CN114660100A - Edge fuzzy defect characteristic reinforced amplification inspection method - Google Patents

Abstract

The invention discloses a method for enhanced magnification inspection of edge-blurred defect features. First, an X-ray reflection detection camera is used to photograph a flexible integrated circuit substrate to be inspected, and then an adaptive median filter is used to eliminate defect-free welding seam areas and background areas. Then, the boundary extraction algorithm of the blur enhanced image is used to make the edges of the edge fuzzy defect features clear and enhanced, and then the enhanced and enlarged edge blur defect features are integrated into a defect pattern and stored in the processing terminal. The line scan camera scans the surface of the flexible integrated circuit substrate to obtain a high-definition picture, and superimposes it with the defect pattern to obtain a high-definition picture of the surface of the flexible integrated circuit substrate marked with the defect position. Finally, it is projected and overlapped with the body to complete the blurring of the upper edge of the body. Detailed marking of defect-like features, the present invention has the advantage of providing an inspection method that can magnify and strengthen small edge-blurring-like defects.

Description

A method for enhanced magnification inspection of edge fuzzy defect features

technical field

The invention relates to the field of surface defect detection, in particular to a method for enhancing and amplifying the characteristics of edge fuzzy defects.

Background technique

Flexible Printed Integrated Circuit Substrates (FICS), based on Flexible Printed Circuit Board (FPC), is a printed circuit substrate that uses copper foil to corrode the surface of polyimide flexible substrate material to form circuits. . Flexible IC substrates have the characteristics of light weight, small size, high density and bendability, and are widely used in aerospace, military, mobile terminals and other fields.

People's requirements for the miniaturization of electronic products, flexible IC substrate circuits are becoming more and more refined, the appearance defects generated in the manufacturing process are becoming more and more complex, and the quality and defect control in the manufacturing process are becoming more and more strict. At present, there are nearly 100 kinds of substrate defects of different types produced by different production processes, and more than ten kinds of common defects, which seriously affect the product quality, especially the blurred edge defects, because there are many linear areas in the flexible integrated circuit substrate. , For small blurred edge defects, using traditional line scanning and other methods to inspect the entire flexible integrated circuit substrate is likely to ignore small blurred edge defects, resulting in the risk of defective products.

To solve this problem, we need an inspection method that can magnify and strengthen small edge blur-like defects.

SUMMARY OF THE INVENTION

Purpose of the invention: The purpose of the present invention is to provide a method for enhancing and amplifying the characteristics of edge fuzzy defects in view of the deficiencies of the prior art.

Technical solution: The method for enhancing and amplifying the feature of edge fuzzy defects according to the present invention includes the following steps:

S1. Use an X-ray reflection inspection camera to take pictures of the flexible integrated circuit substrate to be inspected, and then use adaptive median filtering to eliminate defect-free weld areas and background areas of the digital image captured by X-rays, and then use the blurred image to enhance the boundary extraction of the image. Algorithms are used to make the edges of edge-blurring-like defect features on flexible integrated circuit substrates clear so that they can be enhanced and amplified;

S2. Integrate the enhanced and enlarged edge fuzzy defect features into a defect pattern and store it in the processing terminal;

S3. Then use a line scan camera to scan the surface of the flexible integrated circuit substrate to obtain a high-definition picture of the surface of the flexible integrated circuit substrate, and then superimpose the defect pattern with the high-definition picture of the surface of the flexible integrated circuit substrate to obtain the marked defect position. High-definition picture of the surface of the flexible integrated circuit substrate;

S4 , the high-definition picture of the surface of the flexible integrated circuit substrate marked with the defect position is projected and overlapped with the flexible integrated circuit substrate body, so as to complete the detailed marking of the fuzzy edge defect features on the body.

Preferably, when the line scan camera is used to scan the surface of the flexible integrated circuit substrate in S3, three-dimensional scanning of the tunnel is used to construct a three-dimensional modeling of the flexible integrated circuit substrate.

Preferably, in S1, the X-ray reflection detection camera is used to photograph the flexible integrated circuit substrate to be inspected by tunnel scanning, and in S2, a full-angle defect pattern of the flexible integrated circuit substrate to be inspected is constructed based on this, and then S2 The full-angle defect pattern obtained in S3 coincides with the nested projection of the stereo modeling obtained in S3.

Preferably, when the defect pattern is generated in S2, each edge-blurred defect feature is marked with a grade, and in S4, a detailed mark of the edge-blurred defect feature with a graded level is marked on the body.

Compared with the prior art, the invention has the following beneficial effects: the X-ray reflection detection camera and the line scan camera are used to photograph the surface of the flexible integrated circuit substrate step by step, and the X-ray reflection detection camera cooperates with adaptive median filtering and blurring to enhance the image. The boundary extraction algorithm is used to obtain the defect pattern integrated by the enhanced and enlarged edge fuzzy defect features, and the high-definition picture of the surface of the flexible integrated circuit substrate is obtained by the line scan camera. Finally, the detailed marking of edge-blurred defect features is carried out on the ontology. Using this method, the edge-blurred defect features on the flexible integrated circuit substrate can be strengthened and enlarged, which is convenient for inspection, and the edge-blurred defect features can be realized on the ontology. correct marking on the .

Detailed ways

The technical solutions in the embodiments of the present invention will be described clearly and completely below. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

In the description of the present invention, it should be understood that the terms "center", "portrait", "horizontal", "top", "bottom", "front", "rear", "left", "right", " The orientation or positional relationship indicated by vertical, horizontal, top, bottom, inner, outer, axial, radial, circumferential, etc. is only for the convenience of description The present invention and simplified description do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operate in a particular orientation, and therefore should not be construed as limiting the invention.

In the present invention, unless otherwise expressly specified and limited, the terms "installed", "connected", "connected", "fixed" and other terms should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection , it can also be integrated; it can be a mechanical connection, an electrical connection, or a communication connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two components or two components. interactions, unless otherwise expressly defined. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

The technical solutions of the present invention will be described in detail below with specific examples. The following specific embodiments may be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments.

Embodiment 1: a method for enhancing and amplifying defect features of edge blurring, comprising the following steps:

S1. Use an X-ray reflection inspection camera to take pictures of the flexible integrated circuit substrate to be inspected, and then use adaptive median filtering to eliminate defect-free weld areas and background areas of the digital image captured by X-rays, and then use the blurred image to enhance the boundary extraction of the image. Algorithms are used to make the edges of edge-blurring-like defect features on flexible integrated circuit substrates clear so that they can be enhanced and amplified;

S2. Integrate the enhanced and enlarged edge fuzzy defect features into a defect pattern and store it in the processing terminal;

S3. Then use a line scan camera to scan the surface of the flexible integrated circuit substrate to obtain a high-definition picture of the surface of the flexible integrated circuit substrate, and then superimpose the defect pattern with the high-definition picture of the surface of the flexible integrated circuit substrate to obtain the marked defect position. High-definition picture of the surface of the flexible integrated circuit substrate;

S4 , the high-definition picture of the surface of the flexible integrated circuit substrate marked with the defect position is projected and overlapped with the flexible integrated circuit substrate body, so as to complete the detailed marking of the fuzzy edge defect features on the body.

Embodiment 2: a method for enhancing and amplifying the feature of fuzzy edge defects, comprising the following steps:

S1. Use an X-ray reflection detection camera to perform tunnel scanning and shooting of the flexible integrated circuit substrate to be tested, and then use adaptive median filtering to eliminate defect-free weld areas and background areas of the digital image captured by the X-ray, and then use blur to enhance the image. The edge extraction algorithm is used to make the edge of the edge blurred defect feature on the flexible integrated circuit substrate clear, so that it can be strengthened and enlarged;

S2. Integrate the enhanced and enlarged edge fuzzy defect features into an all-angle defect pattern for constructing the flexible integrated circuit substrate to be inspected and store it in the processing terminal, and perform a full-angle defect pattern on each edge fuzzy defect feature when generating the full-angle defect pattern. grading mark;

S3. Then use the line scan camera to scan the surface of the flexible integrated circuit substrate. When the line scan camera is used to scan the surface of the flexible integrated circuit substrate, use the tunnel stereo scan to construct a three-dimensional modeling of the flexible integrated circuit substrate, and then use the full-angle scan to scan the surface of the flexible integrated circuit substrate. The defect pattern is superimposed with the three-dimensional modeling of the surface of the flexible integrated circuit substrate, so as to obtain a high-definition picture of the surface of the flexible integrated circuit substrate with the marked defect position;

S4, the high-definition picture of the surface of the flexible integrated circuit substrate marked with the defect position is projected and overlapped with the flexible integrated circuit substrate body, and then a detailed mark with a graded edge fuzzy defect feature is marked on the body.

The advantage of this technical solution is that the X-ray reflection detection camera and the line scan camera are used to photograph the surface of the flexible integrated circuit substrate step by step, and the X-ray reflection detection camera cooperates with the adaptive median filter and the boundary extraction algorithm of the blur enhanced image to obtain the image. The defect pattern formed by the enhanced and magnified edge fuzzy defect features is obtained by the line scan camera to obtain the high-definition picture of the surface of the flexible integrated circuit substrate. Carry out detailed marking of edge fuzzy defect features. This method can realize the enhancement and enlargement of edge fuzzy defect features on flexible integrated circuit substrates, which is convenient for inspection, and can realize the correct marking of edge fuzzy defect features on the body.

In the present invention, unless otherwise expressly specified and limited, a first feature "on" or "under" a second feature may be in direct contact with the first feature and the second feature, or the first feature and the second feature through the middle indirect contact with the media. Also, the first feature being "above", "over" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is level higher than the second feature. A first feature "below", "below" and "below" a second feature may mean that the first feature is directly or obliquely below the second feature, or simply means that the first feature is level below the second feature. In the description of this specification, reference to the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples", etc., means specific features described in connection with the embodiment or example. , structure, material or feature is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example.

Furthermore, the particular features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, those skilled in the art may combine and combine the different embodiments or examples described in this specification, as well as the features of the different embodiments or examples, without conflicting each other.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, but not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: The technical solutions described in the foregoing embodiments can still be modified, or some or all of the technical features thereof can be equivalently replaced; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the technical solutions of the embodiments of the present invention. scope.

Claims (4)

1. an edge fuzzy class defect feature enhancement amplification inspection method is characterized in that: comprise the following steps: S1. Use an X-ray reflection inspection camera to take pictures of the flexible integrated circuit substrate to be inspected, and then use adaptive median filtering to eliminate defect-free weld areas and background areas of the digital image captured by X-rays, and then use the blurred image to enhance the boundary extraction of the image. Algorithms are used to make the edges of edge-blurring-like defect features on flexible integrated circuit substrates clear so that they can be enhanced and amplified; S2. Integrate the enhanced and enlarged edge fuzzy defect features into a defect pattern and store it in the processing terminal; S3. Then use a line scan camera to scan the surface of the flexible integrated circuit substrate to obtain a high-definition picture of the surface of the flexible integrated circuit substrate, and then superimpose the defect pattern with the high-definition picture of the surface of the flexible integrated circuit substrate to obtain the marked defect position. High-definition picture of the surface of the flexible integrated circuit substrate; S4 , the high-definition picture of the surface of the flexible integrated circuit substrate marked with the defect position is projected and overlapped with the flexible integrated circuit substrate body, so as to complete the detailed marking of the fuzzy edge defect features on the body. 2 . The method for enhancing and magnifying the features of edge blurred defects according to claim 1 , wherein: when the line scan camera is used to scan the surface of the flexible integrated circuit substrate in S3 , a tunnel stereo scan is used to construct the flexible integrated circuit. 3 . 3D modeling of the substrate. 3. A kind of edge fuzzy defect feature enhancement amplification inspection method according to claim 2, it is characterized in that: in S1, adopt tunnel scanning to take pictures when adopting X-ray reflection detection camera to take pictures of the flexible integrated circuit substrate to be detected, and in S1. In S2, a full-angle defect pattern of the flexible integrated circuit substrate to be inspected is constructed based on this, and then the full-angle defect pattern obtained in S2 and the three-dimensional modeling obtained in S3 are subjected to nested projection overlap. 4. a kind of edge fuzzy class defect feature enhancement amplification inspection method according to claim 1, is characterized in that: when generating defect pattern in S2, carry out grading marking to each edge fuzzy class defect feature and mark band on the body in S4 Detailed marking of edge blur-like defect features with graded levels.