CN114666715A

CN114666715A - Loudspeaker with FPC and bonding pad integrally formed and assembling method thereof

Info

Publication number: CN114666715A
Application number: CN202210468248.5A
Authority: CN
Inventors: 吕仕涌; 何泽明; 郑佳祥; 林乔郁
Original assignee: Xiamen Tuness Electronic Co ltd
Current assignee: Xiamen Tuness Electronic Co ltd
Priority date: 2022-04-29
Filing date: 2022-04-29
Publication date: 2022-06-24

Abstract

The invention relates to a loudspeaker with an FPC and a bonding pad integrally formed and an assembling method thereof, wherein the loudspeaker comprises: the loudspeaker comprises a lower shell, a vibrating diaphragm, a magnetic circuit system, a voice coil and an FPC (flexible printed circuit); the vibrating diaphragm and the lower shell form a corresponding sound cavity, and the FPC is arranged in the sound cavity; the FPC and the bonding pad are integrally formed, the FPC is electrically connected with the bonding pad, the lower shell is provided with a bonding pad placing position, and the bonding pad is led out from the inside of the sound cavity and fixedly arranged at the bonding pad placing position; the voice coil is electrically connected to the FPC through a voice coil lead led out of the voice coil. This application has changed the structure of traditional speaker, sets up FPC between vibrating diaphragm and lower casing, and vibrating diaphragm, FPC vibration are all followed to voice coil loudspeaker voice coil and voice coil loudspeaker voice coil lead wire, have avoided voice coil loudspeaker voice coil lead wire fatigue, fracture scheduling problem.

Description

Loudspeaker with FPC and bonding pad integrally formed and assembling method thereof

Technical Field

The invention relates to the field of loudspeakers, in particular to a loudspeaker with an integrally formed FPC and a bonding pad and an assembling method thereof.

Background

The loudspeaker is a transducer for converting an electric signal into an acoustic signal, and the performance of the loudspeaker has great influence on the sound quality. The loudspeaker is the weakest component in the sound equipment, and is the most important component for sound effect; portable electronic devices such as portable mobile communication terminal devices, notebook computers, and MP3 players are each provided with a micro speaker module that converts an electrical signal into an audio signal.

Its voice coil loudspeaker voice coil of current speaker follows the vibrating diaphragm vibration, and the voice coil loudspeaker voice coil lead wire that the voice coil loudspeaker voice coil was drawn forth need be connected to FPC or pad, therefore the one end vibration other end of voice coil loudspeaker voice coil lead wire does not vibrate, causes easy fatigue, the fracture of the in-process voice coil loudspeaker voice coil lead wire of speaker work. Meanwhile, the FPC and the pad of the conventional speaker are separated, and the FPC needs to be connected to the pad by a process such as soldering.

The invention aims to design a loudspeaker with an FPC and a bonding pad integrally formed and an assembling method thereof aiming at the problems in the prior art.

Disclosure of Invention

In view of the problems in the prior art, the present invention provides a speaker with an integrated FPC and a pad and an assembling method thereof, which can effectively solve the problems in the prior art.

The technical scheme of the invention is as follows:

a speaker with an FPC and a pad integrally formed, comprising: the loudspeaker comprises a lower shell, a vibrating diaphragm, a magnetic circuit system, a voice coil and an FPC (flexible printed circuit);

the vibrating diaphragm and the lower shell form a corresponding sound cavity, and the FPC is arranged in the sound cavity;

the FPC and the bonding pad are integrally formed, the FPC is electrically connected with the bonding pad, the lower shell is provided with a bonding pad placing position, and the bonding pad is led out from the inside of the sound cavity and fixedly arranged at the bonding pad placing position;

the voice coil is electrically connected to the FPC through a voice coil lead wire led out of the voice coil.

Further, FPC hangs and establishes the up end of casing down, the vibrating diaphragm connect in FPC's up end, the voice coil loudspeaker voice coil fixed set up in FPC's lower terminal surface.

Further, the FPC comprises an outer ring FPC and an inner ring FPC, and the outer ring FPC is hung on the upper end face of the lower shell;

the outer ring of the vibrating diaphragm is fixedly arranged on the upper end face of the outer ring PFC, and the inner ring of the vibrating diaphragm vibrates along with the inner ring FPC.

Further, the inner ring FPC is provided with a plurality of voice coil connecting portions, and the voice coil is electrically connected to the voice coil connecting portions through voice coil lead wires led out of the voice coil.

Further, the pad is connected to the outer ring FPC, and the pad is led out from the outer ring FPC.

Furthermore, the pad placing position is arranged on the lower end face of the lower shell, and the pad is led out from the outer ring FPC, turned over and then fixedly arranged on the pad placing position.

Further, the outer ring FPC and the inner ring FPC are electrically connected through a plurality of cantilevers.

Furthermore, one side of the outer ring FPC, one side of the inner ring FPC and the corresponding cantilever form an S-shaped structure together.

Further, the casing includes base and U cup down, the base including step of stepping down and set up in step outlying outer lane is protruding along stepping down, outer lane FPC's shape with the up end on the protruding edge of outer lane is the same, inner circle FPC's shape is less than the interior concave surface of U cup, it is right to step down the step of stepping down the setting of stepping down is done to the vibration route of cantilever.

Further, there is provided an assembling method of a speaker with an integrated FPC and a pad, for assembling the speaker with an integrated FPC and a pad, comprising the steps of:

fixedly connecting the voice coil to the lower end face of the FPC, and electrically connecting the voice coil to the FPC;

disposing the unfolded FPC on an upper surface of the lower case;

pulling or stretching a bonding pad integrally formed on the FPC to the bonding pad placing position, and fixedly connecting the bonding pad to the bonding pad placing position;

and arranging the vibrating diaphragm cover on the upper end surface of the FPC.

The invention has the advantages that:

the FPC is arranged in the sound cavity, meanwhile, the bonding pad and the FPC are integrally formed, the bonding pad is led out from the part, located in the sound cavity, of the FPC, and the led-out bonding pad is arranged at the bonding pad placing position. The voice coil is electrically connected to the FPC through a voice coil lead 401 from which it is led, for transmitting a digital signal from the pad to the voice coil.

This application has changed the structure of traditional speaker, sets up FPC between vibrating diaphragm and lower casing, and vibrating diaphragm, FPC vibration are all followed to voice coil loudspeaker voice coil and voice coil loudspeaker voice coil lead wire, have avoided voice coil loudspeaker voice coil lead wire fatigue, fracture scheduling problem.

The utility model provides a position set up in the lower terminal surface of casing down is placed to the pad, the pad is followed outer lane FPC draws and turns over a after-fixing set up in the position is placed to the pad, can realize pad and FPC integrated into one piece through this structure.

The assembling method provided by the application reduces the procedure of connecting the bonding pad and the FPC in the assembling process of the traditional loudspeaker, and the PFC and bonding pad are directly pulled, stretched and bent to the bonding pad placing position through an operator or mechanical equipment. The working efficiency is improved.

Drawings

Fig. 1 is a schematic structural diagram of a speaker provided in the present invention.

Fig. 2 is a sectional view B-B of fig. 1.

Fig. 3 is an exploded schematic view of the structure of the speaker provided by the present invention.

Fig. 4 is a schematic structural diagram of the FPC.

Fig. 5 is a schematic structural diagram of a hidden diaphragm of a speaker according to the present invention.

Fig. 6 is a schematic diagram of a back structure of the speaker provided by the present invention.

Fig. 7 is an exploded view of the FPC, base and U-cup.

FIGS. 8-11 are graphs of experimental data results.

Detailed Description

To facilitate understanding of those skilled in the art, the structure of the present invention will now be described in further detail by way of examples in conjunction with the accompanying drawings:

example one

Referring to fig. 1 to 7, a speaker in which an FPC and a pad are integrally formed, includes: the lower shell 1, the diaphragm 2, the magnetic circuit system 3, the voice coil 4 and the FPC 5;

the diaphragm 2 and the lower shell 1 form a corresponding sound cavity, and the FPC5 is arranged in the sound cavity; in this embodiment, the FPC5 is provided in the sound cavity as a component for transmitting an audio signal, and is connected to an audio signal output point of an external circuit through the pad 6, thereby transmitting the audio signal to the FPC5 through the pad 6.

The FPC5 and a pad 6 are integrally formed, the FPC5 is electrically connected with the pad 6, the lower shell 1 is provided with a pad placing position, and the pad 6 is led out from the inside of the sound cavity and fixedly arranged at the pad placing position; in this embodiment, since the FPC5 is disposed inside the sound cavity, and the pad 6 and the FPC5 are integrally formed, the pad 6 is led out from a portion of the FPC5 located inside the sound cavity, and the led pad 6 may be disposed at a pad placement position. The position of the pad placement site may be on the lower end surface of the lower case 1, or may be on the upper end surface of the lower case 1, which is not limited herein.

The voice coil 4 is electrically connected to the FPC5 through a voice coil lead 401 led out therefrom. In this embodiment, the voice coil 4 is a component that receives a digital signal and generates vibration in cooperation with the magnetic circuit system 3, and the voice coil 4 receives the digital signal from the FPC5 through the voice coil lead 401.

The above is the most basic composition of the present embodiment. The optimization direction of the present embodiment is described below.

Further, the FPC5 is hung on the upper end surface of the lower housing 1, the diaphragm 2 is connected to the upper end surface of the FPC5, and the voice coil 4 is fixedly disposed on the lower end surface of the FPC 5. The voice coil 4 may be attached to the lower end face of the FPC5 by means of gluing, and the diaphragm 2 may be attached to the upper end face of the FPC by means of gluing. In a conventional speaker, a diaphragm is hung on an upper end surface of a lower housing. This embodiment has changed the structure of traditional speaker, sets up FPC5 between vibrating diaphragm 2 and lower casing 1, and voice coil 4 and voice coil lead wire 401 thereof all follow vibrating diaphragm 2, FPC5 vibration. Because the voice coil lead wire is connected between the bonding pad and the voice coil in the traditional structure, one end of the voice coil lead wire vibrates while the other end of the voice coil lead wire is fixed, and the defects that the voice coil lead wire is easy to fatigue, break and the like are caused. This problem can be avoided well by the present application.

Further, the FPC5 includes an outer FPC501 and an inner FPC502, and the outer FPC501 is hung on the upper end surface of the lower housing 1;

the outer ring of the diaphragm 2 is fixedly arranged on the upper end surface of the outer ring PFC501, and the inner ring of the diaphragm 2 vibrates along with the inner ring FPC 502.

Further, the inner FPC502 is provided with a plurality of voice coil connection portions 504, and the voice coil 4 is electrically connected to the voice coil connection portions 504 through voice coil leads 401 led out of the voice coil connection portions.

Further, the pad 6 is connected to the outer ring FPC501, and the pad 6 is led out from the outer ring FPC 501.

Further, the pad placing position is arranged on the lower end face of the lower shell 1, and the pad 6 is led out from the outer ring FPC501, folded and then fixedly arranged on the pad placing position. In this embodiment, the pad placement position is disposed on the lower end surface of the lower housing 1, and the FPC5 is disposed on the upper end surface of the lower housing 1, so that the led-out pad 6 needs to be folded and then connected to the lower end surface of the lower housing 1. In other embodiments, the pad placement site may be placed at other positions, and the pad 6 is led out and then placed at the position.

Further, the outer FPC501 and the inner FPC502 are electrically connected by a plurality of cantilevers 503. One side of the outer ring FPC501, one side of the inner ring FPC502 and the corresponding cantilever 503 form an S-shaped structure together. In this embodiment, the cantilever 503 is connected between one side of the outer FPC501 and one side of the inner FPC502 in a diagonal manner, so as to form an S-shaped structure, which can provide a support for the inner FPC502 and also provide a vibration elastic structure for the inner FPC 502. The longer the cantilever 504, the less stressed the FPC5 at the same displacement.

Further, referring to fig. 7, the lower housing 1 includes a base 101 and a U cup 102, the base 101 includes an abdicating step 1011 and is disposed on the outer ring convex edge 1012 on the periphery of the abdicating step 1011, the shape of the outer ring FPC501 is the same as the upper end surface of the outer ring convex edge 1012, the shape of the inner ring FPC502 is smaller than the inner concave surface of the U cup 102, the abdicating step 1011 is right the vibration path of the cantilever 503 is abdicating.

In this embodiment, the upper end surface of the outer ring convex edge 1012 is rectangular, and is not provided with any arrangement such as concave or abdicating, and the outer ring FPC501 and the outer ring convex edge 1012 have the same shape, and are also rectangular with equal area, equal length, and equal width. The advantage of doing so is that can enlarge the area of FPC5 as far as possible, because FPC5 plays the effect of connecting voice coil and vibrating diaphragm in this embodiment, the elastic force that can provide is more sufficient more playing the area to the bigger, and the setting of stepping down is made a way to the vibration path of cantilever 503 to the step 1011, can effectively prevent FPC5 vibration in-process touch other parts and thus arouse the roll vibration. In the existing speaker, the FPC5 and the pad 6 are often located on the same horizontal plane, so that in order to prevent the FPC5 from colliding with the pad 6 in the vibration process, the FPC5 needs to be set at a position close to the pad 6 by abdicating, the area of the FPC5 is sacrificed, and the elastic force provided by the FPC5 is further reduced. The solder pads 6 and the FPC5 of the present application are not located on the same horizontal plane, and the FPC5 is located on the upper end surface of the outer convex edge 1012, and the FPC5 may be located in the same area as the outer convex edge 1012, or may be regarded as being located in the same area as the maximum cross section of the lower case.

Further, there is provided an assembling method of a speaker with an integrated FPC and a pad, for assembling the speaker with an integrated FPC and a pad, comprising the steps of: it should be noted that the steps in this embodiment may not be performed sequentially.

S1, fixedly connecting the voice coil to the lower end face of the FPC, and electrically connecting the voice coil to the FPC; in this step, the voice coil is fixedly connected to the lower end face of the inner ring FPC of the FPC.

S2, disposing the unfolded FPC on the upper surface of the lower case; in this step, the unassembled FPC and the bonding pad are in an unfolded shape on the same plane, and the FPC is extended and connected to the bonding pad. At this time, the outer ring FPC of the FPC is bonded to the edge of the upper end face of the lower housing.

S3, pulling or stretching the bonding pad integrally formed on the FPC to the bonding pad placing position, and fixedly connecting the bonding pad to the bonding pad placing position; in this embodiment, FPC sets up in the up end of casing down, and the pad is placed the position and is set up in the lower terminal surface of casing down, then need turn over the pad from the up end tractive of casing down after rolling over, along the outward flange of casing down the crease of rolling over to turn over the back pad and place in the pad and place the position, thereby rigid coupling or welding pad set up its fixedly in the pad and place the position.

And S4, covering the diaphragm on the upper end face of the FPC.

Experimental data

Referring to fig. 8 to 11, fig. 8 is a sound generation simulation data diagram obtained by the speaker provided in the first embodiment, wherein the shape of the outer FPC is the same as the upper end surface of the outer ledge, fig. 9 is a sound generation simulation data diagram of the speaker without the FPC interposed between the diaphragm and the lower case, fig. 10 is a sound generation simulation data diagram obtained by the speaker provided in the first embodiment and only shows experimental data of the FPC and the voice coil, and fig. 11 is a sound generation simulation data diagram of the speaker without the FPC interposed between the diaphragm and the lower case and only shows the voice coil. It can be seen that the maximum deviation of the sound simulation obtained by the speaker provided in the first embodiment is 3.1mm, and the maximum deviation of the sound simulation of the speaker without the FPC between the diaphragm and the lower housing is 3.7 mm. This application passes through FPC and pad integrated into one piece's structure, sets up the connecting wire of FPC and pad in the outside of casing down, vacates the inside space that originally sets up the structure of connecting wire of casing down, enlarges FPC's area as far as possible simultaneously and makes its and the up end of casing down, the area of vibrating diaphragm be the same completely, plays biggest support, elastic action to the vibrating diaphragm, thereby reduces the vibrating diaphragm skew improvement sound production effect of sound production in-process.

Through the steps, the method reduces the procedure of connecting the bonding pad and the FPC in the traditional loudspeaker assembling process, and the connection position of the PFC and the bonding pad is directly pulled, stretched and bent to the bonding pad placing position through an operator or mechanical equipment. The working efficiency is improved.

It should be noted that in the claims, any reference signs placed between parentheses shall not be construed as limiting the claim. The word "comprising" does not exclude the presence of elements or steps not listed in a claim. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. The invention may be implemented by means of hardware comprising several distinct elements, and by means of a suitably programmed computer. In the unit claims enumerating several means, several of these means may be embodied by one and the same item of hardware. The usage of the words first, second and third, etcetera do not indicate any ordering. These words may be interpreted as names.

While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all such alterations and modifications as fall within the scope of the invention.

It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above should not be understood to necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

The above description is only a preferred embodiment of the present invention, and all equivalent changes and modifications made in accordance with the claims of the present invention should be covered by the present invention.

Claims

1. The utility model provides a FPC and pad integrated into one piece's speaker which characterized in that: the method comprises the following steps: the loudspeaker comprises a lower shell, a vibrating diaphragm, a magnetic circuit system, a voice coil and an FPC (flexible printed circuit);

2. A speaker having an FPC and a bonding pad integrally formed as claimed in claim 1, wherein: FPC hangs to be located the up end of casing down, the vibrating diaphragm connect in FPC's up end, the voice coil loudspeaker voice coil fix set up in FPC's lower terminal surface.

3. A speaker having an FPC and a bonding pad integrally formed as claimed in claim 2, wherein: the FPC comprises an outer ring FPC and an inner ring FPC, and the outer ring FPC is hung on the upper end face of the lower shell;

4. A speaker having an FPC and a bonding pad integrally formed as claimed in claim 2, wherein: the inner ring FPC is provided with a plurality of voice coil connecting portions, and the voice coil is electrically connected to the voice coil connecting portions through voice coil lead wires led out of the voice coil.

5. A speaker having an FPC and a bonding pad integrally formed as claimed in claim 2, wherein: the welding disc is connected to the outer ring FPC and led out from the outer ring FPC.

6. A speaker with an integrated FPC and a pad according to claim 5, wherein: the welding disc placing position is arranged on the lower end face of the lower shell, and the welding disc is led out from the outer ring FPC, turned over and then fixedly arranged on the welding disc placing position.

7. A speaker having an FPC and a solder pad integrally formed as claimed in claim 2, wherein: the outer ring FPC and the inner ring FPC are electrically connected through a plurality of cantilevers.

8. A speaker with an integrated FPC and solder pad as claimed in claim 7, wherein: one side of the outer ring FPC, one side of the inner ring FPC and the corresponding cantilever form an S-shaped structure together.

9. A speaker having an FPC and a bonding pad integrally formed as claimed in claim 7, wherein: the lower casing includes base and U cup, the base including step of stepping down and set up in step outlying outer lane is protruding along, outer lane FPC's shape with the up end on the protruding edge of outer lane is the same, inner circle FPC's shape is less than the interior concave surface of U cup, it is right to step down the step the setting of stepping down is done to the vibration route of cantilever.

10. A method of assembling a speaker in which an FPC and a land are integrally formed, for assembling a speaker in which an FPC and a land are integrally formed as claimed in any one of claims 1 to 9, wherein: the method comprises the following steps:

disposing the unfolded FPC on an upper surface of the lower case;