CN114675758A - Touch panel and touch display device - Google Patents
Touch panel and touch display device Download PDFInfo
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- CN114675758A CN114675758A CN202210329099.4A CN202210329099A CN114675758A CN 114675758 A CN114675758 A CN 114675758A CN 202210329099 A CN202210329099 A CN 202210329099A CN 114675758 A CN114675758 A CN 114675758A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0416—Control or interface arrangements specially adapted for digitisers
- G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Networks & Wireless Communication (AREA)
- Position Input By Displaying (AREA)
Abstract
The embodiment of the invention discloses a touch panel and a touch display device. In a specific embodiment, the touch panel includes a touch integrated circuit, and further includes a touch area, a routing area, and a bonding area formed on the substrate, where the bonding area includes a shielding trace and a shielding pad electrically connected to a shielding signal pin of the touch integrated circuit, and the shielding trace is electrically connected to the shielding pad; the shielding pad is formed by a first transparent conducting layer, the first transparent conducting layer extends to the wiring area, and the projection of the first transparent conducting layer extending to the wiring area on the substrate covers the projection of at least part of wiring in the wiring area on the substrate. This embodiment can reduce the interference of noise.
Description
Technical Field
The present invention relates to the field of touch technologies, and in particular, to a touch panel and a touch display device.
Background
In recent years, with the demand for human-computer interaction becoming more and more widespread, the market demand for display devices with touch control functions also becomes greater and greater. Generally, a display device to implement a touch function generally needs to be composed of the following components: the touch sensor comprises a touch sensor, a touch flexible circuit board, a touch integrated circuit and the like, wherein the touch sensor is provided with a binding area for binding (binding) the touch flexible circuit board, and the touch flexible circuit board is used for connecting the touch sensor and the touch integrated circuit, so that the driving and the detection of touch are realized.
However, the capacitive touch screen is adopted in the current touch display device, and the situation that the ESD test does not pass is often generated in the verification of the whole machine; or in the whole machine debugging process, because of the complexity of the experimental environment, the environmental noise is large, and the condition that the touch performance is unstable during debugging is caused.
Disclosure of Invention
An object of the present invention is to provide a touch panel and a touch display device, so as to solve at least one of the problems in the prior art.
In order to achieve the purpose, the invention adopts the following technical scheme:
the invention provides a touch panel, which comprises a touch integrated circuit, a touch area, a wiring area and a bonding area, wherein the touch area, the wiring area and the bonding area are formed on a substrate;
the shielding pad is formed by a first transparent conducting layer, the first transparent conducting layer extends to the wiring area, and the projection of the first transparent conducting layer extending to the wiring area on the substrate covers the projection of at least part of wiring in the wiring area on the substrate.
According to the touch panel provided by the first aspect of the invention, the shielding routing and the shielding bonding pad electrically connected with the shielding signal pin of the touch integrated circuit are arranged in the bonding area, so that the antistatic performance of the touch panel is improved, the noise interference is reduced and the performance-to-noise ratio of the touch panel is improved without increasing the cost.
Optionally, the shielding trace extends to the trace region.
This option can enhance the side protection of the touch panel.
Optionally, a projection of the first transparent conductive layer extending to the routing area on the substrate covers a projection of the shielding routing extending to the routing area on the substrate.
According to the optional mode, noise interference on two sides of the module can be reduced, meanwhile, ESD release paths are increased, and side protection of the touch panel is enhanced.
Optionally, a projection of the first transparent conductive layer extending to the routing area on the substrate covers a projection of all the traces extending to the routing area on the substrate.
In the alternative mode, the first transparent conductive layer is arranged to cover all the wires in the wire routing area, so that the ESD capability can be enhanced, and the signal shielding capability can be enhanced.
Optionally, the shielding traces in the bonding area are located at the edge positions of two sides of the bonding area, and the shielding traces extending to the routing area are located at the edge position of the routing area.
Optionally, a projection of the shielding pad on the substrate covers a projection of the shielding trace of the bonding area on the substrate.
Optionally, the bonding area further includes a ground trace and a ground pad connected to a ground signal pin of the touch integrated circuit, the ground trace is electrically connected to the ground pad, and the ground trace extends to the routing area.
Optionally, a projection of the ground pad on the substrate covers a projection of the ground trace on the substrate.
Optionally, the ground pad is formed by a second transparent conductive layer, and the second transparent conductive layer and the first transparent conductive layer are disposed on the same layer.
Optionally, the touch integrated circuit is configured to electrically connect the shielding signal pin and the ground signal pin in response to a switching instruction.
In the optional mode, the anti-noise capability or the anti-static capability is optimized in a targeted manner through the switching instruction of the touch integrated circuit, so that the anti-ESD capability of the touch panel can be further improved, the interference of noise can be further reduced, and the signal to noise ratio is improved.
Optionally, the touch area includes a touch sensor, the routing area includes a signal lead connected to the touch sensor, the signal lead extends to the bonding area, the bonding area further includes a sensing pad electrically connected to a sensing signal pin of the touch integrated circuit, and the sensing pad is electrically connected to the signal lead extending to the bonding area.
Optionally, the touch panel is a capacitive touch panel.
A second aspect of the present invention provides a touch display device, including the touch module according to the first aspect of the present invention.
The invention has the following beneficial effects:
according to the technical scheme, the shielding routing and the shielding bonding pad electrically connected with the shielding signal pin of the touch integrated circuit are arranged in the bonding area, so that the noise interference can be reduced and the signal-to-noise ratio of the touch panel can be improved without increasing the cost.
Drawings
The following describes embodiments of the present invention in further detail with reference to the accompanying drawings.
FIG. 1 is a schematic diagram of a touch panel in the prior art
Fig. 2 is a schematic cross-sectional view of the touch panel of fig. 1 along a transverse cross-section of the routing area.
Fig. 3 is a schematic structural diagram of a touch panel according to an embodiment of the present invention.
Fig. 4 is a schematic cross-sectional view of the touch panel of fig. 3 along a transverse cross-section of the routing area.
Fig. 5 is a schematic structural diagram of a touch panel according to another embodiment of the invention.
Fig. 6 is a schematic cross-sectional view of the touch panel of fig. 5 along a transverse cross-section of the routing area.
Fig. 7 is a schematic structural diagram of a touch panel according to another embodiment of the invention.
Fig. 8 is a schematic structural diagram of a touch panel according to another embodiment of the invention.
Fig. 9 is a schematic diagram illustrating a specific structure of the touch panel of fig. 8.
Detailed Description
In order to more clearly illustrate the present invention, the present invention is further described below with reference to the following examples and the accompanying drawings. Similar parts in the figures are denoted by the same reference numerals. It is to be understood by persons skilled in the art that the following detailed description is illustrative and not restrictive, and is not to be taken as limiting the scope of the invention.
In recent years, with the demand for human-computer interaction becoming more and more widespread, the market demand for display devices with touch control functions also becomes greater and greater. Generally, a display device to implement a touch function generally needs to be composed of the following components: the touch control device comprises a touch control sensor, a touch control flexible circuit board, a touch control integrated circuit and the like, wherein the touch control sensor is provided with a binding area used for binding (binding) the touch control flexible circuit board, and the touch control flexible circuit board is used for connecting the touch control sensor and the touch control integrated circuit, so that the driving and the detection of touch control are realized.
Common touch display device has for example products such as intelligent wrist-watch, intelligent bracelet, intelligent glasses, intelligent ornament, rhythm of the heart/blood pressure watch and motion camera in the existing market, and along with the renewal of above-mentioned product, the customer has proposed higher requirement in the aspect of display effect, display area, module size and touch-control performance to touch display device.
However, a capacitive touch screen is adopted in a current touch display device, fig. 1 shows a schematic structural diagram of a touch panel in the prior art, fig. 2 shows a schematic cross-sectional diagram of the touch panel of fig. 1 along a transverse cross-section of a routing area, as shown in fig. 1 and fig. 2, the touch panel includes a touch area, a routing area 20 ' and a bonding area 30 ', edge positions on two sides of the bonding area in fig. 1 are ground pads 2, a ground pad a of the bonding area is connected to a ground trace 1 of the bonding area, the ground trace 1 extends to the routing area 20 ', and there are: the bonding pad corresponding to the plurality of Rx wires, the bonding pad corresponding to the grounding wire, the bonding pad corresponding to the plurality of Tx wires, the bonding pad corresponding to the grounding wire and the bonding pad corresponding to the plurality of Rx wires are arranged on the bonding area, wherein the bonding pad corresponding to the plurality of Rx wires is connected with the plurality of Rx wires through punching; the Rx routing is used for outputting a signal of the touch sensor to the touch integrated circuit; the bonding pad bonding areas corresponding to the grounding wires are connected through punching; the bonding pads corresponding to the plurality of Tx wires are connected with the plurality of Tx wires in the bonding area through punching; the Tx wire is used for receiving signals sent by the touch integrated circuit to the touch sensor. In fig. 1, the Rx trace, the GND trace and the Tx trace all extend to the trace area 20'; in the bonding area 30', bonding pads corresponding to Rx traces are connected to the Rx traces; the bonding pad corresponding to the grounding wire is connected with the grounding wire; the bonding pad corresponding to the Tx wire is connected with the Tx wire; an insulating layer is arranged between the grounding wire extending to the wire routing area 20 ' and the wire routing area 20 ' in the wire routing area 20 '; an insulating layer is arranged between the Rx wiring extending to the wiring area 20 'and the wiring area 20'; there is an insulating layer between the Tx trace extending to the trace area 20 'and the trace area 20'. As shown in fig. 2, the substrates are 101, 104 are signal traces in the trace area, including ground traces, Tx traces, and Rx traces, and 102 and 103 are insulating layers.
The touch panel often fails the ESD test in the whole machine verification; or in the whole machine debugging process, because of the complexity of the experimental environment, the environmental noise is large, and the condition that the touch performance is unstable during debugging is caused.
The prior art also has related improvement schemes aiming at the problems that the ESD test of the module fails and the signal-to-noise ratio is poor, the electrostatic performance can be provided to a certain extent by adding the conductive cloth on the module or providing the grounding area of the module and the whole machine, but the BOM cost can be provided by adding the membrane material; the debugging of the whole machine needs to coordinate time and resources, needs a large amount of experimental verification, and has lower efficiency. The improvement scheme of the signal-to-noise ratio is to temporarily optimize firmware, and to improve the reporting threshold to correspond to the debugging problem of the client, which may increase the verification time of the client on the touch performance, and the efficiency is low.
In view of this, an embodiment of the present invention provides a touch panel, including a touch integrated circuit, and further including a touch area, a routing area, and a bonding area formed on a substrate, where the bonding area includes a shielding trace and a shielding pad electrically connected to a shielding signal pin of the touch integrated circuit, and the shielding trace is electrically connected to the shielding pad;
the shielding pad is formed by a first transparent conducting layer, the first transparent conducting layer extends to the wiring area, and the projection of the first transparent conducting layer extending to the wiring area on the substrate covers the projection of at least part of wiring in the wiring area on the substrate.
In a specific example, the touch panel provided in the embodiment of the present invention is a capacitive touch panel. A schematic structural diagram of a touch panel provided in an embodiment of the present invention is shown in fig. 3, where the touch panel includes a touch area, a routing area 20, and a bonding area 30 formed on a substrate, where the touch area includes a touch sensor, the touch sensor is a capacitive sensor, the routing area 20 includes a signal lead connected to the touch sensor, the signal lead extends to the bonding area 30, the touch panel further includes a touch integrated circuit (not shown in fig. 3) and a touch flexible circuit board (not shown in fig. 3), and the touch flexible circuit board is used to connect the touch sensor located in the touch area and the touch integrated circuit, so as to ensure the touch performance of the touch panel.
In a specific example, in fig. 3, the bonding area 30 includes shielding traces 31 located at two side edges of the bonding area and shielding pads 32 electrically connected to shielding signal pins of the touch integrated circuit, where the shielding traces 31 are electrically connected to the shielding pads 32; specifically, the shield trace 31 and the shield pad 32 of the bonding region 30 are electrically connected by punching.
The shielding pad 32 is formed by a first transparent conductive layer, the first transparent conductive layer extends to the routing area 20, and a projection of the first transparent conductive layer extending to the routing area 20 on the substrate covers a projection of at least a part of the routing in the routing area 20 on the substrate.
In a specific example, the length and width of the shielding pad 32 are 0.47 × 0.14mm, wherein the line width of the shielding trace 31 is 0.02mm, and the first transparent conductive layer covers the shielding trace 31 and has a line width of 0.024 mm.
In fig. 3, the shielding pad 32 is connected to the shielding trace 31 through a hole, the shielding pad 32 extends to the routing area 20, and the shielding trace 31 does not extend to the routing area 20, so that the shielding trace 31 is connected to the shielding pad 32, and the shielding pad 32 is connected to the routing area 20, thereby realizing the connection between the shielding trace 31 and the routing area 20. The projection of the first transparent conductive layer on the substrate in fig. 2, which extends to the routing area 20, covers the projection of the trace on the substrate at the corresponding shielding pad 32 in the routing area 20, and since the shielding trace does not realize the projection of all the traces covered in the routing area 20 on the substrate, the shielding capability is relatively weak.
In a possible implementation manner, the bonding area 30 further includes a ground trace 33 and a ground pad 34 connected to a ground signal pin of the touch integrated circuit, where the ground trace 33 is electrically connected to the ground pad 34, and specifically, the ground trace 33 of the bonding area 30 is electrically connected to the ground pad 34 by punching; the ground trace 33 extends to the trace region 20.
In one possible implementation, the ground pad 34 is formed by a second transparent conductive layer, which is disposed on the same layer as the first transparent conductive layer.
In a specific example, in fig. 3, since the first transparent conductive layer extends to the routing area 20, and the second transparent conductive layer is disposed on the same layer as the first transparent conductive layer, the ground pad 34 also extends to the routing area 20, the ground pad 34 is connected to the ground trace 33 by punching, the ground trace 33 also extends to the routing area 20, but an insulating layer is disposed between the ground trace extending to the routing area and the routing area, so that the ground trace 33 is connected to the ground pad 34, and the ground pad 34 is connected to the routing area 20, thereby achieving connection between the ground trace 33 and the routing area 20.
In one possible implementation, the projection of the ground pad 34 on the substrate covers the projection of the ground trace 33 on the substrate.
In a specific example, as shown in fig. 3, the line width of the second transparent conductive layer of the ground pad 34 is 0.024mm, and the line width of the ground trace is 0.02mm, so that the projected area of the ground pad 34 on the substrate is larger than the projected area of the ground trace 33 on the substrate, that is, the projection of the ground pad 34 on the substrate covers the projection of the ground trace 33 on the substrate.
In one possible implementation, the shielding traces 31 of the bonding area 30 are located at two side edges of the bonding area.
In a specific example, the shielding pads 32 of the bonding area 30 are located at two side edge positions of the bonding area 30, and the shielding traces 31 corresponding to the shielding pads 32 are also located at two side edge positions of the bonding area 30.
In one possible implementation, the bonding area 30 further includes a sense pad electrically connected to a sense signal pin of the touch integrated circuit, the sense pad being electrically connected to a signal lead extending to the bonding area. In fig. 3, a sensing pad corresponding to an Rx trace for outputting a signal of the touch sensor to the touch integrated circuit is further present between the shielding pad 32 and the grounding pad 34; the sensing pads corresponding to the Tx traces for receiving signals sent by the touch integrated circuit to the touch sensor are further included between the two ground pads 34, where there are several Rx traces extending to the trace area 20 in the sensing pads corresponding to the Rx traces, and there are several Tx traces extending to the trace area 20 in the sensing pads corresponding to the Tx traces (the sensing pads corresponding to the Rx traces, several Rx traces, the sensing pads corresponding to the Tx traces, and several Tx traces are not shown in fig. 3). The circuit connection corresponding to the sensing pad is specifically as follows: a receiving pin of the touch integrated circuit provides a sensing pad of the bonding area 30 corresponding to the Rx trace, and the Rx trace sensing signal is connected to the sensing pad and provides the touch flexible circuit board with the Rx trace; the signal output by the capacitive touch sensor is sent from the routing area 20 to the sensing pad of the bonding area 30 corresponding to the Tx trace, and the sensing pad corresponding to the Tx trace is connected to the touch integrated circuit through the touch flexible circuit board.
In one specific example, for example, a group of three sensing signals Rx are located in the sensing pad corresponding to the Rx trace; the three sensing signals Tx form a group and are positioned in the sensing bonding pad corresponding to the Tx routing; the ground trace is between the three sense signals Rx and Tx.
In a possible implementation manner, the projection of the first transparent conductive layer extending to the routing area on the substrate covers the projection of at least part of the routing in the routing area on the substrate.
In a specific example, as shown in fig. 4, 104 above the substrate 101 is a part of the traces of the trace area, including the shielding trace, the grounding trace, the Rx trace and the Tx trace, 102 and 103 are insulating layers, and 105 is a first transparent conductive layer extending to the trace area.
In a possible implementation manner, the projection of the first transparent conductive layer extending to the routing area on the substrate covers the projection of all the traces extending to the routing area on the substrate.
In a specific example, as shown in fig. 5, a projection of the first transparent conductive layer extending to the routing area on the substrate covers a projection of all the traces extending to the routing area on the substrate, that is, the routing area is entirely formed by the first transparent conductive layer, and the second transparent conductive layer and the first transparent conductive layer are disposed on the same layer, so to speak, the routing area is entirely formed by the second transparent conductive layer, and at this time, the width of the first transparent conductive layer and the width of the second transparent conductive layer are 0.5 mm.
Fig. 6 is a schematic cross-sectional view of the touch panel of fig. 5 along a transverse cross-section of the routing area, where the first conductive layer 105 covers a projection of all traces in the routing area on the substrate, so that the first conductive layer 105 is between the insulating layer 102 and the insulating layer 103.
In one possible implementation, the shielding trace 31 extends to the trace region 20.
In a specific example, as shown in fig. 7, the shielding trace 31 extends to the routing area 20, an insulating layer is disposed between the shielding trace 31 extending to the routing area 20 and the routing area, and the shielding trace 31 extends to the routing area 20, so that a shielding protection can be formed on a side surface of the routing area 20.
In a possible implementation manner, the projection of the first transparent conductive layer extending to the routing area on the substrate covers the projection of all the traces extending to the routing area on the substrate.
In a specific example, as shown in fig. 8, a projection of the first transparent conductive layer extending to the routing area on the substrate covers a projection of all the traces extending to the routing area on the substrate. Fig. 9 is a schematic structural diagram of the touch panel of fig. 8, where the touch panel includes: the touch area 10, the routing area 20, and the bonding area 30, the bonding area 30 includes a shielding pad 32 corresponding to a shielding signal, a sensing pad 35 corresponding to an Rx trace, a ground pad 34 corresponding to a ground trace, and a sensing pad 36 corresponding to a Tx trace. At bonding area 30, the shielding signal and the shielding pad are connected in a punching manner, the grounding signal and the grounding pad are connected in a punching manner, Rx trace and sensing pad 35 are connected in a punching manner, Tx trace and sensing pad 36 are connected in a punching manner, although Rx trace, Tx trace, shielding trace and grounding trace all extend to the trace area at trace area 20, the Rx trace, Tx trace, shielding trace and grounding trace are all separated by an insulating layer between the trace area 20, and when the trace area and Rx trace, Tx trace, shielding trace and grounding trace need to be communicated, the sensing pad 35, the sensing pad 36, the shielding pad 32 and the grounding pad 34 corresponding to the grounding trace are communicated through Rx trace, Tx trace, shielding trace and grounding pad.
In one possible implementation manner, the touch integrated circuit is configured to electrically connect the shielding signal pin and the grounding signal pin in response to a switching instruction.
In a specific example, the touch panel provided in fig. 3, 5, 7 and 8 of the embodiment of the present invention has two operation modes, the first operation mode is that the shielding pad is connected to the shielding signal pin of the touch integrated circuit through the flexible circuit board FPC, for example; the second working mode is that when the shielding bonding pad is connected with the shielding signal pin of the touch integrated circuit, the shielding signal pin in the touch integrated circuit is grounded, for example, when the switch is turned off, the shielding signal pin in the touch integrated circuit is not grounded; when the switch is closed, the shielding signal pin inside the touch integrated circuit is grounded.
For example, using the touch panel designed in fig. 3, the touch flexible printed circuit board is bonded to the shielding pads 32, so that the shielding pads 32 are connected to the shielding signal lines of the touch integrated circuit, and similarly, the grounding pads 34 are connected to the grounding signal lines of the touch integrated circuit, and the grounding signal lines of the touch integrated circuit are connected to the grounding copper lines of the touch flexible printed circuit board, and according to the environmental conditions, the shielding signals are output when the touch integrated circuit is in the anti-noise mode, and the touch panel provided in this embodiment can block the noise interference of the signal lines; when the touch integrated circuit is in an antistatic mode, the first transparent conductive layer is in a grounding state, grounding resistance is effectively reduced, ESD can be released in the film layer, and bridge point damage or Pad explosion caused by entering the channel film layer is avoided, and finally function failure is caused.
Another embodiment of the present invention provides a touch display device, which includes the touch panel and a display panel, wherein a touch sensor, such as a capacitive sensor, of the touch panel and corresponding traces are integrated in a functional film of the display panel.
In the description of the present invention, it should be noted that the terms "upper", "lower", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and operate, and thus, should not be construed as limiting the present invention. Unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are intended to be inclusive and mean, for example, that they may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
It is further noted that, in the description of the present invention, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in the process, method, article, or apparatus that comprises the element.
It should be understood that the above-mentioned embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention, and it will be obvious to those skilled in the art that other variations and modifications can be made on the basis of the above description, and all embodiments cannot be exhaustive, and all obvious variations and modifications belonging to the technical scheme of the present invention are within the protection scope of the present invention.
Claims (13)
1. A touch panel is characterized by comprising a touch integrated circuit, a touch area, a wiring area and a bonding area, wherein the touch area, the wiring area and the bonding area are formed on a substrate;
the shielding pad is formed by a first transparent conducting layer, the first transparent conducting layer extends to the wiring area, and the projection of the first transparent conducting layer extending to the wiring area on the substrate covers the projection of at least part of wiring in the wiring area on the substrate.
2. The touch panel of claim 1, wherein the shield trace extends to the trace region.
3. The touch panel of claim 2, wherein a projection of the first transparent conductive layer on the substrate that extends to the routing area covers a projection of the shield trace on the substrate that extends to the routing area.
4. The touch panel according to claim 1 or 2, wherein a projection of the first transparent conductive layer extending to the routing area on the substrate covers a projection of all the traces extending to the routing area on the substrate.
5. The touch panel of claim 2, wherein the shielding traces in the bonding area are located at two side edges of the bonding area, and the shielding traces extending to the routing area are located at an edge of the routing area.
6. The touch panel of claim 5, wherein a projection of the shield pad on the substrate covers a projection of the shield trace of the bonding area on the substrate.
7. The touch panel of claim 1, wherein the bonding area further comprises a ground trace and a ground pad connected to a ground signal pin of the touch integrated circuit, the ground trace is electrically connected to the ground pad, and the ground trace extends to the trace area.
8. The touch panel of claim 7, wherein a projection of the ground pad on the substrate overlaps a projection of the ground trace on the substrate.
9. The touch panel of claim 7, wherein the ground pad is formed of a second transparent conductive layer, the second transparent conductive layer being disposed on the same layer as the first transparent conductive layer.
10. The touch panel of claim 1, wherein the touch integrated circuit is configured to electrically connect the shield signal pin and the ground signal pin in response to a switching command.
11. The touch panel of claim 1, wherein the touch area includes a touch sensor, the routing area includes signal leads connected to the touch sensor, the signal leads extending to the bonding area, the bonding area further includes sense pads electrically connected to sense signal pins of a touch integrated circuit, the sense pads electrically connected to the signal leads extending to the bonding area.
12. The touch panel of claim 1, wherein the touch panel is a capacitive touch panel.
13. A touch display device comprising the touch module according to any one of claims 1 to 12.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210329099.4A CN114675758A (en) | 2022-03-31 | 2022-03-31 | Touch panel and touch display device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210329099.4A CN114675758A (en) | 2022-03-31 | 2022-03-31 | Touch panel and touch display device |
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| CN114675758A true CN114675758A (en) | 2022-06-28 |
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| CN202210329099.4A Pending CN114675758A (en) | 2022-03-31 | 2022-03-31 | Touch panel and touch display device |
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| CN (1) | CN114675758A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024087195A1 (en) * | 2022-10-28 | 2024-05-02 | 京东方科技集团股份有限公司 | Display panel and display device |
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- 2022-03-31 CN CN202210329099.4A patent/CN114675758A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024087195A1 (en) * | 2022-10-28 | 2024-05-02 | 京东方科技集团股份有限公司 | Display panel and display device |
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