CN114660100A - Edge fuzzy defect characteristic reinforced amplification inspection method - Google Patents
Edge fuzzy defect characteristic reinforced amplification inspection method Download PDFInfo
- Publication number
- CN114660100A CN114660100A CN202210172730.4A CN202210172730A CN114660100A CN 114660100 A CN114660100 A CN 114660100A CN 202210172730 A CN202210172730 A CN 202210172730A CN 114660100 A CN114660100 A CN 114660100A
- Authority
- CN
- China
- Prior art keywords
- defect
- integrated circuit
- circuit substrate
- flexible integrated
- edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/20—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by using diffraction of the radiation by the materials, e.g. for investigating crystal structure; by using scattering of the radiation by the materials, e.g. for investigating non-crystalline materials; by using reflection of the radiation by the materials
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/05—Investigating materials by wave or particle radiation by diffraction, scatter or reflection
- G01N2223/052—Investigating materials by wave or particle radiation by diffraction, scatter or reflection reflection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/10—Different kinds of radiation or particles
- G01N2223/101—Different kinds of radiation or particles electromagnetic radiation
- G01N2223/1016—X-ray
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/60—Specific applications or type of materials
- G01N2223/646—Specific applications or type of materials flaws, defects
Landscapes
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
Abstract
The invention discloses a reinforced amplification inspection method for edge fuzzy defect characteristics, which comprises the steps of firstly shooting a flexible integrated circuit substrate to be detected by an X-ray reflection detection camera, then eliminating a non-defective welding seam area and a non-defective background area by utilizing self-adaptive median filtering, then adopting a boundary extraction algorithm of a fuzzy enhanced image to ensure that the edge of the edge fuzzy defect characteristics is clear and the edge fuzzy defect characteristics are reinforced and amplified, then integrating the edge fuzzy defect characteristics which are reinforced and amplified into a defect pattern and storing the defect pattern in a processing terminal, then scanning the surface of the flexible integrated circuit substrate by a line scanning camera to obtain a high-definition picture and overlapping the defect pattern to obtain a high-definition picture of the surface of the flexible integrated circuit substrate at a marked defect position, finally projecting and superposing the high-definition picture with a body to finish detailed marking of the edge fuzzy defect characteristics on the body, the invention has the advantage of providing the inspection method which can amplify and strengthen the tiny edge fuzzy defects.
Description
Technical Field
The invention relates to the field of surface defect detection, in particular to an edge fuzzy defect characteristic reinforced amplification inspection method.
Background
A Flexible Integrated Circuit Substrates (FICS) is a Printed Circuit substrate on which a Circuit is formed by etching a copper foil on a surface of a polyimide Flexible substrate material, based on a Flexible Printed Circuit Board (FPC). The flexible IC substrate has the characteristics of light weight, small volume, high density, flexibility and the like, and is widely applied to the fields of spaceflight, military, mobile terminals and the like.
In the demand for miniaturization of electronic products, flexible IC substrate circuits are becoming finer and finer, appearance defects generated during the manufacturing process are becoming more and more complex, and quality and defect control during the manufacturing process are becoming stricter and stricter. At present, the defects of different types of substrates generated by different production processes reach nearly one hundred types, common defects also reach more than ten types, the product quality is seriously influenced, particularly the edge fuzzy defects, and for the tiny edge fuzzy defects, the defects of the flexible integrated circuit substrate are detected by adopting the traditional line scanning and other modes to detect the defects of the whole flexible integrated circuit substrate, so that the defective product risk is caused.
To solve this problem, an inspection method that can amplify and reinforce fine edge blur defects is needed.
Disclosure of Invention
The purpose of the invention is as follows: the invention aims to provide an edge fuzzy defect feature enhanced amplification inspection method aiming at the defects of the prior art.
The technical scheme is as follows: the invention relates to an edge fuzzy defect characteristic strengthening amplification inspection method, which comprises the following steps:
s1, shooting a flexible integrated circuit substrate to be detected by adopting an X-ray reflection detection camera, then eliminating a defect-free welding seam area and a background area of a digital image shot by the X-ray by utilizing self-adaptive median filtering, and then, adopting a boundary extraction algorithm of a fuzzy enhanced image to enable the edge of the edge fuzzy defect characteristics on the flexible integrated circuit substrate to be clear and to be enhanced and amplified;
s2, integrating the edge fuzzy defect features which are strengthened and amplified into a defect pattern and storing the defect pattern in a processing terminal;
s3, scanning the surface of the flexible integrated circuit substrate by using a line scanning camera to obtain a high-definition picture of the surface of the flexible integrated circuit substrate, and then overlapping the defect pattern with the high-definition picture of the surface of the flexible integrated circuit substrate to obtain the high-definition picture of the surface of the flexible integrated circuit substrate with the marked defect position;
and S4, projecting and superposing the high-definition pictures marked with the defect positions on the surface of the flexible integrated circuit substrate and the flexible integrated circuit substrate body to complete the detailed marking of the fuzzy defect characteristics of the upper edge of the body.
Preferably, when the line-scan camera is used to scan the surface of the flexible integrated circuit substrate in S3, the tunnel stereo scanning is used to build up the stereo model of the flexible integrated circuit substrate.
Preferably, in S1, when the flexible integrated circuit substrate to be detected is photographed by using the X-ray reflection detection camera, tunnel scan photographing is used, and in S2, a full-angle defect pattern of the flexible integrated circuit substrate to be detected is constructed, and then the full-angle defect pattern obtained in S2 and the stereoscopic modeling obtained in S3 are nested and projected to coincide.
Preferably, when the defect pattern is generated in S2, the edge-blurring defect feature is graded and marked on the body in S4, and the detailed mark with the graded edge-blurring defect feature is marked on the body.
Compared with the prior art, the invention has the following beneficial effects: the method comprises the steps of shooting the surface of the flexible integrated circuit substrate by an X-ray reflection detection camera and a line scan camera step by step, obtaining a defect pattern integrated by intensified and amplified edge fuzzy defect characteristics by the X-ray reflection detection camera in cooperation with a self-adaptive median filter and a fuzzy enhancement image boundary extraction algorithm, obtaining a high-definition picture of the surface of the flexible integrated circuit substrate by the line scan camera, superposing the high-definition picture and the high-definition picture to obtain a high-definition picture of the surface of the flexible integrated circuit substrate at a marked defect position, and finally marking the edge fuzzy defect characteristics on the body in detail.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," "circumferential," and the like are used merely for convenience in describing and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be considered as limiting the invention.
In the present invention, unless otherwise specifically stated or limited, the terms "mounted," "connected," "fixed," and the like are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; the connection can be mechanical connection, electrical connection or communication connection; either directly or indirectly through intervening media, either internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
The technical solution of the present invention will be described in detail below with specific examples. The following several specific embodiments may be combined with each other, and details of the same or similar concepts or processes may not be repeated in some embodiments.
Example 1: an edge fuzzy defect feature enhanced amplification inspection method comprises the following steps:
s1, shooting a flexible integrated circuit substrate to be detected by adopting an X-ray reflection detection camera, then eliminating a defect-free welding seam area and a background area of a digital image shot by the X-ray by utilizing self-adaptive median filtering, and then, adopting a boundary extraction algorithm of a fuzzy enhanced image to enable the edge of the edge fuzzy defect characteristics on the flexible integrated circuit substrate to be clear and to be enhanced and amplified;
s2, integrating the edge fuzzy defect features which are strengthened and amplified into a defect pattern and storing the defect pattern in a processing terminal;
s3, scanning the surface of the flexible integrated circuit substrate by using a line scanning camera to obtain a high-definition picture of the surface of the flexible integrated circuit substrate, and then overlapping the defect pattern with the high-definition picture of the surface of the flexible integrated circuit substrate to obtain the high-definition picture of the surface of the flexible integrated circuit substrate marked with the defect position;
and S4, projecting and superposing the high-definition pictures marked with the defect positions on the surface of the flexible integrated circuit substrate and the flexible integrated circuit substrate body to complete the detailed marking of the fuzzy defect characteristics of the upper edge of the body.
Example 2: an edge fuzzy defect feature enhanced amplification inspection method comprises the following steps:
s1, tunnel scanning shooting is carried out on the flexible integrated circuit substrate to be detected by adopting an X-ray reflection detection camera, then a defect-free weld joint area and a background area of a digital image shot by the X-ray are eliminated by utilizing self-adaptive median filtering, and then the edge of the edge fuzzy defect characteristics on the flexible integrated circuit substrate is made clear by adopting a fuzzy enhanced image boundary extraction algorithm so as to be enhanced and amplified;
s2, integrating the edge fuzzy defect characteristics which are strengthened and amplified into an all-angle defect pattern of the flexible integrated circuit substrate to be detected, storing the all-angle defect pattern in a processing terminal, and grading and marking the edge fuzzy defect characteristics when the all-angle defect pattern is generated;
s3, scanning the surface of the flexible integrated circuit substrate by using a line-scan camera, and when scanning the surface of the flexible integrated circuit substrate by using the line-scan camera, performing tunnel three-dimensional scanning and constructing three-dimensional modeling of the flexible integrated circuit substrate, and then overlapping the full-angle defect pattern and the three-dimensional modeling of the surface of the flexible integrated circuit substrate to obtain a high-definition picture of the surface of the flexible integrated circuit substrate at the marked defect position;
and S4, projecting and superposing the high-definition picture of the surface of the flexible integrated circuit substrate marked with the defect position with the flexible integrated circuit substrate body, and then marking a detailed mark with graded edge fuzzy defect characteristics on the body.
The technical scheme has the advantages that the X-ray reflection detection camera and the line scan camera are adopted to shoot the surface of the flexible integrated circuit substrate step by step, the X-ray reflection detection camera is matched with the self-adaptive median filtering and the boundary extraction algorithm of the fuzzy enhancement image to obtain a defect pattern integrated by the edge fuzzy defect characteristics which are enhanced and amplified, the line scan camera obtains the high-definition picture of the surface of the flexible integrated circuit substrate and superposes the high-definition picture to obtain the high-definition picture of the surface of the flexible integrated circuit substrate at the marked defect position, and finally the detailed marking of the edge fuzzy defect characteristics is carried out on the body.
In the present invention, unless otherwise explicitly specified or limited, the first feature "on" or "under" the second feature may be directly contacting the first feature and the second feature or indirectly contacting the first feature and the second feature through an intermediate. Also, a first feature "on," "above," and "over" a second feature may mean that the first feature is directly above or obliquely above the second feature, or that only the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lower level than the second feature. In the description herein, reference to the description of the term "one embodiment," "some embodiments," "an example," "a specific example" or "some examples," or the like, means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example.
Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (4)
1. An edge fuzzy defect feature enhanced amplification inspection method is characterized by comprising the following steps: the method comprises the following steps:
s1, shooting a flexible integrated circuit substrate to be detected by adopting an X-ray reflection detection camera, then eliminating a defect-free welding seam area and a background area of a digital image shot by the X-ray by utilizing self-adaptive median filtering, and then, adopting a boundary extraction algorithm of a fuzzy enhanced image to enable the edge of the edge fuzzy defect characteristics on the flexible integrated circuit substrate to be clear and to be enhanced and amplified;
s2, integrating the edge fuzzy defect features which are strengthened and amplified into a defect pattern and storing the defect pattern in a processing terminal;
s3, scanning the surface of the flexible integrated circuit substrate by using a line scanning camera to obtain a high-definition picture of the surface of the flexible integrated circuit substrate, and then overlapping the defect pattern with the high-definition picture of the surface of the flexible integrated circuit substrate to obtain the high-definition picture of the surface of the flexible integrated circuit substrate with the marked defect position;
and S4, projecting and superposing the high-definition pictures marked with the defect positions on the surface of the flexible integrated circuit substrate and the flexible integrated circuit substrate body to complete the detailed marking of the fuzzy defect characteristics of the upper edge of the body.
2. The method for enhanced magnification inspection of edge blur defect features according to claim 1, wherein: and S3, when the surface of the flexible integrated circuit substrate is scanned by the line scan camera, tunnel stereo scanning is adopted to construct the stereo modeling of the flexible integrated circuit substrate.
3. The method for enhanced magnification inspection of edge blur defect features according to claim 2, wherein: and in S1, when the flexible integrated circuit substrate to be detected is shot by using an X-ray reflection detection camera, tunnel scanning shooting is adopted, a full-angle defect pattern of the flexible integrated circuit substrate to be detected is constructed in S2, and then the full-angle defect pattern obtained in S2 is superposed with the three-dimensional modeling obtained in S3 through nested projection.
4. The method for enhanced magnification inspection of edge blur defect features as claimed in claim 1, wherein: when the defect pattern is generated in S2, the edge blur defect-like features are hierarchically marked, and detailed marks of the edge blur defect-like features with the hierarchical levels are marked on the body in S4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210172730.4A CN114660100A (en) | 2022-02-24 | 2022-02-24 | Edge fuzzy defect characteristic reinforced amplification inspection method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210172730.4A CN114660100A (en) | 2022-02-24 | 2022-02-24 | Edge fuzzy defect characteristic reinforced amplification inspection method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114660100A true CN114660100A (en) | 2022-06-24 |
Family
ID=82028232
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210172730.4A Pending CN114660100A (en) | 2022-02-24 | 2022-02-24 | Edge fuzzy defect characteristic reinforced amplification inspection method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114660100A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116148289A (en) * | 2023-04-20 | 2023-05-23 | 宁德时代新能源科技股份有限公司 | Battery defect detection method and system and computer readable storage medium |
-
2022
- 2022-02-24 CN CN202210172730.4A patent/CN114660100A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116148289A (en) * | 2023-04-20 | 2023-05-23 | 宁德时代新能源科技股份有限公司 | Battery defect detection method and system and computer readable storage medium |
| CN116148289B (en) * | 2023-04-20 | 2023-08-29 | 宁德时代新能源科技股份有限公司 | Battery defect detection method and system and computer readable storage medium |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10886504B2 (en) | Systems, devices and methods for the quality assessment of OLED stack films | |
| KR101015410B1 (en) | Soldering-print inspection apparatus | |
| KR101058160B1 (en) | Solder Print Inspection Device and Component Mounting System | |
| CN114660100A (en) | Edge fuzzy defect characteristic reinforced amplification inspection method | |
| JP2018128359A (en) | Substrate inspection device, substrate inspection method, and method of manufacturing substrate | |
| KR102657751B1 (en) | Board inspection method using a learning model | |
| CN113390894A (en) | Substrate measuring system and method thereof | |
| US8186050B2 (en) | Printed wiring board manufacturing method | |
| KR100888235B1 (en) | Image processing device and method | |
| CN103630542B (en) | Defect detecting device, defect correction device and defect inspection method | |
| WO2022142599A1 (en) | System and method for differential geometric 3d micro-visual inspection of high-density ic solder joint | |
| WO2022074897A1 (en) | Solder printing inspection device | |
| CN111899248B (en) | Automatic PCB solder paste defect detection method based on machine learning | |
| CN115511792A (en) | Enhanced detection method for defects of high-aspect-ratio workpiece | |
| CN116469789A (en) | Compensation method, compensation system and deep learning system for etching process | |
| CN115100098A (en) | Printed circuit board AOI intelligent detection equipment based on deep learning algorithm | |
| CN114577818A (en) | Substrate information analysis system and method | |
| KR101564696B1 (en) | Device and method for reverse engineering of pcb(printed circuit board) | |
| JP3417178B2 (en) | Circuit pattern inspection method and inspection apparatus | |
| CN113160259A (en) | Edge detection method, edge detection device, computer equipment and storage medium | |
| CN118196359B (en) | PCB multi-layer board circuit region detection method, device, equipment and storage medium | |
| JP2019132720A (en) | Visual inspection device and visual inspection method | |
| CN104640374B (en) | The method for transplanting circuit board | |
| CN115754670B (en) | Repairing and rechecking method and device for short circuit defect of PCB | |
| CN118918218A (en) | Method for manufacturing PCBA defect detection data set based on deep learning |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |