers/inorganic layers/organic layers, but not limited thereto.
The light emitting unit LEU may include, for example, any suitable self-light emitting element or non-self-light emitting element, but is not limited thereto. The self-light emitting element may include, for example, an Organic Light Emitting Diode (OLED), a quantum dot diode (QLED), an inorganic Light Emitting Diode (LED), any other suitable light emitting element, or a combination thereof. The inorganic light emitting diode may include, for example, a sub-millimeter light emitting diode (mini LED) or a micro light emitting diode (micro LED), but is not limited thereto. In one embodiment, the chip size of the light emitting diode is about 300 micrometers (μm) to 10 millimeters (mm), the chip size of the sub-millimeter light emitting diode (mini LED) is about 100 micrometers to 300 micrometers, and the chip size of the micro light emitting diode (micro LED) is about 1 micrometer to 100 micrometers, but not limited thereto. The non-self-luminous element may include, for example, a liquid crystal cell, but is not limited thereto. In the present embodiment, the light emitting unit LEU of the light emitting device 100 may include, for example, light emitting elements that emit light of a plurality of colors. As shown in fig. 1, the electronic unit EU of the electronic device ED may be a light emitting unit LEU, wherein the light emitting unit LEU may include a plurality of first light emitting units LEU1, a plurality of second light emitting units LEU2, and a plurality of third light emitting units LEU3, wherein the first light emitting units LEU1, the second light emitting units LEU2, and the third light emitting units LEU3 may respectively extend along a first direction DR1 parallel to the surface (e.g., the first surface FS) of the substrate SB and be disposed on the substrate SB, but not limited thereto. According to the present embodiment, the first light emitting unit LEU1, the second light emitting unit LEU2, and the third light emitting unit LEU3 may emit red, green, and blue light, respectively, and may mix white light, but not limited thereto. In some embodiments, the light-emitting device 100 may include a light-emitting unit LEU that emits a single color light. The features of the light-emitting unit LEU in the following embodiments can refer to the contents of this embodiment, and thus are not described again.
As shown in fig. 1, the light emitting device 100 may include a plurality of data lines DL, which may extend in a first direction DR 1. The light emitting device 100 may further include a plurality of scan lines SL (shown in fig. 5) disposed on the substrate SB to be staggered with the data lines DL. The scan line SL may extend along a second direction DR2, and the first direction DR1 and the second direction DR2 may be different, for example, vertical, but not limited thereto. The material of the data lines DL and the scan lines SL may include any suitable conductive material. According to the present embodiment, as shown in fig. 1, the extending direction DR1 of the data line DL may be substantially parallel to the extending direction of the first light emitting unit LEU1, the second light emitting unit LEU2 and/or the third light emitting unit LEU3, i.e., the first direction DR 1. In the present embodiment, the light emitting cells LEU located in the same column (column) in the first direction DR1 may be electrically connected to the same data line DL. For example, as shown in fig. 1, in the first direction DR1, the first light emitting units LEU1 in the same column may be all electrically connected to the data line DL 1; the second light-emitting units LEU2 in the same column may all be electrically connected to the data line DL 2; the third light emitting units LEU3 in the same row may all be electrically connected to the data line DL3, but not limited thereto. In addition, in the present embodiment, the light emitting cells LEU located in the same row (row) in the second direction DR2 may be electrically connected to the same scan line SL (as shown in fig. 5), but not limited thereto. It should be noted that the number and arrangement of the light emitting units LEU and the data lines DL shown in fig. 1 are only exemplary, and the present invention is not limited thereto.
As shown in fig. 5, in detail, the control unit CU may include, for example, a thin film transistor element, and includes a gate electrode GE, a source electrode SE, and a drain electrode DE. The light emitting apparatus 100 may include a plurality of control units CU. According to the present embodiment, a control unit CU in the light emitting device 100 may be electrically connected between a light emitting unit LEU and a data line DL, for example, to control the light emission of the light emitting unit LEU. For example, the source electrode SE of the control unit CU may be electrically connected to the data line DL, the drain electrode DE of the control unit CU may be electrically connected to the light emitting unit LEU, and the gate electrode GE of the control unit CU may be electrically connected to the scan line SL. When the scan line SL transmits a switching signal to the control unit CU and turns on the control unit CU, the data line DL may transmit a luminance signal to the light emitting unit LEU through the control unit CU, thereby controlling light emission of the light emitting unit LEU, but not limited thereto. As shown in fig. 1, the data line DL1 may be electrically connected to all the first light emitting units LEU1 located in the same column in the first direction DR1, so that the luminance signal of the column of the first light emitting units LEU1 may be transmitted through the data line DL1, but not limited thereto. In addition, the light emitting device 100 of the present embodiment may further include a power line PL for electrically connecting a voltage source (not shown) to the light emitting unit LEU to provide a voltage or a current, but not limited thereto.
As shown in fig. 1 and 2, according to the present embodiment, the data lines DL and the power lines PL of the light emitting device 100 may extend from the first surface FS of the substrate SB to the edge of the substrate SB, via the side SS of the substrate SB to the second surface RS of the substrate SB. The data line DL and the power line PL may be electrically connected to the corresponding bonding pad BP at the second surface RS of the substrate SB, wherein the position of the bonding pad BP may substantially define the bonding area BA1 of the light emitting device 100, or the position of the bonding area BA1 may substantially overlap the position of the bonding pad BP. In the present embodiment, the bonding area BA1 may be an area where any suitable external electronic element is bonded to the light emitting device 100. That is, external electronic components (not shown) may be disposed on the second surface RS of the substrate SB of the light emitting device 100. For example, the external electronic component may include a brightness control chip electrically connected to the data line DL for providing the brightness signal, but not limited thereto. In some embodiments, although not shown in fig. 1, the bonding pads BP of the second surface RS of the light emitting device 100 may be electrically connected to the scan lines SL, and the external electronic device may include a gate switch control chip electrically connected to the scan lines SL to provide the switching signals. In some embodiments, the external electronic components may include other electronic components suitable for use in the light-emitting device 100.
Referring to fig. 3 to 5, fig. 3 to 4 are schematic configuration diagrams of a test switch element of an electronic device according to a first embodiment of the invention, and fig. 5 is a schematic circuit diagram of the electronic device according to the first embodiment of the invention. In fig. 3 and 4, elements such as signal lines (data lines DL, scan lines SL), test signal lines TL, and the like are omitted to simplify the drawings. As shown in fig. 3, the light emitting device 100 may be divided into a plurality of pixel areas PU, which may be an array PA arranged along a first direction DR1 and arranged along a second direction DR 2.
The light emitting device 100 may include a plurality of light emitting units LEU, a plurality of control units CU, and a plurality of test switching elements TU. According to some embodiments, at least one light emitting unit LEU, at least one control unit CU, and at least one test switch element TU are disposed in one pixel area PU, and the connection relationship therebetween is as described above and will not be described herein again. The pixel areas PU may include a plurality of pixel rows (columns) PC arranged along the first direction DR1, such as a first pixel row PC1, a second pixel row PC2, and a third pixel row PC3 arranged along the first direction DR1, but not limited thereto. The first pixel column PC1 may include a pixel region PU1, a pixel region PU2, and a pixel region PU3, the second pixel column PC2 may include a pixel region PU4, a pixel region PU5, and a pixel region PU6, and the third pixel column PC3 may include a pixel region PU7, a pixel region PU8, and a pixel region PU 9. According to the present embodiment, in each pixel column PC, at least one test switching element TU may be provided to test the light emitting units LEU of all the pixel regions PU in the pixel column PC. In detail, as shown in fig. 3, the test switch element TU may include a first test switch element TUa, a second test switch element TUb and a third test switch element TUc, wherein the first test switch element TUa may be disposed in the first pixel row PC1, the second test switch element TUb may be disposed in the second pixel row PC2, and the third test switch element TUc may be disposed in the third pixel row PC3, but not limited thereto. Accordingly, the first test switch element TUa may be used to test the light emitting units LEU of all the pixel areas PU in the first pixel column PC1, the second test switch element TUb may be used to test the light emitting units LEU of all the pixel areas PU in the second pixel column PC2, and the third test switch element TUc may be used to test the light emitting units LEU of all the pixel areas PU in the third pixel column PC 3.
In addition, as shown in fig. 3, the pixel region PU may include a plurality of pixel rows (row) PR arranged along the second direction DR2, for example, including a first pixel row PR1, a second pixel row PR2, and a third pixel row PR 3. The first pixel row PR1 includes, for example, a pixel region PU1, a pixel region PU4, a pixel region PU7 and pixel regions (not shown) to the right, the second pixel row PR2 includes, for example, a pixel region PU2, a pixel region PU5, a pixel region PU8 and pixel regions (not shown) to the right, and the third pixel row PR3 includes, for example, a pixel region PU3, a pixel region PU6, a pixel region PU9 and pixel regions (not shown) to the right. According to the present embodiment, the test switch units TU in different pixel columns PC may be disposed in different pixel rows PR. For example, as shown in fig. 3, a first test switch element TUa may be located within a first pixel row PR1, a second test switch element TUb may be located within the second pixel row PR2, and a third test switch element TUc may be located within the third pixel row PR3, but not limited thereto. Since the test switch devices TU in different pixel columns PC can be disposed in different pixel rows PR, the flexibility of disposing other devices of the light emitting device 100 can be increased, thereby improving the spatial configuration of the light emitting device 100. As shown in fig. 3, the first test switch element TUa may be disposed in the pixel area PU1, the second test switch element TUb may be disposed in the pixel area PU5, and the third test switch element TUc may be disposed in the pixel area PU9, but not limited thereto. According to some embodiments, the test switch devices TU may not overlap or be staggered with each other in the first direction DR1 and the second direction DR2, i.e., the space occupied by the test switch devices TU in the display area DA may be more dispersed, thereby increasing the flexibility of disposing other devices of the light emitting device 100 and further improving the spatial configuration of the light emitting device 100.
According to some embodiments, the first test switch element TUa and the second test switch element TUb may be disposed in different columns, for example, as shown in fig. 3, the first test switch element TUa may be disposed in the first pixel column PC1, and the second test switch element TUb may be disposed in the second pixel column PC 2. According to some embodiments, the first test switch element TUa and the second test switch element TUb may be disposed in different rows, for example, as shown in FIG. 3, the first test switch element TUa may be disposed in the first pixel row PR1, and the second test switch element TUb may be disposed in the second pixel row PR 2. According to some embodiments, the first test switch element TUa and the second test switch element TUb may be disposed within different pixel columns but within the same pixel row. According to some embodiments, the first test switch element TUa and the second test switch element TUb may be disposed within different pixel rows but within the same pixel column.
As shown in fig. 3, the plurality of pixel regions PU may include a first pixel row PR1 and a second pixel row PR2 arranged along the second direction DR 2. According to some embodiments, the first test switch element TUa and the second test switch element TUb may be disposed in different columns, for example, as shown in fig. 3, the first test switch element TUa may be disposed in the first pixel column PC1, and the second test switch element TUb may be disposed in the second pixel column PC 2. According to some embodiments, the first test switch element TUa and the second test switch element TUb may be disposed in different rows, for example, as shown in FIG. 3, the first test switch element TUa may be disposed in the first pixel row PR1, and the second test switch element TUb may be disposed in the second pixel row PR 2. According to some embodiments, the first test switch element TUa and the second test switch element TUb may be disposed within different pixel columns but within the same pixel row. According to some embodiments, the first test switch element TUa and the second test switch element TUb may be disposed within different pixel rows but within the same pixel column.
As shown in fig. 4, the light emitting device may be divided into a plurality of sub-pixel regions. One pixel region PU may include at least two sub-pixel regions. For example, the first pixel column PC1 may include a plurality of first sub-pixel regions SPU1 and a plurality of second sub-pixel regions SPU2 arranged along the first direction DR 1. In detail, according to some embodiments, the first pixel column PC1 may include a plurality of first sub-pixel regions SPU1, a plurality of second sub-pixel regions SPU2, and a plurality of third sub-pixel regions SPU3 arranged along the first direction DR 1. As shown in fig. 5, the at least one first light-emitting unit LEU1, the at least one control unit CU1 and the at least one test switch element TUa may be disposed in a first sub-pixel region SPU1, and the connection relationship therebetween is as described above and will not be described herein again. The first light-emitting unit LEU1 included in the first sub-pixel region SPU1 and the second light-emitting unit LEU2 included in the second sub-pixel region SPU2 may be the same color or different colors, which should not be construed as a limitation to the invention. According to some embodiments, the first light-emitting unit LEU1 included in the first sub-pixel region SPU1, the second light-emitting unit LEU2 included in the second sub-pixel region SPU2, and the third light-emitting unit LEU3 included in the third sub-pixel region SPU3 may be different colors, for example, red light, green light, and blue light, respectively, which is not limited in this disclosure. A first sub-pixel area SPU1, a second sub-pixel area SPU2 and a third sub-pixel area SPU3 may constitute one pixel area PU of the light-emitting device 100.
As shown in fig. 1, according to the present embodiment, the test switching element TU may be electrically connected to the data line DL, and electrically connected to the control unit CU and the light emitting unit LEU through the data line DL. Specifically, the test switch device TU of the present embodiment may include, for example, a thin film transistor device, and may include a gate GA, a source SO and a drain DR, wherein the drain DR of the test switch device TU may be electrically connected to the data line DL, and further electrically connected to the control unit CU and the light emitting unit LEU electrically connected to the data line DL, but is not limited thereto. In addition, the light emitting device 100 of the present embodiment may further include a plurality of test signal lines TL disposed on the substrate SB, wherein the gate GA and the source SO of the test switch element TU may be electrically connected to the corresponding test signal lines TL respectively. As shown in fig. 1 and 2, the test signal line TL electrically connected to the test switching element TU may extend from the first surface FS of the substrate SB to an edge of the substrate SB, through and along the side SS of the substrate SB, and down to the second surface RS of the substrate SB. The material of the test signal line TL can refer to the material of the data line DL and the scan line SL, and thus is not described again. In addition, as shown in fig. 2, in the present embodiment, the test signal lines TL may be each electrically connected to the corresponding test pad TP through the bonding pad BP at the second surface RS of the substrate SB. That is, the test signal line TL may be electrically connected between the test pad TP and the test switch unit TU. Therefore, the test pad TP may be electrically connected to the light emitting unit LEU through the test signal line TL, the test switching element TU, the data line DL, and the control unit CU, but is not limited thereto. Furthermore, as shown in fig. 2, the second surface RS of the substrate SB may further include a bonding region BA2 in addition to the bonding region BA1, wherein the position of the bonding region BA2 may substantially correspond to the position of the bonding pad BP between the test pad TP and the test signal line TL, so that the external electronic component disposed in the bonding region BA2 may be electrically connected to the bonding pad BP and the test signal line TL, but not limited thereto.
As shown in fig. 1, in the present embodiment, one test switching element TU may be electrically connected to one data line DL, thereby testing all the light emitting cells LEU electrically connected to the data line DL. In detail, as shown in fig. 1, the drain DR of the test switch device TU1 may be electrically connected to the data line DL1, the source SO of the test switch device TU1 may be electrically connected to the test signal line Q1, and the gate GA of the test switch device TU1 may be electrically connected to the test signal line QV. When testing the light emitting unit LEU, the test signal line QV may transmit a switching signal (e.g., a voltage signal or a current signal) to the gate GA of the test switch device TU1, thereby turning on the test switch device TU 1. At this time, a test signal may be transmitted through the test signal line Q1, wherein the test signal may be transmitted to all the first light emitting units LEU1 electrically connected to the data line DL1 through the test signal line Q1, the test switching element TU1, the data line DL1, and the control unit CU1, thereby testing all the first light emitting units LEU1 electrically connected to the data line DL 1. That is, the test signal transmitted by the test switch TU1 can replace the brightness signal transmitted by the data line DL1 during the test phase. When no test is performed, the test switching element TU1 may be turned off. Similarly, in the testing phase of the light emitting units LEU, the testing signal line QV can transmit a switching signal to the gate GA of the testing switch element TU2, and transmit a testing signal to all the second light emitting units LEU2 electrically connected to the data line DL2 through the testing signal line Q2, the testing switch element TU2, the data line DL2 and the control unit CU2, so as to test all the second light emitting units LEU2 electrically connected to the data line DL 2; the test signal line QV transmits a switching signal to the gate GA of the test switch device TU3, and transmits a test signal to all the third light emitting units LEU3 electrically connected to the data line DL3 through the test signal line Q3, the test switch device TU3, the data line DL3 and the control unit CU3, thereby testing all the third light emitting units LEU3 electrically connected to the data line DL 3. The switching signal and the test signal may be provided by, for example, an external electronic component, wherein the electronic component may be disposed in, for example, the bonding area BA2 shown in fig. 2 and electrically connected to the test signal line TL, but not limited thereto. In addition, the test pads TP disposed on the second surface RS of the substrate SB may perform a lighting (light on) test after the light emitting cells LEU are disposed on the substrate SB to confirm whether the light emitting cells LEU are damaged, thereby improving the yield of the light emitting device 100.
In a conventional light emitting device, a test element is generally disposed in a peripheral region of the light emitting device. However, such a configuration may result in excessive space in the peripheral area, thereby reducing the screen-to-screen ratio of the device. In contrast, since the test switch unit TU of the present invention can be disposed in the display area DA of the substrate SB, the space requirement of the peripheral area of the light emitting device 100 can be reduced. Moreover, since the elements (e.g., the light emitting unit LEU, the control unit CU and/or the test switch element TU) included in the light emitting device 100 can be disposed in the display area DA, and the external electronic elements, the signal lines, the test signal lines TL, etc. can extend to the second surface RS of the substrate SB, the light emitting device 100 can include no peripheral area or only a small portion of peripheral area, or the display area DA of the light emitting device 100 can substantially overlap the surface area of the substrate SB, so as to increase the screen occupation ratio of the light emitting device 100 and further improve the display effect of the light emitting device 100. It should be noted that the above-mentioned "the display area DA may substantially overlap the surface area of the substrate SB" may represent that the area of the display area DA is substantially the same as the area of the surface area of the substrate SB, but may include a difference caused by the manufacturing tolerance of the light-emitting device 100. In addition, when the conventional light emitting device is applied to a tiled display device, the testing element may be disposed in the peripheral region to be disadvantageous to the tiling, or the formed tiled display device may generate a gap feeling, thereby affecting the display. Alternatively, in order to reduce the gap feeling of the tiled display device, the conventional light-emitting device may be tiled after removing the peripheral region (including the test element). However, such a method may not be able to test the light emitting units in the subsequent processes, thereby affecting the yield of the tiled display device. In contrast, in the embodiment, the test switch unit TU can be disposed in the display area DA to reduce the space requirement of the peripheral area of the light emitting device 100, so that when the light emitting device 100 is applied to a tiled display device, the gap of the tiled display device can be reduced, and the user experience can be improved. In addition, after the light emitting devices 100 are tiled, the test switching elements TU disposed in the display area DA may also test the light emitting units LEU. As such, the yield of the tiled display device formed by the light emitting device 100 of the present invention can be improved.
It should be noted that fig. 1 only exemplarily shows a structure in which the test switch element TU is disposed in the display area DA, and the disposition position of the test switch element TU of the embodiment is not limited to that shown in fig. 1. The arrangement position of the test switch element TU in the display area DA of the present embodiment will be described in detail below.
It should be noted that the number of the test switch units TU included in each pixel column PC in the present embodiment can be adjusted according to the design of the pixel area PU, and is not limited to the one shown in fig. 3. For example, as shown in fig. 4, when the pixel area PU includes the first sub-pixel area SPU1, the second sub-pixel area SPU2, and the third sub-pixel area SPU3 described above, each pixel column PC may include a plurality of first sub-pixel areas SPU1, a plurality of second sub-pixel areas SPU2, and a plurality of third sub-pixel areas SPU3 respectively arranged along the first direction DR 1. In this case, each pixel column PC may include, for example, three test switch elements TU respectively located in one of the first sub-pixel areas SPU1, one of the second sub-pixel areas SPU2, and one of the third sub-pixel areas SPU3 of the pixel column PC. Taking the first pixel column PC1 as an example, the first pixel column PC1 may include three test switch elements TU respectively located in the first sub-pixel area SPU1, the second sub-pixel area SPU2 and the third sub-pixel area SPU3 of the pixel area PU1, but not limited thereto. According to the present embodiment, the test switching element TU provided in the first sub-pixel area SPU1 of the pixel area PU1 may be electrically connected to all of the first sub-pixel areas SPU1 in the first pixel column PC1 and used to test the first light-emitting units LEU1 in the plurality of first sub-pixel areas SPU 1. Similarly, the test switch element TU provided in the second sub-pixel area SPU2 of the pixel area PU1 may be used to test the second light-emitting units LEU2 of all the second sub-pixel areas SPU2 in the first pixel column PC1, and the test switch element TU provided in the third sub-pixel area SPU3 of the pixel area PU1 may be used to test the third light-emitting units LEU3 of all the third sub-pixel areas SPU3 in the first pixel column PC 1.
Fig. 5 shows a circuit configuration diagram of the pixel area PU including the test switching element TU in the present embodiment. For example, fig. 5 may be a circuit structure diagram of the pixel area PU1 shown in fig. 4, but not limited thereto. As shown in fig. 5, pixel area PU1 may include therein a first sub-pixel area SPU1, a second sub-pixel area SPU2, and a third sub-pixel area SPU3, wherein first sub-pixel area SPU1 includes a first light-emitting unit LEU1 and a control unit CU1, second sub-pixel area SPU2 may include a second light-emitting unit LEU2 and a control unit CU2, and third sub-pixel area SPU3 may include a third light-emitting unit LEU3 and a control unit CU 3. In addition, the first light emitting unit LEU1 may be electrically connected to the data line DL1 through the control unit CU1, the second light emitting unit LEU2 may be electrically connected to the data line DL2 through the control unit CU2, and the third light emitting unit LEU3 may be electrically connected to the data line DL3 through the control unit CU 3. According to the present embodiment, as shown in fig. 5, the first sub-pixel region SPU1, the second sub-pixel region SPU2 and the third sub-pixel region SPU3 may further include a capacitive element CP, a driving unit DRU and a switch control unit SW, respectively, wherein the driving unit DRU and the switch control unit SW may be electrically connected between the light emitting unit LEU and the control unit CU, but not limited thereto. The capacitive element CP may be used to maintain the voltage of the light emitting unit LEU to ensure a normal display of the light emitting unit LEU. One end of the capacitor CP may be electrically connected to the gate of the driving unit DRU, and the other end of the capacitor CP may be electrically connected to the source of the driving unit DRU, but not limited thereto. A gate of the driving unit DRU may be electrically connected to the drain DE of the control unit CU, a source of the driving unit DRU may be electrically connected to a voltage source (e.g., power line PL), and a drain of the driving unit DRU may be electrically connected to a source of the switch control unit SW. When the control unit CU transmits the luminance signal to the gate of the driving unit DRU and turns on the driving unit DRU, the driving unit DRU may transmit a voltage signal or a current signal to the drain of the switch control unit SW. A gate of the switch control unit SW is electrically connected to the brightness control line EM, and a drain of the switch control unit SW is electrically connected to the light emitting unit LEU. The light emission of the light emitting unit LEU can be controlled by controlling the switch of the switch control unit SW through the luminance control line EM. It should be noted that the driving circuit in the light emitting device 100 of the present invention is not limited to the one shown in fig. 5, and may include any suitable driving circuit.
Referring to fig. 6 to 8, fig. 6 to 7 are schematic configuration diagrams of a test switch element of an electronic device according to a second embodiment of the invention, and fig. 8 is a schematic circuit diagram of the electronic device according to the second embodiment of the invention. In fig. 6 and 7, elements such as signal lines (data lines DL, scan lines SL), test signal lines TL, and the like are omitted to simplify the drawings. In addition, the features of the elements shown in fig. 6, 7 and 8 can be referred to the contents of fig. 3, 4 and 5, respectively, and thus are not repeated. As shown in fig. 7, the pixel area PU of the present embodiment may include a first sub-pixel area SPU1, a second sub-pixel area SPU2, and a third sub-pixel area SPU 3. In one pixel column PC, three test switching elements TU may be provided, which may be located in one of the first sub-pixel areas SPU1, one of the second sub-pixel areas SPU2, and one of the third sub-pixel areas SPU3 in the pixel column PC, respectively. According to the present embodiment, the three test switching elements TU in one pixel column PC may be respectively disposed in different pixel rows PR of the pixel column PC. For example, as shown in fig. 6 and 7, in the first pixel column PC1, the first test switch element TUa may be disposed in the first sub-pixel region SPU1, and the third test switch element TUc may be disposed in the second sub-pixel region SPU 2. In the second pixel column PC1, the second test switch element TUb may be disposed in the first pixel row PR 1. The first test switching element TUa may also be disposed in the first pixel row PR 1. The first test switch element TUa may be located in a first pixel row PR1, and the third test switch element TUc may be located in a second pixel row PR2 different from the first pixel row PR1, but not limited thereto.
As shown in fig. 7, in addition, in the first pixel column PC1, a test switching element TU may be further provided in the third sub-pixel region SPU3 and may be located in a third pixel row PR3 different from the first pixel row PR1 and the second pixel row PR 2. The method for disposing the test switch element TU in the second pixel column PC2 and the third pixel column PC3 is similar to that of the first pixel column PC1, and therefore, the description thereof is omitted. In some embodiments, the three test switch elements TU in the first pixel column PC1 (or the second pixel column PC2, the third pixel column PC3) may be respectively located in any three pixel regions PU of the first pixel column PC1 (or the second pixel column PC2, the third pixel column PC3), and are not limited to those shown in fig. 6 and 7.
In addition, according to the arrangement of the test switch elements TU of the present embodiment, the test switch elements TU in different pixel columns PC may be located in the same pixel row PR in the second direction DR 2. For example, as shown in fig. 6 and 7, the first test switch element TUa in the first sub-pixel region SPU1 in the first pixel column PC1 and the second test switch element TUb in the first sub-pixel region SPU1 in the second pixel column PC2 may be located in the first pixel row PR1, but not limited thereto.
According to some embodiments, as shown in fig. 7, the first pixel column PC1 includes a plurality of first sub-pixel areas SPU1 and a plurality of second sub-pixel areas SPU2 arranged along the first direction DR 1. The first test switching element TUa may be disposed in one of the plurality of first sub-pixel areas SPU1, and the third test switching element TUc may be disposed in one of the plurality of second sub-pixel areas SPU 2. According to some embodiments, the first test switch element TUa and the third test switch element TUc may be disposed in different pixel rows, for example, the first test switch element TUa may be disposed in the first pixel row PR1, and the third test switch element TUc may be disposed in the second pixel row PR 2. Furthermore, in the first pixel row PC1, the test switch unit TU may be disposed in the third pixel row PR 3. According to some embodiments, in the first pixel column PC1, the first light emitting unit may be disposed in the first sub-pixel region SPU1, the second light emitting unit may be disposed in the second sub-pixel region SPU2, the third light emitting unit may be disposed in the third sub-pixel region SPU3, and the first, second and third light emitting units may be different colors, such as, but not limited to, emitting red light, green light and blue light. According to some embodiments, the first, second and third light emitting units may, for example, emit the same light.
Fig. 8 shows circuit structures of the pixel region PU1, the pixel region PU2, and the pixel region PU3 in fig. 6 and 7. As shown in fig. 8, the test switch element TU (i.e., the first test switch element TUa) disposed in the first sub-pixel area SPU1 of the pixel area PU1 may be electrically connected to the first light-emitting units LEU1 of all the first sub-pixel areas SPU1 in the pixel column PC1 through the data line DL1, thereby testing the plurality of first light-emitting units LEU 1. Similarly, the test switch element TU (i.e., the third test switch element TUc) provided in the second sub-pixel region SPU2 of the pixel region PU2 may be electrically connected to the second light-emitting units LEU2 of all the second sub-pixel regions SPU2 in the pixel column PC1 through the data line DL2, thereby testing the plurality of second light-emitting units LEU 2; and the test switching element TU disposed in the third sub-pixel region SPU3 of the pixel region PU3 may be electrically connected to the third light emitting units LEU3 of all the third sub-pixel regions SPU3 in the pixel column PC1 through the data line DL3, thereby testing the plurality of third light emitting units LEU 3. It should be noted that although the pixel columns PC in the structures shown in fig. 6 to 8 have the same arrangement of the test switch elements TU, the invention is not limited thereto. In the present invention, different pixel columns PC may have different arrangements of the test switch elements TU. For example, in some embodiments, the test switch elements TU in the first pixel column PC1 may be arranged in the manner shown in fig. 6 to 8, and the test switch elements TU in the second pixel column PC2 may be arranged in the manner shown in fig. 3 to 5, but not limited thereto.
According to the embodiment, since the different test switch devices TU in the same pixel column PC may not be located in the same pixel row PR in the second direction DR2, the test switch devices TU may be disposed in the display area DA in a more dispersed manner, so as to increase the design flexibility thereof, and in addition, the influence of the test switch devices TU on the display effect of the light emitting apparatus 100 may be reduced. In addition, since different test switch elements TU in the same pixel row PC can be respectively disposed corresponding to the sub-pixel regions including the light emitting units LEU to be tested, the design of the test switch elements TU and the related wiring can be simplified, thereby simplifying the manufacturing process of the light emitting device 100.
Referring to fig. 9 and 10, fig. 9 is a functional block diagram of an electronic device according to a third embodiment of the invention, and fig. 10 is a circuit diagram of the electronic device according to the third embodiment of the invention. It should be noted that, although the test switch unit TU shown in fig. 9 is arranged in the same manner as the embodiment shown in fig. 6 to 8, the invention is not limited thereto. According to the present embodiment, the light emitting device 100 may further include an antistatic element PE disposed on the first surface FS of the substrate SB, in addition to the above elements. In detail, the anti-static device PE of the present embodiment may be disposed at the outermost edge of the display area DA. For example, the static electricity preventing device PE may be disposed outside the outermost pixel area PU. According to some embodiments, the anti-static device PE may surround all of the plurality of pixel areas PU and form a frame structure. According to some embodiments, the anti-static element PE and the display area DA may have a distance. In detail, the anti-static device PE may surround the test switch element TU in the pixel region PU. The anti-static device PE of the present embodiment may include any suitable type of electrostatic discharge (ESD) protection device, such as an ESD diode, but is not limited thereto. Fig. 10 shows one embodiment of an antistatic element ESD. It should be noted that fig. 10 only shows the anti-static element PE on one side of the display area DA for simplifying the drawing, but the invention is not limited thereto. As shown in fig. 10, a signal line (for example, but not limited to, a data line DL) and a test signal line TL of the light emitting device 100 may be electrically connected to an electrostatic discharge prevention element PE (ESD protection circuit). Therefore, the signal line and the test signal line TL can be protected by the anti-static device PE, and the probability of damage to the signal line and the test signal line TL due to electrostatic discharge is reduced. It should be noted that, although not shown in fig. 10, the scan lines SL of the light emitting device 100 may also be electrically connected to the anti-static device PE, so as to protect the scan lines SL through the anti-static device. According to some embodiments, the anti-static element PE may be disposed on the first surface FS of the substrate SB in an area outside the display area DA.
In summary, the present invention provides a light emitting device including a test switch element disposed in a display region. Accordingly, the space requirement of the light-emitting device on the peripheral area can be reduced, or the light-emitting device can not comprise the peripheral area, so that the screen occupation ratio of the light-emitting device is improved. In addition, the gap feeling of the spliced display device formed by the light-emitting device can be reduced, so that the user experience is improved. Furthermore, after the light-emitting device of the present invention is spliced, the light-emitting elements can be tested by the test switch elements disposed in the display area. Therefore, the yield of the tiled display device formed by the light-emitting device of the invention can be improved.
The above description is only an example of the present invention, and is not intended to limit the present invention, and it is obvious to those skilled in the art that various modifications and variations can be made in the present invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. An electronic device, comprising:
a substrate, the substrate comprising a first surface and a second surface opposite the first surface, wherein the first surface comprises an active region;
The electronic unit is arranged on the substrate and positioned in the active region;
the data line is arranged on the substrate;
the control unit is arranged on the substrate and positioned in the active area, and is electrically connected between the electronic unit and the data line;
a test pad disposed on the second surface of the substrate; and
the test switch element is arranged on the substrate and positioned in the active area, and the test switch element is electrically connected between the data line and the test pad.
2. The electronic device of claim 1, wherein the electronic device comprises:
a plurality of said test switch elements, said plurality of test switch elements including a first test switch element and a second test switch element;
the electronic device is divided into a plurality of pixel areas, and the pixel areas comprise a first pixel row and a second pixel row which are arranged along a first direction, wherein the first test switch element is arranged in the first pixel row, and the second test switch element is arranged in the second pixel row.
3. The electronic device of claim 2, wherein the plurality of pixel regions includes a first pixel row and a second pixel row arranged along a second direction, wherein the first direction and the second direction are different, the first test switch element is disposed within the first pixel row, and the second test switch element is disposed within the second pixel row.
4. The electronic device of claim 2, wherein the plurality of pixel regions includes a first row of pixels arranged along a second direction, wherein the first direction and the second direction are different, and wherein the first test switch element and the second test switch element are disposed within the first row of pixels.
5. The electronic device of claim 2, wherein the first pixel column includes a plurality of first sub-pixel regions and a plurality of second sub-pixel regions arranged along the first direction, and the plurality of test switch elements further includes a third test switch element, wherein the first test switch element is disposed in one of the plurality of first sub-pixel regions, and the third test switch element is disposed in one of the plurality of second sub-pixel regions.
6. The electronic device of claim 5, wherein the plurality of pixel regions includes a first pixel row and a second pixel row arranged along a second direction, wherein the first direction and the second direction are different, the first test switch element is disposed within the first pixel row, and the third test switch element is disposed within the second pixel row.
7. The electronic device according to claim 5, wherein the electronic device comprises a plurality of the electronic units, the plurality of electronic units comprising a first light-emitting unit and a second light-emitting unit, wherein the first light-emitting unit is located in one of the plurality of first sub-pixel regions, the second light-emitting unit is located in one of the plurality of second sub-pixel regions, and the first light-emitting unit and the second light-emitting unit are light-emitting units of different colors.
8. The electronic device according to claim 5, wherein the electronic device comprises a plurality of first electronic units respectively disposed in the plurality of first sub-pixel regions of the first pixel row, and the plurality of first electronic units are electrically connected to the first test switch element.
9. The electronic device of claim 1, further comprising a test signal line electrically connected between the test switch element and the test pad.
10. The electronic device of claim 1, wherein the electronic unit is a light emitting unit.
CN202111062712.2A 2020-12-24 2021-09-10 Electronic device Pending CN114678349A (en)

Priority Applications (2)

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EP21210109.1A EP4020439B1 (en) 2020-12-24 2021-11-24 Electronic device
US17/534,473 US20220209083A1 (en) 2020-12-24 2021-11-24 Electronic device

Applications Claiming Priority (2)

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US202063130415P 2020-12-24 2020-12-24
US63/130,415 2020-12-24

Publications (1)

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