CN114640731A

CN114640731A - Camera module and preparation method thereof

Info

Publication number: CN114640731A
Application number: CN202011486982.1A
Authority: CN
Inventors: 刘佳; 袁栋立; 魏罕钢; 吴湖; 卞强龙; 戚杨迪
Original assignee: Ningbo Sunny Opotech Co Ltd
Current assignee: Ningbo Sunny Opotech Co Ltd
Priority date: 2020-12-16
Filing date: 2020-12-16
Publication date: 2022-06-17

Abstract

The application provides a camera module and a preparation method thereof. The lens assembly is arranged on a photosensitive path of the photosensitive assembly and comprises a first lens and a second lens which are arranged at intervals. The focusing lens is arranged between the first lens and the second lens and comprises at least one deformable film layer. The deformable focusing lens is arranged between the lens of the camera module, so that the focusing function of the camera module is realized, and the ultra-thinness of the camera module is realized.

Description

Camera module and preparation method thereof

Technical Field

The application relates to the technical field of optical imaging, in particular to an ultrathin anti-shake camera module and a preparation method thereof.

Background

With the popularization and development of mobile terminals with photographing functions, the requirements on camera modules applied to the mobile terminals are higher and higher.

Taking a mobile phone as an example, the thickness of the current light and thin mobile phone can be basically within 9mm, even within 8mm, so that the camera module applied thereon is required to have the super-pulsation characteristic. Meanwhile, manufacturers and users also desire that the performance of the camera module, such as pixels, telephoto shooting, large aperture, anti-shake, etc., can reach a high level. However, the function of the camera module is improved, which results in the increase of the size of the camera module, especially the height of the camera module.

The camera module used in the existing mobile terminal generally protrudes out of the outer cover of the mobile terminal (the camera module is disposed inside the mobile terminal corresponding to the outer cover and exposed out of the outer cover), so that a boss is formed on the outer cover, and the outer cover is not flat enough. The mobile terminal appearance is influenced, and the user operation is influenced, for example, when a user puts a mobile terminal such as a mobile phone on a desktop flatly, the posture of the mobile terminal is inclined and unstable. More importantly, module protrusion in mobile terminal's enclosing cover makes a video recording for the module of making a video recording or the protection apron in the module outside of making a video recording have very big fish tail risk, collide with or fall to all very easily lead to the module of making a video recording mar or crack appear, and then influence the formation of image effect of the module of making a video recording.

In summary, there is a need for a camera module and a method for manufacturing the same, which can solve the above problems, so as to optimize the performance of the camera module in terms of ultra-thin, image quality and anti-shake.

Disclosure of Invention

The present application provides a camera module and a method of manufacturing the same that can at least address or partially address at least one of the above-mentioned shortcomings in the prior art.

This application provides a module of making a video recording in one aspect, includes: a photosensitive assembly; the lens assembly is arranged on a photosensitive path of the photosensitive assembly and comprises a first lens and a second lens which are arranged at intervals; and the focusing lens is arranged between the first lens and the second lens and comprises at least one deformable film layer.

According to the embodiment of the application, the focusing lens comprises a substrate, a polymer layer and a deformable film layer which are arranged in sequence.

According to this application embodiment, the focusing lens includes first deformable thin layer, polymer layer and the deformable thin layer of second that sets gradually.

According to the embodiment of the application, the camera module is applied to a mobile terminal, an outer cover of the mobile terminal is provided with an opening, and the camera module is arranged in the opening of the outer cover, wherein the first lens comprises a first lens arranged at a light incident end of the camera module, and the first lens comprises a light incident surface and a light emergent surface which are opposite to each other; wherein the light incident surface is planar and flush with the outer cover; and the light exit surface is concave or convex.

According to an embodiment of the present application, the lens assembly further includes a first lens barrel opposite to the first lens, wherein a bearing platform is disposed on an inner surface of the first lens barrel to seat the first lens; and the light exit surface of the first lens is in contact with the bearing platform.

According to this application embodiment, the module of making a video recording still includes anti-shake subassembly, anti-shake subassembly include with photosensitive element connects in order to drive photosensitive element carries out the movable part of compensation motion.

According to an embodiment of the present application, the focus lens further includes: and the driving mechanism comprises a piezoelectric film, and the piezoelectric film is arranged at the outer edge of the deformable film layer.

According to an embodiment of the present application, the focus lens includes: and the driving mechanism comprises a pressing ring, wherein the pressing ring is arranged at the outer edge of the surface of the deformable lens and is driven by at least one of VCM (Voice coil Motor), MEMS (micro electro mechanical System) drive and SMA (shape memory alloy) drive.

According to the embodiment of the application, the sensitization subassembly still includes the circuit board, the camera lens subassembly still include with the second lens barrel that the second camera lens is relative the surface of second lens barrel is provided with the intercommunication circuit, the one end of intercommunication circuit with focusing lens electricity is connected, the other end of intercommunication circuit with the circuit board electricity is connected.

According to the embodiment of the application, the first lens is far away from the photosensitive assembly, the second lens is close to the photosensitive assembly, and a communication circuit is arranged on the outer surface or inside of the second lens barrel.

According to the embodiment of the present application, a communication circuit formed by an integral molding process is provided inside the second barrel.

According to the embodiment of the application, a communication circuit formed by an etching process is arranged on the outer surface of the second lens barrel.

According to the implementation mode of the application, the focusing lens is electrically connected with the communicating circuit through a routing process.

According to the implementation mode of the application, the focusing lens comprises a first face and a second face which are opposite, and a side face for connecting the first face and the second face, wherein a bonding pad is arranged on the side face so as to be connected with the communication circuit through a routing process.

According to the implementation mode of the application, the focusing lens comprises a first face and a second face which are opposite, the second face faces the second lens, a first bonding pad and a second bonding pad are respectively arranged on the second face and the surface, right opposite to the second face, of the second lens, and the first bonding pad is directly connected with the second bonding pad through a Chip Scale Package (CSP) process.

According to the embodiment of the application, the other end of the communication circuit is electrically connected with the circuit board through at least one of a laser welding mode or a connector buckling mode.

According to the embodiment of the application, the photosensitive assembly comprises a circuit board and a photosensitive chip, wherein the circuit board is provided with a groove for accommodating the photosensitive chip; and the lens component also comprises a color filtering element and a lens seat, wherein the lens seat is arranged on the circuit board, and the color filtering element is arranged on the surface of the lens seat far away from the circuit board.

According to the embodiment of the application, the circuit board is provided with a through hole for accommodating the photosensitive chip.

According to the embodiment of the application, the photosensitive assembly comprises a circuit board, and the movable part is arranged on the circuit board.

According to the embodiment of the application, the movable part is arranged on one side of the lens base close to the outer edge of the circuit board.

According to the embodiment of the application, the microscope base is arranged at the outer edge of the circuit board, and the movable part is arranged on the surface of the microscope base, which is far away from the circuit board.

According to the embodiment of the application, the sensitization subassembly includes circuit board and reinforcing plate, the reinforcing plate set up in keeping away from of circuit board the surface of sensitization chip, the sensitization chip set up in on the circuit board in the recess to in addition attached in the reinforcing plate.

Another aspect of the present application further provides a method for manufacturing a camera module, including: arranging the first lens and the second lens at intervals to form a lens assembly; the lens assembly is arranged on a photosensitive path of the photosensitive assembly; and arranging a focusing lens comprising at least one deformable film layer between the first lens and the second lens.

According to an embodiment of the application, the method further comprises: and connecting the movable part with the photosensitive assembly.

According to an embodiment of the present application, disposing a focus lens including at least one deformable thin film layer between a first lens and a second lens includes: the first lens is arranged far away from the photosensitive assembly, and the second lens is arranged close to the photosensitive assembly; fixing the focusing lens on one side of the second lens close to the first lens; actively calibrating and adjusting the position relation of the first lens and the second lens, and adjusting the optical axes of the first lens and the second lens to be consistent; and arranging a glue material in a gap formed by the first lens and the focusing lens so as to fix the first lens and the second lens.

According to an embodiment of the present application, the lens assembly further includes a first lens barrel and a second lens barrel respectively opposite to the first lens barrel and the second lens barrel, wherein fixing the focus lens to a side of the second lens barrel close to the first lens barrel includes: a communication circuit is arranged on the outer surface or inside of the second lens barrel; and electrically connecting one end of the communicating circuit with the focusing lens, and electrically connecting the other end of the communicating circuit with the circuit board.

According to an embodiment of the present application, providing a communication circuit inside the second barrel includes: the communication circuit is formed inside the second barrel by an integral molding process.

According to an embodiment of the present application, providing a communication circuit on an outer surface of the second barrel includes: and forming the communication circuit on the outer surface of the second lens barrel through an etching process.

According to an embodiment of the present application, electrically connecting one end of the communication circuit to the focus lens includes: and the focusing lens is electrically connected with the communicating circuit through a routing process.

According to this application implementation mode, focusing lens includes relative first face and second face, and connects the side of first face with the second face, wherein, electrically connect through the routing technology focusing lens with the intercommunication circuit includes: arranging a bonding pad on the side face; and connecting the bonding pad with a metal wire to electrically connect the focusing lens and the communication circuit in a routing process.

According to an embodiment of the present application, the focus lens includes first and second opposing faces, the second face facing the second lens, wherein electrically connecting one end of the communication circuit with the focus lens includes: respectively arranging a first bonding pad and a second bonding pad on the second surface and the surface of the second lens opposite to the second surface; and directly connecting the first bonding pad and the second bonding pad through a Chip Scale Package (CSP) process so as to electrically connect one end of the connecting circuit with the focusing lens.

According to an embodiment of the present application, electrically connecting the other end of the communication circuit to the wiring board includes: the circuit board is provided with a bent soft board, and the other end of the communication circuit is electrically connected with the soft board of the circuit board through at least one of a laser welding mode or a connector buckling mode.

According to the embodiment of the application, the camera module is applied to a mobile terminal, an outer cover of the mobile terminal is provided with an opening, the camera module is arranged in the opening of the outer cover, the first lens comprises a first lens arranged at a light incident end of the camera module, the first lens comprises a light incident surface and a light emergent surface which are opposite, and the method further comprises the following steps: disposing the light incident surface of the first lens planar and flush with the outer cover; and providing the light exit surface of the first lens to be concave or convex.

According to an embodiment of the present application, disposing a focus lens including at least one deformable thin film layer between a first lens and a second lens includes: arranging a piezoelectric film at the outer edge of the deformable film layer; and disposing the focus lens between the first lens and the second lens.

According to an embodiment of the present application, disposing a focus lens including at least one deformable thin film layer between a first lens and a second lens includes: arranging a pressure ring at the outer edge of the deformable film layer, wherein the pressure ring is driven by at least one of VCM (Voice coil Motor), MEMS (micro electro mechanical System) and SMA (shape memory alloy) driving; and disposing the focus lens between the first lens and the second lens.

According to the above-mentioned at least one scheme of the module of making a video recording that provides of this application, can reach following at least one beneficial effect:

the camera module provided by the application keeps relatively motionless in the position of the lens in the focusing process, the focusing component is a focusing lens arranged on the optical axis of the lens, and the focusing function of the camera module can be realized by controlling the change of the surface shape of the focusing lens. Compared with the prior art, the moving stroke of the lens in the optical axis direction of the lens is omitted, the nonlinear section stroke of the driving mechanism is omitted, and the total height of the camera module is reduced. The mobile terminal is not only beneficial to realizing the lightness and thinness of the mobile terminal, but also improves the handheld experience of the mobile terminal.

The application provides an ultra-thin anti-shake camera module and preparation method thereof installs the movable part of anti-shake subassembly in the photosensitive assembly to and set up photosensitive chip in the recess of circuit board, both can correct the displacement volume that the module shake of making a video recording produced, reduced the height of the module of making a video recording again. Meanwhile, a deformable focusing lens is arranged between the two lenses of the camera module closest to the light incidence end (the side of the lens assembly of the camera module, which is far away from the photosensitive assembly), so that the focusing function of the camera module is realized. Therefore, the camera module preparation method provided by the application can effectively improve the imaging quality of the camera module, and the prepared camera module has the characteristics of being ultrathin and anti-shaking.

In addition, the camera module and the preparation method thereof provided by the application can also set the surface (first surface) exposed to the external space of the lens arranged at the outermost side of the light incidence end (the side of the lens component of the camera module far away from the photosensitive component) of the camera module as a plane, so that the surface of the light incidence end of the camera module is a plane, and the surface is installed in the mobile terminal, thereby eliminating the protective glass used for protecting the camera module in the mobile terminal. The plane is not easy to accumulate dust in the using process of the mobile terminal, the appearance is more attractive, a gap between the protective glass and the light incident end of the camera module is eliminated, the space height of the camera module in the mobile terminal can be further shortened, and the camera module obtained by the preparation method is beneficial to improving the handheld experience of the mobile terminal and realizing the lightness and thinness of the mobile terminal.

In addition, in the camera module and the preparation method thereof provided by the application, the focusing lens can be provided with more than one deformable film, so that two light receiving surfaces of the focusing lens can be deformed, and the focusing capacity of the focusing lens is increased.

Drawings

Other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:

fig. 1 is a schematic structural diagram of a camera module according to an embodiment of the present application;

fig. 2 is a schematic structural diagram of a camera module according to another embodiment of the present application;

FIG. 3A is a schematic view of a partial structure of a lens assembly according to yet another embodiment of the present application;

FIG. 3B is a schematic diagram of a partial structure of a lens assembly according to yet another embodiment of the present application;

FIG. 3C is a schematic view of a partial structure of a lens assembly according to yet another embodiment of the present application;

FIG. 4 is a schematic diagram of a focusing lens including a piezoelectric film according to an embodiment of the present application;

FIG. 5 is a schematic diagram of a focus lens including a compression ring according to another embodiment of the present application;

FIG. 6 is a schematic diagram of a focus lens according to another embodiment of the present application; and

fig. 7 is a flow chart of a manufacturing process of the camera module according to an embodiment of the present application.

Detailed Description

For a better understanding of the present application, various aspects of the present application will be described in more detail with reference to the accompanying drawings. It should be understood that the detailed description is merely illustrative of exemplary embodiments of the present application and does not limit the scope of the present application in any way. Like reference numerals refer to like elements throughout the specification. The expression "and/or" includes any and all combinations of one or more of the associated listed items.

It should be noted that in this specification, the expressions first, second, third, etc. are used only to distinguish one feature from another, and do not represent any limitation on the features. Thus, the first surface discussed below may also be referred to as the second surface without departing from the teachings of the present application. And vice versa.

In the drawings, the thickness, size and shape of the components have been slightly adjusted for convenience of explanation. The figures are purely diagrammatic and not drawn to scale. As used herein, the terms "approximately", "about" and the like are used as table-approximating terms and not as table-degree terms, and are intended to account for inherent deviations in measured or calculated values that would be recognized by one of ordinary skill in the art.

It will be further understood that terms such as "comprising," "including," "having," "including," and/or "containing," when used in this specification, are open-ended and not closed-ended, and specify the presence of stated features, elements, and/or components, but do not preclude the presence or addition of one or more other features, elements, components, and/or groups thereof. Furthermore, when a statement such as "at least one of" appears after a list of listed features, it modifies that entire list of features rather than just individual elements in the list. Furthermore, when describing embodiments of the present application, the use of "may" mean "one or more embodiments of the present application. Also, the term "exemplary" is intended to refer to examples or illustrations.

Unless otherwise defined, all terms (including engineering and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. Unless explicitly defined or contradicted by context, the specific steps included in the imaging module described in the present application are not necessarily limited to the described order, and may be executed in any order or in parallel. The present application will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.

Fig. 1 is a schematic structural diagram of a camera module 1000 according to an embodiment of the present application.

As shown in fig. 1, the camera module 1000 may include a lens assembly 1100, a photosensitive assembly 1200, and a focus lens 1500.

The lens assembly 1100 may be disposed on a photosensitive path of the photosensitive assembly 1200, and includes at least two lenses. The at least two lenses may include: a first lens 1120 and a second lens 1130 disposed at an interval. The first lens 1120 and the second lens 1130 may be disposed in the first barrel 1110A and the second barrel 1110B corresponding thereto, respectively. The focusing lens 1500 may be disposed between the first lens 1120 and the second lens 1130, and includes at least one deformable film layer 13 to achieve a focusing function of the camera module 1000.

Fig. 2 is a schematic structural diagram of a camera module 1000 according to another embodiment of the present application. Fig. 3A is a partial structural schematic diagram of a lens assembly 1100 according to yet another embodiment of the present application. Fig. 3B is a partial structural schematic diagram of a lens assembly 1100 according to yet another embodiment of the present application. Fig. 3C is a partial structural schematic diagram of a lens assembly 1100 according to yet another embodiment of the present application.

As shown in fig. 2, the camera module 1000 applied to the mobile terminal 2000 is directly exposed to the external space after the cover glass is removed, and the cover 2100 of the mobile terminal 2000 (the camera module 1000 is mounted inside the mobile terminal 2000 corresponding to the cover 2100 and exposed on the cover 2100) is flush with the light incident surface of the camera module 1000 exposed to the external space. For example, when the camera module 1000 is a rear camera module of the mobile terminal 2000, the outer cover 2100 may be a rear cover of the mobile terminal 2000, and in order to reduce a space where the camera module 1000 is accommodated in the mobile terminal 2000, a cover glass of the mobile terminal 2000 may be removed and a flat light incident surface of the camera module 1000 exposed to an external space may be disposed to be flush with the rear cover.

Specifically, the first lens 1120 is farthest from the photosensitive element 1200 and located at a light incident end of the camera module 1000. The first lens 1120 may include a plurality of lenses. The plurality of lenses includes a first lens 1121 located at the outermost side of the light incident end (farthest from the photosensitive element 1200) of the camera module 1000. The first lens 1121 includes opposing light incident and exit surfaces 21 and 22. The light incident surface 21 of the first lens 1121 exposed to the external space may be provided as a flat surface and be flush with the outer cover 2100 of the mobile terminal 2000. Further, in order to ensure the imaging effect of the camera module 1000, the light exit surface 22 of the first lens 1121 may be configured to be concave or convex according to a specific optical design scheme.

In addition, during the assembly process of the camera module 1000, the first lens 1121 needs to be assembled in the first barrel 1110A along the light incident direction of the camera module 1000 (from the end far away from the photosensitive element 1200 to the end close to the photosensitive element 1200). In other words, the opening size of the end surface 1111 of the first barrel 1110A near the light incident end is larger than the opening size of the opposite end. Further, the first lens 1120 may be fixed to the cover 2100 of the mobile terminal 2000 by glue 16.

As shown in fig. 3A, a bearing platform 23 may be disposed on an inner surface of the first barrel 1110A to position the first lens 1121, such that the light exit surface 22 of the first lens 1121 is in contact with the bearing platform 23, and the first lens 1121 is fixed by glue. Further, as an option, in some embodiments of the present application, a plurality of bearing stages may also be provided in the first barrel 1110A to seat other lenses in the first lens 1120.

Since the opening of one side (away from the photosensitive assembly 1200) of the platform shape of the support platform 23 close to the light incident end is larger than the opening of the other opposite side, the light incident surface 21 of the planar shape of the first lens 1121 can be stably and firmly installed in the first barrel 1110A.

As shown in fig. 3B, in an embodiment of the present application, a bearing platform 23 may be disposed on an inner surface of the first barrel 1110A, and an end surface 1111 of the first barrel 1110A is lower than the light incident surface 21 of the first lens 1121, an outer cover 2100 of the mobile terminal 2000 may be disposed on the end surface 1111 and flush with the light incident surface 21, and glue may be applied where the outer cover 2100 contacts the first barrel 1110A. The above structure can prevent the glue between the first lens 1121 and the first lens barrel 1110A from being exposed to the outside, which affects the beauty of the camera module. Further, as an option, in some embodiments of the present application, a plurality of bearing stages may also be provided in the first barrel 1110A to seat other lenses in the first lens 1120.

As shown in fig. 3C, in an embodiment of the present application, the first barrel 1110A is only the supporting platform 23, one side of the supporting platform 23 may be fixed to the first lens 1121 through gluing, and the other side of the supporting platform 23 may be fixed to the focusing lens 1500 through gluing 16. The above structure can prevent the glue between the first lens 1121 and the first lens barrel 1110A (the support platform 23) from being exposed to the outside, which affects the beauty of the camera module.

Fig. 4 is a schematic structural diagram of a focusing lens 1500 including a piezoelectric film 14 according to an embodiment of the present application. Fig. 5 is a schematic configuration diagram of a focus lens 1500 including a pressing ring 15 according to another embodiment of the present application. Fig. 6 is a schematic configuration diagram of a focus lens 1500 according to another embodiment of the present application.

As shown in fig. 4 and 5, in one embodiment of the present application, a focus lens 1500 may include a substrate 11, a polymer layer 12, and a deformable thin film layer 13, which are sequentially disposed. The substrate 11 is disposed opposite the deformable film layer 13, and the polymer layer 12 is disposed between the substrate 11 and the deformable film layer 13.

In another embodiment of the present application, as shown in fig. 6, the focus lens 1500 may include a first deformable thin film layer 18, a polymer layer 12, and a second deformable thin film layer 19 sequentially disposed. The first deformable membrane layer 18 and the second deformable membrane layer 19 are oppositely disposed, and the polymer layer 12 is disposed between the first deformable membrane layer 18 and the second deformable membrane layer 19. The focusing lens with the structure is provided with more than one deformable film layer, so that two light receiving surfaces of the focusing lens can be deformed, and the focusing capacity of the focusing lens is improved.

Further, in one embodiment of the present application, the focus lens 1500 may further include a driving mechanism (not shown), which may include the piezoelectric film 14. The piezoelectric film 14 may be disposed at the outer edge of the deformable film layer 13 (shown in fig. 4). By the deformation of the piezoelectric film 14, the deformable film layer 13 can be pressed along the optical axis direction of the lens 1120 (as shown by the dotted line in fig. 4), so as to change the shape of the surface of the deformable lens, thereby realizing the focusing function of the camera module 1000.

Alternatively, in another embodiment of the present application, the driving mechanism of the focus lens 1500 may further include a pressing ring 15. A press ring 15 may be provided at the outer edge of the deformable membrane layer 13 (as shown in figure 5). The compression ring 15 is pressed in the optical axis direction of the lens 1120 by at least one of VCM driving, MEMS driving, and SMA driving, so that the shape of the surface of the deformable lens is changed, and the focusing function of the camera module 1000 is realized.

The driving mechanism of the deformable thin film layer is described above only by taking the focusing lens 1500 having one deformable thin film layer as an example, and those skilled in the art will understand that the driving mechanism of the focusing lens 1500 having the first deformable thin film layer 18 and the second deformable thin film layer 19 is the same as that described above and will not be described again.

Because the driving mechanism can provide larger driving force, the degree of changing the shape of the surface of the deformable lens through at least one driving press ring in VCM driving, MEMS driving and SMA driving is larger, and the camera module adopting the focusing lens with the structure can realize stronger focusing capability.

In one embodiment of the present application, the polymer layer 12 may be selected to have a high polymer with a low flow to ensure that the weight of the polymer layer 12 itself is not sufficient to deform the deformable film layer 13.

In one embodiment of the present application, the substrate 11 may be prepared by selecting a suitable material according to the optical performance of the camera module 1000 by referring to optical parameters such as transmittance and abbe number.

In the prior art, the camera module realizes the shooting function from far to near, and usually requires the lens to move and focus in the direction of the optical axis, so that a clear imaging effect can be obtained on the photosensitive chip all the time. However, the distance that the lens moves in the optical axis direction of the lens needs to reach several hundred micrometers (effective focusing stroke), and because a driving part for driving the lens to move needs a larger stroke which is not completely linear, the actual movable stroke of the lens in the driving part is far greater than the effective focusing stroke, so that the camera module is protruded out of the outer cover of the mobile terminal after the camera module is installed on the mobile terminal, which neither meets the trend of thinning the mobile terminal, nor reduces the handheld experience of the mobile terminal.

Compared with the traditional focusing mode, the camera module provided by the application keeps the position of the lens relatively still in the focusing process, the focusing component is the focusing lens arranged on the optical axis of the lens, and the focusing function of the camera module can be realized by controlling the change of the surface shape of the focusing lens. Compared with the prior art, the moving stroke of the lens in the optical axis direction of the lens is omitted, the nonlinear section stroke of the driving mechanism is omitted, and the total height of the camera module is reduced. The mobile terminal is not only beneficial to realizing the lightness and thinness of the mobile terminal, but also improves the handheld experience of the mobile terminal.

In addition, in the camera module and the preparation method thereof provided by the application, the focusing lens can be provided with more than one deformable film layer, so that two light receiving surfaces of the focusing lens can be deformed, the focusing capacity of the focusing lens is increased, and the camera module has excellent zooming capacity.

In addition, the camera module and the manufacturing method thereof provided by the application can also eliminate the protective glass used for protecting the camera module in the mobile terminal by arranging the surface (the light incidence surface 21 of the first lens 1121) of the lens at the outermost side of the light incidence end (the side of the lens component of the camera module, which is far away from the photosensitive component) of the camera module, which is exposed to the external space, as a plane, so that the surface of the light incidence end of the camera module is a plane, and the surface is arranged in the mobile terminal. The plane is not easy to accumulate dust in the using process of the mobile terminal, the appearance is more attractive, a gap between the protective glass and the light incident end of the camera module is eliminated, the space height of the camera module in the mobile terminal can be further shortened, and the camera module obtained by the preparation method is beneficial to improving the handheld experience of the mobile terminal and realizing the lightness and thinness of the mobile terminal.

Referring to fig. 1 and 2 again, the first lens 1120 is away from the photosensitive element 1200 and located at the light incident end of the camera module 1000, and the second lens 1130 is close to the photosensitive element 1200. The photosensitive assembly 1200 may include a photosensitive chip 1210 and a circuit board 1220.

A communication circuit 17 may be provided on a surface of the second barrel 1110B of the lens assembly 1100. One end of the communication circuit 17 may be electrically connected to the focus lens 1500, and the other end of the communication circuit 17 may be electrically connected to the circuit board 1220, so that the focus lens 1500 and the circuit board 1220 are electrically connected.

Specifically, a communication circuit 17 may be provided on the outer surface or inside of the second barrel 1110B.

In one embodiment of the present application, the communication circuit 17 may be formed inside the second barrel 1110B through an integral molding process.

Alternatively, in another embodiment of the present application, the communication circuit 17 may be formed on the outer surface of the second barrel 1110B through an etching process.

In addition, in an embodiment of the present application, the focusing lens 1500 may be electrically connected to the communication circuit 17 through a wire bonding process. Further, the metal wires used in the wire bonding process may be encapsulated by the glue 16 while the glue 16 fixes the first lens 1120 and the outer cover 2100 of the mobile terminal 2000, so as to prevent the metal wires from being damaged.

In one embodiment of the present application, the focus lens 1500 may include first and second opposing faces 1520, 1530 and a side 1540 connecting the first and

second faces

1520, 1530. Further, a bonding pad may be disposed on a side 1540 of the focus lens 1500, and the focus lens 1500 and the connection circuit 17 may be electrically connected by a wire bonding process.

Alternatively, in another embodiment of the present application, the focus lens 1500 may include first and second opposing faces 1520, 1530, and the second face 1530 may face the second lens 1130. First and second pads may be provided at an outer edge of the second face 1530 of the focus lens 1500 and an outer edge of a surface of the second lens 1130 facing the second face 1530, respectively. And directly connecting the first pad and the second pad through a Chip Scale Package (CSP) process. Specifically, solder paste may also be disposed between the first pad and the second pad to solder the tunable lens 1500 and the second lens 1130.

The CSP process can directly connect the focus lens 1500 and the connection circuit 17 through the pad, and thus a space for disposing the pad, which is required to be reserved in the second barrel 1110B, is avoided, and the size of the focus lens 1500 can be designed to be large. Therefore, the above electrical connection is achieved in the process of packaging the focus lens 1500 by the CSP process, which is advantageous to set the clear aperture of the focus lens 1500 to be larger.

Specifically, in another embodiment of the present application, the other end of the communication circuit 17 may be electrically connected to the circuit board 1220 by at least one of a laser welding method or a connector fastening method. Further, fpc (flexible wiring board) may be led out at the edge of the wiring board 1220 and bent upward to be connected to the communicating circuit 17 of the surface of the second barrel 1110B.

The photosensitive assembly 1200 mainly converts the optical signal transmitted from the lens 1120 into an electrical signal to form a picture of the object. In one embodiment of the present application, a recess may be provided on the wiring board 1220 to accommodate the photosensitive chip 1210. The photosensitive chip 1210 can be electrically connected to the circuit board 1220 by, for example, a wire bonding process, so as to achieve electrical connection therebetween.

Alternatively, in an embodiment of the present application, a groove for accommodating the photosensitive chip 1210 on the circuit board 1220 may be provided as a through hole to further reduce the height of the camera module 1000.

In one embodiment of the present application, the camera module 1000 further includes an anti-shake assembly 1300. The anti-shake assembly 1300 is an important component of the anti-shake structure of the camera module 1000, and may include a movable portion 1310 and a fixed portion 1320 connected to the photosensitive assembly 1200 for driving the photosensitive assembly 1200 to perform compensation motion.

In one embodiment of the present application, the movable portion 1310 of the anti-shake assembly 1300 may be made of SMA (Shape Memory Alloy) metal, or may be made of other materials. The present application is not limited thereto and those skilled in the art will appreciate that the materials of construction and the methods of fabrication of the mobile portion can be varied to achieve the results and advantages described herein without departing from the claimed subject matter.

In one embodiment of the present application, the anti-shake assembly 1300 may include a kinetic energy supply part that may provide a power source, such as an electromagnetic force, to provide power to move the movable part 1310 with respect to the fixed part 1320. Because the movable part 1310 is connected with the photosensitive assembly 1200 in the camera module 1000 provided by the application, the power can drive the photosensitive chip 1210 to perform compensation motion, and the focusing function of the camera module 1000 is realized.

Alternatively, in another embodiment of the present application, the movable portion 1310 and the fixed portion 1320 may be connected by an SMA member (not shown). However, it will be appreciated by those skilled in the art that the connection between the movable portion and the fixed portion is not limited in this application, and that the connection between the movable portion and the fixed portion or the material of the connecting member may be changed without departing from the claimed technical solution to achieve the results and advantages described in this specification.

The SMA (Shape Memory Alloy) component may be made of SMA metals, such as a Memory Alloy of titanium nickel Alloy (TiNi), titanium palladium Alloy (TiPd), titanium nickel copper Alloy (TiNiCu), titanium nickel palladium Alloy (TiNiPd), or combinations thereof. The SMA member may have various shapes such as a wire shape, a bar shape, and the like. The SMA member has a shape memory function, i.e., it can recover its pre-deformed shape when the temperature reaches a critical value after being heated after undergoing plastic deformation. When the SMA member is energized, since the temperature of the SMA member itself rises and the length of the SMA member changes when the temperature reaches the critical value, a certain driving force is generated, and the driving force drives the movable portion 1310 to move relative to the fixed portion 1320. Because the utility model provides a movable part 1310 is connected with sensitization subassembly 1200 among the module 1000 of making a video recording, consequently, above-mentioned drive can drive sensitization chip 1210 and carry out the compensation motion, realizes the function of focusing of module 1000 of making a video recording.

Specifically, the lens assembly 1100 further includes a color filter element 1150 and a lens mount 1140. The color filter 1150 is mainly used for filtering stray light. The lens mount 1140 can provide support for the lens assembly 1100 and can be used to encapsulate the electronic components of the photosensitive assembly 1200. Further, the lens mount 1140 may also be an encapsulation.

In one embodiment of the present application, the mirror base 1140 may be disposed on the wiring board 1220, and the color filter element 1150 is disposed on a surface 1141 of the mirror base 1140 remote from the wiring board 1220.

Further, a slot may be formed on the surface 1141 to receive the color filter 1150. The color filter 1150 is directly disposed on the lens holder 1140, which is beneficial to reducing the distance from the color filter 1150 to the photosensitive chip 1210, thereby further reducing the overall height of the camera module 1000 and realizing the ultra-thinness of the camera module 1000.

In one embodiment of the present application, the lens seat 1140 can be disposed around the circuit board 1220, and the lens seat 1140, the circuit board 1220 and the color filter 1150 form a closed space. The formation of the closed space can prevent dust or debris from entering the surface of the photosensitive chip 1210 to affect the imaging effect.

In one embodiment of the present application, the mirror base 1140 can be disposed at the outer edge of the circuit board 1220, and the movable portion 1310 can be attached to the surface 1141 of the mirror base 1140 (the upper surface of the mirror base 1140) away from the circuit board 1220.

Alternatively, in another embodiment of the present application, the movable portion 1310 may be disposed on the wiring board 1220.

Further, the movable portion 1310 may be bonded to a side (outer side) of the mirror base 1140 near the outer edge of the circuit board 1220. Thus, the unevenness of the upper surface 1141 of the lens holder 1140 or the inclination of the movable portion 1310 to affect the consistency between the optical axis of the lens 1120 and the optical axis of the photosensitive chip 1210 can be avoided. In addition, since the movable portion 1310 is located outside the lens holder 1140, the distance from the photosensitive chip 1210 to the lens 1120 can be reduced to some extent, thereby further reducing the overall height of the camera module 1000.

Further, in an embodiment of the present application, the camera module 1000 further includes a housing 1400, and the housing 1400 may be disposed below the photosensitive assembly 1200 and enclose the photosensitive assembly 1200 and the anti-shake assembly 1300. A gap is formed between the housing 1400 and the circuit board 1220, so that the photosensitive assembly 1200 can move in a direction perpendicular to the optical axis of the lens 1120, and the anti-shake function of the camera module 1000 is realized.

Further, in one embodiment of the present application, the photosensitive assembly 1200 further includes a reinforcing plate, which may be made of, for example, a steel sheet. The stiffener may be disposed on a surface of the wiring board 1220 remote from the photosensitive chip 1210. The photosensitive chip 1210 may be disposed in a groove on the wiring board 1220 and attached to the surface of the stiffener. However, it will be understood by those skilled in the art that the arrangement position of the photosensitive chip and the arrangement of the reinforcing plate do not constitute a limitation of the present application, and the arrangement position of the photosensitive chip and the arrangement of the reinforcing plate may be changed to obtain the respective results and advantages described in the present specification without departing from the technical solution claimed in the present application.

In an embodiment of the present application, the specific setting position of the photosensitive chip and the thickness and material of the reinforcing plate can be freely selected according to the thickness of the mobile terminal to which the camera module is finally applied. For example, in a thicker mobile terminal, the thickness of the reinforcing plate can be selected to be increased to increase the strength of the camera module, and conversely, in a mobile terminal with a smaller thickness, the thickness of the reinforcing plate can be selected to be reduced and the photosensitive chip can be arranged in the through hole of the circuit board to further reduce the thickness of the camera module.

The application provides a module 1000 of making a video recording's movable part 1310 is connected with photosensitive assembly 1200, and the drive power that drives movable part 1310 for the motion of fixed part 1320 can drive photosensitive assembly 1200 for the motion of fixed part 1320. When the camera module 1000 shakes during shooting, the anti-shake module 1300 can drive the photosensitive chip 1210 to adjust the corresponding position through the movable portion 1310 according to a received instruction, so as to correct the displacement generated by shaking of the camera module 1000, after the shaking correction action of the anti-shake module 1300 is completed, the focusing function of the camera module 1000 can be realized through the deformation of the focusing lens 1500, and then the camera module 1000 finishes shooting. Consequently, utilize the camera module including anti-shake subassembly and focusing lens that this application provided to shoot, can promote imaging quality effectively.

The application provides a module of making a video recording installs in the photosensitive assembly through the movable part with anti-shake subassembly to and set up the photosensitive chip in the recess of circuit board, both can correct the displacement amount that the module of making a video recording shake produced, reduced the height of the module of making a video recording again. Meanwhile, a deformable focusing lens is arranged between the two lenses of the camera module closest to the light incidence end (the side of the lens assembly of the camera module, which is far away from the photosensitive assembly), so that the focusing function of the camera module is realized. Consequently, utilize the module of making a video recording that this application provided to have higher image quality to have characteristics ultra-thin and anti-shake.

Fig. 7 is a flow chart of a manufacturing process of the camera module according to an embodiment of the present application. As shown in fig. 7, in an embodiment of the present application, a method 3000 for manufacturing a camera module is also provided. The preparation method 3000 mainly comprises:

and S1, arranging the first lens and the second lens at intervals to form a lens assembly.

And S2, arranging the lens assembly on the photosensitive path of the photosensitive assembly.

And S3, arranging a focusing lens comprising at least one deformable film layer between the first lens and the second lens.

In addition, the preparation method 3000 further comprises: the movable part is connected with the photosensitive assembly. The movable part is an important component of the anti-shake component. The anti-shake assembly may include a movable portion and a fixed portion.

Specifically, in one embodiment of the present application, the disposing a focus lens including at least one deformable thin film layer between the first lens and the second lens in step S3 includes: the first lens is arranged far away from the photosensitive assembly, and the second lens is arranged close to the photosensitive assembly; fixing a focusing lens on one side of the second lens close to the first lens; actively calibrating and adjusting the position relation of the first lens and the second lens, and adjusting the optical axes of the first lens and the second lens to be consistent; and arranging the adhesive material in a gap formed by the first lens and the focusing lens so as to fix the first lens and the second lens.

The active calibration process can calculate and adjust the relative position between the lenses through the imaging quality of an optical system formed by the lenses in the lens assembly, and the calibration process is repeated until the imaging quality of the optical system reaches the optimal value or meets the requirement, and then the relative position of the lenses can be fixed through the rubber material.

The lens assembly further includes first and second barrels corresponding to the first and second lenses. After the focusing lens is fixed on one side of the second lens barrel close to the first lens barrel, the steps of arranging a communication circuit on the outer surface or inside the second lens barrel, electrically connecting one end of the communication circuit with the focusing lens, and electrically connecting the other end of the communication circuit with the circuit board can be directly executed. Therefore, the circuit of the adjustable lens does not need to be welded after the lens component and the adjustable lens are assembled.

Alternatively, in one embodiment of the present application, the communication circuit may be formed inside the second barrel through an integral molding process.

Alternatively, in another embodiment of the present application, the communication circuit may be formed on the outer surface of the second barrel through an etching process.

In another embodiment of the present application, the focusing lens and the communication circuit can be electrically connected through a wire bonding process.

Further, in one embodiment of the present application, the focus lens includes first and second opposing faces, and a side face connecting the first and second faces. A bonding pad can be arranged on the side face of the focusing lens and connected with a metal wire, so that the focusing lens and the communicating circuit are electrically connected through a routing process.

Alternatively, in another embodiment of the present application, the focus lens includes first and second opposing faces, the deformable lens surface being any one of the first and second faces, the second face facing the second lens. The first pad and the second pad may be respectively disposed at an outer edge of the second surface of the focus lens and an outer edge of a surface of the second lens facing the second surface, and the first pad and the second pad may be directly connected by a Chip Scale Package (CSP) process, so that one end of the connection circuit is electrically connected to the focus lens.

Alternatively, in one embodiment of the present application, a flexible board may be provided on the circuit board, and the other end of the communication circuit may be electrically connected to the flexible board of the circuit board by at least one of a laser welding method and a connector engagement method.

In one embodiment of the application, the camera module is applied to a mobile terminal, an opening can be arranged on an outer cover of the mobile terminal, and the camera module is arranged in the opening of the outer cover. The first lens of the camera shooting module comprises a first lens arranged at a light incidence end of the camera shooting module, and the first lens comprises a light incidence surface and a light emergence surface which are opposite. The first lens comprises at least one lens, the light incidence surface of the first lens can be set to be a plane so as to be exposed to the external space, the light incidence surface of the first lens is set to be flush with the outer cover of the mobile terminal, and meanwhile, the light emergence surface of the first lens can be set to be a concave surface or a convex surface according to the specific requirements of imaging of the camera module.

In an embodiment of this application, can set up piezoelectric film at the outer fringe of the thin layer that can deform, can follow the optical axis direction extrusion thin layer that can deform of camera lens, and then change the shape on deformable lens surface, realize making a video recording the function of focusing of module.

Alternatively, in another embodiment of the present application, the driving mechanism of the focus lens may further include a pressing ring. The clamping ring can be arranged at the outer edge of the deformable film. And pressure is given to the pressure ring along the optical axis direction of the lens through at least one of VCM drive, MEMS drive and SMA drive, so that the shape of the surface of the deformable lens is changed, and the focusing function of the camera module is realized.

The above description is only an embodiment of the present application and an illustration of the principles of the technology employed. It will be appreciated by a person skilled in the art that the scope of protection covered by the present application is not limited to the embodiments with a specific combination of the features described above, but also covers other embodiments with any combination of the features described above or their equivalents without departing from the technical idea. For example, the above features may be replaced with (but not limited to) features having similar functions disclosed in the present application.

Claims

1. The utility model provides a module of making a video recording which characterized in that includes:

a photosensitive assembly;

the lens assembly is arranged on a photosensitive path of the photosensitive assembly and comprises a first lens and a second lens which are arranged at intervals; and

and the focusing lens is arranged between the first lens and the second lens and comprises at least one deformable film layer.

2. The camera module of claim 1, wherein the focus lens comprises a substrate, a polymer layer, and a deformable film layer in that order.

3. The camera module of claim 1, wherein the focus lens comprises a first deformable thin film layer, a polymer layer, and a second deformable thin film layer in that order.

4. The camera module according to claim 1, applied to a mobile terminal, the cover of which is provided with an opening, the camera module being arranged in the opening of the cover,

the first lens comprises a first lens arranged at the light incidence end of the camera module, and the first lens comprises a light incidence surface and a light emergence surface which are opposite;

wherein the light incident surface is planar and flush with the outer cover; and

the light exit surface is concave or convex.

5. The camera module of claim 4,

the lens assembly further includes a first barrel opposite the first lens,

wherein, a bearing platform is arranged on the inner surface of the first lens barrel to arrange the first lens; and

the light exit surface of the first lens is in contact with the bearing platform.

6. The camera module of any one of claims 1-4, further comprising:

the anti-shake subassembly, the anti-shake subassembly include with photosensitive element connects in order to drive photosensitive element carries out the movable part of compensation motion.

7. The imaging module according to any one of claims 1 to 4, wherein the focus lens further includes:

and the driving mechanism comprises a piezoelectric film, and the piezoelectric film is arranged on the outer edge of the deformable film layer.

8. The image capture module of any of claims 1-4, wherein the focus lens comprises:

actuating mechanism, actuating mechanism includes the clamping ring, the clamping ring set up in the outer fringe of deformable thin layer to by at least one kind drive in VCM drive, MEMS drive and the SMA drive.

9. The camera module according to any one of claims 1 to 4, wherein the photosensitive assembly further comprises a circuit board, the lens assembly further comprises a second lens barrel opposite to the second lens, a communication circuit is disposed on a surface of the second lens barrel, one end of the communication circuit is electrically connected to the focus lens, and the other end of the communication circuit is electrically connected to the circuit board.

10. The camera module according to claim 9, wherein the first lens is far from the photosensitive element, the second lens is close to the photosensitive element, and a communication circuit is disposed on an outer surface or inside of the second lens barrel.

11. The camera module according to claim 10, wherein a communication circuit formed by an integral molding process is provided inside the second barrel.

12. The camera module according to claim 10, wherein a communication circuit formed by an etching process is provided on an outer surface of the second barrel.

13. The camera module of claim 9, wherein the focus lens is electrically connected to the communication circuit by a wire bonding process.

14. The camera module of claim 13,

the focusing lens comprises a first surface, a second surface and a side surface, wherein the first surface and the second surface are opposite, and the side surface is connected with the first surface and the second surface; and

and a bonding pad is arranged on the side surface to be connected with the communication circuit through a routing process.

15. The camera module of claim 9,

the focusing lens comprises a first surface and a second surface which are opposite, and the second surface faces the second lens; and

and a first bonding pad and a second bonding pad are respectively arranged on the second surface and the surface of the second lens opposite to the second surface, and the first bonding pad and the second bonding pad are directly connected through a Chip Scale Package (CSP) process.

16. The camera module of claim 9, wherein the other end of the communication circuit is electrically connected to the circuit board by at least one of laser welding or connector fastening.

17. The camera module of any of claims 1-4,

the photosensitive assembly comprises a circuit board and a photosensitive chip, and the circuit board is provided with a groove for accommodating the photosensitive chip; and

the lens component also comprises a color filter element and a lens seat,

the lens base is arranged on the circuit board, and the color filtering element is arranged on the surface of the lens base, which is far away from the circuit board.

18. The camera module of claim 17, wherein the circuit board is provided with a through hole to receive the photo-sensing chip.

19. The camera module of any one of claims 1-4, wherein the photosensitive assembly comprises a circuit board, and the movable portion is disposed on the circuit board.

20. The camera module of claim 17, wherein the movable portion is disposed on a side of the lens holder adjacent to an outer edge of the circuit board.

21. The camera module of claim 17, wherein the lens holder is disposed at an outer edge of the circuit board, and the movable portion is disposed on the surface of the lens holder away from the circuit board.

22. The camera module according to any one of claims 1 to 4, wherein the photosensitive assembly includes a circuit board and a reinforcing plate, the reinforcing plate is disposed on a surface of the circuit board away from the photosensitive chip, and the photosensitive chip is disposed in the groove on the circuit board and attached to the reinforcing plate.

23. A method for manufacturing a camera module, the method comprising:

arranging the first lens and the second lens at intervals to form a lens assembly;

the lens assembly is arranged on a photosensitive path of the photosensitive assembly; and

and arranging a focusing lens comprising at least one deformable film layer between the first lens and the second lens.

24. The method of claim 23, further comprising:

and connecting the movable part with the photosensitive assembly.

25. The method of claim 23, wherein disposing a focusing lens comprising at least one deformable thin film layer between a first lens and a second lens comprises:

the first lens is arranged far away from the photosensitive assembly, and the second lens is arranged close to the photosensitive assembly;

fixing the focusing lens on one side of the second lens close to the first lens;

actively calibrating and adjusting the position relation of the first lens and the second lens, and adjusting the optical axes of the first lens and the second lens to be consistent; and

and arranging an adhesive material in a gap formed by the first lens and the focusing lens so as to fix the first lens and the second lens.

26. The method of claim 25, the lens assembly further comprising a first barrel and a second barrel opposite the first lens and the second lens, respectively, wherein securing the focus lens to the second lens on a side of the second lens proximate to the first lens comprises:

a communication circuit is arranged on the outer surface or the inner part of the second lens barrel; and

and electrically connecting one end of the communicating circuit with the focusing lens, and electrically connecting the other end of the communicating circuit with the circuit board.

27. The method according to claim 26, wherein providing a pass-through circuit inside the second barrel comprises:

the communication circuit is formed inside the second barrel by an integral molding process.

28. The method according to claim 26, wherein providing a communication circuit on an outer surface of the second barrel comprises:

and forming the communication circuit on the outer surface of the second lens barrel through an etching process.

29. The method of claim 26, wherein electrically connecting one end of the continuity circuit with the focus lens comprises:

and the focusing lens is electrically connected with the communicating circuit through a routing process.

30. The method of claim 29, wherein the focus lens comprises opposing first and second faces and a side connecting the first and second faces, and wherein electrically connecting the focus lens to the communication circuit by a wire bonding process comprises:

arranging a bonding pad on the side surface; and

and connecting the bonding pad with a metal wire to electrically connect the focusing lens and the communication circuit by a routing process.

31. The method of claim 26, the focus lens comprising opposing first and second faces, the second face facing the second lens, wherein electrically connecting one end of the communication circuit to the focus lens comprises:

respectively arranging a first bonding pad and a second bonding pad on the second surface and the surface of the second lens opposite to the second surface; and

and directly connecting the first bonding pad and the second bonding pad through a Chip Scale Package (CSP) process so as to electrically connect one end of the communicating circuit with the focusing lens.

32. The method of claim 26, wherein electrically connecting the other end of the communication circuit to the wiring board comprises:

arranging a bent flexible board on the circuit board, and

and electrically connecting the other end of the communication circuit with the flexible board of the circuit board through at least one of a laser welding mode or a connector buckling mode.

33. The method of claim 23, wherein the camera module is applied to a mobile terminal, wherein an opening is formed in a cover of the mobile terminal, wherein the camera module is disposed in the opening of the cover, wherein the first lens comprises a first lens disposed at a light incident end of the camera module, and wherein the first lens comprises an opposite light incident surface and a light exiting surface, and wherein the method further comprises:

disposing the light incident surface of the first lens planar and flush with the outer cover; and

the light exit surface of the first lens is provided as a concave surface or a convex surface.

34. The method of claim 23, wherein disposing a focusing lens comprising at least one deformable thin film layer between a first lens and a second lens comprises:

arranging a piezoelectric film at the outer edge of the deformable film layer; and

the focusing lens is disposed between the first lens and the second lens.

35. The method of claim 24, wherein disposing a focusing lens comprising at least one deformable thin film layer between a first lens and a second lens comprises:

arranging a pressure ring at the outer edge of the deformable film layer, wherein the pressure ring is driven by at least one of VCM (Voice coil Motor), MEMS (micro electro mechanical System) and SMA (shape memory alloy) driving; and

the focusing lens is disposed between the first lens and the second lens.