CN114661124A - Heat dissipation device and heat dissipation module thereof - Google Patents
Heat dissipation device and heat dissipation module thereof Download PDFInfo
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- CN114661124A CN114661124A CN202210302323.0A CN202210302323A CN114661124A CN 114661124 A CN114661124 A CN 114661124A CN 202210302323 A CN202210302323 A CN 202210302323A CN 114661124 A CN114661124 A CN 114661124A
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- heat exchange
- liquid
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- pipe
- heat dissipation
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 61
- 239000007788 liquid Substances 0.000 claims abstract description 104
- 239000000110 cooling liquid Substances 0.000 claims abstract description 41
- 239000002826 coolant Substances 0.000 claims abstract description 6
- 239000000706 filtrate Substances 0.000 claims description 14
- 238000007789 sealing Methods 0.000 claims description 5
- 239000012809 cooling fluid Substances 0.000 claims description 3
- 238000001816 cooling Methods 0.000 abstract description 22
- 239000012530 fluid Substances 0.000 abstract description 13
- 238000000034 method Methods 0.000 abstract description 4
- 230000008569 process Effects 0.000 abstract description 3
- 238000012546 transfer Methods 0.000 abstract description 3
- 230000009471 action Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000007654 immersion Methods 0.000 description 4
- 238000005507 spraying Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 239000005341 toughened glass Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The application discloses a heat dissipation device and a heat dissipation module thereof, wherein the heat dissipation module comprises an annular pipeline, a plurality of shunt pipelines and an auxiliary heat exchange unit, the annular pipeline is arranged in a first plane, and the annular pipeline is used for allowing cooling liquid to circulate in the first plane; the plurality of shunt pipelines are arranged on the annular pipeline and connected with the annular pipeline, the plurality of shunt pipelines are used for shunting cooling liquid, and any shunt pipeline is provided with a nozzle; the auxiliary heat exchange unit is arranged in the second plane and connected with the annular pipeline, and the auxiliary heat exchange unit is used for allowing cooling liquid to flow in the second plane. Among the above-mentioned heat dissipation module, some coolant liquid carries out the hydrojet cooling through setting up a plurality of branch liquid pipelines on the ring conduit to this cools off the heat in server chip place region, and partly process supplementary heat transfer unit for the fluid of supplementary cooling server local edge can eliminate blind spot and local hot hidden danger like this, furthest improves heat exchange efficiency and system reliability.
Description
Technical Field
The application relates to the technical field of servers, in particular to a heat dissipation module. The application also relates to a heat dissipation device with the heat dissipation module.
Background
At present, with the rapid development of mobile data, cloud computing and big data services, the heat dissipation capacity of a server is larger and larger, and the demand for energy conservation of a data center is gradually highlighted. In recent years, a plurality of new energy-saving technologies appear, and the generation of a direct immersion type liquid cooling server technology adopting an electronic refrigerant technology has the advantages of high availability, high density, ultra-low PUE and the like, and is receiving more and more attention in the industry.
In the prior art, the full immersion liquid cooling is to directly immerse the server in the cooling liquid, and the heat generated by the operation of equipment such as the server and the like is taken away by depending on the flowing circulation of the liquid, so that the noise is lower and the energy is more saved compared with cold plate type liquid cooling. However, in the conventional immersion type liquid cooling method, when the servers are installed in the liquid cooling device, the cooling effect of the servers at the two ends is good, and the heat dissipation of the server in the central area is poor, especially when the server in the central area is locally overheated, the server nodes cannot be rapidly cooled.
Disclosure of Invention
The application aims at providing a heat dissipation module, which can quickly dissipate heat of hot spots of a server and locally assist the heat dissipation of the server, so that the heat dissipation efficiency and the system reliability of the server are improved. Another objective of the present application is to provide a heat dissipation device including the heat dissipation module.
In order to achieve the above object, the present application provides a heat dissipation module for dissipating heat of a server, including:
the annular pipeline is arranged in a first plane and is used for circulating cooling liquid in the first plane;
the plurality of shunting pipelines are arranged on the annular pipeline, connected with the annular pipeline and used for shunting the cooling liquid, and any shunting pipeline is provided with a nozzle;
and the auxiliary heat exchange unit is arranged in a second plane, is connected with the annular pipeline and is used for allowing the cooling liquid to flow in the second plane.
Optionally, the central area of the annular pipeline is provided with a first nozzle on the flow dividing pipeline, the central area of the annular pipeline is provided with second nozzles on the flow dividing pipelines on two sides of the flow dividing pipeline, and the first nozzle is different from the second nozzle.
Optionally, first spout is equipped with the vortex device, the vortex device includes a plurality of vortex blades, and is a plurality of the vortex blade is located the exit of first spout.
Optionally, the second spout tapers in a direction away from the shunt line.
Optionally, the plurality of branch pipes are arranged in parallel and at equal intervals on the inner side of the annular pipe.
Optionally, the auxiliary heat exchange unit comprises an auxiliary heat exchange liquid inlet pipe, an auxiliary heat exchange liquid distribution pipe, an auxiliary heat exchange pipe and an auxiliary heat exchange liquid collection pipe;
the auxiliary heat exchange liquid inlet pipe is connected with the annular pipeline so that the cooling liquid can flow into the auxiliary heat exchange liquid separating pipe;
the auxiliary heat exchange liquid dividing pipe is connected with a plurality of auxiliary heat exchange pipes so that the cooling liquid is distributed to the plurality of auxiliary heat exchange pipes;
the auxiliary heat exchange liquid collecting pipe is connected with a plurality of auxiliary heat exchange pipes so as to collect the heat-exchanged cooling liquid;
the heat dissipation module further comprises a return pipe, and the return pipe is connected with the auxiliary heat exchange liquid collecting pipe to allow the cooling liquid to flow out of the auxiliary heat exchange unit.
Optionally, the method further comprises:
the liquid inlet pipeline is connected with the annular pipeline;
and the liquid outlet pipeline is connected with the return pipe.
Optionally, the liquid level controller further comprises a filtrate tank, the filtrate tank is arranged on the return pipe, and the liquid outlet pipeline is connected to the filtrate tank.
Optionally, the liquid inlet pipeline, the liquid outlet pipeline, the auxiliary heat exchange unit, the return pipe and the filtrate tank are all provided with two liquid inlet pipelines, and the two liquid inlet pipelines are symmetrically distributed at two ends of the annular pipeline.
The present application further provides a heat dissipation apparatus, including any one of the above heat dissipation modules, further including:
the box body is used for accommodating the heat dissipation module;
and the top cover is connected with the box body and used for sealing the box body.
Compared with the background art, the heat dissipation module provided by the embodiment of the application is used for dissipating heat of a server, and comprises an annular pipeline, a plurality of shunt pipelines and an auxiliary heat exchange unit, wherein the annular pipeline is arranged in a first plane and is used for circulating cooling liquid in the first plane; the plurality of shunt pipelines are arranged on the annular pipeline and connected with the annular pipeline, the plurality of shunt pipelines are used for shunting cooling liquid, and meanwhile, any one shunt pipeline is provided with a nozzle which is used for outwards spraying the cooling liquid so as to dissipate heat of hot spots of a server; the auxiliary heat exchange unit is arranged in the second plane and connected with the annular pipeline, and the auxiliary heat exchange unit is used for allowing cooling liquid to flow in the second plane so as to assist the local heat dissipation of the server. That is to say, above-mentioned heat dissipation module, on the one hand, through the annular pipeline with a plurality of reposition of redundant personnel pipelines that are equipped with the spout to the quick heat dissipation of the hot area hotspot of server, on the other hand, through the supplementary heat transfer unit to the supplementary heat dissipation of the part of server. Compare in the not good submergence formula liquid cooling mode of traditional cooling effect, among the heat dissipation module that this application embodiment provided, some coolant liquid carries out the hydrojet cooling through setting up a plurality of branch liquid pipelines on the ring conduit to this cools off the heat in server chip place region, and partly process supplementary heat transfer unit is used for the fluid of supplementary cooling server local edge, can eliminate dead zone and local hot hidden danger like this, furthest improves heat exchange efficiency and system reliability.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, it is obvious that the drawings in the following description are only embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a heat dissipation module in an embodiment of the present application;
FIG. 2 is an enlarged view of portion A of FIG. 1;
FIG. 3 is an enlarged view of portion B of FIG. 1;
fig. 4 is a schematic structural diagram of a heat dissipation device in an embodiment of the present application.
Wherein:
1-a heat dissipation device,
100-a heat dissipation module,
101-liquid inlet pipeline,
102-ring pipeline,
103-a flow dividing pipeline, 1031-a first nozzle, 1032-a second nozzle, 1033-a flow disturbing device,
104-auxiliary heat exchange unit, 1041-auxiliary heat exchange liquid inlet pipe, 1042-auxiliary heat exchange liquid separating pipe, 1043-auxiliary heat exchange pipe, 1044-auxiliary heat exchange liquid collecting pipe,
105-a return pipe,
106-filtrate box,
107-liquid outlet pipeline,
200-a box body,
And a 300-U mark.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In order to enable those skilled in the art to better understand the scheme of the present application, the present application will be described in further detail with reference to the accompanying drawings and the detailed description.
It should be noted that the following directional terms such as "upper end, lower end, left side, right side" and the like are defined based on the drawings of the specification.
Referring to fig. 1 to 4, fig. 1 is a schematic structural diagram of a heat dissipation module in an embodiment of the present application; FIG. 2 is an enlarged view of portion A of FIG. 1; FIG. 3 is an enlarged view of portion B of FIG. 1; fig. 4 is a schematic structural diagram of a heat dissipation device in an embodiment of the present application.
The heat dissipation module 100 provided in the embodiment of the present application is configured to dissipate heat of a server, where the heat dissipation module 100 includes an annular pipeline 102, a plurality of branch pipelines 103, and an auxiliary heat exchange unit 104, where the annular pipeline 102 is disposed in a first plane, and the annular pipeline 102 is configured to allow a cooling liquid to circulate in the first plane; the plurality of shunt pipelines 103 are arranged on the annular pipeline 102, the plurality of shunt pipelines 103 are connected with the annular pipeline 102, the plurality of shunt pipelines 103 are used for shunting cooling liquid, and meanwhile, any one shunt pipeline 103 is provided with a nozzle which is used for outwards spraying the cooling liquid so as to dissipate heat of a hot spot of a hot area of the server; the auxiliary heat exchange unit 104 is disposed in the second plane, the auxiliary heat exchange unit 104 is connected to the annular pipeline 102, and the auxiliary heat exchange unit 104 is configured to allow a cooling liquid to flow in the second plane to assist the local part of the server in heat dissipation.
The first plane and the second plane may preferably be two planes perpendicular to each other. For example, the first plane may be set as an XY plane as shown in fig. 1, and the second plane may be set as an XZ plane as shown in fig. 1.
The heat dissipation module 100, on one hand, rapidly dissipates heat to a hot spot of a hot area of a server through the annular pipeline 102 and the plurality of branch pipelines 103 provided with the nozzles, and on the other hand, locally assists in dissipating heat to the server through the auxiliary heat exchange unit 104.
The hot spot of the server is a position close to the chip in the server, and the heating condition of the chip position is particularly serious when the server runs, so that the local position where the chip is arranged in the server is rapidly radiated in a targeted manner, and the cooling efficiency of the server is improved.
Compared with an immersion type liquid cooling mode with a poor cooling effect in the prior art, in the heat dissipation module 100 provided by the embodiment of the application, a part of cooling liquid is subjected to liquid spraying cooling through the liquid distribution pipelines arranged on the annular pipeline 102, so that heat of the area where the server chip is located is cooled, and a part of cooling liquid passes through the auxiliary heat exchange unit 104 and is used for assisting in cooling fluid at the local edge of the server, so that dead zones and local hot spot hidden dangers can be eliminated, and the heat exchange efficiency and the system reliability are improved to the maximum extent.
In this embodiment, the heat dissipation module 100 further includes two liquid inlet pipes 101, and the two liquid inlet pipes 101 are symmetrically connected to two ends of the annular pipe 102.
In this way, the cooling liquid may enter the loop 102 through the liquid inlet pipes 101 on both sides, a part of the cooling liquid is cooled by spraying liquid through the nozzles on the liquid distribution pipes, and a part of the cooling liquid passes through the auxiliary heat exchange unit 104 to assist in cooling the fluid at the local edge of the server.
It can be understood that the annular pipeline 102 connected with the liquid inlet pipeline 101 can form a liquid inlet ring network, the annular pipeline 102 can be made of stainless steel, the annular pipeline 102 is welded with the liquid inlet pipelines 101 on two sides, the annular pipeline 102 can be used for equalizing pressure of fluid of the system, and meanwhile, the two liquid inlet pipelines 101 are arranged, so that the reliability of the system can be improved; in addition, a plurality of shunt pipelines 103 are designed on the annular pipeline 102, the shunt pipelines 103 are rectangular stainless steel shunt pipelines 103, the shunt pipelines 103 can shunt the cooling liquid in the annular pipeline 102, and meanwhile, the filling amount of the internal cooling liquid can be reduced, and the cost is reduced.
Preferably, the plurality of branch pipes 103 are arranged in parallel and at equal intervals inside the annular pipe 102, for example, 10 branch pipes 103 may be sequentially arranged in the inner annular cavity of the annular pipe 102 from left to right along the X direction shown in fig. 1, each branch pipe 103 is provided with a plurality of nozzles, and the nozzles on any branch pipe 103 are arranged at equal intervals along the Y axis direction shown in fig. 1.
It should be noted that the ports on the diversion line 103 are different at different locations. Specifically, a first nozzle 1031 is arranged on the branch line 103 located in the central region of the annular line 102, and second nozzles 1032 are arranged on the branch lines 103 located at two sides of the branch line 103 located in the central region of the annular line 102, and the first nozzle 1031 and the second nozzles 1032 are different.
Of course, according to actual requirements, the first nozzle 1031 is provided on two/four mutually adjacent branch lines 103 in the central region of the ring line 102, and the second nozzle 1032 is provided on the remaining branch lines 103.
Specifically, the first nozzle 1031 is provided with a spoiler 1033, the spoiler 1033 includes a plurality of spoiler blades, and the spoiler blades are disposed at an outlet of the first nozzle 1031; the second nozzle 1032 tapers in a direction away from the flow splitting conduit 103.
That is to say, a plurality of second spouts 1032 which are gradually reduced in the direction close to the outlet are arranged on the branch pipes 103 near the left and right sides of the heat dissipation module 100, and the second spouts 1032 on any pipe are uniformly arranged; meanwhile, the branch lines 103 in the central region of the ring line 102 are provided with first nozzles 1031 with turbulators 1033, and the first nozzles 1031 on any one line are uniformly arranged.
Of course, the turbulators 1033 are a plurality of turbulators fixed at the exit of the nozzle. Therefore, the turbulence blades can rotate rapidly under the action of fluid power, so that the disturbance of outlet cooling liquid can be strengthened, and the heat exchange of the central area of the server is strengthened.
Thus, after the cooling liquid enters the annular pipeline 102 through the liquid inlet pipelines 101 on both sides, the cooling liquid enters the respective branch pipelines 103 respectively, the pipelines close to both sides have large jet speed due to the arrangement of the tapered second nozzles 1032, the liquid cooling servers on both sides can be cooled rapidly, meanwhile, the pipeline resistance is also large due to the action of the nozzles, the first nozzle resistance 1031 with the turbulence device 1033 is small, so that more cooling liquid can enter the branch pipelines 103 in the central area, under the action of the turbulence device 1033, the cooling liquid with the turbulence can be rapidly sprayed out to cool the liquid cooling servers in the central area, and therefore the problem that local hot spots occur in the liquid cooling servers in the central area is solved.
In this embodiment, the auxiliary heat exchange unit 104 includes an auxiliary heat exchange liquid inlet pipe 1041, an auxiliary heat exchange liquid separating pipe 1042, an auxiliary heat exchange pipe 1043, and an auxiliary heat exchange liquid collecting pipe 1044; wherein, the auxiliary heat exchange liquid inlet pipe 1041 is connected with the annular pipeline 102, so that the cooling liquid flows into the auxiliary heat exchange liquid distribution pipe 1042; the auxiliary heat exchange liquid distribution pipe 1042 is connected with a plurality of auxiliary heat exchange pipes 1043 for distributing cooling liquid to the plurality of auxiliary heat exchange pipes 1043; the auxiliary heat exchange liquid collecting pipe 1044 is connected with the plurality of auxiliary heat exchange pipes 1043 to collect the heat exchanged coolant; in addition, the heat dissipation module 100 further includes a return pipe 105, and the return pipe 105 is connected to the auxiliary heat exchange header 1044 for the cooling liquid to flow out of the auxiliary heat exchange unit 104.
Certainly, according to actual heat dissipation needs, two auxiliary heat exchange units 104 are arranged, and the two auxiliary heat exchange units 104 are respectively arranged on the front side and the rear side of the server. The temperature of the fluid on the front side and the rear side of the server is reduced under the action of the auxiliary heat exchange unit 104, so that the fluid on the two sides is prevented from being locally overheated.
Specifically, the auxiliary heat exchange liquid inlet pipe 1041 is connected to a pipe portion arranged along the X-axis direction on the annular pipe 102, the pipe portion arranged along the X-axis direction on the annular pipe 102 is connected to a plurality of auxiliary heat exchange liquid inlet pipes 1041, any one of the auxiliary heat exchange liquid inlet pipes 1041 is arranged along the Z-axis direction, that is, any one of the auxiliary heat exchange liquid inlet pipes 1041 is vertically connected to the annular pipe 102; the auxiliary heat exchange liquid distributing pipe 1042 is arranged along the X-axis direction, the auxiliary heat exchange liquid distributing pipe 1042 is connected with an auxiliary heat exchange liquid inlet pipe 1041, the auxiliary heat exchange liquid distributing pipe 1042 is used for distributing partial liquid inlet of the annular pipeline 102 into a plurality of auxiliary heat exchange pipes 1043 after pressure equalization, the auxiliary heat exchange pipes 1043 are arranged along the Z-axis direction, the temperature of fluid on the front side and the rear side of the server is reduced under the action of the auxiliary heat exchange pipes 1043, and therefore local overheating of the fluid on the front side and the rear side of the server is prevented, and the auxiliary heat exchange pipes 1043 are arranged at equal intervals in any auxiliary heat exchange unit 104; the auxiliary heat exchange liquid collecting tubes 1044 are arranged along the X-axis direction, the auxiliary heat exchange liquid collecting tubes 1044 are connected with the auxiliary heat exchange tubes 1043, the auxiliary heat exchange liquid collecting tubes 1044 are used for equalizing the pressure of the cooling liquid after heat exchange again, and then the auxiliary heat exchange liquid collecting tubes 1044 are connected with the return tubes 105 along the Y-axis direction.
In addition, the heat dissipation module 100 further includes two liquid outlet pipes 107, two liquid outlet pipes 107 are disposed, the front and rear return pipes 105 are connected to the liquid outlet pipes 107 on both sides, and the cooling liquid in the return pipes 105 flows out through the liquid outlet pipes 107.
In this embodiment, the heat dissipation module 100 further includes two filtrate boxes 106, the two filtrate boxes 106 are respectively disposed on the return pipes 105 at two sides, and the liquid outlet pipe 107 is connected to the filtrate boxes 106. For example, the inlet of the filtrate tank 106 is connected to the return pipe 105, and the outlet of the filtrate tank 106 is connected to the outlet pipe 107. The filtrate tank 106 is provided with a plurality of mesh openings for filtering impurities in the fluid and also facilitating the fluid to enter the next module.
The heat dissipation device 1 provided by the present application includes the heat dissipation module 100 described in the above embodiment, and the heat dissipation device 1 further includes a box 200 and a top cover, wherein the box 200 is used for accommodating the heat dissipation module 100; the top cover is connected to a cabinet 200, and the cabinet 200 contains a cooling fluid for submerging the servers.
It should be noted that the main body of the box 200 is formed by welding stainless steel materials, and the left and right ends of the main body are correspondingly provided with a liquid inlet and a liquid outlet, which are respectively a first liquid inlet and a first liquid outlet, and a second liquid inlet and a second liquid outlet, which are two inlets and two outlets, the liquid inlet pipeline 101 is arranged at the lower part of the box 200, the liquid outlet pipeline 107 is arranged at the upper part of the box 200, the liquid inlet pipeline 101 is adapted to the liquid inlet, and the liquid outlet pipeline 107 is adapted to the liquid outlet. Connecting flanges are arranged at the external interface of the liquid inlet pipeline 101 and the liquid outlet pipeline 107. A plurality of wiring holes are formed in the upper end of the main body of the box body 200, wiring is facilitated, and sealing rings are adopted for sealing.
In addition, the top cover is made of tempered glass, so that the top cover not only can play a role in sealing, but also can be beneficial to observing the operation conditions of equipment and fluid in the box body 200.
In order to fix the server, two standard U-tags 300 are welded to the end of the box 200, and the U-tags 300 are used for fixing the server device.
To sum up, in the heat abstractor 1 that this application embodiment provided, the coolant liquid gets into annular pipeline 102 respectively through the feed liquor pipeline 101 of both sides, and partly coolant liquid carries out the hydrojet cooling through the reposition of redundant personnel pipeline 103 that sets up on annular pipeline 102 to this cools off the heat in server chip place region, and partly process supplementary heat exchange unit 104 for the fluid of supplementary cooling server local edge eliminates dead zone and local hot spot hidden danger, furthest improves heat exchange efficiency and system reliability.
It is noted that, in this specification, relational terms such as first and second, and the like are used solely to distinguish one entity from another entity without necessarily requiring or implying any actual such relationship or order between such entities.
The heat dissipation device and the heat dissipation module thereof provided by the present application are described in detail above. The principle and the implementation of the present application are explained herein by using specific examples, and the above descriptions of the examples are only used to help understand the scheme and the core idea of the present application. It should be noted that, for those skilled in the art, it is possible to make several improvements and modifications to the present application without departing from the principle of the present application, and such improvements and modifications also fall within the scope of the claims of the present application.
Claims (10)
1. A heat sink module (100) for a server to dissipate heat, comprising:
-an annular line (102) arranged in a first plane for circulating a cooling fluid in said first plane;
the plurality of shunting pipelines (103) are arranged on the annular pipeline (102), connected with the annular pipeline (102) and used for shunting the cooling liquid, and any shunting pipeline (103) is provided with a nozzle;
and the auxiliary heat exchange unit (104) is arranged in a second plane and connected with the annular pipeline (102) and is used for allowing the cooling liquid to flow in the second plane.
2. The heat dissipation module (100) according to claim 1, wherein a first nozzle (1031) is disposed on the branch line (103) in the central region of the annular line (102), a second nozzle (1032) is disposed on the branch line (103) on both sides of the branch line (103) in the central region of the annular line (102), and the first nozzle (1031) and the second nozzle (1032) are different.
3. The heat dissipation module (100) of claim 2, wherein the first nozzle (1031) is provided with a flow perturbation device (1033), the flow perturbation device (1033) comprises a plurality of flow perturbation blades, and the plurality of flow perturbation blades are provided at an outlet of the first nozzle (1031).
4. The thermal module (100) of claim 2 wherein the second nozzle (1032) tapers away from the shunt conduit (103).
5. The heat dissipation module (100) of claim 1, wherein the plurality of shunt pipes (103) are arranged in parallel and at equal intervals inside the ring pipe (102).
6. The heat dissipation module (100) of any of claims 1-5, wherein the auxiliary heat exchange unit (104) comprises an auxiliary heat exchange liquid inlet pipe (1041), an auxiliary heat exchange liquid distribution pipe (1042), an auxiliary heat exchange pipe (1043) and an auxiliary heat exchange liquid collection pipe (1044);
the auxiliary heat exchange liquid inlet pipe (1041) is connected with the annular pipeline (102) so as to allow the cooling liquid to flow into the auxiliary heat exchange liquid distribution pipe (1042);
the auxiliary heat exchange liquid distribution pipe (1042) is connected with a plurality of auxiliary heat exchange pipes (1043) so that the cooling liquid is distributed to the plurality of auxiliary heat exchange pipes (1043);
the auxiliary heat exchange liquid collecting pipe (1044) is connected with a plurality of auxiliary heat exchange pipes (1043) so as to collect the cooling liquid after heat exchange;
the heat dissipation module (100) further comprises a return pipe (105), and the return pipe (105) is connected with the auxiliary heat exchange header pipe (1044) so as to allow the coolant to flow out of the auxiliary heat exchange unit (104).
7. The heat dissipation module (100) of claim 6, further comprising:
a liquid inlet pipe (101) connected to the annular pipe (102);
and the liquid outlet pipeline (107) is connected with the return pipe (105).
8. The heat dissipation module (100) of claim 7, further comprising a filtrate tank (106), wherein the filtrate tank (106) is disposed on the return pipe (105), and the liquid outlet pipe (107) is connected to the filtrate tank (106).
9. The heat dissipation module (100) of claim 8, wherein two liquid inlet pipes (101), two liquid outlet pipes (107), two auxiliary heat exchange units (104), two liquid return pipes (105), and two liquid filter boxes (106) are disposed, and the two liquid inlet pipes (101) are symmetrically distributed at two ends of the annular pipe (102).
10. A heat sink (1) comprising the heat sink module (100) according to any one of claims 1-9, further comprising:
a box body (200) for accommodating the heat dissipation module (100);
a top cover connected to the case (200) for sealing the case (200).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210302323.0A CN114661124A (en) | 2022-03-25 | 2022-03-25 | Heat dissipation device and heat dissipation module thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210302323.0A CN114661124A (en) | 2022-03-25 | 2022-03-25 | Heat dissipation device and heat dissipation module thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114661124A true CN114661124A (en) | 2022-06-24 |
Family
ID=82031142
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210302323.0A Withdrawn CN114661124A (en) | 2022-03-25 | 2022-03-25 | Heat dissipation device and heat dissipation module thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114661124A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115175547A (en) * | 2022-08-26 | 2022-10-11 | 苏州浪潮智能科技有限公司 | Immersed liquid cooling device |
-
2022
- 2022-03-25 CN CN202210302323.0A patent/CN114661124A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115175547A (en) * | 2022-08-26 | 2022-10-11 | 苏州浪潮智能科技有限公司 | Immersed liquid cooling device |
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