CN114653259A - Glue preparation equipment for bonding electronic products - Google Patents
Glue preparation equipment for bonding electronic products Download PDFInfo
- Publication number
- CN114653259A CN114653259A CN202210133360.3A CN202210133360A CN114653259A CN 114653259 A CN114653259 A CN 114653259A CN 202210133360 A CN202210133360 A CN 202210133360A CN 114653259 A CN114653259 A CN 114653259A
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- China
- Prior art keywords
- sealing cover
- electronic products
- equipment
- base
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000002360 preparation method Methods 0.000 title claims abstract description 46
- 239000003292 glue Substances 0.000 title claims abstract description 45
- 238000007789 sealing Methods 0.000 claims abstract description 45
- 238000003756 stirring Methods 0.000 claims abstract description 11
- 239000006096 absorbing agent Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 230000035939 shock Effects 0.000 claims description 6
- 230000007797 corrosion Effects 0.000 claims description 3
- 238000005260 corrosion Methods 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- 239000000741 silica gel Substances 0.000 claims description 2
- 229910002027 silica gel Inorganic materials 0.000 claims description 2
- 238000011161 development Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 230000003670 easy-to-clean Effects 0.000 description 2
- 239000002085 irritant Substances 0.000 description 2
- 231100000021 irritant Toxicity 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 206010063385 Intellectualisation Diseases 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
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Abstract
The invention discloses glue preparation equipment for bonding an electronic product, which comprises a base, wherein an equipment rack is fixedly arranged on the base, a bracket is vertically and fixedly arranged at the bottom of the base, the bracket is fixedly arranged on the bottom plate, a configuration machine is arranged on the base, the top end of the configuration machine is provided with a sealing cover, the center above the sealing cover is fixedly provided with a motor, the output end of the motor is provided with a stirring shaft, a scraper is fixedly arranged on the stirring shaft through a bolt, the outer wall of the equipment frame is fixedly provided with a delivery pump, the delivery pump is communicated with the configuration machine through a guide pipe, the top end of the sealing cover is fixedly connected with a hydraulic rod, the hydraulic rod is fixedly arranged at the top end of the equipment frame, the sealing cover is provided with an air hole, the sealing cover is provided with an air inlet cover, the gas inlet cover is communicated with the gas filter through a gas inlet pipe, and the gas filter is fixedly arranged on the outer wall of the equipment frame and is provided with a gas inlet pipe. The invention is environment-friendly and pollution-free and has high intelligent degree.
Description
Technical Field
The invention relates to the technical field of electronic products, in particular to glue preparation equipment for bonding electronic products.
Background
The electronic product is a related product based on electric energy, and mainly comprises: watches, smart phones, telephones, televisions, video disc players (VCD, SVCD, DVD), video recorders, camcorders, radios, radio cassettes, combination speakers, compact disc players (CD), computers, games, mobile communication products, and the like. The early products were named electronic products mainly based on electronic tubes. The electronic products are developed most rapidly in the twentieth century and are applied most widely, and become an important mark for the development of modern science and technology. The first generation of electronic products have electronic tubes as the core. The first semiconductor triode comes out in the world in the end of the forty years, has the characteristics of small size, light weight, electricity saving, long service life and the like, is rapidly applied by various countries, and replaces an electron tube in a large range. In the last fifties, the world appeared the first integrated circuit, which integrated many electronic components such as transistors on a silicon chip, and made the electronic products more compact. Integrated circuits are rapidly developed from small-scale integrated circuits to large-scale integrated circuits and very large-scale integrated circuits, so that electronic products are developed towards high efficiency, low consumption, high precision, high stability and intellectualization. Since the four stages of development of electronic computers are just fully characterized by the four stages of development of electronic technology, the features of the four stages of development of electronic technology will be described below from the four times of development of electronic computers.
In the production and processing process of electronic products, glue preparation equipment needs to be used, the traditional glue preparation equipment is single in function and only has a preparation function, however, in the glue production process, pungent peculiar smell can be generated, the environment is easily polluted, the human health is influenced, and the glue is easily attached to the inner wall of the device and is not easy to clean, so that the use requirement of people is difficult to meet.
Based on the above, the invention designs glue preparation equipment for bonding electronic products, so as to solve the problems.
Disclosure of Invention
The invention aims to provide glue preparation equipment for bonding an electronic product, which aims to solve the problems that the glue preparation equipment is required to be used in the production and processing processes of the electronic product in the background art, the traditional glue preparation equipment has single function and only has the preparation function, however, sharp peculiar smell is generated in the glue production process, the environment is easily polluted, the human health is influenced, and the glue is easily attached to the inner wall of the device and is not easy to clean, so that the use requirements of people are difficult to meet.
In order to achieve the purpose, the invention provides the following technical scheme:
a glue preparation device for bonding an electronic product comprises a base, wherein a device frame is fixedly arranged on the base, a support is vertically and fixedly arranged at the bottom of the base, the support is fixedly arranged on a bottom plate, a preparation machine is arranged on the base, a sealing cover is arranged at the top end of the preparation machine, a motor is fixedly arranged in the center of the upper part of the sealing cover, a stirring shaft is arranged at the output end of the motor, a scraper tightly attached to the inner wall of the preparation machine is fixedly arranged on the stirring shaft through a bolt, a delivery pump is fixedly arranged on the outer wall of the device frame and communicated with the preparation machine through a guide pipe, a hydraulic rod is fixedly connected to the top end of the sealing cover, the top end of the device frame is fixedly arranged on the top end of the device frame, an air hole is formed in the sealing cover, an air inlet cover is arranged on the sealing cover and communicated with a gas filter through an air inlet pipe, the gas filter is fixedly arranged on the outer wall of the equipment frame.
As a further scheme of the invention, a section of the air inlet pipe is provided with a flexible hose, and the air inlet cover is fixedly connected with the sealing cover through a fixing bolt arranged on a fixing flange and is positioned right above the air inlet hole.
As a further scheme of the present invention, a sealing gasket is disposed at a joint of the sealing cover and the dispensing machine, the sealing gasket is a corrosion-resistant silicone gasket, a first protrusion is integrally formed on the sealing cover, a second protrusion is integrally formed on the dispensing machine, and sealing grooves adapted to the first protrusion and the second protrusion are respectively integrally formed on the dispensing machine and the sealing cover.
As a further aspect of the present invention, a mounting groove is integrally formed on the base, and a shock absorber is fixedly mounted in the mounting groove at the bottom of the configuration machine.
As a further scheme of the invention, a controller is electrically installed on the outer wall of the equipment rack.
As a further scheme of the invention, a discharge opening is fixedly arranged at the bottom of the configurator, an electromagnetic valve is fixedly arranged on the discharge opening, and a material receiving box is arranged below the discharge opening.
As a further scheme of the invention, universal wheels are installed on the bottom of the bottom plate through bolts.
Compared with the prior art, the invention has the beneficial effects that:
the glue preparation equipment for bonding the electronic product is provided with the sealing cover matched with the preparation machine, the sealing cover is provided with the air hole, the air inlet cover is arranged on the air hole, the air inlet cover is communicated with the external air filter through the air inlet pipe, and in the glue preparation process, irritant gas can be pumped away in time through the air filter, so that the influence of gas overflow on the environment and the human health is avoided, and the device is more environment-friendly and pollution-free.
According to the glue preparation equipment for bonding the electronic product, the sealing cover is driven to lift through the hydraulic rod, the sealing cover is sealed with the preparation machine through the sealing washer, the first bulge and the second bulge, and the bottom of the preparation machine controls material discharge through the electromagnetic valve.
According to the glue preparation equipment for bonding the electronic product, the stirring shaft is provided with the scraper which can scrape off the glue attached to the inner wall of the preparation machine, so that the problem that the glue is difficult to clean due to long-time attachment is avoided.
The bottom of the configurator is provided with the shock absorber, so that the working stability of the device is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic view of the overall structure of a glue dispensing device for bonding electronic products according to the invention;
FIG. 2 is a schematic view showing the installation of a dispenser of an apparatus for dispensing glue for bonding electronic products according to the present invention;
fig. 3 is a partially sectional enlarged schematic view of an electronic product bonding glue dispensing apparatus according to the present invention;
fig. 4 is a partially sectional enlarged schematic view of an electronic product bonding glue dispensing apparatus according to the invention.
In the drawings, the components represented by the respective reference numerals are listed below:
1. a base; 2. an equipment rack; 3. a support; 4. a base plate; 5. a universal wheel; 6. a configuration machine; 7. a sealing cover; 8. a motor; 9. a stirring shaft; 10. a discharge outlet; 11. an electromagnetic valve; 12. a material receiving box; 13. a squeegee; 14. a delivery pump; 15. a conduit; 16. a hydraulic lever; 17. a gas filter; 18. an air inlet pipe; 19. a flexible hose; 20. an air intake hood; 21. mounting grooves; 22. a shock absorber; 23. a sealing gasket; 24. a first protrusion; 25. a second protrusion; 26. a fixed flange; 27. air holes; 28. and a controller.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "top", "bottom", "one side", "the other side", "front", "back", "middle part", "inside", "top", "bottom", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As shown in fig. 1 to 4, the present invention provides a glue dispensing apparatus for bonding electronic products, wherein,
fig. 1 is a schematic view of the overall structure of a glue dispensing device for bonding electronic products according to the invention; FIG. 2 is a schematic view of a dispenser mounting apparatus of an electronic product bonding glue dispensing apparatus according to the present invention; fig. 3 is a partially sectional enlarged schematic view of an electronic product bonding glue dispensing apparatus according to the present invention; FIG. 4 is an enlarged view of the adhesive dispensing apparatus for bonding electronic products according to the present invention;
as shown in fig. 1-4, in practical application, an apparatus for preparing glue for bonding electronic products includes a base 1, an apparatus frame 2 is fixedly mounted on the base 1, a support 3 is vertically and fixedly mounted at the bottom of the base 1, the support 3 is fixedly mounted on a bottom plate 4, a configurator 6 is mounted on the base 1, a sealing cover 7 is disposed at the top end of the configurator 6, a motor 8 is fixedly mounted at the center above the sealing cover 7, a stirring shaft 9 is mounted at the output end of the motor 8, a scraping plate 13 tightly attached to the inner wall of the configurator 6 is fixedly mounted on the stirring shaft 9 by a bolt, a delivery pump 14 is fixedly mounted on the outer wall of the apparatus frame 2, the delivery pump 14 is communicated with the configurator 6 through a conduit 15, a hydraulic rod 16 is fixedly connected to the top end of the sealing cover 7, and the hydraulic rod 16 is fixedly mounted at the top end of the apparatus frame 2, the sealing cover 7 is provided with an air hole 27, the sealing cover 27 is provided with an air inlet cover 20, the air inlet cover 20 is communicated with the gas filter 17 through an air inlet pipe 18, and the gas filter 17 is fixedly arranged on the outer wall of the equipment frame 2.
The upper section of the air inlet pipe 18 is provided with a flexible hose 19, and the air inlet cover 20 is fixedly connected with the sealing cover 7 through a fixing bolt arranged on a fixing flange 26 and is positioned right above the air inlet hole 27. Sealed lid 7 with the laminating department of configurator 6 is provided with seal ring 23, seal ring 23 is the corrosion-resistant packing ring of silica gel, integrated into one piece has first arch 24 on the sealed lid 7, integrated into one piece has the second arch 25 on the configurator 6, configurator 6 with sealed lid 7 respectively integrated into one piece have with the seal groove of first arch 24 and the protruding 25 adaptation of second. The base 1 is integrally formed with a mounting groove 21, and a shock absorber 22 is fixedly mounted at the bottom of the configuration machine 6 in the mounting groove 21. The outer wall of the equipment frame 2 is electrically provided with a controller 28. The bottom of the configuration machine 6 is fixedly provided with a discharge opening 10, the discharge opening 10 is fixedly provided with an electromagnetic valve 11, and a material receiving box 12 is arranged below the discharge opening 10. And universal wheels 5 are mounted at the bottom of the bottom plate 4 through bolts.
The glue preparation equipment for bonding the electronic product is provided with the sealing cover matched with the preparation machine, the sealing cover is provided with the air hole, the air inlet cover is arranged on the air hole, the air inlet cover is communicated with the external air filter through the air inlet pipe, and in the glue preparation process, irritant gas can be pumped away in time through the air filter, so that the influence of gas overflow on the environment and the human health is avoided, and the device is more environment-friendly and pollution-free.
According to the glue preparation equipment for bonding the electronic product, the sealing cover is driven to lift by the hydraulic rod, the sealing cover is sealed with the preparation machine through the sealing washer, the first bulge and the second bulge, the bottom of the preparation machine controls material discharge through the electromagnetic valve, manual operation is not needed in the production process, the glue preparation equipment is more convenient to use and good in sealing performance, and the glue storage time can be prolonged.
According to the glue preparation equipment for bonding the electronic product, the stirring shaft is provided with the scraper which can scrape off the glue attached to the inner wall of the preparation machine, so that the problem that the glue is difficult to clean due to long-time attachment is avoided.
The bottom of the configurator is provided with the shock absorber, so that the working stability of the device is improved.
The preferred embodiments of the invention disclosed above are intended to be illustrative only. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention. The invention is limited only by the claims and their full scope and equivalents.
Claims (7)
1. The glue preparation equipment for bonding the electronic products comprises a base (1) and is characterized in that an equipment frame (2) is fixedly mounted on the base (1), a support (3) is vertically and fixedly mounted at the bottom of the base (1), the support (3) is fixedly mounted on a bottom plate (4), a configurator (6) is mounted on the base (1), a sealing cover (7) is arranged at the top end of the configurator (6), a motor (8) is fixedly mounted at the center above the sealing cover (7), a stirring shaft (9) is mounted at the output end of the motor (8), a scraper (13) tightly attached to the inner wall of the configurator (6) is fixedly mounted on the stirring shaft (9) through bolts, a conveying pump (14) is fixedly mounted on the outer wall of the equipment frame (2), and the conveying pump (14) is communicated with the configurator (6) through a guide pipe (15), sealed lid (7) top fixed connection hydraulic stem (16), hydraulic stem (16) fixed mounting be in equipment rack (2) top, it has gas pocket (27) to set up on sealed lid (7), install on sealed lid (27) and admit air cover (20), admit air cover (20) through intake pipe (18) and gas filter (17) intercommunication, gas filter (17) fixed mounting be in on the equipment rack (2) outer wall.
2. The glue preparation equipment for bonding electronic products as claimed in claim 1, wherein a flexible hose (19) is arranged on one section of the air inlet pipe (18), and the air inlet cover (20) is fixedly connected with the sealing cover (7) through a fixing bolt arranged on a fixing flange (26) and is located right above the air inlet hole (27).
3. The glue preparation equipment for bonding of electronic products according to claim 1, wherein a sealing gasket (23) is arranged at the joint of the sealing cover (7) and the preparation machine (6), the sealing gasket (23) is a corrosion-resistant silica gel gasket, a first protrusion (24) is integrally formed on the sealing cover (7), a second protrusion (25) is integrally formed on the preparation machine (6), and sealing grooves matched with the first protrusion (24) and the second protrusion (25) are respectively and integrally formed on the preparation machine (6) and the sealing cover (7).
4. The glue preparation equipment for bonding electronic products according to claim 1, wherein the base (1) is integrally formed with an installation groove (21), and a shock absorber (22) is fixedly installed in the installation groove (21) at the bottom of the preparation machine (6).
5. The glue preparation device for bonding electronic products as claimed in claim 1, wherein a controller (28) is electrically mounted on the outer wall of said device frame (2).
6. The glue preparation equipment for bonding electronic products as claimed in claim 1, wherein a discharge outlet (10) is fixedly installed at the bottom of the preparation machine (6), an electromagnetic valve (11) is fixedly installed on the discharge outlet (10), and a material receiving box (12) is arranged below the discharge outlet (10).
7. The glue preparation device for bonding electronic products as claimed in claim 1, wherein universal wheels (5) are bolted to the bottom of the base plate (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210133360.3A CN114653259A (en) | 2022-05-16 | 2022-05-16 | Glue preparation equipment for bonding electronic products |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210133360.3A CN114653259A (en) | 2022-05-16 | 2022-05-16 | Glue preparation equipment for bonding electronic products |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114653259A true CN114653259A (en) | 2022-06-24 |
Family
ID=82027147
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210133360.3A Pending CN114653259A (en) | 2022-05-16 | 2022-05-16 | Glue preparation equipment for bonding electronic products |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114653259A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109453705A (en) * | 2018-12-29 | 2019-03-12 | 柳州亚翔科技有限公司 | A kind of glue production device |
| CN109908803A (en) * | 2019-05-06 | 2019-06-21 | 肇庆市星动传说自动化技术有限公司 | A kind of LED light production glue feeding device with agitating function |
| CN210522349U (en) * | 2019-07-17 | 2020-05-15 | 东莞市冠昌实业有限公司 | Efficient pollution-free glue production device |
| CN210994008U (en) * | 2019-08-13 | 2020-07-14 | 郑州友佳包装科技有限公司 | Chemical glue mixing and stirring device |
| CN112354412A (en) * | 2020-11-08 | 2021-02-12 | 杭州宽福科技有限公司 | Glue agitating unit is used in electronic component production |
| CN214598512U (en) * | 2021-03-09 | 2021-11-05 | 广东远东高分子科技有限公司 | Glue stirring equipment |
-
2022
- 2022-05-16 CN CN202210133360.3A patent/CN114653259A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109453705A (en) * | 2018-12-29 | 2019-03-12 | 柳州亚翔科技有限公司 | A kind of glue production device |
| CN109908803A (en) * | 2019-05-06 | 2019-06-21 | 肇庆市星动传说自动化技术有限公司 | A kind of LED light production glue feeding device with agitating function |
| CN210522349U (en) * | 2019-07-17 | 2020-05-15 | 东莞市冠昌实业有限公司 | Efficient pollution-free glue production device |
| CN210994008U (en) * | 2019-08-13 | 2020-07-14 | 郑州友佳包装科技有限公司 | Chemical glue mixing and stirring device |
| CN112354412A (en) * | 2020-11-08 | 2021-02-12 | 杭州宽福科技有限公司 | Glue agitating unit is used in electronic component production |
| CN214598512U (en) * | 2021-03-09 | 2021-11-05 | 广东远东高分子科技有限公司 | Glue stirring equipment |
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Application publication date: 20220624 |
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| RJ01 | Rejection of invention patent application after publication |