CN114672793A

CN114672793A - Antenna oscillator and manufacturing method thereof

Info

Publication number: CN114672793A
Application number: CN202011551041.1A
Authority: CN
Inventors: 钟文龙
Original assignee: Xiamen Huahongchang Technology Co ltd
Current assignee: Xiamen Huahongchang Technology Co ltd
Priority date: 2020-12-24
Filing date: 2020-12-24
Publication date: 2022-06-28

Abstract

The invention relates to an antenna oscillator and a manufacturing method thereof, wherein the manufacturing method comprises the following steps: s1, injection molding to obtain a vibrator body; s2 mechanically coarsening the vibrator; s3, chemically roughening the oscillator; s4, activating the vibrator by using colloidal palladium or ionic palladium solution; s5 disperging or reducing the vibrator; s6, carrying out chemical copper plating on the vibrator to form a chemical copper layer; s7, separating a plating area and a non-plating area on the surface of the vibrator; s8 electroplating copper on the electroplating area; s9 removes the electroless copper layer on the electroless plated area. The invention breaks the dilemma that the surface layer of the plastic antenna oscillator is difficult to be chemically plated with copper at the present stage, and the chemical copper layer has strong adhesive force on the plastic surface layer and is uniform; and a copper layer is electroplated on the chemical copper layer, so that the prepared antenna oscillator has stronger reliability and the performance is improved to a great extent. The mode of combining chemical copper plating with electro-coppering improves the production efficiency and reduces the production cost at the same time, so that the product has more competitive advantage.

Description

Antenna oscillator and manufacturing method thereof

Technical Field

The invention relates to the technical field of communication antennas, in particular to an antenna oscillator and a manufacturing method thereof.

Background

With the continuous development and network upgrade of the 4G/5G wireless communication industry, the frequency of wireless communication is higher and higher, and the demand is more and more. The structural design, material selection, manufacturing method and assembly process of the antenna guarantee the reliability, stability and durability of the antenna performance. The oscillator is the most important functional part in the antenna, and general structural design is comparatively complicated. The traditional production process of the vibrator adopts the mode of die-casting and molding metal materials (aluminum alloy or zinc alloy) or combining sheet metal parts, plastic fixing parts and circuit boards.

Although mass production of plastic oscillators is introduced in the antenna industry at present, the process of chemically plating copper on the plastic surface layer is difficult to realize due to the process limitation of plating copper on the plastic surface layer. One of the current processes is to plate copper on the surface layer of the plastic by a vacuum plating method, but the method is not suitable for mass production, and the vacuum plating equipment is expensive, and the cost investment of the former stage is huge; the other method is to chemically plate the plastic surface layer with nickel and then plate the plastic surface layer with copper, because the plastic surface layer is plated with nickel, which is not a good conductor, and the performance of the vibrator is greatly influenced. In addition, compared with copper plating on a copper film, copper plated on a nickel film has weaker adhesive force and is easier to wear; moreover, the copper film on the plastic antenna element needs to have a certain thickness to achieve a relatively ideal effect, so that the process is relatively time-consuming.

Disclosure of Invention

The invention provides a method for manufacturing an antenna oscillator, which breaks the dilemma of difficult surface chemical copper plating of a plastic antenna oscillator and further electroplates copper on a chemical copper layer, thereby manufacturing the antenna oscillator with light weight and good performance.

In order to achieve the technical purpose, the invention also discloses an antenna oscillator manufacturing method, which comprises the following steps:

s1, injection molding is carried out by taking plastic as a raw material to obtain a vibrator body with a preset structure;

s2, performing mechanical roughening treatment on the surface of the vibrator body, and then cleaning;

s3, performing chemical roughening treatment on the vibrator body by adopting roughening liquid;

s4, activating the vibrator body by using an acidic palladium solution;

s5, cleaning the vibrator body;

s6, carrying out chemical copper plating on the vibrator body by adopting an alkaline ion copper solution to form a chemical copper layer;

s7, separating a plating area and a non-plating area on the electroless copper layer;

s8, performing copper electroplating treatment on the electroplating area of the vibrator body to form an electroplated copper layer;

and S9, removing the electroless copper layer on the non-electroplating area of the oscillator body.

Preferably, in step S3, the roughening solution is a roughening salt solution, and the concentration of roughening salt is 150-400 g/l; the chemical coarsening time is 5-20 min, and the temperature is 20-45 ℃.

Preferably, in step S4, a colloidal palladium solution is used to activate the vibrator body, wherein the solution contains 15-55 ppm of palladium, 150-300 ml/l of hydrochloric acid, and 1-5 g/l of stannous chloride; the activation time is 1-8 min, and the temperature is 20-45 ℃;

in the step S5, a dispergator solution is adopted to dispergate the vibrator body, wherein the concentration of the dispergator in the solution is 10-80 ml/l; the cleaning time is 1-8 min, and the temperature is 30-60 ℃.

Preferably, in step S4, an ionic palladium solution is used to perform an activation treatment on the vibrator body, wherein the solution contains 20-100 ppm of palladium and 8-50 ml/l of sulfuric acid or hydrochloric acid; the activation time is 1-8 min, and the temperature is 20-45 ℃;

in the step S5, a reducing agent solution is adopted to reduce the vibrator body, the concentration of the reducing agent in the solution is 20-80 ml/l, the cleaning time is 1-8 min, and the temperature is 30-60 ℃.

Preferably, in step S6, the ionic copper solution comprises 1-5 g/l of ionic copper, 5-15 g/l of free alkali and 10-25 ml/l of free formaldehyde; the chemical copper plating time is 5-30 min, and the temperature is 20-35 ℃; in the electroless copper plating process, the concentration of the ionic copper solution is controlled to be 50-150%, and the pH value of the solution is 8-14.

Preferably, in step S7, a plating region and a non-plating region are separated by laser etching a barrier line on the electroless copper layer.

Preferably, in the step S1, PPS plastic or PPO plastic is selected as the raw material; the mechanical roughening in step S2 is to perform sand blasting on the surface of the vibrator body; the electrolytic copper plating treatment described in step S8 is either a coke plating or an acid copper plating.

Preferably, steps S10 and S11 are further included after step S9, and step S10 is a second copper electroplating treatment, which is acid copper electroplating; step S11 is to add a protection layer on the electroplating region.

Preferably, the additional protective layer in step S11 is tin or silver plated.

The invention also discloses an antenna oscillator which is manufactured by adopting any one of the methods.

The invention has the following beneficial effects:

1. the difficulty that the surface layer of the plastic antenna oscillator is difficult to chemically plate copper at the present stage is broken through, and compared with vacuum plating, the adhesion of a chemical copper layer on the surface layer of the oscillator is stronger, and the copper layer is more uniform; compared with the copper layer plated on the nickel layer, the copper layer plated on the chemical copper layer has the advantages that the reliability of the manufactured antenna oscillator is higher, and the performance is greatly improved.

2. The mode of combining chemical copper plating with electro-coppering improves the production efficiency and reduces the production cost at the same time, so that the product has more competitive advantage.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments.

The first embodiment is as follows:

a manufacturing method of an antenna oscillator takes PPS plastic as a base material and comprises the following steps:

s1: and injection molding the PPS plastic to obtain the oscillator body with a preset structure.

S2: and carrying out mechanical roughening treatment on the surface of the oscillator body, and then cleaning. The purpose of mechanical coarsening is to improve the roughness of the surface of the oscillator body, so that the adhesion of a copper layer is improved, and the copper layer is prevented from falling off. The mechanical roughening treatment mode can adopt a sand blasting mode, and the spraying material is made of a non-magnetic material, so that the situation that the residual spraying material is attached to the surface of the oscillator to influence the electrical performance of the finished oscillator product is avoided.

S3: and carrying out chemical roughening treatment on the oscillator body by adopting roughening liquid. The coarsening liquid is a coarsening salt solution, and the concentration of the coarsening salt is 150 g/l; and immersing the oscillator body in the coarsening liquid for 5-20 min, and controlling the temperature at 20-45 ℃. The purpose of chemical roughening is to further improve the adhesion properties of the oscillator surface.

S4: and activating the vibrator body by adopting a colloidal palladium solution. The colloidal palladium solution contains 15ppm of palladium, 150ml/l of hydrochloric acid and 1g/l of stannous chloride, the activation time is 1-8 min, and the temperature is controlled at 20-45 ℃.

The bivalent tin is colloidal to tightly wrap palladium atoms, so that the catalytic action of palladium cannot be exerted, and then the colloid is uniformly attached to the surface of the vibrator to wait for the next process.

S5: and (3) debonding the vibrator body activated by the colloidal palladium solution by using a debonding agent solution, wherein the concentration of the debonding agent in the solution is 10ml/l, the debonding time is 1-8 min, and the temperature is controlled at 30-60 ℃.

The dispergator removes divalent tin on the surface of the oscillator, so that palladium atoms are exposed, and the catalytic action of palladium is exerted.

S6: immersing the oscillator body in an alkaline solution prepared by ionic copper for electroless copper plating to form an electroless copper layer; the ionic copper solution comprises 1g/l of ionic copper, 5g/l of free alkali and 10ml/l of free formaldehyde, and in the reaction process, the concentration of the solution is controlled to be 50-150%, the pH value of the solution is 8-14, the time is 5-30 min, and the temperature is 20-35 ℃.

The principle of electroless copper plating is that under the catalytic action of palladium, copper ions are quickly reduced into copper atoms by bivalent tin and tightly adsorbed on the surface of the oscillator.

S7: and laser etching is carried out on the chemical copper layer to form a barrier line so as to separate an electroplating area and an electroless plating area on the surface of the oscillator body.

During laser etching, laser etching is carried out on the position where the barrier line is to be formed, and the surface copper film on the position where the barrier line is to be formed is removed to form the barrier line. The blocking lines fall predominantly in the non-selected areas so as not to disrupt or reduce the predetermined shape or area of the selected areas. The laser etching treatment can be realized by adopting the prior art.

S8: and carrying out electro-coppering treatment on the electroplating area of the oscillator body, and forming an electro-coppering layer. In this step, the pyrocopper plating or the acid copper plating can be performed, the pyrocopper is generally used as the intermediate layer, when the vibrator copper layer is required to be thick, the pyrocopper plating is selected, and the step S10 is performed subsequently. The acid copper is generally used as an outer layer for improving the brightness, and the acid copper can be electroplated when the requirement on the thickness of the oscillator copper layer is not high. For the purpose of detailed description herein and comparison between the respective examples, the step S8 is the electroplating of the pyrocopper, and both steps are performed with the step S10. The copper electroplating process can be realized by adopting the prior art, and is not described in detail herein.

S9: and removing the electroless copper layer on the non-electroplating area of the oscillator body. And removing the electroless copper layer to expose the oscillator raw material, and performing copper removing treatment by adopting the prior art such as etching and the like.

S10: and a second copper electroplating treatment, wherein the process is acid copper electroplating.

S11: and carrying out electroplating protective layer treatment on the electroplating area of the oscillator body to form a protective layer on the electroplated copper layer. The copper layer of the vibrator is electroplated with a layer of tin or silver, preferably tin, and the cost is low. After tin plating, a passivation film is formed on the surface of the tin layer to protect the tin layer by using a commercially available passivation solution. The tin layer protects the copper layer, so that the service life of the vibrator can be prolonged.

The second embodiment:

the substrate of this example is still PPS plastic, and the difference from the first example is that the concentration of the coarsening salt in the step S3 is adjusted to 300g/l, and the other steps are kept unchanged.

Example three:

the substrate of this example is still PPS plastic, and the difference from the first example is that the concentration of the coarsening salt in the step S3 is adjusted to 400g/l, and the other steps are kept unchanged.

Example four:

the base material of this embodiment is still PPS plastic, and the difference from the first embodiment is that the concentration of palladium in the colloidal palladium solution of step S4 is adjusted to 35ppm, the concentration of hydrochloric acid is adjusted to 230ml/l, and the concentration of stannous chloride is adjusted to 3 g/l; adjusting the concentration of the dispergator in the step S5 to 45 ml/l; the other steps remain unchanged.

Example five:

the base material of this embodiment is still PPS plastic, and the difference from the first embodiment is that the concentration of palladium in the colloidal palladium solution of step S4 is adjusted to 55ppm, the concentration of hydrochloric acid is adjusted to 300ml/l, and the concentration of stannous chloride is adjusted to 5 g/l; adjusting the concentration of the dispergator in the step S5 to 80 ml/l; the other steps remain unchanged.

Example six:

the substrate of this example is still PPS plastic, and the difference from the first example is that the concentration of ionic copper in the ionic copper solution of step S6 is adjusted to 3g/l, the concentration of free base is adjusted to 10g/l, and the concentration of free formaldehyde is adjusted to 18 ml/l; the other steps remain unchanged.

Example seven:

the substrate of this example is still PPS plastic, and the difference from the first example is that the concentration of ionic copper in the ionic copper solution of step S6 is adjusted to 5g/l, the concentration of free base is adjusted to 15g/l, and the concentration of free formaldehyde is adjusted to 25 ml/l; the other steps remain unchanged.

Example eight:

in this embodiment, the base material is still PPS plastic, and the difference from the first embodiment is that step S4 is changed to perform an activation treatment on the resonator body by using an ionic palladium solution. The ionic palladium solution contains 20ppm of palladium and 8ml/l of sulfuric acid, the activation time is 1-8 min, and the temperature is controlled at 20-45 ℃.

And step S5, reducing the oscillator body activated by the ionic palladium solution by using a reducing agent solution, wherein the concentration of the reducing agent in the solution is 20ml/l, the reduction time is 1-8 min, and the temperature is controlled at 30-60 ℃.

In this example, the purpose of steps S4 and S5 is to attach ionic palladium to the surface of the resonator, and then to reduce the ionic palladium into palladium atoms by a reducing agent, so that palladium can exert a catalytic action.

Example nine:

the substrate of this example is still PPS plastic, and the difference from the eighth example is that the concentration of palladium in the ionic palladium solution of step S4 is adjusted to 60ppm, and the concentration of sulfuric acid is adjusted to 30 ml/l; adjusting the concentration of the reducing agent to 50ml/l in the step S5; the other steps remain unchanged.

Example ten:

the substrate of this example is still PPS plastic, and the difference from the eighth example is that the concentration of palladium in the ionic palladium solution of step S4 is adjusted to 100ppm, and the concentration of sulfuric acid is adjusted to 50 ml/l; adjusting the concentration of the reducing agent in the step S5 to 80 ml/l; the other steps remain unchanged.

Example eleven:

the substrate of this embodiment is still PPS plastic, and the difference from the eighth embodiment is that the sulfuric acid in the ionic palladium solution of step S4 is replaced by hydrochloric acid; the other steps remain unchanged.

Example twelve:

the substrate of this example is still PPS plastic, and the difference from the ninth example is that the sulfuric acid in the ionic palladium solution of step S4 is replaced by hydrochloric acid; the other steps remain unchanged.

Example thirteen:

the substrate of this embodiment is still PPS plastic, and the difference from the tenth embodiment is that the sulfuric acid in the ionic palladium solution of step S4 is replaced by hydrochloric acid; the other steps remain unchanged.

Example fourteen:

the difference between the present embodiment and the first embodiment is that the base material is made of PPO plastic; the steps remain unchanged.

Example fifteen:

the difference between the embodiment and the second embodiment is that the base material is made of PPO plastic; the steps remain unchanged.

Example sixteen:

the difference between the present embodiment and the third embodiment is that the base material is made of PPO plastic; the steps remain unchanged.

Example seventeen:

the difference between the present embodiment and the fourth embodiment is that the base material is made of PPO plastic; the steps remain unchanged.

Example eighteen:

the difference between the embodiment and the fifth embodiment is that the base material is made of PPO plastic; the steps remain unchanged.

Example nineteenth:

the difference between the embodiment and the sixth embodiment is that the base material is made of PPO plastic; the steps remain unchanged.

Example twenty:

the difference between the embodiment and the seventh embodiment is that the base material is made of PPO plastic; the steps remain unchanged.

Example twenty one:

the difference between the embodiment and the eighth embodiment is that the base material is made of PPO plastic; the steps remain unchanged.

Example twenty two:

the difference between the embodiment and the ninth embodiment is that the base material is made of PPO plastic; the steps remain unchanged.

Example twenty three:

the difference between the embodiment and the embodiment ten is that the base material is made of PPO plastic; the steps remain unchanged.

Example twenty-four:

the difference between the embodiment and the eleventh embodiment is that the base material is made of PPO plastic; the steps remain unchanged.

Example twenty-five:

the difference between the present example and the twelfth example is that the base material is made of PPO plastic; the steps remain unchanged.

Example twenty-six:

the difference between the embodiment and the thirteen embodiment is that the base material is made of PPO plastic; the steps remain unchanged.

The antenna elements produced according to the 26 embodiments are numbered together to obtain table one.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention.

Watch 1

Claims

1. A method for manufacturing an antenna element is characterized by comprising the following steps:

s4, activating the vibrator body;

s5, carrying out dispergation or reduction on the vibrator body;

s6, carrying out chemical copper plating on the vibrator body to form a chemical copper layer;

2. The method for manufacturing an antenna element according to claim 1, wherein in step S3, the roughening solution is a roughening salt solution, and the concentration of roughening salt is 150 to 400 g/l; the chemical coarsening time is 5-20 min, and the temperature is 20-45 ℃.

3. The manufacturing method of the antenna oscillator according to claim 1, wherein in step S4, a colloidal palladium solution is used to perform activation treatment on the oscillator body, wherein the solution contains 15-55 ppm of palladium, 150-300 ml/l of hydrochloric acid, and 1-5 g/l of stannous chloride; the activation time is 1-8 min, and the temperature is 20-45 ℃;

in the step S5, a debonding agent solution is adopted to debond the vibrator body, wherein the concentration of the debonding agent in the solution is 10-80 ml/l; the cleaning time is 1-8 min, and the temperature is 30-60 ℃.

4. The method for manufacturing the antenna element according to claim 1, wherein in step S4, the element body is activated by using an ionic palladium solution, wherein the solution contains 20 to 100ppm of palladium and 8 to 50ml/l of sulfuric acid or hydrochloric acid; the activation time is 1-8 min, and the temperature is 20-45 ℃;

5. The method for manufacturing an antenna element according to claim 1, wherein in step S6, the ionic copper solution contains 1 to 5g/l of ionic copper, 5 to 15g/l of free alkali, and 10 to 25ml/l of free formaldehyde; the chemical copper plating time is 5-30 min, and the temperature is 20-35 ℃; in the electroless copper plating process, the concentration of the ionic copper solution is controlled to be 50-150%, and the pH value of the solution is 8-14.

6. The method of claim 1, wherein in step S7, the electroless copper plating layer is laser etched to form a barrier line thereon to separate an electroplated area from an electroless copper plating layer.

7. The method for manufacturing the antenna element according to claim 1, wherein in step S1, PPS plastic or PPO plastic is selected as a raw material; the mechanical roughening in step S2 is to perform sand blasting on the surface of the vibrator body; the electrolytic copper plating treatment described in step S8 is either a coke plating or an acid copper plating.

8. The antenna element manufacturing method according to claim 1, further comprising steps S10 and S11 after step S9, wherein step S10 is a second electrolytic copper plating process, and the electrolytic copper plating process is acid copper plating; step S11 is to add a protection layer on the electroplating region.

9. The method of claim 8, wherein the additional passivation layer of step S11 is plated with tin or silver.

10. An antenna element produced by the production method according to any one of claims 1 to 9.